Electronic devices and materials Books
Pearson Education (US) Working in the Cloud
Book Synopsis
£16.49
Bloomsbury Publishing PLC Solar Energy: The physics and engineering of
Book SynopsisThis book provides a broad overview on the different aspects of solar energy, with a focus on photovoltaics, which is the technology that allows light energy to be converted into electric energy. Renewable energy sources have become increasingly popular in recent years, and solar is one of the most adaptable and attractive types – from solar farms to support the National Grid to roof panels/tiles used for solar thermal heating systems, and small solar garden lights. Written by Delft University researchers, Solar Energy uniquely covers both the physics of photovoltaic (PV) cells and the design of PV systems for real-life applications, from a concise history of solar cells components and location issues of current systems. The book is designed to make this complicated subject accessible to all, and is packed with fascinating graphs and charts, as well as useful exercises to cement the topics covered in each chapter. Solar Energy outlines the fundamental principles of semiconductor solar cells, as well as PV technology: crystalline silicon solar cells, thin-film cells, PV modules, and third-generation concepts. There is also background on PV systems, from simple stand-alone to complex systems connected to the grid. This is an invaluable reference for physics students, researchers, industrial engineers and designers working in solar energy generation, as well those with a general interest in renewable energy.Table of ContentsI. Introduction 1. Energy 2. Status and prospects of PV technology 3. The working principle of a solar cell II. PV Fundamentals 4. Electrodynamic basics 5. Solar radiation 6. Basic semiconductor physics 7. Generation and recombination of electron-hole pairs 8. Semiconductor junctions 9. Solar cell parameters and equivalent circuit 10. Losses and efficiency limits III. PV technology 11. A short history of solar cells 12. Crystalline silicon solar cells 13. Thin-film solar cells 14. A closer look to some processes 15. PV modules 16. Third generation concepts IV. PV systems 17. Introduction to PV systems 18. Location issues 19. Components of PV systems 20. PV system design 21. PV System economics and ecology V. Alternative solar energy conversion technologies 22. Solar thermal energy 23. Solar fuels Appendix A. Derivations in electrodynamics B. Derivation of homojunctions J-V curves C. Some aspects of surface recombination D. The morphology of selected TCO samples E. Some aspects on location issues F. Derivations for DC-DC converters G. Fluid-dynamic model Bibliography Index
£25.50
McGraw-Hill Education Principles of Electronic Materials and Devices
Book SynopsisPrinciples of Electronic Materials and Devices is one of the few books in the market that has a broad coverage of electronic materials that today''s scientists and engineers need. The general treatment of the textbook and various proofs leverage at a semiquantitative level without going into detailed physics.Table of Contents1) Elementary Materials Science Concepts2) Electrical and Thermal Conduction in Solids3) Elementary Quantum Physics4) Modern Theory of Solids5) Semiconductors6) Semiconductor Devices7) Dielectric Materials and Insulation8) Magnetic Properties and Superconductivity9) Optical Properties of Materials
£56.04
Oxford University Press Quantum Physics of Semiconductor Materials and
Book SynopsisQuantum Phenomena do not occur in a Hilbert space. They occur in a laboratory. - Asher PeresSemiconductor physics is a laboratory to learn and discover the concepts of quantum mechanics and thermodynamics, condensed matter physics, and materials science, and the payoffs are almost immediate in the form of useful semiconductor devices. Debdeep Jena has had the opportunity to work on both sides of the fence - on the fundamental materials science and quantum physics of semiconductors, and in their applications in semiconductor electronic and photonic devices. In Quantum Physics of Semiconductors and Nanostructures, Jena uses this experience to make each topic as tangible and accessible as possible to students at all levels.Consider the simplest physical processes that occur in semiconductors: electron or hole transport in bands and over barriers, collision of electrons with the atoms in the crystal, or when electrons and holes annihilate each other to produce a photon. The correct explanation of these processes require a quantum mechanical treatment. Any shortcuts lead to misconceptions that can take years to dispel, and sometimes become roadblocks towards a deeper understanding and appreciation of the richness of the subject. A typical introductory course on semiconductor physics would then require prerequisites of quantum mechanics, statistical physics and thermodynamics, materials science, and electromagnetism. Rarely would a student have all this background when (s)he takes a course of this nature in most universities. Jena''s work fills in these gaps and gives students the background and deeper understanding of the quantum physics of semiconductors and nanostructures.Trade ReviewEngaging, attractively presented, and very clear. This book truly fills a gap. * Chris G. Van de Walle, University of California, Santa Barbara *Table of ContentsI Fundamentals 1: And Off We Go! 2: Secrets of the Classical Electron 3: Quantum Mechanics in a Nutshell 4: Damned Lies, and Statistics 5: Electrons in the Quantum World 6: Red or Blue pill: Befriending the Matrix 7: Perturbations to the Electron's Freedom II Bands, Doping, and Heterostructures 8: Electrons in a Crystal get their Bands, Gaps and Masses 9: Bloch theorem, Bandstructure, and Quantum Currents 10: Crystal Clear: Bandstructure of the Empty Lattice 11: Tight-Binding Bandstructure 12: k . p Bandstructure 13: 1, 2, 3 ...: Pseudopotentials and Exact Bandstructure 14: Doping and Heterostructures: The Effective Mass Method 15: Carrier Statistics and Energy Band Diagrams 16: Controlling Electron Traffic in the k-Space III Quantum Electronics with Semiconductors 17: Game of Modes: Quantized R, L, and C 18: Junction Magic: Schottky, pn and Bipolar Transistors 19: Zeroes and Ones: The Ballistic Transistor 20: Fermi's Golden Rule 21: No Turning Back: The Boltzmann Transport Equation 22: Taking the Heat: Phonons and Electron-Phonon Interactions 23: Scattering, Mobility, and Velocity Saturation 24: Through the Barrier: Tunneling & Avalanches 25: Running Circles: Quantum Magnetotransport IV Quantum Photonics with Semiconductors 26: Let there be Light: Maxwell Equations 27: Light-Matter Interaction 28: Heavenly Light: Solar Cells and Photodetectors 29: Reach for the stars: Lasers and LEDs 30: Every End is a New Beginning
£51.30
John Murray Press Practical Electronics A Complete Introduction
Book SynopsisNow completely revised, Practical Electronics: A Complete Introduction covers the key areas of electronics you need to be confident in, whether you are a keen amateur hobbyist, an engineering student or a professional who wants to keep up to date. It outlines the basics in clear jargon-free English and provides added-value features like key ideas, memorable quotations and even lists of questions you might be asked in a seminar or exam.The book has been updated to remove complex and abstract technical thought and replace it with practical information that will be essential for students and general readers alike. It builds on basic principles such as simple circuits and switches, going on to explain how basic components can be used to form versatile digital systems, which can be combined and programmed to create new functional systems. It also covers microprocessor technology and microcontroller chips, showing how to program microcontrollers for learners wishing to explore this new technology. Practical Electronics employs the ''Breakthrough Method'' to help you advance quickly at any subject, whether you''re studing for an exam or just for your own interst. The Breakthrough Method is designed to overcome typical problems you''ll face as learn new concepts and skills.- Problem: "I find it difficult to remember what I''ve read."; Solution: this book includes end-of-chapter summaries and questions to test your understanding.- Problem: "Lots of introductory books turn out to cover totally different topics than my course."; Solution: this book is written by a university lecturer who understands what students are expected to know.
£15.29
Elsevier Science & Technology Programmable Logic Controllers
Book SynopsisTrade Review"... an excellent introductory text for students studying PLCs that is also a useful programming guide for engineers who need to program them...supported by numerous worked examples and a specific focus on the safety aspects necessary in PLC system design." --Computing ReviewsTable of Contents1. Programmable logic controllers2. Input-output devices3. Digital systems4. I/O processing5. Ladder and functional block programming6. IL, SFC and ST programming methods7. Internal relays8. Jump and call9. Timers10. Counters11. Shift registers12. Data handling13. Designing systems14. Programs
£41.80
Elsevier Science & Technology Embedded Systems
Book SynopsisTable of Contents1. The Linux/ARM embedded platform Chapter 2. Multicore and data-level optimization: OpenMP and SIMD Chapter 3. Arithmetic optimization and the Linux Framebuffer Chapter 4. Memory optimization and video processing Chapter 5. Embedded heterogeneous programming with OpenCL Appendix A. Adding PMU support to Raspbian for the Generation 1 Raspberry Pi B. NEON intrinsic reference C. OpenCL reference Index
£61.74
Pearson Education (US) Framework Design Guidelines
Book Synopsis Krzysztof Cwalina is a Principal Architect at Microsoft. He was a founding member of the .NET Framework team, and throughout his career has designed many .NET Framework, .NET Core, and other APIs. He is currently working on Azure SDK APIs. Krzysztof graduated with BS and MS in computer science from the University of Iowa. Jeremy Barton is a Principal Software Engineer at Microsoft. The majority of his career in computer software has been on the design and development of shared libraries. Since 2005 his primary programming language is C#, and he joined the .NET Base Class Libraries team in 2015 and is primarily responsible for .NET Cryptography. Jeremy graduated from Rose-Hulman Institute of Technology with a BS in Computer Science and Discrete Mathematics. Since graduation, he has gotten a cat, married, and a pilot's license. Brad Abrams was a founding meTable of Contents Chapter 1: Introduction Chapter 2: Framework Design Fundamentals Chapter 3: Naming Guidelines Chapter 4: Type Design Guidelines Chapter 5: Member Design Chapter 6: Designing for Extensibility Chapter 7: Exceptions Chapter 8: Usage Guidelines Chapter 9: Common Design Patterns Appendix A: C# Coding Style Conventions Appendix B: Obsolete Guidance Appendix C: Sample API Specification Appendix D: Breaking Changes Glossary
£46.54
Pearson Education Limited Mechatronics
Book SynopsisBill Bolton is the author of many successful engineering textbooks. He was formerly a Consultant to the Further Education Unit, Head of Research and Development and Monitoring at BTEC and a UNESCO consultant.Table of ContentsPreface Acknowledgements Introducing mechatronics Sensors and transducers Signal conditioning Digital signals Digital logic Data presentation systems Pneumatic and hydraulic actuation systems Mechanical actuation systems Electrical actuation systems Microprocessors and microcontrollers Assembly language C language Input/output systems Programmable logic controllers Communication systems Fault finding Basic system models System models Dynamic responses of systems System transfer functions Frequency response Closed-loop controllers Artificial intelligence Mechatronic systems Appendices Answers Index
£78.99
O'Reilly Media Make Radio
Book SynopsisWith more than 150 color images, step-by-step instructions and detailed explanations, and a handy materials list of components and sources, this is the ultimate guide to explore the hidden universe of radio waves!
