Storage media and peripherals Books

Book SynopsisThe fourth edition of this popular cookbook provides more than 200 hands-on recipes (complete with code) that show you how to run this tiny low-cost computer with Linux, program it with Python, hook it up to sensors and motors, and use it with the internet of things (IoT).

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Book SynopsisThis practical book explains the value of observable systems and shows you how to practice observability-driven development.

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Book SynopsisDavid M. Kroenke entered  the computing profession as a summer intern at the RAND Corporation  in 1967. Since then, his career has spanned  education,  industry, consulting, and publishing. He has taught at the University of Washington, Colorado State University, and Seattle University. Over the years, he has led dozens of teaching seminars for college professors. In 1991 the International Association of Information Systems named him Computer Educator of the Year. In  industry,  Kroenke  has  worked  for  the  U.S. Air  Force  and  Boeing Computer Services, and he was a principal in the startup of three companies. He was also vice presi- dent of product  marketing and development for the Microrim Corporation  and was chief technologist for the database division of Wall Data, Inc. He is the father of the semantic object data mTable of Contents PAR T 1 DATABASE FUNDAMENTALS 1 Getting Started 2 The Relational Model 3 Structured Query Language PAR T 2 DATABASE DESIGN 4 Data Modeling and the Entity- Relationship Model 5 Database Design PAR T 3 DATABASE MANAGEMENT 6 Database Administration 7 Database Processes Applications 8 Data Warehouses, Business Intelligence Systems, and Big Data Glossary Index

