Electronics: circuits and components Books

Book SynopsisFundamental Electrical and Electronic Principles covers the essential principles that form the foundations for electrical and electronic engineering courses. This new edition is extensively updated with a greater focus on electronic principles, evenly balanced with electrical principles. Fuller coverage is given to active electronics, with the additional topics of diodes and transistors, and core topics such as oscilloscopes now reflect state-of-the-art technology.Each main chapter starts with learning outcomes tied to the syllabus. All theory is explained in detail and backed up with numerous worked examples and handy summaries of equations. Students can test their understanding with end-of-chapter assignment questions for which answers are provided. The book also provides detailed suggested practical assignments outlining apparatus and methods.The book forms an excellent core work for beginning further education students with some mathematics background preparing for careers as technicians, and an introductory text for first-year undergraduate students in all engineering disciplines.Table of Contents1. Fundamentals. 2. D.C. Circuits. 3. Electric Fields and Capacitors. 4. Magnetic Fields and Circuits. 5. Electromagnetism. 6. Semiconductor Theory and Diodes. 7. Transistors. 8. Alternating Quantities. 9. D.C. Machines. 10. D.C. Transients.

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Book SynopsisThis book provides a complete guide to digital power system protection, emphasizing cutting-edge technologies such as digital relays, intelligent electronic devices (IEDs), artificial intelligence (AI), signal processing, and substation automation. It bridges the gap between theory and practice, offering insights into hardware implementation and real-world applications. Protection strategies for transformers, motors, generators, transmission lines, and inverter-fed systems are discussed in detail with Industry relay hardware implementation, with a focus on renewable energy integration and modern industry practices.Key Features: Explains theoretical principles and conventional topics to most advanced protection with practical examples with solutions for digital protection systems. Includes AI based relay protection, WAMS, HVDC System protection, Microgrid protection, hardware case studies of large system protection, Anti- Islanding schemes, Signal processing techniques, and substation automation. Features case studies, solved examples, and practical programs. Covered IEC standards, HVDC protection, and cybersecurity. Solutions and strategies for inverter-fed systems protection and renewable integration. The text is primarily written for senior undergraduate, graduate students, and academic researchers in the fields of electrical engineering, electronics, and communications engineering.

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Book SynopsisCrossbar switch fabrics offer many benefits when designing switch/routers. This book discusses switch/router architectures using design examples and case studies of well-known systems that employ crossbar switch fabric as their internal interconnects. This book looks to explain the design of switch/routers from a practicing engineer's perspective. It uses a broad range of design examples to illustrate switch/router designs and provides case studies to enhance readers comprehension of switch/router architectures. The book goes on to discuss industry best practices in switch/router design and explains the key features and differences between unicast and multicast packet forwarding architectures. This book will be of benefit to telecoms/networking industry professionals and engineers as well as researchers and academics looking for more practical and efficient approaches for designing non-blocking crossbar switch fabrics.Table of ContentsPart 1: Characteristics of Switch/Routers with Crossbar Switch Fabrics 1. The Switch/Router: Integrated OSI Layers 2 and 3 Forwarding on a Single Platform 2. Understanding Crossbar Switch Fabrics 3. Introduction to Switch/Routers with Crossbar Switch Fabrics Part 2: Design Examples and Case Studies 4. Cisco Catalyst 6500 Series Switches with Supervisor Engines 1A and 2 5. Avaya P580 and P882 Routing Switch Architecture with 80-Series Media Module 6. Foundry Networks Multilayer Switches with IronCoreTM Network Interface Module 7. Foundry Networks Multilayer Switches with JetCoreTM Network Interface Module 8. Cisco Catalyst 6500 Series Switches with Supervisor Engine 720 9. Multicast Routing and Multicast Forwarding Information Base (MFIB) Architecture 10. Unicast versus Multicast Packet Forwarding: A Case Study

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Book SynopsisThis comprehensive, hands-on review of the most up-to-date techniques in RF and microwave measurement combines fundamental theory with in-depth analysis of advanced modern instrumentation, methods and systems, alongside practical advice for RF and microwave engineers and researchers.Table of ContentsPart I. General Concepts: 1. Transmission lines and scattering parameters Roger Pollard and Mohamed Sayed; 2. Microwave interconnections, probing, and fixturing Leonard Hayden; Part II. Microwave Instrumentation: 3. Microwave synthesizers Alexander Chenakin; 4. Real-time spectrum analysis and time-correlated measurements applied to non-linear system characterization Marcus Da Silva; 5. Vector network analyzers Mohamed Sayed and Jon Martens; 6. Microwave power measurements Ronald Ginley; 7. Modular systems for RF and microwave measurements Jin Bains; Part III. Linear Measurements: 8. Two-port network analyzer calibration Andrea Ferrero; 9. Multiport and differential S-parameter measurements Valeria Teppati and Andrea Ferrero; 10. Noise figure characterization Nerea Otegi, Juan-Mari Collantes and Mohamed Sayed; 11. TDR based S-parameters Peter J. Pupalaikis and Kaviyesh Doshi; Part IV. Non-Linear Measurements: 12. Vector network analysis for nonlinear systems Yves Rolain, Gerd Vandersteen and Maarten Schoukens; 13. Load and source-pull techniques Valeria Teppati, Andrea Ferrero and Gian Luigi Madonna; 14. Broadband signal measurements for linearity optimization Marco Spirito and Mauro Marchetti; 15. Pulse and RF measurement Anthony Parker.

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Book SynopsisProvides students with a system-level perspective and the tools they need to understand, analyze and design complete digital systems using VHDL. It goes beyond the design of simple combinational and sequential modules to show how such modules are used to build complete systems, reflecting digital design in the real world.Table of ContentsPart I. Introduction: 1. The digital abstraction; 2. The practice of digital system design; Part II. Combinational Logic: 3. Boolean algebra; 4. CMOS logic circuits; 5. Delay and power of CMOS circuits; 6. Combinational logic design; 7. VHDL descriptions of combinational logic; 8. Combinational building blocks; 9. Combinational examples; Part III. Arithmetic Circuits: 10. Arithmetic circuits; 11. Fixed- and floating-point numbers; 12. Fast arithmetic circuits; 13. Arithmetic examples; Part IV. Synchronous Sequential Logic: 14. Sequential logic; 15. Timing constraints; 16. Datapath sequential logic; 17. Factoring finite-state machines; 18. Microcode; 19. Sequential examples; Part V. Practical Design: 20. Verification and test; Part VI. System Design: 21. System-level design; 22. Interface and system-level timing; 23. Pipelines; 24. Interconnect; 25. Memory systems; Part VII. Asynchronous Logic: 26. Asynchronous sequential circuits; 27. Flip-flops; 28. Metastability and synchronization failure; 29. Synchronizer design; Appendix A. VHDL coding style; Appendix B. VHDL syntax guide; References; Index.

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Book SynopsisBioresorbable electronics offer a revolutionary solution to replace the built-to-last electronics used in implanted devices and electronic gadgets. This Element analyzes the unique dissolution behaviors and biological effects of bioresorbable materials such as metals, polymers, inorganic compounds and semiconductors used to construct devices.

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Book SynopsisDiscover the techniques of analog filter designs and their utilization in a large number of practical applications such as audio/video signal processing, biomedical instrumentation and antialiasing/reconstruction filters. Covering high frequency filter design like active R and active C filters, the author tries to present the subject in a simpler way as a base material for analog filter designs, as well as for advanced study of continuous-time filter designs, and allied filter design areas of current-mode (CM) and switched capacitor filters. With updated basic analog filter design approaches, the book will provide a better choice to select appropriate design technique for a specific application. Focussing mainly on continuous time domain techniques, which forms the base of all other techniques, this is an essential reading for undergraduate students. Numerous solved examples, practical applications and case studies on audio/video devices, medical instrumentation, control and antialiasiTable of ContentsList of figures; List of tables; Preface; Acknowledgements; 1. Analog filter: concepts; 2. First- and second-order filters; 3. Magnitude approximations; 4. Delay: approximation and optimization; 5. Frequency and impedance transformations; 6. Sensitivity of active networks; 7. Single amplifier second-order filters; 8. Multi amplifier second-order filter sections; 9. Direct form synthesis: element substitution and operational simulation; 10. Cascade approach: optimization and tuning; 11. Amplification and filtering in biomedical applications; 12. Audio signal processing and anti-aliasing filters; 13. Follow the leader feedback filters; 14. Switched capacitor circuits; 15. Operational transconductance amplifier-C filters; 16. Current conveyors and CDTA (current differencing transconductance amplifiers) based filters; 17. Active R and active C filters; References; Practice problems; Index.

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Book SynopsisGet up to speed with the fundamentals of complementary metal oxide semiconductor (CMOS) for wireline communication with this practical introduction, from short-reach optical links to various electrical links. It presents practical coverage of the state of the art, equipping readers with all the tools needed to understand these circuits and then design their own. A comprehensive treatment of components, including details for front-end circuits, equalizers, oscillators, phase-locked loops and clock and data recovery systems, accompanies significant coverage of inverter-based circuits, preparing the reader for modern designs in nano-scale CMOS. Numerous inline examples demonstrate concepts and solutions, allowing readers to absorb the theory and confidently apply concepts to new scenarios. Suitable for graduate students and professional engineers working in mixed-signal integrated circuit design for high-speed interconnects, and including over 100 end-of-chapter problems to extend learning (with online solutions for instructors), this versatile book will equip readers with an unrivalled understanding of exactly what goes into a modern wireline link ? and why.

