Other manufacturing technologies Books
Taylor & Francis Inc Improving the Extended Value Stream: Lean for the
Book SynopsisThis book discusses a system for extending lean manufacturing across the entire supply chain. It is divided into three parts: planning and analysis of the lean extended value stream, implementation of a lean supply chain and sustaining and continuously improving the lean extended value chain.Table of ContentsAcknowledgments -- Introduction -- Part I: Planning and Analysis of the Lean Extended Value Stream -- Part II: Implementation of the Lean Supply Chain -- Part III: Sustaining and Continuously Improving the Lean Extended Value Stream -- Recommended Readings -- Index -- About the Author.
£52.99
Taylor & Francis Inc Validating Medical Packaging
Book SynopsisAccording to the FDA Quality System Regulations, manufacturers must ensure that "device packaging and shipping containers are designed and constructed to protect the device from alteration or damage during the customary conditions of processing, storage, handling, and distribution." As specific as this statement is, the FDA does not provide instructions on how to achieve their standards. Validating Medical Packaging demystifies the validation procedure for medical device packaging by providing specific examples and templates for creating and maintaining a validation file.About the author: Ronald Pilchik has over 30 years of experience in the healthcare manufacturing industry. As principal of the Techmark Group, he provided consulting services to diverse multinational manufacturers on selecting, developing, and validating medical packaging compatible with their sterilization requirements. He has been chairman of the healthcare packaging section of TAPPI, the packaging committee of HIMA, and a member of AAMI's ISO198 working group on packaging. Mr. Pilchik is program chairman of the HealthPack Conference Series on medical device packaging.Table of ContentsINTRODUCTION. What is Validation? PACKAGE DESIGN VALIDATION. Elements of Package Design. Package Design Issues. Validation Flow Chart. Simulation Criteria. Qualified Suppliers. PACKAGE PROCESS VALIDATION. Introduction. Process Validation. IQ, OQ, PQ. Process Capability Studies. Example. PUTTING IT ALL TOGETHER: THE VALIDATION PROTOCOL. The Validation File. File Maintenance. Employing the Process. Example. REGULATORY ACTIVITIES. Selected Case Studies. Packaging Non-Compliances. Industry Generated Support Documents. HACCP. Appendix.
£228.00
Capital Transport Publishing London Clocks
Book Synopsis
£7.72
NMSE - Publishing Ltd The Millennium Clock Tower
Book SynopsisThe Millennium Clock first chimed on 1 January 2000 and crowds still gather round it in the National Museum of Scotland. The finished clock tower echoes the form of a medieval cathedral, standing just over ten metres high. It marks the passing of time but is also a summary of the best and worst of the twentieth century. The animated construction comprises four sections: The Crypt, The Nave, The Belfry and The Spire. Each has its own stories to tell and secrets to reveal. This edition is in a new format and has 12 superb replacement photographs which give close-ups of some of the clock's intricate details. The clock tower is a collaboration between E Bersudsky, A Sandstrom, T Stead and J Tubbecke.
£6.16
Arnoldsche Die Wand- und Bodenstanduhren der
Book SynopsisThis two-volume publication illustrates the evolutionary history of the pendulum clock from the early Age of Metternich and provides detailed explanations on their engineering. In addition, it contains a catalogue with almost 400 wall and longcase clocks, most of which have never been published, and a unique index with over 14,000 entries on clockmakers from all over the Austrian Empire, including a vast amount of previously unknown masters and workshops. It also includes biographical information on the makers, locations of the workshops, masterpieces and exhibits from trade exhibitions, inventions, characteristic features of the pieces, sales outlets, and the prices of the time. An indispensable compendium on classic longcase and wall clocks of the Austrian Empire and a major reference work for all those with an interest in clocks! Text in German.
£238.50
Pan Stanford Publishing Pte Ltd Block Copolymer Nanocomposites
Book SynopsisThis book provides a comprehensive overview of the synthesis and characterization of nanocomposites based on block copolymers. Because of the self-assembly capability of block copolymers for the generation of nanostructures, besides their ability to nanostructure thermosetting matrices such as epoxy and polyester, binary or ternary nanocomposites can be prepared with different nanofillers such as nanoparticles and carbon nanotubes. The book starts with a review on nanocomposites based on block copolymers and nanoparticles synthesized with the use of surfactants, followed by a review on nanocomposites with metallic nanoparticles with polymer brushes and those with carbon nanotubes. A chapter is devoted to binary systems based on block copolymers and nanoparticles synthesized by sol-gel. A review on nanocomposites based on thermosetting matrices nanostructured with block copolymers (amphiphilic or chemically modified) is also presented for both epoxy and polyester resins. The work on ternary systems based on thermosetting matrices, block copolymers, and nanoparticles is presented next. The book concludes with a discussion on nanocomposites based on epoxy and block copolymers with azobenzene groups for optical purposes.Trade Review"This book includes a wide variety of examples of block copolymer nanocomposites and their applications. It documents the enormous progress made in the field in order to use very simple strategies to tailor the surface of nanoparticles into a block copolymer. The chapters are supplemented by comprehensive bibliographies. The book will be immensely useful for polymer chemists, engineers, metallurgists, and all those who are interested in materials science."—Prof. Deodato Radic, Pontificia Universidad Católica de Chile, ChileTable of ContentsSurfactant-treated nanoparticles confinement into block copolymer domains. Nanocomposites based on block copolymers and metallic nanoparticles grafted with polymer brushes. Nanocomposites based on block copolymers and carbon nanotubes. Block copolymer-assisted sol gel templating. Nanostructured epoxy based thermosetting materials modified with amphiphilic block copolymers. Chemically functionalized block copolymers as reactive modifiers for nanostructuring and toughening epoxy thermosetting materials. Nanostructuration of unsaturated polyester resins using block copolymers. Block copolymers as template for the design of advanced multifunctional hybrid nanostructured thermosetting materials. Reversible photoinduced birefringence in epoxy polymers, block copolymers and nanostructured thermosetting systems containing azobenzene groups.
£94.04
John Wiley & Sons Inc Wood Furniture Finishing Refinishing Repairing
Book SynopsisThe primary emphasis of this updated third edition is on the application of various types of finishes to wood furniture. It also contains chapters on furniture repair and the preparation of wood surfaces.Table of ContentsForeword. Acknowledgments. 1. Introduction to Wood Finishing. 2. Finishing Tools and Supplies. 3. Types of Wood. 4. Introduction to Finish Technology. 5. Veneering. 6. Inlaying. 7. Repairing and Restoring. 8. Stripping Finishes. 9. Wood Preparation. 10. Staining. 11. Shellac Finishes. 12. Varnish Finishes. 13. Lacquer Finishes. 14. Paint and Enamel Finishes. 15. Oil and Wax Finishes. 16. Rubbing, Waxing, and Polishing Finishes. 17. Antiquing (Glazing) and Related Techniques. 18. Gilding and Bronzing. 19. Decorating Furniture. 20. Safety: Fire, Health, and the Environment. Glossary. References. Index.
£45.86
John Wiley & Sons Inc Audel Promoting and Marketing Your Crafts
Book SynopsisProvides the craftsperson with the guidance needed to promote, market and sell his or her arts and crafts. The book offers a wide range of techniques, starting with a business plan, and explains the processes of obtaining media exposure, locating promotional tools, and selecting outlets.
£12.99
The University of Chicago Press The Nature of the Book
Book SynopsisThis text takes a detailed look at early modern England and the creative and commercial forces in which print culture was formed (commercial, intellectual, political and individual), including replications of the disputes between authors and printers to political/religious manipulation.Table of ContentsList of Illustrations Acknowledgments A Note on Conventions 1: Introduction: The Book of Nature and the Nature of the Book 2: Literatory Life: The Culture and Credibility of the Printed Book in Early Modern London 3: "The Advancement of Wholesome Knowledge": The Politics of Print and the Practices of Propriety 4: John Streater and the Knights of the Galaxy: Republicanism, Natural Knowledge, and the Politics of Printing 5: Faust and the Pirates: The Cultural Construction of the Printing Revolution 6: The Physiology of Reading: Print and the Passions 7: Piracy and Usurpation: Natural Philosophy in the Restoration 8: Histories of the Heavens: John Flamsteed, Isaac Newton, and the Historia Coelestis Britannica 9: Conclusion Bibliography Index
£46.55
The University of Chicago Press The Nature of the Book
Book SynopsisThis analysis of print culture and its many arenas - commercial, intellectual, political and individual - looks at how authors, printers, booksellers and readers competed for power over the printed page.
£37.00
John Wiley & Sons Inc Handbook for Cleaning for Semiconductor
Book SynopsisProvides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals includTrade Review Table of ContentsForeword. Introduction. Part 1: Fundamentals. 1. Surface and Colloidal Chemical Aspects of Wet Cleaning (Srtni Raghavan, Manish Keswani, and Nandini Venkataraman). 1.1 Introduction to Surface Chemical Aspects of Cleaning. 1.2 Chemistry of Solid-Water Interface. 1.3 Particulate Contamination: Theory and Measurements. 1.4 Influence of Surface Electrical Charges on Metal Ion Adsorption. 1.5 Wettability of Surfaces. 1.6 High Aspect Ratio Cleaning: Narrow Structures. 1.7 Surface Tension Gradient: Application to Drying. 1.8 Summary. 2. The Chemistry of Wet Cleaning (D. Martin Knotter). 2.1 Introduction to Aqueous Cleaning. 2.2 Overview of Aqueous Cleaning Processes. 2.3 The SC-1 Clean or APM. 2.4 The SC-2 clean or HPM. 2.5 Sulfuric Acid-Hydrogen Peroxide Mixture. 2.6 Hydrofluoric Acid. The Chemistry of Wet Etching (D. Martin Knotter). 3.1 Introduction and Overview. 3.2 Silicon Dioxide Etching. 3.3 Silicon Etching. 3.4 Silicon Nitride Etching. 4. Surface Phenomena: Rinsing and Drying (Karen A. Reinhardt, Richard F. Reidy, and John A. Marsella). 4.1 The Surface Phenomena of Rinsing and Drying. 4.2 Overview of Rinsing. 4.3 Overview of Drying. 5. Fundamental Design of Chemical Formulations (Robert J. Rovito, Michael B. Korzenski, Ping Jiang, and Karen A. Reinhardt). 5.1 Introduction and Overview. 5.2 Historical Development of Formulations for the Integrated Circuit Industry. 5.3 Mechanism of Stripping, Cleaning, and Particle Removal. 5.4 Components and Additives in Chemical Formulations. 5.5 Creating Chemical Formulations. 5.6 Environmental, Safety, and Health Aspects. Filtering, Recirculating, Reuse, and Recycling of Chemicals (Barry Gotlinsky, Kevin T. Pate, and Donald C. Grant). 6.1 Overview of Wet Chemical Contamination Control 193 6.2 Bulk Chemical Distribution for Wet Cleaning Tools. 6.3 Chemical Distribution, Filtering, and Recirculation. 6.4 Contamination Control Metrology. 6.5 Effects of Contamination. 6.6 Filtration. 6.7 Chemical Blending, Recycling, and Reuse. 6.8 Summary. Part 2: Applications. 7. Cleaning Challenges of High-K/Metal Gate Structures (Muhammad M. Hussain, Denis Shamiryan, Vasile Paraschiv, Kenichi Sano, and Karen A. Reinhardt). 7.1 Introduction and Overview of High-k/Metal Gate Surface Preparation. 7.2 Surface Preparation and Cleaning. 7.3 Wet Film Removal. 7.4 High-K Removal. 7.5 Resist Stripping and Residue Removal. High Dose Implant Stripping (Karen A. Reinhardt and Michael B. Korzenski). 8.1 Introduction and Overview of High Dose Implant Stripping. 8.2 High Dose Implant Cleaning and Stripping Processes. 8.3 Plasma Processing. 8.4 Wet Processing. 8.5 Other Processing. Aluminum Interconnect Cleaning and Drying (David J. Maloney). 9.1 Introduction to Aluminum Interconnect Cleaning. 9.2 Source of Post-Etch Residues Requiring Wet Cleaning. 9.3 Chemistry Considerations for Cleans Following Etching. 9.4 Rinsing/Drying and Equipment Considerations. 9.5 Alternative and Emerging Cleaning Technologies. 10. Low-k/CU Cleaning and Drying (Karen A. Reinhardt, Richard F. Reidy, and Jerome Daviot). 10.1 Introduction and Overview. 10.2 Stripping and Post-etch Residue Removal. 10.3 Pore Sealing and Plasma Damage Repair. 10.4 Post-chemical Mechanical Polishing Cleaning. 11. Corrosion and Passivation of Copper (Darryl W. Peters). 11.1 Introduction and Overview 395 11.2 Copper Corrosion. 11.3 Copper Corrosion Inhibitors. 11.4 Copper Cleaning Formulations. 12. Germanium Surface Conditioning and Passivation (Sonja Sioncke, Yves J. Chabal, and Martin M. Frank). 12.1 Introduction. 12.2 Germanium Cleaning. 12.3 Surface Passivation and Gate Stack Interface Preparation. 13. Wafer Reclaim (Michael B. Korzenski and Ping Jiang). 13.1 Introduction to Wafer Reclaim. 13.2 Introduction to Silicon Manufacturing for Semiconductor Applications. 13.3 Energy Requirements for Silicon Wafer Manufacturing. 13.4 Test Wafer Usage and Wafer Reclaim. 13.5 Requirements for Wafer Reclaim and Recycle. 13.6 Wafer Reclaim Options. 13.7 Types of Wafer Reclaim Processes. 13.8 Formulated Reclaim Solutions. 14. Direct Wafer Bonding Surface Conditioning (Hubert Moriceau, Yannick C. Le Tiec, Frank Fournel, Ludovic F. L. Ecarnot, Sébastien L. E. Kerdilès, Daniel Delprat, and Christophe Maleville). 14.1 Introduction and Overview of Bonding. 14.2 Planarization and Smoothing Prior to Bonding. 14.3 Wet Cleaning and Surface Conditioning Processing. 14.4 Dry Surface Conditioning Processing. 14.5 Thermal Treatments and Annealing. 14.6 Conductive Bonding. Part 3: New Directions. 15. Novel Analytical Methods for Cleaning Evaluation (Chris M. Sparks and Alain C. Diebold). 15.1 Introduction. 15.2 Novel Analytical Methods. 15.3 Recent Advances in Total Reflection X-ray Fluorescence Spectroscopy Analysis. 15.4 Advances in Vapor Phase Analysis. 15.5 Trace Metal Contamination on the Edge and Bevel of a Wafer. 15.6 Kelvin Probe Technologies. 15.7 Novel Applications of Electron Spectroscopy Techniques. 15.8 Novel X-ray Spectroscopy Techniques. 15.9 Electrochemical Sensors. 15.10 Summary. 16. Stripping and Cleaning for Advanced Photolithography Applications (John A. Marsella, Dana L. Durham, and Leslie D. Molnar). 16.1 Introduction to Advance Stripping Applications. 16.2 Historical Background. 16.3 Recent Trends for Photoresist Stripping and Post-etch Residue Removal. 16.4 Single Wafer Tools. 16.5 Wetting in Small Dimensions and Cleaning Challenges. 16.6 Environmental Health and Safety. 16.7 The Future of Advanced Photoresist Stripping and Cleaning. Index.