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Book SynopsisAll you need to know about Storage Area Networks The amount of data of an average company doubles every year. Thus, companies who own 1TB of data today will own 32TB in five years. Storage networks help to tame such data quantities and to manage this data growth efficiently. Since stored data and information are the biggest asset of any company, anyone who is involved in the planning or the operation of IT systems requires a basic knowledge of the principle and the use of storage networks. Storage Networks Explained covers the fundaments, techniques and functions of storage networks such as disk subsystems, Fibre Channel SAN, Internet SCSI (iSCSI), Fibre Channel over Ethernet (FCoE), Network Attached Storage (NAS), file systems, and storage virtualization. Furthermore the authors describe the use of these techniques and how they are designed to achieve high-availability, flexibility, and scalability of data and applications. Additional attention is given Table of ContentsAbout the Authors. Foreword to the Second Edition by Hermann Strass. Preface by the Authors. List of Figures and Tables. 1 Introduction. 1.1 Server-Centric IT Architecture and its Limitations. 1.2 Storage-Centric IT Architecture and its Advantages. 1.3 Case Study: Replacing a Server with Storage Networks. 1.4 The Structure of the Book. PART I Technologies for Storage Networks. 2 Intelligent Disk Subsystems. 2.1 Architecture of Intelligent Disk Subsystems. 2.2 Hard Disks and Internal I/O Channels. 2.3 JBOD: Just a Bunch of Disks. 2.4 Storage Virtualisation Using RAID. 2.5 Different RAID Levels in Detail. 2.5.1 RAID 0: block-by-block striping. 2.5.2 RAID 1: block-by-block mirroring. 2.5.3 RAID 0+1/RAID 10: striping and mirroring combined. 2.5.4 RAID 4 and RAID 5: parity instead of mirroring. 2.5.5 RAID 6: double parity. 2.5.6 RAID 2 and RAID 3. 2.5.7 A comparison of the RAID levels. 2.6 Caching: Acceleration of Hard Disk Access. 2.6.1 Cache on the hard disk. 2.6.2 Write cache in the disk subsystem controller. 2.6.3 Read cache in the disk subsystem controller. 2.7 Intelligent Disk Subsystems. 2.7.1 Instant copies. 2.7.2 Remote mirroring. 2.7.3 Consistency groups. 2.7.4 LUN masking. 2.8 Availability of Disk Subsystems. 2.9 Summary. 3 I/O Techniques. 3.1 The Physical I/O Path from the CPU to the Storage System. 3.2 SCSI. 3.2.1 SCSI basics. 3.2.2 SCSI and storage networks. 3.3 The Fibre Channel Protocol Stack. 3.3.1 Links, ports and topologies. 3.3.2 FC-0: cables, plugs and signal encoding. 3.3.3 FC-1: 8b/10b encoding, ordered sets and link control protocol. 3.3.4 FC-2: data transfer. 3.3.5 FC-3: common services. 3.3.6 Link services: login and addressing. 3.3.7 Fabric services: name server and co. 3.3.8 FC-4 and ULPs: application protocols. 3.4 Fibre Channel SAN. 3.4.1 Point-to-point topology. 3.4.2 Fabric topology. 3.4.3 Arbitrated loop topology. 3.4.4 Hardware components for Fibre Channel SAN. 3.4.5 InterSANs. 3.4.6 Interoperability of Fibre Channel SAN. 3.5 IP Storage. 3.5.1 IP storage standards: iSCSI, iFCP, mFCP, FCIP and iSNS. 3.5.2 TCP/IP and Ethernet as an I/O technology. 3.5.3 Migration from Fibre Channel to IP storage. 3.6 Infiniband-based Storage Networks. 3.6.1 InfiniBand. 3.6.2 Virtual Interface Architecture (VIA). 3.6.3 SCSI via InfiniBand and RDMA. 3.7 Fibre Channel over Ethernet (FCoE). 3.7.1 I/O Consolidation based on Ethernet. 3.7.2 FCoE Details. 3.7.3 Case studies. 3.7.4 Data Center Bridging (DCB). 3.7.5 Outlook. 3.8 Summary. 4 File Systems and Network Attached Storage (NAS). 4.1 Local File Systems. 4.1.1 File systems and databases. 4.1.2 Journaling. 4.1.3 Snapshots. 4.1.4 Volume manager. 4.2 Network File Systems and File Servers. 4.2.1 Basic principle. 4.2.2 Network Attached Storage (NAS). 4.2.3 Performance bottlenecks in file servers. 4.2.4 Acceleration of network file systems. 4.2.5 Case study: The Direct Access File System (DAFS). 4.3 Shared Disk File Systems. 4.3.1 Case study: The General Parallel File System (GPFS). 4.4 Comparison: Fibre Channel SAN, FCoE SAN, iSCSI SAN and NAS. 4.5 Summary. 5 Storage Virtualisation. 5.1 Once Again: Virtualisation in the I/O Path. 5.2 Limitations and Requirements. 5.2.1 Architecture-related limitations of non-virtualised storage networks. 5.2.2 Implementation-related limitations of storage networks. 5.2.3 Requirements of the data. 5.2.4 Proposed solution: storage virtualisation. 5.3 Definition of Storage Virtualisation. 5.4 Implementation Considerations. 5.4.1 Realisation of the virtualisation entity. 5.4.2 Replacement of storage devices. 5.4.3 Efficient use of resources by dynamic storage allocation. 5.4.4 Efficient use of resources by data migration. 5.4.5 Performance increase. 5.4.6 Availability due to the introduction of redundancy. 5.4.7 Backup and archiving. 5.4.8 Data sharing. 5.4.9 Privacy protection. 5.5 Storage Virtualisation on Block or File Level. 5.6 Storage Virtualisation on Various Levels of the Storage Network. 5.6.1 Storage virtualisation in the server. 5.6.2 Storage virtualisation in storage devices. 5.6.3 Storage virtualisation in the network. 5.7 Symmetric and Asymmetric Storage Virtualisation in the Network. 5.7.1 Symmetric storage virtualisation. 5.7.2 Asymmetric storage virtualisation. 5.8 Summary. PART II Application and Management of Storage Networks. 6 Application of Storage Networks. 6.1 Definition of the Term ‘Storage Network’. 6.1.1 Layering of the transmission techniques and protocols. 6.1.2 Networks in the I/O path. 6.1.3 Data networks, voice networks and storage networks. 6.2 Storage Sharing. 6.2.1 Disk storage pooling. 6.2.2 Dynamic tape library sharing. 6.2.3 Data sharing. 6.3 Availability of Data. 6.3.1 Failure of an I/O bus. 6.3.2 Failure of a server. 6.3.3 Failure of a disk subsystem. 6.3.4 Failure of virtualisation in the storage network. 6.3.5 Failure of a data centre based upon the case study ‘protection of an important database’. 6.4 Adaptability and Scalability of IT Systems. 6.4.1 Clustering for load distribution. 6.4.2 Web architecture. 6.4.3 Web applications based upon the case study ‘travel portal’. 6.5 Summary. 7 Network Backup. 7.1 General Conditions for Backup. 7.2 Network Backup Services. 7.3 Components of Backup Servers. 7.3.1 Job scheduler. 7.3.2 Error handler. 7.3.3 Metadata database. 7.3.4 Media manager. 7.4 Backup Clients. 7.5 Performance Gains as a Result of Network Backup. 7.6 Performance Bottlenecks of Network Backup. 7.6.1 Application-specific performance bottlenecks. 7.6.2 Performance bottlenecks due to server-centric IT architecture. 7.7 Limited Opportunities for Increasing Performance. 7.7.1 Separate LAN for network backup. 7.7.2 Multiple backup servers. 7.7.3 Backup server and application server on the same physical computer. 7.8 Next Generation Backup. 7.8.1 Server-free backup. 7.8.2 LAN-free backup. 7.8.3 LAN-free backup with shared disk file systems. 7.8.4 Backup using instant copies. 7.8.5 Data protection using remote mirroring. 7.8.6 Tape library sharing. 7.9 Backup of File Systems. 7.9.1 Backup of file servers. 7.9.2 Backup of file systems. 7.9.3 Backup of NAS servers. 7.9.4 The Network Data Management Protocol (NDMP). 7.10 Backup of Databases. 7.10.1 Functioning of database systems. 7.10.2 Classical backup of databases. 7.10.3 Next generation backup of databases. 