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Book Synopsis* The second edition of Analog Integrated Circuit Design focuses on several types of circuits that have increased in importance in the past decade. * The text is enhanced with material on CMOS IC device modeling, updated processing layout and expanded coverage to reflect technical innovations.Table of ContentsCHAPTER 1 INTEGRATED-CIRCUIT DEVICES AND MODELLING 1 1.1 Semiconductors and pn Junctions 1 1.1.1 Diodes 2 1.1.2 Reverse-Biased Diodes 4 1.1.3 Graded Junctions 8 1.1.4 Large-Signal Junction Capacitance 10 1.1.5 Forward-Biased Junctions 11 1.1.6 Junction Capacitance of Forward-Biased Diode 12 1.1.7 Small-Signal Model of a Forward-Biased Diode 13 1.1.8 Schottky Diodes 14 1.2 MOS Transistors 15 1.2.1 Symbols for MOS Transistors 16 1.2.2 Basic Operation 17 1.2.3 Large-Signal Modelling 22 1.2.4 Body Effect 25 1.2.5 p-Channel Transistors 26 1.2.6 Low-Frequency Small-Signal Modelling in the Active Region 26 1.2.7 High-Frequency Small-Signal Modelling in the Active Region 32 1.2.8 Small-Signal Modelling in the Triode and Cutoff Regions 35 1.2.9 Analog Figures of Merit and Trade-offs 37 1.3 Device Model Summary 39 1.3.1 Constants 40 1.3.2 Diode Equations 40 1.3.3 MOS Transistor Equations 41 1.4 Advanced MOS Modelling 43 1.4.1 Subthreshold Operation 43 1.4.2 Mobility Degradation 46 1.4.3 Summary of Subthreshold and Mobility Degradation Equations 48 1.4.4 Parasitic Resistances 48 1.4.5 Short-Channel Effects 49 1.4.6 Leakage Currents 50 1.5 SPICE Modelling Parameters 51 1.5.1 Diode Model 51 1.5.2 MOS Transistors 52 1.5.3 Advanced SPICE Models of MOS Transistors 52 1.6 Passive Devices 55 1.6.1 Resistors 55 1.6.2 Capacitors 59 1.7 Appendix 61 1.7.1 Diode Exponential Relationship 61 1.7.2 Diode-Diffusion Capacitance 63 1.7.3 MOS Threshold Voltage and the Body Effect 65 1.7.4 MOS Triode Relationship 67 1.8 Key Points 69 1.9 References 70 1.10 Problems 70 CHAPTER 2 PROCESSING AND LAYOUT 73 2.1 CMOS Processing 73 2.1.1 The Silicon Wafer 73 2.1.2 Photolithography and Well Definition 74 2.1.3 Diffusion and Ion Implantation 76 2.1.4 Chemical Vapor Deposition and Defining the Active Regions 78 2.1.5 Transistor Isolation 78 2.1.6 Gate-Oxide and Threshold-Voltage Adjustments 81 2.1.7 Polysilicon Gate Formation 82 2.1.8 Implanting the Junctions, Depositing SiO2, and Opening Contact Holes 82 2.1.9 Annealing, Depositing and Patterning Metal, and Overglass Deposition 84 2.1.10 Additional Processing Steps 84 2.2 CMOS Layout and Design Rules 86 2.2.1 Spacing Rules 86 2.2.2 Planarity and Fill Requirements 94 2.2.3 Antenna Rules 94 2.2.4 Latch-Up 95 2.3 Variability and Mismatch 96 2.3.1 Systematic Variations Including Proximity Effects 96 2.3.2 Process Variations 98 2.3.3 Random Variations and Mismatch 99 2.4 Analog Layout Considerations 103 2.4.1 Transistor Layouts 103 2.4.2 Capacitor Matching 104 2.4.3 Resistor Layout 107 2.4.4 Noise Considerations 109 2.5 Key Points 112 2.6 References 113 2.7 Problems 114 CHAPTER 3 BASIC CURRENT MIRRORS AND SINGLE-STAGE AMPLIFIERS 117 3.1 Simple CMOS Current Mirror 118 3.2 Common-Source Amplifier 120 3.3 Source-Follower or Common-Drain Amplifier 122 3.4 Common-Gate Amplifier 124 3.5 Source-Degenerated Current Mirrors 127 3.6 Cascode Current Mirrors 129 3.7 Cascode Gain Stage 131 3.8 MOS Differential Pair and Gain Stage 135 3.9 Key Points 138 3.10 References 139 3.11 Problems 139 CHAPTER 4 FREQUENCY RESPONSE OF ELECTRONIC CIRCUITS 144 4.1 Frequency Response of Linear Systems 144 4.1.1 Magnitude and Phase Response 145 4.1.2 First-Order Circuits 147 4.1.3 Second-Order Low-Pass Transfer Functions with Real Poles 154 4.1.4 Bode Plots 157 4.1.5 Second-Order Low-Pass Transfer Functions with Complex Poles 163 4.2 Frequency Response of Elementary Transistor Circuits 164 4.2.1 High-Frequency MOS Small-Signal Model 164 4.2.2 Common-Source Amplifier 166 4.2.3 Miller Theorem and Miller Effect 169 4.2.4 Zero-Value Time-Constant Analysis 173 4.2.5 Common-Source Design Examples 176 4.2.6 Common-Gate Amplifier 179 4.3 Cascode Gain Stage 181 4.4 Source-Follower Amplifier 187 4.5 Differential Pair 193 4.5.1 High-Frequency T Model 193 4.5.2 Symmetric Differential Amplifier 194 4.5.3 Single-Ended Differential Amplifier 195 4.5.4 Differential Pair with Active Load 196 4.6 Key Points 197 4.7 References 198 4.8 Problems 198 CHAPTER 5 FEEDBACK AMPLIFIERS 204 5.1 Ideal Model of Negative Feedback 204 5.1.1 Basic Definitions 204 5.1.2 Gain Sensitivity 205 5.1.3 Bandwidth 206 5.1.4 Linearity 207 5.1.5 Summary 207 5.2 Dynamic Response of Feedback Amplifiers 208 5.2.1 Stability Criteria 209 5.2.2 Phase Margin 211 5.3 First- and Second-Order Feedback Systems 213 5.3.1 First-Order Feedback Systems 213 5.3.2 Second-Order Feedback Systems 217 5.3.3 Higher-Order Feedback Systems 220 5.4 Common Feedback Amplifiers 221 5.4.1 Obtaining the Loop Gain, L(s) 222 5.4.2 Noninverting Amplifier 226 5.4.3 Transimpedance (Inverting) Amplifiers 231 5.5 Summary of Key Points 235 5.6 References 236 5.7 Problems 236 CHAPTER 6 BASIC OPAMP DESIGN AND COMPENSATION 242 6.1 Two-Stage CMOS Opamp 242 6.1.1 Opamp Gain 243 6.1.2 Frequency Response 245 6.1.3 Slew Rate 249 6.1.4 n-Channel or p-Channel Input Stage 252 6.1.5 Systematic Offset Voltage 253 6.2 Opamp Compensation 254 6.2.1 Dominant-Pole Compensation and Lead Compensation 255 6.2.2 Compensating the Two-Stage Opamp 256 6.2.3 Making Compensation Independent of Process and Temperature 260 6.3 Advanced Current Mirrors 262 6.3.1 Wide-Swing Current Mirrors 262 6.3.2 Enhanced Output-Impedance Current Mirrors and Gain Boosting 263 6.3.3 Wide-Swing Current Mirror with Enhanced Output Impedance 266 6.3.4 Current-Mirror Symbol 267 6.4 Folded-Cascode Opamp 268 6.4.1 Small-Signal Analysis 270 6.4.2 Slew Rate 272 6.5 Current Mirror Opamp 275 6.6 Linear Settling Time Revisited 279 6.7 Fully Differential Opamps 281 6.7.1 Fully Differential Folded-Cascode Opamp 283 6.7.2 Alternative Fully Differential Opamps 284 6.7.3 Low Supply Voltage Opamps 286 6.8 Common-Mode Feedback Circuits 288 6.9 Summary of Key Points 292 6.10 References 293 6.11 Problems 294 CHAPTER 7 BIASING, REFERENCES, AND REGULATORS 302 7.1 Analog Integrated Circuit Biasing 302 7.1.1 Bias Circuits 303 7.1.2 Reference Circuits 305 7.1.3 Regulator Circuits 306 7.2 Establishing Constant Transconductance 307 7.2.1 Basic Constant-Transconductance Circuit 307 7.2.2 Improved Constant-Transconductance Circuits 309 7.3 Establishing Constant Voltages and Currents 310 7.3.1 Bandgap Voltage Reference Basics 310 7.3.2 Circuits for Bandgap References 314 7.3.3 Low-Voltage Bandgap Reference 319 7.3.4 Current Reference 320 7.4 Voltage Regulation 321 7.4.1 Regulator Specifications 321 7.4.2 Feedback Analysis 322 7.4.3 Low Dropout Regulators 324 7.5 Summary of Key Points 327 7.6 References 327 7.7 Problems 328 CHAPTER 8 BIPOLAR DEVICES AND CIRCUITS 331 8.1 Bipolar-Junction Transistors 331 8.1.1 Basic Operation 331 8.1.2 Analog Figures of Merit 341 8.2 Bipolar Device Model Summary 344 8.3 SPICE Modeling 345 8.4 Bipolar and BICMOS Processing 346 8.4.1 Bipolar Processing 346 8.4.2 Modern SiGe BiCMOS HBT Processing 347 8.4.3 Mismatch in Bipolar Devices 348 8.5 Bipolar Current Mirrors and Gain Stages 349 8.5.1 Current Mirrors 349 8.5.2 Emitter Follower 350 8.5.3 Bipolar Differential Pair 353 8.6 Appendix 356 8.6.1 Bipolar Transistor Exponential Relationship 356 8.6.2 Base Charge Storage of an Active BJT 359 8.7 Summary of Key Points 359 8.8 References 360 8.9 Problems 360 CHAPTER 9 NOISE AND LINEARITY ANALYSIS AND MODELLING 363 9.1 Time-Domain Analysis 363 9.1.1 Root Mean Square (rms) Value 364 9.1.2 SNR 365 9.1.3 Units of dBm 365 9.1.4 Noise Summation 366 9.2 Frequency-Domain Analysis 367 9.2.1 Noise Spectral Density 367 9.2.2 White Noise 369 9.2.3 1/f, or Flicker, Noise 370 9.2.4 Filtered Noise 371 9.2.5 Noise Bandwidth 373 9.2.6 Piecewise Integration of Noise 375 9.2.7 1/f Noise Tangent Principle 377 9.3 Noise Models for Circuit Elements 377 9.3.1 Resistors 378 9.3.2 Diodes 378 9.3.3 Bipolar Transistors 380 9.3.4 MOSFETS 380 9.3.5 Opamps 382 9.3.6 Capacitors and Inductors 382 9.3.7 Sampled Signal Noise 384 9.3.8 Input-Referred Noise 384 9.4 Noise Analysis Examples 387 9.4.1 Opamp Example 387 9.4.2 Bipolar Common-Emitter Example 390 9.4.3 CMOS Differential Pair Example 392 9.4.4 Fiber-Optic Transimpedance Amplifier Example 395 9.5 Dynamic Range Performance 397 9.5.1 Total Harmonic Distortion (THD) 398 9.5.2 Third-Order Intercept Point (IP3) 400 9.5.3 Spurious-Free Dynamic Range (SFDR) 402 9.5.4 Signal-to-Noise and Distortion Ratio (SNDR) 404 9.6 Key Points 405 9.7 References 406 9.8 Problems 406 CHAPTER 10 COMPARATORS 413 10.1 Comparator Specifications 413 10.1.1 Input Offset and Noise 413 10.1.2 Hysteresis 414 10.2 Using an Opamp for a Comparator 415 10.2.1 Input-Offset Voltage Errors 417 10.3 Charge-Injection Errors 418 10.3.1 Making Charge-Injection Signal Independent 421 10.3.2 Minimizing Errors Due to Charge-Injection 421 10.3.3 Speed of Multi-Stage