£220.46
John Wiley & Sons Inc Data Acquisition and Signal Processing for Smart
Book SynopsisFrom simple thermistors to intelligent silicon microdevices with powerful capabilities to communicate information across networks, sensors play an important role in such diverse fields as biomedical and chemical engineering to wireless communications.Trade Review"...this book provides a good basis for anyone entering or studying the field of smart sensors...not only...for the inexperienced...but also...very useful to those with some experience." (IEEE Instrumentation & Measurement Magazine, December 2002)Table of ContentsPreface. List of Abbreviations and Symbols. Introduction. Smart Sensors for Electrical and Non-Electrical, Physical and Chemical Variables: Tendencies and Perspectives. Converters for Different Variables to Frequency-Time Parameters of the Electric Signal. Data Acquisition Methods for Multichannel Sensor Systems. Methods of Frequency-to-Code Conversion. Advanced and Self-Adapting Methods of Frequency-to-Code Conversion. Signal Processing in Quasi-Digital Smart Sensors. Digital Output Smart Sensors with Software-Controlled Performances and Functional Capabilities. Multichannel Intelligent and Virtual Sensor Systems. Smart Sensor Design at Software Level. Smart Sensor Buses and Interface Circuits. Future Directions. References. Appendix A: What is on the Sensors Web Portal? Glossary. Index.
£144.85
John Wiley & Sons Inc Microsensors MEMS and Smart Devices Technology
Book SynopsisFrom the electronic nose and the intelligent ear to the modern ink jet nozzle, the applications of smart devices incorporating microsensors are increasing rapidly. Microsensors are miniature devices that convert a non--electrical quantity into an electrical signal. By integrating a microsensor with a microprocessor, a smart sensor is produced.Table of ContentsIntroduction Electronic Materials and Processing MEMS Materials and their Preparation Standard Microelectronic Technologies Silicon Micromachining:Bulk Silicon Micromachining: Surface Microstereolithography for MEMS Microsensors Introduction to SAW Devices Surface Acoustic Waves in Solids IDT Microsensor Parameter Measurement IDT Microsensor Fabrication IDT Microsensors MEMS-IDT Microsensors Smart Sensors and MEMS Appendices Index
£105.26
John Wiley and Sons Ltd Introduction to Clothing Production Management
Book SynopsisThis introductory textbook for supervisors and students of clothing and fashion sets out the fundamentals of work study, effective supervision, training, balancing, layouts, fault prevention and other basic information needed by those working in the clothing manufacturing industry. This second edition has been updated to incorprate the changes that have occurred since the first edition was published seven years ago. Greater emphasis has been placed on production planning and control, and total quality management, both important factors for ensuring a profitable operation.Table of ContentsIntroduction; The sewing room supervisor; How output is lost; Basic Method Study; Basic work measurement; Balancing; Balancing exercises; Production planning and control; Total quality control; Quality from design to despatch; Production and people; Training; Charting and layouts
£33.24
John Wiley & Sons The Complete Horseshoeing Guide
Book SynopsisHere for experts, beginners, and do-it-yourself horse owners is all the information necessary to the modern farrier's art of horseshoeing. In this second edition, Robert Wiseman describes and illustrates not only basic shoeing techniques but also hoof diseases and defects that cause lameness.
£18.86
University of Pennsylvania Press Blind Impressions
Book SynopsisAs bibliographers or book historians, we perform our work by changing the function of the objects we study. We rarely pick up an Aldine edition to read one of the classical texts it contains. . . . Print culture, under this notion, is not a medium for writing or thought but a historical object of study; our bibliographical field, our own concoction, becomes the true referent of the objects we define as its foundation.—From the IntroductionWhat is a book in the study of print culture? For the scholar of material texts, it is not only a singular copy carrying the unique traces of printing and preservation efforts, or an edition, repeated and repeatable, or a vehicle for ideas to be abstracted from the physical copy. But when the bibliographer situates a book copy within the methods of book history, Joseph A. Dane contends, it is the known set of assumptions which govern the discipline that bibliographic arguments privilege, repeat, or challenge. Book history, he writes, isTrade Review"Dane not only enlivens his text with the refreshing polemical cast with which bibliographers from Housman to Greg and Tanselle have become deservedly well known, but also spices his discussion with arresting contemporary references. . . . The historical range, critical acuity and cumulative evidence from various sources, genres and media make the books a rich resource on any bibliographer's shelves." * SHARP News *Table of ContentsIntroduction PART I. WHAT IS PRINT? Chapter 1. Paleography Versus Typography Chapter 2. "Ca. 1800": What's in a Date? Chapter 3. Bibliographers of the Mind PART II. ON THE MAKING OF LISTS Chapter 4. Herman R. Mead's Incunabula in the Huntington Library and the Notion of "Typographical Value" Chapter 5. Catchtitles in English Books to 1550 Chapter 6. An Editorial Propaedeutic PART III. IRONIES OF HISTORY AND REPRESENTATION: THEME AND VARIATION Playing Bibliography III.1. Book History and Book Histories: On the Making of Lists III.2. Meditation on the Composing Stick III.3. The Red and the Black III.4. Fragments III.5. The Nature and Function of Scholarly Illustration in a Digital World III.6. Art of the Mind Notes Principal Sources Cited Index Acknowledgments
£52.70
John Wiley & Sons Inc Chemistry and Lithography
Book SynopsisThis book will be of interest to all involved in the semiconductor industry. Offering a complete overview of the topic of lithography it will be of interest to practitioners, researchers and students. Chemists, Electrical Engineers, chip designers and manufacturers. Conferences: OSA, ISSCC, ISCS, EMC, ICASSP.Table of ContentsPreface. Acronyms and Abbreviations. Part I. Origins, Inventions, and the Evolution of Lithography. 1. Introduction to Lithography. 2. Invention of Lithography and Photolithography. 2.1 Introduction. 2.2 Invention of Lithography. 2.3 Invention of Photolithography. 2.4 Pioneers of Photography. 3. Optical and Chemical Origins of Lithography. 3.1 Introduction. 3.2 Key Developments that Enabled the Invention and Development of Lithography. 4. Evolution and Lithography. 4.1 Introduction. 4.2 Offset Lithography. 4.3 The Printed Circuit Board and the Development of the Electronics Industry. 4.4 The Transistor and Microelectronics Revolution. 4.5 The Integrated Circuit. 4.6 Other Notable Developments in Transistor Technology. 4.7 Overall Device Technology Trends. 4.8 Semiconductor Lithography. 4.9 X-ray Lithography. 4.10 Electron-Beam Lithography. 4.11 Ion-Beam Lithography. 4.12 Extreme Ultraviolet Lithography. 4.13 Soft Lithography. 4.14 Proximal Probe Lithography. 4.15 Atom Lithography. 4.16 Stereolithography. 4.17 Molecular Self-Assembly Lithography. Part II. Lithographic Chemicals. 5. Lithographic Chemicals. 5.1 Introduction. 5.2 Resists. 5.3 Antireflection Coatings. 5.4 Resist Developers and Rinses. 5.5 Resist Strippers and Cleaners. 5.6 Offset Lithographic Inks and Fountain Solutions. 6. Negative Resists. 6.1 Introduction. 6.2 Resins. 6.3 Types and Negative Resists. 6.4 General Considerations on the Chemistry of Cross-Linking. 6.5 Negative Resists Arising from Polymerization of Monomers. 6.6 General Considerations on the Chemistry of Photoinitiated. 6.7 General Considerations of Photoinitiated Condensation Polymerization. 6.8 General Considerations on the Photoinitiated Cationic Polymerization Employed in Negative Resist Systems. 6.9 Practical Negative Resist Compositions Arising from Photopolymerization of Monomers in the Presence of Polyfunctional Components. 6.19 Lithographic Applications of Photopolymerization Negative Resists. 7. Positive Resists. 7.1 Introduction. 7.2 Types of Positive Resists. 7.3 Resist Materials for Multilayer Resist Systems. 8. General Considerations on the Radiation and Photochemistry of Resists. 8.1 Interaction of Radiation with Resists. 8.2 Excited State Complexes. 8.3 Energy Transfer. 8.4 Energy Migration in Resist Polymers. 8.5 Spectral Sensitization. 8.6 Sensitization by Energy Transfer. 8.7 Radiation Chemistry Versus Photochemistry of Resists. 8.8 Radiation Chemical Yield and Dosimetry. 8.9 Radiation Chemistry of Polymers. 8.10 Sensitive and Exposure Radiation. 8.11 Exposure Mechanisms of Resists and Exposure Radiation. 9. Antireflection Coatings and Reflectivity Control. 9.1 Introduction. 9.2 Antireflection Coating Strategies. 9.3 Bottom Antireflection Coatings. 9.4 Applications of Bottom Antireflection Coatings. 9.5 Organic versus Inorganic Bottom Antireflection Coating and Rework/Stripping Issues. 9.6 Bottom Antireflection Coating-Resist Interactions. 9.7 Theory of Bottom Antireflection Coatings. 9.8 Bottom Antireflection Coatings for High-NA Imaging. Part III. The Practice of Lithography. 10. Stone, Plate, and Offset Lithography. 10.1 Stone and Plate Lithography. 10.2 Offset Lithography. 10.3 The Offset Lithographic Press. 10.4 Components of an Offset Lithographic Press. 10.5 Types of Offset Lithographic Inks. 10.6 Fabrication of Lithographic Offset Plates. 10.7 The Offset Lithographic Process. 10.8 Waterless Offset Lithography. 11. The Semiconductor Lithographic Process. 11.1 Introduction. 11.2 Adhesion Promotion. 11.3 Resist Coating. 11.4 Characterizing Ultrathin Resist Processes. 11.5 Soft Bake/Prebake. 11.6 Alignment. 11.7 Exposure. 11.8 Postexposure Bake. 11.9 Monitoring Photoacid Generation in Thin Photoresist Films by Means of Fluorescence Spectroscopy. 11.10 Postexposure Bake Sensitivity. 11.11 Consequences of Acid Diffusion. 11.12 Development. 11.13 Dissolution Mechanism of Resist Polymers. 11.14 Dissolution Mechanism of Phenolic Resists. 11.15 Comparison of Dissolution Characteristics of Novolac and Poly(hydroxystyrene)-based Resists. 11.16 General Facts about the Dissolution Mechanism of DNQ/Novolac Resists. 11.17 Resist Development Issues. 11.8 Postdevelopment Bake and Resist Stabilization Treatments. 11.19 Measurement and Inspection. 11.20 Etching. 11.21 Rework/Stripping. 12. Lithographic Modeling. 12.1 Introduction. 12.2 Historical Background. 12.3 Structure of a Lithographic Model. 12.4 Basic Imaging Theory. 12.5 Accounting for Aberrations. 12.6 Aerial Image Formation Models. 12.7 Standing Wave Models. 12.8 Exposure Models. 12.9 Postexposure Bake Models. 12.10 Development Models. 12.11 Accuracy of Lithographic Models. 12.12 Applications/Uses of Lithographic Modeling. 13. Optical Lithography. 13.1 Introduction. 13.2 Elements of Optical Lithography. 13.3 UV Photochemistry in the Exposure Chamber. 13.4 Optical Materials for UV and Visible Light Lithographies. 13.5 Printing Modes. 13.6 General Considerations on Optics Relevant to Lithography. 13.7 Optical Lithographic Technologies and Their Performance. 14. X-Ray and Extreme Ultraviolet Lithographies. 14.1 Introduction. 14.2 Proximity X-Ray Lithography. 14.3 Extreme Ultraviolet Lithography. 14.4 Optics Lifetime. 14.5 Contamination Processes. 14.6 Contamination Mitigation Strategies. 16.7 EUV Resists and Imaging Performance. 15. Charged Particle Lithography. 15.1 Introduction. 15.2 Electron-Beam Lithography. 15.3 Types of Electron-Beam Lithographies. 15.4 Electron Projection Lithography. 15.5 Ion-Beam Lithography. 16. Lithography in Integrated Circuit Device Fabrication. 16.1 Introduction. 16.2 Fabrication of a 90-nm CMOS Microprocessor. 17. Advanced Resist Processing and Resist Resolution Limit Issues. 17.1 Introduction. 17.2 Resist Systems. 17.3 Advanced Resist Processing Techniques. 17.4 Resolution Limits Issues of Resists. 17.5 Resist Materials Outlook for the 22-nm and Smaller Technology Nodes. 17.6 Resist Processing Outlook for the 22-nm and Smaller Technology Nodes. Afterword. Index.