7.11 Organisational Aspects of Backup. 7.12 Summary. 8 Archiving. 8.1 Terminology. 8.1.1 Differentiating between information and data. 8.1.2 Archiving. 8.1.3 Digital archiving. 8.1.4 Reference architecture for digital archive systems. 8.1.5 Differentiating between archiving and backup. 8.1.6 Differentiating between archiving and ILM. 8.2 Motivation, Conditions and Requirements. 8.2.1 Reasons for archiving. 8.2.2 Legal requirements. 8.2.3 Technical progress. 8.2.4 Requirement for stability. 8.2.5 Risks from the environment and from society. 8.2.6 Requirement for adaptability and scalability. 8.2.7 Operational requirements. 8.2.8 Cost-related requirements. 8.2.9 Conclusion: Archive systems as a strategic investment. 8.3 Implementation Considerations. 8.3.1 WORM storage technologies. 8.3.2 Data security. 8.3.3 Data integrity. 8.3.4 Proof of regulatory compliance. 8.3.5 Deletion of data. 8.3.6 Continuous operation. 8.3.7 Loss-free operation. 8.3.8 Data management: storage hierarchy and migration. 8.3.9 Component-neutral archiving. 8.3.10 Selection of components and vendors. 8.4 Interfaces in Archive Systems. 8.4.1 Interface between application and DMS. 8.4.2 Java Content Repository (JCR). 8.4.3 Interface between DMS and archive storage. 8.4.4 eXtensible Access Method (XAM). 8.4.5 Management interfaces. 8.4.6 Interface between DMS systems. 8.4.7 Standardised interfaces for archive systems. 8.5 Archive Solutions. 8.5.1 Archiving of emails. 8.5.2 Archiving of files. 8.5.3 Archiving of ERP systems. 8.5.4 Archiving in hospitals. 8.5.5 Central archives. 8.6 Operational and Organisational Aspects. 8.7 Summary and Outlook. 9 Business Continuity. 9.1 General Conditions. 9.1.1 Terminology. 9.1.2 Target audience. 9.1.3 Classification of risks. 9.1.4 Classification of outages. 9.1.5 IT failures in the context of business processes. 9.1.6 Resumption of business processes. 9.1.7 Business continuity for the web architecture. 9.1.8 Cost optimisation for business continuity. 9.1.9 Risk analysis and risk management. 9.1.10 Creation of a business continuity plan. 9.2 Strategies of Business Continuity. 9.2.1 High availability. 9.2.2 Disaster recovery. 9.2.3 Continuous business operation. 9.3 Parameters of Business Continuity. 9.3.1 Availability. 9.3.2 Characterisation of availability (MTBF, MTTR and MTTF). 9.3.3 Calculation of overall availability. 9.3.4 Characterisation of failures (RTO and RPO). 9.3.5 Network Recovery Objective (NRO). 9.4 Quality of Service for Business Continuity. 9.4.1 Service Level Agreements (SLAs). 9.4.2 High availability versus disaster recovery. 9.4.3 The seven-tier model. 9.4.4 Tier 0: no data backup. 9.4.5 Tier 1: data backup without a backup data centre. 9.4.6 Tier 2: data backup with backup data centre. 9.4.7 Tier 3: electronic vaulting. 9.4.8 Tier 4: instant copies. 9.4.9 Tier 5: software mirroring. 9.4.10 Tier 6: disk subsystem-based mirroring. 9.4.11 Tier 7: fully automated solutions. 9.5 Business Continuity Solutions. 9.5.1 Basic techniques. 9.5.2 Solution segments of the seven-tier model. 9.5.3 Backup and restore. 9.5.4 Rapid data recovery using copies. 9.5.5 Rapid data recovery using mirrors. 9.5.6 Continuous availability. 9.6 Switch of Operational Location. 9.7 Organisational Aspects. 9.8 Summary. 10. Management of Storage Networks. 10.1 Requirements. 10.1.1 User-related requirements. 10.1.2 Component-related requirements. 10.1.3 Architectural requirements. 10.1.4 One central management system. 10.1.5 Five basic services. 10.2 Characterisation of Management Interfaces. 10.2.1 In-band interfaces. 10.2.2 Out-band interfaces. 10.2.3 Standardised interfaces. 10.2.4 Proprietary interfaces. 10.2.5 Conclusion. 10.3 In-band Management. 10.3.1 In-band management in Fibre Channel SAN. 10.4 Out-band Management. 10.4.1 The Simple Network Management Protocol (SNMP). 10.4.2 CIM and WBEM. 10.4.3 Storage Management Initiative Specification (SMI-S). 10.4.4 CMIP and DMI. 10.5 Operational Aspects of the Management of Storage Networks. 10.6 Summary. 11 Removable Media Management. 11.1 The Significance of Removable Media. 11.2 Removable Media. 11.2.1 Tapes. 11.2.2 CD, DVD and magneto-optical media. 11.2.3 Management features of removable media. 11.3 Libraries and Drives. 11.3.1 Libraries. 11.3.2 Drives. 11.3.3 Media changers. 11.4 Problems and Requirements in Respect of Removable Media Management. 11.4.1 Efficient use of the available resources. 11.4.2 Access control. 11.4.3 Access synchronisation. 11.4.4 Access prioritisation and mount request queuing. 11.4.5 Grouping, pooling. 11.4.6 Media tracking and vaulting. 11.4.7 Cartridge life cycle management. 11.4.8 Monitoring. 11.4.9 Reporting. 11.5 The IEEE 1244 Standard for Removable Media Management. 11.5.1 Media management system architecture. 11.5.2 Media manager and MMP. 11.5.3 Library manager and drive manager. 11.6 Summary. 12 The SNIA Shared Storage Model. 12.1 The Model. 12.1.1 The functional approach. 12.1.2 Graphical representations. 12.1.3 An elementary overview. 12.1.4 The components. 12.1.5 The layers. 12.1.6 The file/record layer. 12.1.7 The block layer. 12.1.8 Combination of the block and file/record layers. 12.1.9 Access paths. 12.1.10 Caching. 12.1.11 Access control. 12.1.12 Clustering. 12.1.13 Storage, data and information. 12.1.14 Resource and data sharing. 12.1.15 The service subsystem. 12.2 Examples of Disk-Based Storage Architectures. 12.2.1 Direct attached block storage. 12.2.2 Storage network attached block storage. 12.2.3 Block storage aggregation in a storage device: SAN appliance. 12.2.4 Network attached block storage with metadata server: asymmetric block services. 12.2.5 Multi-site block storage. 12.2.6 File server. 12.2.7 File server controller: NAS heads. 12.2.8 Asymmetric file services: NAS/file server metadata manager. 12.2.9 Object-based storage device (OSD). 12.3 Extension of the SNIA Shared Storage Model to Tape Functions. 12.3.1 Logical and physical structure of tapes. 12.3.2 Differences between disk and tape. 12.3.3 Extension of the model. 12.4 Examples of Tape-Based Backup Techniques and Architectures. 12.4.1 File backup. 12.4.2 File system volume backup. 12.4.3 Volume backup. 12.4.4 File backup to virtual tape. 12.4.5 Direct attached tape. 12.4.6 LAN attached tape. 12.4.7 Shared tape drive. 12.4.8 Partitioned tape library. 12.4.9 Virtual tape controller. 12.4.10 Virtual tape controller with disk cache. 12.4.11 Data mover for tape. 12.4.12 File server with tape drive. 12.4.13 File server with external tape. 12.4.14 File server with data mover. 12.5 Summary. 13 Final Note. Glossary. Annotated Bibliography. Appendix A: Proof of Calculation of the Parity Block of RAID 4 and 5. Appendix B: Checklist for the Management of Storage Networks. B.1 Applications. B.1.1 Monitoring. B.1.2 Availability. B.1.3 Performance. B.1.4 Scalability. B.1.5 Efficient use. B.2 Data. B.2.1 Availability. B.2.2 Performance. B.2.3 Data protection. B.2.4 Archiving. B.2.5 Migration. B.2.6 Data sharing. B.2.7 Security/access control. B.3 Resources. B.3.1 Inventory/asset management and planning. B.3.2 Monitoring. B.3.3 Configuration. B.3.4 Resource use. B.3.5 Capacity. B.3.6 Efficient resource utilisation. B.3.7 Availability. B.3.8 Resource migration. B.3.9 Security. B.4 Network. B.4.1 Topology. B.4.2 Monitoring. B.4.3 Availability. B.4.4 Performance. Index.

