Precision engineering and manufacturing Books

Book SynopsisThe Practical Watch Escapement explains the action of the escapement in terms accessible to both expert and layman.One of George Daniels'' central contributions to horology is his co-axial escapement. Having observed that the dominant lever escapement begins to change its rate after a year or two - a disturbance caused by the sliding action of the impulse elements of the escapement - Daniels set about developing a mechanism that avoided this problem.The result of his efforts was the co-axial escapement, a mechanism in which he sought to combine the strengths and eliminate the deficiencies of existing watch escapements, the lever escapement foremost among them. First devised in 1977, today it remains largely the same as fitted in watches of Daniels'' own manufacture, as well as those of several wrist-watch manufacturers.The text is accompanied by a series of detailed line drawings.Table of ContentsForeword Introduction General Principles Verge Escapement Cylinder Escapement Virgule Escapement Duplex Escapement Lever Escapement Escaping Angle Lever Angle The Draw Angle The Balance Roller The Pallets and Escape Wheel Detent Escapement The Unlocking Angle The Angle of Draw The Locking Stone Pivoted Detent The Impulse Angle Radial Impulse at Each Vibration Robin Escapement Echappement Naturel Summary Detached Escapements without lubricant Independent Double Wheel Escapement Double Radial Impulse with Single Wheel Co-Axial Escapement Extra Flat Co-Axial Escapement Symmetrical Co-Axial Escapement Photographic Plates

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Book SynopsisMany clock repairers carry out excellent work but avoid cutting their own wheels and pinions, fearing it is too complicated and involved. This book, written by an experienced clock and tool maker, dispels those fears and gives a step-by-step guide to an extremely satisfying aspect of horology. This book is written for both the amateur and professional involved in the making and restoring of clocks, and for anyone who intends to start building up a workshop and requires a guide to the equipment and how to use it.

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Book SynopsisInnovation, exclusivity, and elegance define Patek Philippe, a family-owned company with a single and passionate calling: to perfect the watch. These lavishly illustrated books present some of the most important timepieces from the more than 3,000 watches exhibited at the Patek Philippe Museum in Geneva. These precious timepieces have been passionately assembled over more than 40 years by Philippe Stern, Honorary President of the company, and include some of the most valuable pieces in watchmaking history. The books allow you to take the Patek Philippe Museum’s exhibition home with you, or, alternatively, to get a preview of its treasures before you visit. From the collection of historic watches featuring the first portable timepieces dating back to the 16th century to innovative milestones in Patek Philippe’s portfolio since its founding in 1839, each watch is reproduced with such beauty and precision that you can almost hear it ticking. With expert curatorial insight and context from Peter Friess, Conservateur of the Patek Philippe Museum, these intricate mechanisms are not only presented for themselves; they also offer a unique perspective into the cultural history of the last 500 years. True to the trust and excellence of the Patek Philippe brand, the presentation, the extraordinary book design by Birgit Binner, and content of these sumptuous publications meet the highest professional standards. They are the perfect books for the “perfect watch.”Trade Review"A handsome two-volume photo book dives into the history of the storied Swiss watchmaker... At the core of each volume is a range of photos and illustrations detailing more than 3,000 watches from the enviable Patek Philippe Museum in Geneva, with the selection itself curated by Patek Philippe Museum Director Peter Friess." - MaximAnnual Holiday Gift Guide 2023: "Two books are presented in a beautiful slipcase featuring 235 rare watches from the Patek Philippe Collection. Published by teNeues this book takes readers back to the first portable timepieces from the 16th century to the founding of Patek Philippe in 1839, through the art of modern watchmaking." - The Gentleman Racer

