Electronics: circuits and components Books

Book SynopsisIn today's globally competitive wireless industry, the design-to-production cycle is critically important. Circuit and system engineers must be able to develop robust designs that can be mass produced. To accomplish this, engineers need to learn the requirements of, and solutions leading to, optimum performance. The first of a two-volume set, this text takes a practical approach to RF (radio frequency) circuit design, offering an understanding of the fundamental concepts that practitioners need to know and use for their work in this industry. It seeks to lay the groundwork for efficient passive circuit design.Table of ContentsIntroduction to RF circuit design; the radio as a typical RF system; RF circuit fundamentals; CAD of linear RF/MW circuits; scattering parameters and the Smith Chart; passive component modelling; impedance matching; lumped and distributed filters; high-speed circuit design considerations.

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Book SynopsisPower distribution networks (PDNs) are key components in today's high-performance electronic circuitry. They ensure that circuits have a constant, stable supply of power. The complexities of designing PDNs have been dramatically reduced by frequency-domain analysis. This book examines step-by-step how electrical engineers can use frequency-domain techniques to accurately simulate, measure, and model PDNs. It guides engineers through the ins and outs of these techniques to ensure they develop the right PDN for any type of circuit. Circuit engineers gain valuable insight from the book's best practices for measuring, simulating, and modeling. Practical examples illustrate every phase in PDN development from material characterization and component design to modeling the entire network.Table of ContentsIntroduction. Simulation Methods and Tools. Modeling of Vias; Modeling of Planes. Measurement Basics. Probes and Calibrations; Measurements - Practical Details. Modeling of Capacitors. Modeling of Inductors, Converters and Systems.

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Book SynopsisThis undergraduate textbook for electrical and computer engineering students is dedicated solely to digital CMOS electronics. It covers many of the topics of graduate level textbooks, but in an introductory style specifically crafted (and course tested) for undergraduates. Students will not need a prerequisite in analog electronics, allowing instructors flexibility in course scheduling. This book blends the academic and industrial experience of the authors to define a base of electronics instruction for the CMOS chip industry. CMOS Digital Integrated Circuits: A First Course teaches the fundamentals of modern CMOS technology by focusing on central themes and avoiding excessive details. Extensive examples, self-exercises, and end-of chapter problems assist in teaching the current practices of industry and subjects taught by graduate courses in microelectronics. Computer engineering curriculums can remove the analog electronics prerequisite altogether when adopting this book. Key Features: CMOS technology written specifically for (and tested by) undergraduates. Equal treatment to both types of MOSFET transistors that make up computer circuits. Power properties of logic circuits. Physical and electrical properties of metals. Introduction of timing circuit electronics. Introduction of layout. Real-world examples and problem sets. Table of Contents Chapter 1: Basic Logic Gate and Circuit Theory Chapter 2: Semiconductor Physics Chapter 3: MOSFET Transistors Chapter 4: Metal Interconnection Properties Chapter 5: The CMOS Inverter Chapter 6: CMOS NAND, NOR, and Transmission Gates Chapter 7: CMOS Circuit Design Styles Chapter 8: Sequential Logic Gate Design and Timing Chapter 9: IC Memory Circuits Chapter 10: Programmable Logic - FPGAs Chapter 11: CMOS Circuit Layout Chapter 12: How Chips Are Made

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Book SynopsisAs integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above.Table of Contents Chapter 1: Heat in integrated circuits and systems Chapter 2: On-chip temperature sensing Chapter 3: Dynamic thermal management Chapter 4: Active cooling Chapter 5: Mitigating thermal events at the system level and above Chapter 6: Emerging directions in thermal-aware systems Appendix A: Relevant units and metrics

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Book SynopsisThis book is devoted to embedded systems (ESs), which can now be found in practically all fields of human activity. Embedded systems are essentially a special class of computing systems designed for monitoring and controlling objects of the physical world. The book begins by discussing the distinctive features of ESs, above all their cybernetic-physical character, and how they can be designed to deliver the required performance with a minimum amount of hardware. In turn, it presents a range of design methodologies. Considerable attention is paid to the hardware implementation of computational algorithms. It is shown that different parts of complex ESs could be implemented using models of finite state machines (FSMs). Also, field-programmable gate arrays (FPGAs) are very often used to implement different hardware accelerators in ESs. The book pays considerable attention to design methods for FPGA-based FSMs, before the closing section turns to programmable logic controllers widely used in industry. This book will be interesting and useful for students and postgraduates in the area of Computer Science, as well as for designers of embedded systems. In addition, it offers a good point of departure for creating embedded systems for various spheres of human activity. Table of ContentsIntroduction into embedded systems.- Design of embedded systems.- Implementation of computational algorithms in embedded systems.- Field programmable gate arrays.- Implementing Control Algorithms with FPGAs.- Programmable Logic Controllers.- Conclusion.