Comparators 424 10.4 Latched Comparators 426 10.4.1 Latch-Mode Time Constant 428 10.4.2 Latch Offset 430 10.5 Examples of CMOS and BiCMOS Comparators 432 10.5.1 Input-Transistor Charge Trapping 435 10.6 Examples of Bipolar Comparators 437 10.7 Key Points 439 10.8 References 440 10.9 Problems 441 CHAPTER 11 SAMPLE-AND-HOLD AND TRANSLINEAR CIRCUITS 444 11.1 Performance of Sample-and-Hold Circuits 444 11.1.1 Testing Sample-and-Holds 445 11.2 MOS Sample-and-Hold Basics 446 11.3 Examples of CMOS S/H Circuits 452 11.4 Bipolar and BiCMOS Sample-and-Holds 456 11.5 Translinear Gain Cell 460 11.6 Translinear Multiplier 462 11.7 Key Points 464 11.8 References 465 11.9 Problems 466 CHAPTER 12 CONTINUOUS-TIME FILTERS 469 12.1 Introduction to Continuous-Time Filters 469 12.1.1 First-Order Filters 470 12.1.2 Second-Order Filters 470 12.2 Introduction to Gm-C Filters 471 12.2.1 Integrators and Summers 472 12.2.2 Fully Differential Integrators 473 12.2.3 First-Order Filter 475 12.2.4 Biquad Filter 477 12.3 Transconductors Using Fixed Resistors 478 12.4 CMOS Transconductors Using Triode Transistors 483 12.4.1 Transconductors Using a Fixed-Bias Triode Transistor 484 12.4.2 Transconductors Using Varying Bias-Triode Transistors 486 12.4.3 Transconductors Using Constant Drain-Source Voltages 490 12.5 CMOS Transconductors Using Active Transistors 492 12.5.1 CMOS Pair 493 12.5.2 Constant Sum of Gate-Source Voltages 494 12.5.3 Source-Connected Differential Pair 495 12.5.4 Inverter-Based 495 12.5.5 Differential-Pair with Floating Voltage Sources 496 12.5.6 Bias-Offset Cross-Coupled Differential Pairs 499 12.6 Bipolar Transconductors 499 12.6.1 Gain-Cell Transconductors 500 12.6.2 Transconductors Using Multiple Differential Pairs 502 12.7 BiCMOS Transconductors 506 12.7.1 Tunable MOS in Triode 506 12.7.2 Fixed-Resistor Transconductor with a Translinear Multiplier 507 12.7.3 Fixed Active MOS Transconductor with a Translinear Multiplier 508 12.8 Active RC and MOSFET-C Filters 509 12.8.1 Active RC Filters 510 12.8.2 MOSFET-C Two-Transistor Integrators 512 12.8.3 Four-Transistor Integrators 515 12.8.4 R-MOSFET-C Filters 516 12.9 Tuning Circuitry 517 12.9.1 Tuning Overview 517 12.9.2 Constant Transconductance 519 12.9.3 Frequency Tuning 520 12.9.4 Q-Factor Tuning 522 12.9.5 Tuning Methods Based on Adaptive Filtering 523 12.10 Introduction to Complex Filters 525 12.10.1 Complex Signal Processing 525 12.10.2 Complex Operations 526 12.10.3 Complex Filters 527 12.10.4 Frequency-Translated Analog Filters 528 12.11 Key Points 531 12.12 References 532 12.13 Problems 534 CHAPTER 13 DISCRETE-TIME SIGNALS 537 13.1 Overview of Some Signal Spectra 537 13.2 Laplace Transforms of Discrete-Time Signals 537 13.2.1 Spectra of Discrete-Time Signals 540 13.3 z-Transform 541 13.4 Downsampling and Upsampling 543 13.5 Discrete-Time Filters 545 13.5.1 Frequency Response of Discrete-Time Filters 545 13.5.2 Stability of Discrete-Time Filters 548 13.5.3 IIR and FIR Filters 550 13.5.4 Bilinear Transform 550 13.6 Sample-and-Hold Response 552 13.7 Key Points 554 13.8 References 555 13.9 Problems 555 CHAPTER 14 SWITCHED-CAPACITOR CIRCUITS 557 14.1 Basic Building Blocks 557 14.1.1 Opamps 557 14.1.2 Capacitors 558 14.1.3 Switches 558 14.1.4 Nonoverlapping Clocks 559 14.2 Basic Operation and Analysis 560 14.2.1 Resistor Equivalence of a Switched Capacitor 560 14.2.2 Parasitic-Sensitive Integrator 563 14.2.3 Parasitic-Insensitive Integrators 565 14.2.4 Signal-Flow-Graph Analysis 569 14.3 Noise in Switched-Capacitor Circuits 570 14.4 First-Order Filters 572 14.4.1 Switch Sharing 575 14.4.2 Fully Differential Filters 575 14.5 Biquad Filters 577 14.5.1 Low-Q Biquad Filter 577 14.5.2 High-Q Biquad Filter 581 14.6 Charge Injection 585 14.7 Switched-Capacitor Gain Circuits 588 14.7.1 Parallel Resistor-Capacitor Circuit 588 14.7.2 Resettable Gain Circuit 588 14.7.3 Capacitive-Reset Gain Circuit 591 14.8 Correlated Double-Sampling Techniques 593 14.9 Other Switched-Capacitor Circuits 594 14.9.1 Amplitude Modulator 594 14.9.2 Full-Wave Rectifier 595 14.9.3 Peak Detectors 596 14.9.4 Voltage-Controlled Oscillator 596 14.9.5 Sinusoidal Oscillator 598 14.10 Key Points 600 14.11 References 601 14.12 Problems 602 CHAPTER 15 DATA CONVERTER FUNDAMENTALS 606 15.1 Ideal D/A Converter 606 15.2 Ideal A/D Converter 608 15.3 Quantization Noise 609 15.3.1 Deterministic Approach 609 15.3.2 Stochastic Approach 610 15.4 Signed Codes 612 15.5 Performance Limitations 614 15.5.1 Resolution 614 15.5.2 Offset and Gain Error 615 15.5.3 Accuracy and Linearity 615 15.6 Key Points 620 15.7 References 620 15.8 Problems 620 CHAPTER 16 NYQUIST-RATE D/A CONVERTERS 623 16.1 Decoder-Based Converters 623 16.1.1 Resistor-String Converters 623 16.1.2 Folded Resistor-String Converters 625 16.1.3 Multiple Resistor-String Converters 626 16.1.4 Signed Outputs 628 16.2 Binary-Scaled Converters 629 16.2.1 Binary-Weighted Resistor Converters 629 16.2.2 Reduced-Resistance-Ratio Ladders 630 16.2.3 R-2R-Based Converters 631 16.2.4 Charge-Redistribution Switched-Capacitor Converters 632 16.2.5 Current-Mode Converters 633 16.2.6 Glitches 633 16.3 Thermometer-Code Converters 634 16.3.1 Thermometer-Code Current-Mode D/A Converters 636 16.3.2 Single-Supply Positive-Output Converters 637 16.3.3 Dynamically Matched Current Sources 638 16.4 Hybrid Converters 640 16.4.1 Resistor-Capacitor Hybrid Converters 640 16.4.2 Segmented Converters 640 16.5 Key Points 642 16.6 References 643 16.7 Problems 643 CHAPTER 17 NYQUIST-RATE A/D CONVERTERS 646 17.1 Integrating Converters 646 17.2 Successive-Approximation Converters 650 17.2.1 D/A-Based Successive Approximation 652 17.2.2 Charge-Redistribution A/D 653 17.2.3 Resistor-Capacitor Hybrid 658 17.2.4 Speed Estimate for Charge-Redistribution Converters 659 17.2.5 Error Correction in Successive-Approximation Converters 660 17.2.6 Multi-Bit Successive-Approximation 662 17.3 Algorithmic (or Cyclic) A/D Converter 662 17.3.1 Ratio-Independent Algorithmic Converter 663 17.4 Pipelined A/D Converters 667 17.4.1 One-Bit-Per-Stage Pipelined Converter 667 17.4.2 1.5 Bit Per Stage Pipelined Converter 670 17.4.3 Pipelined Converter Circuits 673 17.4.4 Generalized k-Bit-Per-Stage Pipelined Converters 673 17.5 Flash Converters 674 17.5.1 Issues in Designing Flash A/D Converters 675 17.6 Two-Step A/D Converters 678 17.6.1 Two-Step Converter with Digital Error Correction 679 17.7 Interpolating A/D Converters 681 17.8 Folding A/D Converters 684 17.9 Time-Interleaved A/D Converters 687 17.10 Key Points 690 17.11 References 691 17.12 Problems 692 CHAPTER 18 OVERSAMPLING CONVERTERS 696 18.1 Oversampling without Noise Shaping 696 18.1.1 Quantization Noise Modelling 697 18.1.2 White Noise Assumption 697 18.1.3 Oversampling Advantage 698 18.1.4 The Advantage of 1-Bit D/A Converters 700 18.2 Oversampling with Noise Shaping 701 18.2.1 Noise-Shaped Delta-Sigma Modulator 702 18.2.2 First-Order Noise Shaping 703 18.2.3 Switched-Capacitor Realization of a First-Order A/D Converter 705 18.2.4 Second-Order Noise Shaping 705 18.2.5 Noise Transfer-Function Curves 707 18.2.6 Quantization Noise Power of 1-Bit Modulators 708 18.2.7 Error-Feedback Structure 708 18.3 System Architectures 710 18.3.1 System Architecture of Delta-Sigma A/D Converters 710 18.3.2 System Architecture of Delta-Sigma D/A Converters 712 18.4 Digital Decimation Filters 713 18.4.1 Multi-Stage 714 18.4.2 Single Stage 716 18.5 Higher-Order Modulators 717 18.5.1 Interpolative Architecture 717 18.5.2 Multi-Stage Noise Shaping (MASH) Architecture 718 18.6 Bandpass Oversampling Converters 720 18.7 Practical Considerations 721 18.7.1 Stability 721 18.7.2 Linearity of Two-Level Converters 722 18.7.3 Idle Tones 724 18.7.4 Dithering 725 18.7.5 Opamp Gain 725 18.8 Multi-Bit Oversampling Converters 726 18.8.1 Dynamic Element Matching 726 18.8.2 Dynamically Matched Current Source D/A Converters 727 18.8.3 Digital Calibration A/D Converter 727 18.8.4 A/D with Both Multi-Bit and Single-Bit Feedback 728 18.9 Third-Order A/D Design Example 729 18.10 Key Points 731 18.11 References 733 18.12 Problems 734 CHAPTER 19 PHASE-LOCKED LOOPS 737 19.1 Basic Phase-Locked Loop Architecture 737 19.1.1 Voltage-Controlled Oscillator 738 19.1.2 Divider 739 19.1.3 Phase Detector 740 19.1.4 Loop Filer 745 19.1.5 The PLL in Lock 746 19.2 Linearized Small-Signal Analysis 747 19.2.1 Second-Order PLL Model 748 19.2.2 Limitations of the Second-Order Small-Signal Model 750 19.2.3 PLL Design Example 752 19.3 Jitter and Phase Noise 754 19.3.1 Period Jitter 758 19.3.2 P-Cycle Jitter 758 19.3.3 Adjacent Period Jitter 759 19.3.4 Other Spectral Representations of Jitter 760 19.3.5 Probability Density Function of Jitter 761 19.4 Electronic Oscillators 763 19.4.1 Ring Oscillators 764 19.4.2 LC Oscillators 768 19.4.3 Phase Noise of Oscillators 770 19.5 Jitter and Phase Noise in PLLS 774 19.5.1 Input Phase Noise and Divider Phase Noise 775 19.5.2 VCO Phase Noise 775 19.5.3 Loop Filter Noise 776 19.6 Key Points 779 19.7 References 779 19.8 Problems 780 INDEX 783