£108.86
John Wiley & Sons Inc Introduction to Flat Panel Displays
Book SynopsisTHE PERFECT GUIDE TO FLAT PANEL DISPLAYS FOR RESEARCHERS AND INDUSTRY PERSONNEL ALIKE Introduction to Flat Panel Displays, 2nd Edition is the leading introductory reference to state-of-the-art flat panel display technologies. The 2nd edition has been newly updated to include the latest developments for high pixel resolution support, high brightness, improved contrast settings, and low power consumption. The 2nd edition has also been updated to include the latest developments of head-mounted displays for virtual and augmented reality applications. Introduction to Flat Panel Displays introduces and updates both the fundamental physics and materials concepts underlying flat panel display technology and their application to smart phones, ultra-high definitions TVs, computers, and virtual and augmented reality systems. The book includes new information on quantum-dot enhanced LCDs, device configurations and performance, and nTable of ContentsSeries Editor’s Foreword xiii 1 Flat Panel Displays 1 1.1 Introduction 1 1.2 Emissive and non-emissive Displays 4 1.3 Display Specifications 4 1.3.1 Physical Parameters 5 1.3.2 Brightness and Color 7 1.3.3 Contrast Ratio 8 1.3.4 Spatial and Temporal Characteristics 8 1.3.5 Efficiency and Power Consumption 9 1.3.6 Flexible Displays 9 1.4 Applications of Flat Panel Displays 9 1.4.1 Liquid Crystal Displays 10 1.4.2 Light-Emitting Diodes 10 1.4.3 Organic Light-Emitting Devices 11 1.4.4 Reflective Displays 11 1.4.5 Head-Mounted Displays 12 1.4.6 Touch Panel Technologies 12 References 13 2 Color Science and Engineering 15 2.1 Introduction 15 2.2 Photometry 16 2.3 The Eye 18 2.4 Colorimetry 22 2.4.1 Trichromatic Space 22 2.4.2 CIE 1931 Colormetric Observer 24 2.4.3 CIE 1976 Uniform Color System 27 2.4.4 CIECAM 02 Color Appearance Model 30 2.4.5 Color Gamut 31 2.4.6 Light Sources 32 2.4.6.1 Sunlight and Blackbody Radiators 32 2.4.6.2 Light Sources for Transmissive, Reflective, and Projection Displays 33 2.4.6.3 Color Rendering Index 34 2.5 Production and Reproduction of Colors 34 2.6 Display Measurements 35 Homework Problems 36 References 36 3 Thin Film Transistors 39 3.1 Introduction 39 3.2 Basic Concepts of Crystalline Semiconductor Materials 39 3.2.1 Band Structure of Crystalline Semiconductors 40 3.2.2 Intrinsic and Extrinsic Semiconductors 43 3.3 Classification of Silicon Materials 46 3.4 Hydrogenated Amorphous Silicon (a-Si:H) 46 3.4.1 Electronic Structure of a:Si-H 47 3.4.2 Carrier Transport in a-Si:H 48 3.4.3 Fabrication of a-Si:H 48 3.5 Polycrystalline Silicon 49 3.5.1 Carrier Transport in Polycrystalline Silicon 49 3.5.2 Fabrication of Polycrystalline-Silicon 50 3.6 Thin-Film Transistors 52 3.6.1 Fundamentals of TFTs 52 3.6.2 a-Si:H TFTs 55 3.6.3 Poly-Si TFTs 55 3.6.4 Organic TFTs 56 3.6.5 Oxide Semiconductor TFTs 57 3.6.6 Flexible TFT Technology 59 3.7 PM and AM Driving Schemes 61 Homework Problems 67 References 67 4 Liquid Crystal Displays 71 4.1 Introduction 71 4.2 Transmissive LCDs 72 4.3 Liquid Crystal Materials 74 4.3.1 Phase Transition Temperatures 75 4.3.2 Eutectic Mixtures 75 4.3.3 Dielectric Constants 77 4.3.4 Elastic Constants 78 4.3.5 Rotational Viscosity 79 4.3.6 Optical Properties 80 4.3.7 Refractive Indices 80 4.3.7.1 Wavelength Effect 80 4.3.7.2 Temperature Effect 82 4.4 Liquid Crystal Alignment 83 4.5 Homogeneous Cell 84 4.5.1 Phase Retardation Effect 85 4.5.2 Voltage Dependent Transmittance 86 4.6 Twisted Nematic (TN) 87 4.6.1 Optical Transmittance 87 4.6.2 Viewing Angle 89 4.6.3 Film-Compensated TN 90 4.7 In-Plane Switching (IPS) 91 4.7.1 Device Structure 92 4.7.2 Voltage-Dependent Transmittance 92 4.7.3 Viewing Angle 92 4.7.4 Phase Compensation Films 93 4.8 Fringe Field Switching (FFS) 95 4.8.1 Device Configurations 95 4.8.2 n-FFS versus p-FFS 96 4.9 Vertical Alignment (VA) 98 4.9.1 Voltage-Dependent Transmittance 98 4.9.2 Response Time 99 4.9.3 Overdrive and Undershoot Addressing 101 4.9.4 Multi-domain Vertical Alignment (MVA) 102 4.10 Ambient Contrast Ratio 103 4.10.1 Modeling of Ambient Contrast Ratio 103 4.10.2 Ambient Contrast Ratio of LCD 103 4.10.3 Ambient Contrast Ratio of OLED 104 4.10.4 Simulated ACR for Mobile Displays 105 4.10.5 Simulated ACR for TVs 105 4.10.6 Simulated Ambient Isocontrast Contour 106 4.10.6.1 Mobile Displays 106 4.10.6.2 Large-Sized TVs 108 4.10.7 Improving LCD’s ACR 109 4.10.8 Improving OLED’s ACR 110 4.11 Motion Picture Response Time (MPRT) 112 4.12 Wide Color Gamut 114 4.12.1 Material Synthesis and Characterizations 115 4.12.2 Device Configurations 116 4.13 High Dynamic Range 118 4.13.1 Mini-LED Backlit LCDs 118 4.13.2 Dual-Panel LCDs 120 4.14 Future Directions 121 Homework Problems 123 References 124 5 Light-Emitting Diodes 135 5.1 Introduction 135 5.2 Material Systems 138 5.2.1 AlGaAs and AlGaInP Material Systems for Red and Yellow LEDs 140 5.2.2 GaN-Based Systems for Green, Blue, UV and UV LEDs 141 5.2.3 White LEDs 143 5.3 Diode Characteristics 146 5.3.1 p- and n-Layer 147 5.3.2 Depletion Region 148 5.3.3 J–V Characteristics 150 5.3.4 Heterojunction Structures 152 5.3.5 Quantum-Well, -Wire, and -Dot Structures 152 5.4 Light-Emitting Characteristics 154 5.4.1 Recombination Model 154 5.4.2 L-J Characteristics 155 5.4.3 Spectral Characteristics 156 5.4.4 Efficiency Droop 159 5.5 Device Fabrication 160 5.5.1 Epitaxy 161 5.5.2 Process Flow and Device Structure Design 165 5.5.3 Extraction Efficiency Improvement 166 5.5.4 Packaging 168 5.6 Applications 169 5.6.1 Traffic Signals, Electronic Signage and Huge Displays 169 5.6.2 LCD Backlight 170 5.6.3 General Lighting 172 5.6.4 Micro-LEDs 173 Homework Problems 175 References 175 6 Organic Light-Emitting Devices 179 6.1 Introduction 179 6.2 Energy States in Organic Materials 180 6.3 Photophysical Processes 182 6.3.1 Franck–Condon Principle 182 6.3.2 Fluorescence and Phosphorescence 183 6.3.3 Jablonski Diagram 185 6.3.4 Intermolecular Processes 186 6.3.4.1 Energy Transfer Processes 186 6.3.4.2 Excimer and Exciplex Formation 188 6.3.4.3 Quenching Processes 188 6.3.5 Quantum Yield Calculation 189 6.4 Carrier Injection, Transport, and Recombination 191 6.4.1 Richardson–Schottky Thermionic Emission 192 6.4.2 SCLC, TCLC, and P–F Mobility 193 6.4.3 Charge Recombination 195 6.4.4 Electromagnetic Wave Radiation 195 6.5 Structure, Fabrication and Characterization 197 6.5.1 Device Structure of Organic Light-Emitting Device 198 6.5.1.1 Two-Layer Organic Light-Emitting Device 198 6.5.1.2 Matrix Doping in the EML 200 6.5.1.3 HIL, EIL, and p-i-n Structure 202 6.5.1.4 Top-Emission and Transparent OLEDs 204 6.5.2 Polymer OLED 205 6.5.3 Device Fabrication 206 6.5.3.1 Thin-film Formation 207 6.5.3.2 Encapsulation and Passivation 210 6.5.3.3 Device Structures for AM Driving 211 6.5.4 Electrical and Optical Characteristics 212 6.5.5 Degradation Mechanisms 214 6.6 Triplet Exciton Utilization 219 6.6.1 Phosphorescent OLEDs 219 6.6.2 Triplet-Triplet Annihilation OLED 221 6.6.3 Thermally Activated Delayed Fluorescence 222 6.6.4 Exciplex-Based OLED 223 6.7 Tandem Structure 224 6.8 Improvement of Extraction Efficiency 226 6.9 White OLEDs 229 6.10 Quantum-Dot Light-Emitting Diode 231 6.11 Applications 233 6.11.1 Mobile OLED Display 233 6.11.2 OLED TV 234 6.11.3 OLED Lighting 235 6.11.4 Flexible OLEDs 235 6.11.5 Novel Displays 236 Homework Problems 236 References 237 7 Reflective Displays 245 7.1 Introduction 245 7.2 Electrophoretic Displays 245 7.3 Reflective Liquid Crystal Displays 249 7.4 Reflective Display Based on Optical Interference (Mirasol Display) 253 7.5 Electrowetting Display 254 7.6 Comparison of Different Reflective Display Technologies 256 Homework Problems 256 References 257 8 Fundamentals of Head-Mounted Displays for Virtual and Augmented Reality 259 8.1 Introduction 259 8.2 Human Visual System 262 8.3 Fundamentals of Head-mounted Displays 265 8.3.1 Paraxial Optical Specifications 265 8.3.2 Microdisplay Sources 272 8.3.3 HMD Optics Principles and Architectures 275 8.3.4 Optical Combiner 280 8.4 HMD Optical Designs and Performance Specifications 286 8.4.1 HMD Optical Designs 286 8.4.2 HMD Optical Performance Specifications 290 8.5 Advanced HMD Technologies 298 8.5.1 Eyetracked and Fovea-Contingent HMDs 299 8.5.2 Dynamic Range Enhancement 302 8.5.3 Addressable Focus Cues in HMDs 305 8.5.3.1 Extended Depth of Field Displays 307 8.5.3.2 Vari-Focal Plane (VFP) Displays 308 8.5.3.3 Multi-Focal Plane (MFP) Displays 309 8.5.3.4 Head-Mounted Light Field (LF) Displays 315 8.5.4 Head-Mounted Light Field Displays 316 8.5.4.1 InI-Based Head-Mounted Light Field Displays 317 8.5.4.2 Computational Multi-Layer Head-Mounted Light Field Displays 321 8.5.5 Mutual Occlusion Capability 323 References 328 9 Touch Panel Technology 337 9.1 Introduction 337 9.2 Resistive Touch Panel 338 9.3 Capacitive Touch Panel 339 9.4 On-Cell and In-Cell Touch Panel 344 9.5 Optical Sensing for Large Panels 347 Homework Problems 348 References 348 Index 351
£81.65
John Wiley & Sons Inc Handbook of Renewable Materials for Coloration
Book SynopsisThe purpose of this unique handbook is to provide reference material that includes basic principles and current developments in the field of natural coloration and finishing. A sustainable world requires the utilization of renewable materials or resources that can be produced in huge quantities for a wide range of applications. To adopt the use of active materials for textile coloration and finishing, they should reach the technical demands of the modern world such as eco-preservation, economic and ecological requirements by which, equity and sustainability might be considered. Therefore, there is a need to discuss and understand the challenges and solutions of textile coloration and functional finishing methodologies. The 20 chapters comprising the Handbook of Renewable Materials for Coloration and Finishing are divided into four segments: Substrates for Coloration and Finishing; Renewable Colorants and their Applications; Advanced Materials and TechnoloTable of ContentsPreface xixPart I: Substrates for Coloration and Finishing 1 1 An Introduction to Textile Fibers: An Overview 3Mohd Shabbir and Faqeer Mohammad 1.1 Introduction 3 1.2 Classification 4 1.2.1 Natural Fibers 5 1.2.2 Synthetic Fibers 5 1.2.3 Semi-Synthetic Fibers 6 1.3 Conclusion 6 References 7 2 Effect of Processing and Type of Mechanical Loading on Performance of Bio-Fibers and Bio-Composites 9Vijay Chaudhary and Pramendra Kumar Bajpai 2.1 Introduction 9 2.2 Extraction of Bio-Fibers 10 2.3 Mechanical Loading 12 2.4 Tensile Test 14 2.5 Flexural Test 15 2.6 Impact Test 15 2.7 Tribological Performance 16 2.8 Conclusion 16 References 17 3 Mechanical and Chemical Structure of Natural Protein Fibers: Wool and Silk 19Mohd Yusuf 3.1 Introduction 19 3.2 Wool 20 3.2.1 Physical Properties 20 3.2.2 Chemical Properties 21 3.2.3 Morphology 22 3.2.4 Chemical Structure 24 3.3 Silk 31 3.3.1 Physical properties 31 3.3.2 Chemical Properties 33 3.3.3 Morphology 34 3.3.4 Chemical Structure 36 3.4 Conclusion 38 References 38 Part II: Renewable Colorants and their Applications: Revolutionary Approach 41 4 Animal Based Natural Dyes: A Short Review 43Shahid Adeel, Sana Rafi, Muhammad Abdul Mustaan, Mahwish Salman and Abdul Ghaffar 4.1 Introduction of Natural Dyes 44 4.2 Sustainability of Natural Dyes 45 4.3 Classification of Natural Dyes 46 4.4 Animal Based Natural Dyes 47 4.4.1 Cochineal 47 4.4.1.1 Polish Cochineal 49 4.4.1.2 Armenian Cochineal 50 4.4.2 Kermes 50 4.4.3 Lac Insect 51 4.4.4 Sea Snails 53 4.4.4.1 Bolinusbrandaris 53 4.4.4.2 Hexaplex trunculus 54 4.4.4.3 Stramonita haemastoma 54 4.5 Extraction Methodology 56 4.6 Application of Animal Based Dyes 60 4.6.1 Textile 60 4.6.2 Dye Sensitized Solar Cells 62 4.6.3 Food 63 4.6.4 Pharmaceuticals 64 4.6.5 Nano-technological Image 64 4.7 Future Prospects 65 4.8 Conclusion 66 Acknowledgment 66 References 66 5 Natural Dyes and Pigments: Extraction and Applications 75Rym Mansour 5.1 Introduction 75 5.2 Classification of Natural Dyes 77 5.2.1 Classification Based on Color 77 5.2.1.1 Red 77 5.2.1.2 Blue 77 5.2.1.3 Yellow 77 5.2.1.4 Green 78 5.2.1.5 Black and Brown 78 5.2.1.6 Orange 78 5.2.2 Classification Based on Chemical Constitution 78 5.2.2.1 Anthraquinone Dyes 78 5.2.2.2 Indigoid Dyes 79 5.2.2.3 Carotenoid Dyes 79 5.2.2.4 Flavonoid Dyes 79 5.2.2.5 Dihydropyran Dyes 79 5.2.3 Classification Based on Application 80 5.2.3.1 Mordant Dyes 80 5.2.3.2 Vat Dyes 80 5.2.3.3 Direct Dyes 80 5.2.3.4 Acid Dyes 81 5.2.3.5 Basic Dyes 81 5.2.3.6 Disperse Dyes 81 5.2.4 Classification Based on Origin 81 5.2.4.1 Plants 81 5.2.4.2 Minerals 82 5.2.4.3 Animals 82 5.3 Extraction of Natural Dyes 82 5.3.1 Extraction Methods 82 5.3.1.1 Aqueous Extraction 82 5.3.1.2 Acid and Alkali Extraction Process 83 5.3.1.3 Ultrasonic and Microwave Extraction 84 5.3.1.4 Fermentation 84 5.3.1.5 Enzymatic Extraction 85 5.3.1.6 Solvent Extraction 85 5.3.1.7 Supercritical Fluid Extraction 86 5.4 Natural Dyes Application 86 5.4.1 Textile, Medicinal and Herbal Applications 86 5.4.1.1 Quinones 87 5.4.1.2 Anthraquinones 87 5.4.1.3 Naphthoquinones 88 5.4.1.4 Anthocyanins 89 5.4.1.5 Usnic Acid 89 5.4.1.6 Tannins 90 5.4.2 Natural Dyes in Food Coloration 90 5.4.3 UV-protective Finishing 92 5.4.4 Insect Repellent Finishing 93 5.4.5 Natural Dyes in Dye-sensitized Solar Cells 94 5.5 Other Applications of Natural Dyes 95 5.6 Conclusion and Future Outlook 96 References 97 6 Lichen Derived Natural Colorants: History, Extraction, and Applications 103Luqman Jameel Rather,, Salman Jameel Rather, Showkat Ali Ganie and Khursheed Ahmad Bhat 6.1 Introduction 103 6.2 History 105 6.3 Lichen Dyes and Industrial Revolution 106 6.4 Extraction 107 6.5 Dye Stuffs from Lichens 107 6.5.1 Lichen