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Book SynopsisTwenty-eight years after its first publication, the best-selling Watchmaking continues to inspire and encourage the art of watchmaking, especially among new generations of enthusiasts. As a supreme master of his art, George Daniels'' advice is constantly sought by both students and watch repairers, his understanding of the problems that can beset the would-be watchmaker, especially in an age of mass production, and his expert knowledge of the history of watchmaking being second to none.Here, the making of the precision timekeeper is described step-by-step and illustrated at each stage with line drawings and brief explanatory captions. The text is easy to follow and care has been taken to avoid complicated technical descriptions. As Daniels is particularly interested in the development of the escapement - many are described in this book, several of his own design - the reader is encouraged to explore this aspect of watchmaking in even greater detail.This classiTrade ReviewI truly believe that this book [...] will be held in high esteem both by its future collectors, as well as by the common watch enthusiast looking for a publication that summarizes their favorite hobby and presents its secrets in an easily understandable way. * A Blog to Watch *Watchmaking by George Daniels is a very fascinating book, a must read for everybody interested in the watchmaking. * www.learnwatchmaking.com *Table of ContentsAcknowledgements Preface to the Third Edition Preface The Colour Plates 1. Workshop and Equipment 2. Hand Tools 3. Finishing Steel and Brass 4. Turning 5. Wheels and Pinions 6. Making Small Components 7. Jewelling 8. Escapements 9. Mainsprings and Accessories 10. Movement Design 11. The Balance and Spring 12. Casemaking 13. Engine-Turned Cases and Dials Select Bibliography Appendices Index

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Book SynopsisProvides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals includTrade Review Table of ContentsForeword. Introduction. Part 1: Fundamentals. 1. Surface and Colloidal Chemical Aspects of Wet Cleaning (Srtni Raghavan, Manish Keswani, and Nandini Venkataraman). 1.1 Introduction to Surface Chemical Aspects of Cleaning. 1.2 Chemistry of Solid-Water Interface. 1.3 Particulate Contamination: Theory and Measurements. 1.4 Influence of Surface Electrical Charges on Metal Ion Adsorption. 1.5 Wettability of Surfaces. 1.6 High Aspect Ratio Cleaning: Narrow Structures. 1.7 Surface Tension Gradient: Application to Drying. 1.8 Summary. 2. The Chemistry of Wet Cleaning (D. Martin Knotter). 2.1 Introduction to Aqueous Cleaning. 2.2 Overview of Aqueous Cleaning Processes. 2.3 The SC-1 Clean or APM. 2.4 The SC-2 clean or HPM. 2.5 Sulfuric Acid-Hydrogen Peroxide Mixture. 2.6 Hydrofluoric Acid. The Chemistry of Wet Etching (D. Martin Knotter). 3.1 Introduction and Overview. 3.2 Silicon Dioxide Etching. 3.3 Silicon Etching. 3.4 Silicon Nitride Etching. 4. Surface Phenomena: Rinsing and Drying (Karen A. Reinhardt, Richard F. Reidy, and John A. Marsella). 4.1 The Surface Phenomena of Rinsing and Drying. 4.2 Overview of Rinsing. 4.3 Overview of Drying. 5. Fundamental Design of Chemical Formulations (Robert J. Rovito, Michael B. Korzenski, Ping Jiang, and Karen A. Reinhardt). 5.1 Introduction and Overview. 5.2 Historical Development of Formulations for the Integrated Circuit Industry. 5.3 Mechanism of Stripping, Cleaning, and Particle Removal. 5.4 Components and Additives in Chemical Formulations. 