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Book SynopsisThis book provides a hands-on, application-oriented guide to the language and methodology of both SystemVerilog Assertions and Functional Coverage. Readers will benefit from the step-by-step approach to learning language and methodology nuances of both SystemVerilog Assertions and Functional Coverage, which will enable them to uncover hidden and hard to find bugs, point directly to the source of the bug, provide for a clean and easy way to model complex timing checks and objectively answer the question ‘have we functionally verified everything’. Written by a professional end-user of ASIC/SoC/CPU and FPGA design and Verification, this book explains each concept with easy to understand examples, simulation logs and applications derived from real projects. Readers will be empowered to tackle the modeling of complex checkers for functional verification and exhaustive coverage models for functional coverage, thereby drastically reducing their time to design, debug and cover. This updated third edition addresses the latest functional set released in IEEE-1800 (2012) LRM, including numerous additional operators and features. Additionally, many of the Concurrent Assertions/Operators explanations are enhanced, with the addition of more examples and figures. · Covers in its entirety the latest IEEE-1800 2012 LRM syntax and semantics; · Covers both SystemVerilog Assertions and SystemVerilog Functional Coverage languages and methodologies; · Provides practical applications of the what, how and why of Assertion Based Verification and Functional Coverage methodologies; · Explains each concept in a step-by-step fashion and applies it to a practical real life example; · Includes 6 practical LABs that enable readers to put in practice the concepts explained in the book.Table of ContentsIntroduction.- System Verilog Assertions.- Immediate Assertions.- Concurrent Assertions – Basics (sequence, property, assert).- Sampled Value Functions $rose, $fell.- Operators.- System Functions and Tasks.- Multiple clocks.- Local Variables.- Recursive property.- Detecting and using endpoint of a sequence.- ‘expect’.- ‘assume’ and formal (static functional) verification.- Other important topics.- Asynchronous Assertions !!!.- IEEE-1800–2009 Features.- SystemVerilog Assertions LABs.- System Verilog Assertions – LAB Answers.- Functional Coverage.- Performance Implications of coverage methodology.- Coverage Options.

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Book SynopsisThis holistic book is an invaluable reference for addressing various practical challenges in architecting and engineering Intelligent IoT and eHealth solutions for industry practitioners, academic and researchers, as well as for engineers involved in product development. The first part provides a comprehensive guide to fundamentals, applications, challenges, technical and economic benefits, and promises of the Internet of Things using examples of real-world applications. It also addresses all important aspects of designing and engineering cutting-edge IoT solutions using a cross-layer approach from device to fog, and cloud covering standards, protocols, design principles, reference architectures, as well as all the underlying technologies, pillars, and components such as embedded systems, network, cloud computing, data storage, data processing, big data analytics, machine learning, distributed ledger technologies, and security. In addition, it discusses the effects of Intelligent IoT, which are reflected in new business models and digital transformation. The second part provides an insightful guide to the design and deployment of IoT solutions for smart healthcare as one of the most important applications of IoT. Therefore, the second part targets smart healthcare-wearable sensors, body area sensors, advanced pervasive healthcare systems, and big data analytics that are aimed at providing connected health interventions to individuals for healthier lifestyles.Table of ContentsIntroduction.- Engineering an AI-driven IoT platform.- Smart and connected IoT devices.- Engineering IoT networks.- IoT cloud architecture and design.- End-to-end security.- Machine learning fundamentals.- Big Data and advanced analytics.- AI-driven IoT for smart health.- Biomedical engineering fundamentals.- Biosensors and connected wearable eHealth devices.- Applications of machine learning & IoT in healthcare.- AI-driven IoT eHealth prototyping lab.- Conclusion.

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Book SynopsisThis book provides readers with the necessary background information and advanced concepts in the field of circuits, at the crossroads between physics, mathematics and system theory. It covers various engineering subfields, such as electrical devices and circuits, and their electronic counterparts. Based on the idea that a modern university course should provide students with conceptual tools to understand the behavior of both linear and nonlinear circuits, to approach current problems posed by new, cutting-edge devices and to address future developments and challenges, the book places equal emphasis on linear and nonlinear, two‐terminal and multi‐terminal, as well as active and passive circuit components. This second volume focuses on dynamical circuits, which are characterized by time evolution and by the concept of state. The content is divided into a set of introductory and a set of advanced‐level topics, mirroring the approach used in the previously published volume. Whenever possible, circuits are compared to physical systems of different natures (e.g. mechanical or biological) that exhibit the same dynamical behavior. The book also features a wealth of examples and numerous solved problems. Further topics, such as a more general framing of linear and nonlinear components, will be discussed in volume 3. Trade Review“This is volume 2 of a basic book on linear and nonlinear circuits for undergraduate electrical engineering students.” (Wai-Kai Chen, zbMATH 1492.94002, 2022)Table of ContentsBasic concepts: two-terminal linear elements with memory and first-order linear circuits.- Advanced concepts: first-order nonlinear circuits.- Basic concepts: linear two-ports with memory and higher-order linear circuits.- Advanced concepts: Higher-order nonlinear circuits – State equations and equilibrium points.- Basic concepts: Analysis of LTI circuits in sinusoidal steady state.- Advanced concepts: Analysis of nonlinear oscillators.