£20.39
Institution of Engineering and Technology Technologies and Techniques in Gait Analysis:
Book SynopsisGait analysis is the study of the walking or running pattern of an individual. This can include spatial and temporal measurements such as step length, stride length and speed along with angular measurements of various joints and the interplay between various parts like the foot, hip, pelvis or spine when walking. Gait analysis can be used to assess clinical conditions and design effective rehabilitation; for example, following limb injury or amputation, or other disorders such as a stroke or Parkinson's diagnosis. It can be used to influence intervention decisions, such as whether a patient should undergo surgery, further physiotherapy, or begin a particular treatment regime. Gait analysis can also be used in sports science to monitor and review performance and technique. Gait can be recorded in a variety of ways, including pressure sensors, force plates, in-shoe pressure systems, through marker-based or marker-less systems using various cameras or sensors to calculate body positions in a set sequence of movements. This book focuses on both the hardware systems for collecting data as well as data visualisation and mathematical models for interpreting the data. It is written by a range of international researchers from academia, industry, and clinical settings, providing a complete overview of gait analysis technologies suitable for an audience of engineers in rehabilitation technologies or other biomedical engineering fields.Table of Contents Chapter 1: Introduction to gait analysis Chapter 2: Gait analysis - a historical perspective Chapter 3: Gait analysis - kinematics Chapter 4: Gait analysis - kinetics Chapter 5: Assessment of muscle function Chapter 6: Considerations for data analysis Chapter 7: Novel technologies for gait analysis Chapter 8: Clinical gait analysis Chapter 9: Gait analysis in rehabilitation Chapter 10: Forensic gait analysis - Is there a case? Chapter 11: Future of gait analysis
£114.00
Raspberry Pi Press Get started with MicroPython on Raspberry Pi Pico
Book SynopsisMicrocontrollers, like Raspberry Pi Pico, are computers stripped down to their bare essentials (no keyboard, mouse, or monitor). Learn how to set up your desktop or laptop computer to write Python code for the Pico and Pico W, and how to make your own electro-mechanical projects that can interact with the real world.
£14.24
McGraw-Hill Education ISE Electric Motors and Control Systems
Book SynopsisElectric Motors and Control Systems provides an overview of electric motor operation, selection, installation, and control and maintenance for a range of motor types and control systems. This edition presents the most up-to-date information, which reflects the current needs of the industry and includes coverage of how motors operate in conjunction with their associated control circuitry. Both older and newer motor technologies are examined. Topics covered include motor types, controls, installing and maintaining conventional controllers, electronic motor drives and programmable logic controllers. This broad-based approach taken, makes this text viable for a variety of motors and control systems courses. Content is suitable for colleges, technical institutions, vocational/technical schools, as well as apprenticeship and journeymen training. Electrical apprentices and journeymen will find this book to be invaluable as well as information on maintenance and troublTable of Contents1) Safety in the WorkplacePart 1 - Protecting against Electrical ShockPart 2 - Grounding-Lockout-Codes2) Understanding Electrical DrawingsPart 1 - Symbols-Abbreviations-Ladder DiagramsPart 2 - Wiring-Single Line-Block DiagramsPart 3 - Monitor Terminal ConnectionsPart 4 - Motor Nameplate and TerminologyPart 5 - Manual and Magnetic Motor Starters3) Motor Transformers and Distribution SystemsPart 1 - Power Distribution SystemsPart 2 - Transformer PrinciplesPart 3 - Transformer Connections and Systems4) Motor Control DevicesPart 1 - Manually Operated SwitchesPart 2 - Mechanically Operated SwitchesPart 3 - SensorsPart 4 - Actuators5) Electric MotorsPart 1 - Motor PrinciplePart 2 - Direct Current MotorsPart 3 - Three-Phase Alternating CurrentPart 4 - Single-Phase Alternating CurrentPart 5 - Alternating Current Motor DrivesPart 6 - Motor SelectionPart 7 - Motor InstallationPart 8 - Motor Maintenance and Troubleshooting6) Contractors and Motor StartersPart 1 - Magnetic ContractorPart 2 - Contractor Ratings, Enclosures, and Solid-State TypesPart 3 - Motor Starters7) RelaysPart 1 - Electromechanical Control RelaysPart 2 - Solid-State RelaysPart 3 - Timing RelaysPart 4 - Latching RelaysPart 5 - Relay Control Logic8) Motor Control CircuitsPart 1 - NEC Motor Installation RequirementsPart 2 - Motor StartingPart 3 - Motor Reversing and JoggingPart 4 - Motor StoppingPart 5 - Motor Speed9) Motor Control ElectronicsPart 1 - Semiconductor DiodesPart 2 - TransistorsPart 3 - ThyristorsPart 4 - Integrated Circuits (ICs)10) Adjustable-Speed Drives and PLC InstallationsPart 1 - AC Motor Drive FundamentalsPart 2 - VFD Installation and Programming ParametersPart 3 - DC Motors Drive FundamentalsPart 4 - Programmable Logic Controllers (PLCs)
£53.09
Elsevier Science & Technology Computers as Components
Book Synopsis
£70.25
CRC Press Particles Fields SpaceTime
Book SynopsisParticles, Fields, Space-Time: From Thomson's Electron to Higgs' Boson explores the concepts, ideas, and experimental results that brought us from the discovery of the first elementary particle in the end of the 19th century to the completion of the Standard Model of particle physics in the early 21st century. The book concentrates on disruptive events and unexpected results that fundamentally changed our view of particles and how they move through space-time. It separates the mathematical and technical details from the narrative into focus boxes, so that it remains accessible to non-scientists, yet interesting for those with a scientific background who wish to further their understanding. The text presents and explains experiments and their results wherever appropriate. This book is of interest to a general audience, but also to students studying particle physics, physics teachers at all levels, and scientists with a recreational curiosity towards the subject.For this
£49.99
APress Understanding Semiconductors
Book SynopsisGain complete understanding of electronic systems and their constituent parts. From the origins of the semiconductor industry right up until today, this book serves as a technical primer to semiconductor technology. Spanning design and manufacturing to the basic physics of electricity, it provides a comprehensive base of understanding from transistor to iPhone. Melding an accessible, conversational style with over 100 diagrams and illustrations, Understanding Semiconductors provides clear explanations of technical concepts going deep enough to fully explain key vernacular, mechanisms, and basic processes, without getting lost in the supporting theories or the theories that support the supporting theories. Concepts are tethered to the real world with crisp analysis of industry dynamics and future trends. As a break from the straight-ahead scientific concepts that keep the world of semiconductors spinning, Understanding SemicondTable of ContentsChapter One: Semiconductors BasicsElectricity Electric Charge Electric Current Electromagnetic Force (EMF) and Voltage Power Joule’s LawConductivity Conductors Insulators SemiconductorsSilicon – The Crucial SemiconductorSemiconductor History – Part OneSemiconductor Value Chain Customer Need & Market Demand Chip Design Fabrication & Manufacturing Packaging & Assembly System Integration Product DeliveryPerformance, Power, Area, and Cost (PPAC)Who Uses Semiconductors? Chapter Two: Circuit Building BlocksDiscrete Components – The Building Blocks of CircuitsTransistors Transistor Structure How Transistors Work – A Water Analogy FinFET vs. MOSFET TransistorsCMOSGeometric vs. Functional Scaling – Part 1Logic Gates Chapter Three: Building a System Different Levels of Electronics – How the System Fits TogetherIntegrated Circuit Design Flow System Level Architecture Front End Design Design Verification Physical Design High Level Synthesis Design Netlist Floorplanning Place-and-Route Clock-tree Synthesis Back End Validation Manufacturing (GDS)EDA Tools Chapter Four: Semiconductor Manufacturing Front-End ManufacturingDepositionPatterning & Lithography Removal ProcessesPhysical Property AlterationCycling – Pre & Post Metal Wafer Probing, Yield, and Failure AnalysisBack-End Manufacturing Assembly & TestWafer DicingDie BondingExternal Interconnect FormationEncapsulation and SealingFinal Testing Chapter Five: Tying the System Together Input / Output (I/O) IC Packaging Wire Bonding Flip Chip Packaging Wafer Level Packaging Multi-Chip Modules & System-In Packages 2.5/3D Packaging Signal Integrity Bus Interfaces Power Flow within Electronic Systems Chapter Six: Common Circuits and System Components Digital vs. Analog Wavelength vs. Frequency Building a System - Putting Components Together Common System Components – The SIA Framework Micro Components Logic Memory OSD Analog Components Micro Components Microprocessors & Microcontrollers Digital Signal Processors Micro Component Market Summary Logic Special Purpose Logic Central Processing Unit Graphics Processing Unit ASIC vs. FPGA System on Chip Logic Market Summary Memory Memory Stack Volatile Memory Random Access MemoryDRAM SRAM Non-Volatile Memory Primary Memory ROMPROMEPROMEEPROMNAND Secondary Memory HDD SSD Stacked Die Memory High Bandwidth Memory Hybrid Memory Cube Memory Market Summary Optoelectronics, Sensors & Actuators, and Discrete Components Optoelectronics Sensors & Actuators MEMS Discrete Components PMIC PMU OSD Market Summary Analog Components General Purpose Analog IC vs. ASSP Analog Component Market Summary Chapter Seven: RF & Wireless Technologies RF Signals and The Electromagnetic Spectrum RFIC – Transmitters and Receivers Power Source Oscillators Modulators & Demodulators Amplifiers Antenna Filters OSI Reference Model Application Layer Physical Layer (PHY) Macro System Stack RF and Wireless – The Big Picture Base Stations Tracking a Phone Call Broadcasting and Frequency Regulation Digital Signal ProcessingTDMA & CDMA 1G to 5G – An Evolution Wireless Communication and Cloud Computing Chapter Eight: System Architecture and Integration Macro vs. Micro-Architecture Common Chip Architectures Von Neumann Architecture Harvard Architecture CISC vs. RISC Choosing an ISA Heterogenous vs. Monolithic Integration Chapter Nine: The Semiconductor Industry – Past, Present, and Future Semiconductor Industry – Major Challenges Design Costs Manufacturing Costs Evolution of the Semiconductor Industry 1960-1980’s: Fully Integrated Semiconductor Companies 1980’s-2000: IDM + Fabless Design + Pure-Play Foundry 2000-Today: IDM + Fabless Design + Foundries + System Companies Fabs vs. Fabless Design – The Case Against IDM’s Industry Outlook Cyclical Revenues and High Volatility High R&D and Capital Investment Positive Productivity Growth Long-Term Profitability High Consolidation 2010-2021: Major Acquisitions by Year U.S. vs. International Semiconductor Market COVID-19 & The Semiconductor Supply Chain Chinese Competition Chapter Ten: The Future of Semiconductors and Electronic Systems Prolonging Moore’s Law – Sustaining Technologies 2.5 & 3D Die Stacking Gate-All-Around (GAA) Transistors & New Channel Materials Custom Silicon & Specialized Accelerators Graphene Carbon Nanotubes & 2D Transistors Overcoming Moore’s Law – New Technologies Quantum Computing & Quantum Transistors Neuromorphic Computing
£26.99
Hodder & Stoughton The Everything Blueprint: The Microchip Design
