Electronics: circuits and components Books

Book SynopsisTable of Contents Quantities and Units Voltage, Current, and Resistance Ohm's Law Energy and Power Series Circuits Parallel Circuits Series-Parallel Circuits Circuit Theorems and Conversions Branch, Loop, and Node Analyses Magnetism and Electromagnetism Introduction to Alternating Current and Voltage Capacitors Inductors Transformers RC Circuits RL Circuits RLC Circuits and Resonance Passive Filters Circuit Theorems in AC Analysis Time Response of Reactive Circuits Three-Phase Systems in Power Applications APPENDICES Table of Standard Resistor Values Derivations Capacitor Label Coding NI Multisim for Circuit Simulation

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Book SynopsisTable of ContentsBrief Contents PART I: FUNDAMENTALS Introduction to Design 1.1 Design Machine Design 1.2 A Design Process 1.3 Problem Formulation and Calculation Definition Stage Preliminary Design Stage Detailed Design Stage Documentation Stage 1.4 The Engineering Model Estimation and First-Order Analysis The Engineering Sketch 1.5 Computer-Aided Design and Engineering Computer-Aided Design (CAD) Computer-Aided Engineering (CAE) Computational Accuracy 1.6 The Engineering Report 1.7 Factors of Safety and Design Codes Factor of Safety Choosing a Safety Factor Design and Safety Codes 1.8 Statistical Considerations 1.9 Units 1.10 Summary 1.11 References 1.12 Web References 1.13 Bibliography 1.14 Problems Materials and Processes 2.0 Introduction 2.1 Material-Property Definitions The Tensile Test Ductility and Brittleness The Compression Test The Bending Test The Torsion Test Fatigue Strength and Endurance Limit Impact Resistance Fracture Toughness Creep and Temperature Effects 2.2 The Statistical Nature of Material Properties 2.3 Homogeneity and Isotropy 2.4 Hardness Heat Treatment Surface (Case) Hardening Heat Treating Nonferrous Materials Mechanical Forming and Hardening 2.5 Coatings and Surface Treatments Galvanic Action Electroplating Electroless Plating Anodizing Plasma-Sprayed Coatings Chemical Coatings 2.6 General Properties of Metals Cast Iron Cast Steels Wrought Steels Steel Numbering Systems Aluminum Titanium Magnesium Copper Alloys 2.7 General Properties of Nonmetals Polymers Ceramics Composites 2.8 Selecting Materials 2.9 Summary 2.10 References 2.11 Web References 2.12 Bibliography 2.13 Problems Kinematics and Load Determination 3.0 Introduction 3.1 Degree of Freedom 3.2 Mechanisms 3.3 Calculating Degree of Freedom (Mobility) 3.4 Common 1-DOF Mechanisms Fourbar Linkage and the Grashof Condition Sixbar Linkage Cam and Follower 3.5 Analyzing Linkage Motion Types of Motion Complex Numbers as Vectors The Vector Loop Equation 3.6 Analyzing the Fourbar Linkage Solving for Position in the Fourbar Linkage Solving for Velocity in the Fourbar Linkage Angular Velocity Ratio and Mechanical Advantage Solving for Acceleration in the Fourbar Linkage 3.7 Analyzing the Fourbar Crank-Slider Solving for Position in the Fourbar Crank-Slider Solving for Velocity in the Fourbar Crank-Slider Solving for Acceleration in the Fourbar Crank-Slider Other Linkages 3.8 Cam Design and Analysis The Timing Diagram The svaj Diagram Polynomials for the Double-Dwell Case Polynomials for the Single-Dwell Case Pressure Angle Radius of Curvature 3.9 Loading Classes For Force Analysis 3.10 Free-body Diagrams 3.11 Load Analysis Three-Dimensional Analysis Two-Dimensional Analysis Static Load Analysis 3.12 Two-Dimensional, Static Loading Case Studies 3.13 Three-Dimensional, Static Loading Case Study 3.14 Dynamic Loading Case Study 3.15 Vibration Loading Natural Frequency Dynamic Forces 3.16 Impact Loading Energy Method 3.17 Beam Loading Shear and Moment Singularity Functions Superposition 3.18 Summary 3.19 References 3.20 Web References 3.21 Bibliography 3.22 Problems Stress, Strain, and Deflection 4.0 Introduction 4.1 Stress 4.2 Strain 4.3 Principal Stresses 4.4 Plane Stress and Plane Strain Plane Stress Plane Strain 4.5 Mohr’s Circles 4.6 Applied Versus Principal Stresses 4.7 Axial Tension 4.8 Direct Shear Stress, Bearing Stress, and Tearout Direct Shear Direct Bearing Tearout Failure 4.9 Beams and Bending Stresses Beams in Pure Bending Shear Due to Transverse Loading 4.10 Deflection in Beams Deflection by Singularity Functions Statically Indeterminate Beams 4.11 Castigliano’s Method Deflection by Castigliano’s Method Finding Redundant Reactions with Castigliano’s Method 4.12 Torsion 4.13 Combined Stresses 4.14 Spring Rates 4.15 Stress Concentration Stress Concentration Under Static Loading Stress Concentration Under Dynamic Loading Determining Geometric Stress-Concentration Factors Designing to Avoid Stress Concentrations 4.16 Axial Compression - Columns Slenderness Ratio Short Columns Long Columns End Conditions Intermediate Columns 4.17 Stresses in Cylinders Thick-Walled Cylinders Thin-Walled Cylinders 4.18 Case Studies in Static Stress and Deflection Analysis 4.19 Summary 4.20 References 4.21 Bibliography 4.22 Problems Static Failure Theories 5.0 Introduction 5.1 Failure of Ductile Materials Under Static Loading The von Mises-Hencky or Distortion-Energy Theory The Maximum Shear-Stress Theory The Maximum Normal-Stress Theory Comparison of Experimental Data with Failure Theories 5.2 Failure of Brittle Materials Under Static Loading Even and Uneven Materials The Coulomb-Mohr Theory The Modified-Mohr Theory 5.3 Fracture Mechanics Fracture-Mechanics Theory Fracture Toughness Kc 5.4 Using The Static Loading Failure Theories 5.5 Case Studies in Static Failure Analysis 5.6 Summary 5.7 References 5.8 Bibliography 5.9 Problems Fatigue Failure Theories 6.0 Introduction History of Fatigue Failure 6.1 Mechanism of Fatigue Failure Crack Initiation Stage Crack Propagation Stage Fracture 6.2 Fatigue-Failure Models Fatigue Regimes The Stress-Life Approach 3 The Strain-Life Approach The LEFM Approach 6.3 Machine-Design Considerations 6.4 Fatigue Loads Rotating Machinery Loading Service Equipment Loading 6.5 Measuring Fatigue Failure Criteria Fully Reversed Stresses Combined Mean and Alternating Stress Fracture-Mechanics Criteria Testing Actual Assemblies 6.6 Estimating Fatigue Failure Criteria Estimating the Theoretical Fatigue Strength Sf ’ or Endurance Limit Se’ Correction Factors—Theoretical Fatigue Strength or Endurance Limit Corrected Fatigue Strength Sf or Corrected Endurance Limit Se Creating Estimated S-N Diagrams 6.7 Notches and Stress Concentrations Notch Sensitivity 6.8 Residual Stresses 6.9 Designing for High-Cycle Fatigue 6.10 Designing for Fully Reversed Uniaxial Stresses Design Steps for Fully Reversed Stresses with Uniaxial Loading 6.11 Designing for Fluctuating Uniaxial Stresses Creating the Modified-Goodman Diagram Applying Stress-Concentration Effects with Fluctuating Stresses Determining the Safety Factor with Fluctuating Stresses Design Steps for Fluctuating Stresses 6.12 Designing for Multiaxial Stresses in Fatigue Frequency and Phase Relationships Fully Reversed Simple Multiaxial Stresses Fluctuating Simple Multiaxial Stresses Complex Multiaxial Stresses 6.13 A General Approach to High-Cycle Fatigue Design 6.14 A Case Study in Fatigue Design 6.15 Summary 6.16 References 6.17 Bibliography 6.18 Problems Surface Failure 7.0 Introduction 7.1 Surface Geometry 7.2 Mating Surfaces 7.3 Friction Effect of Roughness on Friction Effect of Velocity on Friction Rolling Friction Effect of Lubricant on Friction 7.4 Adhesive Wear The Adhesive-Wear Coefficient 7.5 Abrasive Wear Abrasive Materials Abrasion-Resistant Materials 7.6 Corrosion Wear Corrosion Fatigue Fretting Corrosion 7.7 Surface Fatigue 7.8 Spherical Contact Contact Pressure and Contact Patch in Spherical Contact Static Stress Distributions in Spherical Contact 7.9 Cylindrical Contact Contact Pressure and Contact Patch in Parallel Cylindrical Contact Static Stress Distributions in Parallel Cylindrical Contact 7.10 General Contact Contact Pressure and Contact Patch in General Contact Stress Distributions in General Contact 7.11 Dynamic Contact Stresses Effect of a Sliding Component on Contact Stresses 7.12 Surface Fatigue Failure Models—Dynamic Contact 7.13 Surface Fatigue Strength 7.14 Summary 7.15 References 7.16 Problems Finite Element Analysis 8.0 Introduction Stress and Strain Computation 8.1 Finite Element Method 8.2 Element Types Element Dimension and Degree of Freedom (DOF) Element Order H-Elements Versus P-Elements Element Aspect Ratio 8.3 Meshing Mesh Density Mesh Refinement Convergence 8.4 Boundary Conditions 8.5 Applying Loads 8.6 Testing the Model (Verification) 8.7 Modal Analysis 8.8 Case Studies 8.9 Summary 8.10 References 8.11 Bibliography 8.12 Web Resources 8.13 Problems PART II: MACHINE DESIGN Design Case Studies 9.0 Introduction 9.1 Case Study 8—A Portable Air Compressor 9.2 Case Study 9—A Hay-Bale Lifter 9.3 Case Study 10—A Cam-Testing Machine 9.4 Summary 9.5 References 9.6 Design Projects Shafts, Keys, and Couplings 10.0 Introduction 10.1 Shaft Loads 10.2 Attachments and Stress Concentrations 10.3 Shaft Materials 10.4 Shaft Power 10.5 Shaft Loads 10.6 Shaft Stresses 10.7 Shaft Failure in Combined Loading 10.8 Shaft Design General Considerations Design for Fully Reversed Bending and Steady Torsion Design for Fluctuating Bending and Fluctuating Torsion 10.9 Shaft Deflection Shafts as Beams Shafts as Torsion Bars 10.10 Keys and Keyways Parallel Keys Tapered Keys Woodruff Keys Stresses in Keys Key Materials Key Design Stress Concentrations in Keyways 10.11 Splines 10.12 Interference Fits Stresses in Interference Fits Stress Concentration in Interference Fits Fretting Corrosion 10.13 Flywheel Design Energy Variation in a Rotating System Determining the Flywheel Inertia Stresses in Flywheels Failure Criteria 10.14 Critical Speeds of Shafts Lateral Vibration of Shafts and Beams—Rayleigh’s Method Shaft Whirl Torsional Vibration Two Disks on a Common Shaft Multiple Disks on a Common Shaft Controlling Torsional Vibrations 10.15 Couplings Rigid Couplings Compliant Couplings 10.16 Case Study 8B Designing Driveshafts for a Portable Air Compressor 10.17 Summary 10.18 References 10.19 Problems Bearings and Lubrication 11.0 Introduction A Caveat 11.1 Lubricants 11.2 Viscosity 11.3 Types of Lubrication Full-Film Lubrication Boundary Lubrication 11.4 Material Combinations in Sliding Bearings 11.5 Hydrodynamic Lubrication Theory Petroff’s Equation for No-Load Torque Reynolds’ Equation for Eccentric Journal Bearings Torque and Power Losses in Journal Bearings 11.6 Design of Hydrodynamic Bearings Design Load Factor—The Ocvirk Number Design Procedures 11.7 Nonconforming Contacts 11.8 Rolling-element Bearings Comparison of Rolling and Sliding Bearings Types of Rolling-Element Bearings 11.9 Failure of Rolling-element bearings 11.10 S election of Rolling-element bearings Basic Dynamic Load Rating C Modified Bearing Life Rating Basic Static Load Rating C0 Combined Radial and Thrust Loads Calculation Procedures 11.11 Bearing Mounting Details 11.12 Special Bearings 11.13 Case Study 10B 11.14 Summary Important Equations Used in This Chapter 11.15 References 11.16 Problems Spur Gears 12.0 Introduction 12.1 Gear Tooth Theory The Fundamental Law of Gearing The Involute Tooth Form Pressure Angle Gear Mesh Geometry Rack and Pinion Changing Center Distance Backlash Relative Tooth Motion 12.2 Gear Tooth Nomenclature 12.3 Interference and Undercutting Unequal-Addendum Tooth Forms 12.4 Contact Ratio 12.5 Gear Trains Simple Gear Trains Compound Gear Trains Reverted Compound Trains Epicyclic or Planetary Gear Trains 12.6 Gear Manufacturing Forming Gear Teeth Machining Roughing Processes Finishing Processes Gear Quality 12.7 Loading on Spur Gears 12.8 Stresses in Spur Gears Bending Stresses Surface Stresses 12.9 Gear Materials Material Strengths Bending-Fatigue Strengths for Gear Materials Surface-Fatigue Strengths for Gear Materials 12.10 Lubrication of Gearing 12.11 Design of Spur Gears 12.12 Case Study 8C 12.13 Summary 12.14 References 12.15 Problems Helical, Bevel, and Worm Gears 13.0 Introduction 13.1 Helical Gears Helical Gear Geometry Helical-Gear Forces Virtual Number of Teeth Contact Ratios Stresses in Helical Gears 13.2 Bevel Gears Bevel-Gear Geometry and Nomenclature Bevel-Gear Mounting Forces on Bevel Gears Stresses in Bevel Gears 13.3 Wormsets Materials for Wormsets Lubrication in Wormsets Forces in Wormsets Wormset Geometry Rating Methods A Design Procedure for Wormsets 13.4 Case Study 9B 13.5 Summary 13.6 References 13.7 Problems Spring Design 14.0 Introduction 14.1 Spring Rate 14.2 Spring Configurations 14.3 Spring Materials Spring Wire Flat Spring Stock 14.4 Helical Compression Springs Spring Lengths End Details Active Coils Spring Index Spring Deflection Spring Rate Stresses in Helical Compression Spring Coils Helical Coil Springs of Nonround Wire Residual Stresses Buckling of Compression Springs Compression-Spring Surge Allowable Strengths for Compression Springs The Torsional-Shear S-N Diagram for Spring Wire The Modified-Goodman Diagram for Spring Wire 14.5 Designing Helical Compression Springs for Static Loading 14.6 Designing Helical Compression Springs for Fatigue Loading 14.7 Helical Extension Springs Active Coils in Extension Springs Spring Rate of Extension Springs Spring Index of Extension Springs Coil Preload in Extension Springs Deflection of Extension Springs Coil Stresses in Extension Springs End Stresses in Extension Springs Surging in Extension Springs Material Strengths for Extension Springs Design of Helical Extension Springs 14.8 Helical Torsion Springs Terminology for Torsion Springs Number of Coils in Torsion Springs Deflection of Torsion Springs Spring Rate of Torsion Springs Coil Closure Coil Stresses in Torsion Springs Material Parameters for Torsion Springs Safety Factors for Torsion Springs Designing Helical Torsion Springs 14.9 Belleville Spring Washers Load-Deflection Function for Belleville Washers Stresses in Belleville Washers Static Loading of Belleville Washers Dynamic Loading Stacking Springs Designing Belleville Springs 14.10 Case Study 10C 14.11 Summary 14.12 References 14.13 Problems Screws and Fasteners 15.0 Introduction 15.1 Standard Thread Forms Tensile Stress Area Standard Thread Dimensions 15.2 Power Screws Square, Acme, and Buttress Threads Power Screw Application Power Screw Force and Torque Analysis Friction Coefficients Self-Locking and Back-Driving of Power Screws Screw Efficiency Ball Screws 15.3 Stresses in Threads Axial Stress Shear Stress Torsional Stress 15.4 Types of Screw Fasteners Classification by Intended Use Classification by Thread Type Classification by Head Style Nuts and Washers 15.5 Manufacturing Fasteners 15.6 Strengths of Standard Bolts and Machine Screws 15.7 Preloaded Fasteners in Tension Preloaded Bolts Under Static Loading Preloaded Bolts Under Dynamic Loading 15.8 Determining the Joint Stiffness Factor Joints With Two Plates of the Same Material Joints With Two Plates of Different Materials Gasketed Joints 15.9 Controlling Preload The Turn-of-the-Nut Method Torque-Limited Fasteners Load-Indicating Washers Torsional Stress Due to Torquing of Bolts 15.10 Fasteners in Shear Dowel Pins Centroids of Fastener Groups Determining Shear Loads on Fasteners 15.11 Case Study 8D 15.12 Summary 15.13 References 15.14 Bibliography 15.15 Problems Weldments 16.0 Introduction 16.1 Welding Processes Types of Welding in Common Use Why Should a Designer Be Concerned with the Welding Process? 16.2 Weld Joints and Weld Types Joint Preparation Weld Specification 16.3 Principles of Weldment Design 16.4 Static Loading of Welds 16.5 Static Strength of Welds Residual Stresses in Welds Direction of Loading Allowable Shear Stress for Statically Loaded Fillet and PJP Welds 16.6 Dynamic Loading of Welds Effect of Mean Stress on Weldment Fatigue Strength Are Correction Factors Needed For Weldment Fatigue Strength? Effect of Weldment Configuration on Fatigue Strength Is There an Endurance Limit for Weldments? Fatigue Failure in Compression Loading? 16.7 Treating a Weld as a Line 16.8 Eccentrically Loaded Weld Patterns 16.9 Design Considerations for Weldments in Machines 16.10 Summary 16.11 References 16.12 Problems Clutches and Brakes 17.0 Introduction 17.1 Types of Brakes and Clutches 17.2 Clutch/Brake Selection and Specification 17.3 Clutch and Brake Material 17.4 Disk Clutches Uniform Pressure Uniform Wear 17.5 Disk Brakes 17.6 Drum Brakes Short-Shoe External Drum Brakes Long-Shoe External Drum Brakes Long-Shoe Internal Drum Brakes 17.7 Summary 17.8 References 17.9 Bibliography 17.10 Problems Appendices Material Properties Beam Tables Stress-Concentration Factors Answers to Selected Problems