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Book SynopsisThis book will be a valuable resource for those interested in - how to use advanced memory configurations, - memory chip to system level designs including megabyte and gigabyte mass storage memories, - and radiation effects on these technologies for use in military and space applications.Table of ContentsPREFACE xix 1 INTRODUCTION TO ADVANCED SEMICONDUCTOR MEMORIES 1 1.1. Semiconductor Memories Overview 1 1.2. Advanced Semiconductor Memory Developments 8 1.3. Future Memory Directions 16 References 18 2 STATIC RANDOM ACCESS MEMORY TECHNOLOGIES 19 2.1. Basic SRAM Architecture and Cell Structures 19 2.1.1. SRAM Performance and Timing Specifications 21 2.1.2. SRAM ReadWrite Operations 23 2.2. SRAM Selection Considerations 26 2.3. High Performance SRAMs 33 2.3.1. Synchronous SRAMs Flow-Through 41 2.3.2. Zero Bus Turnaround SRAMs 43 2.3.3. Quad Data Rate SRAM 44 2.3.4. Double Data Rate SRAM 50 2.3.5. No-Turnaround Random Access Memory 51 2.4. Advanced SRAM Architectures 55 2.5. Low-Voltage SRAMs 61 2.6. BiCMOS Technology SRAMs 75 2.7. SOI SRAMs 79 2.8. Specialty SRAMs 91 2.8.1. Multiport RAMs 92 2.8.1.1. Dual-Port RAMs 92 2.8.1.2. Quadport™ RAMs 101 2.8.2. First-In-First-Out (FIFO) Memories 103 2.8.3. Content Addressable Memories (CAMs) 111 2.8.3.1. Advanced Content Addressable Memories (Examples) 116 References 122 3 HIGH-PERFORMANCE DYNAMIC RANDOM ACCESS MEMORIES 129 3.1. DRAM Technology Evolution and Trends 129 3.2. DRAM Timing Specifications and Operations 133 3.2.1. General Timing Specifications 133 3.2.2. Memory Read Operation 135 3.2.3. Memory Write Operation 138 3.2.4. Read-Modify-Write Operation 140 3.2.5. DRAM Refresh Operation 141 3.3. Extended-Data-Out DRAMS 145 3.3.1. EDO DRAM (Example) 145 3.4. Enhanced DRAM (EDRAM) 146 3.5. Synchronous DRAMGRAM Architectures 150 3.5.1. SDR SDRAMSGRAM 150 3.5.2. DDR SDRAMSGRAM Features 151 3.5.3. Synchronous DRAM 256Mb (Example) 154 3.5.3.1. Initialization 154 3.5.3.2. Register Definition 155 3.5.3.3. Commands 157 3.5.3.4. SDRAM Operations 159 3.6. Enhanced Synchronous DRAM (ESDRAM) 163 3.7. Cache DRAM (CDRAM) 166 3.8. Virtual Channel Memory (VCM) DRAMs 172 3.9. Advaned DRAM Technology Perspectives 175 3.9.1. Memory Capacitor Cell Improvements 179 3.9.2. 64-Mb DRAMs 188 3.9.3. 256-Mb DRAMs 195 3.10. Gigabit DRAM Scaling Issues and Architectures 200 3.11. Multilevel Storage DRAMs 217 3.12. SOI DRAMs 221 References 231 4 APPLICATION-SPECIFIC DRAM ARCHITECTURES AND DESIGNS 237 4.1. Video RAMs (VRAMs) 241 4.2. Synchronous Graphic RAMs (SGRAMs) 244 4.2.1. 64-Mb DDR SGRAM 246 4.2.2. 256-Mb DDR Fast Cycle RAM 253 4.3. Rambus Technology Overview 257 4.3.1. Direct RDRAM Technologies and Architectures 264 4.3.2. Direct Rambus Memory System-Based Designs 272 4.4. Synchronous Link DRAMs (SLDRAMs) 275 4.4.1. SLDRAM Standard 277 4.4.2. SLDRAM Architectural and Functional Overview 283 4.4.3. SLDRAM (Example) 285 4.5. 3-D RAM 296 4.5.1. Pixel ALU Operations 305 4.6. Memory System Design Considerations 309 References 316 5 ADVANCED NONVOLATILE MEMORY DESIGNS AND TECHNOLOGIES 319 5.1. Nonvolatile Memory Advances 319 5.1.1. Introduction 319 5.1.2. Serial EEPROMs 323 5.1.3. Flash Memory Developments 327 5.2. Floating Gate Cell Theory and Operations 334 5.2.1. Floating Gate Cell Theory 334 5.2.2. Charge Transport Mechanisms 339 5.2.2.1. Fowler-Nordheim Tunneling 340 5.2.2.2. Polyoxide Conduction 342 5.2.2.3. Channel Hot-Electron Injection (CHEI) 343 5.2.2.4. Direct Band-to-Band Tunneling 347 5.3. Nonvolatile Memory Cell and Array Designs 350 5.3.1. UV-EPROM (or EPROM) Cells 350 5.3.1.1. T-Cell EPROM 351 5.3.1.2. X-Cell EPROM 351 5.3.1.3. Staggered Virtual Ground (SVG) Cell Array EPROM 352 5.3.1.4. Alternate Metal Virtual Ground (AMG) Cell Array EPROM 353 5.3.2. EEPROM Cells 354 5.3.3. Flash Memory Cells 354 5.3.3.1. T-Cell Flash 355 5.3.3.2. Alternate Metal Ground (AMG) Flash Cell 357 5.3.3.3. Source-Coupled Split-Gate (SCSG) Flash Cell 358 5.3.3.4. Field-Enhancing Tunneling Injector Flash Cell 359 5.3.3.5. Triple-Polysilicon Virtual Ground (TPVG) Flash Cell 362 5.3.3.6. Divided Bit-Line NOR (DINOR) Flash Cell 363 5.3.3.7. AND Flash Cell 365 5.3.3.8. High Capacitive Coupling Ratio (HiCr) Flash Cell 366 5.3.3.9. NAND Flash Cell 366 5.3.4. Flash Memory Cell Basic Operation and Processes 368 5.3.5. Flash EEPROM Technology Developments 372 5.4. Flash Memory Architectures 377 5.4.1. NOR Flash Memories 378 5.4.1.1. AMD NOR Architecture Flash Memories 381 5.4.1.2. Intel Flash Memories 387 5.4.2. NAND Flash Memories 392 5.4.2.1. AMD NAND Architecture Flash Memories 393 5.4.2.2. Samsung 32M x 8-bit NAND Architecture Flash Memory 397 5.4.2.3. Virtual DRAM 401 5.4.3. DINOR Architecture Flash Memories 403 5.4.3.1. A 16-Mb DINOR Flash Memory 405 5.4.3.2. P-Channel DINOR Flash Memory 406 5.4.3.3. BiNOR Cell Flash Memory 408 5.4.4. AND Architecture Flash Memories 410 5.4.5. Specialty Flash Memories 411 5.5. Multilevel Nonvolatile Memories 412 5.5.1. Multilevel NOR Flash Memories 418 5.5.2. Multilevel NAND Flash Memories 426 5.5.2.1. A 512-Mb NAND Flash Memory 429 5.5.3. Multilevel AND Flash Memories 429 5.6. Flash Memory Reliability Issues 430 5.6.1. General Failure Mechanisms for EPROMsEEPROMs 430 5.6.1.1. Stuck Bit 434 5.6.1.2. Data Retention Degradation 434 5.6.1.3. Read Time Degradation 434 5.6.1.4. Erase Time Degradation 434 5.6.1.5. Program Time Degradation 434 5.6.1.6. Disturbs 434 5.6.2. Flash Memory Reliability 435 5.6.2.1. Flash Overerase 436 5.6.2.2. Flash Program Disturbs 436 5.6.2.3. Flash Read Disturbs 437 5.6.2.4. Flash ProgramErase Endurance 437 5.6.2.5. Flash Data Retention Failures 439 5.6.2.6. Flash Hot Carrier Reliability Effects 441 5.6.2.7. Multilevel Flash Reliability 442 5.7. Ferroelectric Memories 443 5.7.1. Technology Overview 443 5.7.2. Ferroelectric Materials and Memory Design 451 5.7.3. Megabit FRAMs 454 5.7.4. Chain FRAM (CFRAM) 463 5.7.5. Metal Ferroelectric Semiconductor FET 465 5.7.6. FRAM Reliability Issues 467 References 469 6 EMBEDDED MEMORIES DESIGNS AND APPLICATIONS 479 6.1. Embedded Memory Developments 479 6.2. Cache Memory Designs 487 6.2.1. Cache Architecture Implementation for a DSP (Example) 495 6.3. Embedded SRAMDRAM Designs 499 6.3.1. Embedded SRAM Macros 503 6.3.1.1. A IT SRAM Macro 504 6.3.1.2. A 4T SRAM Macro 506 6.3.2. Embedded DRAM Macros 508 6.3.2.1. dRAMASICs 508 6.3.2.2. A Compiled 100-MHz DRAM Macro 509 6.3.2.3. A Dual-Port Interleaved DRAM Architecture Macro 511 6.3.2.4. A 1-GHz Synchronous DRAM Macro 513 6.4. Merged Processor DRAM Architectures 516 6.5. DRAM Processes with Embedded Logic Architectures 522 6.5.1. A Modular Embedded DRAM Core 523 6.5.2. Multimedia Accelerator with Embedded DRAM 524 6.5.3. Intelligent RAM (IRAM) 527 6.5.4. Computational RAM 530 6.6. Embedded EEPROM and Flash Memories 533 6.7. Memory Cards and MultiMedia Applications 536 6.7.1. Memory Cards 536 6.7.2. Single-Chip Flash Disk 544 References 547 7 FUTURE MEMORY DIRECTIONS: MEGABYTES TO TERABYTES 549 7.1. Future Memory Developments 549 7.2. Magnetoresistive Random Access Memories (MRAMs) 551 7.2.1. MRAM Technology Developments and Tradeoffs 551 7.2.2. MRAM Cells and Architectures 556 7.2.3. 256K1-Mb GMRAMs 566 7.2.4. Multilevel MRAMs 571 7.3. Resonant Tunneling Diode-Based Memories 572 7.3.1. Resonant Tuneling Diode Theory 572 7.3.2. Tunneling SRAM (TSRAM) Cell Designs 574 7.3.3. RTD-Based Memory System (Example) 579 7.4. Single-Electron Memories 582 7.4.1. Single-Electron Device Theory 582 7.4.2. Single-Electron Memory Characteristics and Configurations 590 7.4.3. Single-Electron Devices Fabrication Techniques 595 7.4.4. Nanocrystal Memory Devices 596 7.5. Phase-Change Nonvolatile Memories 602 7.6. Protonic Nonvolatile Memories 607 7.7. Miscellaneous Memory Technology Development (Examples) 612 7.7.1. Thyristor-Based SRAM Cell (T-RAM) 613 7.7.2. Content Addressable Read-Only Memory (CAROM) 614 7.7.3. Nanotech Memories 618 7.7.4. Solid-State Holographic Memories 618 References 623 INDEX 631

