Description
Book SynopsisThis book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman’s visionary talk “There is Plenty of Room at the Bottom” to propose that the time has come to see silicon sensors as part of a “Feynman Roadmap” instead of the “More-than-Moore” technology roadmap. The sharing of the author’s industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
Table of Contents1. Silicon as Sensor Material
2. Epitaxial Growth3. Thin Film Deposition4. Thin Films Characterization & Metrology5. Dry silicon etch 6. Lithography7. HF Release 8. Galvanic growth9. Wet Etch and Cleaning 10. Piezoelectric materials 11. Wafer to wafer Bonding12. Linear and non linear mechanichs in MEMS 13. Inertial sensors 14. Magnetometer15. MEMS microphones 16. Pressure Sensors17. Enviromental Sensors18. Mirror19. Piezo ink jet printers20. Speakers21. Autofocus22. Electronic sensors front-end23. Electronic Interfaces for actuators24. Package25. Testing26. Reliability27. The future of sensor and actuators