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Book SynopsisLabs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistrythis text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design Trade Review"... a bright example of a truly interdisciplinary text. I was much impressed by its completeness. ... useful for a broad class of readers."—Fabrizio Frezza, Sapienza – Università di Roma, Italy Table of ContentsIntroduction. Elements of Organic Chemistry. Elements of Biochemistry. Biochemical Assays and Sequencing Techniques. Planar Technology. Polymer Technology. Back-End Technologies. Fluid Dynamics in Microfluidic Circuits. Microfluidic Building Blocks. Surface Functionalization. Electronic Detection. Optical Detection. Building Blocks for Genetics. References. Appendices.

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Book SynopsisThis book deals with nonlinear dynamics of electronic circuits, which could be used in robot control, secure communications, sensors and synchronized networks. The genesis of the content is related to a course on complex adaptive systems that has been held at the University of Catania since 2005. The efforts are devoted in order to emulate with nonlinear electronic circuits nonlinear dynamics. Step-by-step methods show the essential concepts of complex systems by using the Varela diagrams and accompanying MATLAB exercises to reinforce new information. Special attention has been devoted to chaotic systems and networks of chaotic circuits by exploring the fundamentals, such as synchronization and control. The aim of the book is to give to readers a comprehensive view of the main concepts of nonlinear dynamics to help them better understand complex systems and their control through the use of electronics devices.Trade Review"This textbook offers a very comprehensive, very clear and unique course on nonlinear dynamics, synchronization and chaos control by using electronic circuits. The exercises, the numerical examples with MATLAB and laboratory experiments make it an extremely useful tool for under-graduated students or beginners in this domain."— Françoise Lamnabhi-Lagarrigue, CNRS, FranceTable of ContentsPreface. Introduction to nonlinear systems. The logistic map and elements of complex system dynamics. Bifurcations. Oscillators. Strange attractors and continuous-time chaotic systems. Cellular Nonlinear Networks. Synchronization and chaos control. Experiments and applications. Bibliography. Index.

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Book SynopsisWritten in easy-to-understand language with illustrative designs and examples, Electronics Engineering covers all aspects of electronics fundamentals. It begins with semiconductors and diodes, the simplest form of semiconductor device. It goes on to examine the bipolar junction transistor (BJT), field effect transistor (FET), operational amplifier (Op-Amp), switching theory and logic design (STLD), and electronics instruments. Each chapter provides a summary and a series of questions for exercise purposes, helping readers to test their assimilation of the material.

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Book SynopsisAdvances in design methods and process technologies have resulted in a continuous increase in the complexity of integrated circuits (ICs). However, the increased complexity and nanometer-size features of modern ICs make them susceptible to manufacturing defects, as well as performance and quality issues. Testing for Small-Delay Defects in Nanoscale CMOS Integrated Circuits covers common problems in areas such as process variations, power supply noise, crosstalk, resistive opens/bridges, and design-for-manufacturing (DfM)-related rule violations. The book also addresses testing for small-delay defects (SDDs), which can cause immediate timing failures on both critical and non-critical paths in the circuit. Overviews semiconductor industry test challenges and the need for SDD testing, including basic concepts and introductory material Describes algorithmic solutions incorporated in commercial tools from Mentor Graphics Reviews SDD testing Table of ContentsFundamentals of Small-Delay Defect Testing. Timing-Aware ATPG: K Longest Paths. Timing-Aware ATPG. Faster-than-At-Speed: Faster-than-at-Speed Test for Screening Small-Delay Defects. Circuit Path Grading Considering Layout, Process Variations, and Cross Talk. Alternative Methods: Output Deviations-Based SDD Testing. Hybrid/Top-off Test Pattern Generation Schemes for Small-Delay Defects. Circuit Topology-Based Test Pattern Generation for Small-Delay Defects. SDD Metrics: Small-Delay Defect Coverage Metrics. Conclusion. References.

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Book SynopsisPresenting the cutting-edge results of new device developments and circuit implementations, High-Speed Devices and Circuits with THz Applications covers the recent advancements of nano devices for terahertz (THz) applications and the latest high-speed data rate connectivity technologies from system design to integrated circuit (IC) design, providing relevant standard activities and technical specifications. Featuring the contributions of leading experts from industry and academia, this pivotal work: Discusses THz sensing and imaging devices based on nano devices and materials Describes silicon on insulator (SOI) multigate nanowire field-effect transistors (FETs) Explains the theory underpinning nanoscale nanowire metal-oxide-semiconductor field-effect transistors (MOSFETs), simulation methods, and their results Explores the physics of the silicon-germanium (SiGe) heterojunction bipolar transistor (HBT), as well as commercially availableTrade Review"... a valuable reference for high-speed device and circuit researchers and design engineers."—James Chu, Kennesaw State University, Marietta, Georgia, USA, from IEEE Microwave Magazine, November 2015 Table of ContentsTerahertz Technology based on Nanoelectronic Devices. Ultimate FDSOI Multigate MOSFETs and Multibarrier Boosted Gate Resonant Tunneling FETs for a New High-Performance Low-Power Paradigm. SiGe BiCMOS Technology and Devices. SiGe HBT Technology and Circuits for THz Applications. Multiwavelength Sub-THz Sensor Array with Integrated Lock-In Amplifier and Signal Processing in 90 nm CMOS Technology. 40/100 GbE Physical Layer Connectivity for Servers and Data Centers. Equalization and Multilevel Modulation for Multi-Gbps Chip-to-Chip Links. 25 G/40 G CMOS SerDes: Need, Architecture, and Implementation. Clock and Data Recovery Circuits.