Dyestuffs: Orchils and Litmus 110 6.6 Yellowish, Brownish and Reddish Colorants from Lichen 110 6.7 Ways of Dyeing with Lichens 111 6.8 Future Prospectus and Conclusion 111 Acknowledgement 112 References 112 7 Chlorophylls as Pigment: A Contemporary Approach 115Shafat Ahmad Khan, Mohd Yusuf, Pooja Agarwal and Lalit Prasad 7.1 Introduction 116 7.2 Molecular Structure and Physico-chemical Characterization 117 7.3 Coloring Aspects 119 7.4 Characterization and Quality Control 120 7.5 Conclusion and Future Outlook 121 References 122 8 Contemporary Revolutions in Natural Dyes: Extraction and Dyeing Methodology 125Fazal-ur-Rehman, Shahid Adeel, Sana Rafi, Noman Habib, Khalid Mahmood Zia, Mohammad Zuber and Nasim Akhtar 8.1 Introduction 126 8.2 Pros and Cons of Natural Dyes 127 8.3 Classification of Natural Dyes 129 8.3.1 Plant Based Natural Dyes 129 8.3.1.1 Pomegranate 129 8.3.1.2 Australian Pine 130 8.3.1.3 Bush Grape 130 8.3.1.4 Butterfly Pea 130 8.3.1.5 Mugavu 131 8.3.1.6 Jackfruit 132 8.3.1.7 Larkspur 134 8.3.1.8 Tee Oil Plant 135 8.3.1.9 Chaste Tree 136 8.3.1.10 Chinese Sumac 137 8.3.1.11 Limoniastrum Monopetalum 137 8.3.1.12 Yerba Mate 137 8.3.1.13 Camphor Tree 138 8.3.1.14 Basil 139 8.3.1.15 Fennel 139 8.3.1.16 Indian Paper Plant 140 8.3.1.17 Guava 140 8.3.1.18 Scarlet Sage 141 8.3.1.19 Sandalwood 142 8.3.1.20 Centaury 142 8.4 Extraction Methodology 144 8.4.1 Conventional Methods 145 8.4.2 Modern Methods 146 8.5 Exploration of New Plants Using Modern Tools to Maintain Sustainability 150 8.5.1 Harmal 150 8.5.2 Saffron 152 8.5.3 Madder 152 8.5.4 Safflower 153 8.5.5 Arjun 154 8.5.6 Chicken Gizzard 156 8.5.7 Red Calico 156 8.5.8 Golden Duranta 157 8.5.9 Marigold 157 8.5.10 Milk Weed 159 8.5.11 Neem 160 8.6 Conclusion 161 Acknowledgment 161 References 161 9 A Review on Phytochemistry, Pharmacological and Coloring Potential of Lawsonia inermis 169Mohd Yusuf 9.1 Introduction 169 9.2 Phytochemistry 171 9.2.1 Phenolics 171 9.2.1.2 Naphthoquinones 171 9.2.1.3 Naphthalenes 172 9.2.1.4 Acetylenes 173 9.2.1.5 Alkyl Phenones 174 9.2.1.6 Xanthones 175 9.2.1.7 Coumarins 175 9.2.1.8 Tannins 176 9.2.1.9 Lignans 176 9.2.1.10 Others 176 9.2.2 Terpenoids 178 9.2.3 Steroids 178 9.2.4 Alkaloids 178 9.2.5 Miscellaneous Compounds 179 9.3 Pharmacological Potential 181 9.4 Coloring Potential 182 9.5 Conclusion and Future Outlook 184 References 184 10 Sustainable Application of Natural Dyes in Cosmetic Industry 189Shahid Adeel, Shazia Abrar, Shumaila Kiran,,Tahir Farooq, Tahsin Gulzar and Mubeen Jamal 10.1 Introduction 190 10.2 Classification of Natural Dyes 191 10.2.1 Sources of Origin 191 10.2.1.1 Plant Origin 191 10.2.1.2 Animal Origin 195 10.2.1.3 Mineral Origin 195 10.2.1.4 Microbial Origin 195 10.3 Application of Natural Dyes in Cosmetics 196 10.3.1 Natural Lip Cosmetics 196 10.3.2 Natural Hair Dyes 197 10.4 Methods of Application as Hair Colorant 199 10.5 Natural Dyes as Hair Colorant 200 10.5.1 Henna (Lawsonia inermis Linn) 200 10.5.2 Indigo (Indigoferatinctoria) 202 10.5.3 Shoe Flower (Hibiscus rosa-sinensis L.) 203 10.5.4 Amla (EmblicaofficinalisLinn) 205 10.5.5 Beet (Beta Vulgaris) 206 10.6 Advantages/Merits 206 10.7 Disadvantages/Demerits 207 10.8 Conclusion 207 Acknowledgments 208 References 208 11 Application of Natural Dyes to Cotton and Jute Textiles: Science and Technology and Environmental Issues 213Ashis Kumar Samanta 11.1 Introduction 214 11.2 Extraction of Color Solution from the Sources of Natural Dyes 216 11.3 Purification of Selected Natural Dyes 216 11.4 Testing and Characterization of Purified Natural Dyes Before its Application to Textiles 217 11.4.1 UV-VIS Spectral Analysis of Aqueous Extracted Solution of Natural Dyes 217 11.4.2 FTIR Spectral Analysis 217 11.4.3 Analysis of DSC-Thermo Grams 218 11.5 Mechanism of Complex Formation Amongst Dye-Mordant and Fiber for Fixation of Natural Dyes on Different Fibers 221 11.6 Technological Aspects of Natural Dyeing to Cotton and Jute: Effect of Different Mordants 226 11.6.2 Effect of Selective Single and Double Mordanting on Jute and Cotton Fabrics for Natural Dyeing 227 11.6.2 Effect of Dyeing Process Variables for Optimizing the Dyeing Conditions 245 11.7 Study of Dyeing Kinetics for Dyeing Jack fruit Wood on Cotton and Jute fabrics 254 11.7.2 Dye Affinity 255 11.7.3 Dyeing Absorption Isotherm 257 11.7.4 Heat (Enthalpy) of Dyeing 260 11.7.5 Entropy of Dyeing and Gibb’s Free Energy 261 11.8 Study of Compatibility of Binary and Ternary Mixture of Natural dyes to Obtain Compound Shade 262 11.9 Test of Compatibility for Selected Binary Mixture of Natural Dyes 263 11.9.2 Newer Proposed Method of Test of Compatibility (Method-II) 264 11.9 Some Recent Studies on Natural Dyes for Textiles 274 11.10 Conclusions 275 References 276 12 Bio-Colorants as Photosensitizers for Dye Sensitized Solar Cell (DSSC) 279Pooja Agarwal, Mohd Yusuf, Shafat Ahmed Khan and Lalit Prasad 12.1 Introduction 279 12.2 Operational Principle of the DSSCs 281 12.3 DSSC Components 283 12.3.1 Semiconductor Film Electrode 283 12.3.2 Electrolyte 285 12.3.2.1 Liquid Electrolyte 285 12.3.2.2 Solid State Electrolytes 287 12.3.2.3 Quasi-Solid Electrolyte 287 12.3.3 Counter Electrode 288 12.3.4 Photosensitizers 289 12.3.4.1 Metal Complex Sensitizer 289 12.3.4.2 Metal-Free Organic Sensitizer 290 12.3.4.3 Natural Sensitizer/Natural Dye/Natural Pigments 291 12.4 Conclusion and Future Outlook 297 References 298 Part III: Advanced Materials and Technologies for Coloration and Finishing 301 13 Advanced Materials and Technologies for Antimicrobial Finishing of Cellulosic Textiles 303Nabil A. Ibrahim, Basma M. Eid and Faten H. H. Abdellatif 13.1 Cellulosic Fibers 303 13.2 Wet Processing of Cellulosic Textiles 304 13.2.1 Pre-treatment 304 13.2.2 Coloration 306 13.2.3 Finishing 306 13.3 Antimicrobial Finishing of Cellulosic Textiles 307 13.3.1 Criteria for Proper Antimicrobial Agents 310 13.3.2 Best Available Techniques 310 13.4 Traditional Antimicrobial Finishing Chemicals, Application Method, Disadvantages 311 13.4.1 Synthetic Antimicrobial Agents 311 13.4.1.1 Quaternary Ammonium Compounds 311 13.4.1.2 Poly (hexamethylenebiguanide) (PHMB) 312 13.4.1.3 N-Halamine Compounds 313 13.4.1.4 Triclosan 314 13.4.2 Natural Antimicrobial Agents 314 13.4.2.1 Chitosan 315 13.5 Advanced Antimicrobial Agents 320 13.5.1 Antimicrobial Agent Based on Natural Products 320 13.5.2 Advanced Antimicrobial Agents Based on Nano-materials 327 13.5.2.1 Silver Nanoparticles AgNPs 329 13.5.2.2 Tianium Dioxide Nanoparticle (TiO2NPs) 333 13.5.2.3 Zinc Oxide Nanoparticles (ZnO NPs) 335 13.5.2.4 Cuprousoxide Nanoparticle (Cu2ONPs) 335 13.5.3 Nan composites and Hybrid Materials 336 13.6 Evaluation of Antimicrobial Products 336 13.7 Conclusion and Future Prospects 336 Reference 345 14 Bio-macromolecules: A New Flame Retardant Finishing Strategy for Textiles 357Giulio Malucelli 14.1 Introduction 357 14.2 The Role of Bio-macromolecules as Flame Retardant Systems: Structure-Property Relationships 363 14.2.1 Whey Proteins 364 14.2.2 Caseins 367 14.2.3 Hydrophobins 371 14.2.4 Nucleic Acids 374 14.2.5 Other Bio-macromolecules: A Quick Recent Overview 380 14.3 Current Limitations 381 14.4 Conclusions and Future Perspectives 382 Acknowledgements 382 Reference 383 15 Significant Trends in Nano Finishes for Improvement of Functional Properties of Fabrics 387N. Gokarneshan and K. Velumani 15.1 Introduction 388 15.2 Significance of Nanotechnology 389 15.3 Application of Nanotechnology in Textiles 389 15.4 Nanotechnology for Improved Fabric Finishing 392 15.5 Problem Associated with Nanotechnology 393 15.6 Nano Safe Textile Finishes with Papaya Peel and Silver 393 15.6.1 Overview 393 15.6.2 Related Aspects 393 15.6.3 Analysis of UV Visible Spectra 394 15.6.4 Dynamic Light Scattering 395 15.6.5 Evaluation of Antibacterial Activity of Textile Material 396 15.7 Plasma Induced Finishes for Multifunctional Properties 397 15.7.1 Overview 397 15.7.2 Related Aspects 397 15.7.3 Ultra Violet Protection 398 15.7.4 Flame Retardant Properties 399 15.7.5 Thermo-Gravimetric Analysis 400 15.7.6 Morphology of Surface 401 15.7.7 Antibacterial Properties 401 15.7.8 Crease Recovery Angle 401 15.7.9 Surface Chemical Changes 402 15.7.10 Tensile Properties 403 15.8 Nano Finishes Adopting Green Approach 403 15.8.1 Overview 403 15.8.2 Related Aspects 403 15.8.3 Release of Silver Nano Particle 405 15.8.4 Anti-Microbial Activity 405 15.9 Multi Functional Nano Finish on Denim Fabrics 406 15.9.1 Overview 406 15.9.2 Related Aspects 407 15.9.3 Characterization of Nanoparticles 408 15.9.4 Characterization of Treated Fabric 408 15.10 Role of Silk Sericin in Nano Finishing with Silver Particles 410 15.10.1 Overview 410 15.10.2 Related Aspects 411 15.10.3 Characterization of Silver Nanoparticles 411 15.10.4 Importance of Sericin asCapping Agent 412 15.10.5 Application of Silver Nano Particles as Antibacterial Agent 413 15.11 Improvement in Coloration and Antimicrobial Properties in Silk Fabrics with Aqueous Binders 413 15.11.1 Overview 413 15.11.2 Related Aspects 414 15.11.3 Analysis of Polyurethane Acrylate 414 15.11.4 Influence of PUA Concentration on K/S Value 415 15.11.5 Influence of Titanium Dioxide Concentration on K/S Value 415 15.11.6 UV Protection 415 15.11.7 Antimicrobial Property 416 15.11.8 Wrinkle Resistance 417 15.11.9 Fiber Surface 417 15.11.10 Fastness Properties 417 15.12 Nanoparticles for Improving Flame Retardant Properties of Fabrics 418 15.13 Application of Herbal Synthesized Silver Nano Particles on Cotton Fabric 420 15.14 Conclusion 422 References 423 16 Rot Resistance and Antimicrobial Finish of Cotton Khadi Fabrics 435Tapas Ranjan Kar 16.1 Introduction 436 16.2 Anti Microbial Treatment 439 16.3 Some Important Study on Eco-friendly Antimicrobial Finishing of Cotton Khadi Fabric 440 16.3.2 Reaction Scheme 445 16.3.3 Crease Recovery and Stiffness 453 16.3.4 Appearance Properties 455 16.4 Effect of Varying Concentration Level of Chitosan and PEG for Application of Mixture of Chitosan and PEG on Microbial and Other Properties of Cotton Khadi Fabric with CA and SHP as Mixed Catalyst and Their Optimization 455 16.5 Characterization of Control and Treated Cotton Fabrics by FTIR, TGA, and X-RD Analysis 460 16.5.1 Analysis of FTIR Spectra for Untreated and Treated Cotton Khadi Fabric with PEG and its Mixture 460 16.5.2 Characterization of Thermal Stability of the Control and Treated Fabric 463 16.5.3 X-ray Diffraction of Untreated and Treated Fabrics with CA and SHP as Catalyst 465 16.6 Study of Residual Antimicrobial Effect after Repeated Washing Cycles 466 16.7 Analysis of Surface Properties by SEM 467 16.8 Conclusion 467 16.8.1 Ranking Index of Different Treatments on Loss of Tenacity and Antimicrobial Reduction Percentage Values 468 Acknowledgement 469 Reference 469 17 Advanced Technologies for Coloration and Finishing Using Nanotechnology 473Abdul Azeez Nazeer, Saravanan Dhandapani and Sudarshana Deepa Vijaykumar 17.1 Introduction 474 17.2 Nanoparticles in Dyes 474 17.2.1 Plasma Technology 475 17.2.1.1 Coloration of Plasma-Treated Polyester Fibers 476 17.2.1.2 Coloration of Plasma-Treated Wool Fibers 476 17.2.1.3 Coloration of Plasma-Treated Cotton Fibers 476 17.3 Nano Finishing 477 17.3.1 Hydrophobic Finishing 477 17.3.2 Antimicrobial Finishing 480 17.3.3 Self Cleaning Finishing 482 17.3.4 Flame Retardent 485 17.3.5 UV Protecting Finishing 487 17.3.6 Wrinkle Resistant 488 17.4 Encapsulation Technology 489 17.4.1 Application of Microcapsules on Textile Industry 495 17.5 Conclusion 497 References 497 18 Sol–Gel Flame Retardant and/or Antimicrobial Finishings for Cellulosic Textiles 501Giulio Malucelli 18.1 Introduction 502 18.2 The Sol–Gel Process 504 18.2.1 Sol–gel Fully Inorganic Coatings 506 18.2.2 Phosphorus-Doped Sol–Gel Coatings 509 18.2.3 Smoke Suppressant Sol–Gel Coating Formulations 510 18.2.4 Hybrid Organic–Inorganic Sol–Gel Coatings 511 18.2.5 Antibacterial Effects Provided by Sol–Gel Coatings 513 18.3 Current Limitations 515 18.4 Conclusions and Future Outlook 515 References 516 Part IV: Sustainability 521 19 Sustainable Coloration and Value Addition to Textiles 523S. Basak, Kartick K. Samanta, S. K. Chattopadhyay and P. Pandit 19.1 Introduction 524 19.2 Sustainable Coloration of Textile Materials 525 19.2.2 Naturally Colored Cotton 526 18.2.3 Natural Dye from Plants 527 19.2.4 Sustainable Synthetic Color 530 19.2.5 Easy Care Finishing of Textile Products 531 19.3 Antimicrobial Finishing of Textiles 532 19.4 Flame Retardant Finishing of Textile 535 19.5 UV Protective Textile 537 19.6 Mosquito, Insect and Moth Repellent Finishing of Textile 538 19.7 Irradiation-Induced Value Addition to Textiles 539 19.8 Enzyme-Based Textile Pretreatment 540 19.9 Bio-mimic Based Value Addition to Textile 541 19.10 Conclusion and Future Outlook 543 References 543 20 Interconnection Between Biotechnology and Textile: A New Horizon of Sustainable Technology 549Aranya Mallick 20.1 Introduction 549 20.2 Influence of Bioprocess on Textile 550 20.2.1 Fibers and Polymers 551 20.2.1.1 Modified Cotton 551 20.2.1.2 Biopolymers 552 20.2.1.3 Thermoplastic Polymers Derived from Natural Sources 555 20.2.2 Pretreatment 557 20.2.2.1 Desizing 558 20.2.2.2 Scouring 559 20.2.2.3 Bleaching 559 20.2.2.4 Peroxide Killing 559 20.2.3 Dyes and Dyeing 560 20.2.3.1 Natural Dyes and Dyeing 560 20.2.3.2 Bacteria Derived Pigments 561 20.2.4 After or Post-treatment 561 20.2.5 Decolorization of Textile Dyes Waste 562 20.2.6 Biosurfactants 563 20.2.7 Antimicrobial Activities and the Tests 563 20.2.8 Textile Detergent 565 20.3 Influence of Textile on Biotechnology 565 20.3.1 Filtration 565 20.3.2 Immobilization 565 20.3.3 Protective Textile 567 20.3.3.1 Air Permeable Material 567 20.3.3.2 Semipermeable Material 567 20.3.3.3 Impermeable Material 567 20.3.3.4 Selective Permeable Membrane 568 20.4 Conclusion 568 References 568 Index 000