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Book SynopsisProvides the reader with memory fundamentals as well as directions for future research. Examines memory history, current memory technology and offers a glimpse at the future of memories.Table of ContentsThe Strategic Nature of Semiconductor Memories. The Basics of Memories: Market, Technology and Product. Trends in Memory Applications. Memory Device and Process Technology. Basic Memory Architecture and Cell Structure. Dynamic Random Access Memory Trends--4k to 256Mb. Application-Specific DRAMs. Trends in Static RAMs. Future, Fast and Application-Specific SRAMs. MOS ROMs, PROMs and EPLDs. Field Alterable ROMs I: EPROM, OTP, and Flash Memories. Field Alterable ROMs 2: EEPROM, EAROM, NV-RAM. Packaging--Single, Module and Wafer Scale Integration. Memory Electrical and Reliability Testing. Yield, Cost and the Modern Factory. Memory Trends in the Future. Index.

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Book SynopsisHigh Performance Memories New architecture DRAMs and SRAMs evolution and function Revised Edition Betty Prince Memory Strategies International, Leander, Texas, USA Now presenting extra product specific material on the new DDR SDRAMs, ESDRAMs and DDR ESDRAMs, Direct Rambus DRAMs, SLDRAM, VCDRAM, SGRAM and DDR SGRAM, and DP-DRAM.Table of ContentsOverview of High Speed Memories and Memory Systems. High Performance Memory Applications. Fast SRAMs. Fast Cache Memory. Evolution of Fast Asynchronous DRAMs. New Architectures for Fast DRAMs. Graphics DRAMs. Power Supply, Interface, and Test Issues. Fast Packaging Techniques. Index.

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Book SynopsisData manipulation and analysis are easier than you might imagine. Using tools that come standard with your desktop computer, you can learn how to extract, manipulate, and analyse data of any size and complexity. This book familiarizes readers with easily digestible but powerful concepts that will enable you to feel confident working with data.Trade ReviewI highly recommend The Data Wrangler’s Handbook for anyone who now manipulates data or may need to do so in the future. In Banerjee’s words, 'If these tasks [that require data wrangling] sound intimidating, this book is for you. You will understand everything in this book even if you have no special technical knowledge or programming experience.'"" — TechnicalitiesTable of Contents List of Figures and Tables Acknowledgments Introduction Chapter 1 Getting Started with the Command Line Finding the Command Line Mac Windows Meet the Command Line Chapter 2 Command Line Concepts Two Powerful Symbols Direct Output to a File (Greater Than Symbol) Direct Output to Another Program (Pipe Symbol) Command Substitution Regular Expressions—The Swiss Army Knife for Data Literal Characters Special Characters Wildcard Characters Logical Operators Grouping Scripting Chapter 3 Understanding Formats, by David Forero Chapter 4 Simplify Complicated Problems Isolating Specific Data Elements Converting Data into Formats That Are Easier to Work With Chapter 5 Delimited Text CSV (Comma Separated Values) Commas and Quotation Marks in CSV Files Multiline Fields in CSV Files Multivalued Fields in Delimited Files Chapter 6 XML So What Is XML, Really? What Makes XML So Useful? Why Is XML So Easy? DOM (Document Object Model) XPath XSLT (eXtensible Stylesheet Language Transformations) Working with Large XML Files Working with Complex XML Files XmlStarlet Installing XmlStarlet Converting XML Documents Chapter 7 JSON (JavaScript Object Notation) Chapter 8 Scripting Variables Arguments Conditional Execution Loops Chapter 9 Solving Common Problems Viewing Large Files Locating Files That Contain Particular Data Finding Files with Specific Characteristics Working with Internal Metadata Working with APIs Combining Data from Different Sources Other Tasks Chapter 10 Conclusions One-Line Wonders Locating, Viewing, and Performing Basic File Operations Combine Information from Multiple Files into a Single File Combine Three Files, Each Consisting of a Single Column into a Three-Column Table Extract 1,000 Random Lines or Records from a File Find Files with Specific Characteristics Find All Lines in All Files in the Current Directory as Well as All Subdirectories Containing a Regular Expression Identify All Files in Current Directories and Subdirectories That Contain a Value List All Files in Current Directory and Subdirectories over a 100 MB in Order of Decreasing Size List the Names, Pixel Dimensions, and File Sizes of All Files in the Current Directory and Subdirectories in Tab Delimited Format Print Line Number of File That Match Occurred On Split Large Files into Smaller Chunks with Each File Breaking on a Line View 200 Characters Starting at Position 38562 in a File View Lines 4369–4374 of a File Retrieving and Sending Information over a Network Retrieve a Document from the Web and Send It to a File Send an XML Document to an API Requiring HTTP Authentication Sorting, Counting, Deduplication, and File Comparison Combine Two Files on a Common Field Compare Two Sorted Files Count Occurrences for Each Entry in a File, Listed in Order of Decreasing Frequency Count Records Containing an Expression Count Words, Lines, and Characters in Files Identify All Unique Entries and Supply a Count of How Many Times Each Occurs Sort a File and Remove Duplicates, Show Only Duplicated Entries, or Show Only Unique Entries Useful Scripting Operations Capture Parameters Passed to a Script Divide a Line into Parameters Iterate through Every Item in Parameter List Perform a Loop Perform an Operation Conditionally Run a Script on Every Line of a File Send the Output of a Command as Arguments to Another Command Send the Output of a Command to Another Command Send the Output of a Command to a File Store the Output of a Command in a Variable Use Foreign Character Sets in a Terminal Window Transforming Text Convert File of Dates to YYYY-MM-DD Format Convert to Title Case Convert to Upper Case Convert List of Names from Direct Order to Indirect Order Extract and Manipulate All Lines in a File That Match a Complex Pattern Extract and Manipulate All Entries in All Files in an Entire Directory Hierarchy That Match a Pattern Remove Lines from a File That Match a Pattern Remove Carriage Return Characters Inserted by Windows Programs from a File Remove Newline Characters from a File Replace Newlines in a File with Character 7 (Bell) Replace Search_Expr with Replace_Expr Only on Lines That Contain Condition_Expr Replace Search_Expr with Replace_Expr Except on Lines That Contain Condition_Expr Replace Smart Quotes with Straight Quotes Working with Delimited Files Convert Comma Delimited File Where Some Values Are Quoted and Some Values Are Not to Tab Delimited Convert Multiline Records to Table Extract Individual Fields from Files Find the Most Common Values in the Second Field of a File Find All Lines in Tab Delimited File Not Containing Six Fields Fix Delimited File That Contains Line Breaks in Fields Remove Trailing and Leading Whitespace from Tab Delimited Data Fields Reorder Fields in a Tab Delimited File Working with JSON and XML Add an Attribute to an XML Document Add an Element to an XML Document Apply XSLT Stylesheet to XML Document Convert JSON to Tab Delimited Format Delete Elements, Attributes, or Values Based on XPath Expressions Display Structure of XML File Pretty Print JSON Document Pretty Print XML Document Glossary Symbols That Perform Important Tasks Useful Commands Regular Expression Cheat Sheet Index