5.5 Creating Chemical Formulations. 5.6 Environmental, Safety, and Health Aspects. Filtering, Recirculating, Reuse, and Recycling of Chemicals (Barry Gotlinsky, Kevin T. Pate, and Donald C. Grant). 6.1 Overview of Wet Chemical Contamination Control 193 6.2 Bulk Chemical Distribution for Wet Cleaning Tools. 6.3 Chemical Distribution, Filtering, and Recirculation. 6.4 Contamination Control Metrology. 6.5 Effects of Contamination. 6.6 Filtration. 6.7 Chemical Blending, Recycling, and Reuse. 6.8 Summary. Part 2: Applications. 7. Cleaning Challenges of High-K/Metal Gate Structures (Muhammad M. Hussain, Denis Shamiryan, Vasile Paraschiv, Kenichi Sano, and Karen A. Reinhardt). 7.1 Introduction and Overview of High-k/Metal Gate Surface Preparation. 7.2 Surface Preparation and Cleaning. 7.3 Wet Film Removal. 7.4 High-K Removal. 7.5 Resist Stripping and Residue Removal. High Dose Implant Stripping (Karen A. Reinhardt and Michael B. Korzenski). 8.1 Introduction and Overview of High Dose Implant Stripping. 8.2 High Dose Implant Cleaning and Stripping Processes. 8.3 Plasma Processing. 8.4 Wet Processing. 8.5 Other Processing. Aluminum Interconnect Cleaning and Drying (David J. Maloney). 9.1 Introduction to Aluminum Interconnect Cleaning. 9.2 Source of Post-Etch Residues Requiring Wet Cleaning. 9.3 Chemistry Considerations for Cleans Following Etching. 9.4 Rinsing/Drying and Equipment Considerations. 9.5 Alternative and Emerging Cleaning Technologies. 10. Low-k/CU Cleaning and Drying (Karen A. Reinhardt, Richard F. Reidy, and Jerome Daviot). 10.1 Introduction and Overview. 10.2 Stripping and Post-etch Residue Removal. 10.3 Pore Sealing and Plasma Damage Repair. 10.4 Post-chemical Mechanical Polishing Cleaning. 11. Corrosion and Passivation of Copper (Darryl W. Peters). 11.1 Introduction and Overview 395 11.2 Copper Corrosion. 11.3 Copper Corrosion Inhibitors. 11.4 Copper Cleaning Formulations. 12. Germanium Surface Conditioning and Passivation (Sonja Sioncke, Yves J. Chabal, and Martin M. Frank). 12.1 Introduction. 12.2 Germanium Cleaning. 12.3 Surface Passivation and Gate Stack Interface Preparation. 13. Wafer Reclaim (Michael B. Korzenski and Ping Jiang). 13.1 Introduction to Wafer Reclaim. 13.2 Introduction to Silicon Manufacturing for Semiconductor Applications. 13.3 Energy Requirements for Silicon Wafer Manufacturing. 13.4 Test Wafer Usage and Wafer Reclaim. 13.5 Requirements for Wafer Reclaim and Recycle. 13.6 Wafer Reclaim Options. 13.7 Types of Wafer Reclaim Processes. 13.8 Formulated Reclaim Solutions. 14. Direct Wafer Bonding Surface Conditioning (Hubert Moriceau, Yannick C. Le Tiec, Frank Fournel, Ludovic F. L. Ecarnot, Sébastien L. E. Kerdilès, Daniel Delprat, and Christophe Maleville). 14.1 Introduction and Overview of Bonding. 14.2 Planarization and Smoothing Prior to Bonding. 14.3 Wet Cleaning and Surface Conditioning Processing. 14.4 Dry Surface Conditioning Processing. 14.5 Thermal Treatments and Annealing. 14.6 Conductive Bonding. Part 3: New Directions. 15. Novel Analytical Methods for Cleaning Evaluation (Chris M. Sparks and Alain C. Diebold). 15.1 Introduction. 15.2 Novel Analytical Methods. 15.3 Recent Advances in Total Reflection X-ray Fluorescence Spectroscopy Analysis. 15.4 Advances in Vapor Phase Analysis. 15.5 Trace Metal Contamination on the Edge and Bevel of a Wafer. 15.6 Kelvin Probe Technologies. 15.7 Novel Applications of Electron Spectroscopy Techniques. 15.8 Novel X-ray Spectroscopy Techniques. 15.9 Electrochemical Sensors. 15.10 Summary. 16. Stripping and Cleaning for Advanced Photolithography Applications (John A. Marsella, Dana L. Durham, and Leslie D. Molnar). 16.1 Introduction to Advance Stripping Applications. 16.2 Historical Background. 16.3 Recent Trends for Photoresist Stripping and Post-etch Residue Removal. 16.4 Single Wafer Tools. 16.5 Wetting in Small Dimensions and Cleaning Challenges. 16.6 Environmental Health and Safety. 16.7 The Future of Advanced Photoresist Stripping and Cleaning. Index.