£187.16
John Wiley & Sons Inc Leadfree Soldering Process Development and
Book SynopsisCoveringthe majortopics in lead-free soldering Lead-free Soldering Process Development and Reliabilityprovides a comprehensive discussion of all modern topics in lead-free soldering. Perfect forprocess, quality,failure analysisand reliability engineersin production industries,this reference will help practitioners address issues inresearch, development andproduction. Among other topics, the book addresses: Developments in process engineering(SMT, Wave, Rework, Paste Technology) Lowtemperature,hightemperature andhighreliabilityalloys Intermetallic compounds PCB surface finishesandlaminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book'sexplanations ofhigh-temperature, low-temperature, andhigh-reliabilitylead-free alloysin terms of process and reTable of ContentsList of Contributors xix Introduction xxi 1 Lead-Free Surface Mount Technology 1Jennifer Nguyen and Jasbir Bath 1.1 Introduction 1 1.2 Lead-Free Solder Paste Alloys 1 1.3 Solder Paste Printing 2 1.3.1 Introduction 2 1.3.2 Key Paste Printing Elements 2 1.4 Component Placement 5 1.4.1 Introduction 5 1.4.2 Key Placement Parameters 5 1.4.2.1 Nozzle 6 1.4.2.2 Vision System 6 1.4.2.3 PCB Support 6 1.4.2.4 Component Size, Packaging, and Feeder Capacity 6 1.4.2.5 Feeder Capacity 6 1.5 Reflow Process 7 1.5.1 Introduction 7 1.5.2 Key Parameters 7 1.5.2.1 Preheat 7 1.5.2.2 Soak 8 1.5.2.3 Reflow 8 1.5.2.4 Cooling 9 1.5.2.5 Reflow Atmosphere 9 1.6 Vacuum Soldering 9 1.7 Paste in Hole 10 1.8 Robotic Soldering 11 1.9 Advanced Technologies 12 1.9.1 Flip Chip 12 1.9.2 Package on Package 12 1.10 Inspection 13 1.10.1 Solder Paste Inspection (SPI) 13 1.10.2 Solder Joint Inspection 14 1.10.2.1 Automated Optical Inspection (AOI) 14 1.10.2.2 X-ray Inspection 15 1.11 Conclusions 16 References 17 2 Wave/Selective Soldering 19Gerjan Diepstraten 2.1 Introduction 19 2.2 Flux 19 2.2.1 The Function of a Flux 19 2.2.2 Flux Contents 20 2.3 Amount of Flux Application on a Board 20 2.4 Flux Handling 21 2.5 Flux Application 21 2.5.1 Methods to Apply Flux (Wave Soldering) 21 2.5.2 Methods to Apply Flux (Selective Soldering) 23 2.6 Preheat 24 2.6.1 Preheat Process-Heating Methods 24 2.6.2 Preheat Temperatures 27 2.6.3 Preheat Time 28 2.6.4 Controlling Preheat Temperatures 28 2.6.5 BoardWarpage Compensation (Selective Soldering) 29 2.7 Selective Soldering 29 2.7.1 Different Selective Soldering Point to Point Nozzles (Selective Soldering) 29 2.7.2 Solder Temperatures (Selective Soldering) 30 2.7.3 Dip/Contact Times (Selective Soldering) 31 2.7.4 Drag Conditions (Selective Soldering) 31 2.7.5 Nitrogen Environment (Selective Soldering) 31 2.7.6 Wave Height Controls (Selective Soldering) 32 2.7.7 De-Bridging Tools (Selective Soldering) 32 2.7.8 Solder Pot (Selective Soldering) 33 2.7.9 Topside Heating during Soldering (Selective Soldering) 34 2.7.10 Selective Soldering Dip Process with Nozzle Plates (Selective Soldering) 34 2.7.11 Solder Temperatures for Multi-Wave Dip Soldering (Selective Soldering) 35 2.7.12 Nitrogen Environment (Selective Soldering) 35 2.7.13 Wave Height Control (Selective Soldering) 36 2.7.14 Dip Time – Contact Time with Solder (Selective Soldering) 36 2.7.15 Solder Flow Acceleration and Deceleration (Selective Soldering) 37 2.7.16 De-Bridging Tools (Selective Soldering) 37 2.7.17 Pallets (Selective Soldering) 38 2.7.18 Conveyor (Selective Soldering) 38 2.8 Wave Soldering 39 2.8.1 Wave Formers (Wave Soldering) 39 2.8.2 Pallets (Wave Soldering) 40 2.8.3 Nitrogen Environment (Wave Soldering) 40 2.8.4 Process Control (Wave Soldering) 41 2.8.5 Conveyor (Wave Soldering) 41 2.9 Conclusions 42 References 42 3 Lead-Free Rework 43Jasbir Bath 3.1 Introduction 43 3.2 Hand Soldering Rework for SMT and PTH Components 43 3.2.1 Alloy and Flux Choices 43 3.2.1.1 Alloys 43 3.2.1.2 Flux 44 3.2.2 Soldering Iron Tip Life 44 3.2.3 Hand Soldering Temperatures and Times 47 3.3 BGA/CSP Rework 50 3.3.1 Alloy and Flux Choices 50 3.3.1.1 Alloys 50 3.3.1.2 Flux 50 3.3.2 BGA/CSP Rework Soldering Temperatures and Times 50 3.3.3 Component Temperatures in Relation to IPC/JEDEC J-STD-020 and Component/BoardWarpage Standards 52 3.3.3.1 IPC/JEDEC J-STD-020 Standard 52 3.3.3.2 ComponentWarpage Standards 52 3.3.3.3 BoardWarpage Standards 52 3.3.4 Equipment Updates for Lead-Free BGA/CSP Rework 53 3.3.5 Adjacent Component Temperatures 53 3.4 Non-standard Component Rework (Including BTC/QFN) 54 3.4.1 Alloy and Flux Choices 54 3.4.1.1 Alloys 54 3.4.1.2 Flux 54 3.4.2 Soldering Temperatures and Times 54 3.4.3 Non-standard Component Temperatures in Relation to IPC JEDEC J-STD-020 Standard and ComponentWarpage Standards 55 3.4.4 Equipment and Tooling Updates for Lead-Free Non-standard Component Rework 55 3.4.5 Adjacent Component Temperatures 56 3.4.6 Non-standard Component Rework Solder Joint Reliability 56 3.5 PTH (Pin-Through-Hole)Wave Rework 56 3.5.1 Alloy and Flux Choices 56 3.5.1.1 Alloys 56 3.5.1.2 Flux 57 3.5.2 Soldering Temperatures and Times 57 3.5.3 Component Temperatures in Relation to Industry and Board Standards During PTH Rework 67 3.5.3.1 Component Temperature Rating Standards 67 3.5.3.2 Bare Board Testing Standards and Methods for PTH Rework 67 3.5.4 Equipment Updates for PTH Component Rework 68 3.5.5 Adjacent Component Temperatures During PTH Rework 68 3.5.6 PTH Component Rework Solder Joint Reliability 68 3.5.6.1 Copper Dissolution 68 3.5.6.2 Holefill 69 3.6 Conclusions 69 References 70 4 Solder Paste and Flux Technology 73Shantanu Joshi and Peter Borgesen 4.1 Introduction 73 4.2 Solder Paste 75 4.2.1 Water-Soluble Solder Paste 75 4.2.2 No-Clean Solder Paste 76 4.3 Flux Technology 77 4.3.1 Halide-Free and Halide-Containing 77 4.4 Composition of Solder Paste 79 4.4.1 Alloy 79 4.4.2 Flux 82 4.4.3 Solder Powder Type 83 4.4.3.1 Oxide Layer 84 4.5 Characteristics of a Solder Paste 84 4.5.1 Printing 84 4.5.1.1 Printing Parameters 85 4.5.2 Reflow 86 4.5.2.1 Wetting/Spreadability of Lead-Free Solder Paste 86 4.5.2.2 Bridging 86 4.5.2.3 Micro Solder Balls 86 4.5.2.4 Voiding 86 4.5.2.5 Head-on-Pillow Component Soldering Defect 88 4.5.2.6 Non-Wet Open 90 4.5.2.7 Tombstoning 90 4.5.3 In-Circuit Test (ICT) Probe Testability 90 4.5.4 Flux Reliability Issues 91 4.6 Conclusions 92 References 92 5 Low Temperature Lead-Free Alloys and Solder Pastes 95Raiyo Aspandiar, Nilesh Badwe, and Kevin Byrd 5.1 Introduction 95 5.1.1 Definition of Low Temperature Solders 95 5.1.2 Benefits of Low Temperature Soldering 97 5.1.2.1 Reduced Manufacturing Cost 98 5.1.2.2 Power Use Savings 98 5.1.2.3 Environmental Benefits 99 5.1.2.4 Manufacturing Yield Improvements 100 5.1.3 Drawbacks 103 5.1.3.1 Brittleness 103 5.1.4 Other Low Temperature Metallurgical Systems 103 5.2 Development of Robust Bismuth-Based Low Temperature Solder Alloys 105 5.2.1 Bismuth-Tin (Bi-Sn) Phase Diagram 105 5.2.2 Mechanical Properties 107 5.2.3 Physical Properties 108 5.2.4 Alloy Development Progress 108 5.2.5 Fluxes for Low Temperature Solders 109 5.3 SMT Process Characterization of Sn-Bi Based Solder Pastes 111 5.3.1 Printability 111 5.3.2 Reflow Profiles 112 5.3.3 Rework 113 5.4 Polymeric Reinforcement of Sn-Bi Based Low Temperature Alloys 114 5.4.1 Current Polymeric Reinforcement Strategies 114 5.4.2 Joint Reinforced Pastes (JRP) 118 5.4.3 Polymeric Reinforcement Summary 128 5.5 Mixed SnAgCu-BiSn BGA Solder Joints 128 5.5.1 Formation Mechanism 128 5.5.2 Microstructural Features and Key Characteristics 133 5.5.3 Soldering Process Optimization 134 5.5.4 Possible Defects 135 5.6 Solder Joint Reliability 140 5.7 Conclusions 145 5.8 Future Development and Trends 146 References 149 6 High Temperature Lead-Free Bonding Materials – The Need, the Potential Candidates and the Challenges 155Hongwen Zhang and Ning-Cheng Lee 6.1 Introduction 155 6.2 Solder Materials 159 6.2.1 Gold-Based Solders 159 6.2.2 Bismuth-Rich Solders 160 6.2.2.1 Design of Bismuth-Rich Solders 160 6.2.2.2 Mechanical Behavior of BiAgX 163 6.2.2.3 Microstructure and Microstructural Evolution of BiAgX Joint 167 6.2.3 Tin-Antimony (Sn-Sb) High Temperature Solders 174 6.2.4 Zinc-Aluminum Solders 176 6.3 Silver (Ag)-Sintering Materials 178 6.4 Transient Liquid Phase Bonding Materials/Technique 181 6.5 Summary 182 Acknowledgment 185 References 185 7 Lead (Pb)-Free Solders for High Reliability and High-Performance Applications 191Richard J. Coyle 7.1 Evolution of Commercial Lead (Pb)-Free Solder Alloys 191 7.1.1 First Generation Commercial Pb-Free Solders 191 7.1.2 Second Generation Commercial Pb-Free Solders 192 7.1.3 Third Generation Commercial Pb-Free Solders 196 7.2 Third Generation Alloy Research and Development 196 7.2.1 Limitations of Sn-Ag-Cu Solder Alloys 196 7.2.2 Emergence of Commercial Third Generation Alloys 202 7.2.2.1 The Genesis of 3rd Generation Alloy Development 202 7.2.2.2 An Expanding Class of 3rd Generation Alloys 202 7.2.3 Metallurgical Considerations 203 7.2.3.1 Antimony (Sb) Additions to Tin (Sn) 206 7.2.3.2 Indium (In) Additions to Tin (Sn) 207 7.2.3.3 Bismuth (Bi) Additions to Tin (Sn) 209 7.3 Reliability Testing Third Generation Commercial Pb-Free Solders 210 7.3.1 Thermal Fatigue Evaluations 210 7.3.2 iNEMI/HDPUG Third Generation Alloy Pb-Free Thermal Fatigue Project 213 7.3.3 Microstructure and Reliability of Third Generation Alloys 219 7.4 Reliability Gaps and Suggestions for AdditionalWork 223 7.4.1 Root Cause of Interfacial Fractures 223 7.4.2 Effect of Component Attributes on Thermal Fatigue 224 7.4.3 Effect of Surface Finish on Thermal Fatigue 224 7.4.4 Thermomechanical Test Parameters and Test Outcomes 225 7.4.4.1 Thermal Cycling Dwell Time 225 7.4.4.2 Preconditioning (Isothermal Aging) 225 7.4.4.3 Thermal Cycling of Mixed Metallurgy BGA Assemblies 226 7.4.4.4 Thermal Shock or Aggressive Thermal Cycling 226 7.4.5 Reliability Under Mechanical Loading: Drop/Shock, and Vibration 227 7.4.6 Solder Alloy Microstructure and Reliability 230 7.4.7 Summary of Suggestions for Additional Investigation 231 7.5 Conclusions 232 Acknowledgments 234 References 234 8 Lead-Free Printed Wiring Board Surface Finishes 249Rick Nichols 8.1 Introduction: Why a Surface Finish is Needed 249 8.2 Surface Finishes in the Market 250 8.3 Application Perspective 255 8.4 A Description of Final Finishes 261 8.4.1 Hot Air Solder Leveling (HASL) 263 8.4.1.1 Process Complexity 263 8.4.1.2 Process Description 265 8.4.1.3 Issues and Remedies 267 8.4.1.4 Summary 267 8.4.2 High Temperature OSP 267 8.4.2.1 Process Complexity 267 8.4.2.2 Process Description 269 8.4.2.3 Issues and Remedies 270 8.4.2.4 Summary 270 8.4.3 Immersion Tin 271 8.4.3.1 Process Complexity 271 8.4.3.2 Process Description 273 8.4.3.3 Issues and Remedies 275 8.4.3.4 Summary 276 8.4.4 Immersion Silver 276 8.4.4.1 Process Complexity 277 8.4.4.2 Process Description 279 8.4.4.3 Issues and Remedies 280 8.4.4.4 Summary 281 8.4.5 Electroless Nickel Immersion Gold (ENIG) 281 8.4.5.1 Process Complexity 281 8.4.5.2 Process Description 283 8.4.5.3 Issues and Remedies 285 8.4.5.4 Summary 286 8.4.6 Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) 287 8.4.6.1 Process Complexity 287 8.4.6.2 Process Description 289 8.4.6.3 Issues and Remedies 290 8.4.6.4 Summary 291 8.4.7 Electroless Nickel Autocatalytic Gold (ENAG) 291 8.4.7.1 Process Complexity 292 8.4.7.2 Process Description 293 8.4.7.3 Issues and Remedies 295 8.4.7.4 Summary 295 8.4.8 Electroless Palladium Autocatalytic Gold (EPAG) 295 8.4.8.1 Process Complexity 295 8.4.8.2 Process Description 297 8.4.8.3 Issues and Remedies 298 8.4.8.4 Summary 299 8.4.9 Electrolytic Nickel Electrolytic Gold 299 8.4.9.1 Process Complexity 299 8.4.9.2 Process Description 301 8.4.9.3 Issues and Remedies 301 8.4.9.4 Summary 302 8.5 Conclusions 303 References 304 9 PCB Laminates (Including High Speed Requirements) 307Karl Sauter and Silvio Bertling 9.1 Introduction 307 9.2 Manufacturing Background 307 9.3 PCB Fabrication Design and Laminate Manufacturing Factors Affecting Yield and Reliability 308 9.3.1 High Frequency Loss 308 9.3.2 Mixed Dielectric 308 9.3.3 Back-Drilling 309 9.3.4 Aspect Ratio 309 9.3.5 PCB Fabrication 309 9.3.6 Press Lamination 310 9.3.7 Moisture Content 310 9.3.8 Laminate Material 311 9.4 Assembly Factors Affecting Yields and Long-Term Reliability for Laminate Materials 311 9.4.1 Reflow Temperature 311 9.4.2 Assembly Components 312 9.4.3 Thermal Stress 312 9.5 Copper Foil Trends (by Silvio Bertling) 312 9.6 High Frequency/High Speed and Other Trends Affecting Laminate Materials 316 9.6.1 High Speed Standards 316 9.6.2 Adhesion Treatment (Prior to Press Lamination) 317 9.6.3 Laminate Material Filler Content 317 9.6.4 GlassWeave Effect 317 9.6.5 Halogen-Free 318 9.7 Conclusions 318 References 319 10 Underfills and Encapsulants Used in Lead-Free Electronic Assembly 321Brian J. Toleno 10.1 Introduction 321 10.2 Rheology 322 10.2.1 Rheological Response and Behavior 323 10.2.1.1 Thixotropy 325 10.2.2 Measuring Rheology 327 10.2.2.1 Spindle Type Viscometry 327 10.2.2.2 Cone and Plate Rheometry 328 10.3 Curing of Adhesive Systems 330 10.3.1 Thermal Cure 330 10.3.2 Ultraviolet (UV) Light Curing 335 10.3.3 Moisture Cure 338 10.4 Glass Transition Temperature 339 10.5 Coefficient of Thermal Expansion (CTE) 341 10.6 Young’s Modulus (E) 343 10.7 Applications 344 10.7.1 Underfills 344 10.7.1.1 Capillary Underfill 345 10.7.1.2 Fluxing (No-Flow) Underfill 348 10.7.1.3 Removable/Reworkable Underfill 349 10.7.1.4 Staking or Corner Bond Underfill 349 10.7.2 Encapsulant Materials 350 10.7.2.1 Glob Top 351 10.7.2.2 Component Encapsulation 351 10.7.2.3 Application 353 10.7.2.4 Low-Pressure Molding 355 10.8 Conclusions 355 