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Book SynopsisThis book discusses and compares several new trends that can be used to overcome Moore’s law limitations, including Neuromorphic, Approximate, Parallel, In Memory, and Quantum Computing. The author shows how these paradigms are used to enhance computing capability as developers face the practical and physical limitations of scaling, while the demand for computing power keeps increasing. The discussion includes a state-of-the-art overview and the essential details of each of these paradigms. Table of Contents1. An Introduction: New Trends in Computing2. Numerical Computing3. Parallel Computing: OpenMP, MPI, and CUDA4. Deep Learning and Cognitive computing: Pillars and Ladders5. Approximate Computing: Towards Ultra Low Power Systems Design6. Near-Memory/In-Memory Computing: Pillars and Ladders7. Quantum Computing and DNA Computing: Beyond Conventional Approaches8. Cloud, Fog and Edge Computing9. Reconfigurable and Heterogeneous Computing10. ConclusionIndex

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Book Synopsis​This book explains in layman’s terms how CMOS transistors work. The author explains step-by-step how CMOS transistors are built, along with an explanation of the purpose of each process step. He describes for readers the key inventions and developments in science and engineering that overcame huge obstacles, enabling engineers to shrink transistor area by over 1 million fold and build billions of transistor switches that switch over a billion times a second, all on a piece of silicon smaller than a thumbnail.Table of ContentsIntroduction.- Overview.- Semiconductors and Insulators.- Diodes, MOS Transistors, Bipolar Transistors, Inverters.- Building High Performance MOS Transistors.- Parasitic MOS and Bipolar Transistors.- Design Rules and Photo Patterns.- CMOS Inverter Process Flow.- Key Inventions & Developments that Enabled Scaling.- Process Flow with Histories of Scaling at Key Steps.

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Book SynopsisThis book will give a detailed description of different carbon based materials synthesis methods, characterization, and applications. It serves as a fundamental information source on the actual techniques and methodologies involved in carbon materials synthesis, such as CVD, plasma in liquids, fusion reactors, or frequency-doubled yttrium–aluminum– garnet (YAG) lasers. This book includes coverage of several categories of carbon materials, such as graphene, carbon fiber composites, functionalized carbons, and polyimides used for various applications, from microelectronic industry to slotted waveguide antennas.Table of Contents1. Introduction to Raman spectroscopy of chemically functionalized CVD graphene2. Applications of Graphite Materials in the Field of Electromagnetic Compatibility3. Carbon Fibre Reinforced Polymer Materials for Antennas and Microwave Technologies4. Structural Design and Optimization of Slotted Waveguide Antenna Stiffened Structures Under Compressive Load5. The Influence of Azobenzene Content on Azopolyimides Capacity to Form Laser-Induced Surface Relief Gratings6. Structural Modifications of Polymers and Nanocomposites Synthesis by Pulsed Electrical Discharges in LiquidsIndex

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Book SynopsisThis book describes a set of SystemC‐based virtual prototype analysis methodologies, including design understanding, verification, security validation, and design space exploration. Readers will gain an overview of the latest research results in the field of Electronic Design Automation (EDA) at the Electronic System Level (ESL). The methodologies discussed enable readers to tackle easily key tasks and applications in the design process.Table of ContentsChapter 1. Introduction.- Chapter 2. Background.- Chapter 3. Design Understanding Methodology.- Chapter 4. Application I: Verification.- Chapter 5. Application II: Security Validation.- Chapter 6. Application III: Design Space Exploration.- Chapter 7. Conclusion.

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Book SynopsisThis one-semester textbook teaches students Electromagnetic Waves, via an early introduction to Maxwell’s Equations in the first chapter. Mathematics fundamentals are used as needed, but rigor is de-emphasized in preference to understanding the basic ideas and principles of EM waves. Each chapter includes extensive, step-by-step, solved examples, as well as abundant exercises. Designed for a one-semester course in electromagnetic waves; Introduces Maxwell’s equations in the first chapter; De-emphasizes mathematical rigor in order to make key ideas and principles easy to understand; Makes material accessible to readers of varying backgrounds, with extensive use of solved examples; Includes abundant exercises for each chapter. Trade Review“The book includes a huge number of figures, a large number of exercises and a reasonable number of solved examples, which, altogether, help the reader to understand quickly the exposition.” (Luis Filipe Pinheiro de Castro, zbMATH 1455.78001, 2021)Table of ContentsIntroduction.- Maxwell’s Equations.- Plane Waves and Wave Equations.- Characteristics and Parameters of EM Waves.- Boundary Conditions and Behavior of EM Waves.- Transmission Line.- Smith Chart.- Antenna.

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Book SynopsisThis book provides readers with a single-source reference to current sensing integrated circuit design. It is written in handbook style, including systematic guidelines and implementation examples. The authors focus on the implementation of wide-bandwidth current sensing on a single microchip, toward usage in applications such as sensing, control and optimization of the energy flow in growth areas like industrial electronics, renewable energies, smart grids, electromobility and the Internet of Things. Provides readers with a comprehensive, all-in-one source for current sensing integrated circuit design, including implementation examples; Discusses modeling and optimization of on-chip Rogowski coil and Hall sensor in both lateral and vertical orientation; Includes noise reduction techniques, such as auto-zeroing and chopping; Covers open-loop and closed-loop sensor front-end design; Presents the first on-chip current sensor with a planar coil placed besides a power line to measure internal signal currents and the first off-chip current sensor with a helix-shaped coil for external signal currents in the multi-MHz region. Table of ContentsIntroduction.- Motivation and Fundamentals.- Integrated Rogowski Coil Sensing.- Integrated Hall Sensing.- Hybrid Current Sensor.- Conclusion and Outlook.