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Book SynopsisMicro-Cutting: Fundamentals and Applications comprehensively covers the state of the art research and engineering practice in micro/nano cutting: an area which is becoming increasingly important, especially in modern micro-manufacturing, ultraprecision manufacturing and high value manufacturing. This book provides basic theory, design and analysis of micro-toolings and machines, modelling methods and techniques, and integrated approaches for micro-cutting. The fundamental characteristics, modelling, simulation and optimization of micro/nano cutting processes are emphasized with particular reference to the predictabilty, producibility, repeatability and productivity of manufacturing at micro and nano scales. The fundamentals of micro/nano cutting are applied to a variety of machining processes including diamond turning, micromilling, micro/nano grinding/polishing, ultraprecision machining, and the design and implementation of micro/nano cutting process chains andTable of ContentsList of Contributors xi Series Preface xiii Preface xv Part One Fundamentals 1 1 Overview of Micro Cutting 3 Dehong Huo and Kai Cheng 1.1 Background and Scope 3 1.1.1 Micro Manufacturing 3 1.1.2 History and Development Process of Micro Cutting 5 1.1.3 Definition and Scope of Micro Cutting 7 1.1.4 Micro Cutting and Nanometric Cutting 8 1.2 Materials in Micro Cutting 10 1.3 Micro Cutting Processes 11 1.3.1 Micro Turning 12 1.3.2 Micro Milling 12 1.3.3 Micro Drilling 13 1.3.4 Micro Grinding 14 1.4 Micro Cutting Framework 14 References 16 2 Micro Cutting Mechanics 19 Dehong Huo and Kai Cheng 2.1 Introduction 19 2.2 Characterization of Micro Cutting 20 2.2.1 Micro Cutting and Ultra-Precision Machining 21 2.2.2 Enabling Technologies for Micro Cutting 22 2.3 Micro Cutting Mechanics 25 2.3.1 Size Effects 26 2.3.2 Chip Formation and Minimum Chip Thickness 27 2.3.3 Specific Cutting Energy and Micro Cutting Force Modelling 29 2.3.4 Surface Generation and Burr Formation 33 2.4 Micro Machinability Issues and the Scientific Approaches 39 2.4.1 Vibration Assisted Micro Cutting 40 2.4.2 Laser Assisted Micro Cutting 40 2.5 Summary 41 References 42 3 Micro Tooling Design and Manufacturing 45 Paul T. Mativenga, Ampara Aramcharoen and Dehong Huo 3.1 Tool Size and Machining Scale 45 3.2 Manufacturing Methods for Solid Shank Micro Tools 46 3.3 Coatings and Coated Solid Shank Micro Tools 48 3.3.1 Closed Field Unbalanced Magnetron Sputter Ion Plating (CFUBMSIP) 50 3.3.2 Coating Layout 50 3.4 Importance of Coated Micro Tools 52 3.5 Diamond Micro Cutting Tools 53 3.6 Micro Cutting Tool Wear 55 3.7 Smart Cutting Tools 58 References 59 4 Ultraprecision and Micro Machine Tools for Micro Cutting 63 Christian Brecher and Christian Wenzel 4.1 Introduction 63 4.2 Components of High Precision Machine Tools 64 4.2.1 Machine Base Materials 65 4.2.2 Drive Systems 66 4.2.3 Guidance Systems 69 4.2.4 Control Systems and Amplifiers 70 4.3 Diamond Turning Machines and Components 70 4.3.1 Typical Machine Setup 71 4.3.2 Market Comparison 73 4.3.3 Fast Tool Servo Technology 78 4.4 Precision Milling Machines 79 References 85 5 Engineering Materials for Micro Cutting 87 Sathyan Subbiah and Shreyes N. Melkote 5.1 Introduction 87 5.2 ‘Size’ Effects 88 5.3 Strain and Stress in Cutting 90 5.4 Elastic and Plastic Behaviours at the Micro-scale 94 5.5 Fracture 99 5.6 Metals, Brittle Materials and Others 105 5.6.1 Pure Materials 105 5.6.2 Ductile Metals 106 5.6.3 Brittle Materials – Glass, Silicon, Germanium, Tungsten Carbide 107 5.6.4 Other Materials – Amorphous Alloys, Graphene and Embedded Polymers 108 5.7 Summary 111 References 112 6 Modelling and Simulation of Micro Cutting 115 Ying-Chun Liang, Qing-Shun Bai and Jia-Xuan Chen 6.1 FE modelling and Analysis 116 6.1.1 Finite Element Model 116 6.1.2 Simulation on Micro-burr Formation 117 6.1.3 Influence of the Tool Edge Radius on Cutting Forces 118 6.1.4 Stress