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Book SynopsisA unique text on the theory and design fundaments of inductors and transformers, updated with more coverage on the optimization of magnetic devices and many new design examples The first edition is popular among a very broad audience of readers in different areas of engineering and science.Trade Review“What sets this book apart from previous magnetics books recently reviewed in How2Power Today is its depth of coverage, especially of topics that are hard to analyze such as winding resistance caused by the skin and proximity effects, and parasitic winding capacitances. Kazimierczuk—I’ll call him “Kaz” for short, as Apple co-founder Steve Wozniak is called “Woz”—has worked out in sufficient detail the mathematical derivations of design equations that usually appear in the literature as either given (or else ignored entirely) rather than derived.” (How2Power.com, 1 September 2015) “Loaded with essential formulas and design methods, this book will give the designer of high-frequency magnetic components not only a better design but will reinforce an understanding of the high-frequency magnetic component design.” (IEEE Electrical Engineering magazine, 1 March 2015) Table of ContentsPreface xvii About the Author xix List of Symbols xxi 1 Fundamentals of Magnetic Devices 1 1.1 Introduction 1 1.2 Fields 2 1.3 Magnetic Relationships 2 1.4 Magnetic Circuits 6 1.5 Magnetic Laws 9 1.6 Eddy Currents 29 1.7 Core Saturation 32 1.8 Inductance 40 1.9 Air Gap in Magnetic Core 51 1.10 Fringing Flux 54 1.11 Inductance of Strip Transmission Line 62 1.12 Inductance of Coaxial Cable 62 1.13 Inductance of Two-Wire Transmission Line 63 1.14 Magnetic Energy and Magnetic Energy Density 64 1.15 Self-Resonant Frequency 69 1.16 Quality Factor of Inductors 69 1.17 Classification of Power Losses in Magnetic Components 69 1.18 Noninductive Coils 71 1.19 Summary 71 1.20 References 74 1.21 Review Questions 76 1.22 Problems 78 2 Magnetic Cores 81 2.1 Introduction 81 2.2 Properties of Magnetic Materials 81 2.3 Magnetic Dipoles 83 2.4 Magnetic Domains 89 2.5 Curie Temperature 90 2.6 Magnetic Susceptibility and Permeability 91 2.7 Linear, Isotropic, and Homogeneous Magnetic Materials 93 2.8 Magnetic Materials 93 2.9 Hysteresis 96 2.10 Low-Frequency Core Permeability 98 2.11 Core Geometries 99 2.12 Ferromagnetic Core Materials 103 2.13 Superconductors 108 2.14 Hysteresis Loss 109 2.15 Eddy-Current Core Loss 113 2.16 Steinmetz Empirical Equation for Total Core Loss 129 2.17 Core Losses for Nonsinusoidal Inductor Current 135 2.18 Complex Permeability of Magnetic Materials 136 2.19 Cooling of Magnetic Cores 151 2.20 Summary 152 2.21 References 157 2.22 Review Questions 160 2.23 Problems 161 3 Skin Effect 163 3.1 Introduction 163 3.2 Resistivity of Conductors 164 3.3 Skin Depth 166 3.4 AC-to-DC Winding Resistance Ratio 173 3.5 Skin Effect in Long Single Round Conductor 173 3.6 Current Density in Single Round Conductor 175 3.7 Magnetic Field Intensity for Round Wire 193 3.8 Other Methods of Determining the Round Wire Inductance 195 3.9 Power Loss Density in Round Conductor 200 3.10 Skin Effect in Single Rectangular Plate 204 3.11 Skin Effect in Rectangular Foil Conductor Placed Over Ideal Core 215 3.12 Summary 218 3.13 Appendix 220 3.14 References 222 3.15 Review Questions 223 3.16 Problems 224 4 Proximity Effect 226 4.1 Introduction 226 4.2 Orthogonality of Skin and Proximity Effects 227 4.3 Proximity Effect in Two Parallel Round Conductors 227 4.4 Proximity Effect in Coaxial Cable 228 4.5 Proximity and Skin Effects in Two Parallel Plates 230 4.6 Antiproximity and Skin Effects in Two Parallel Plates 244 4.7 Proximity Effect in Open-Circuit Conductor 249 4.8 Proximity Effect in Multiple-Layer Inductor 250 4.9 Self-Proximity Effect in Rectangular Conductors 256 4.10 Summary 259 4.11 Appendix 260 4.12 References 261 4.13 Review Questions 263 4.14 Problems 263 5 Winding Resistance at High Frequencies 265 5.1 Introduction 265 5.2 Eddy Currents 265 5.3 Magnetic Field Intensity in Multilayer Foil Inductors 266 5.4 Current Density in Multilayer Foil Inductors 274 5.5 Winding Power Loss Density in Individual Foil Layers 278 5.6 Complex Winding Power in nth Layer 281 5.7 Winding Resistance of Individual Foil Layers 282 5.8 Orthogonality of Skin and Proximity for Individual Foil Layers 284 5.9 Optimum Thickness of Individual Foil Layers 286 5.10 Winding Inductance of Individual Layers 291 5.11 Power Loss in All Layers 292 5.12 Impedance of Foil Winding 293 5.13 Resistance of Foil Winding 294 5.14 Dowell’s Equation 294 5.15 Approximation of Dowell’s Equation 298 5.16 Winding AC Resistance with Uniform Foil Thickness 300 5.17 Transformation of Foil Conductor to Rectangular, Square, and Round Conductors 308 5.18 Winding AC Resistance of Rectangular Conductor 309 5.19 Winding Resistance of Square Wire 318 5.20 Winding Resistance of Round Wire 326 5.21 Inductance 335 5.22 Solution for Round Conductor Winding in Cylindrical Coordinates 338 5.23 Litz Wire 338 5.24 Winding Power Loss for Inductor Current with Harmonics 351 5.25 Winding Power Loss of Foil Inductors Conducting DC and Harmonic Currents 364 5.26 Winding Power Loss of Round Wire Inductors Conducting DC and Harmonic Currents 366 5.27 Effective Winding Resistance for Nonsinusoidal Inductor Current 367 5.28 Thermal Effects on Winding Resistance 370 5.29 Thermal Model of Inductors 373 5.30 Summary 374 5.31 Appendix 375 5.32 References 377 5.33 Review Questions 381 5.34 Problems 381 6 Laminated Cores 383 6.1 Introduction 383 6.2 Low-Frequency Eddy-Current Laminated Core Loss 384 6.3 Comparison of Solid and Laminated Cores 389 6.4 Alternative Solution for Low-Frequency Eddy-Current Core Loss 389 6.4.1 Sinusoidal Inductor Voltage 391 6.4.2 Square-Wave Inductor Voltage 393 6.4.3 Rectangular Inductor Voltage 393 6.5 General Solution for Eddy-Current Laminated Core Loss 393 6.6 Summary 408 6.7 References 409 6.8 Review Questions 410 6.9 Problems 411 7 Transformers 412 7.1 Introduction 412 7.2 Transformer Construction 413 7.3 Ideal Transformer 413 7.4 Voltage Polarities and Current Directions in Transformers 416 7.5 Nonideal Transformers 417 7.6 Neumann’s Formula for Mutual Inductance 422 7.7 Mutual Inductance 424 7.8 Magnetizing Inductance 425 7.9 Coupling Coefficient 427 7.10 Leakage Inductance 429 7.11 Dot Convention 432 7.12 Series-Aiding and Series-Opposing Connections 435 7.13 Equivalent T Network 435 7.14 Energy Stored in Coupled Inductors 436 7.15 High-Frequency Transformer Model 437 7.16 Stray Capacitances 438 7.17 Transformer Efficiency 438 7.18 Transformers with Gapped Cores 438 7.19 Multiple-Winding Transformers 439 7.20 Autotransformers 439 7.21 Measurements of Transformer Inductances 440 7.22 Noninterleaved Windings 442 7.23 Interleaved Windings 444 7.24 Wireless Energy Transfer 446 7.25 AC Current Transformers 446 7.26 Saturable Reactors 454 7.27 Transformer Winding Power Losses with Harmonics 455 7.28 Thermal Model of Transformers 464 7.29 Summary 465 7.30 References 467 7.31 Review Questions 470 7.32 Problems 471 8 Integrated Inductors 472 8.1 Introduction 472 8.2 Skin Effect 472 8.3 Resistance of Rectangular Trace with Skin Effect 474 8.4 Inductance of Straight Rectangular Trace 477 8.5 Inductance of Rectangular Trace with Skin Effect 478 8.6 Construction of Integrated Inductors 480 8.7 Meander Inductors 481 8.8 Inductance of Straight Round Conductor 485 8.9 Inductance of Circular Round Wire Loop 486 8.10 Inductance of Two-Parallel Wire Loop 486 8.11 Inductance of Rectangle of Round Wire 486 8.12 Inductance of Polygon Round Wire Loop 486 8.13 Bondwire Inductors 487 8.14 Single-Turn Planar Inductor 488 8.15 Inductance of Planar Square Loop 490 8.16 Planar Spiral Inductors 490 8.17 Multimetal Spiral Inductors 505 8.18 Planar Transformers 506 8.19 MEMS Inductors 507 8.20 Inductance of Coaxial Cable 509 8.21 Inductance of Two-Wire Transmission Line 509 8.22 Eddy Currents in Integrated Inductors 509 8.23 Model of RF-Integrated Inductors 510 8.24 PCB Inductors 512 8.25 Summary 514 8.26 References 515 8.27 Review Questions 518 8.28 Problems 519 9 Self-Capacitance 520 9.1 Introduction 520 9.2 High-Frequency Inductor Model 520 9.3 Self-Capacitance Components 530 9.4 Capacitance of Parallel-Plate Capacitor 531 9.5 Self-Capacitance of Foil Winding Inductors 532 9.6 Capacitance of Two Parallel Round Conductors 533 9.7 Capacitance of Round Conductor and Parallel Conducting Plane 539 9.8 Capacitance of Straight Parallel Wire Pair Over Ground 540 9.9 Capacitance Between Two Parallel Straight Round Conductors with Uniform Charge Density 540 9.10 Capacitance of Cylindrical Capacitor 542 9.11 Self-Capacitance of Single-Layer Inductors 542 9.12 Self-Capacitance of Multilayer Inductors 545 9.13 Self-Capacitance of Single-Layer Inductors 553 9.14 T-to-Y Transformation of Capacitors 557 9.15 Overall Self-Capacitance of Single-Layer Inductor with Core 557 9.16 Measurement of Self-Capacitance 559 9.17 Inductor Impedance 560 9.18 Summary 564 9.19 References 565 9.20 Review Questions 566 9.21 Problems 566 10 Design of Inductors 568 10.1 Introduction 568 10.2 Magnet Wire 569 10.3 Wire Insulation 572 10.4 Restrictions on Inductors 572 10.5 Window Utilization Factor 574 10.6 Temperature Rise of Inductors 581 10.7 Mean Turn Length of Inductors 585 10.8 Area Product Method 586 10.9 Design of AC Inductors 590 10.10 Inductor Design for Buck Converter in CCM 603 10.11 Inductor Design for Buck Converter in DCM Using Ap Method 619 10.12 Core Geometry Coefficient Kg Method 654 10.13 Inductor Design for Buck Converter in CCM Using Kg Method 658 10.14 Inductor Design for Buck Converter in DCM Using Kg Method 660 10.15 Summary 663 10.16 References 664 10.17 Review Questions 666 10.18 Problems 666 11 Design of Transformers 668 11.1 Introduction 668 11.2 Area Product Method 668 11.3 Optimum Flux Density 673 11.4 Area Product Ap for Sinusoidal Voltages 674 11.5 Transformer Design for Flyback Converter in CCM 675 11.6 Transformer Design for Flyback Converter in DCM 689 11.7 Geometrical Coefficient Kg Method 702 11.8 Transformer Design for Flyback Converter in CCM Using Kg Method 705 11.9 Transformer Design for Flyback Converter in DCM Using Kg Method 709 11.10 Summary 714 11.11 References 714 11.12 Review Questions 715 11.13 Problems 715 Appendix A Physical Constants 717 Appendix B Maxwell's Equations 718 Answers to Problems 719 Index 725