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Book SynopsisThis book explores C-based design, implementation, and analysis of post-quantum cryptography (PQC) algorithms for signature generation and verification. The authors investigate NIST round 2 PQC algorithms for signature generation and signature verification from a hardware implementation perspective, especially focusing on C-based design, power-performance-area-security (PPAS) trade-offs and design flows targeting FPGAs and ASICs. Describes a comprehensive set of synthesizable c code base as well as the hardware implementations for the different types of PQC algorithms including lattice-based, code-based, and multivariate-based; Demonstrates the hardware (FPGA and ASIC) and hardware-software optimizations and trade-offs of the NIST round 2 signature-based PQC algorithms; Enables designers to build hardware implementations that are resilient to a variety of side-channels. Table of ContentsIntroduction.- qTESLA.- CRYSTALS –Dilithium.- MQDSS.- SPHINCS.- Luov.- Falcon.- Picnic.- GeMSS.- Power, Performance, Area, and Security (PPAS) Comparison of the PQC Algorithms.- Conclusions.

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Book SynopsisThis study guide is designed for students taking courses in electrical circuit analysis. The textbook includes examples, questions, and exercises that will help electrical engineering students to review and sharpen their knowledge of the subject and enhance their performance in the classroom. Offering detailed solutions, multiple methods for solving problems, and clear explanations of concepts, this hands-on guide will improve student’s problem-solving skills and basic understanding of the topics covered in electric circuit analysis courses. Exercises cover a wide selection of basic and advanced questions and problems Categorizes and orders the problems based on difficulty level, hence suitable for both knowledgeable and under-prepared students Provides detailed and instructor-recommended solutions and methods, along with clear explanations Can be used along with the core textbooks in AC circuit analysis and advanced electrical circuit analysis Table of ContentsDC Circuits.- Nodal and Mesh Analyses.- First-order Circuits.- Second-order Circuits.-Circuit Theorems.- AC Circuits.- Sinusoids and Phasors.- Sinusoidal Steady-state Analysis.- AC Power Analysis.- Magnetically Coupled Circuits.- Frequency Response.- Laplace Transform.- Applications of the Laplace Transform.- Two-port Networks.

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Book SynopsisThis textbook introduces basic and advanced embedded system topics through Arm Cortex M microcontrollers, covering programmable microcontroller usage starting from basic to advanced concepts using the STMicroelectronics Discovery development board. Designed for use in upper-level undergraduate and graduate courses on microcontrollers, microprocessor systems, and embedded systems, the book explores fundamental and advanced topics, real-time operating systems via FreeRTOS and Mbed OS, and then offers a solid grounding in digital signal processing, digital control, and digital image processing concepts — with emphasis placed on the usage of a microcontroller for these advanced topics. The book uses C language, “the” programming language for microcontrollers, C++ language, and MicroPython, which allows Python language usage on a microcontroller. Sample codes and course slides are available for readers and instructors, and a solutions manual is available to instructors. The book will also be an ideal reference for practicing engineers and electronics hobbyists who wish to become familiar with basic and advanced microcontroller concepts.Table of ContentsChapter 1. Introduction.- Chapter 2. Microcontroller Architecture.- Chapter 3. Software Development Platforms.- Chapter 4. Digital Input and Output.- Chapter 5. Interrupts and Power Management.- Chapter 6. Timing Operations.- Chapter 7. Conversion Between Analog and Digital Values.- Chapter 8. Digital Communication.- Chapter 9. Memory Operations.- Chapter 10. Real-Time Operating Systems.- Chapter 11. LCD, Touch Screen and Graphical User Interface Formation.- Chapter 12. Introduction to Digital Signal Processing.- Chapter 13. Introduction to Digital Control.- Chapter 14. Introduction to Digital Image Processing.- Chapter 15. Advanced Topics.

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Book Synopsis The greatly expanded and updated 3rd edition of this textbook offers the reader a comprehensive introduction to the concepts of logic functions and equations and their applications across computer science and engineering. The authors’ approach emphasizes a thorough understanding of the fundamental principles as well as numerical and computer-based solution methods. The book provides insight into applications across propositional logic, binary arithmetic, coding, cryptography, complexity, logic design, and artificial intelligence.Updated throughout, some major additions for the 3rd edition include: a new chapter about the concepts contributing to the power of XBOOLE; a new chapter that introduces into the application of the XBOOLE-Monitor XBM 2; many tasks that support the readers in amplifying the learned content at the end of the chapters; solutions of a large subset of these tasks to confirm learning success; challenging tasks that need the power of the XBOOLE software for their solution. The XBOOLE-monitor XBM 2 software is used to solve the exercises; in this way the time-consuming and error-prone manipulation on the bit level is moved to an ordinary PC, more realistic tasks can be solved, and the challenges of thinking about algorithms leads to a higher level of education.Table of ContentsPart I Theoretical Foundations 1. Basic Algebraic Structures 2. Logic Functions 3. Logic Equations 4. Boolean Differential Calculus 5. Sets, Lattices, and Classes Logic Functions Part II Applications 6. Logics, Arithmetic, and Special Functions 7. SAT-Problems 8. Extremely Complex Problems 9. Combinational Circuits 10. Sequential Circuits References Index

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Book SynopsisThis updated textbook covers digital design, fundamentals of computer architecture, and ARM assembly language. The book starts by introducing computer abstraction, basic number systems, character coding, basic knowledge in digital design, and components of a computer. The book goes on to discuss information representation in computing, Boolean algebra and logic gates, and sequential logic. The book also presents introduction to computer architecture, Cache mapping methods, and virtual memory. The author also covers ARM architecture, ARM instructions, ARM assembly language using Keil development tools, and bitwise control structure using C and ARM assembly language. The book includes a set of laboratory experiments related to digital design using Logisim software and ARM assembly language programming using Keil development tools. In addition, each chapter features objectives, summaries, key terms, review questions, and problems.Table of ContentsChapter1: Signal and number systems.- Chapter2: Boolean Logics and Logic Gates.- Chapter3: Minterms, Maxterms, Karnaugh Map (K-Map), and Universal Gates.- Chapter4: Combinational Logic.- Chapter5: Synchronous Sequential Logic.- Chapter6: Introduction to Computer Architecture.- Chapter7: Memory.- Chapter8: Assembly Language and ARM Instructions Part I.- Chapter9: ARM Assembly Language Programming Using Keil Development Tools.- Chapter10: ARM Instructions Part II and Instraction Formats.- Chapter11: Bitwise and Control Structures Used for Programming with C and ARM Assembly Language.