Distribution on the Micro-cutter 120 6.1.5 Micro-tool-tip Breakage 120 6.1.6 Thermal Analysis on Micro Cutting 123 6.2 Molecular Dynamics (MD) Modelling and Analysis 124 6.2.1 MD Modelling Process and Simulation 124 6.2.2 Modelling Analysis of Micro Cutting 127 6.2.3 Scratching Simulation by Using MD 128 6.2.4 Friction and Wear Simulation by Using MD 132 6.2.5 Effect of the Crystal Plane of Single Crystal and Multicrystalline 135 6.2.6 Improvement of the MD Simulation Capability 137 6.3 Multiscale Modelling and Analysis 138 6.3.1 Advance in Multiscale Simulation Methods 140 6.3.2 Applications of Multiscale Simulation in Micro Cutting Processes 143 6.3.3 Research Challenges and Future Trends 147 6.4 Summary 148 References 148 Part Two Applications 153 7 Diamond Turning and Micro Turning 155 Dehong Huo and Kai Cheng 7.1 Introduction 155 7.2 Ultra-precision Diamond Turning 155 7.2.1 A Historical Perspective of Diamond Turning 156 7.2.2 Material Perspectives 158 7.2.3 Micro Structuring by Diamond Turning 159 7.3 Micro Turning 166 7.3.1 Micro Turning Tool Fabrication 166 7.3.2 Micro Machines for Micro Turning 171 7.3.3 Size Effect Arising from Micro Turning 178 7.4 Challenges Arising from Micro Turning 182 References 182 8 Micro Milling: The State-of-the-art Approach Towards Applications 185 Tao Wu and Kai Cheng 8.1 Introduction 185 8.2 Fundamental Elements in Micro Milling 186 8.2.1 Micro Milling Machines 187 8.2.2 Cutting Tools 189 8.2.3 Process Conditions 195 8.2.4 Work Materials 197 8.3 Micro Milling Mechanics 198 8.3.1 Size Effect in Micro-Scale Cutting 198 8.3.2 Minimum Chip Thickness 200 8.3.3 Work Micro Structure Effect 203 8.4 Modelling of the Micro Milling Process 205 8.4.1 Finite Element Modelling 206 8.4.2 Mechanistic Modelling 208 8.5 Metrology and Instrumentation 212 8.5.1 3D Surface Profilers 212 8.5.2 Microscopes 212 8.5.3 Process Monitoring Sensors and Systems 214 8.6 Scientific and Technological Challenges 217 8.6.1 Tool Run-out 217 8.6.2 Tool Wear and Life 218 8.6.3 Micro-Burr Formation 218 8.6.4 Process Conditions Optimization 219 8.7 Application Perspectives 220 8.8 Concluding Remarks 220 References 221 9 Micro Drilling Applications 227 M. J. Jackson, T. Novakov and K. Mosiman 9.1 Chapter Overview 227 9.2 Investigation of Chatter in Mesoscale Drilling 227 9.2.1 Torsional-axial Model 231 9.2.2 Bending Model 239 9.2.3 Combination of the Bending and Torsional-axial Models 242 9.2.4 Chatter Suppression 251 9.2.5 Research Challenges 256 9.3 Investigation of Chatter in Micro Drilling 257 9.4 Case Study: Micro Drilling Medical Polymer Materials and Composites 265 9.4.1 Tooling Selection 266 9.4.2 Cutting Mechanisms and Considerations 267 9.4.3 Drilling 268 9.4.4 Burr Elimination when Drilling Polymers 269 9.5 Conclusions 270 Acknowledgements 271 References 272 10 Micro Grinding Applications 275 Han Huang 10.1 Introduction 275 10.2 Principles and Methodologies 278 10.2.1 Removal Mechanism in the Grinding of Brittle Materials 278 10.2.2 Interaction Between a Work Material and Diamond Abrasives 280 10.2.3 Grinding Approaches for Micro Grinding 285 10.3 Implementation Perspectives 286 10.3.1 Truing and Dressing 286 10.3.2 Characterization of Wheel Topography and Cutting Edge Distribution 287 10.3.3 Measurement of Grit Height Distribution 291 10.3.4 Characterization of Abrasive Wear 292 10.3.5 Compensation Grinding 292 10.3.6 Pragmatic Aspects in Profile Grinding 297 10.3.7 Parametric Effects in Profile Grinding 298 10.4 Application Cases 299 10.4.1 Micro Grinding of Aspherical Moulds 299 10.4.2 Micro Grinding of Optical Fibre Connectors 305 Acknowledgements 311 References 311 11 In-Process Micro/Nano Measurement for Micro Cutting 315 Wei Gao, Kang-Won Lee, Young-Jin Noh, Yoshikazu Arai and Yuki Shimizu 11.1 Introduction 315 11.2 The Hybrid Instrument for Micro Cutting and In-process Measurement 316 11.3 In-process Measurement of Micro Cutting Force 326 11.4 In-process Measurement of Micro Wear of Cutting Tool 331 11.5 In-process Measurement of Micro Surface Form 337 11.6 Summary 342 References 343 Index 345