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Book SynopsisTable of ContentsMicrofluidics and Biosensors. Chemical and Environmental Sensors. Automotive and Industrial Sensors. Software and Sensor Systems.

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Book SynopsisRecently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe.Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academic developments beyond silicon and complementary metaloxidesemiconductor (CMOS) technology. From quantum-dot cellular automata (QCA) to chips for cochlear implants, this must-have resource: Investigates the trend of combining multiple cores in a single chip to boost perforTable of ContentsIntegration of Graphics Processing Cores with Microprocessors. Arithmetic Implemented with Semiconductor Quantum-Dot Cellular Automata. Novel Capacitor-Less A2RAM Memory Cells for Beyond 22-nm Nodes. Four-State Hybrid Spintronics–Straintronics: Extremely Low-Power Information Processing with Multiferroic Nanomagnets Possessing Biaxial Anisotropy. Improvement and Applications of Large-Area Flexible Electronics with Organic Transistors. Soft-Error Mitigation Approaches for High-Performance Processor Memories. Design Space Exploration of Wavelength-Routed Optical Networks-on-Chip Topologies for 3D Stacked Multi- and Many-Core Processors. Quest for Energy Efficiency in Digital Signal Processing: Architectures, Algorithms, and Systems. Nanoelectromechanical Relays: An Energy Efficient Alternative in Logic Design. High-Performance and Customizable Bioinformatic and Biomedical Very-Large-Scale-Integration Architectures. Basics, Applications, and Design of Reversible Circuits. Three-Dimensional Spintronics. Soft-Error-Aware Power Optimization Using Dynamic Threshold. Future of Asynchronous Logic. Memristor-CMOS-Hybrid Synaptic Devices Exhibiting Spike-Timing-Dependent Plasticity. Very-Large-Scale Integration Implementations of Cryptographic Algorithms. Dynamic Intrinsic Chip ID for Hardware Security. Ultra-Low-Power Audio Communication System for Full Implantable Cochlear Implant Application. Heterogeneous Memory Design. Soft Error Resilient Circuit Design.

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Book SynopsisThis book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity.With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harshTrade Review"Engineers are developing electronic systems for applications in environments significantly more taxing than those seen in classical computing applications. This book exposes engineers to the range of challenges faced and fosters an understanding of the approaches useful to succeed in those taxing application environments. It has an outstanding overview of the challenges to design electronic systems to operate in the presence of hazards in extreme environments."—Klaus Schuegraf, Cymer, San Diego, California, USATable of ContentsSection I Radiation. Commercial Off-the-Shelf Components in Space Applications. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues. Simulation of Single-Event Effects on Fully Depleted Siliconon-Insulator (FDSOI) CMOS. Section II Sensors and Operating Conditions. Electronic Sensors for the Detection of Ovarian Cancer. Sensors and Sensor Systems for Harsh Environment Applications. III-Nitride Electronic Devices for Harsh Environments. Section III Packaging and System Design. Packaging for Systems in Harsh Environments. Corrosion Resistance of Lead-Free Solders under Environmental Stress. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via.

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Book SynopsisRecent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed. Table of ContentsIntroduction. Packaging techniques of future ICs. Integrated architectures. Summary. Through Silicon Vias: Materials, Properties and Fabrication. Introduction. History of graphene material. Carbon nanotube. Graphene nanoribbon. Properties of TSV. Fabrication of TSVs. Challenges for the TSV implementations. Summary. Copper Based TSVs. Introduction. Physical configuration. Modelling of Cu based TSVs. Performance analysis of Cu based TSVs. Summary. Carbon Nanotube Based TSVs. Introduction. Physical configuration. Modelling. Performance analysis of CNT based TSVs. Summary. Mixed CNT Bundled Based TSVs. Introduction. Configurations of mixed CNT bundled TSVs. Modelling of MCB based TSVs. Signal integrity analysis of MCB based TSVs. Summary. Graphene Nanoribbon Based TSVs. Introduction. Configurations of GNR based TSVs. Fabrication challenges and limitations. Modelling of GNR based TSVs with smooth edges. Modelling of GNR based TSVs with rough edges. Signal integrity analysis of GNR based TSVs. Summary. Liners in TSVs. Introduction. Types of liners and their impact on performance. Fabrication challenges. Modelling of CNT bundled TSV with SiO2 and polymer liners. Impact of polymer liners on delay. Summary.

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Book SynopsisThis book discusses non-conventional digital signal processing based on direct processing of delta-sigma modulated bit-stream. The main attributes of low-pass delta-sigma analog-to-digital converters are: simple and inexpensive design, robustness of design to component tolerances, low-power consumption, high input impedance, high resolution (more than 20 bits) and possibility of direct arithmetic operation on its bit-stream. The author presents a number of theoretical and simulation results related to newly proposed linear and non-linear circuits such as delta-sigma adders, delta-sigma rectifiers, delta-sigma RMS and AGC circuits, delta-sigma frequency deviation meters, etc. The proposed circuits are not application limited and can be used in instrumentation, sensor application, bio-medical application, communications, etc. Presents novel linear and nonlinear circuits for direct processing of delta-sigma modulated bit-stream; The proposed circuits are supported by theoretical and simulation results; Recommends potential applications of the proposed circuits, and proposes ideas for further investigation. Table of ContentsChapter 1. Basics of Low-Pass Modulation.- Chapter 2. Linear Processing of Delta-Modulated Bit-Stream.- Chapter 3. Rectification of a Delta-Sigma Modulated Signal.- Chapter 4. Multiplication of Two Δ-Σ Bit-Streams.- Chapter 5. Digital Architecture for Δ-Σ RMS-to-DC Converter.- Chapter 6. Companding Circuits and Systems Based on Δ-Σ Modulation.- Chapter 7. A Δ-Σ Digital Stereo Multiplexing-Demultiplexing System.- Chapter 8. Δ-Σ Digital Amplitude Modulation System.- Chapter 9. Δ-Σ Methods for Frequency Deviation Measurement of a Known Nominal Frequency.- Chapter 10. Δ-Σ Automatic Gain Controller.- Chapter 11. Δ-Σ Integrator and Differentiator Circuits.

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Book SynopsisThis book describes warehouse-scale computers (WSCs), the computing platforms that power cloud computing and all the great web services we use every day. It discusses how these new systems treat the datacenter itself as one massive computer designed at warehouse scale, with hardware and software working in concert to deliver good levels of internet service performance. The book details the architecture of WSCs and covers the main factors influencing their design, operation, and cost structure, and the characteristics of their software base. Each chapter contains multiple real-world examples, including detailed case studies and previously unpublished details of the infrastructure used to power Google's online services. Targeted at the architects and programmers of today's WSCs, this book provides a great foundation for those looking to innovate in this fascinating and important area, but the material will also be broadly interesting to those who just want to understand the infrastructure powering the internet. The third edition reflects four years of advancements since the previous edition and nearly doubles the number of pictures and figures. New topics range from additional workloads like video streaming, machine learning, and public cloud to specialized silicon accelerators, storage and network building blocks, and a revised discussion of data center power and cooling, and uptime. Further discussions of emerging trends and opportunities ensure that this revised edition will remain an essential resource for educators and professionals working on the next generation of WSCs.Table of ContentsAcknowlegements.- Introduction.- Workloads and Software Infrastructure.- WSC Hardware Building Blocks.- Data Center Basics: Building, Power, and Cooling.- Energy and Power Efficiency.- Modeling Costs.- Dealing with Failures and Repairs.- Closing Remarks.- Bibliography.- Author Biographies.

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Book SynopsisThis book teaches basic and advanced concepts, new methodologies and recent developments in VLSI technology with a focus on low power design. It provides insight on how to use Tanner Spice, Cadence tools, Xilinx tools, VHDL programming and Synopsis to design simple and complex circuits using latest state-of-the art technologies. Emphasis is placed on fundamental transistor circuit-level design concepts.

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Book SynopsisThe demands for processing power, software, and communication are continuously increasing; in all industries and also in the automotive one. In vehicles, the need for higher data rates is driven by more electronic functions in general, but especially by ever more potent (camera) sensors, displays, and high performance ECUs.This book provides a holistic view on new SerDes and Ethernet high-speed communication solutions for cars. It addresses core physical components such as cables, connectors, or PCB design, as well as physical layer processing, use-case-specific protocols, and the use cases as such. It is important to the authors not only to explain the technologies, but also to provide context and background in respect to various technical choices. The intent is to help readers understand the current eco-system end-to-end, whether they are new to the automotive industry or experts who want to deepen their understanding on specific items, whether they are working for a car manufacturer directly or any of the suppliers, whether they are already involved or evaluating to get involved.This is the first book to address the following topics: the >10 Gbps Automotive Ethernet technologies IEEE 802.3cy and IEEE 802.3cz asymmetric Ethernet the new automotive SerDes Standard, the ASA Motion Link the MIPI Automotive SerDes Solutions ( MASS ) power supply over coaxial data cables design for testability in an automotive context

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Book SynopsisThis book is primarily designed to serve as a textbook for undergraduate students of electrical, electronics, and computer engineering, but can also be used for primer courses across other disciplines of engineering and related sciences. The book covers all the basic aspects of electronics engineering, from electronic materials to devices, and then to basic electronic circuits. The book can be used for freshman (first year) and sophomore (second year) courses in undergraduate engineering. It can also be used as a supplement or primer for more advanced courses in electronic circuit design. The book uses a simple narrative style, thus simplifying both classroom use and self study. Numerical values of dimensions of the devices, as well as of data in figures and graphs have been provided to give a real world feel to the device parameters. It includes a large number of numerical problems and solved examples, to enable students to practice. A laboratory manual is included as a supplement with the textbook material for practicals related to the coursework. The contents of this book will be useful also for students and enthusiasts interested in learning about basic electronics without the benefit of formal coursework. Table of ContentsCHAPTER 1: Semiconductor – An overview.- CHAPTER 2: Semiconductor Diodes and Applications.- CHAPTER 3: Transistors and other devices.- CHAPTER 4: Optoelectronic Devices.- CHAPTER 5: Digital Electronics.- CHAPTER 6: Transducer.- CHAPTER 7: Communications System.- CHAPTER 8: Simple Laboratory Experiments.

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Book SynopsisIn this book, the authors concentrate on the surface Plasmon (SP) waveguide configurations ensuring nanoscale confinement and review the current status of this rapidly emerging field, considering different configurations being developed for nanoscale plasmonic guides and circuits. Both fundamental physics and application aspects of plasmonics are reviewed in detail by the world's leading experts. A unique feature of this book is its strong focus on a particular subfield of plasmonics dealing with subwavelength (nanoscale) waveguiding, an area which is especially important in view of the explosively growing interest in plasmonic interconnects and nanocircuits. Trade Review"This book brings together expert contributions from experimentalists and theorists in the field of plasmonic waveguides and devices who steer readers through the underlying physical principles of plasmonic circuitry to specific designs and applications. Possible plasmonic waveguide geometries as well as their advantages and drawbacks are clearly and comprehensively discussed with various uses in mind, ranging from optical communication components, on-chip interconnects and electronic-photonic hybrid circuits. It makes fascinating reading and equally gives food for thought to nanophotonics practitioners and students alike."—Prof. Anatoly Zayats, Queen's University of Belfast, UKTable of ContentsIntroduction to Surface Plasmon Polariton Waveguides. Negative Dielectric Optical Waveguides for Nano-Optical Guiding. Nanoparticle Plasmon Waveguides. Surface Plasmon Polariton Gap Waveguide and Its Applications. Metal Heterostructures. Plasmonic Slot Waveguides. Plasmonic Modulators. Metal Trench Waveguides: Experiments and Analysis. Fundamentals of Channel and Wedge Plasmon Polaritons. Channel Plasmon Polaritons in Triangular Grooves. Nanophotonic Components Utilizing Channel Plasmon Polaritons. Adiabatic Concentration and Coherent Control in Nanoplasmonic Waveguides. Nanoplasmonics: Components, Devices and Circuits.