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Book SynopsisThis textbook uses design insight, real-life examples, illustrative figures, easy-to-follow equations, and simple SPICE code to show how semiconductor devices (diodes, bipolar-junction transistors (BJTs), and metal–oxide–semiconductor (MOS) field-effect transistors (FETs) ) work independently and collectively in switched-inductor power supplies; how these power supplies transfer power, consume power, and react and respond across frequency; how feedback loops switch, control, and stabilize them; and how the building blocks that comprise them are implemented and designed. This book is focused and complete, with a holistic approach and perspective on power IC design that extends from semiconductor devices to fully-closed feedback systems. Readers will develop the insight needed to interpret, assess, and design switched inductor power ICs, which almost all electronic systems need, yet no other book addresses this way.Table of Contents1. Diodes & BJTs 2, Field-Effect Transistors 3. Switched Inductors 4. Power Losses 5. Frequency Response 6. Feedback Control 7. Control Loops 8. Building Blocks

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Book SynopsisThis book focuses on the core question of the necessary architectural support provided by hardware to efficiently run virtual machines, and of the corresponding design of the hypervisors that run them. Virtualization is still possible when the instruction set architecture lacks such support, but the hypervisor remains more complex and must rely on additional techniques.Despite the focus on architectural support in current architectures, some historical perspective is necessary to appropriately frame the problem. The first half of the book provides the historical perspective of the theoretical framework developed four decades ago by Popek and Goldberg. It also describes earlier systems that enabled virtualization despite the lack of architectural support in hardware.As is often the case, theory defines a necessary—but not sufficient—set of features, and modern architectures are the result of the combination of the theoretical framework with insights derived from practical systems. The second half of the book describes state-of-the-art support for virtualization in both x86-64 and ARM processors. This book includes an in-depth description of the CPU, memory, and I/O virtualization of these two processor architectures, as well as case studies on the Linux/KVM, VMware, and Xen hypervisors. It concludes with a performance comparison of virtualization on current-generation x86- and ARM-based systems across multiple hypervisors.Table of ContentsPreface.- Acknowledgments.- Definitions.- The Popek/Goldberg Theorem.- Virtualization without Architectural Support.- x86-64: CPU Virtualization with VT-x.- x86-64: MMU Virtualization with Extended Page Tables.- x86-64: I/O Virtualization.- Virtualization Support in ARM Processors.- Comparing ARM and x86 Virtualization Performance.- Bibliography.- Authors' Biographies.- Index .

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Book SynopsisOriginally developed to support video games, graphics processor units (GPUs) are now increasingly used for general-purpose (non-graphics) applications ranging from machine learning to mining of cryptographic currencies. GPUs can achieve improved performance and efficiency versus central processing units (CPUs) by dedicating a larger fraction of hardware resources to computation. In addition, their general-purpose programmability makes contemporary GPUs appealing to software developers in comparison to domain-specific accelerators. This book provides an introduction to those interested in studying the architecture of GPUs that support general-purpose computing. It collects together information currently only found among a wide range of disparate sources. The authors led development of the GPGPU-Sim simulator widely used in academic research on GPU architectures. The first chapter of this book describes the basic hardware structure of GPUs and provides a brief overview of their history. Chapter 2 provides a summary of GPU programming models relevant to the rest of the book. Chapter 3 explores the architecture of GPU compute cores. Chapter 4 explores the architecture of the GPU memory system. After describing the architecture of existing systems, Chapters 3 and 4 provide an overview of related research. Chapter 5 summarizes cross-cutting research impacting both the compute core and memory system. This book should provide a valuable resource for those wishing to understand the architecture of graphics processor units (GPUs) used for acceleration of general-purpose applications and to those who want to obtain an introduction to the rapidly growing body of research exploring how to improve the architecture of these GPUs.Table of ContentsPreface.- Acknowledgments.- Introduction.- Programming Model.- The SIMT Core: Instruction and Register Data Flow.- Memory System.- Crosscutting Research on GPU Computing Architectures.- Bibliography.- Authors' Biographies.

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Book SynopsisChapter.1.Wireless Power Transfer for Self-reporting Cardiovascular Implantable Medical Devices.- Chapter.2.Advancements in Energy Harvesting for Implantable Cardiovascular Devices.- Chapter.3.Magnetoelectric Composites for implantable wireless power transferin biomedical applications.- Chapter.4 Triboelectric Nanogenerators Competency to Wireless Device Applications.-Chapter 5 Photovaltoic energy Scavenging for the sustainable implantable Medical device.- Chapter 6 ultrasound- Based Wireless powering technologies.-Chapter.7.Smart Contact Lens.- Chapter.8.Motivation.- Chapter.9. Power Management Integrated Circuits for Implantable Devices.