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Book Synopsis

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Book SynopsisLinear Circuit Transfer Functions: An introduction to Fast Analytical Techniques teaches readers how to determine transfer functions of linear passive and active circuits by applying Fast Analytical Circuits Techniques. Building on their existing knowledge of classical loop/nodal analysis, the book improves and expands their skills to unveil transfer functions in a swift and efficient manner. Starting with simple examples, the author explains step-by-step how expressing circuits time constants in different configurations leads to writing transfer functions in a compact and insightful way. By learning how to organize numerators and denominators in the fastest possible way, readers will speed-up analysis and predict the frequency response of simple to complex circuits. In some cases, they will be able to derive the final expression by inspection, without writing a line of algebra. Key features: Emphasizes analysis through employing time Table of ContentsAbout the Author ix Preface xi Acknowledgement xiii 1 Electrical Analysis – Terminology and Theorems 1 1.1 Transfer Functions, an Informal Approach 1 1.1.1 Input and Output Ports 3 1.1.2 Different Types of Transfer Function 6 1.2 The Few Tools and Theorems You Did Not Forget . . . 11 1.2.1 The Voltage Divider 11 1.2.2 The Current Divider 12 1.2.3 Thévenin’s Theorem at Work 14 1.2.4 Norton’s Theorem at Work 19 1.3 What Should I Retain from this Chapter? 25 1.4 Appendix 1A – Finding Output Impedance/Resistance 26 1.5 Appendix 1B – Problems 37 Answers 39 2 Transfer Functions 41 2.1 Linear Systems 41 2.1.1 A Linear Time-invariant System 43 2.1.2 The Need for Linearization 43 2.2 Time Constants 44 2.2.1 Time Constant Involving an Inductor 47 2.3 Transfer Functions 49 2.3.1 Low-entropy Expressions 54 2.3.2 Higher Order Expressions 59 2.3.3 Second-order Polynomial Forms 60 2.3.4 Low-Q Approximation for a 2nd-order Polynomial 62 2.3.5 Approximation for a 3rd-order Polynomial 68 2.3.6 How to Determine the Order of the System? 69 2.3.7 Zeros in the Network 76 2.4 First Step Towards a Generalized 1st-order Transfer Function 78 2.4.1 Solving 1st-order Circuits with Ease, Three Examples 82 2.4.2 Obtaining the Zero with the Null Double Injection 89 2.4.3 Checking Zeros Obtained in Null Double Injection with SPICE 94 2.4.4 Network Excitation 95 2.5 What Should I Retain from this Chapter? 100 References 101 2.6 Appendix 2A – Problems 102 Answers 105 3 Superposition and the Extra Element Theorem 116 3.1 The Superposition Theorem 116 3.1.1 A Two-input/Two-output System 120 3.2 The Extra Element Theorem 126 3.2.1 The EET at Work on Simple Circuits 130 3.2.2 The EET at Work – Example 2 132 3.2.3 The EET at Work – Example 3 137 3.2.4 The EET at Work – Example 4 138 3.2.5 The EET at Work – Example 5 140 3.2.6 The EET at Work – Example 6 146 3.2.7 Inverted Pole and Zero Notation 150 3.3 A Generalized Transfer Function for 1st-order Systems 153 3.3.1 Generalized Transfer Function – Example 1 156 3.3.2 Generalized Transfer Function – Example 2 159 3.3.3 Generalized Transfer Function – Example 3 163 3.3.4 Generalized Transfer Function – Example 4 170 3.3.5 Generalized Transfer Function – Example 5 174 3.4 Further Reading 180 3.5 What Should I Retain from this Chapter? 180 References 182 3.6 Appendix 3A – Problems 183 Answers 185 References 218 4 Second-order Transfer Functions 219 4.1 Applying the Extra Element Theorem Twice 219 4.1.1 Low-entropy 2nd-order Expressions 227 4.1.2 Determining the Zero Positions 231 4.1.3 Rearranging and Plotting Expressions 233 4.1.4 Example 1 – A Low-Pass Filter 235 4.1.5 Example 2 – A Two-capacitor Filter 241 4.1.6 Example 3 – A Two-capacitor Band-stop Filter 245 4.1.7 Example 4 – An LC Notch Filter 248 4.2 A Generalized Transfer Function for 2nd-Order Systems 255 4.2.1 Inferring the Presence of Zeros in the Circuit 256 4.2.2 Generalized 2nd–order Transfer Function – Example 1 257 4.2.3 Generalized 2nd–order Transfer Function – Example 2 262 4.2.4 Generalized 2nd–order Transfer Function – Example 3 266 4.2.5 Generalized 2nd–order Transfer Function – Example 4 273 4.3 What Should I Retain from this Chapter ? 277 References 279 4.4 Appendix 4A – Problems 279 Answers 282 References 311 5 Nth-order Transfer Functions 312 5.1 From the 2EET to the NEET 312 5.1.1 3rd-order Transfer Function Example 317 5.1.2 Transfer Functions with Zeros 320 5.1.3 A Generalized Nth-order Transfer Function 327 5.2 Five High-order Transfer Functions Examples 335 5.2.1 Example 2: A 3rd-order Active Notch Circuit 341 5.2.2 Example 3: A 4th-order LC Passive Filter 349 5.2.3 Example 4: A 4th-order Band-pass Active Filter 355 5.2.4 Example 5: A 3rd-order Low-pass Active GIC Filter 368 5.3 What Should I Retain from this Chapter ? 383 References 385 5.5 Appendix 5A – Problems 385 Answers 388 References 431 Conclusion 433 Glossary of Terms 435 Index 439

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Book SynopsisTable of ContentsCHAPTER 1 Electric Circuit Variables 1 CHAPTER 2 Circuit Elements 20 CHAPTER 3 Resistive Circuits 53 CHAPTER 4 Methods of Analysis of Resistive Circuits 114 CHAPTER 5 Circuit Theorems 169 CHAPTER 6 The Operational Amplifier 219 CHAPTER 7 Energy Storage Elements 268 CHAPTER 8 The Complete Response of RL and RC Circuits 322 CHAPTER 9 The Complete Response of Circuits with Two Energy Storage Elements 378 CHAPTER 10 Sinusoidal Steady-State Analysis 425 CHAPTER 11 AC Steady-State Power 504 CHAPTER 12 Three-Phase Circuits 568 CHAPTER 13 Frequency Response 604 CHAPTER 14 The Laplace Transform 670 CHAPTER 15 Fourier Series and Fourier Transform 741 CHAPTER 16 Filter Circuits 804 CHAPTER 17 Two-Port and Three-Port Networks 840 APPENDIX A Getting Started with PSpice 865 APPENDIX B MATLAB, Matrices, and Complex Arithmetic 873 APPENDIX C Mathematical Formulas 885 APPENDIX D Standard Resistor Color Code 889 References 891 Index 893