References 355 11 Thermal Cycling and General Reliability Considerations 359Maxim Serebreni 11.1 Introduction to Thermal Cycling of Electronics 359 11.1.1 Influence of Solder Alloy Composition and Microstructure on Thermal Cycling Reliability 362 11.2 Influence of Package Type and Thermal Cycling Profile 363 11.2.1 Influence of Board and Pad Design 366 11.3 Fatigue Life Prediction Models 371 11.3.1 Empirical Models and Acceleration Factors 371 11.3.2 Semi-empirical Models 372 11.3.3 Finite Element Analysis (FEA) Based Fatigue Life Predictions 373 11.4 Conclusions 376 References 377 12 Intermetallic Compounds 381Alyssa Yaeger, Travis Dale, Elizabeth McClamrock, Ganesh Subbarayan, and Carol Handwerker 12.1 Introduction 381 12.1.1 Solders 382 12.1.2 Interaction with Substrates 382 12.2 Setting the Stage 384 12.2.1 Mechanical and Thermomechanical Response of Solder Joints 386 12.3 Common Lead-Free Solder Alloy Systems 392 12.3.1 Solder Joints Formed Between Sn-Cu, Sn-Ag, and Sn-Ag-Cu Solder Alloys and Copper Surface Finishes 396 12.3.1.1 Sn-Cu Solder on Copper 396 12.3.1.2 Sn-Ag and Sn-Ag-Cu Solder Alloys on Copper 399 12.3.2 Solder Joints Formed Between Sn-Cu, Sn-Ag, and Sn-Ag-Cu Alloys and Nickel Surface Finishes 408 12.3.2.1 Ni-Sn 408 12.3.2.2 Sn-Ag Solder Alloys on Nickel 411 12.3.2.3 Spalling 415 12.3.2.4 Effects of Phosphorus Concentration in ENIG on Solder Joint Reliability 416 12.3.3 Au-Sn 417 12.4 High Lead – Exemption 422 12.5 Conclusions 423 References 423 13 Conformal Coatings 429Jason Keeping 13.1 Introduction 429 13.2 Environmental, Health, and Safety (EHS) Requirements 430 13.3 Overview of Types of Conformal Coatings 430 13.3.1 Types of Conformal Coatings 431 13.3.1.1 Acrylic Resins (Type AR) 432 13.3.1.2 Urethane Resins (Type UR) 433 13.3.1.3 Epoxy Resins (Type ER) 433 13.3.1.4 Silicone Resins (Type SR) 435 13.3.1.5 Para-xylylene (Type XY) 436 13.3.1.6 Synthetic Rubber (Type SC) 437 13.3.1.7 Ultra-Thin (Type UT) 438 13.4 Preparatory Steps Necessary to Ensure a Successful Coating Process 440 13.4.1 Assembly Cleaning 440 13.4.2 Assembly Masking 440 13.4.3 Priming and Other Surface Treatments 441 13.4.3.1 Measuring Surface Energy 441 13.4.3.2 Water Drop Contact Angle 447 13.4.4 Bake-Out 448 13.5 Various Methods of Applying Conformal Coating 449 13.5.1 Manual Coating 449 13.5.2 Dip 449 13.5.3 Hand Spray 450 13.5.4 Automatic Spray 451 13.5.5 Selective Coating 451 13.5.6 Vapor Deposition 451 13.6 Aspects for Cure, Inspection, and Demasking 453 13.6.1 Cure 453 13.6.1.1 Solvent Evaporation 453 13.6.1.2 Room Temperature Vulcanization (RTV) 454 13.6.1.3 Heat Cure 454 13.6.1.4 UV Cure 454 13.6.1.5 Catalyzed 454 13.6.2 UV Inspection 455 13.6.3 Demasking 455 13.7 Repair and Rework Processes 456 13.7.1 Chemical 456 13.7.2 Thermal 456 13.7.3 Mechanical 457 13.7.4 Abrasion (Micro-Abrasion) 457 13.7.5 Plasma Etch 457 13.8 Design Guidance on When and Where Conformal Coating is Required, and Which Physical Characteristics and Properties are Important to Consider 457 13.8.1 Is Conformal Coating Required? 458 13.8.1.1 Why Use It? 458 13.8.1.2 Why Not Use Conformal Coating? 459 13.8.2 Desirable Material Properties 459 13.8.3 Areas to Mask 461 13.9 Long-Term Reliability and Testing 462 13.10 Conclusions 462 13.11 Future Work 463 References 463 Index 467
£98.06
Hanser Publications Understanding Plastics Rheology
Book SynopsisThis book is designed to provide a background in polymer rheology to both engineering students and practicing engineers. It is written at an intermediate level with sufficient technical information and practical examples to enable the reader to understand the interesting and complex rheological behavior of polymers, to make the right decisions regarding rheological testing methods, and to troubleshoot rheology related problems encountered in polymer processing. The organization of the book and the practical examples throughout make it an ideal textbook and reference source. Processors and raw material suppliers will find the information within particularly valuable. Rheology is a rapidly growing and industrially important field, playing a significant role not only in polymer processing, but also in food processing, coating and printing, and many other manufacturing processes.
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A S M International ASM Handbook, Volume 24: Additive Manufacturing
Book SynopsisThis brand new volume in the ASM Handbook series has been developed to address the current and rapidly expanding importance of additive manufacturing (AM). ASM Handbook, Volume 24: Additive Manufacturing Processes provides the latest knowledge in materials, processes, and applications of AM, written by the leading experts in research and industry.It begins with an introduction and history of AM, authored by some of the key participants in that history as they trace the evolution of AM. The complete suite of materials and processes for polymers and ceramics are described in detail in the next two divisions. A division on metal AM processes begins with an in-depth description of the production and characterization of metal powders, which has a big effect on the success or failure of metal AM processes. The book describes AM processing of a wide variety of materials, illustrating differences in characteristics of metal alloys produced by AM processes in contrast to conventional processes. Volume 24 also covers direct-write processes, which take advantage of AM processes to combine materials and devices for multifunctional engineering applications.
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Plunkett Research, Ltd Plunkett's Apparel, Shoes & Textiles Industry Almanac 2022: Apparel, Shoes & Textiles Industry Market Research, Statistics, Trends and Leading Companies
Book SynopsisThe apparel and textiles industry is one of the industries most affected by globalization, and involves complex relationships that are constantly evolving. This carefully-researched book, formally Plunkett's Apparel & Textiles Industry Almanac, covers exciting trends in apparel and textile supply chains; manufacturing; design; women's, men's and children's fashions; shoes; accessories; retailing; trade; distribution; technologies; and smart fabrics. It includes a thorough market analysis as well as our highly respected trends analysis. It also includes thousands of contacts for business and industry leaders, industry associations, Internet sites and other resources. In addition, this book features extensive statistical tables, an industry glossary and thorough indexes. We are careful to detail the latest developments in global trade agreements, third party logistics and retail chain stores, along with important news from China and other emerging nations. The corporate profiles section of the book includes our proprietary, in-depth profiles of the 350 leading companies in all facets of the apparel and textiles industry. Major retailers, distributors, manufacturers and designers are covered thoroughly. You'll find a complete overview, industry analysis and market research report in one superb, value-priced package.
£276.25
ISTE Ltd and John Wiley & Sons Inc From Additive Manufacturing to 3D/4D Printing 2:
Book SynopsisAdditive manufacturing, which was first invented in France and then applied in the United States, is now 33 years old and represents a market of around 5 billion euros per year, with annual growth of between 20 and 30%. Today, additive manufacturing is experiencing a great amount of innovation in its processes, software, engineering and materials used. Its strength as a process has more recently allowed for the exploration of new niches, ranging from applications at nanometer and decameter scales, to others in mechanics and health. As a result, the limitations of the process have also begun to emerge, which include the quality of the tools, their cost of manufacture, the multi-material aspects, functionalities and surface conditions. Volume 2 of this series presents the current techniques, improvements and limits of additive manufacturing, providing an up-to-date review of this process.Table of ContentsAcknowledgments ix Foreword xi Preface xv Introduction xxix Part 1 Incremental Innovations and Technologies Pushed to their Limits 1 Chapter 1 Incremental Developments of Processes, Machines and Materials 3 1.1 Introduction 5 1.2 Undertaking non-layered stereolithography 8 1.2.1 Optimizing the light supply within a single-photon process 11 1.2.2 Transparent window 12 1.2.3 Gaseous interface 12 1.2.4 Simultaneous two-photon absorption 16 1.3 Challenging the notion of layers 26 1.3.1 Addition of prefabricated structures 26 1.3.2 Proof of concept 33 1.3.3 Synthesis 34 1.4 Optical-quality surface finish 35 1.4.1 Glasses lenses and contact lenses 36 1.4.2 Microlenses 36 1.4.3 Direct lens manufacture 37 1.4.4 Multi-mode optical fiber 39 1.5 Cold-cast metal 3D printing 40 1.5.1 Electrolytic deposition 40 1.5.2 Metallic ink 43 1.5.3 Laser processes 43 1.5.4 Photochemistry 45 1.5.5 Silver metal 46 1.5.6 Conducting polymers 49 1.6 Colored objects 51 1.7 Conclusion 54 1.8 Bibliography 56 Part 2 Additive Manufacturing Pushed to its Limits 71 Introduction to Part 2 73 Chapter 2 µ-Fluidics (or Microfluidics) 81 2.1 Introduction 81 2.2 Review of microfluidics 82 2.3 Applications 86 2.4 Return to additive manufacturing 89 2.4.1 Comment 1: LIFT process (Laser-Induced Forward Transfer) 91 2.4.2 Comment 2: FEBID process (Focused Electron Beam Induced Deposition) 92 2.4.3 Other methods 93 2.4.4 Hybrid methods 99 2.5 Conclusive outcomes 100 2.6 The converse problem: a potential µ-fluidics application to additive manufacturing 101 2.6.1 3D sintering 101 2.6.2 Deposition of polymerized particles 101 2.7 Provisional concept 110 2.8 Conclusion 111 2.9 Bibliography 112 Chapter 3 3D Nanomanufacturing, 3D µ-Electronics and µ-Robotics 121 3.1 Introduction 122 3.2 3D nano-facturing 125 3.2.1 Smart material: so-called “DNA origami” 125 3.2.2 Return from additive manufacturing to standard methods 131 3.2.3 Comment: nanomaterials and additive manufacturing 136 3.2.4 Conclusion 137 3.3 3D µ-electronics 140 3.3.1 2D or 3D electronic circuits 140 3.3.2 Subtractive/additive coupling 146 3.3.3 µ-Electronics 147 3.3.4 Conclusion and aspirations in the sphere 148 3.4 Actuators and µ-robots 148 3.5 Conclusion 150 3.6 Bibliography 151 Part 3 How Should We Go That One Step Further? 163 Chapter 4 A Short Reflection on Spheres to Explore Their Conditions for Achieving Success 165 4.1 Introduction 167 4.2 Favored spheres of innovation 174 4.2.1 How to know where we must anticipate this technology? 174 4.2.2 Opportunities 179 4.3 Some conditions to ensure additive manufacturing reaches maturity? 183 4.3.1 Moreover where does additive manufacturing sit within this interdisciplinarity framework? 186 4.3.2 Observations 191 4.3.3 Some possible solutions? 198 4.3.4 Proposed solutions? 200 4.4 A positive conclusion 202 4.5 Bibliography 203 Chapter 5 Questions of Hope and “Unhope” 213 5.1 Introduction 214 5.2 The “lab-tribe”(LT) approach 216 5.2.1 Context elements 218 5.2.2 Some results 220 5.2.3 “Scientific excellence” 227 5.2.4 Financing and the orientation of research 229 5.2.5 Prospective opportunities for the research unit 230 5.2.6 Collective projects? Risky projects? 233 5.3 Creativity’s place in research 237 5.3.1 Support to creativity? 238 5.3.2 But all the same, strong brakes on creativity… 240 5.3.3 What to do? 241 5.4 Innovation, a consequence of creativity 243 5.4.1 Academic system 247 5.4.2 Between productions resulting from science and responsible conscience 250 5.4.3 Engagement toward a future focused on innovation? 251 5.4.4 Caught between two chairs? Between more than two chairs? 252 5.4.5 Innovation as scientific production: is it born of freedom? What freedom? 254 5.5 What solutions to evoke for additive manufacturing? 257 5.5.1 General framing 257 5.5.2 And if the history of additive manufacturing in France were examined in light of these comments? 264 5.5.3 A bit of creativity? 275 5.6 In the form of a conclusion: a summary of the author’s point of view 279 5.7 Bibliography 282 Conclusion 297 Index 301
£125.06
ISTE Ltd and John Wiley & Sons Inc Optics in Instruments: Applications in Biology