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Book SynopsisThis book examines single-electron circuits as an introduction to the rapidly expanding field of nanoelectronics. It discusses both the analysis and synthesis of circuits with the nanoelectronic metallic single-electron tunneling (SET) junction device. The basic physical phenomena under consideration are the quantum mechanical tunneling of electrons through a small insulating gap between two metal leads, the Coulomb blockade and Coulomb oscillations — the last two resulting from the quantization of charge. The author employs an unconventional approach in explaining the operation and design of single-electron circuits.Trade Review"The spectacular evolution of microelectronics has demonstrated the power of the ‘circuit paradigm’. During the last decade, a broad class of nanoelectronic discrete devices has been proposed and successfully demonstrated; however, there still exists a gap between device physics and nanoelectronic integrated circuit design. This book offers an insight into an original and outstanding effort to bridge the gap between device physics and engineering of nanoelectronic integrated architectures. Original equivalent circuit models of metallic single-electron tunneling (SET) junctions and efficient analysis and synthesis techniques of nanoelectronic circuits are presented. This book in recommended to researchers and students interested in nanoscience and nanotechnology, especially in nanoelectronics."—Arpad I. Csurgay, University, Hungary and University of Notre Dame, USA"Single electron devices are promising candidates for next-generation circuits. By clarifying the relationship between models of different levels, this book offers useful knowledge on modeling which makes single electron devices treated the same as conventional transistors during circuit design. The new perspectives involved also help to conceive novel nano-devices. It is a very good reference for researchers who are engaged in this exciting area."—Ning Deng, Tsinghua University, ChinaTable of ContentsTunneling Experiments in Nanoelectronics. Current in Electrodynamics and Circuit Theory. Free Electrons in Quantum Mechanics. Current and Tunnel Current in Quantum Physics. Energy in Circuit Theory. Energy in the Switched Two-Capacitor Circuit. Impulse Circuit Model for Single-Electron Tunneling — Zero Tunneling Time. Impulse Circuit Model for Single-Electron Tunneling — Nonzero Tunneling Times. Generalizing the Theory to Multi-Junction Circuits. Single-Electron Tunneling Circuit Examples. Circuit Design Methodologies. More Potential Applications and Challenges.

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Book SynopsisThis book focuses on the fabrication and applications of cantilever beams with nanoscale dimensions. Nanometer-size mechanical structures show exceptional properties generated by their reduced dimensions. These properties enable new sensing concepts and transduction mechanisms that will allow the enhancement of the performance of devices to their fundamental limits. A number of scientists are conducting research in the area of nanocantilever beams. The book will particularly benefit researchers and help them consolidate their background in the field. The book aims to be an excellent scientific reference for an audience with diverse backgrounds and interests, including students, academic researchers, industry specialists, policymakers, and enthusiasts. Trade Review"Nanocantilever Beams: Modeling, Fabrication, and Applications presents a review of the state of the art in the nanocantilever beam technology. Owing to their high sensitivity and versatility in transduction methods, nanocantilever beams have been widely studied and applied for the detection of physical, chemical, and biological events. This book is an excellent scientific reference for practicing engineers, students, and researchers in mechanical, electrical, civil, and aerospace engineering as well as materials science. It contains 16 chapters that offer a broad range of information, including theory, design, fabrication, and applications, on diverse nanostructures such as nanocantilever beam, nanobridge, and nanomembane structures. The text also provides an important discussion and perspective on sensing applications in air, liquid, and vacuum. It is important in the field, particularly because there is currently no other book with similar topics focused on nanocantilever beams."—Prof. Jie (Jayne) Wu, University of Tennessee, USATable of ContentsPart 1: Fabrication techniques of nanocantilver beam. Nanocantilever beam fabrication techniques in silicon. Nanocantilever fabrication techniques in polymer and transduction techniques for nano-electro-mechanical-sensing. Part 2: Nonlinearity of nanocantilever beam resonators. Nonlinear dynamics and its applications in nanocantilevers. Intentional nonlinearity for design of micro/nanomechnical resonators. Part 3: Applications of Nanocantilever beams. Electromechanical properties and applications of carbon nanotube nanocantilevers. Membrane–type Surface Stress Sensor (MSS). Mechanical Properties Characterization of PZT Nanofibers. Micro-and Nanomechanical String Resonators. Optical transduction and actuation of subwavelength nanomechanical resonators. Cantilever resonanace detection using nanophotonic structure. Integrated silicon optmechanical transducers and their application in atomic force microscopy. Nanostuctures for gas sensing applications. Bimaterial nanocantilever beam calormeter for biological application. Advances and challenges to bring nanomechanical biosensors to biochemistry labs and clinical use. Nanocantilever beam as biological sensors. Micro/nano Mechanical Cantilever for Cancer Diagnosis.

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Book SynopsisCombining the theory and practice of RF and microwave engineering, RF and Microwave Transistor Oscillator Design provides comprehensive results of established and new theoretical analysis, and the practical design of oscillators on modern active devices.Table of ContentsAbout the Author ix Preface xi Acknowledgements xv 1 Nonlinear circuit design methods 1 1.1 Spectral-domain analysis 1 1.1.1 Trigonometric identities 2 1.1.2 Piecewise-linear approximation 4 1.1.3 Bessel functions 8 1.2 Time-domain analysis 9 1.3 Newton–Raphson algorithm 12 1.4 Quasilinear method 15 1.5 Van der Pol method 20 1.6 Computer-aided analysis and design 24 References 28 2 Oscillator operation and design principles 29 2.1 Steady-state operation mode 29 2.2 Start-up conditions 31 2.3 Oscillator configurations and historical aspects 36 2.4 Self-bias condition 43 2.5 Oscillator analysis using matrix techniques 50 2.5.1 Parallel feedback oscillator 50 2.5.2 Series feedback oscillator 53 2.6 Dual transistor oscillators 55 2.7 Transmission-line oscillator 60 2.8 Push–push oscillator 65 2.9 Triple-push oscillator 72 2.10 Oscillator with delay line 75 References 79 3 Stability of self-oscillations 83 3.1 Negative-resistance oscillator circuits 83 3.2 General single-frequency stability condition 86 3.3 Single-resonant circuit oscillators 87 3.3.1 Series resonant circuit oscillator with constant load 87 3.3.2 Parallel resonant circuit oscillator with nonlinear load 88 3.4 Double-resonant circuit oscillator 89 3.5 Stability of multi-resonant circuits 91 3.5.1 General multi-frequency stability criterion 91 3.5.2 Two-frequency oscillation mode and its stability 93 3.5.3 Single-frequency stability of oscillator with two coupled resonant circuits 94 3.5.4 Transistor oscillators with two coupled resonant circuits 96 3.6 Phase plane method 105 3.6.1 Free-running oscillations in lossless resonant LC circuits 106 3.6.2 Oscillations in lossy resonant LC circuits 108 3.6.3 Aperiodic process in lossy resonant LC circuits 110 3.6.4 Transformer-coupled MOSFET oscillator 112 3.7 Nyquist stability criterion 113 3.8 Start-up and stability 118 References 125 4 Optimum design and circuit technique 127 4.1 Empirical optimum design approach 128 4.2 Analytic optimum design approach 136 4.3 Parallel feedback oscillators 138 4.3.1 Optimum oscillation condition 138 4.3.2 Optimum MOSFET oscillator 139 4.4 Series feedback bipolar oscillators 142 4.4.1 Optimum oscillation condition 142 4.4.2 Optimum common base oscillator 143 4.4.3 Quasilinear approach 146 4.4.4 Computer-aided design 150 4.5 Series feedback MESFET oscillators 152 4.5.1 Optimum common gate oscillator 152 4.5.2 Quasilinear approach 154 4.5.3 Computer-aided design 157 4.6 High-efficiency design technique 162 4.6.1 Class C operation mode 162 4.6.2 Class E power oscillators 165 4.6.3 Class DE power oscillators 170 4.6.4 Class F mode and harmonic tuning 172 4.7 Practical oscillator schematics 177 References 182 5 Noise in oscillators 187 5.1 Noise figure 187 5.2 Flicker noise 196 5.3 Active device noise modelling 198 5.3.1 MOSFET devices 198 5.3.2 MESFET devices 200 5.3.3 Bipolar transistors 203 5.4 Oscillator noise spectrum: linear model 205 5.4.1 Parallel feedback oscillator 205 5.4.2 Negative resistance oscillator 214 5.4.3 Colpitts oscillator 216 5.5 Oscillator noise spectrum: nonlinear model 219 5.5.1 Kurokawa approach 219 5.5.2 Impulse response model 224 5.6 Loaded quality factor 235 5.7 Amplitude-to-phase conversion 239 5.8 Oscillator pulling figure 241 References 245 6 Varactor and oscillator frequency tuning 251 6.1 Varactor modelling 251 6.2 Varactor nonlinearity 255 6.3 Frequency modulation 258 6.4 Anti-series varactor pair 262 6.5 Tuning linearity 267 6.5.1 VCOs with lumped elements 267 6.5.2 VCOs with transmission lines 273 6.6 Reactance compensation technique 276 6.7 Practical VCO schematics 280 6.7.1 VCO implementation techniques 280 6.7.2 Differential VCOs 286 6.7.3 Push–push VCOs 292 References 296 7 CMOS voltage-controlled oscillators 299 7.1 MOS varactor 299 7.2 Phase noise 305 7.3 Flicker noise 310 7.4 Tank inductor 313 7.5 Circuit design concepts and technique 317 7.5.1 Device operation modes 317 7.5.2 Start-up and steady-state conditions 321 7.5.3 Differential cross-coupled oscillators 325 7.5.4 Wideband tuning techniques 326 7.5.5 Quadrature VCOs 331 7.6 Implementation technology issues 333 7.7 Practical schematics of CMOS VCOs 335 References 342 8 Wideband voltage-controlled oscillators 347 8.1 Main requirements 347 8.2 Single-resonant circuits with lumped elements 351 8.2.1 Series resonant circuit 351 8.2.2 Parallel resonant circuit 353 8.3 Double-resonant circuit with lumped elements 356 8.4 Transmission line circuit realization 360 8.4.1 Oscillation system with uniform transmission line 360 8.4.2 Oscillation system with multi-section transmission line 365 8.5 VCO circuit design aspects 369 8.5.1 Common gate MOSFET and MESFET VCOs 369 8.5.2 Common collector bipolar VCO 373 8.5.3 Common base bipolar VCO 376 8.6 Wideband nonlinear design 378 8.7 Dual mode varactor tuning 381 8.8 Practical RF and microwave wideband VCOs 387 8.8.1 Wireless and satellite TV applications 387 8.8.2 Microwave monolithic VCO design 391 8.8.3 Push–push oscillators and oscipliers 394 References 396 9 Noise reduction techniques 399 9.1 Resonant circuit design technique 399 9.1.1 Oscillation systems with lumped elements 400 9.1.2 Oscillation systems with transmission lines 402 9.2 Low-frequency loading and feedback optimization 410 9.3 Filtering technique 416 9.4 Noise-shifting technique 423 9.5 Impedance noise matching 426 9.6 Nonlinear feedback loop noise suppression 430 References 433 Index 437