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Book SynopsisTable of ContentsPreface xxxiii Chapter 1 Introduction to CMOS Design 1 1.1 The CMOS IC Design Process 1 1.1.1 Fabrication 2 1.2 CMOS Background 5 1.3 An Introduction to SPICE 8 Chapter 2 The Well 31 2.1 Patterning 32 2.1.1 Patterning the N-well 35 2.2 Laying Out the N-well 35 2.2.1 Design Rules for the N-well 36 2.3 Resistance Calculation 36 2.3.1 The N-well Resistor 38 2.4 The N-well/Substrate Diode 39 2.4.1 A Brief Introduction to PN Junction Physics 39 2.4.2 Depletion Layer Capacitance 42 2.4.3 Storage or Diffusion Capacitance 45 2.4.4 SPICE Modeling 46 2.5 The RC Delay through the N-well 48 2.6 Twin Well Processes 51 Chapter 3 The Metal Layers 59 3.1 The Bonding Pad 59 3.1.1 Laying Out the Pad I 60 3.2 Design and Layout Using the Metal Layers 63 3.2.1 Metal1 and Via1 63 3.2.2 Parasitics Associated with the Metal Layers 63 3.2.3 Current-Carrying Limitations 67 3.2.4 Design Rules for the Metal Layers 68 3.2.5 Contact Resistance 69 3.3 Crosstalk and Ground Bounce 70 3.3.1 Crosstalk 71 3.3.2 Ground Bounce 72 3.4 Layout Examples 74 3.4.1 Laying Out the Pad II 74 3.4.2 Laying Out Metal Test Structures 76 Chapter 4 The Active and Poly Layers 83 4.1 Layout Using the Active and Poly Layers 83 4.1.1 Process Flow 90 4.2 Connecting Wires to Poly and Active 93 4.3 Electrostatic Discharge (ESD) Protection 99 Chapter 5 Resistors, Capacitors, MOSFETs 107 5.1 Resistors 107 5.2 Capacitors 115 5.3 MOSFETs 118 5.4 Layout Examples 125 Chapter 6 MOSFET Operation 135 6.1 MOSFET Capacitance Overview/Review 136 6.2 The Threshold Voltage 139 6.3 IV Characteristics of MOSFETs 144 6.3.1 MOSFET Operation in the Triode Region 144 6.3.2 The Saturation Region 146 6.4 SPICE Modeling of the MOSFET 149 6.4.1 Some SPICE Simulation Examples 151 6.4.2 The Subthreshold Current 152 6.5 Short-Channel MOSFETs 154 6.5.1 MOSFET Scaling 155 6.5.2 Short-Channel Effects 156 6.5.3 SPICE Models for Our Short-Channel CMOS Process 157 Chapter 7 CMOS Fabrication by Jeff Jessing 165 7.1 CMOS Unit Processes 165 7.1.1 Wafer Manufacture 165 7.1.2 Thermal Oxidation 167 7.1.3 Doping Processes 168 7.1.4 Photolithography 170 7.1.5 Thin Film Removal 173 7.1.6 Thin Film Deposition 177 7.2 CMOS Process Integration 180 7.2.1 Frontend-of-the-Line Integration 182 7.2.2 Backend-of-the-Line Integration 196 7.3 Backend Processes 210 7.4 Advanced CMOS Process Integration 212 7.4.1 FinFETs 213 7.4.2 Dual Damascene Low-k/Cu Interconnects 216 7.5 Summary 219 Chapter 8 Electrical Noise: An Overview 221 8.1 Signals 221 8.1.1 Power and Energy 221 8.1.2 Power Spectral Density 223 8.2 Circuit Noise 226 8.2.1 Calculating and Modeling Circuit Noise 227 8.2.2 Thermal Noise 231 8.2.3 Signal-to-Noise Ratio 237 8.2.4 Shot Noise 247 8.2.5 Flicker Noise 251 8.2.6 Other Noise Sources 258 8.3 Discussion 260 8.3.1 Correlation 260 8.3.2 Noise and Feedback 264 8.3.3 Some Final Notes Concerning Notation 267 Chapter 9 Models for Analog Design 277 9.1 Long-Channel MOSFETs 277 9.1.1 The Square-Law Equations 279 9.1.2 Small Signal Models 286 9.1.3 Temperature Effects 300 9.2 Short-Channel MOSFETs 302 9.2.1 General Design (A Starting Point) 303 9.2.2 Specific Design (A Discussion) 306 9.3 MOSFET Noise Modeling 308 Chapter 10 Models for Digital Design 327 10.1 The Digital MOSFET Model 328 10.1.2 Process Characteristic Time Constant 331 10.1.3 Delay and Transition Times 333 10.1.4 General Digital Design 326 10.2 The MOSFET Pass Gate 326 10.2.1 Delay through a Pass Gate 338 10.2.2 Delay through Series-Connected PGs 340 10.3 A Final Comment Concerning Measurements 341 Chapter 11 The Inverter 347 11.1 DC Characteristics 347 11.2 Switching Characteristics 352 11.3 Layout of the Inverter 356 11.4 Sizing for Large Capacitive Loads 358 11.5 Other Inverter Configurations 364 Chapter 12 Static Logic Gates 369 12.1 DC Characteristics of the NAND and NOR Gates 369 12.1.1 DC Characteristics of the NAND Gate 369 12.1.2 DC Characteristics of the NOR Gate 372 12.2 Layout of the NAND and NOR Gates 373 12.3 Switching Characteristics 374 12.3.1 NAND Gate 375 12.3.2 Number of Inputs 378 12.4 Complex CMOS Logic Gates 379 Chapter 13 Clocked Circuits 389 13.1 The CMOS TG 389 13.2 Applications of the Transmission Gate 391 13.3 Latches and Flip-Flops 395 13.4 Examples 402 Chapter 14 Dynamic Logic Gates 411 14.1 Fundamentals of Dynamic Logic 411 14.1.1 Charge Leakage 411 14.1.2 Simulating Dynamic Circuits 414 14.1.3 Nonoverlapping Clock Generation 415 14.1.4 CMOS TG in Dynamic Circuits 416 14.2 Clocked CMOS Logic 417 Chapter 15 CMOS Layout Examples 425 15.1 Chip Layout 426 15.2 Layout Steps by Dean Moriarty 434 Chapter 16 Memory Circuits 445 16.1 Array Architectures 446 16.1.1 Sensing Basics 446 16.1.2 The Folded Array 452 16.1.3 Chip Organization 458 16.2 Peripheral Circuits 458 16.2.1 Sense Amplifier Design 458 16.2.2 Row/Column Decoders 467 16.2.3 Row Drivers 470 16.3 Memory Cells 471 16.3.1 The SRAM Cell 473 16.3.2 Read-Only Memory (ROM) 473 16.3.3 Floating Gate Memory 473 Chapter 17 Sensing Using Modulation 493 17.1 Qualitative Discussion 494 17.1.1 Examples of DSM 494 17.1.2 Using DSM for Sensing in Flash Memory 496 17.2 Sensing Resistive Memory 506 17.3 Sensing in CMOS Imagers 513 Chapter 18 Special Purpose CMOS Circuits 533 18.1 The Schmitt Trigger 533 18.1.1 Design of the Schmitt Trigger 534 18.1.2 Applications of the Schmitt Trigger 536 18.2 Multivibrator Circuits 538 18.2.1 The Monostable Multivibrator 539 18.2.2 The Astable Multivibrator 540 18.3 Input Buffers 541 18.3.1 Basic Circuits 541 18.3.2 Differential Circuits 543 18.3.3 DC Reference 547 18.3.4 Reducing Buffer Input Resistance 550 18.4 Charge Pumps (Voltage Generators) 551 18.4.1 Increasing the Output Voltage 553 18.4.2 Generating Higher Voltages: The Dickson Charge Pump 553 18.4.3 Example 556 Chapter 19 Digital Phase-Locked Loops 561 19.1 The Phase Detector 563 19.1.1 The XOR Phase Detector 563 19.1.2 The Phase Frequency Detector 567 19.2 The Voltage-Controlled Oscillator 570 19.2.1 The Current-Starved VCO 570 19.2.2 Source-Coupled VCOs 574 19.3 The Loop Filter 576 19.3.1 XOR DPLL 577 19.3.2 PFD DPLL 583 19.4 System Concerns 590 19.4.1 Clock Recovery from NRZ Data 593 19.5 Delay-Locked Loops 600 19.6 Some Examples 603 19.6.1 A 2 GHz DLL 603 19.6.2 A 1 Gbit/s Clock-Recovery Circuit 609 Chapter 20 Current Mirrors 621 20.1 The Basic Current Mirror 621 20.1.1 Long-Channel Design 622 20.1.2 Matching Currents in the Mirror 624 20.1.3 Biasing the Current Mirror 628 20.1.4 Short-Channel Design 634 20.1.5 Temperature Behavior 638 20.1.6 Biasing in the Subthreshold Region 642 20.2 Cascoding the Current Mirror 643 20.2.1 The Simple Cascode 643 20.2.2 Low-Voltage (Wide-Swing) Cascode 645 20.2.3 Wide-Swing, Short-Channel Design 648 20.2.4 Regulated Drain Current Mirror 651 20.3 Biasing Circuits 653 20.3.1 Long-Channel Biasing Circuits 653 20.3.2 Short-Channel Biasing Circuits 656 20.3.3 A Final Comment 657 Chapter 21 Amplifiers 671 21.1 Gate-Drain Connected Loads 671 21.1.1 Common-Source (CS) Amplifiers 671 21.1.2 The Source Follower (Common-Drain Amplifier) 683 21.1.3 Common Gate Amplifier 684 21.2 Current Source Loads 685 21.2.1 Common-Source Amplifier 685 21.2.2 The Cascode Amplifier 698 21.2.3 The Common-Gate Amplifier 702 21.2.4 The Source Follower (Common-Drain Amplifier) 702 21.3 The Push-Pull Amplifier 710 21.3.1 DC Operation and Biasing 711 21.3.2 Small-Signal Analysis 714 21.3.3 Distortion 716 Chapter 22 Differential Amplifiers 735 22.1 The Source-Coupled Pair 735 22.1.1 DC Operation 735 22.1.2 AC Operation 741 22.1.3 Common-Mode Rejection Ratio 745 22.1.4 Matching Considerations 746 22.1.5 Noise Performance 749 22.1.6 Slew-Rate Limitations 750 22.2 The Source Cross-Coupled Pair 750 22.2.1 Current Source Load 754 22.3 Cascode Loads (The Telescopic Diff-Amp) 756 22.4 Wide-Swing Differential Amplifiers 758 22.4.1 Current Differential Amplifier 760 22.4.2 Constant Transconductance Diff-Amp 760 Chapter 23 Voltage References 773 23.1 MOSFET-Resistor Voltage References 774 23.1.1 The Resistor-MOSFET Divider 774 23.1.2 The MOSFET-Only Voltage Divider 777 23.1.3 Self-Biased Voltage References 778 23.2 Parasitic Diode-Based References 784 23.2.1 Long-Channel BGR Design 787 23.2.2 Short-Channel BGR Design 795 Chapter 24 Operational Amplifiers I 803 24.1 The Two-Stage Op-Amp 804 24.2 An Op-Amp with Output Buffer 822 24.3 The Operational Transconductance Amplifier (OTA) 824 24.4 Gain-Enhancement 835 24.5 Some Examples and Discussions 839 Chapter 25 Dynamic Analog Circuits 857 25.1 The MOSFET Switch 857 25.1.1 Sample-and-Hold Circuits 861 25.2 Fully-Differential Circuits 864 25.2.1 A Fully-Differential Sample-and-Hold 866 25.3 Switched-Capacitor Circuits 869 25.3.1 Switched-Capacitor Integrator 871 25.4 Circuits 879 Chapter 26 Operational Amplifiers II 889 26.1 Biasing for Power and Speed 889 26.1.1 Device Characteristics 890 26.1.2 Biasing Circuit 891 26.2 Basic Concepts 892 26.3 Basic Op-Amp Design 900 26.4 Op-Amp Design Using Switched-Capacitor CMFB 920 Chapter 27 Nonlinear Analog Circuits 933 27.1 Basic CMOS Comparator Design 933 27.1.1 Characterizing the Comparator 939 27.1.2 Clocked Comparators 942 27.1.3 Input Buffers Revisited 943 27.2 Adaptive Biasing 943 27.3 Analog Multipliers 946 27.3.1 The Multiplying Quad 947 Chapter 28 Data Converter Fundamentals by Harry Li 955 28.1 Analog Versus Discrete Time Signals 955 28.2 Converting Analog Signals to Digital Signals 956 28.3 Sample-and-Hold (S/H) Characteristics 959 28.4 Digital-to-Analog Converter (DAC) Specifications 961 28.5 Analog-to-Digital Converter (ADC) Specifications 970 28.6 Mixed-Signal Layout Issues 979 Chapter 29 Data Converter Architectures by Harry Li 987 29.1 DAC Architectures 987 29.1.1 Digital Input Code 987 29.1.2 Resistor String 987 29.1.3 R-2R Ladder Networks 992 29.1.4 Current Steering 995 29.1.5 Charge-Scaling DACs 999 29.1.6 Cyclic DAC 1003 29.1.7 Pipeline DAC 1005 29.2 ADC Architectures 1006 29.2.1 Flash 1006 29.2.2 The Two-Step Flash ADC 1010 29.2.3 The Pipeline ADC 1014 29.2.4 Integrating ADCs 1018 29.2.5 The Successive Approximation ADC 1022 29.2.6 The Oversampling ADC 1027 Chapter 30 Implementing Data Converters 1043 30.1 R-2R Topologies for DACs 1043 30.1.1 The Current-Mode R-2R DAC 1044 30.1.2 The Voltage-Mode R-2R DAC 1045 30.1.3 A Wide-Swing Current-Mode R-2R DAC 1047 30.1.4 Topologies Without an Op-Amp 1057 30.2 Op-Amps in Data Converters 1063 30.2.1 Op-Amp Gain 1066 30.2.2 Op-Amp Unity Gain Frequency 1067 30.2.3 Op-Amp Offset 1067 30.3 Implementing ADCs 1070 30.3.1 Implementing the S/H 1071 30.3.2 The Cyclic ADC 1077 30.3.3 The Pipeline ADC 1084 Chapter 31 Feedback Amplifiers with Harry Li 1115 31.1 The Feedback Equation 1115 31.2 Properties of Negative Feedback on Amplifier Design 1117 31.2.1 Gain Desensitivity 1117 31.3 Recognizing Feedback Topologies 1120 31.3.1 Input Mixing 1121 31.3.2 Output Sampling 1121 31.3.3 The Feedback Network 1122 31.3.4 Calculating Open-Loop Parameters 1125 31.3.5 Calculating Closed-Loop Parameters 1127 31.4 The Voltage Amp (Series-Shunt Feedback) 1128 31.5 The Transimpedance Amp (Shunt-Shunt Feedback) 1134 31.5.1 Simple Feedback Using a Gate-Drain Resistor 1140 31.6 The Transconductance Amp (Series-Series Feedback) 1142 31.7 The Current Amplifier (Shunt-Series Feedback) 1146 31.8 Stability 1148 31.8.1 The Return Ratio 1151 31.9 Design Examples 1154 31.9.1 Voltage Amplifiers 1154 31.9.2 A Transimpedance Amplifier 1158 Chapter 32 Hysteretic Power Converters 1175 32.1 A Review of Power and Energy Basics 1176 32.1.1 Energy Storage in Inductors and Capacitors 1177 32.1.2 Energy Use in Transmitting Data 1180 32.1.3 Selection and use of Switches 1181 32.2 Switching Power Supplies: Some Examples 1189 32.2.1 The Buck SPS 1189 32.2.2 The Boost SPS 1196 32.2.3 The Flyback SPS 1200 32.2.4 Pulse Width Modulation: A Control Loop Example 1204 32.3 Hysteretic Control 1210 32.3.1 Topologies 1211 32.3.2 Examples 1212 Index 1219 About the Author 1235

