Description

Book Synopsis
Offers coverage of some of the major topics related to the performance and failure of materials used in electronic devices and electronics packaging. This book explains the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage.

Table of Contents
1. An Overview of Electronic Devices and Their Reliability 2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated 3. Defects, Contamination and Yield 4. The Mathematics of Failure and Reliability 5. Mass Transport-Induced Failure 6. Electronic Charge-Induced Damage 7. Environmental Damage to Electronic Products 8. Packaging Materials, Processes, and Stresses 9. Degradation of Contacts and Packages 10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices 11. Characterization and Failure Analysis of Material, Devices and Packages 12. Future Directions and Reliability Issues

Reliability and Failure of Electronic Materials and Devices

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    A Hardback by Milton Ohring, Lucian Kasprzak

    15 in stock

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      Publisher: Academic Press
      Publication Date: 10/23/2014 12:00:00 AM
      ISBN13: 9780120885749, 978-0120885749
      ISBN10: 0120885743
      Also in:
      Electronic devices and materials Electronics engineering Electronics: circuits and components

      Description

      Book Synopsis
      Offers coverage of some of the major topics related to the performance and failure of materials used in electronic devices and electronics packaging. This book explains the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage.

      Table of Contents
      1. An Overview of Electronic Devices and Their Reliability 2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated 3. Defects, Contamination and Yield 4. The Mathematics of Failure and Reliability 5. Mass Transport-Induced Failure 6. Electronic Charge-Induced Damage 7. Environmental Damage to Electronic Products 8. Packaging Materials, Processes, and Stresses 9. Degradation of Contacts and Packages 10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices 11. Characterization and Failure Analysis of Material, Devices and Packages 12. Future Directions and Reliability Issues

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