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Book SynopsisChapter 1. On-Chip Analog Neural Network for Edge Computing in Radiation Detectors.- Chapter 2. A high-voltage LDO voltage regulator featuring enhanced transient response and reduced area.- Chapter 3. A low-cost fault tolerance technique for microcontroller-class RISC-V processors.- Chapter 4. Exploiting the Latched Ring Oscillator Cell as a compact PUF architecture on FPGA.- Chapter 5.- Low Power Design of Approximate Adders based on Inexact Full Adder.- Chapter 6. 109 dB, 0.3V, 1.49 nW, Digital-Based OTA Topology with  cross-coupled bulk gain-enhancement.- Chapter 7. 0.7V, 215 nW Tunable Universal Gm-C Filter.- Chapter 8. Operating Principles and Power Consumption of DB-OTAs.- Chapter 9. Semi-analytical model for the estimation of the subthreshold swing in Dirac-source FETs.- Chapter 10. Anomalous I-V characteristics of 4H-SiC p-i-n diode at cryogenic temperature.- Chapter 11. Rutile TiO2 nanoparticles as Raman micro-thermometer for self-heating analysis.-  Chapter 12. Simulation framework for hole spin qubits.- Chapter 13. Effect of phase noise in superconducting qubit control.- Chapter 14. Advanced interconnect solutions for millimetre-wave Low-Noise Amplifiers.- Chapter 15. A Wideband L-band Integrated Low Noise Amplifier.- Etc...

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Book SynopsisPreparation Knowledge: Basics of AI.- Tools for Artificial Intelligence.- Linear Models.- Decision Trees.- Support Vector Machine.- Bayesian Algorithms.- Artificial Neural Network.- Deep Learning.- Ensemble Learning.- Clustering.- Dimension Reduction.- Anomaly Detection.- Association Rule Leaming.- Basics of and Value-Based Reinforcement Learning.- Policy-Based Reinforcement Learning.

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Book SynopsisPart 1 Algebra.- Chapter 1 Numbers.- Chapter 2 Polynomials.- Chapter 3 Linear Equations and Inequalities.- Chapter 4 Irrational Equations.- Chapter 5 Logarithmic and Exponential Functions.- Part 2 Trigonometry and Complex Algebra.- Chapter 6 Elements of Analytic Geometry.- Chapter 7 Trigonometry.- Chapter 8 Complex Algebra.- Chapter 9 Bode plot.- Part 3 Linear Algebra.- Chapter 10 Linear Algebra.

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Book SynopsisIntroduction to Hardware Security.- Role of Artificial Intelligence in Hardware Security.- Towards Transistor-less Computation: Key Attributes & Challenges.- Hardware Security in IoT Paradigm.- Structure for implementation of Hardware Security in IoT Devices.- Hardware Security in Healthcare Industry.- Emerging Trends and Future Directions in Hardware Security.- Reverse Engineering Techniques for Cyber-Physical Systems Security.- Hardware Security in Automotive Systems.- Secure Boot and Secure Firmware using Trusted Platform Modules (TPMs).- Side-Channel Attacks and Countermeasures.- Blockchain-Enabled Hardware Security.- Fault Attacks and Potential Countermeasures.- Hardware Security Verification and Validation.- Hardware Security Threats and Attacks in Smart City Scenarios.

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Book Synopsis.- Selective SERS identification of bacteria using a phage/gold-silver nanoalloys network..- 3D MicroOrganoSpheres formation of hepatocellular carcinoma on chip as a novel in vitro model for physiological and therapeutic studies..- 3D Printing and Optical Adhesives to realize low-cost Plasmonic Biosensors..- Lithium Detection in Peripheral Biofluids Using a Smart Electrochemical Sensor..- Characterization of a Lab-On-Chip for dual analyte as-say in space missions..- On-Chip micro-incubator for studying cell cultures in space..- Electrochemical chip for the Alzheimer's associated miRNA PCR-free detection..- Evaluation of Pregnacy-Induced  Modification of Urinary Volatilome by a Gas Sensor Array..- Study of Indium Tin Oxide Thin Film as Fluorescence Enhancers for Optical Biosensing in Water Quality Analysis..- Humidity sensing performance of In2o3-x nanomaterial functionalized QCM sensor..- Development of a sensor based on a thin layer of zeolite to monitor plant health through VOC analysis..- Optoresistive measurement system for the characterization of metal oxide based nanosensors..- A Feasibility Study Over a MWCNT-Coated  Textile as NH3 Sensor..- Organic Electrochemical Transistor as a VOCs Sensor..- Textile impedentiometric sensor for gas detection..- Sub-ppm Photonic Sensor for Water Quality Control: Feasibility Study on Zinc and Lead Detection..- Evaluation of Long-Term Stability and Performances of Eco-Friendly and Low-Power Temperature Sensor Based on Hydrogel Nanocomposite, etc.