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Book SynopsisPatterning or lithography is at the core of modern science and technology and cuts across all disciplines. With the emergence of nanotechnology, conventional methods based on electron beam lithography and extreme ultraviolet photolithography have become prohibitively expensive.Table of ContentsPREFACE xv I NANOPATTERNING TECHNIQUES 1 1 INTRODUCTION 3 2 MATERIALS 7 2.1 Introduction 7 2.2 Mold Materials and Mold Preparation 8 2.2.1 Soft Molds 8 2.2.2 Hard Molds 19 2.2.3 Rigiflex Molds 19 2.3 Surface Treatment and Modification 21 References 23 3 PATTERNING BASED ON NATURAL FORCE 27 3.1 Introduction 27 3.2 Capillary Force 28 3.2.1 Open-Ended Capillary 29 3.2.2 Closed Permeable Capillary 31 3.2.3 Completely Closed Capillary 40 3.2.4 Fast Patterning 43 3.2.5 Capillary Kinetics 45 3.3 London Force and Liquid Filament Stability 48 3.3.1 Patterning by Selective Dewetting 49 3.3.2 Liquid Filament Stability: Filling and Patterning 51 3.4 Mechanical Stress: Patterning of A Metal Surface 56 References 63 4 PATTERNING BASED ON WORK OF ADHESION 67 4.1 Introduction 67 4.2 Work of Adhesion 68 4.3 Kinetic Effects 71 4.4 Transfer Patterning 74 4.5 Subtractive Transfer Patterning 79 4.6 Transfer Printing 82 References 91 5 PATTERNING BASED ON LIGHT: OPTICAL SOFT LITHOGRAPHY 95 5.1 Introduction 95 5.2 System Elements 96 5.2.1 Overview 96 5.2.2 Elastomeric Photomasks 96 5.2.3 Photosensitive Materials 99 5.3 Two-Dimensional Optical Soft Lithography (OSL) 100 5.3.1 Two-Dimensional OSL with Phase Masks 100 5.3.2 Two-Dimensional OSL with Embossed Masks 104 5.3.3 Two-Dimensional OSL with Amplitude Masks 105 5.3.4 Two-Dimensional OSL with AmplitudePhase Masks 109 5.4 Three-Dimensional Optical Soft Lithography 110 5.4.1 Optics 111 5.4.2 Patterning Results 112 5.5 Applications 117 5.5.1 Low-Voltage Organic Electronics 117 5.5.2 Filters and Mixers for Microfluidics 118 5.5.3 High Energy Fusion Targets and Media for Chemical Release 118 5.5.4 Photonic Bandgap Materials 120 References 122 6 PATTERNING BASED ON EXTERNAL FORCE: NANOIMPRINT LITHOGRAPHY 129L. Jay Guo 6.1 Introduction 129 6.2 NIL MOLD 133 6.2.1 Mold Fabrication 133 6.2.2 Mold Surface Preparation 137 6.2.3 Flexible Fluoropolymer Mold 137 6.3 NIL Resist 138 6.3.1 Thermoplastic Resist 139 6.3.2 Copolymer Thermoplastic Resists 141 6.3.3 Thermal-Curable Resists 142 6.3.4 UV-Curable Resist 146 6.3.5 Other Imprintable Materials 148 6.4 The Nanoimprint Process 149 6.4.1 Cavity Fill Process 149 6.5 Variations of NIL Processes 152 6.5.1 Reverse Nanoimprint 152 6.5.2 Combined Nanoimprint and Photolithography 155 6.5.3 Roll-to-Roll Nanoimprint Lithography (R2RNIL) 156 6.6 Conclusion 159 References 160 7 PATTERNING BASED ON EDGE EFFECTS: EDGE LITHOGRAPHY 167Matthias Geissler, Joseph M. McLellan, Eric P. Lee and Younan Xia 7.1 Introduction 167 7.2 Topography-Directed Pattern Transfer 169 7.2.1 Photolithography with Phase-Shifting Masks 170 7.2.2 Use of Edge-Defined Defects in SAMs 172 7.2.3 Controlled Undercutting 175 7.2.4 Edge-Spreading Lithography 176 7.2.5 Edge Transfer Lithography 178 7.2.6 Step-Edge Decoration 180 7.3 Exposure of Nanoscale Edges 181 7.3.1 Fracturing of Thin Films 182 7.3.2 Sectioning of Encapsulated Thin Films 182 7.3.3 Thin Metallic Films along Sidewalls of Patterned Stamps 184 7.3.4 Topographic Reorientation 186 7.4 Conclusion and Outlook 187 References 188 8 PATTERNING WITH ELECTROLYTE: SOLID-STATE SUPERIONIC STAMPING 195Keng H. Hsu, Peter L. Schultz, Nicholas X. Fang, and Placid M. Ferreira 8.1 Introduction 195 8.2 Solid-State Superionic Stamping 197 8.3 Process Technology 199 8.4 Process Capabilities 203 8.5 Examples of Electrochemically Imprinted Nanostructures Using the S4 Process 208 Acknowledgments 211 References 211 9 PATTERNING WITH GELS: LATTICE-GAS MODELS 215Paul J. Wesson and Bartosz A. Grzybowski 9.1 Introduction 215 9.2 The RDF Method 218 9.3 Microlenses: Fabrication 218 9.4 Microlenses: Modeling Aspects 220 9.4.1 Modeling Using PDEs 220 9.4.2 Modeling Using Lattice-Gas Method 221 9.5 RDF at the Nanoscale 222 9.5.1 Nanoscopic Features from Counter-Propagating RD Fronts 222 9.5.2 Failure of Continuum Description 225 9.5.3 Lattice-Gas Models at the Nanoscale 227 9.6 Summary and Outlook 229 References 230 10 PATTERNING WITH BLOCK COPOLYMERS 233Jia-Yu Wang, Wei Chen, and Thomas P. Russell 10.1 Introduction 233 10.2 Orientation 235 10.2.1 Self-Assembling 235 10.2.2 Self-Directing 247 10.3 Long-Range 254 10.3.1 Solvent Annealing 254 10.3.2 Graphoepitaxy 256 10.3.3 Sequential, Orthogonal Fields 260 10.4 Nanoporous BCP Films 262 10.4.1 Ozonolysis 264 10.4.2 Thermal Degradation 264 10.4.3 UV Degradation 267 10.4.4 Selective Extraction 271 10.4.5 “Soft” Chemical Etch 272 10.4.6 Cleavable Junction 272 10.4.7 Solvent-Induced Film Reconstruction 274 References 276 11 PERSPECTIVE ON APPLICATIONS 291 II APPLICATIONS 293 12 SOFT LITHOGRAPHY FOR MICROFLUIDIC MICROELECTROMECHANICAL SYSTEMS (MEMS)AND OPTICAL DEVICES 295Svetlana M. Mitrovski, Shraddha Avasthy, Evan M. Erickson, Matthew E. Stewart, John A. Rogers, and Ralph G. Nuzzo 12.1 Introduction 295 12.2 Microfluidic Devices for Concentration Gradients 297 12.3 Electrochemistry and Microfluidics 300 12.4 PDMS and Electrochemistry 302 12.5 Optics and Microfluidics 306 12.6 Unconventional Soft Lithographic Fabrication of Optical Sensors 314 Acknowledgments 317 References 318 13 UNCONVENTIONAL PATTERNING METHODS FOR BIONEMS 325Pilnam Kim, Yanan Du, Ali Khademhosseini, Robert Langer, and Kahp Y. Suh 13.1 Introduction 325 13.2 Fabrication of Nanofluidic System for Biological Applications 326 13.2.1 Unconventional Methods for Fabrication of Nanochannel 326 13.2.2 Application of Nanofluidic System 332 13.3 Fabrication of Biomolecular Nanoarrays for Biological Applications 338 13.3.1 DNA Nanoarray 338 13.3.2 Protein Arrays 340 13.3.3 Lipid Array 345 13.4 Fabrication of Nanoscale Topographies for Tissue Engineering Applications 347 13.4.1 Nanotopography-Induced Changes in Cell Adhesion 347 13.4.2 Nanotopography-Induced Changes in Cell Morphology 348 References 349 14 MICRO TOTAL ANALYSIS SYSTEM 359Yuki Tanaka and Takehiko Kitamori 14.1 Introduction 359 14.1.1 Historical Backgrounds 359 14.2 Fundamentals on Microchip Chemistry 361 14.2.1 Characteristics of Liquid Microspace 361 14.2.2 Liquid Handling 362 14.2.3 Concepts of Micro Unit Operation and Continuous-Flow Chemical Processing 362 14.3 Key Technologies 365 14.3.1 Fabrication of Microchips 365 14.3.2 Patterning for Fluid Control 366 14.3.3 Detection 366 14.4 Applications 368 14.4.1 Synthesis 368 14.4.2 Cell Adhesion Control 369 14.4.3 Liquid Handling: Valve Using Wettability 370 References 372 15 COMBINATIONS OF TOP-DOWN AND BOTTOM-UP NANOFABRICATION TECHNIQUES AND THEIR APPLICATION TO CREATE FUNCTIONAL DEVICES 379Pascale Maury, David N. Reinhoudt, and Jurriaan Huskens 15.1 Introduction 379 15.2 Top-Down and Bottom-Up Techniques 380 15.2.1 Top-Down Techniques 380 15.2.2 Bottom-Up Techniques 383 15.2.3 Mixed Techniques 384 15.3 Combining Top-Down and Bottom-Up Techniques for High Resolution Patterning 385 15.3.1 Top-Down Nanofabrication and Polymerization 386 15.3.2 Top-Down Nanofabrication and Micelles 387 15.3.3 Top-Down Nanofabrication and Block Copolymer Assembly 387 15.3.4 Top-Down Nanofabrication and NP Assembly 389 15.3.5 Top-Down Nanofabrication and Layer-by-Layer Assembly 392 15.4 Applicaion of Combined Top-Down and Bottom-Up Nanofabrication for Creating Functional Devices 397 15.4.1 Photonic Crystal Devices 397 15.4.2 Protein Assays 400 References 406 16 ORGANIC ELECTRONIC DEVICES 419 16.1 Introduction 419 16.2 Organic Light-Emitting Diodes 420 16.3 Organic Thin Film Transistors 429 References 439 17 INORGANIC ELECTRONIC DEVICES 445 17.1 Introduction 445 17.2 Inorganic Semiconductor Materials for Flexible Electronics 446 17.2.1 “Bottom-Up” Approaches 447 17.2.2 “Top-Down” Approaches 449 17.3 Soft Lithography Techniques for Generating Inorganic Electronic Systems 452 17.3.1 Micromolding in Capillaries 453 17.3.2 Imprint Lithography 454 17.3.3 Dry Transfer Printing 454 17.4 Fabrication of Electronic Devices 459 17.4.1 Transistors on Rigid Substrates via MIMIC Processing 459 17.4.2 Flexible Inorganic Transistors 459 17.4.3 Flexible Integrated Circuits 463 17.4.4 Heterogeneous Electronics 466 17.4.5 Stretchable Electronics 469 References 475 18 MECHANICS OF STRETCHABLE SILICON FILMS ON ELASTOMERIC SUBSTRATES 483Hanqing Jiang, Jizhou Song, Yonggang Huang, and John A. Rogers 18.1 Introduction 483 18.2 Buckling Analysis of Stiff Thin Ribbons on Compliant Substrates 484 18.3 Finite-Deformation Buckling Analysis of Stiff Thin Ribbons on Compliant Substrates 488 18.4 Edge Effects 495 18.5 Effect of Ribbon Width and Spacing 498 18.6 Buckling Analysis of Stiff Thin Membranes on Compliant Substrates 502 18.6.1 One-Dimensional Buckling Mode 504 18.6.2 Checkerboard Buckling Mode 506 18.6.3 Herrington Buckling Mode 506 18.7 Precisely Controlled Buckling of Stiff Thin Ribbons on Compliant Substrates 507 18.8 Concluding Remarks 512 Acknowledgments 512 References 512 19 MULTISCALE FABRICATION OF PLASMONIC STRUCTURES 515Joel Henzie, Min H. Lee, and Teri W. Odom 19.1 Introduction 515 19.1.1 Brief Primer on Surface Plasmons 517 19.1.2 Conventional Methods to Plasmonic Structures 518 19.2 Soft Lithography and Metal Nanostructures 518 19.3 A Platform for Multiscale Patterning 520 19.3.1 Soft Interference Lithography: Patterns on a Nanoscale Pitch 520 19.3.2 Phase-Shifting Photolithography: Patterns on a Microscale Pitch 520 19.3.3 PEEL: Transferring Photoresist Patterns to Plasmonic Materials 521 19.4 Subwavelength Arrays of Nanoholes: Plasmonic Materials 522 19.4.1 Infinite Arrays of Nanoholes 523 19.4.2 Finite Arrays (Patches) of Nanoholes 525 19.5 Microscale Arrays of Nanoscale Holes 526 19.6 Plasmonic Particle Arrays 528 19.6.1 Metal and Dielectric Nanoparticles 528 19.6.2 Anisotropic Nanoparticles 531 19.6.3 Pyramidal Nanostructures 531 Acknowledgments 533 References 533 20 A RIGIFLEX MOLD AND ITS APPLICATIONS 539Se-Jin Choi, Tae-Wan Kim, and Seung-Jun Baek 20.1 Introduction 539 20.2 Modulus-Tunable Rigiflex Mold 540 20.3 Applications of Rigiflex Mold 544 20.3.1 From Nanoimprint to Microcontact Printing 544 20.3.2 Rapid Flash Patterning for Residue-Free Patterning 547 20.3.3 Continuous Rigiflex Imprinting 549 20.3.4 Soft Molding Application 553 20.3.5 Capillary Force Lithography Applications 556 20.3.6 Transfer Fabrication Technique 558 References 561 21 NANOIMPRINT TECHNOLOGY FOR FUTURE LIQUID CRYSTAL DISPLAY 565Jong M. Kim, Hwan Y. Choi, Moon-G. Lee, Seungho Nam, Jin H. Kim, Seongmo Whang, Soo M. Lee, Byoung H. Cheong, Hyuk Kim, Ji M. Lee, and In T. Han 21.1 Introduction 565 21.2 Holographic LGP 569 21.2.1 Design and Properties of Holographic LGP 570 21.2.2 NI Technology for the Holographic LGP 572 21.3 Polarized LGP 573 21.3.1 Design and Properties of Polarized LGP 574 21.3.2 Fabrication of the Polarized LGP 575 21.3.3 Optical Performance of the Polarized LGP 576 21.4 Reflective Polarizer: Wire Grid Polarizer 579 21.4.1 Design and Properies of WGP 580 21.4.2 Fabrication and Applications 581 21.5 Transflective Display 585 21.5.1 Design and Optical Properties of Reflecting Pattern 587 21.5.2 Fabrication of the Reflecting Pattern 588 References 592 INDEX 595