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Book SynopsisTable of ContentsPreface ix 1 Basic Concepts 1 1.1 System of Units 1 1.2 Basic Quantities 2 1.3 Circuit Elements 8 Summary 18 2 Resistive Circuits 19 2.1 Ohm’s Law 19 2.2 Kirchhoff’s Laws 24 2.3 Single-Loop Circuits 33 2.4 Single-Node-Pair Circuits 40 2.5 Series and Parallel Resistor Combinations 45 2.6 Circuits with Series-Parallel Combinations of Resistors 51 2.7 Wye Delta Transformations 57 2.8 Circuits with Dependent Sources 61 2.9 Resistor Technologies for Electronic Manufacturing 67 2.10 Application Examples 70 2.11 Design Examples 72 Summary 78 3 Nodal and Loop Analysis Techniques 79 3.1 Nodal Analysis 79 3.2 Loop Analysis 100 3.3 Application Example 117 3.4 Design Example 118 Summary 119 4 Operational Amplifiers 120 4.1 Introduction 120 4.2 Op-Amp Models 121 4.3 Fundamental Op-Amp Circuits 127 4.4 Comparators 135 4.5 Application Examples 136 4.6 Design Examples 140 Summary 144 5 Additional Analysis Techniques 145 5.1 Introduction 145 5.2 Superposition 148 5.3 Thévenin’s and Norton’s Theorems 153 5.4 Maximum Power Transfer 171 5.5 Application Example 175 5.6 Design Examples 176 Summary 181 6 Capacitance and Inductance 182 6.1 Capacitors 182 6.2 Inductors 189 6.3 Capacitor and Inductor Combinations 198 6.4 RC Operational Amplifier Circuits 206 6.5 Application Examples 208 6.6 Design Examples 213 Summary 214 7 First- and Second-Order Transient Circuits 215 7.1 Introduction 215 7.2 First-Order Circuits 217 7.3 Second-Order Circuits 237 7.4 Application Examples 250 7.5 Design Examples 259 Summary 266 8 AC Steady-State Analysis 268 8.1 Sinusoids 268 8.2 Sinusoidal and Complex Forcing Functions 271 8.3 Phasors 275 8.4 Phasor Relationships for Circuit Elements 277 8.5 Impedance and Admittance 281 8.6 Phasor Diagrams 287 8.7 Basic Analysis Using Kirchhoff’s Laws 290 8.8 Analysis Techniques 293 8.9 Application Examples 305 8.10 Design Examples 307 Summary 310 9 Steady-State Power Analysis 311 9.1 Instantaneous Power 311 9.2 Average Power 312 9.3 Maximum Average Power Transfer 318 9.4 Effective or RMS Values 322 9.5 The Power Factor 325 9.6 Complex Power 327 9.7 Power Factor Correction 333 9.8 Single-Phase Three-Wire Circuits 337 9.9 Safety Considerations 340 9.10 Application Examples 348 9.11 Design Examples 352 Summary 355 10 Magnetically Coupled Networks 356 10.1 Mutual Inductance 356 10.2 Energy Analysis 367 10.3 The Ideal Transformer 370 10.4 Safety Considerations 379 10.5 Application Examples 380 10.6 Design Examples 385 Summary 388 11 Polyphase Circuits 389 11.1 Three-Phase Circuits 389 11.2 Three-Phase Connections 394 11.3 Source/Load Connections 396 11.4 Power Relationships 404 11.5 Power Factor Correction 408 11.6 Application Examples 410 11.7 Design Examples 413 Summary 417 12 Variable-Frequency Network Performance 418 12.1 Variable Frequency-Response Analysis 418 12.2 Sinusoidal Frequency Analysis 426 12.3 Resonant Circuits 438 12.4 Scaling 458 12.5 Filter Networks 460 12.6 Application Examples 484 12.7 Design Examples 488 Summary 494 13 The Laplace Transform 496 13.1 Definition 496 13.2 Two Important Singularity Functions 497 13.3 Transform Pairs 499 13.4 Properties of the Transform 501 13.5 Performing the Inverse Transform 503 13.6 Convolution Integral 509 13.7 Initial-Value and Final-Value Theorems 512 13.8 Solving Differential Equations with Laplace Transforms 514 Summary 516 14 Application of the Laplace Transform to Circuit Analysis 517 14.1 Laplace Circuit Solutions 517 14.2 Circuit Element Models 519 14.3 Analysis Techniques 521 14.4 Transfer Function 532 14.5 Pole-Zero Plot/Bode Plot Connection 552 14.6 Steady-State Response 554 Summary 558 15 Fourier Analysis Techniques 559 15.1 Fourier Series 559 15.2 Fourier Transform 583 15.3 Application Example 594 15.4 Design Examples 595 Summary 601 16 Two-Port Networks 602 16.1 Admittance Parameters 602 16.2 Impedance Parameters 605 16.3 Hybrid Parameters 607 16.4 Transmission Parameters 609 16.5 Parameter Conversions 611 16.6 Interconnection of Two-Ports 611 Summary 617 Appendix Complex Numbers 618 Problems 626 Index I-1

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Book SynopsisLabs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistrythis text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design Trade Review"... a bright example of a truly interdisciplinary text. I was much impressed by its completeness. ... useful for a broad class of readers."—Fabrizio Frezza, Sapienza – Università di Roma, Italy Table of ContentsIntroduction. Elements of Organic Chemistry. Elements of Biochemistry. Biochemical Assays and Sequencing Techniques. Planar Technology. Polymer Technology. Back-End Technologies. Fluid Dynamics in Microfluidic Circuits. Microfluidic Building Blocks. Surface Functionalization. Electronic Detection. Optical Detection. Building Blocks for Genetics. References. Appendices.

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Book SynopsisThis book deals with nonlinear dynamics of electronic circuits, which could be used in robot control, secure communications, sensors and synchronized networks. The genesis of the content is related to a course on complex adaptive systems that has been held at the University of Catania since 2005. The efforts are devoted in order to emulate with nonlinear electronic circuits nonlinear dynamics. Step-by-step methods show the essential concepts of complex systems by using the Varela diagrams and accompanying MATLAB exercises to reinforce new information. Special attention has been devoted to chaotic systems and networks of chaotic circuits by exploring the fundamentals, such as synchronization and control. The aim of the book is to give to readers a comprehensive view of the main concepts of nonlinear dynamics to help them better understand complex systems and their control through the use of electronics devices.Trade Review"This textbook offers a very comprehensive, very clear and unique course on nonlinear dynamics, synchronization and chaos control by using electronic circuits. The exercises, the numerical examples with MATLAB and laboratory experiments make it an extremely useful tool for under-graduated students or beginners in this domain."— Françoise Lamnabhi-Lagarrigue, CNRS, FranceTable of ContentsPreface. Introduction to nonlinear systems. The logistic map and elements of complex system dynamics. Bifurcations. Oscillators. Strange attractors and continuous-time chaotic systems. Cellular Nonlinear Networks. Synchronization and chaos control. Experiments and applications. Bibliography. Index.

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Book SynopsisCovers all your testing and inspection needs to help you pass your exams on City & Guilds 2391 and EAL 600/4338/6 and 600/4340/4 and Part P courses. Entirely up to date with the 18th Edition IET Wiring Regulations Step-by-step descriptions and photographs of the tests show exactly how to carry them out Completion of inspection and test certification and periodic reporting Fault finding techniques Testing 3 phase and single phase motors Supporting video footage of the tests contained in this book are available on the companion website This book covers everything you need to learn about inspection and testing, with clear reference to the latest updates to the legal requirements and wiring regulations. It answers all of your questions on the basics of inspection and testing, using clear and easy to remember language, along with sample questions and scenarios as they will be encountered in the exams. ChTable of ContentsIntroduction. The legal requirements. Types of certification required for the inspecting and testing of electrical installations. Initial verification inspection. Periodic testing. Earth electrode testing. Completion of test certificates. Correct selection of protective devices. Test equipment. Electric Shock. Testing photovoltaic systems. Fault finding. Exercises and questions. Answers. Glossary.