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Book SynopsisPart 1 Introduction.- Chapter 1 Introduction to Vertical GaN Power Electronics.- Chapter 2 Electronic Transport and Advances in Vertical Bulk GaN Based Power Semiconductor Devices.- Part 2 Bulk GaN Substrates.- Chapter 3 Bulk GaN.- Chapter 4 Near Equilibrium Ammonothermal (NEAT) Growth of Low Dislocation GaN for Power Devices.- Chapter 5 Use of HVPE for Growth of Bulk GaN Wafers and GaN Epilayers for Power Electronics Applications.- Chapter 6 X-ray Topography and High-Resolution X-ray Diffraction Characterization of GaN Materials for Power Electronics Applications.- Part 3 Epitaxial Growth of Gallium Nitride and Processing.- Chapter 7 Laser assisted MOCVD GaN and the Development of Vertical GaN-on-GaN PN diodes.- Chapter 8 MOCVD Growth of GaN Drift Layers on Bulk GaN Substrates for Power Electronic Devices.- Chapter 9 MBE Grown GaN P-N Diodes.- Chapter 10 Gallium Nitride Wafer Metrology and Device Processing.- Chapter 11 Layer Transfer of Gallium Nitride by Controlled Spalling.- Part 4 Selective Area Doping, Processes, and Characterization.- Chapter 12 In-situ TBCl Etching and Selective-Area Growth and Doping of GaN.- Chapter 13 Selective Area Regrowth and Doping for Vertical GaN Power Devices.- Chapter 14 Acceptor Dopant Ion Implant and Gyrotron Rapid Thermal Annealing of GaN.- Chapter 15 Ion Implantation for p-Type Conductivity in GaN.- Chapter 16 High Energy Ion Implantation using Electrostatic Accelerators.- Chapter 17 Solid State Diffusion in GaN.- Chapter 18 Transmutation Doping of GaN.- Part 5 Materials Characterization Techniques.- Chapter 19 Deep Level Defect Spectroscopy and Electron Beam-Induced Current Characterization of GaN Junctions.- Chapter 20 Ion Beam Analysis of GaN Surfaces and Interfaces.- Chapter 21 Structural and Chemical Defect Characterization for Selectively Doped GaN.- Chapter 22 Secondary Ion Mass Spectroscopy (SIMS) Analysis of GaN Epitaxial Films.- Part 6 Gallium Nitride Materials Properties for Power Electronics Devices.- Chapter 23 Intrinsic and Extrinsic Thermal Conductivity of Gallium Nitride and Silicon Carbide.- Chapter 24 Breakdown Phenomena in GaN.- Chapter 25 Theoretical Modeling of Avalanche Currents in GaN.- Part 7 Related Wideband Gap Materials and Devices.- Chapter 26 Cubic GaN: Growth, Characterization, and Applications.- Chapter 27 Development of Wafer-Scale h-BN Quasi-Bulk Crystals.- Part 8 Future Outlook.- Chapter 28 Outlook of Wide Bandgap Semiconductors and Power Electronics in the Energy Transition Towards a More Electric Future.

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Book SynopsisInnovative Trends in the Development of Digital Society.- Comprehensive maturity assessment calculator for innovation projects a tool for digital transformation in decision making processes in innovation management.- Modern challenges of using artificial intelligence in the socio economic processes of society opportunities and threats.- Digital technologies for comprehensive promotion of a startup.- Research of Software Architecture of Digital Platforms for Development of their Theoretical Model.- Digital Monitoring of Government Funding of Talent Development Based on Young Scientists’ Performance Indicators.

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Book SynopsisIntroduction to IC Packaging Development and Assembly Processes.- Bonding Techniques Interconnects.- CVD in Semiconductor Packaging.- Etching in Semiconductor Manufacturing: Techniques, Applications, and Performance Metrics in Advanced IC Packaging.- Physical Vapor Deposition in Advanced Semiconductor Packaging.

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Book SynopsisChapter 1. BACKGROUND.- Chapter 2. THE ANTENNA EFFECT.- Chapter 3. DIODE AND TRANSISTOR PROTECTION.- Chapter 4. SIGNATURES OF PROCESS DAMAGE.- Chapter 5. ELECTRICAL SIGNATURES OF PROCESS DAMAGE.- Chapter 6. LATENT DAMAGE AND RELIABILITY DEGRADATION.- Chapter 7. ATOMIC-LEVEL DEFECTS AND ELECTRICAL EFFECTS.- Chapter 8. TECHNOLOGY SPECIFIC PROCESS DAMAGE.- Chapter 9. COMMON SOURCES OF PROCESS DAMAGE.- Chapter 10. INLINE PROCESS DAMAGE MEASUREMENTS.- Chapter 11. PROCESS DAMAGE TEST STRUCTURES.- Chapter 12. DESIGN RULES RELATED TO PROCESS DAMAGE .- Chapter 13. PARAMETRIC DAMAGE TESTING STRATEGY AND PROCEDURES.- Chapter 14. THE ROLE OF HYDROGEN.- Chapter 15. METALLIC DEFECTS.- Chapter 16. MOBILE ION CONTAMINATION.- Chapter 17. FIXED CHARGE.