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Book SynopsisIncludes extensive design information in the form of equations, tables, graphs and examples. Offers an in-depth study of amplifiers. Simple design equations are included to help understand design concepts. Practical and simple to understand examples with over 70 fully solved.Table of ContentsForeword. Preface. Chapter 1: Introduction. 1.1 Transistor Amplifier. 1.2 Early History of Transistor Amplifiers. 1.3 Benefits of Transistor Amplifiers. 1.4 Transistors. 1.5 Design of Amplifiers. 1.6 Amplifier Manufacturing Technologies. 1.7 Applications of Amplifiers. 1.8 Amplifier Cost. 1.9 Current Trends. 1.10 Book Organization. References. Chapter 2: Linear Network Analysis. 2.1 Impedance Matrix. 2.2 Admittance Matrix. 2.3 ABCD Parameters. 2.4 S-Parameters. 2.5 Relationships Between Various 2-Port Parameters. References. Problems. Chapter 3: Amplifier Characteristics and Definitions. 3.1 Bandwidth. 3.2 Power Gain. 3.3 Input and Output VSWR. 3.4 Output Power. 3.5 Power Added Efficiency. 3.6 Intermodulation Distortion. 3.7 Harmonic Power. 3.8 Peak-to-Average Ratio. 3.9 Combiner Efficiency. 3.10 Noise Characterization. 3.11 Dynamic Range. 3.12 Multi-Stage Amplifier Characteristics. 3.13 Gate and Drain Pushing Factors. 3.14 Amplifier Temperature Coefficient. 3.15 Mean Time To Failure. References. Problems. Chapter 4: Transistors. 4.1 Transistor Types. 4.2 Si Bipolar Transistor. 4.3 GaAs MESFET. 4.4 Hetrojunction Field Effect Transistor. 4.5 Hetrojunction BipolarTransistors. 4.6 MOSFET. References. Problems. Chapter 5: Transistor Models. 5.1 Transistor Model Types. 5.2 MESFET Models. 5.3 pHEMT Models. 5.4 HBT Model. 5.5 MOSFET Models. 5.6 BJT Models. 5.7 Transistor Model Scaling. 5.8 Source- and Load-Pull Data. 5.9 Temperature Dependent Models. References. Problems. Chapter 6: Matching Network Components. 6.1 Impedance Matching Elements. 6.2 Transmission Lines Matching Elements. 6.3 Lumped Elements. 6.4 Bond Wire Inductors. 6.5 Broadband Inductors. References. Problems. Chapter 7: Impedance Matching Techniques. 7.1 One-Port and Two-Port Networks. 7.2 Narrowband Matching Techniques. 7.3 Wideband Matching Techniques. References. Problems. Chapter 8: Amplifier Classes and Analyses. 8.1 Classes of Amplifiers. 8.2 Analysis of Class-A Amplifiers. 8.3 Analysis of Class-B Amplifiers. 8.4 Analysis of Class-C Amplifiers. 8.5 Analysis of Class-E Amplifiers. 8.6 Analysis of Class-F Amplifiers. 8.7 Comparison Between Various Amplifier Classes. References. Problems. Chapter 9: Amplifier Design Methods. 9.1 Amplifier Design. 9.2 Amplifier Design techniques. 9.3 Matching Networks. 9.4 Amplifier Design Examples. 9.5 Silicon Based Handset Amplifier Design. References. Problems. Chapter 10: High-Efficiency Amplifier Techniques. 10.1 High-Efficiency Design. 10.2 Harmonic Reaction Amplifier. 10.3 Harmonic Injection Technique. 10.4 Harmonic Control Amplifier. 10.5 High-PAE Design Considerations. References. Problems. Chapter 11: Broadband Amplifier Techniques. 11.1 Transistor Bandwidth Limitations. 11.2 Broadband Amplifier Techniques. 11.3 Broadband Power Amplifier Design Considerations. References. Problems. Chapter 12: Linearization Techniques. 12.1 Nonlinear Analysis. 12.2 Phase Distortion. 12.3 Linearization of Power Amplifiers. 12.4 Efficiency Enhancement Techniques for Linear Amplifiers. 12.5 Linear Amplifier Design Considerations. 12.6 Linear Amplifier Design Examples. References. Problems. Chapter 13: High-Voltage Power Amplifier Design. 13.1 Performance Overview of High-Voltage Transistors. 13.2 High-Voltage Transistors. 13.3 High-Power Amplifier Design Considerations. 13.4 Power Amplifier Design Examples. 13.5 Broadband HV Amplifiers. 13.6 Series FET Amplifiers. References. Problems. Chapter 14: Hybrid Amplifiers. 14.1 Hybrid Amplifier Technologies. 14.2 Printed Circuit Boards. 14.3 Hybrid Integrated Circuits. 14.4 Design of Internally Matched Power Amplifiers. 14.5 Low-Noise Amplifiers. 14.6 Power Amplifiers. References. Problems. Chapter 15: Monolithic Amplifiers. 15.1 Advantages of Monolithic Amplifiers. 15.2 Monolithic IC Technology. 15.3 MMIC Design. 15.4 Design Examples. 15.5 CMOS Fabrication. References. Problems. Chapter 16: Thermal Design. 16.1 Thermal Basics. 16.2 Transistor Thermal Design. 16.3 Amplifier Thermal Design. 16.4 Pulsed Operation. 16.5 Heat Sink Design. 16.6 Thermal Resistance Measurement. References. Problems. Chapter 17: Stability Analyses. 17.1 Even-Mode Oscillations. 17.2 Odd-Mode Oscillations. 17.3 Parametric Oscillations. 17.4 Spurous Parametric Oscillations. 17.5 Low-Frequency Oscillations. References. Problems. Chapter 18: Biasing Networks. 18.1 Biasing of Transistors. 18.2 Biasing Network Design Considerations. 18.3 Self-Bias Technique. 18.4 Biasing Multi-Stage Amplifiers. 18.5 Biasing Circuitry for Low-Frequency Stabilization. 18.6 Biasing Sequence. References. Problems. Chapter 19: Power Combining. 19.1 Device-Level Power Combining. 19.2 Circuit-Level Power Combining. 19.3 Power Dividers, Hybrids and Couplers. 19.4 N-Way Combiners. 19.5 Corporate Structures. 19.6 Power Handling of Isolation Resistors. 19.7 Spatial Power Combiners. 19.8 Comparison of Power Combining Schemes. References. Problems. Chapter 20: Integrated Function Amplifiers. 20.1 Integrated limiter/LNA. 20.2 Transmitter Chain. 20.3 Cascading of Amplifiers. References. Problems. Chapter 21: Amplifier Packages. 21.1 Amplifier Packaging Overview. 21.2 Materials for Packages. 21.3 Ceramic Package Design. 21.4 Plastic Package Design. 21.5 Package Assembly. 21.6 Thermal Considerations. 21.7 CAD Tools For Packages. 21.8 Power Amplifier Modules. References. Problems. Chapter 22: Transistor and Amplifier Measurements. 22.1 Transistor Measurements. 22.2 Amplifier Measurements. 22.3 Distortion Measurements. 22.4 Phase Noise Measurement. 22.5 Recovery Time Measurement. References. Problems. Appendix A: Physical Constants and Other Data. Appendix B: Units and Symbols. Appendix C: Frequency Band Designation. Appendix D: Decibel Units - (dB). Appendix E: Mathematical Relations. Appendix F: Smith Chart. Appendix G: Graphical Symbols. Appendix H: Acronyms and Abbreviations. Appendix I: List Of Symbols. Appendix J: Multiple Access and Modulation Techniques. Index.

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Book SynopsisAn in-depth survey of the design and REALIZATIONS of miniaturized fractal microwave and RF filters Engineers are continually searching for design methods that can satisfy the ever-increasing demand for miniaturization, accuracy, reliability, and fast development time. Design and Realizations of Miniaturized Fractal RF and Microwave Filters provides RF and microwave engineers and researchers, advanced graduate students, and wireless and telecommunication engineers with the knowledge and skills to design and realize miniaturized fractal microwave and RF filters. This book is an essential resource for the realization of portable and cellular phones, WiFi, 3G and 4G, and satellite networks. The text focuses on the synthesis and fabrication of miniaturized fractal filters with symmetrical and asymmetrical frequency characteristics in the C, X and Ku bands, though applications to other frequency bands are considered. Readers will find helpful guidance on: MTable of ContentsFOREWORD. PREFACE. 1 MICROWAVE FILTER STRUCTURES. 1.1 Background. 1.2 Cavity Filters. 1.3 Planar Filters. 1.4 Planar Filter Technology. 1.5 Active Filters. 1.6 Superconductivity or HTS Filters. 1.7 Periodic Structure Filters. 1.8 SAW Filters. 1.9 Micromachined Filters. 1.10 Summary. References. 2 IN-LINE SYNTHESIS OF PSEUDO-ELLIPTIC FILTERS. 2.1 Introduction. 2.2 Approximation and Synthesis. 2.3 Chebyshev Filters. 2.4 Pseudo-elliptic Filters. 2.5 Prototype Synthesis Examples. 2.6 Theoretical Coupling Coefficients and External Quality Factors. References. 3 SUSPENDED SUBSTRATE STRUCTURE. 3.1 Introduction. 3.2 Suspended Substrate Technology. 3.3 Unloaded Quality Factor of a Suspended Substrate Resonator. 3.4 Coupling Coefficients of Suspended Substrate Resonators. 3.5 Enclosure Design Considerations. References. 4 MINIATURIZATION OF PLANAR RESONATORS USING FRACTAL ITERATIONS. 4.1 Introduction. 4.2 Miniaturization of Planar Resonators. 4.3 Fractal Iteration Applied to Planar Resonators. 4.4 Minkowski Resonators. 4.5 Hibert Resonators. References. 5 DESIGN AND REALIZATIONS OF MEANDERED LINE FILTERS. 5.1 Introduction. 5.2 Third-order Pseudo-elliptic Filters with Transmission Zero on the Right. 5.3 Third-order Pseudo-elliptic Filters with Transmission Zero on the Left. References. 6 DESIGN AND REALIZATIONS OF HILBERT FILTERS. 6.1 Introduction. 6.2 Design of Hilbert Filters. 6.3 Realizations and Measured Performance. References. 7 DESIGN AND REALIZATION OF DUAL-MODE MINKOWSKI FILTERS. 7.1 Introduction. 7.2 Study of Minkowski Dual-Mode Resonators. 7.3 Design of Fourth-Order Pseudo-elliptic Filters with Two Transmission Zeros. 7.4 Realization and Measured Performance. References. APPENDIX 1: Equivalence Between J and K Lowpass Prototypes. APPENDIX 2: Extraction of the Unloaded Quality Factor of Suspended Substrate Resonators. INDEX.