Book SynopsisOptics is a science which covers a very large domain and is experiencing indisputable growth. It has enabled the development of a considerable number of instruments, the optical component or methodology of which is often the essential part of portent systems. This book sets out show how optical physical phenomena such as lasers – the basis of instruments of measurement – are involved in the fields of biology and medicine. Optics in Instruments: Applications in Biology and Medicine details instruments and measurement systems using optical methods in the visible and near-infrared, as well as their applications in biology and medicine, through looking at confocal laser scanning microscopy, the basis of instruments performing in biological and medical analysis today, and flow cytometry, an instrument which measures at high speed the parameters of a cell passing in front of one or more laser beams. The authors also discuss optical coherence tomography (OCT), which is an optical imaging technique using non-contact infrared light, the therapeutic applications of lasers, where they are used for analysis and care, and the major contributions of plasmon propagation in the field of life sciences through instrumental developments, focusing on propagating surface plasmons (PSP) and localized plasmons (LP). Contents: 1. Confocal Laser Scanning Microscopy, Thomas Olivier and Baptiste Moine. 2. Flow Cytometry (FCM) Measurement of Cells in Suspension, Odile Sabido. 3. Optical Coherence Tomography, Claude Boccara and Arnaud Dubois. 4. Therapeutic Applications of Lasers, Geneviève Bourg-Heckly and Serge Mordon. 5. Plasmonics, Emmanuel Fort. About the Authors Jean-Pierre Goure is Emeritus Professor of optics at Jean Monnet University in Saint-Etienne, France, and was previously director of the UMR 5516 laboratory linked with CNRS. He is the author of more than 100 publications in various fields, such as spectroscopy, instrumentation, sensors, optical fiber and optical communications. He was also previously deputy director in engineering science at CNRS and a member of several scientific associations such as the French Optical Society and the European Optical Society.Table of ContentsPreface ix Introduction xiii Chapter 1 Confocal Laser Scanning Microscopy 1 Thomas OLIVIER and Baptiste MOINE 1.1. Introduction 1 1.1.1. Context and framework of chapter 1 1.1.2. From wide-field microscopy to confocal microscopy 3 1.2. Principle and implementation 6 1.2.1. General principle 7 1.2.2. Axial and lateral resolution in confocal microscopy 9 1.2.3. Some notions of fluorescence 21 1.2.4. Main elements of a confocal scanning laser microscope 25 1.3. Applications in biology, potential and limitations 40 1.3.1. Basic elements of biology for the neophyte 41 1.3.2. Fluorescent labeling 43 1.3.3. Practical implementation of confocal microscopy 46 1.4. Related and derived techniques 62 1.4.1. Advanced contrast modes: FRAP, FLIP, FLIM, FRET, etc. 62 1.4.2. The contribution of nonlinear contrast modes 66 1.4.3. Recent major advances: overcoming the diffraction limit 72 1.5. Bibliography 74 Chapter 2 Flow Cytometry (FCM) Measurement of Cells in Suspension 79 Odile SABIDO 2.1. History of FCM 79 2.2. Components of the cytometer: fluidics, optics and signal processing 80 2.2.1. Fluidics 81 2.2.2. Optics 81 2.2.3. Signal processing 83 2.3. Experimentation strategy 83 2.3.1. Visualizations of the spectra 84 2.3.2. Compensation of fluorescences 84 2.3.3. Checking the optical bench 84 2.3.4. Presentation of parameters A/H/W 85 2.3.5. Graphical presentation 85 2.4. Types of platform for FCM 87 2.4.1. Clinical platform 87 2.4.2. Research platform 87 2.5. Principle of cell sorting 88 2.6. Analyzed parameters 90 2.6.1. Light scattering 90 2.6.2. Fluorochromes 90 2.7. Applications in biology 93 2.7.1. Clinical 93 2.7.2. Research 93 2.7.3. Environment 94 2.7.4. Plant biology 94 2.7.5. Industrial microbiology 94 2.8. Complementarities of the FCM with the other cytometries, confocal and dynamic 95 2.9. Cytometry on beads, LUMINEXTM type 95 2.10. Scientific societies 96 2.11. Websites to visit 96 2.12. Bibliography 97 2.13. Reference books 99 Chapter 3 Optical Coherence Tomography 101 Claude BOCCARA and Arnaud DUBOIS 3.1. Introduction 101 3.2. Principles of OCT 102 3.3. Frequency-domain OCT 104 3.4. Spatial resolution 106 3.5. Applications of OCT 107 3.5.1. Ophtalmology 107 3.5.2. Internal medicine 107 3.5.3. Other fields of application 108 3.6. Extensions of OCT 109 3.7. Full-field OCT 110 3.7.1. Principle 110 3.7.2. Spatial resolution 111 3.7.3. Dynamics and sensitivity 113 3.7.4. Operating speed 113 3.7.5. Applications 114 3.8. Conclusion 119 3.9. Bibliography 119 Chapter 4 Therapeutic Applications of Lasers 125 Geneviève BOURG-HECKLY and Serge MORDON 4.1. Introduction 125 4.2. Interaction of light with biological tissues 127 4.2.1. Optical parameters characterizing light radiation 127 4.2.2. The three types of interaction between a light beam and a biological tissue 131 4.2.3. Penetration of light in biological tissues 151 4.3. Therapeutic effects of lasers 155 4.3.1. Thermal effect 156 4.3.2. Photoablative effect 167 4.3.3. Photochemical or photodynamic effect 168 4.3.4. The electromechanical effect 174 4.4. Conclusion 175 4.5. For more information 175 4.6. Bibliography 176 Chapter 5 Plasmonics 179 Emmanuel FORT 5.1. Propagating surface plasmons 180 5.1.1. Theoretical reminders and definitions 180 5.1.2. Surface plasmon resonance sensors 185 5.1.3. Units and sensitivity of SPR sensors 189 5.1.4. Other SPR configurations 190 5.1.5. SPR imaging 191 5.1.6. Surface plasmons coupled fluorescence 194 5.2. Localized surface plasmons 201 5.2.1. Theoretical reminders 201 5.2.2. Detection of plasmonic nanoprobes 203 5.3. Conclusion 210 5.4. Bibliography 211 List of Authors 217 Index 219
£125.06
John Wiley & Sons Inc An Introductory Guide to Flow Measurement
Book SynopsisNow available in a new improved format, this second edition is completely revised and updated. An Introductory Guide to Flow Measurement is an indispensable guide for the busy practising engineer. It provides a ready source of information on flowmeters, their operation, installation, and relative advantages and disadvantages in different applications. This revised edition retains the succinct style of the original, with plenty of clear line diagrams and shading to highlight key points, it is comprehensive and easy-to-use. The material is based on the author’s own lectures at Cranfield Institute of Technology, UK, but incorporates lessons learned through using the first edition as a teaching tool during the 13 years since its first publication. It aims to transmit as much information as possible, as efficiently as possible, in as short a time as possible. Essential reading for any engineer faced with a flow measurement problem – this book will enable the reader to assess advice received from manufacturers and contribute to discussions with experts. Existing and new readers alike will welcome this updated version of the well established and highly regarded Introductory Guide to Flow Measurement. Key areas considered include: Accuracy; flow behavior, and fluid parameters Calibration techniques Selection Momentum flowmeters Volumetric flowmeters Mass flowmeters Probes and tracers Recent developments and future trends Table of ContentsPart 1 Introduction: accuracy; flowmeter systems; flow in pipes; effect on flowmeters; essential equations of flow; fluid parameters; multiphase flows. Part 2 Calibration: datum conditions; steady flow; calibration rigs for liquids; calibration rigs for gases; master meters; site calibrations; general comments. Part 3 Selection: considerations in selecting a flowmeter; nature of the fluid to be metered; flowmeter constraints; environment; special effects; price; choosing. Part 4 Momentum flowmeters: orifice plate meter; Venturi meter; special orifice plates and flow nozzles; critical nozzle (sonic nozzle); other differential pressure devices; target meter (drag plate); variable area, Rotameter (R) or float-in-tube meter; momentum-sensing flowmeters - general comments. Part 5 Volumetric flowmeters: positive displacement meters; turbine meters; oscillatory meters; electromagnetic meters; ultrasonic meters. Part 6 Mass flowmeters: introduction; thermal mass flow measurement; angular momentum fuel flowmeter; Coriolis flowmeters. Part 7 Probes and tracers: probes; averaging pitot; tracers; conclusions. Part 8 Recent developments and likely future trends in flow measurement: instruments; meters for multiphase flow; developing technologies; manufacture and management; conclusions.
£74.66
ISTE Ltd and John Wiley & Sons Inc Modern Sensors Handbook
Book SynopsisModern sensors working on new principles and/or using new materials and technologies are more precise, faster, smaller, use less power and are cheaper. Given these advantages, it is vitally important for system developers, system integrators and decision makers to be familiar with the principles and properties of the new sensor types in order to make a qualified decision about which sensor type to use in which system and what behavior may be expected. This type of information is very difficult to acquire from existing sources, a situation this book aims to address by providing detailed coverage on this topic. In keeping with its practical theme, the discussion concentrates on sensor types used or having potential to be used in industrial applications.Table of ContentsChapter 1. Pressure Sensors 1 André MIGEON and Anne-Elisabeth LENEL 1.1. Introduction 1 1.2. Pressure 2 1.2.1. Pressure as a physical quantity 2 1.2.2. Absolute, relative and differential sensors 3 1.2.3. Fluid physical properties 5 1.3. Pressure ranges 6 1.3.1. Vacuum and ultra-vacuum 6 1.3.2. Middle range pressure 8 1.3.3. High pressure 10 1.4. Main physical principles 10 1.4.1. The sensing device 11 1.4.2. Sensors with elastic element 13 1.4.3. Vacuum sensors 41 1.5. Calibration: pressure standards 43 1.5.1. Low pressure standard 43 1.5.2. High pressure standard 43 1.6. Choosing a pressure sensor 45 1.7. References 45 1.8. Other pressure sensor manufacturers 46 1.9. Bibliography 46 Chapter 2. Optical Sensors 49 Stanislav AO and Jan FISCHER 2.1. Optical waveguides and fibers 49 2.2. Light sources and detectors 51 2.2.1. Light sources 51 2.2.2. Light detectors 54 2.3. Sensors of position and movement 62 2.3.1. Position sensors using the principle of triangulation 62 2.3.2. Incremental sensors of position or displacement 63 2.3.3. Photoelectric switches 66 2.4. Optical sensors of dimensions 71 2.4.1. Dimensional gauge with scanned beam 71 2.5. Optical sensors of pressure and force 73 2.5.1. Pressure sensor using the optical resonator 73 2.6. Optical fiber sensors 74 2.6.1. Introduction and classification of sensors with optical fibers 74 2.6.2. Optical fiber sensors with amplitude modulation 75 2.6.3. Sensor with wavelength modulation 77 2.6.4. Optical sensors with phase modulation 78 2.6.5. Perspective of optical fiber sensors 78 2.7. Optical chemical sensors 78 2.7.1. Introduction 78 2.7.2. Chemical sensors based on the absorbency measurement 79 2.7.3. Turbidity sensors 80 2.8. Bibliography 81 2.8.1. Books 81 2.8.2. Physical background – websites 82 Chapter 3. Flow Sensors 83 R. MEYLAERS, F. PEETERS, M. PEETERMANS and L. INDESTEEGE 3.1. Introduction 83 3.1.1. Volume flow and mass flow 83 3.1.2. Influences on the flow 85 3.1.3. Bernoulli equation 86 3.2. Flow measurements based on the principle of difference in pressure 88 3.2.1. The Pitot and Prandtl tube 89 3.2.2. The orifice plate 93 3.2.3. The flow nozzle 98 3.2.4. The Venturi tube 99 3.2.5. The Dall tube 99 3.2.6. General guidelines for a correct reading 100 3.3. Flow measurements based on variable passage 101 3.3.1. The float flow meter (rotameter) 101 3.3.2. Target flow meter 103 3.4. Turbine flow meter 104 3.4.1. Principle 104 3.4.2. Practical installation 106 3.4.3. Characteristics 107 3.5. The mechanical flow meter (positive displacement) 108 3.5.1. Principle 108 3.5.2. Characteristics 110 3.6. Magnetic flow meter 110 3.6.1. Principle 110 3.6.2. Construction of the measuring instrument 112 3.6.3. Practical installation 113 3.6.4. Characteristics 115 3.7. The vortex flow meter 116 3.7.1. Principle 116 3.7.2. Construction of the vortex flow meter 117 3.7.3. Practical installation 120 3.7.4. Characteristics 121 3.8. Ultrasonic flow meter 122 3.8.1. Principle 122 3.8.2. Practical installation 125 3.8.3. Characteristics 125 3.9. Coriolis mass flow meters 126 3.9.1. Principle 126 3.9.2. Applications 128 3.9.3. Practical installation 129 3.9.4. Characteristics 129 3.10. Flow measurements for solid substances 129 3.10.1. Flow measurement of solids by means of an impact plate 130 3.10.2. Flow measurement of solids based on the weighing method 132 3.10.3. Capacitive flow measurement of solid substances 133 3.10.4. Detection of solid substances using microwaves 134 3.11. Flow measurement for open channels with weirs 135 3.12. Choice and comparison of flow measurements 137 3.13. Bibliography 137 3.14. Website references 137 Chapter 4. Intelligent Sensors and Sensor Networks 141 Jirí NOVAK 4.1. Introduction 141 4.2. Intelligent sensors 142 4.2.1. Sensors and transducers 143 4.2.2. Signal conditioning (SC) 144 4.2.3. A/D conversion 146 4.2.4. Data processing 147 4.2.5. Human-machine interface 148 4.2.6. Communication interface 148 4.2.7. Industrial examples 149 4.3. Sensor networks and interfaces 151 4.3.1. Centralized and distributed industrial systems 152 4.3.2. Hierarchical structure of distributed communication 154 4.3.3. Data communication basics 155 4.3.4. Simple sensor interfaces 166 4.3.5. Sensor networks 171 4.3.6. Wireless sensor networks 190 Chapter 5. Accelerometers and Inclinometers 193 André MIGEON and Anne-Elisabeth LENEL 5.1. Introduction 193 5.2. Acceleration 194 5.2.1. Physical quantity 194 5.2.2. Application to velocity and position measurements 198 5.2.3. Application to position measurements 199 5.2.4. The inclinometers 200 5.3. Application ranges 201 5.3.1. Static and low-frequency acceleration. 201 5.3.2. Vibrations 202 5.3.3. Shocks 203 5.3.4. Inclination 204 5.4. Main models of accelerometers 205 5.4.1. Piezoelectric accelerometers 206 5.4.2. Piezoresistive accelerometers 213 5.4.3. Accelerometers with resonators 219 5.4.4. Capacitive accelerometers 221 5.4.5. Potentiometric accelerometers 224 5.4.6. Optical detection accelerometers 226 5.4.7. Magnetic detection accelerometers 227 5.4.8. Servo accelerometers with controlled displacement 229 5.5. The signal processing associated with accelerometers 231 5.6. Manufacturing process 232 5.6.1. The monolithic processes 232 5.6.2. Hybrid process 234 5.6.3. Packaging 234 5.7. The calibrations 235 5.7.1. Inclinometers and accelerometers with range lower than 1 g 235 5.7.2. Acceleration range higher than 1 g 235 5.8. Examples of accelerometers and inclinometers 236 5.9. List of manufacturers of accelerometers 242 5.10. References 243 5.11. Bibliography 244 Chapter 6. Chemical Sensors and Biosensors 245 Gillian McMAHON 6.1. Introduction 245 6.2. What is involved in developing a sensor? 