Book Synopsis**A Financial Times Best Summer Book 2023**Out now: a gripping look at the rise of the microchip and the British tech company behind the blueprint to it all.'A gripping and inspiring read.' Sir James Dyson'A revealing and insightful biography of the company whose blueprints define the digital world.' Chris Miller, author of CHIP WAR: The Fight for the World's Most Critical Technology'[A] sparkly corporate biography.' Financial Times__________One tiny device lies at the heart of the world's relentless technological advance: the microchip. Today, these slivers of silicon are essential to running just about any machine, from household devices and factory production lines to smartphones and cutting-edge weaponry.At the centre of billions of these chips is a blueprint created and nurtured by a single company: Arm.Founded in Cambridge in 1990, Arm's designs have been used an astonishing 250 billion times and counting. The UK's high-tech crown jewel is an indispensable part of a global supply chain driven by American brains and Asian manufacturing brawn that has become the source of rising geopolitical tension.With exclusive interviews and exhaustive research, The Everything Blueprint tells the story of Arm, from humble beginnings to its pivotal role in the mobile phone revolution and now supplying data centres, cars and the supercomputers that harness artificial intelligence.It explores the company's enduring relationship with Apple and numerous other tech titans, plus its multi-billion-pound sale to the one-time richest man in the world, Japan's Masayoshi Son.The Everything Blueprint details the titanic power struggle for control of the microchip, through the eyes of a unique British enterprise that has found itself in the middle of that battle.__________Trade Review'This is a gripping and inspiring read. The Everything Blueprint reveals how a British technology company fought to become a global one - and achieved this thanks to a powerful combination of homegrown talent, international collaboration between brilliant people, and dogged ambition. Arm's success is proof that in today's connected world it is vital to go abroad to achieve scale. The key to this story is a fierce determination to be No. 1 - and never giving into complacency.' Sir James Dyson, British inventor, industrial designer and entrepreneur'The Everything Blueprint provides the hidden history of the most important company most people have never heard of. We all rely on Arm's chip technology but James Ashton provides a dramatic account of where Arm came from-and how this company will shape the future of computing and artificial intelligence. A revealing and insightful biography of the company whose blueprints define the digital world.' Chris Miller, author of CHIP WAR: The Fight for the World's Most Critical Technology'This is an engrossing history of the most important company to emerge in the UK in the last 40 years and how it fits in to the world's most vital industry. It's also a sobering reminder that if we are careless about Arm's future we can give up on our aspirations to be a leading tech nation.' Rory Cellan-Jones, former BBC technology correspondent and author of Always On: Hope and Fear in the Social Smartphone Era'James Ashton weaves his way through the intricate geopolitics of the semiconductor industry with an insider's view of Arm's remarkable rise. From Silicon Valley to Taiwan via Cambridge, this book provides an essential account of a vital industry, and, in an era infused with artificial intelligence, reminds us that technology remains inherently human.' Reid Hoffman, partner at Greylock and co-founder of LinkedIn'Swaffham, Bulbeck in England is not writ as large in the lore of the chip industry as California's Mountain View (birthplace of Intel) and Sunnyvale (birthplace of nVidia), or Taiwan's Hsinchu, the cradle of TSMC. But this village should be in the register because that's where the computer world first encountered ARM, a company whose tale James Ashton deftly weaves into a tapestry stretching from the first transistor to chatGPT.' Sir Michael Moritz, author of Return of the Little Kingdom: Steve Jobs, the Creation of Apple, and How it Changed the World'A detailed guide on the rise of one of the biggest players on the field . . . Ashton's book is a timely release showing how Arm got from a former-turkey plucking barn in Cambridgeshire (its first office) to the Big Apple.' - City AM
£21.25
Academic Studies Press Piezoelectric Electromechanical Transducers for
Book SynopsisThe book presents a broad-scope analysis of piezoelectric electromechanical transducers and the related aspects of practical transducer design for underwater applications. It uses an energy method for analyzing transducer problems that provides the physical insight important for the understanding of electromechanical devices. Application of the method is first illustrated with transducer examples that can be modeled as systems with a single degree of freedom, (such as spheres, short cylinders, bars and flexural disks and plates made of piezoelectric ceramics). Thereupon, transducers are modeled as devices with multiple degrees of freedom. In all these cases, results of modeling are presented in the form of equivalent electromechanical circuits convenient for the calculation of the transducers’ operational characteristics. Special focus is made on the effects of coupled vibrations in mechanical systems on transducer performance. The book also provides extensive coverage of acoustic radiation including acoustic interaction between the transducers. The book is inherently multidisciplinary. It provides essential background regarding the vibration of elastic passive and piezoelectric bodies, piezoelectricity, acoustic radiation, and transducer characterization. Scientists and engineers working in the field of electroacoustics and those involved in education in the field will find this material useful not only for underwater acoustics, but also for electromechanics, energy conversion and medical ultrasonics. Part I contains an introduction to the energy method illustrated with examples of one degree of freedom transducers. It is self-sufficient and can be read independently.
£31.49
Springer Conductors Semiconductors Superconductors
Book SynopsisSpectacular Advances.- Well Ordered Lattice Structures in Crystals.- Permanent Movement in the Crystal Lattice.- Electric Conductor or Insulator?—Energy Bands.- Metals Obey the Rules of Quantum Statistics.- Less Can Be More: Semiconductors.- Circling Electrons in High Magnetic Fields.- The Winner: Superconductors.- The Big Surprise: High-Temperature Superconductivity.- Magnetism: Order Among the Elementary Magnets.- Nanostructures: Superlattices, Quantum Wires, and Quantum Dots.- Defects in the Crystal Lattice: Useful orHarmful?.
£53.99
Artech House Publishers Cognitive Electronic Warfare: An Artificial
Book SynopsisThis comprehensive book gives an overview of how cognitive systems and artificial intelligence (AI) can be used in electronic warfare (EW). Readers will learn how EW systems respond more quickly and effectively to battlefield conditions where sophisticated radars and spectrum congestion put a high priority on EW systems that can characterize and classify novel waveforms, discern intent, and devise and test countermeasures. Specific techniques are covered for optimizing a cognitive EW system as well as evaluating its ability to learn new information in real time. The book presents AI for electronic support (ES), including characterization, classification, patterns of life, and intent recognition. Optimization techniques, including temporal tradeoffs and distributed optimization challenges are also discussed. The issues concerning real-time in-mission machine learning and suggests some approaches to address this important challenge are presented and described. The book covers electronic battle management, data management, and knowledge sharing. Evaluation approaches, including how to show that a machine learning system can learn how to handle novel environments, are also discussed. Written by experts with first-hand experience in AI-based EW, this is the first book on in-mission real-time learning and optimization.Table of ContentsIntro to Cognitive EW; Objective Function; Machine Learning Primer; Electronic Support; Electronic Protect and Electronic Attack; Electronic Battle Management; Real-time In-mission Planning and Learning; Data Management; Architecture; Test and Evaluation.
£96.75
Elsevier Science & Technology Embedded C Programming
Book SynopsisTable of ContentsIntroductionChapter 1: C Overview and Program StructureChapter 2: ConstantsChapter 3: Preprocessor DirectivesChapter 4: Data Variable and TypesChapter 5: Expressions and OperatorsChapter 6: StatementsChapter 7: FunctionsChapter 8: ArraysChapter 9: StructuresChapter 10: Memory and PointersChapter 11: Built-in FunctionsChapter 12: StringsChapter 13: Function-like MacrosChapter 14: Conditional CompilationChapter 15: PIC® Microcontroller Chapter 16: Discrete Input and OutputChapter 17: InterruptsChapter 18: Timers/CountersChapter 19: Advanced TimingChapter 20: Analog TechniquesChapter 21: Internal Serial BussesChapter 22: External Serial BussesChapter 23: Multi-taskingChapter 24: Inline AssemblyChapter 25: DebuggingAppendices A, B and C
£41.79
Taylor & Francis Ltd Photonic Instrumentation
Book SynopsisPhotonic Instrumentation: Sensing and Measuring with Lasers is designed as a source for university-level courses covering the essentials of laser-based instrumentation, and as a useful reference for working engineers. Photonic instruments have very desirable features like non-contact operation and unparalleled sensitivity. They have quickly become a big industrial success, passing unaffected through the bubble years and, not any less important, well-established methods in measurement science. This book offers coverage of the most proven instruments, with a balanced treatment of the optical and electronic aspects involved. It also attempts to present the basic principles, develop the guidelines of design and evaluate the ultimate limits of performances set by noise.The instruments surveyed include: alignment instruments, such as wire diameter and particle size analyzers, telemeters, laser interferometers and self-mixing interferometers, Table of ContentsChapter 1. Introduction. Chapter 2. Alignment, Pointing, and Sizing Instruments. Chapter 3. Laser Telemeters. Chapter 4. Laser Interferometry. Chapter 5. Self-Mixing Interferometry. Chapter 6. Speckle-Pattern and Applications. Chapter 7. Velocimeters. Chapter 8. Gyroscopes. Chapter 9. Optical Fiber Sensors. Chapter 10. Quantum Sensing. Appendix A0. Nomenclature. Appendix A1. Lasers for Instrumentation. Appendix A2. Optical Interferometers. Appendix A3. Propagation through the Atmosphere. Appendix A4. Propagation and Diffraction. Appendix A5. Source of Information on Photonic Instrumentation. Index.
£131.68
CRC Press Electronic Instrumentation with MATLAB
Book SynopsisElectronic Instrumentation systems are electronic systems for implementing specific desired functions such as measurement, control and monitoring. This book discusses sensors and conditioning circuits for electronic instrumentation. The book is unique. It is the first time MATLAB computational powers are being used to describe and explore various aspects of electronic instrumentation (electronic signal conditioning circuits and instrumentation sensors). In addition, it is first time an electronic instrumentation system is written to introduce the Internet-of-Things (IoT), and the popular sensors for IoT applications. MATLAB is used for computations, plotting, curve fitting, statistical analysis and parameters identification of instrumentation systems. There is in-depth presentation of signals conditioning circuits for instrumentation sensors, such as amplifiers, filters, analog to digital conversion circuits. There are broad descriptions of the underlying principles of temperature, displacement, pressure, flow and electro-optical sensors. In addition, the book discusses popular sensors for Internet-of-Things applications. There are several worked examples for solving electronic instrumentation problems by using MATLAB. The examples help the reader to understand the operations of signal conditioning circuits, and explore the characteristics of various instrumentation sensors. The book has end-of-chapter problems that test and help solidify the readerâs understanding of the material. The book can be used by students, professional engineers and technicians who want knowledge of signal conditioning circuits used in instrumentation systems, and detailed description of instrumentation sensors.