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Book SynopsisExplains the fundamentals and practical applications of flat and flexible OLEDs for displays and lighting Organic light-emitting diodes (OLEDs) have emerged as the leading technology for the new display and lighting market.Table of ContentsPreface ix 1 History of OLEDs 1 References 10 2 Fundamentals of OLEDs 12 2.1 Principle of the OLED 12 2.2 Fundamental Structure of the OLED 14 2.3 Features of the OLED 15 3 Light Emission Mechanism 17 3.1 Fluorescent OLEDs 17 3.2 Phosphorescent OLEDs 19 3.3 Thermally Activated Delayed Fluorescent OLEDs 21 3.4 Energy Diagram 21 3.5 Light Emission Efficiency 23 References 24 4 OLED Materials 25 4.1 Types of OLED Materials 26 4.2 Anode Materials 27 4.3 Evaporated Organic Materials (Small Molecular Materials) 29 4.3.1 Hole Injection Materials 29 4.3.2 Hole Transport Materials 32 4.3.3 Emitting Materials and Host Materials in Fluorescent Emission Layer 33 4.3.4 Emitting Materials and Host Materials in Phosphorescent Emission Layer 34 4.3.5 Emitting Materials and Host Materials in TADF Emission Layers 42 4.3.6 Electron Transport Materials 43 4.3.7 Electron Injection Materials and Cathodes 45 4.3.8 Charge-Carrier and Exciton Blocking Materials 46 4.3.9 N-Dope and P-Dope Materials 49 4.4 Solution Materials 50 4.4.1 Polymer Materials 50 4.4.2 Dendrimers 61 4.4.3 Small Molecules 69 4.5 Molecular Orientation of Organic Materials 70 References 71 5 OLED Devices 75 5.1 Bottom Emission, Top Emission, and Transparent Types 75 5.2 Normal and Inverted Structures 79 5.3 White OLEDs 81 5.4 Full-Color Technology 84 5.4.1 RGB-Side-by-Side 87 5.4.2 White + CF 87 5.4.3 Blue Emission with Color Changing Medium (CCM) 88 5.5 Micro-Cavity Structure 89 5.6 Multi-Photon OLED 91 5.7 Encapsulation 94 5.7.1 Thin Film Encapsulation 99 5.7.2 Desiccant Technologies 100 References 100 6 OLED Fabrication Process 103 6.1 Vacuum Evaporation Process 103 6.1.1 Mask Deposition 104 6.1.2 Three Types of Evaporation Methods 104 6.1.3 Ultra-High Vacuum 105 6.2 Wet Processes 107 6.3 Laser Processes 114 References 115 7 Performance of OLEDs 117 7.1 Characteristics of OLEDs 117 7.2 Lifetime 120 7.2.1 Storage Lifetime 121 7.2.2 Driving Lifetime 121 7.3 Temperature Measurement of OLED Devices 124 References 126 8 OLED Display 127 8.1 Features of OLED Displays 128 8.2 Types of OLED Displays 128 8.3 Passive-Matrix OLED Display 130 8.4 Active-Matrix OLED Display 132 8.4.1 TFT Circuit Technologies 133 8.4.2 TFT Device Technologies 137 8.4.3 Commercialized and Prototype AM-OLED Displays 139 References 144 9 OLED Lighting 147 9.1 Appearance of OLED Lighting 147 9.2 Features of OLED Lighting 148 9.3 Fundamental Technologies of OLED Lighting 152 9.4 Light Extraction Enhancement Technologies 154 9.5 Performance of OLED Lighting 159 9.6 Color Tunable OLED Lighting 159 9.7 Application of OLED Lighting – Products and Prototypes 161 References 164 10 Flexible OLEDs 166 10.1 Early Studies of Flexible OLEDs 166 10.2 Flexible Substrates 167 10.2.1 Ultra-Thin Glass 168 10.2.2 Stainless Steel Foil 171 10.2.3 Plastic Films 172 10.3 Flexible OLED Displays 174 10.3.1 Flexible OLED Displays on Ultra-Thin Glass 176 10.3.2 Flexible OLED Displays on Stainless Steel Foil 176 10.3.3 Flexible OLED Displays on Plastic Film 177 10.4 Flexible OLED Lighting 181 10.4.1 Flexible OLED Lighting on Ultra-Thin Glass 182 10.4.2 Flexible OLED Lighting on Stainless Steel Foil 184 10.4.3 Flexible OLED Lighting on Plastic Films 184 10.5 Toward the Flexible 186 References 186 11 New Technologies 189 11.1 Non-ITO Transparent Electrodes 189 11.1.1 Conducting Polymer 190 11.1.2 Stacked Layer Using Ag 194 11.1.3 Silver Nanowire (AgNW) 195 11.1.4 Carbon Nanotube (CNT) 196 11.2 Organic TFT 197 11.3 Wet-Processed TFT 198 11.4 Novel Wet-Processed or Printed OLED 201 11.5 Roll-to-Roll Equipment Technologies 203 11.6 Quantum Dot 204 References 206 Index 209

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Book SynopsisIntroduces the concept of Event Mining for building explanatory models from analyses of correlated data. Such a model may be used as the basis for predictions and corrective actions. The idea is to create, via an iterative process, a model that explains causal relationships in the form of structural and temporal patterns in the data.

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Book SynopsisLearning about distributed systems, becoming familiar with technologies such as containers and functions, and knowing how to put everything together can be daunting. With this practical guide, you'll get up to speed on patterns for building cloud native applications and best practices for common tasks such as messaging, eventing, and DevOps.

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Book SynopsisPreparing for your financial accounting exam? Make the grade with this SAP S/4HANA 1909 and 2020 certification study guide! From general ledger accounting to financial closing, this guide reviews the key technical and functional knowledge you need to get a high score on your SAP S/4HANA for Financial Accounting Associates exam.