249 6.2.1. Molecular recognition 250 6.2.2. Immobilization of host molecules 252 6.2.3. Transduction of signal 253 6.3. Electrochemical sensors 253 6.3.1. Amperometric and voltammetric sensors 254 6.3.2. Potentiometric sensors 258 6.3.3. Resistance, conductance and impedance sensors 263 6.4. Optical sensors 265 6.4.1. Methods of detection 265 6.4.2. Reagent-mediated sensors 268 6.5. Acoustic (mass) sensors 269 6.5.1. Quartz crystal microbalance sensors 270 6.5.2. Sensor arrays 272 6.6. Biosensors 274 6.6.1. Affinity biosensors 275 6.6.2. Catalytic biosensors 285 6.7. Future trends 290 6.7.1. Microanalytical instruments as sensors 291 6.7.2. Autonomous sensing devices 298 6.7.3. Sub-micron dimensioned sensors 298 6.8. Conclusions 301 6.9. References 302 Chapter 7. Level, Position and Distance 305 Stanislav DADO and G. HARTUNG 7.1. Introduction 305 7.1.1. Classification of LPD sensors 305 7.2. Resistive LPD sensors 306 7.2.1. Potentiometer 306 7.2.2. Angular position measurement 307 7.2.3. Draw wire sensors 308 7.2.4. Inclination detectors 308 7.2.5. Application of potentiometers 309 7.3. Inductive LPD sensors 309 7.3.1. Linear variable differential transformers 310 7.3.2. Inductosyns 311 7.3.3. Resolvers 312 7.3.4. Selsyn 313 7.3.5. Inductive sensors of angular velocity 313 7.3.6. Eddy current distance sensors 314 7.4. Magnetic LPD sensors 315 7.4.1. Magnetic field sensors 315 7.4.2. Reed switches 316 7.4.3. Hall sensors 316 7.4.4. Semiconductor magnetoresistors 317 7.4.5. Wiegand wire 318 7.4.6. Magnetostrictive sensor 318 7.5. Capacitive LPD sensors 319 7.5.1. Introduction 319 7.5.2. Signal conditioning circuits for capacitive sensors 320 7.5.3. Using capacitive sensors 321 7.6. Optical LPD sensors 323 7.6.1. Introduction 323 7.6.2. Photo-electric switches (PES) 323 7.6.3. LPD sensors based on triangulation 327 7.6.4. Optical encoders 328 7.6.5. Interferometry 330 7.6.6. Optical LPD sensors based on travel time (time-of-fly) measurement 331 7.6.7. Image-based measurement-machine vision, videometry 332 7.7. Ultrasonic sensors 333 7.7.1. Introduction 333 7.7.2. Travel time principle 334 7.7.3. Doppler effect 334 7.8. Microwave distance sensors (radar) 335 7.8.1. Introduction 335 7.8.2. Microwave sensors based on FMCW 336 7.8.3. Properties of microwave sensors 337 7.9 Level measurement 337 7.9.1. Introduction 337 7.9.2. Detection limits 338 7.9.3. Continuous level measurement 339 7.10. Conclusions and trends 343 7.11. References 343 7.12. Online references 344 Chapter 8. Temperature Sensors 347 F. PEETERS, M. PEETERMANS and L. INDESTEEGE 8.1. Introduction 347 8.2. Thermal measuring techniques 348 8.2.1. Heat and temperature 348 8.2.2. Static and dynamic readings 348 8.2.3. Time constant and response time 349 8.2.4. Thermal units 349 8.2.5. Thermal equilibrium 350 8.2.6. Temperature measuring options 354 8.2.7. Quality of a measurement 355 8.3. Physical or direct temperature measurement 355 8.3.1. Glass thermometer 355 8.3.2. Liquid filled expansion thermometers 356 8.3.3. Gas filled expansion thermometer or pressure thermometer detector 358 8.3.4. Vapor-pressure systems 359 8.3.5. Bimetallic thermometer 361 8.4. Thermoelectric measurements (thermocouples) 363 8.4.1. Measuring principle: thermoelectricity 363 8.4.2. Thermoelectric laws 364 8.4.3. Practical temperature measurement with thermocouples 367 8.4.4. Technological realizations of thermocouples 371 8.4.5. Applications 374 8.4.6. Parallel and series connections of thermocouples 375 8.5. Resistance temperature detectors (RTDs) 377 8.5.1. Principle 377 8.5.2. Used materials and construction 379 8.5.3. Applications 380 8.6. Thermistors 382 8.6.1. Principle 382 8.6.2. Thermistor technology 383 8.6.3. Application 384 8.7. Monolithic temperature sensors (IC sensor) 384 8.8. Pyrometers 385 8.8.1. Introduction 385 8.8.2. Basic principles of pyrometry 386 8.8.3. Measurement possibilities for pyrometers 387 8.8.4. Implementation and construction of pyrometers 389 8.9. References 391 8.10 Bibliography 391 Chapter 9. Solid State Gyroscopes and Navigation 395 André MIGEON and Anne-Elisabeth LENEL 9.1. Introduction 395 9.2. The angular rate 396 9.2.1. Definition of rate gyro 399 9.2.2. Use of rate sensors 401 9.3. Different ranges of rate gyro 401 9.3.1. Control of trajectory 402 9.3.2. Piloting and stabilization 402 9.3.3. Guidance 402 9.3.4. Navigation 402 9.4. Main models of rate gyro 404 9.4.1. Rotary gyrometers 404 9.4.2. Vibrating gyrometers 404 9.4.3. Optical gyrometers 420 9.4.4. Other original principles 426 9.5. Calibration of rate sensors 426 9.6. General features of the gyrometers 427 9.7. The main manufacturers 429 9.8. References 430 9.9. Bibliography 431 Chapter 10. Magnetic Sensors 433 S. RIPKA and Pavel RIPKA 10.1. Introduction 433 10.2. Hall sensors 434 10.2.1. The Hall effect 435 10.2.2. New types of Hall sensors 437 10.3. AMR sensors 439 10.3.1. Operating principles of the AMR effect 439 10.3.2. Measuring configuration of the AMR 443 10.3.3. Flipping 444 10.3.4. Magnetic feedback 446 10.4. GMR sensors 447 10.4.1. Physical mechanism 450 10.4.2. Spin valves 450 10.4.3. Sandwiches and multilayers 453 10.4.4. SDT sensors 454 10.4.5. Linear GMR sensors 454 10.4.6. Rotational GMR sensors 456 10.5. Induction and fluxgate sensors 457 10.5.1. Induction coil sensors 458 10.5.2. Fluxgate sensors 459 10.6. Other magnetic field sensors 463 10.6.1. Resonance sensors 463 10.7. Magnetic position sensors 465 10.7.1. Sensors using permanent magnets 465 10.7.2. Eddy current sensors 466 10.7.3. Linear and rotational transformers 467 10.7.4. Magnetostrictive position sensors 469 10.7.5. Proximity switches 469 10.8. Contactless current sensors 471 10.8.1. Hall current sensors 472 10.8.2. Magnetoresistive current sensors 472 10.8.3. AC and DC transformers 472 10.8.4. Current clamps 472 10.9. References 473 Chapter 11. New Technologies and Materials 477 A. TIPEK, P. RIPKA and E. HULICIUS, with contributions from A. HOSPODKOVÁ and P. NEU?IL 11.1. Introduction: MEMS 477 11.2. Materials 480 11.2.1. Passive materials 480 11.2.2. Active materials 481 11.2.3. Silicon 481 11.2.4. Other semiconductors 483 11.2.5. Plastics 484 11.2.6. Metals 486 11.2.7. Ceramics 486 11.2.8. Glass 486 11.3. Silicon planar IC technology 487 11.3.1. The substrate: crystal growth 488 11.3.2. Diffusion and ion implantation 488 11.3.3. Oxidation 489 11.3.4. Lithography and etching 489 11.3.5. Deposition of materials 490 11.3.6. Metallization and wire bonding 490 11.3.7. Passivation and encapsulation 491 11.4. Deposition technologies 491 11.4.1. Introduction 491 11.4.2. Chemical reactions 492 11.4.3. Physical reactions 495 11.4.4. Epitaxial techniques for semiconductor device preparation 498 11.5. Etching processes 500 11.5.1. Wet etching/micromachining 501 11.5.2. Dry etching/micromachining 502 11.6. 3-D microfabrication techniques 503 11.6.1. LIGA 504 11.6.2. Laser assisted etching (LAE) 504 11.6.3. Photo-forming and stereo lithography 505 11.6.4. Microelectrodischarging (MEDM and WEDG) 506 11.6.5. Microdrip fabrication 507 11.6.6. Manufacturing using scanning probe microscopes and electron microscopes 508 11.6.7. Handling of micro particles with laser tweezers 508 11.6.8. Atomic manipulation 509 11.7. References 510 List of Authors 513 Index 515
£278.96
Springer Nature Switzerland AG Computational Intelligence Methods for Super-Resolution in Image Processing Applications
Book SynopsisThis book explores the application of deep learning techniques within a particularly difficult computational type of computer vision (CV) problem ─ super-resolution (SR). The authors present and discuss ways to apply computational intelligence (CI) methods to SR. The volume also explores the possibility of using different kinds of CV techniques to develop and enhance the tools/processes related to SR. The application areas covered include biomedical engineering, healthcare applications, medicine, histology, and material science. The book will be a valuable reference for anyone concerned with multiple multimodal images, especially professionals working in remote sensing, nanotechnology and immunology at research institutes, healthcare facilities, biotechnology institutions, agribusiness services, veterinary facilities, and universities.Table of ContentsPart I. A Panorama of Computational Intelligence in Super-Resolution Imaging.- Chapter 1. Introduction to Computational Intelligence and Super-Resolution.- Chapter 2. Review on Fuzzy Logic Systems with Super-Resolved Imaging and Metaheuristics for Medical Applications.- Chapter 3. Super-Resolution with Deep Learning Techniques-A Review.- Chapter 4. A Comprehensive Review of CAD Systems in Ultrasound and Elastography for Breast Cancer Diagnosis.- Part II. State-of-the-Art Computational Intelligence in Super-Resolution Imaging.- Chapter 5. Pictorial Image Synthesis from Text and Its Super-Resolution using Generative Adversarial Networks.- Chapter 6. Analysis of Lossy and Lossless Compression Algorithms for Computed Tomography Medical Images Based on Bat and Simulated Annealing Optimization Techniques.- Chapter 7. Super resolution-based Human-Computer Interaction System for Speech and Hearing Impaired using Real-Time Hand Gesture Recognition System.- Chapter 8. Lossy Compression of Noisy Images Using Autoencoders for Computer Vision Applications.- Chapter 9. Recognition of Handwritten Nandinagari Palm Leaf Manuscript Tex.- Chapter 10. Deep Image Prior and Structural Variation Based Super-Resolution Network for Fluorescein Fundus Angiography Images.- Chapter 11. Lightweight Spatial Geometric Models Assisting Shape Description and Retrieval and Relative Global Optimum Based Measure for Fusion.- Chapter 12. Dual-Tree Complex Wavelet Transform and Deep CNN-based Super-Resolution for Video Inpainting with Application to Object Removal and Error Concealment.- Chapter 13. Super-Resolution Imaging and Intelligent solution for Classification, Monitoring and Diagnosis of Alzheimer's Disease.- Chapter 14. Image Enhancement using Non-Local Prior and Gradient Residual Minimization for Improved Visualization of Deep Underwater Image.- Chapter 15. Relative Global Optimum Based Measure for Fusion Technique in Shearlet Transform Domain for Prognosis of Alzheimer Disease.
£142.49
Springer Verlag, Singapore Handbook on Synthesis Strategies for Advanced
Book SynopsisThis book presents state-of-the-art coverage of synthesis of advanced functional materials. Unconventional synthetic routes play an important role in the synthesis of advanced materials as many new materials are metastable and cannot be synthesized by conventional methods. This book presents various synthesis methods such as conventional solid-state method, combustion method, a range of soft chemical methods, template synthesis, molecular precursor method, microwave synthesis, sono-chemical method and high-pressure synthesis. It provides a comprehensive overview of synthesis methods and covers a variety of materials, including ceramics, films, glass, carbon-based, and metallic materials. Many techniques for processing and surface functionalization are also discussed. Several engineering aspects of materials synthesis are also included. The contents of this book are useful for researchers and professionals working in the areas of materials and chemistry. Table of Contents
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Book SynopsisThis book presents a model of organization transformation success. The model is illustrated through description and analysis of an actual, two-decade, highly successful, global enterprise transformation Six Sigma program at a Fortune 200 company -- Cummins, Inc. Table of ContentsList of Figures and TablesList of Acronyms and AbbreviationsForeword – Change by Frank McDonaldAbout the AuthorsChapter 1: Introduction and PurposeChapter 2: Interview with Tim Solso, Cummins CEO 2000-2011Chapter 3: Six Sigma Pre-HistoryChapter 4: The Bottom Line: ResultsChapter 5: S-Curves and Kano – Maturity and SustainabilityChapter 6: Interview with Frank McDonald – Cummins Vice President of Quality (1999-2002)Chapter 7: S-Curve 1 – Pre-launch Chapter 8: S-Curve 2 – Launch and First ProjectsChapter 9: Preparing for the Next S-Curve – Cross-Curve Analysis: A SummaryChapter 10: Interview with Joe Loughrey – Cummins President & COO (2005-2008)Chapter 11: Moving from First Training and Projects S-Curve to the Building a Foundation S-CurveChapter 12: Interview with Michelle Dunlap – Master Black Belt, Quality ChampionChapter 13: Interview with Dana Vogt – Black Belt, Master Black Belt, Quality ChampionChapter 14: S-Curve 3 – Building a FoundationChapter 15: Moving from Building a Foundation to the Self-Supporting S-CurveChapter 16: Interview with Megan Henry – Black Belt, Master Black Belt, Six Sigma LeaderChapter 17: S-Curve 4 – Self-SupportingChapter 18: Interview with Ginger Lirette – Black BeltChapter 19: Moving from Self-Supporting to the Business Integration S-CurveChapter 20: Interview with Tom Linebarger– Cummins CEO (2011+)Chapter 21: S-Curve 5 – Business IntegrationChapter 22: Moving from Business Integration to Continued Growth and Expansion and Business System Improvement S-CurvesChapter 23: S-Curve 6 – Continued Growth and ExpansionChapter 24: Interview with Julie Liu – Black Belt, Quality Champion, Six Sigma LeaderChapter 25: S-Curve 7 – Business System ImprovementChapter 26: Interview with Holly Duarte - Black BeltChapter 27: The Effect of Maturity on Organizational CommunicationChapter 28: How to use S-CurvesChapter 29: Important Considerations for a Healthy Long-Term Six Sigma DeploymentChapter 30: Special SituationsChapter 31: ConclusionsChapter 32: Final ThoughtsAppendicesIndex
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