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Book SynopsisThe development of near-field optics marked a major advance in microscopy and our ability to develop nanoscale technologies. However, the tapered optical fiber widely in use as the optical near-field probe has serious limitations in its fabrication, its optical transmission efficiency, and its use in arrays.Fabrication of Silicon Microprobes for Optical Near-Field Applications reports on several technological approaches to using silicon micromachining techniques for fabricating microprobes without the drawbacks of conventional optical fiber probes. The authors have developed a simple, effective method for batch-process production of silicon cantilevered probes with apertures as small as 20 nanometers. They have investigated in detail the probes'' optical performance characteristics and show how the silicon probes overcome the limitations of the optical fiber probes in terms of production throughput, optical throughput, reproducibility, simplicity of instrumentation, and mechaniTrade Review"All in all, I found this book interesting, well organized, and easy to understand. Written crisply and to the point, it satisfyingly balances mathematical method with experimental results." – Pouria Valley, University of Arizona, in IEEE Circuits & Devices Magazine, July/August 2006, Vol. 22, No. 4Table of ContentsIntroduction. Introduction of Near-Field Optics. Introduction of Silicon Micromachining Technology. Fabrication of Silicon Microprobes for Optical Near-Field Applications. Evaluation of the Microfabricated Optical Near-Field Probes. Novel Probes for Locally Enhancing of Near-Field Light and Other Applications. Using Finite Difference Time Domain Method. Sub-Wavelength Optical Imaging with the Fabricated Probes. Optical Near-Field Lithography . Optical Near-Field Recording with the Fabricated Aperture Array. Future Aspect and Conclusions.

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Book SynopsisThis book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman’s visionary talk “There is Plenty of Room at the Bottom” to propose that the time has come to see silicon sensors as part of a “Feynman Roadmap” instead of the “More-than-Moore” technology roadmap. The sharing of the author’s industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.Table of Contents1. Silicon as Sensor Material2. Epitaxial Growth3. Thin Film Deposition4. Thin Films Characterization & Metrology5. Dry silicon etch 6. Lithography7. HF Release 8. Galvanic growth9. Wet Etch and Cleaning 10. Piezoelectric materials 11. Wafer to wafer Bonding12. Linear and non linear mechanichs in MEMS 13. Inertial sensors 14. Magnetometer15. MEMS microphones 16. Pressure Sensors17. Enviromental Sensors18. Mirror19. Piezo ink jet printers20. Speakers21. Autofocus22. Electronic sensors front-end23. Electronic Interfaces for actuators24. Package25. Testing26. Reliability27. The future of sensor and actuators

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Book Synopsis Is specifically for MedTech entrepreneurs Covers all major steps in the development of a new medical device and bringing it to the market Analyzes product roadmap, common pitfalls, and factors, which can increase chances for success Discusses in each chapter a particular aspect of the MedDev startup roadmap: regulatory, fundraising, business model, IP protection Is primarily based on the US market but is also illustrated with examples from Europe and Canada Table of Contents1. Introduction, Part I: Road to Market, 2. Regulatory Environment, 3. Prerequisites, 4. Product Development Process, 5. Timelines and Capital, Part II: Important Ingredients, 6. Funding, 7. IP and Other Moats, 8. Business Model, 9. Other Considerations, 10. Silver Lining

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