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Book SynopsisA presentation of the use of computer vision systems to control manufacturing processes and product quality in the hard disk drive industry. Visual Inspection Technology in the Hard Disk Drive Industry is an application-oriented book borne out of collaborative research with the world’s leading hard disk drive companies. It covers the latest developments and important topics in computer vision technology in hard disk drive manufacturing, as well as offering a glimpse of future technologies.Table of ContentsPREFACE xi CHAPTER 1. FEATURE FUSION METHOD FOR RAPID CORROSION DETECTION ON POLE TIPS 1Suchart YAMMEN and Paisarn MUNEESAWANG 1.1. Introduction 2 1.2. Algorithm for corrosion detection 6 1.2.1. Extraction of top-shield region 6 1.2.2. Area-based feature 9 1.2.3. Contour-based feature 13 1.3. Experimental result 19 1.3.1. Distribution of corrosion 20 1.3.2. Performance metric 20 1.3.3. Robustness 24 1.4. Conclusion 27 1.5. Bibliography 28 CHAPTER 2. NONLINEAR FILTERING METHOD FOR CORROSION DETECTION ON POLE TIPS 33Paisarn MUNEESAWANG and Suchart YAMMEN 2.1. Introduction 33 2.2. Perpendicular magnetic recording 35 2.3. Perpendicular magnetic recorder and corrosion 37 2.3.1. Lubricant layer 38 2.3.2. Thermal effect results in corrosion 41 2.3.3. Recording head/slider manufacturing and corrosion 42 2.4. Length estimator for pole tip 44 2.5. Nonlinear filtering as a corrosion detector 48 2.5.1. Median filter techniques 48 2.5.2. Median „¸-Filter 50 2.5.3. Corrosion detection procedure 51 2.6. Application 54 2.7. Conclusion 62 2.8. Bibliography 63 CHAPTER 3. MICRO DEFECT DETECTION ON AIR-BEARING SURFACE 71Pichate KUNAKORNVONG and Pitikhate SOORAKSA 3.1. Introduction 71 3.2. Air-bearing surface 74 3.3. Imaging system 75 3.4. Contamination detection 79 3.4.1. Texture unit texture spectrum 80 3.4.2. Graylevel co-occurrence matrix 82 3.4.3. Principle component analysis 85 3.4.4. Identification defect 88 3.5. Conclusion 92 3.6. Acknowledgment 93 3.7. Bibliography 93 CHAPTER 4. AUTOMATED OPTICAL INSPECTION FOR SOLDER JET BALL JOINT DEFECTS IN THE HEADGIMBAL ASSEMBLY PROCESS 99Jirarat IEAMSAARD and Thanapoom FUANGPIAN 4.1. Introduction 99 4.2. Head gimbal assembly 101 4.3. Vertical edge method for inspection of pad burning defect 102 4.3.1. Inspection procedure 103 4.3.2. Experimental result 107 4.4. Detection of solder ball bridging on HGA 108 4.4.1. Solder ball bridging defect 108 4.4.2. Chain code descriptor-based method 109 4.4.3. Morphological template-based method 112 4.4.4. Experimental result 114 4.5. Detection of missing solders on HGA 121 4.5.1. Image acquisition and enhancement 121 4.5.2. Clustering of image pixels 122 4.5.3. Decision making 123 4.5.4. Inspection result 124 4.6. Conclusion 126 4.7. Bibliography 127 CHAPTER 5. ANALYSIS METHODS FOR FAULT DEFORMATION OF SOLDER BUMP ON THE ACTUATOR ARM 131Somporn RUANGSINCHAIWANICH 5.1. Introduction 132 5.2. Surface tension analysis 133 5.2.1. Model analysis 135 5.2.2. Simulation 138 5.3. Analysis of stress performance at different configurations of solder bump positions 140 5.3.1. Analysis model 144 5.3.2. Design and analysis using FEM 145 5.4. Experimental result 149 5.5. Conclusion 151 5.6. Bibliography 152 CHAPTER 6. ARTIFICIAL INTELLIGENCE TECHNIQUES FOR QUALITY CONTROL OF HARD DISK DRIVE COMPONENTS 155Wimalin LAOSIRITAWORN 6.1. Introduction 155 6.2. Artificial intelligence tasks in quality control 157 6.2.1. Classification and prediction 157 6.2.2. Cluster analysis 159 6.2.3. Time series analysis 160 6.3. AI applications in HDD component quality control 161 6.3.1. Multipanel lamination process modeling using ANN 161 6.3.2. Control chart pattern recognition with AI in actuator production 168 6.3.3. Machine clustering using AI technique 174 6.4. Conclusion 179 6.5. Bibliography 180 CHAPTER 7. BOREHOLE DIAMETER INSPECTION FOR HARD DISK DRIVE PIVOT ARMS USING HOUGH TRANSFORM IN PANORAMA IMAGES 183Sansanee AUEPHANWIRIYAKUL, Patison PALEE, Orathai SUTTIJAK and Nipon THEERA-UMPON 7.1. Introduction 183 7.2. Panorama image construction 185 7.3. Dimension estimation 189 7.4. Experiment result 190 7.5. Conclusion 195 7.6. Acknowledgment 195 7.7. Bibliography 195 CHAPTER 8. ELECTROSTATIC DISCHARGE INSPECTION TECHNOLOGIES 199Nattha JINDAPETCH, Kittikhun THONGPULL, Sayan PLONG-NGOOLUAM and Pornchai RAKPONGSIRI 8.1. Introduction 199 8.2. ESD sensitivity test technologies 200 8.2.1. Human body model testing 201 8.2.2. Charged device model testing 202 8.2.3. Machine model testing 203 8.3. Monitoring of ESD prevention equipment 204 8.3.1. Grounding and equipotential bonding systems 205 8.3.2. Ionization 206 8.3.3. Packaging 209 8.4. ESD event localization technologies 211 8.4.1. EMI locators 212 8.4.2. High-speed oscilloscope-based ESD event localization systems 214 8.4.3. RFID localization systems 215 8.4.4. WSN-based localization systems 218 8.4.5. Hybrid localization systems 220 8.5. Conclusion 221 8.6. Bibliography 221 CHAPTER 9. INSPECTION OF STYROFOAM BEADS ON ADAPTER OF HARD DISK DRIVES 225Suchart YAMMEN 9.1. Introduction 225 9.2. Morphological template-based method 227 9.2.1. Image subtraction 230 9.2.2. Otsu method 231 9.2.3. Morphological operation 232 9.2.4. Logical operation 233 9.3. Decision model 233 9.4. Application 234 9.5. Conclusion 234 9.6. Bibliography 235 CHAPTER 10. INSPECTION OF DEFECT ON MAGNETIC DISK SURFACE AND QUALITY OF THE GLUE DISPENSER ROUTE 237Anan KRUESUBTHAWORN 10.1. Introduction 238 10.2. Computer vision technologies for scratch detection on media surfaces 239 10.3. Inspection of glue dispenser route 255 10.4. Conclusion 260 10.5. Bibliography 260 CHAPTER 11. INSPECTION OF GRANULAR MICROSTRUCTURE OF FEPT FILM IN HEAT-ASSISTED MAGNETIC RECORDING MEDIA 265Paisarn MUNEESAWANG 11.1. Introduction 265 11.2. Heat-assisted media recording technology 268 11.2.1. HAMR 268 11.2.2. L10-ordered FePt as HAMR media candidate 268 11.2.3. Magnetic nanoparticle 270 11.3. Inspection procedure 272 11.3.1. Image segmentation 272 11.3.2. Separation of overlapping particles 273 11.4. Measurement of the size distribution 275 11.5. Measurement of dispersion 278 11.5.1. Lennard–Jones potential index 278 11.5.2. Experimental result 281 11.6. Conclusion 285 11.7. Bibliography 286 LIST OF AUTHORS 291 INDEX 295