£84.99
Taylor & Francis Inc Semiconductor Laser Theory
Book SynopsisDeveloped from the authors' classroom-tested material, Semiconductor Laser Theory takes a semiclassical approach to teaching the principles, structure, and applications of semiconductor lasers. Designed for graduate students in physics, electrical engineering, and materials science, the text covers many recent developments, including diode lasers using quantum wells, quantum dots, quantum cascade lasers, nitride lasers, group IV lasers, and transistor lasers.The first half of the book presents basic concepts, such as the semiconductor physics needed to understand the operation of lasers, p-n junction theory, alloys, heterostructures, quantum nanostructures, k.p theory, waveguides, resonators, filters, and optical processes. The remainder of the book describes various lasers, including double heterostructure, quantum wire, quantum dot, quantum cascade, vertical-cavity surface-emitting, single-mode and tunable, nitride, group IV, and transistor laTrade Review"This textbook offers a thorough treatment of basic principles and also manages to capture current trends in semiconductor laser research. … topics are supplemented with problem sets for testing the reader’s understanding, and some references to the literature. The authors’ clear presentation of the material in this volume makes it eminently digestible."—Optics & Photonics News, December 2015Table of ContentsIntroduction to Semiconductor Lasers. Basic Theory. Heterojunctions and Quantum Structures. Band Structures. Waveguides and Resonators. Optical Processes. Models for DH Lasers. Quantum Well Lasers. Quantum Dots. Quantum Cascade Lasers. Vertical-Cavity Surface-Emitting Laser. Single-Mode and Tunable Lasers. Nitride Lasers. Group IV Lasers. Transistor Lasers. Appendices.
£105.00
Nova Science Publishers Inc Polycrystalline & Spatially Non-Homogenous
Book SynopsisThe book is devoted to theoretical investigations of interrelations in between morphology, single-electron spectrum, and optical properties of polycrystalline and spatially non-homogeneous amorphous semiconductors.
£45.89
Academic Studies Press Piezoelectric Electromechanical Transducers for
Book SynopsisThe book presents a broad-scope analysis of piezoelectric electromechanical transducers and the related aspects of practical transducer design for underwater applications. It uses an energy method for analyzing transducer problems that provides the physical insight important for the understanding of electromechanical devices. Application of the method is first illustrated with transducer examples that can be modeled as systems with a single degree of freedom, (such as spheres, short cylinders, bars and flexural disks and plates made of piezoelectric ceramics). Thereupon, transducers are modeled as devices with multiple degrees of freedom. In all these cases, results of modeling are presented in the form of equivalent electromechanical circuits convenient for the calculation of the transducers’ operational characteristics. Special focus is made on the effects of coupled vibrations in mechanical systems on transducer performance. The book also provides extensive coverage of acoustic radiation including acoustic interaction between the transducers. The book is inherently multidisciplinary. It provides essential background regarding the vibration of elastic passive and piezoelectric bodies, piezoelectricity, acoustic radiation, and transducer characterization. Scientists and engineers working in the field of electroacoustics and those involved in education in the field will find this material useful not only for underwater acoustics, but also for electromechanics, energy conversion and medical ultrasonics.
£96.29
Packt Publishing Limited ESP8266 Home Automation Projects
Book SynopsisUnleash the power of the ESP8266 and build a complete home automation system with it. About This Book • Harness the power of the ESP8266 Wi-Fi chip to build an effective Home Automation System • Learn about the various ESP8266 modules • Configuring the ESP8266 and making interesting home automation projects • A step-by-step guide on the ESP8266 chip and how to convert your home into a smart home. Who This Book Is For This book is targeted at people who want to build connected and inexpensive home automation projects using the ESP8266 Wi-Fi chip, and to completely automate their homes. A basic understanding of the board would be an added advantage What You Will Learn • Get, compile, install, and configure an MQTT server • Use the Wi-Fi connectivity feature to control appliances remotely • Control several home appliances using the ESP8266 Wi-Fi chip • Control and monitor your home from the cloud using ESP8266 modules • Stream real-time data from the ESP8266 to a server over WebSockets • Create an Android mobile application for your project In Detail The ESP8266 is a low-cost yet powerful Wi-Fi chip that is becoming more popular at an alarming rate, and people have adopted it to create interesting projects. With this book, you will learn to create and program home automation projects using the ESP8266 Wi-Fi chip. You will learn how to build a thermostat to measure and adjust the temperature accordingly and how to build a security system using the ESP8266. Furthermore, you will design a complete home automation system from sensor to your own cloud. You will touch base on data monitoring, controlling appliances, and security aspects. By the end of the book, you will understand how to completely control and monitor your home from the cloud and from a mobile application. You will be familiar with the capabilities of the ESP8266 and will have successfully designed a complete ready-to-sell home automated system. Style and approach A practical book that will cover independent home automation projects.
£26.59
Wiley-VCH Verlag GmbH Van der Waals Heterostructures: Fabrications,
Book SynopsisVan der Waals Heterostructures A comprehensive resource systematically detailing the developments and applications of van der Waals heterostructures and devices Van der Waals Heterostructures is essential reading to understand the developments made in van der Waals heterostructures and devices in all aspects, from basic synthesis to physical analysis and heterostructures assembling to devices applications, including demonstrated applications of van der Waals heterostructure on electronics, optoelectronics, and energy conversion, such as solar energy, hydrogen energy, batteries, catalysts, biotechnology, and more. This book starts from an in-depth introduction of van der Waals interactions in layered materials and the forming of mixed-dimensional heterostructures via van der Waals force. It then comprehensively summarizes the synthetic methods, devices building processes and physical mechanism of 2D van der Waals heterostructures, and devices including 2D-2D electronics, 2D-2D optoelectronics, and mixed dimensional van der Waals heterostructures. In Van der Waals Heterostructures, readers can expect to find specific information on: The current library of 2D semiconductors and the current synthesis and performances of 2D semiconductors Controllable synthesis and assemble van der Waals heterostructures, physics of the van der Waals interface, and multi-field coupling effects 2D-2D electronics, 2D-2D optoelectronics, mixed dimensional van der Waals heterostructures, and van der Waals heterostructure applications on energy conversion Insight into future perspectives of the van der Waals heterostructures and devices with the detailed effective role of 2D materials for integrated electrical and electronic equipment Table of Contents1 Introduction 2 The library of 2D semiconductors 3 Synthesis and performances of 2D semiconductors 4 The controllable synthesis and assemble van der waals heterostructures 5 The Physics of van der Waals interface 6 The multi-field coupling effects 7 2D-2D electronics 8 2D-2D optoelectronics 9 Mixed dimensional Van der Waals heterostructures 10 Van der waals heterostructure application on energy conversion 11 Perspective and outlook
£100.00
River Publishers Neuromorphic Circuits for Nanoscale Devices
Book SynopsisNanoscale devices attracted significant research effort from the industry and academia due to their operation principals being based on different physical properties which provide advantages in the design of certain classes of circuits over conventional CMOS transistors. Neuromorphic Circuits for Nanoscale Devices contains recent research papers presented in various international conferences and journals to provide insight into how the operational principles of the nanoscale devices can be utilized for the design of neuromorphic circuits for various applications of non-volatile memory, neural network training/learning, and image processing. The topics discussed in the book include:Nanoscale Crossbar Memory DesignQ-Learning and Value Iteration using Nanoscale DevicesImage Processing and Computer Vision Applications for Nanoscale DevicesNanoscale Devices based Cellular Nonlinear/Neural NetworksTrade Review"This should be a very appealing book: the authors are very good, and the topics are very current." -Dinesh Kant Kumar, RMIT, Melbourne, Australia -- Dinesh Kant KumarTable of ContentsNeuromorphic Circuits for Nanoscale Devices
£80.74
Pan Stanford Publishing Pte Ltd Nanophononics: Thermal Generation, Transport, and
Book SynopsisHeat in most semiconductor materials, including the traditional group IV elements (Si, Ge, diamond), III–V compounds (GaAs, wide-bandgap GaN), and carbon allotropes (graphene, CNTs), as well as emerging new materials like transition metal dichalcogenides (TMDCs), is stored and transported by lattice vibrations (phonons). Phonon generation through interactions with electrons (in nanoelectronics, power, and nonequilibrium devices) and light (optoelectronics) is the central mechanism of heat dissipation in nanoelectronics. This book focuses on the area of thermal effects in nanostructures, including the generation, transport, and conversion of heat at the nanoscale level. Phonon transport, including thermal conductivity in nanostructured materials, as well as numerical simulation methods, such as phonon Monte Carlo, Green’s functions, and first principles methods, feature prominently in the book, which comprises four main themes: (i) phonon generation/heat dissipation, (i) nanoscale phonon transport, (iii) applications/devices (including thermoelectrics), and (iv) emerging materials (graphene/2D). The book also covers recent advances in nanophononics—the study of phonons at the nanoscale. Applications of nanophononics focus on thermoelectric (TE) and tandem TE/photovoltaic energy conversion. The applications are augmented by a chapter on heat dissipation and self-heating in nanoelectronic devices. The book concludes with a chapter on thermal transport in nanoscale graphene ribbons, covering recent advances in phonon transport in 2D materials.The book will be an excellent reference for researchers and graduate students of nanoelectronics, device engineering, nanoscale heat transfer, and thermoelectric energy conversion. The book could also be a basis for a graduate special topics course in the field of nanoscale heat and energy.Table of ContentsModeling Self-Heating Effects in Nanoscale Devices. Phonon Monte Carlo: Generating Random Variates for Thermal Transport Simulation. Hybrid Photovoltaic-Thermoelectric Solar Cells: State of the Art and Challenges. Phonon Transport Effects in Ultranarrow, Edge-Roughened Graphene Nanoribbons.