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Book SynopsisToday's networks of processors on and off chip, operating with independent clocks, need effective synchronization of the data passing between them for reliability. When two or more processors request access to a common resource, such as a memory, an arbiter has to decide which request to deal with first.Table of ContentsPreface. List of Contributors. Acknowledgements. 1. Synchronization, Arbitration and Choice. 1.1 Introduction. 1.2 The Problem of Choice. 1.3 Choice in Electronics. 1.4 Arbitration. 1.5 Continuous and Discrete Quantities. 1.6 Timing. 1.7 Book Structure. PART I. 2. Modelling Metastability. 2.1 The Synchronizer. 2.2 Latch Model. 2.3 Failure Rates. 2.3.1 Event Histograms and MTBF. 2.4 Latches and Flip-flops. 2.5 Clock Back Edge. 3. Circuits. 3.1 Latches and Metastability Filters. 3.2 Effects of Filtering. 3.3 The Jamb Latch. 3.3.1 Jamb Latch Flip-flop. 3.4 Low Coupling Latch. 3.5 The Q-flop. 3.6 The MUTEX. 3.7 Robust Synchronizer. 3.8 The Tri-flop. 4. Noise and its Effects. 4.1 Noise. 4.2 Effect of Noise on a Synchronizer. 4.3 Malicious Inputs. 4.3.1 Synchronous Systems. 4.3.2 Asynchronous Systems. 5. Metastability Measurements. 5.1 Circuit Simulation. 5.1.1 Time Step Control. 5.1.2 Long-term τ. 5.1.3 Using Bisection. 5.2 Synchronizer Flip-flop Testing. 5.3 Rising and Falling Edges. 5.4 Delay-based Measurement. 5.5 Deep Metastability. 5.6 Back Edge Measurement. 5.7 Measure and Select. 5.7.1 Failure Measurement. 5.7.2 Synchronizer Selection. 6. Conclusions Part I. PART II. 7. Synchronizers in Systems. 7.1 Latency and Throughput. 7.2 FIFO Synchronizer. 7.3 Avoiding Synchronization. 7.4 Predictive Synchronizers. 7.5 Other Low-latency Synchronizers. 7.5.1 Locally Delayed Latching (LDL). 7.5.2 Speculative Synchronization. 7.6 Asynchronous Communication Mechanisms (ACM). 7.6.1 Slot Mechanisms. 7.6.2 Three-slot Mechanism. 7.6.3 Four-slot Mechanism. 7.6.4 Hardware Design and Metastability. 7.7 Some Common Synchronizer Design Issues. 7.7.1 Unsynchronized Paths. 7.7.2 Moving Metastability Out of Sight. 7.7.3 Multiple Synchronizer Flops. 8. Networks and Interconnects. 8.1 Communication on Chip. 8.1.1 Comparison of Network Architectures. 8.2 Interconnect Links. 8.3 Serial Links. 8.3.1 Using One Line. 8.3.2 Using Two Lines. 8.4 Differential Signalling. 8.5 Parallel Links. 8.5.1 One Hot Codes. 8.5.2 Transition Signaling. 8.5.3 n of m Codes. 8.5.4 Phase Encoding. 8.5.5 Time Encoding. 8.6 Parallel Serial Links. 9. Pausible and Stoppable Clocks in GALS. 9.1 GALS Clock Generators. 9.2 Clock Tree Delays. 9.3 A GALS Wrapper. 10. Conclusions Part II. PART III. 11. Arbitration. 11.1 Introduction. 11.2 Arbiter Definition. 11.3 Arbiter Applications, Resource Allocation Policies and Common Architectures. 11.4 Signal Transition Graphs, Our Main Modelling Language. 12. Simple Two-way Arbiters. 12.1 Basic Concepts and Conventions. 12.1.1 Two-phase or Non-return-to-zero (NRZ) Protocols. 12.1.2 Four-phase or Return-to-zero (RTZ) Protocols. 12.2 Simple Arbitration Between Two Asynchronous Requests. 12.3 Sampling the Logic Level of an Asynchronous Request. 12.4 Summary of Two-way Arbiters. 13. Multi-way Arbiters. 13.1 Multi-way MUTEX Using a Mesh. 13.2 Cascaded Tree Arbiters. 13.3 Ring-based Arbiters. 14. Priority Arbiters. 14.1 Introduction. 14.2 Priority Discipline. 14.3 Daisy-chain Arbiter. 14.4 Ordered Arbiter. 14.5 Canonical Structure of Priority Arbiters. 14.6 Static Priority Arbiter. 14.7 Dynamic Priority Arbiter. 15. Conclusions Part III. References. Index.

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Book SynopsisElectrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology. Look inside for extensive coverage on: failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems; electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, silicon on insulator (SOTable of ContentsAbout the Author. Preface. Acknowledgments. 1 Failure Analysis and ESD. 1.1 Introduction. 1.2 ESD Failure: How Do Micro-electronic Devices Fail?. 1.3 Sensitivity of Semiconductor Components. 1.4 How Do Semiconductor Chips Fail––Are the Failures Random or Systematic?. 1.5 Closing Comments and Summary. Problems. References. 2 Failure Analysis Tools, Models, and Physics of Failure. 2.1 FA Techniques for Evaluation of ESD Events. 2.2 FA Tools. 2.3 ESD Simulation: ESD Pulse Models. 2.4 Electro-Thermal Physical Models. 2.5 Statistical Models for ESD Prediction. 2.6 Closing Comments and Summary. Problems. References. 3 CMOS Failure Mechanisms. 3.1 Tables of CMOS ESD Failure Mechanisms. 3.2 LOCOS Isolation-Defined CMOS. 3.3 Shallow Trench Isolation (STI). 3.4 Polysilicon-Defined Devices. 3.5 Lateral Diode with Block Mask. 3.6 MOSFETs. 3.7 Resistors. 3.8 Interconnects: Wires, Vias, and Contacts. 3.9 ESD Failure in CMOS Nanostructures. 3.10 Closing Comments and Summary. Problems. References. 4 CMOS Circuits: Receivers and Off-Chip Drivers. 4.1 Tables of CMOS Receiver and OCD ESD Failure Mechanisms. 4.2 Receiver Circuits. 4.3 Receivers Circuits with ESD Networks. 4.4 Receiver Circuits with Half-Pass Transmission Gate. 4.5 Receiver with Full-Pass Transmission Gate. 4.6 Receiver, Half-Pass Transmission Gate, and Keeper Network. 4.7 Receiver Circuit with Pseudo-zero VT Half-Pass Transmission Gate. 4.8 Receiver with Zero VT Transmission Gate. 4.9 Receiver Circuits with Bleed Transistors. 4.10 Receiver Circuits with Test Functions. 4.11 Receiver with Schmitt Trigger Feedback Networks. 4.12 Off-Chip Drivers. 4.13 Single NFET Pull-down OCD. 4.14 Series Cascode MOSFETs. 4.15 I/O Design Considerations and ESD Parasitic Failure Mechanisms. 4.16 Closing Comments and Summary. Problems. References. 5 CMOS Integration. 5.1 Table of CMOS Integration ESD Failure Mechanisms. 5.2 Architecture and Design Synthesis-Related Failures. 5.3 Alternate Current Loop. 5.4 Chip Capacitance. 5.5 ESD Power Clamps. 5.6 Intra- and Inter-domain ESD Protection. 5.7 Split Ground Configurations. 5.8 Mixed Voltage Interface. 5.9 Mixed Signal Interface. 5.10 Inter-domain Signal Line ESD Failures. 5.11 Decoupling Capacitors. 5.12 System Clock and Phase-Locked Loop. 5.13 Fuse Networks. 5.14 Bond Pads. 5.15 MOSFET Gate Structure. 5.16 Fill Shapes. 5.17 No Connects. 5.18 Test Circuitry. 5.19 Multi-chip Systems. 5.20 CMOS Latchup Failures. 5.21 Closing Comments and Summary. Problems. References. 6 SOI ESD Failure Mechanisms. 6.1 Tables of SOI Device and Integration ESD Failure Mechanisms. 6.2 SOI N-channel MOSFETs. 6.3 SOI Diodes. 6.4 SOI Buried Resistors. 6.5 SOI Failure Mechanisms in 150 nm Technology. 6.6 SOI ESD Failure Mechanisms in 45 nm Technology. 6.7 SOI ESD Failure Mechanisms in 32 nm Technology. 6.8 SOI ESD Failure Mechanisms in 22 nm Technology and the Future. 6.9 SOI Design Synthesis and ESD Failure Mechanisms. 6.10 SOI Integration: ESD Failure Mechanisms. 6.11 Closing Comments and Summary. Problems. References. 7 RF CMOS and ESD. 7.1 Tables of RF CMOS ESD Failure Mechanisms. 7.2 RF MOSFET. 7.3 RF Shallow Trench Isolation Diode. 7.4 RF Polysilicon Gated Diode. 7.5 Silicon-Controlled Rectifier. 7.6 Schottky Barrier Diodes. 7.7 Capacitors. 7.8 Resistors. 7.9 Inductors. 7.10 Examples of RF ESD Circuit Failure Mechanisms. 7.11 Closing Comments and Summary. Problems. Reference. 8 Micro-electromechanical Systems. 8.1 Table of MEM Failure Mechanisms. 8.2 Electrostatically Actuated Devices. 8.3 Micro-mechanical Engines. 8.4 Torsional Ratcheting Actuator. 8.5 Electromagnetic Micro-power Generators. 8.6 MEM Inductors. 8.7 Electrostatically Actuated Variable Capacitor. 8.8 Micro-mechanical Switches. 8.9 RF MEM Switch. 8.10 Micro-mechanical Mirrors. 8.11 Electrostatically Actuated Torsional Micro-mirrors. 8.12 Closing Comments and Summary. Problems. References. 9 Gallium Arsenide. 9.1 Tables of GaAs-Based ESD Failure Mechanisms. 9.2 GaAs Technology. 9.3 GaAs Energy-to-failure and Power-to-failure. 9.4 GaAs ESD Failures in Active and Passive Elements. 9.5 GaAs HBT Devices. 9.6 GaAs HBT-Based Passive Elements. 9.7 GaAs PHEMT Devices. 9.8 GaAs Power Amplifiers. 9.9 InGaAs. 9.10 Gallium Nitride. 9.11 InP and ESD. 9.12 Closing Comments and Summary. Problems. References. 10 Smart Power, LDMOS, and BCD Technology. 10.1 Tables of LDMOS ESD Failure Mechanisms. 10.2 LOCOS-Defined LDMOS Devices. 10.3 STI-Defined LDMOS Devices. 10.4 STI-Defined Isolated LDMOS Transistors. 10.5 LDMOS Transistors: ESD Electrical Measurements. 10.6 LDMOS-Based ESD Networks. 10.7 LDMOS ESD Failure Mechanisms. 10.8 LDMOS Transistor Design Enhancement. 10.9 Latchup Events in LDMOS and BCD Technology. 10.10 Closing Comments and Summary. Problems. References. 11 Magnetic Recording. 11.1 Tables of Magnetic Recording Failure Mechanisms. 11.2 MR Heads. 11.3 Inductive Heads. 11.4 GMR Heads. 11.5 TMR Heads. 11.6 ESD Solutions. 11.7 Closing Comments and Summary. Problems. References. 12 Photo-masks and Reticles: Failure Mechanisms. 12.1 Table of Photo-masks ESD Failure Mechanisms. 12.2 Photo-mask Failure Mechanisms. 12.3 Photo-mask Inspection Tools. 12.4 Photo-mask ESD Characterization. 12.5 Electrical Breakdown Versus Gap Spacing. 12.6 Electrical Breakdown in Air: The Townsend Model. 12.7 Electric Breakdown in Air: Toepler’s Spark Law. 12.8 Air Breakdown: The Paschen Breakdown Model. 12.9 Paschen Curve Versus Reticle Breakdown Plot. 12.10 Electrical Model of Photo-mask Breakdown. 12.11 ESD Latent Damage. 12.12 ESD Damage for Single Versus Multiple Events. 12.13 ESD Damage to Anti-reflective Coating. 12.14 ESD Solutions in Photo-masks. 12.15 Closing Comments and Summary. Problems. References. Index.