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Book SynopsisThis book provides an invaluable reference to Piezoelectric Accelerometers with Integral Electronics (IEPE). It describes the design and performance parameters of IEPE accelerometers and their key elements, PE transducers and FET-input amplifiers. Coverage includes recently designed, low-noise and high temperature IEPE accelerometers. Readers will benefit from the detailed noise analysis of the IEPE accelerometer, which enables estimation of its noise floor and noise limits. Other topics useful for designers of low-noise, high temperature silicon-based electronics include noise analysis of FET amplifiers, experimental investigation and comparison of low-frequency noise in different JFETs and MOSFETs, and ultra-low-noise JFETs (at level of 0.6 nV/√Hz). The discussion also includes ultra-low-noise (at level of 3 ng/√Hz) seismic IEPE accelerometers and high temperature (up to 175 ̊C) triaxial and single axis miniature IEPE accelerometers, along with key factors for their design.• Provides a comprehensive reference to the design and performance of IEPE accelerometers, including low-noise and high temperature IEPE sensors;• Includes noise analysis of the IEPE accelerometer, which enables estimation of the its noise floor and noise limits;• Describes recently design of ultra-low-noise (at level of 3 ng/√Hz) IEPE seismic accelerometers and high temperature (up to 175 ̊C) triaxial and single axis miniature IEPE accelerometers;• Compares low-frequency noise in different JFETs and MOSFETs including measurement results of ultra-low-noise (at level of 0.6 nV/√Hz) JFET;• Presents key factors for design of low-noise and high temperature IEPE accelerometer and their electronics.Table of ContentsIntroduction to Piezoelectric Accelerometers with Integral Electronics.- Piezoelectric Transducers Used for Piezoelectric Accelerometers with Integral Electronics.- Integral FET Amplifiers Used for IEPE Accelerometers.- Noise of a FET Amplifier.- Comparison of 1/f Noise and Thermal Noise in JFETs and MOSFETs.- Fundamental Noise Limit of an IEPE Accelerometer.- Noise of and IEPE Accelerometer.- Ultra-low-noise IEPE Seismic Accelerometers.- High-temperature, up to 175 ºC, Miniature IEPE Accelerometers.

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Book SynopsisThis book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.Trade ReviewThis book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. Table of ContentsContribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.

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Book SynopsisThis book presents the theory, analysis and design of microwave stepped-frequency radar sensors. Stepped-frequency radar sensors are attractive for various sensing applications that require fine resolution. The book consists of five chapters. The first chapter describes the fundamentals of radar sensors including applications followed by a review of ultra-wideband pulsed, frequency-modulated continuous-wave (FMCW), and stepped-frequency radar sensors. The second chapter discusses a general analysis of radar sensors including wave propagation in media and scattering on targets, as well as the radar equation. The third chapter addresses the analysis of stepped-frequency radar sensors including their principles and design parameters. Chapter 4 presents the development of two stepped-frequency radar sensors at microwave and millimeter-wave frequencies based on microwave integrated circuits (MICs), microwave monolithic integrated circuits (MMICs) and printed-circuit antennas, and discusses their signal processing. Chapter 5 provides the electrical characterization and test results of the developed microwave and millimeter-wave stepped-frequency radar sensors. Finally, a summary and conclusion is provided.Table of ContentsIntroduction.- General Radar Sensor Analysis.- Stepped-Frequency Radar Sensor Analysis.- Development of Stepped-Frequency Radar Sensors.- System Characterization and Tests.- Summary and Conclusions.

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Book SynopsisEnvironmental electromagnetic pollution has drastically increased over the last decades. The omnipresence of communication systems, various electronic appliances and the use of ever increasing frequencies, all contribute to a noisy electromagnetic environment which acts detrimentally on sensitive electronic equipment. Integrated circuits must be able to operate satisfactorily while cohabiting harmoniously in the same appliance, and not generate intolerable levels of electromagnetic emission, while maintaining a sound immunity to potential electromagnetic disturbances: analog integrated circuits are in particular more easily disturbed than their digital counterparts, since they don't have the benefit of dealing with predefined levels ensuring an innate immunity to disturbances. The objective of the research domain presented in EMC of Analog Integrated Circuits is to improve the electromagnetic immunity of considered analog integrated circuits, so that they start to fail at relevantly higher conduction levels than before.Table of ContentsPreface. 1. INTRODUCTION. 1 The pioneers of wireless communication. 2 Evolution of awareness of electromagnetic compatibility. 3 Electromagnetic compatibility of integrated circuits. 4 Scope of this book. 2. BASIC EMC CONCEPTS AT IC LEVEL. 1 Introduction. 2 Definition of EMC, EMI, EMS and EME. 3 Sources of electromagnetic interference. 4 Electromagnetism versus integrated circuit design. 5 Intra-chip versus externally-coupled EMC. 6 Analog versus digital integrated circuits. 7 EMC in automotive applications. 8 Immunity measurement methods for IC’s: IEC 62132. 3. EMC OF INTEGRATED CIRCUITS VERSUS DISTORTION. 1 Introduction. 2 Relationship between EMI resisting design and distortion. 3 Case study 1: diode connected NMOS transistor. 4 Case study 2: NMOS source follower. 5 Case study 3: NMOS current mirror. 6 Case study 4: EMI susceptibility in ESD protections. 7 EMI induced DC shift. 4. EMI RESISTING ANALOG OUTPUT CIRCUITS. 1 Introduction. 2 Categorization of analog output structures. 3 Case study 1: EMI resisting DC current regulator. 4 Case study 2: EMI resisting LIN driver. 5. EMI RESISTING ANALOG INPUT CIRCUITS. 1 Introduction. 2 Case study 1: electromagnetic immunity of CMOS operational amplifiers. 3 Case study 2: EMI resisting instrumentation amplifier input circuit. 6. EMI RESISTING BANDGAP REFERENCES AND LOW DROPOUT VOLTAGE REGULATORS. 1 Introduction. 2 Case study 1: CMOS bandgap voltage references with a high immunity to EMI. 3 Case study 2: EMI resisting low dropout voltage regulators. 7. EPILOGUE. References. Index.

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