£87.39
The University of Chicago Press Tunnel Visions
Book Synopsis
£33.41
John Wiley & Sons Inc Wafer Manufacturing
Book SynopsisPresenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques.Table of ContentsPreface xi Acknowledgement xiii Part I From Crystal to Prime Wafers 1 1 Wafers and Semiconductors 3 1.1 Introduction 3 1.2 Semiconductor Revolution 3 1.2.1 Classification of Materials 3 1.2.2 Semiconductor Revolution Today 5 1.2.3 SiliconWafers and Solar Cells 6 1.3 SiliconWafers Used in Device Manufacturing (IC and MEMS) 7 1.3.1 StandardWafer Diameters and Sizes 8 1.3.2 Crystalline Orientation of SiliconWafers 9 1.3.3 Moore’s Law 11 1.4 Surface Properties and Quality Measurements ofWafers 11 1.4.1 SurfaceWaviness: TTV, Bow, andWarp 11 1.4.2 Discussion onWarp 16 1.4.3 Automated Measurements of TTV,Warp, Bow, and Flatness 17 1.4.4 Wafer Flatness 17 1.4.5 Nanotopography or Nanotopology 21 1.4.6 Surface Roughness 22 1.5 Other Properties and Quality Requirements of SiliconWafers 27 1.5.1 Mechanical and Material Properties 27 1.5.2 Property of Silicon with Anisotropy 27 1.5.3 Gravity-induced Deflection ofWafers 30 1.5.4 Wafer Edge Properties 31 1.6 Economics ofWafer Manufacturing 32 1.6.1 Three Categories ofWafers 32 1.6.2 Cost of SiliconWafers 34 1.7 Summary 35 References 35 2 Wafer Manufacturing: Generalized Processes and Flow 39 2.1 Introduction 39 2.2 Wafer Manufacturing: Generalized Process Flow 39 2.3 Crystal Growth 41 2.3.1 Melt Growth 41 2.3.2 Vapor Growth 49 2.3.3 Epitaxial Growth 49 2.3.4 Casting Polycrystalline Crystal 51 2.3.5 Other Crystal Growth Methods 51 2.4 Wafer Forming 52 2.4.1 Cropping 52 2.4.2 Trimming 52 2.4.3 Orientation Identification 52 2.4.4 Slicing 52 2.4.5 Slicing Using the Inner-diameter (ID) Saw 53 2.4.6 Slicing Using a Wiresaw 54 2.4.7 Other Tools for Slicing 55 2.4.8 Edge Rounding 56 2.5 Wafer Polishing 56 2.5.1 Lapping 57 2.5.2 Grinding 57 2.5.3 Etching 58 2.5.4 Polishing 58 2.6 Wafer Preparation 58 2.6.1 Cleaning 58 2.6.2 Inspection 59 2.6.3 Packaging 59 2.7 Industrial Processes ofWafer Manufacturing 59 2.7.1 Crystal Growth 60 2.7.2 Wafer Forming 61 2.7.3 Wafer Lapping and Polishing 63 2.7.4 Wafer Preparation 66 2.8 Summary 67 References 68 3 Process Modeling and Manufacturing Processes 71 3.1 Introduction 71 3.2 Wafer Manufacturing and Brittle Materials 71 3.3 Ductile Machining Versus Brittle Machining 73 3.4 Abrasive Machining inWafer Manufacturing 74 3.4.1 Bonded Abrasive Machining (BAM) 75 3.4.2 Free Abrasive Machining (FAM) 75 3.5 Abrasive Materials 76 3.5.1 Classification of the Grain Size of Abrasive Materials 77 3.5.2 Hardness of Abrasive Materials 78 3.5.3 Commonly Used Abrasive Materials inWafer Manufacturing 81 3.6 Ductile Machining of Brittle Materials 82 3.6.1 Research on Ductile Machining and Challenges 83 3.6.2 Opportunity and Future Research 83 3.7 Process Modeling ofWafer Manufacturing Processes 84 3.7.1 Rolling-indenting and Scratching-indenting Process Models of FAM 84 3.7.2 Comparison Between Wiresawing and Lapping 87 3.7.3 Other Aspects of Engineering Modeling 88 3.8 Abrasive Slurry in FAM Processes 89 3.8.1 Composition of Abrasive Slurry 89 3.8.2 Comparison ofWater and Glycol as a Carrier Fluid for Slurry 90 3.8.3 Recycling of Abrasive Grits in Slurry 91 3.9 Summary 93 References 93 Part II Wafer Forming 97 4 Wafer Slicing Using a Modern Slurry Wiresaw and Other Saws 99 4.1 Introduction 99 4.2 The Modern Wiresaw Technology 100 4.2.1 Historical Perspectives of Saws UsingWire 100 4.2.2 The Rise of the PV Industry andWafer Slicing 102 4.3 The Three Categories of Saw forWafer Slicing 103 4.4 Inner-diameter (ID) Saw 103 4.5 The Modern Slurry Wiresaw 105 4.5.1 The Control and Program Console 106 4.5.2 The Wire Management Unit 106 4.5.3 Uni-directional Versus Bi-directional Wire Motion 110 4.5.4 The Slicing Compartment 113 4.5.5 Directions of Ingot Feeding 114 4.5.6 Consumables and Other Operations 116 4.6 Comparison Between the ID Saw and Wiresaw 116 4.7 Research Issues inWiresaw Manufacturing Processes 120 4.8 Summary 121 References 121 5 Modeling of the Wiresaw Manufacturing Process and Material Characteristics 127 5.1 Introduction 127 5.2 The Rolling-indenting Model 129 5.3 Vibration Modeling and Analysis 131 5.3.1 A Historical Perspective on the Vibration ofWire 132 5.3.2 Equation of Motion of a Moving Wire 133 5.3.3 Modal Analysis of an Undamped Moving Wire 134 5.3.4 Response for Point-wise Harmonic Excitation 134 5.3.5 Natural Frequency of Vibration and Stability 135 5.3.6 Numerical Solution Using Galerkin’s Method 138 5.3.7 Response of Multiple-point and Distributed Excitations 139 5.3.8 Frequency Response of Multiple Excitations 141 5.3.9 Vibration Responses of a Moving Wire with Damping 143 5.3.10 Discussions 144 5.4 Damping Factor of the Slurry Wiresaw Systems 145 5.5 Elasto-hydrodynamic Process Modeling 147 5.5.1 Approach of Modeling of EHD in the Wiresawing Process 148 5.5.2 Theoretical Modeling 149 5.5.3 Results of the EHD Analysis 150 5.5.4 Implications Related to Floating Machining and Rolling-indenting Modeling of Modern Slurry Wiresaws 152 5.5.5 Important Conclusions from EHD Modeling 155 5.6 Thermal Management 156 5.7 Wire, WireWeb, and Slurry Management 156 5.7.1 Real-time and On-line Monitoring of WireWear 157 5.7.2 Monitoring the Pitch of the WireWeb Spacing 160 5.7.3 Mixing Ratio of Slurry Consisting of Abrasive Grits and Carrier Fluid 162 5.8 Summary 162 References 163 6 Diamond-Impregnated Wire Saws and the Sawing Process 169 6.1 Introduction 169 6.2 Manufacturing Processes of Diamond-impregnated Wires 171 6.2.1 Resinoid Wires 172 6.2.2 Electroplated Wires 174 6.2.3 Machines and Operations of Diamond Wire Saws 175 6.3 Slicing Mechanism of a Diamond Wire Saw 177 6.4 Properties ofWafers Sliced by Diamond Wire Saws 180 6.4.1 Wafer Surface 180 6.4.2 Wafer Fracture Strength 181 6.4.3 Residual Stress and Stress Relaxation 182 6.4.4 PVWafer Efficiency 182 6.4.5 Cost ofWafering 182 6.5 Slicing Performance with Different Process Parameters 183 6.5.1 Effect of Wire Speed 183 6.5.2 Effect of Feed Rate 183 6.5.3 Effect of Grain Density 184 6.5.4 Effect of Wire Tension 184 6.6 Summary 184 References 185 Part III Wafer Surface Preparation and Management 189 7 Lapping 191 7.1 Introduction 191 7.2 Fundamentals of Lapping and FAM 192 7.3 Various Configurations and Types of Lapping Operation 195 7.3.1 Single-sided Lapping 200 7.3.2 Double-sided Lapping 201 7.3.3 Soft-pad Lapping 201 7.3.4 Further References 202 7.4 Lapping and Preliminary Planarization 202 7.4.1 Quality Driven Needs for Preliminary Planarization 202 7.4.2 Cost Driven Needs for Preliminary Planarization 203 7.5 Technical Challenges and Advances in Lapping 204 7.5.1 Technical Considerations 205 7.5.2 Advances in Lapping 206 7.6 Summary 206 References 207 8 Chemical Mechanical Polishing 209 8.1 Introduction 209 8.2 Chemical Mechanical Polishing (CMP) 210 8.2.1 Schematic Illustration of the CMP Process and System 210 8.2.2 Measurement and Evaluation of the SiliconWafer after Polishing 213 8.2.3 Specifications for Polished SiliconWafers 214 8.2.4 Types of CMP Processes 215 8.2.5 Challenges of CMP Technology 215 8.3 Polishing Pad Technology 215 8.3.1 Polishing Pad Conditioning 216 8.4 Polishing Slurry Technology 217 8.5 Edge Polishing 218 8.5.1 Fundamentals of Edge Polishing 218 8.5.2 Challenges of Edge Polishing 218 8.6 Summary 219 References 219 9 Grinding, Edge Grinding, Etching, and Surface Cleaning 223 9.1 Introduction 223 9.2 Wafer Grinding for Surface Processing 223 9.2.1 Wafer Grinding Methods 223 9.2.2 Grinding Wheel Technology 226 9.2.3 Types of Grinding Operations 227 9.2.4 Technical Challenges and Advances in Grinding 228 9.3 Edge Grinding 228 9.3.1 Fundamentals of Edge Grinding 229 9.3.2 Technical Challenges in Edge Grinding 231 9.4 Etching 231 9.4.1 Acid Etching 232 9.4.2 Caustic Etching 232 9.4.3 Preferential Etching 232 9.4.4 Technical Challenges and Advances in Etching 235 9.5 Surface Cleaning 236 9.5.1 Impurities on the Surface of a SiliconWafer 236 9.5.2 Various Cleaning Steps inWafer Process Flow 237 9.6 RCA Standard Clean 238 9.6.1 Introduction 238 9.6.2 RCA Cleaning Protocol 239 9.6.3 Techniques and Variations of the RCA Method 240 9.6.4 The Evolution of SiliconWafer Cleaning Technology 241 9.7 Summary 241 References 242 10 Wafer Metrology and Optical Techniques 247 10.1 Introduction 247 10.2 Evaluation and Inspection of theWafer Surface 247 10.2.1 Wafer Surface Specifications 247 10.3 Wafer Defects and Inspection 251 10.3.1 Defect Classification 251 10.3.2 Impact ofWafer Defects on Device Yield and Performance 253 10.3.3 Defect Inspection Techniques and Systems 254 10.4 Measurement of theWafer Surface Using Moiré Optical Metrology 256 10.4.1 Measurement of theWafer Surface Using Shadow Moiré with the Talbot Effect 257 10.4.2 Enhancing the Resolution of Shadow Moiré with “Phase Shifting” 262 10.4.3 WireWeb Management Using Optical Metrology Technology 273 10.5 Summary 274 References 274 11 Conclusion 279 11.1 (I) From Crystal to PrimeWafers 279 11.2 (II) Wafer Forming 280 11.3 (III) Wafer Surface Preparation and Management 281 11.4 Final Remarks 282 Index 283
£94.46
John Wiley & Sons Inc Continuous Monitoring for Hazardous Material
Book SynopsisOffers technical background and guidance to prepare any workplace for gas-leak catastrophes Determines when monitoring for catastrophic release is appropriate Breaks down gas monitoring equipment options Guides work safety professionals on the placement of monitoring equipment. Offers case studies for concrete analysis. .Table of Contents1. Introduction. 1.1 Purpose. 1.2 Scope. 1.3 Who Will Benefit from this Guideline? 2. Management. 2.1 Management Overview. 2.2 Why Do We Use Gas Detectors? 2.3 What Do We Want to Detect? 2.4 What Actions Do We Expect to Undertake in the Event of a Release? 2.5 How Much Should We Spend on Detection? 3. Determining Where Gas Detection May or May Not be Beneficial. 3.1 Assessing Where Gas Detection may be Beneficial. 3.2 Situations Where Other Technologies May be More Beneficial. 3.3 Situations Where Gas Detection Is Recommended by Consensus. or Mandated By Law. 3.4 Situations Where Toxic Gas Detection May be Beneficial. 3.5 Situations Where Combustible Detection May be Beneficial. 3.6 Example Applications of the Continuous Monitoring System. 3.7 References. 3.8 Glossary. 4. Sensor Technology. 4.1 Introduction. 4.2 Description of Gases and Vapors. 4.3 Available Sensors and How they Work. 4.4 Factors to Consider when Choosing a Sensor. 4.5 Sensor Performance Variables. 4.6 References. 4.7 Glossary. 5. Approaches to Detector Placement and Configuration. 5.1 General Guidance for Detector Placement and Configuration. 5.2 General Guidance for Toxic Gas Detection. 5.3 General Guidance for Flammable Detection. 5.4 Detector Placement for Source Monitoring. 5.5 Detector Placement for Volumetric Monitoring. 5.6 Detector Placement for Enclosure Monitoring. 5.7 Detector Placement for Path of Travel and Target Receptor Monitoring. 5.8 Detector Placement for Perimeter Monitoring. 5.9 Detector Set Points and Monitoring. 6. Overall System Management - Commissioning, Testing, and Maintenance. 6.1 Summary. 6.2 Training. 6.3 Documentation. 6.4 Maintenance. 6.5 Establish a Good Relationship with the Local Authority-Having Jurisdiction (AHJ. 6.6 Change Management.