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Book SynopsisPhotovoltaics (PV), the direct conversion of light from the sun into electricity, is an increasingly important means of distributed power generation. Using SPICE, the tool of choice for circuits and electronics designers, this book highlights the increasing importance of modelling techniques in the quantitative analysis of PV systems.Table of ContentsForeword. Preface. Acknowledgements. Introduction to Photovoltaic Systems and PSpice. Spectral Response and Short-Circuit Current. Electrical Characteristics of the Solar Cell. Solar Cell Arrays, PV Modules and PV Generators. Interfacing PV Modules to Loads and Battery Modelling. Power Conditioning and Inverter Modelling. Standalone PV Systems. Grid-connected PV Systems. Small Photovoltaics. Annex 1 PSpice Files Used in Chapter 1. Annex 2 PSpice Files Used in Chapter 2. Annex 3 PSpice Files Used in Chapter 3. Annex 4 PSpice Files Used in Chapter 4. Annex 5 PSpice Files Used in Chapter 5. Annex 6 PSpice Files Used in Chapter 6. Annex 7 PSpice Files Used in Chapter 7. Annex 8 PSpice Files Used in Chapter 8. Annex 9 PSpice Files Used in Chapter 9. Annex 10 Summary of Solar Cell Basic Theory. Annex 11 Estimation of the Radiation in an Arbitrarily Oriented Surface. Index.

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Book SynopsisPhotovoltaics (PV), the direct conversion of light from the sun into electricity, is an increasingly important means of distributed power generation. Using SPICE, the tool of choice for circuits and electronics designers, this book highlights the increasing importance of modelling techniques in the quantitative analysis of PV systems.Table of ContentsIntroduction to Photovoltaic Systems and Pspice Spectral Response and Short Circuit Current Electrical Characteristics of the Solar Cell Solar Cell Arrays PV Modules and PV Generators Interfacing PV Modules to Loads and Battery Modelling Power Conditioning and Inverter Modelling Stand - Alone PV Systems Grid Connected PV Systems Small Photovoltaics

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Book SynopsisThis text examines the theory and application of infrared detectors. It describes the optical detection process and the electronics involved in mimicking the eye. It further describes how well optical systems detect radiation.Table of ContentsPartial table of contents: Geometrical Optics. Radiometry. Optical-Detection Processes. Probability and Statistics for Optical Detection. Figures of Merit for Optical Detectors. Photovoltaic Detectors. Thermal Detectors. Schottky-Barrier Photodiodes. Infrared Search Systems. Modulation Transfer Function. Thermal-Imager Systems. Appendices. Index.

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Book SynopsisTakes a fresh look at basic digital design. From definition, to example, to graphic illustration, to simulation result, the book progresses through the main themes of digital design. Technically up-to-date, this book covers all the latest topics: Field programmable gate arrays, PALs and ROMs. The latest memory chips for SRAM and DRAM are shown. Software for creating the excitation equations of FSM are covered, as well as LogicWorks and Beige Bag PC and more.Table of ContentsCOMBINATIONAL LOGIC. From Numbers to Switches. Truth Tables and Boolean Algebra. Map and Table Methods for Minimizing Boolean Expressions. Programmable Circuits for Combinational Design. SEQUENTIAL DESIGN. Evolution of Flip-Flops. Synchronous Counters. Synchronous Finite State Machines. MASTERING DESIGN. Memory. Digital Communication and Serial Transmission. Arithmetic Hardware. Register Transfer Logic. Index.

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Book SynopsisSingh provides hands-on and research knowledge to a broad audience to help them get past very serious design problems. It covers signal integrity effects in high performance radio frequency IC designs, and substrate coupling.Trade Review"In the era of System-on-Chip, when large portions of the overall system are integrated on one large chip, designers are facing increasingly challenging issues. For the first time, this book is taking a closer look at the signal integrity problems faced by both high-performance and cost-performance applications, digital and mixed-signal integrated circuits. System designers are given guidance in power distribution analysis, interconnect optimization, and mixed, digital-analog circuit integration challenges. Researchers and CAD engineers can get an in-depth view of the current and future requirements for full-chip CAD tools, on-chip transmission line designs, integrated passive components, and many other critical signal integrity issues. This book is bringing together a broad range of representative papers that will further the understanding both in the industrial and academic communities." (Alina Deutsch, Research Staff Member, T.J. Watson Research Center, International Business Machines) "Electrical integrity (or environment noise) is becoming the principal obstacle in system-on-a-chip design. Digital circuits create a very noisy environment in which other digital and analog circuits must function. This environmental noise comes about because of coupling through the interconnect, power supply, and substrate. This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip." (Kenneth L. Shepard, Professor, Columbia University) "The explosion of wireless communications that offer greater mobility and broadband communications that provide super fast access to the Internet have placed new demands on IC designers. The key to developing successful Systems on Chip designs that offer Analog and Mixed Signal capabilities is the approach used to extract and analyze the affects of parasitics on signal integrity. This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." (Jake Buurma Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.) "As technology scales to .1 micron and below, second order effects due to physical phenomena that were not much visible before start playing a more and more significant role. So much so that well-established methodologies and tools are not providing the necessary level of confidence to the designer that her/his integrated circuit will perform as planned. The need for more accurate extraction and analysis is obvious when we observe horror stories about very hard to detect intermittent faults created by interactions among signals on different wires. There are two complementary approaches to the problem that come to mind as always when we go over the limit of previous methods - increase the accuracy of the analysis tools, and/or solve the problems by imposing constraints on the degrees of freedom left to the designer. This collection of papers covers both in details. It is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection." (Alberto Sangiovanni-Vincentelli, Professor, University of California Berkeley)Table of ContentsForeword. From the Early Days of CMOS to Today. Signal Integrity: A Problem for Design and CAD Engineers. Preface. Acknowledgments. Signal Integrity Effects in Systme-on-Chip Designs - A Designer's Perspective. Part 1: Interconnect Crosstalk. Harmony: Static Noise Analysis of Deep Submicron Digital Integrated Circuits. FastCap: A Multipole Accelerated 3-D Capacitance Extraction Program. Efficient Coupled Noise Estimation for On-Chip Interconnects. Switching Window Computation for Static Timing Analysis in Presence of Crosstalk Noise. Digital Sensitivity: Predicting Signal Interaction using Functional Analysis. Crosstalk Reduction for VLSI. Noise-aware Repeater Insertion and Wire Sizing For On-Chip Interconnect Hierarchical Moment-Matching. Post Global Routing Crosstalk Synthesis. Minimum Crosstalk Channel Routing. Reducing Cross-Coupling among Interconnect Wires in Deep-Submicron Datapath Design. A Postprocessing Algorithm for Crosstalk-driven Wire Perturbation. Noise in Digital Dynamic CMOS Circuits. Design of Dynamic Circuits with Enhanced Noise Tolerance. Coupling-Driven Signal Encoding Scheme for Low-Power Interface Design. High Frequency Simulation and Characterization of Advanced Copper Interconnects. Static Noise Analysis for Digital Integrated Circuits in Partially-Depleted Silicon-On-Insulator Technology. Synthesis of CMOS Domino Circuits for Charge Sharing Alleviation. Part 2: Inductance Effects. On-Chip Wiring Design Challenges for Gigahertz Operation. IC Analyses Including Extracted Inductance Models. FASTHENRY: A Multipole-Accelerated 3-D Inductance Extraction Program. Full-Chip, Three-Dimensional, Shapes-Based RLC Extraction. On-Chip Inductance Modeling and Analysis. How to Efficiently Capture On-Chip Inductance Effects: Introducing a New Circuit Element K. Figures of Merit to Characterize the Importance of On-Chip Inductance. Layout-Techniques for Minimizing On-Chip Interconnect Self Inductance. A Twisted-Bundle Layout Structure for Minimizing Inductive Coupling Noise. Part 3: Power Grid and Distribution Noise. Full-Chip Verification of UDSM Designs. Power Supply Noise in Future IC's: A Crystal Ball Reading. A Floorplan-based Planning Methodology for Power and Clock Distribution in ASICs. Power Supply Noise Analysis Methodology for Deep-Submicron VLSI Chip Design. Analysis of Performance Impact Caused by Power Supply Noise in Deep Submicron Devices. Full-Chip Signal Interconnect Analysis for Electromigration Reliability. Power Dissipation Analysis and Optimization of Deep Submicron CMOS Digital Circuits. Simulation and Optimization of the Power Distribution Network in VLSI Circuits. Design Strategies and Decoupling Techniques for Reducing the Effects of Electrical Interference in Mixed-Mode IC's. Design and Analysis of Power Distribution Networks in Power PC Microprocessors. Modeling the Power and Ground Effects of BGA Packages. Effects of Power/Ground Via Distribution on the Power/Ground Performance of C4/BGA Packages. Power Distribution Fidelity of Wirebond Compared to Flip Chip Devices in Grid Array Packages. Forming Damped LRC Parasitic Circuits in Simultaneously Switched CMOS Output Buffers. Part 4: Substrate Noise. Experimental Results and Modeling Techniques for Substrate Noise in Mixed-Signal Integrated Circuits. Principles of Substrate Crosstalk Generation in CMOS Circuits. Experimental Comparison of Substrate Noise Coupling Using Different Wafer Types. Modeling and Analysis of Substrate Coupling in Integrated Circuits. Fast Methods for Extraction and Sparsification of Substrate Coupling. SUBWAVE: A Methodology for Modeling Digital Substrate Noise Injection in Mixed-Signal ICs. Substrate Modeling and Lumped Substrate Resistance Extraction for CMOS ESD/Latchup Circuit Simulation. Analysis of Ground-Bounce Induced Substrate Noise Coupling in a Low Resistive Bulk Epitaxial Process: Design Strategies to Minimize Noise Effects on a Mixed-Signal Chip. A Methodology for Measurement and Characterization of Substrate Noise in High Frequency Circuits. Measurement of Digital Noise in Mixed-Signal Integrated Circuits. Effects of Substrate Resistances on LNA Performance and a Bondpad Structure for Reducing the Effects in a Silicon Bipolar Technology. A Study of Oscillator Jitter Due to Supply and Substrate Noise. CMOS Technology Characterization for Analog and RF Design. Noise Reduction Is Crucial to Mixed-Signal ASIC Design Success (Parts I & II). Author Index. Subject Index. About the Editor.

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Book SynopsisA detailed, modern introduction to semiconductors made in silicon and III-V compounds. This book develops the device physics of pn junctions, bipolar transistors, Schottky barriers, MOS capacitors, and MOS field-effect transistors (MOSFETs).Table of ContentsIntegrated Circuit Family Tree Electrons in Solids Carrier Transport and Recombination p-n Junctions: I-V Behavior p-n Junctions: Reverse Breakdown and Junction Capacitance Schottky-Barrier Devices MOS Capacitors MOS Field-Effect Transistors Bipolar Transistors Appendix I: Introduction to PSPICE

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