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Book SynopsisWritten for scientists, researchers, and engineers, Non-volatile Memories describes the recent research and implementations in relation to the design of a new generation of non-volatile electronic memories. The objective is to replace existing memories (DRAM, SRAM, EEPROM, Flash, etc.) with a universal memory model likely to reach better performances than the current types of memory: extremely high commutation speeds, high implantation densities and retention time of information of about ten years.Table of Contents ACKNOWLEDGEMENTS xi PREFACE xiii PART 1. INFORMATION STORAGE AND THE STATE OF THE ART OF ELECTRONIC MEMORIES 1 CHAPTER 1. GENERAL ISSUES RELATED TO DATA STORAGE AND ANALYSIS CLASSIFICATION OF MEMORIES AND RELATED PERSPECTIVES 3 1.1. Issues arising from the flow of digital information 3 1.2. Current electronic memories and their classification 5 1.3. Memories of the future 8 CHAPTER 2. STATE OF THE ART OF DRAM, SRAM, FLASH, HDD AND MRAM ELECTRONIC MEMORIES 13 2.1. DRAM volatile memories 13 2.1.1. The operating principle of a MOSFET (metal oxide semiconductor field effect transistor) 14 2.1.2. Operating characteristics of DRAM memories 17 2.2. SRAM memories 19 2.3. Non-volatile memories related to CMOS technology 22 2.3.1. Operational characteristics of a floating gate MOSFET 22 2.3.2. Flash memories 38 2.4. Non-volatile magnetic memories (hard disk drives – HDDs and MRAMs) 45 2.4.1. The discovery of giant magneto resistance at the origin of the spread of hard disk drives 46 2.4.2. Spin valves 49 2.4.3. Magnetic tunnel junctions 51 2.4.4. Operational characteristics of a hard disk drive (HDD) 51 2.4.5. Characteristics of a magnetic random access memory (MRAM) 54 2.5. Conclusion 56 CHAPTER 3. EVOLUTION OF SSD TOWARD FERAM, FEFET, CTM AND STT-RAM MEMORIES 59 3.1. Evolution of DRAMs toward ferroelectric FeRAMs 60 3.1.1. Characteristics of a ferroelectric material 60 3.1.2. Principle of an FeRAM memory 63 3.1.3. Characteristics of an FeFET memory 67 3.2. The evolution of Flash memories towards charge trap memories (CTM) 77 3.3. The evolution of magnetic memories (MRAM) toward spin torque transfer memories (STT-RAM) 82 3.3.1. Nanomagnetism and experimental implications 83 3.3.2. Characteristics of spin torque transfer 84 3.3.3. Recent evolution with use of perpendicular magnetic anisotropic materials 88 3.4. Conclusions 90 PART 2. THE EMERGENCE OF NEW CONCEPTS: THE INORGANIC NEMS, PCRAM, RERAM AND ORGANIC MEMORIES 93 CHAPTER 4. VOLATILE AND NON-VOLATILE MEMORIES BASED ON NEMS 95 4.1. Nanoelectromechanical switches with two electrodes 96 4.1.1. NEMS with cantilevers 97 4.1.2. NEMS with suspended bridge 102 4.1.3. Crossed carbon nanotube networks 103 4.2. NEMS switches with three electrodes 106 4.2.1. Cantilever switch elaborated by lithographic techniques 107 4.2.2. Nanoswitches with carbon nanotubes 110 4.2.3. NEMS-FET hybrid memories with a mobile floating gate or mobile cantilever 116 4.4. Conclusion 121 CHAPTER 5. NON-VOLATILE PHASE-CHANGE ELECTRONIC MEMORIES (PCRAM) 123 5.1. Operation of an electronic phase-change memory 125 5.1.1. Composition and functioning of a GST PCRAM 125 5.1.2. The antinomy between the high resistance of the amorphous state and rapid heating 129 5.2. Comparison of physicochemical characteristics of a few phase-change materials 134 5.3. Key factors for optimized performances of PCM memories 137 5.3.1. Influence of cell geometry on the current Im needed for crystal melting 138 5.3.2. Optimization of phase-change alloy composition to improve performance 143 5.3.3. Influence of nanostructuration of the phase-change material 148 5.3.4. Recent techniques for improvement of amorphization and crystallization rates of phase-change materials 156 5.3.5. Problems related to interconnection of PCRAM cells in a 3D crossbar-type architecture 160 5.4. Conclusion 162 CHAPTER 6. RESISTIVE MEMORY SYSTEMS (RRAM) 165 6.1. Main characteristics of resistive memories 168 6.1.1. Unipolar system 169 6.1.2. Bipolar system 170 6.2. Electrochemical metallization memories 171 6.2.1. Atomic switches 174 6.2.2. Metallization memories with an insulator or a semiconductor 177 6.2.3. Conclusions on metallization memories 182 6.3. Resistive valence change memories (VCM) 183 6.3.1. The first work on resistive memories 183 6.3.2. Resistive valence change memories after the 2000s 185 6.3.3. A perovskite resistive memory (SrZrO3) with better performance than Flash memories 186 6.3.4. Electroforming and resistive switching 189 6.3.5. Hafnium oxide for universal resistive memories? 195 6.4. Conclusion 198 CHAPTER 7. ORGANIC AND NON-VOLATILE ELECTRONIC MEMORIES 201 7.1. Flash-type organic memories 204 7.1.1. Flexible FG-OFET device with metal floating gate 205 7.1.2. Flexible organic FG-OFET entirely elaborated by spin coating and inkjet printing 212 7.1.3. Flexible OFETs with charge-trap gate dielectrics 216 7.1.4. OFETs with conductive nanoparticles encapsulated in the gate dielectric 221 7.1.5. Redox dielectric OFETs 226 7.2. Resistive organic memories with two contacts 230 7.2.1. Organic memories based on electrochemical metallization 232 7.2.2. Resistive charge-trap organic memories 238 7.3. Molecular memories 244 7.4. Conclusion 248 CONCLUSION 251 BIBLIOGRAPHY 255 INDEX 285

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Book SynopsisNow in its fifth edition, bridges the gap between the technical specifications and the real world of designing and programming devices that connect over the Universal Serial Bus (USB). Readers will learn how to select the appropriate USB speed, device class, and hardware for a device; communicate with devices using Visual C#; use standard host drivers to access devices, including devices that perform vendor-defined tasks; save power with USB's built-in power-conserving protocols; and create robust designs using testing and debugging tools. This fully revised edition also includes instruction on how to increase bus speed with SuperSpeed and SuperSpeedPlus, implement wireless communications, and develop for USB On-The-Go and embedded hosts

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Book SynopsisHinrich Schröder und Arno Müller stellen einen Ansatz vor, mit dessen Hilfe die Aufgaben in der Unternehmens-IT analysiert und den Aufgabenträgern zugeordnet werden können. Mögliche Szenarien der sich so ergebenden IT-Organisation werden daraus abgeleitet und situativ beurteilt. Getrieben durch die fortschreitende Digitalisierung ergeben sich völlig neue Anforderungen an die Organisationseinheiten im Unternehmen, die für die Bereitstellung von IT-Services verantwortlich sind. Die zunehmende Komplexität der Aufgabenstellungen erfordert eine veränderte Aufgabenverteilung zwischen der IT-Abteilung, den Fachabteilungen sowie externen Partnern und führt somit zu tiefgreifenden Veränderungen der IT-Organisation.Table of ContentsCloud Computing als Treiber von Veränderungen.- Phasenmodell zur Gestaltung einer zukunftsfähigen IT-Organisation.- Aufgabenanalyse im IT-Management.- Aufgabenverteilung und mögliche Szenarien.- Rollen und notwendige Skills der Aufgabenträger.- Weiterentwicklung zur „IT der zwei Geschwindigkeiten“.

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Book SynopsisDie Harmonisierung in Europa und ein schärferer Wettbewerb machen Anpassungen bei den klassischen Instrumenten des Risikomanagements, bei Geschäftsprozessen und strategischer Steuerung erforderlich. In dem Buch werden die Zusammenhänge aufgezeigt, die für die Konzeption und erfolgreiche Umsetzung des Risikomanagements relevant sind: von den rechtlichen und regulatorischen Grundlagen über moderne Strategien und Ansätze des Risikomanagements bis hin zur Systemintegration und Bilanzierung. Eine grundlegende Orientierung für Praktiker und Studierende.Table of ContentsZusammenhänge zwischen Risikomanagement und Risiko-Softwaresystemen – Risiken verstehen, bewerten und steuern – Software als Gestaltungsinstrument – Prozesse und Software vorteilhaft nutzen – Risikomanagement erfolgreich einsetzen und im Unternehmen integrieren

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Book Synopsis

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Book Synopsis

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