£75.56
John Wiley & Sons Inc High Efficiency RF and Microwave Solid State
Book SynopsisDo you want to know how to design high efficiency RF and microwave solid state power amplifiers? Read this book to learn the main concepts that are fundamental for optimum amplifier design. Practical design techniques are set out, stating the pros and cons for each method presented in this text. In addition to novel theoretical discussion and workable guidelines, you will find helpful running examples and case studies that demonstrate the key issues involved in power amplifier (PA) design flow. Highlights include: Clarification of topics which are often misunderstood and misused, such as bias classes and PA nomenclatures. The consideration of both hybrid and monolithic microwave integrated circuits (MMICs). Discussions of switch-mode and current-mode PA design approaches and an explanation of the differences. Coverage of the linearity issue in PA design at circuit level, with advice on low distortion power stages. Analysis of Table of ContentsPreface. About the Authors. Acknowledgments. 1 Power Amplifier Fundamentals. 1.1 Introduction. 1.2 Definition of Power Amplifier Parameters. 1.3 Distortion Parameters. 1.4 Power Match Condition. 1.5 Class of Operation. 1.6 Overview of Semiconductors for PAs. 1.7 Devices for PA. 1.8 Appendix: Demonstration of Useful Relationships. 1.9 References. 2 Power Amplifier Design. 2.1 Introduction. 2.2 Design Flow. 2.3 Simplified Approaches. 2.4 The Tuned Load Amplifier. 2.5 Sample Design of a Tuned Load PA. 2.6 References. 3 Nonlinear Analysis for Power Amplifiers. 3.1 Introduction. 3.2 Linear vs. Nonlinear Circuits. 3.3 Time Domain Integration. 3.4 Example. 3.5 Solution by Series Expansion. 3.6 The Volterra Series. 3.7 The Fourier Series. 3.8 The Harmonic Balance. 3.9 Envelope Analysis. 3.10 Spectral Balance. 3.11 Large Signal Stability Issue. 3.12 References. 4 Load Pull. 4.1 Introduction. 4.2 Passive Source/Load Pull Measurement Systems. 4.3 Active Source/Load Pull Measurement Systems. 4.4 Measurement Test-sets. 4.5 Advanced Load Pull Measurements. 4.6 Source/Load Pull Characterization. 4.7 Determination of Optimum Load Condition. 4.8 Appendix: Construction of Simplified Load Pull Contours through Linear Simulations. 4.9 References. 5 High Efficiency PA Design Theory. 5.1 Introduction. 5.2 Power Balance in a PA. 5.3 Ideal Approaches. 5.4 High Frequency Harmonic Tuning Approaches. 5.5 High Frequency Third Harmonic Tuned (Class F). 5.6 High Frequency Second Harmonic Tuned. 5.7 High Frequency Second and Third Harmonic Tuned. 5.8 Design by Harmonic Tuning. 5.9 Final Remarks. 5.10 References. 6 Switched Amplifiers. 6.1 Introduction. 6.2 The Ideal Class E Amplifier. 6.3 Class E Behavioural Analysis. 6.4 Low Frequency Class E Amplifier Design. 6.5 Class E Amplifier Design with 50% Duty-cycle. 6.6 Examples of High Frequency Class E Amplifiers. 6.7 Class E vs. Harmonic Tuned. 6.8 Class E Final Remarks. 6.9 Appendix: Demonstration of Useful Relationships. 6.10 References. 7 High Frequency Class F Power Amplifiers. 7.1 Introduction. 7.2 Class F Description Based on Voltage Wave-shaping. 7.3 High Frequency Class F Amplifiers. 7.4 Bias Level Selection. 7.5 Class F Output Matching Network Design. 7.6 Class F Design Examples. 7.7 References. 8 High Frequency Harmonic Tuned Power Amplifiers. 8.1 Introduction. 8.2 Theory of Harmonic Tuned PA Design. 8.3 Input Device Nonlinear Phenomena: Theoretical Analysis. 8.4 Input Device Nonlinear Phenomena: Experimental Results. 8.5 Output Device Nonlinear Phenomena. 8.6 Design of a Second HT Power Amplifier. 8.7 Design of a Second and Third HT Power Amplifier. 8.8 Example of 2nd HT GaN PA. 8.9 Final Remarks. 8.10 References. 9 High Linearity in Efficient Power Amplifiers. 9.1 Introduction. 9.2 Systems Classification. 9.3 Linearity Issue. 9.4 Bias Point Influence on IMD. 9.5 Harmonic Loading Effects on IMD. 9.6 Appendix: Volterra Analysis Example. 9.7 References. 10 Power Combining. 10.1 Introduction. 10.2 Device Scaling Properties. 10.3 Power Budget. 10.4 Power Combiner Classification. 10.5 The T-junction Power Divider. 10.6 Wilkinson Combiner. 10.7 The Quadrature (90◦) Hybrid. 10.8 The 180◦ Hybrid (Ring Coupler or Rat-race). 10.9 Bus-bar Combiner. 10.10 Other Planar Combiners. 10.11 Corporate Combiners. 10.12 Resonating Planar Combiners. 10.13 Graceful Degradation. 10.14 Matching Properties of Combined PAs. 10.15 Unbalance Issue in Hybrid Combiners. 10.16 Appendix: Basic Properties of Three-port Networks. 10.17 References. 11 The Doherty Power Amplifier. 11.1 Introduction. 11.2 Doherty’s Idea. 11.3 The Classical Doherty Configuration. 11.4 The ‘AB-C’ Doherty Amplifier Analysis. 11.5 Power Splitter Sizing. 11.6 Evaluation of the Gain in a Doherty Amplifier. 11.7 Design Example. 11.8 Advanced Solutions. 11.9 References. Index.
£111.56
John Wiley & Sons Inc ESD Basics
Book SynopsisElectrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-Trade Review"With 146 figures including colour blood films and haematology slides, the book provides a pleasant state-of-the-art introduc-tion to clinical haematology. There is a self-assess- ment section at the end." (Journal of Tropical Pediatrics, 1 April 2011) Table of ContentsAbout the Author xiii Preface xv Acknowledgments xvii 1 Fundamentals of Electrostatics 1 1.1 Introduction 1 1.2 Electrostatics 1 1.2.1 Thales of Miletus and Electrostatic Attraction 2 1.2.2 Electrostatics and the Triboelectric Series 3 1.2.3 Triboelectric Series and Gilbert 4 1.2.4 Triboelectric Series and Gray 4 1.2.5 Triboelectric Series and Dufay 4 1.2.6 Triboelectric Series and Franklin 5 1.2.7 Electrostatics – Symmer and the Human Body Model 5 1.2.8 Electrostatics – Coulomb and Cavendish 5 1.2.9 Electrostatics – Faraday and the Ice Pail Experiment 5 1.2.10 Electrostatics – Faraday and Maxwell 6 1.2.11 Electrostatics – Paschen 6 1.2.12 Electrostatics – Stoney and the “Electron” 6 1.3 Triboelectric Charging – How does it Happen? 7 1.4 Conductors, Semiconductors, and Insulators 8 1.5 Static Dissipative Materials 8 1.6 ESD and Materials 9 1.7 Electrification and Coulomb’s Law 9 1.7.1 Electrification by Friction 10 1.7.2 Electrification by Induction 10 1.7.3 Electrification by Conduction 10 1.8 Electromagnetism and Electrodynamics 11 1.9 Electrical Breakdown 11 1.9.1 Electrostatic Discharge and Breakdown 11 1.9.2 Breakdown and Paschen’s Law 12 1.9.3 Breakdown and Townsend 12 1.9.4 Breakdown and Toepler’s Law 13 1.9.5 Avalanche Breakdown 13 1.10 Electroquasistatics and Magnetoquasistatics 15 1.11 Electrodynamics and Maxwell’s Equations 16 1.12 Electrostatic Discharge (ESD) 16 1.13 Electromagnetic Compatibility (EMC) 16 1.14 Electromagnetic Interference (EMI) 16 1.15 Summary and Closing Comments 17 References 17 2 Fundamentals of Manufacturing and Electrostatics 21 2.1 Materials, Tooling, Human Factors, and Electrostatic Discharge 22 2.1.1 Materials and Human Induced Electric Fields 23 2.2 Manufacturing Environment and Tooling 23 2.3 Manufacturing Equipment and ESD Manufacturing Problems 23 2.4 Manufacturing Materials 24 2.5 Measurement and Test Equipment 24 2.5.1 Manufacturing Testing for Compliance 25 2.6 Grounding and Bonding Systems 27 2.7 Worksurfaces 27 2.8 Wrist Straps 28 2.9 Constant Monitors 28 2.10 Footwear 28 2.11 Floors 28 2.12 Personnel Grounding with Garments 29 2.12.1 Garments 29 2.13 Air Ionization 29 2.14 Seating 29 2.15 Carts 30 2.16 Packaging and Shipping 31 2.16.1 Shipping Tubes 31 2.16.2 Trays 32 2.17 ESD Identification 32 2.18 ESD Program Management – Twelve Steps to Building an ESD Strategy 32 2.19 ESD Program Auditing 33 2.20 ESD On-Chip Protection 33 2.21 Summary and Closing Comments 34 References 34 3 ESD, EOS, EMI, EMC and Latchup 39 3.1 ESD, EOS, EMI, EMC and Latchup 39 3.1.1 ESD 39 3.1.2 EOS 40 3.1.3 EMI 40 3.1.4 EMC 41 3.1.5 Latchup 41 3.2 ESD Models 41 3.2.1 Human Body Model (HBM) 41 3.2.2 Machine Model (MM) 43 3.2.3 Cassette Model 45 3.2.4 Charged Device Model (CDM) 46 3.2.5 Transmission Line Pulse (TLP) 46 3.2.6 Very Fast Transmission Line Pulse (VF-TLP) 50 3.3 Electrical Overstress (EOS) 50 3.3.1 EOS Sources – Lightning 51 3.3.2 EOS Sources – Electromagnetic Pulse (EMP) 52 3.3.3 EOS Sources – Machinery 52 3.3.4 EOS Sources – Power Distribution 52 3.3.5 EOS Sources – Switches, Relays and Coils 53 3.3.6 EOS Design Flow and Product Definition 53 3.3.7 EOS Sources – Design Issues 54 3.3.8 EOS Failure Mechanisms 55 3.4 EMI 57 3.5 EMC 57 3.6 Latchup 58 3.7 Summary and Closing Comments 59 References 59 4 System Level ESD 65 4.1 System Level Testing 65 4.1.1 System Level Testing Objectives 66 4.1.2 Distinction of System and Component Level Testing Failure Criteria 66 4.2 When Systems and Chips Interact 67 4.3 ESD and System Level Failures 68 4.3.1 ESD Current and System Level Failures 68 4.3.2 ESD Induced E- and H-Fields and System Level Failures 69 4.4 Electronic Systems 70 4.4.1 Cards and Boards 70 4.4.2 System Chassis and Shielding 71 4.5 System Level Problems Today 71 4.5.1 Hand Held Systems 71 4.5.2 Cell Phones 71 4.5.3 Servers and Cables 72 4.5.4 Laptops and Cables 74 4.5.5 Disk Drives 74 4.5.6 Digital Cameras 75 4.6 Automobiles, ESD, EOS, and EMI 77 4.6.1 Automobiles and ESD – Ignition Systems 77 4.6.2 Automobiles and EMI – Electronic Pedal Assemblies 77 4.6.3 Automobiles and Gas Tank Fires 78 4.6.4 Hybrids and Electric Cars 78 4.6.5 Automobiles in the Future 79 4.7 Aerospace Applications 80 4.7.1 Airplanes, Partial Discharge, and Lightning 80 4.7.2 Satellites, Spacecraft Charging, and Single Event Upset (SEU) 81 4.7.3 Space Landing Missions 81 4.8 ESD and System Level Test Models 83 4.9 IEC 61000-4-2 83 4.10 Human Metal Model (HMM) 83 4.11 Charged Board Model (CBM) 86 4.12 Cable Discharge Event (CDE) 87 4.12.1 Cable Discharge Event (CDE) and Scaling 89 4.12.2 Cable Discharge Event (CDE) – Cable Measurement Equipment 89 4.12.3 Cable Configuration – Test Configuration 92 4.12.4 Cable Configuration – Floating Cable 92 4.12.5 Cable Configuration – Held Cable 92 4.12.6 Cable Discharge Event (CDE) – Peak Current vs. Charged Voltage 92 4.12.7 Cable Discharge Event (CDE) – Plateau Current vs Charged Voltage 92 4.13 Summary and Closing Comments 93 References 93 5 Component Level Issues – Problems and Solutions 97 5.1 ESD Chip Protection – The Problem and the Cure 97 5.2 ESD Chip Level Design Solutions – Basics of Design Synthesis 98 5.2.1 ESD Circuits 101 5.2.2 ESD Signal Pin Protection Networks 101 5.2.3 ESD Power Clamp Protection Networks 103 5.2.4 ESD Power Domain-to-Domain Circuitry 103 5.2.5 ESD Internal Signal Line Domain-to-Domain Protection Circuitry 104 5.3 ESD Chip Floor Planning – Basics of Design Layout and Synthesis 105 5.3.1 Placement of ESD Signal Pin HBM Circuitry 106 5.3.2 Placement of ESD Signal Pin CDM Circuitry 107 5.3.3 Placement of ESD Power Clamp Circuitry 107 5.3.4 Placement of ESD VSS-to-VSS Circuitry 109 5.4 ESD Analog Circuit Design 109 5.4.1 Symmetry and Common Centroid Design for ESD Analog Circuits 110 5.4.2 Analog Signal Pin to Power Rail ESD Network 111 5.4.3 Common Centroid Analog Signal Pin to Power Rail ESD Network 111 5.4.4 Co-synthesis of Common Centroid Analog Circuit and ESD Networks 112 5.4.5 Signal Pin-to-Signal Pin Differential Pair ESD Network 113 5.4.6 Common Centroid Signal Pin Differential Pair ESD Protection 113 5.5 ESD Radio Frequency (RF) Design 115 5.5.1 ESD Radio Frequency (RF) Design Practices 115 5.5.2 ESD RF Circuits – Signal Pin ESD Networks 121 5.5.3 ESD RF Circuits – ESD Power Clamps 123 5.5.4 ESD RF Circuits – ESD RF VSS-to-VSS Networks 126 5.6 Summary and Closing Comments 127 References 127 6 ESD in Systems – Problems and Solutions 129 6.1 ESD System Solutions from Largest to Smallest 129 6.2 Aerospace Solutions 129 6.3 Oil Tanker Solutions 130 6.4 Automobile Solutions 130 6.5 Computers – Servers 131 6.5.1 Servers – Touch Pads and Handling Procedures 131 6.6 Mother Boards and Cards 131 6.6.1 System Card Insertion Contacts 131 6.6.2 System Level Board Design – Ground Design 131 6.7 System Level “On Board” ESD Protection 133 6.7.1 Spark Gaps 134 6.7.2 Field Emission Devices (FED) 136 6.8 System Level Transient Solutions 140 6.8.1 Transient Voltage Suppression (TVS) Devices 141 6.8.2 Polymer Voltage Suppression (PVS) Devices 143 6.9 Package-Level Mechanical ESD Solutions – Mechanical “Crowbars” 144 6.10 Disk Drive ESD Solutions 145 6.10.1 In Line “ESD Shunt” 145 6.10.2 Armature – Mechanical “Shunt” – A Built-In Electrical “Crowbar” 145 6.11 Semiconductor Chip Level Solutions – Floor Planning, Layout, and Architecture 147 6.11.1 Mixed Signal Analog and Digital Floor Planning 147 6.11.2 Bipolar-CMOS-DMOS (BCD) Floor Planning 148 6.11.3 System-on Chip Design Floor Planning 148 6.12 Semiconductor Chip Solutions – Electrical Power Grid Design 149 6.12.1 HMM and IEC Specification Power Grid and Interconnect Design Considerations 150 6.12.2 ESD Power Clamp Design Synthesis – IEC 61000-4-2 Responsive ESD Power Clamps 151 6.13 ESD and EMC – When Chips Bring Down Systems 152 6.14 System Level and Component Level ESD Testing and System Level Response 152 6.14.1 Time Domain Reflection (TDR) and Impedance Methodology for ESD Testing 152 6.14.2 Time Domain Reflectometry (TDR) ESD Test System Evaluation 154 6.14.3 ESD Degradation System Level Method – Eye Tests 158 6.15 EMC and ESD Scanning 160 6.16 Summary and Closing Comments 163 References 164 7 Electrostatic Discharge (ESD) in the Future 167 7.1 What is in the Future for ESD? 167 7.2 Factories and Manufacturing 167 7.3 Photo-Masks and Reticles 168 7.3.1 ESD Concerns in Photo-Masks 169 7.3.2 Avalanche Breakdown in Photo-Masks 170 7.3.3 Electrical Model in Photo-Masks 171 7.3.4 Failure Defects in Photo-Masks 172 7.4 Magnetic Recording Technology 174 7.5 Micro-Electromechanical (MEM) Devices 176 7.5.1 ESD Concerns in Micro-Electromechanical (MEM) Devices 177 7.6 Micro-Motors 178 7.6.1 ESD Concerns in Micro-Motors 178 7.7 Micro-Electromechanical (MEM) RF Switches 180 7.7.1 ESD Concerns in Micro-Electromechanical (MEM) RF Switches 180 7.8 Micro-Electromechanical (MEM) Mirrors 182 7.8.1 ESD Concerns in Micro-Electromechanical (MEM) Mirrors 182 7.9 Transistors 183 7.9.1 Transistors – Bulk vs. SOI Technology 184 7.9.2 Transistors and FinFETs 185 7.9.3 ESD in FinFETs 185 7.10 Silicon Nanowires 187 7.11 Carbon Nanotubes 187 7.12 Future Systems and System Designs 188 7.13 Summary and Closing Comments 189 References 190 Glossary 195 ESD Standards 199 Index 203
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John Wiley & Sons Inc Design and Analysis of Heat Sinks
Book SynopsisThis book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices.Table of ContentsLinear Transformations. Elements of the Linear Transformations. Singular Fins and Spines and Single Elements. Algorithms for Finned Array Assembly. Examples of Finned Array Analysis. Reciprocity and Node Analysis. A General Array Method. Convective Optimizations. Heat Transfer-Parallel Plate Heat Sinks. References. Appendices. Indexes.
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John Wiley & Sons Inc Introduction to Electronic Devices
Book SynopsisThis book gives readers enough knowledge of the required principles so they can adapt the knowledge to new materials and types of devices.Table of ContentsBasics of Quantum Mechanics. Basics of Solid State Physics. Electrons and Holes in Semiconductors. Diodes and Contacts. Bipolar Junction Transistors. MOSFETs. Compound Semiconductor FETs and Thin Film Transistors (TFTs). Photonic Devices. Device Fabrication and Novel Devices. Appendices. Glossary. Index.
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Wiley Liquid Cooling of Electronic Devices by
Book SynopsisChanneling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems.Table of ContentsFundamentals of Heat Transfer and Fluid Flow. Natural Convection. Channel Flows. Jet Impingement Cooling. Heat Transfer Enhancement. Appendices. References. Indexes.
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John Wiley & Sons Inc Fundamentals of Semiconductor Fabrication
Book SynopsisFrom crystal growth to integrated devices and circuits, this new book offers a basic, up-to-date introduction to semiconductor fabrication technology, including both the theoretical and practical aspects of all major steps in the fabrication sequence.Table of ContentsChapter 1. Introduction. Chapter 2. Crystal Growth. Chapter 3. Silicon Oxidation. Chapter 4. Photolithography. Chapter 5. Etching. Chapter 6. Diffusion. Chapter 7. Ion Implantation. Chapter 8. Film Deposition. Chapter 9. Process Integration. Chapter 10. IC Manufacturing. Chapter 11. Future Trends and Challenges. Appendix A: List of Symbols. Appendix B: International System of Units (SI Units). Appendix C: Unit Prefixes. Appendix D: Greek Alphabet. Appendix E: Physical Constants. Appendix F: Properties of Si and GaAs at 300 K. Appendix G: Some Properties of the Error Function. Appendix H: Basic Kinetic Theory of Gases. Appendix I: SUPREM Commands. Appendix J: Running PROLITH. Appendix K. Percentage Points of the t Distribution. Appendix L: Percentage Points of the F Distribution. Index.
£143.45
John Wiley & Sons Inc Insulated Gate Bipolar Transistor Igbt Theory and
Book SynopsisA comprehensive and state-of-the-art coverage of the design and fabrication of IGBT. All-in-one resource Explains the fundamentals of MOS and bipolar physics. Covers IGBT operation, device and process design, power modules, and new IGBT structures. Table of ContentsPreface. Power Device Evolution and the Advert of IGBT. IGBT Fundamentals and Status Review. MOS Components of IGBT. Bipolar Components of IGBT. Physics and Modeling of IGBT. Latch-Up of Parasitic Thyristor in IGBT. Design Considerations of IGBT Unit Cell. IGBT Process Design and Fabrication Technology. Power IGBT Modules. Novel IGBT Design Concepts, Structural Innovations, and Emerging Technologies. IGBT Circuit Applications. Index.
£154.76
John Wiley & Sons Inc Fundamentals of IIIV Devices
Book SynopsisA systematic, accessible introduction to III-V semiconductor devices With this handy book, readers seeking to understand semiconductor devices based on III-V materials no longer have to wade through difficult review chapters focusing on a single, novel aspect of the technology. Well-known industry expert William Liu presents here a systematic, comprehensive treatment at an introductory level. Without assuming even a basic course in device physics, he covers the dc and high-frequency operations of all major III-V devices-heterojunction bipolar transistors (HBTs), metal-semiconductor field-effect transistors (MESFETs), and the heterojunction field-effect transistors (HFETs), which include the high electron mobility transistors (HEMTs). An excellent introduction for researchers and circuit designers working on wireless communications equipment, Fundamentals of III-V Devices offers a variety of features, including: * An introductory chapter on the basic properties, growth process, and Table of ContentsBasic Properties and Device Physics of III-V Materials. Two-Terminal Heterojunction Devices. HBT D.C. Characteristics. HBT High-Frequency Properties. FET D.C. Characteristics. FET High-Frequency Properties. Transistor Fabrication and Device Comparison. Appendices. Index.
£169.16
John Wiley & Sons Inc Electronic Properties of Engineering Materials
Book SynopsisJames Livingston has written a highly readable undergraduate text introducing the physics and chemistry underlying the electronic properties of engineering solids. The first half of the text uses a semi-classical approach, while the second half introduces quantum mechanics and applies quantum chemistry and quantum physics to the basic properties of metals, insulators, and semiconductors.Table of ContentsSEMI-CLASSICAL APPROACH. Conductors and Resistors. Windows, Doors, and Transparent Electrodes (Optical Properties of Conductors). Insulators and Capacitors. Lenses and Optical Fibers (Optical Properties of Insulators). Inductors, Electromagnets, and Permanent Magnets. Superconductors and Superconducting Magnets. Elasticity, Springs, and Sonic Waves. QUANTUM MECHANICAL APPROACH. Light Particles, Electron Waves, and Quantum Wells, and Springs. The Periodic Table, Atomic Spectra, and Neon Lights. The Game Is Bonds, Interatomic Bonds. From Bonds to Bands (and Why Grass Is Green). Free Electron Waves in Metals. Nearly-Free Electrons--Bands, Gaps, Holes, and Zones. Metals and Insulators. Semiconductors. LEDs, Photodetectors, Solar Cells, and Transistors. Suggestions for Further Reading. Index.
£230.36
John Wiley & Sons Inc Handbook of Chemicals and Gases for the
Book SynopsisThis book brings together the most useful and important data on chemicals and gases used in the manufacture of semiconductor devices. It offers an A-to-Z listing of physical properties and safety information for more than 270 chemicals and gases used in the manufacture of semiconductor chips.Table of ContentsThin Film Deposition Materials. Wafer Cleaning Chemicals. Photolithography Materials. Wet and Dry Etching Materials. Chemical Mechanical Planarizing Materials. Carrier Gases. Uncategorized Materials. Semiconductor Chemicals Analysis. Index.
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John Wiley & Sons Inc LowVoltage CMOS VLSI Circuits
Book SynopsisLow-voltage very large scale integration (VLSI) circuits representthe electronics of the future. All electronic products are strivingto reduce power consumption to create more economical, efficient,and compact devices. Despite the inevitable trend towardslow-voltage, few books address the technology needed. Geared to theneeds of engineers and designers in the field, this comprehensivevolume presents a remarkably detailed analysis of one of today''shottest and most compelling research techniques for VLSI systems. Table of ContentsCMOS Technology and Devices. CMOS Static Logic Circuits. CMOS Dynamic Logic Circuits. CMOS Memory. CMOS VLSI Systems. Index.
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John Wiley & Sons Inc Physics and Technology of Semiconductor Devices
Book SynopsisProvides a comprehensive treatment of semiconductor device physics and technology, with emphasis on modern planar silicon devices. Physical principles are explained by the use of simple physical models and illustrated by experimental measurements.Table of ContentsThe Planar Technology. Solid-State Technology. Vapor-Phase Growth. Thermal Oxidation. Solid-State Diffusion. Semiconductors and Semiconductor Devices. Elements of Semiconductor Physics. Semiconductors under Non-Equilibrium Conditions. p-n Junction. Junction Transistor. Junction Field-Effect Transistors. Surface Effects and Surface-Controlled Devices. Theory of Semiconductor Surfaces. Surface Effects on p-n Junctions. Surface Field-Effect Transistors. Properties of the Silicon-Silicon Dioxide System.
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John Wiley & Sons Inc Properties of Advanced Semiconductor Materials
Book SynopsisContaining the most reliable parameter values for each of these semiconductor materials, along with applicable references, these data are organized in a structured, logical way for each semiconductor material. * Reviews traditional semiconductor materials as well as new, advanced semiconductors. * Essential authoritative handbook on the properties of semiconductor materials.Trade Review"Six contributed chapters describe the key properties of emerging semiconductor materials systems with exciting potential..." (SciTech Book News, Vol. 25, No. 2 June 2001) "Anyone working with these materials will find the up-to-date information summarized in this handbook extremely useful and handy...this handbook has the potential to become on of the most cited reference books in upcoming years." (MRS Bulletin, September 2001)Table of ContentsContributors. Preface. Gallium Nitride (GaN) (V. Bougrov, et al.). Aluminum Nitride (AIN) (Y. Goldberg). Indium Nitride (InN) (A. Zubrilov). Boron Nitride (BN) (S. Rumyantsev, et al.). Silicon Carbide (SiC) (Y. Goldberg, et al.). Silicon-Germanium (Si_1-xGe_x) (F. Schäffler). Appendix 1: Basic Physical Constants. Appendix 2: Periodic Table of the Elements. Appendix 3: Rectangular Coordinates for Hexagonal Crystal. Appendix 4: The First Brillouin Zone for Wurtzite Crystal. Appendix 5: Zinc Blende Structure. Appendix 6: The First Brillouin Zone for Zinc Blende Crystal. Additional References.
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John Wiley & Sons Inc Analysis and Design of Vertical Cavity Surface
Book SynopsisVertical Cavity Surface Emitting Lasers (VCSELs) are a type of semiconductor laser whose optical output is vertically emitted from the surface as opposed to conventional edge emitting semiconductor lasers. This book acts as a practical guide for the modeling of VCSELs. It provides derivations for understanding the operational principles of VCSELs.Trade Review"…very nicely organized…design engineers of VCSELs will find this book the most useful. However, it also provides valuable information to CAD tool designers…" (Optics & Photonics News, June 2005) “…the author’s assessment of the opportunities gives a strong incentive to develop such interest” (Robotica, Vol. 22, 2004)Table of ContentsPreface. Acknowledgments. 1. Vertical Cavity Surface Emitting Lasers - An overview. 2. Simple Design Consideration of Vertical Cavity Surface Emitting Lasers. 3. Modal Characteristics of Vertical Cavity Surface Emitting Lasers. 4. Polarization Properties of Vertical Cavity Surface Emitting Lasers. 5. Thermal Characteristics of Vertical Cavity Surface Emitting Lasers. 6. Electrical Characteristics of Vertical Cavity Surface Emitting Lasers. 7. Direct Modulation of Vertical Cavity Surface Emitting Lasers. 8. Spontaneous Emission of Vertical Cavity Surface Emitting Lasers. 9. Nonlinear Characteristics in Vertical Cavity Surface Emitting Lasers. Index.
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John Wiley & Sons Inc Silicon Germanium
Book SynopsisAn excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. -Ron Wilson, EETimes SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. This book is a comprehensive review of the technology and of the design methods that go with it. -Alberto Sangiovanni-Vincentelli Professor, University of California, Berkeley Cofounder, Chief Technology Officer, Member of Board Cadence Design Systems Inc. Filled with in-depth insights and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM''s SiGe technology, this comprehensive guide quickly moves on to: * Detail many of IBM''s SiGe technology development programs * Explore IBM''s approach to deTrade Review"The text is recommended for engineering libraries serving electrical and computer engineering programs and engineers." (E-STREAMS, October 2004)Table of ContentsContributors. Foreword. Preface. Acknowledgments. Introduction. A Historical Perspective at IBM. Technology Development. Modeling and Characterization. Design Automation and Signal Integrity. Leading-Edge Applications. Appendix. Index. About the Authors.
£142.16