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Book SynopsisIn our abundant computing infrastructure, performance improvements across most all application spaces are now severely limited by the energy dissipation involved in processing, storing, and moving data. The exponential increase in the volume of data to be handled by our computational infrastructure is driven in large part by unstructured data from countless sources. This book explores revolutionary device concepts, associated circuits, and architectures that will greatly extend the practical engineering limits of energy-efficient computation from device to circuit to system level. With chapters written by international experts in their corresponding field, the text investigates new approaches to lower energy requirements in computing.Features Has a comprehensive coverage of various technologies Written by international experts in their corresponding field Covers revolutionary concepts at the device, circuit, and system levelsTrade ReviewThe book Energy Efficient Computing & Electronics: Devices to Systems contains a wealth of valuable resources being of paramount importance for graduated students, engineers, researchers and scientists willing to start exploring energy efficient designs of electronic devices, sensors, circuits and systems. The book is also a valuable tool for graduated level teachers, and practicing professionals who need to understand and master energy efficient revolutionary device concepts, associated circuits, and architectures that may greatly extend the practical engineering limits of future energy-efficient computation from device to system level.-Industrial Electronics Magazine (IEM)Table of ContentsSection I Emerging Low Power Devices: A FinFET-Based Framework for VLSI Design at the 7 nm Node. Molecular Phenomena in MOSFET Gate Dielectrics and Interfaces. Tunneling Field Effect Transistors. The Exploitation of the Spin-Transfer Torque Effect for CMOS Compatible Beyond Von Neumann Computing. Ferroelectric Tunnel Junctions As Ultra-Low-Power Computing Devices. Section II Sensors, Interconnects and Rectifiers: X-ray Sensors Based on Chromium Compensated Gallium Arsenide (HR GaAs:Cr). Vertical-Cavity Surface-Emitting Lasers for Interconnects. Low-Power Optoelectronic Interconnects on Two-Dimensional Semiconductors. GaN-Based Schottky Barriers for Low Turn-On Voltage Rectifiers. Compound Semiconductor Oscillation Device Fabricated by Stoichiometry Controlled-Epitaxial Growth and Its Application to Terahertz and Infrared Imaging and Spectroscopy. Section III Systems Design and Applications: Low Power Biosensor Design Techniques Based on Information Theoretic Principles. Low-Power Processor Design Methodology: High-Level Estimation and Optimization via Processor Description Language. Spatio-Temporal Multi-Application Request Scheduling in Energy-Efficient Data Centers. Ultra-Low-Voltage Implementation of Neural Networks. Multi-Pattern Matching Based Dynamic Malware Detection in Smart Phones.

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Book SynopsisFranco''s Design with Operational Amplifiers and Analog Integrated Circuits, 4e combines theory with real-life applications to deliver a straightforward look at analog design principles and techniques. An emphasis on the physical picture helps the student develop the intuition and practical insight that are the keys to making sound design decisions.is The book is intended for a design-oriented course in applications with operational amplifiers and analog ICs. It also serves as a comprehensive reference for practicing engineers. This new edition includes enhanced pedagogy (additional problems, more in-depth coverage of negative feedback, more effective layout), updated technology (current-feedback and folded-cascode amplifiers, and low-voltage amplifiers), and increased topical coverage (current-feedback amplifiers, switching regulators and phase-locked loops).Table of Contents1 Operational Amplifier Fundamentals2 Circuits with Resistive Feedback3 Active Filters: Part I4 Active Filters: Part II5 Static Op Amp Limitations6 Dynamic Op Amp Limitations7 Noise8 Stability9 Nonlinear Circuits10 Signal Generators11 Voltage References and Regulators12 D-A and A-D Converters13 Nonlinear Amplifiers and Phase-Locked Loops

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Book SynopsisPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Up-to-date hacks that will breathe life into your Arduino and Raspberry Pi creations!This intuitive DIY guide shows how to wire, disassemble, tweak, and re-purpose household devices and integrate them with your Raspberry Pi and Arduino inventions. Packed with full-color illustrations, photos, and diagrams, Hacking Electronics: Learning Electronics with Arduino and Raspberry Pi, Second Edition, features fun, easy-to-follow projects. Youâll discover how to build an Internet-controlled hacked electric toy, ultrasonic rangefinder, remote-controlled robotic rover, audio amp, slot car brakes and headlightsâeven a smart card reader!â Get up and running on both Arduino and Raspberry P

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Book Synopsis

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Book Synopsis

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Book Synopsis

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Book SynopsisOriginally published in 1916, as part of the Cambridge Technical Series, this book was written to provide a guide to the laws governing the flow of alternating currents in circuits and an account regarding different types of alternating current machines. Illustrative figures are included.Table of ContentsPreface; 1. Preliminary considerations; 2. Inductance; 3. The flow of single phase alternating currents in circuits possessing resistance, inductance and capacity; 4. Power in alternating current circuits; 5. Multiphase currents; 6. Instruments for use on alternating current circuits; 7. Alternators; 8. Static transformers; 9. Induction motors; 10. Converting plant; 11. Switchgear and protective appliances; high tension transmission; Index.

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Book SynopsisThis cross-disciplinary title features contributions by key-note specialists from Europe, Israel and the United States. It deals with the rapidly growing area of microwave photonics, and includes an extended study of the interactions between optical signals and microwave and millimetre-wave electrical signals for broadband applications. Table of ContentsPreface. Acknowledgements. General introduction. 1: Microwave photonics components. 1. Introduction. 2. Fast lasers sources. 2.1. Fast lasers sources; F. Deborgies. 2.2. Tunable/selectable sources; F. Brillouet. 2.3. Transverse mode, patterns and polarization behavior in VCSELs; J.G. McInerney. 2.4. Mode locked microchip lasers for the generation of low noise millimeter wave carriers; P.R. Herczfeld. 3. Semiconductors optical amplifiers; J.C. Simon. 4. Fast Modulators. 4.1. Fast modulators; M. Varasi. 4.2. Electroabsorption modulators and photo-oscillators for conversion of optics to millimeterwaves; C. Minot. 5. High speed photodetection. 5.1. Microwave optical interaction devices; D. Jager. 5.2. The GaAs MESFET as an optical detector; A. Madjar, et al. 5.3. HBT phototransistors as an optic/millimetre-wave converter. Part I: The device 100; C. Gonzalez. 5.4. HBT phototransistor as an optical millimeter wave converter. Part II: Simulation; C. Rumelhard, et al. 6. References. 2: Electronics for optics: integrated circuits. 1. Introduction. 2. Electronics for optics: introduction to MMICs; I. Darwazeh. 3. High speed ICs for optoelectronic modules; R. Lefevre. 4. High efficiency optical transmitter and receiver modules using integrated MMIC impedance matching and low noise 50.0 amplifier; M. Schaller, et al. 5. References. 3: Modeling methods for optoelectronics. 1. Introduction. 2. Foundations for integrated optics modeling; I. Montrosset, G. Perrone. 3. Tools for microwave-optic co-simulation; D. Breuer, et al. 4. The TLM method - Application to the microwaves and optics; F. Ndagijimana, et al. 5. References. 4 : Microwave - photonics systems. 1. Introduction. 2. Microwave optical links. 2.1. Analog optical links: models, measures and limits of performances; C.H. Cox, III. 2.2. Optoelectronic and optical devices for applications to microwave systems; P. Richin, D. Mongardien. 3. Telecommunication systems. 3.1. Microwave and millimeter-wave photonics for telecommunications; D. Wake. 3.2. Fibre supported MM-wave systems; P. Lane. 3.3. Optics and microwaves in telecommunications networks, today and in the future; M. Joindot. 4. Wireless systems; J.F. Cadiou, et al. 4.2. Broadband access networks: the opportunities of wireless; G. Kalbe. 5. Antenna - Beam fonning. 5.1. Planar antenna technology for microwave-optical interactions; Y. Qian, et al. 5.2. Antenna applications of RF photonics; J.J. Lee. 5.3. Microwave/photonic feed networks for phased array antenna systems; R.A. Sparks. 5.4. Photonics and phased array antennas; J. Chazelas, D. Dolfi. 6. Phase noise degradation in nonlinear fiber optic links distribution networks for communication satellites; A.S. Daryoush. 7. References. 5: All optical processing of microwave functions. 1. Introduction. 2. Photonic base microwave functions. 2.1. Microwave

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Book SynopsisElectronics: Basic, Analog, and Digital with PSpice does more than just make unsubstantiated assertions about electronics. Compared to most current textbooks on the subject, it pays significantly more attention to essential basic electronics and the underlying theory of semiconductors.In discussing electrical conduction in semiconductors, the author addresses the important but often ignored fundamental and unifying concept of electrochemical potential of current carriers, which is also an instructive link between semiconductor and ionic systems at a time when electrical engineering students are increasingly being exposed to biological systems. The text presents the background and tools necessary for at least a qualitative understanding of new and projected advances in microelectronics. The author provides helpful PSpice simulations and associated procedures (based on schematic capture, and using OrCAD 16.0 Demo software), which are availaTable of ContentsBasic Diode Circuits. Basic Principles of Semiconductors. pn Junction and Semiconductor Diodes. Semiconductor Fabrication. Field Effect Transistors. Bipolar Junction Transistor. Two-Port Circuits, Amplifiers, and Feedback. Single-Stage Transistor Amplifiers. Multistage and Feedback Amplifiers. Differential and Operational Amplifiers. Power Amplifiers and Switches. Basic Elements of Digital Circuits. Digital Logic Circuit Families.

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Book SynopsisWritten in easy-to-understand language with illustrative designs and examples, Electronics Engineering covers all aspects of electronics fundamentals. It begins with semiconductors and diodes, the simplest form of semiconductor device. It goes on to examine the bipolar junction transistor (BJT), field effect transistor (FET), operational amplifier (Op-Amp), switching theory and logic design (STLD), and electronics instruments. Each chapter provides a summary and a series of questions for exercise purposes, helping readers to test their assimilation of the material.

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Book SynopsisAdvances in design methods and process technologies have resulted in a continuous increase in the complexity of integrated circuits (ICs). However, the increased complexity and nanometer-size features of modern ICs make them susceptible to manufacturing defects, as well as performance and quality issues. Testing for Small-Delay Defects in Nanoscale CMOS Integrated Circuits covers common problems in areas such as process variations, power supply noise, crosstalk, resistive opens/bridges, and design-for-manufacturing (DfM)-related rule violations. The book also addresses testing for small-delay defects (SDDs), which can cause immediate timing failures on both critical and non-critical paths in the circuit. Overviews semiconductor industry test challenges and the need for SDD testing, including basic concepts and introductory material Describes algorithmic solutions incorporated in commercial tools from Mentor Graphics Reviews SDD testing Table of ContentsFundamentals of Small-Delay Defect Testing. Timing-Aware ATPG: K Longest Paths. Timing-Aware ATPG. Faster-than-At-Speed: Faster-than-at-Speed Test for Screening Small-Delay Defects. Circuit Path Grading Considering Layout, Process Variations, and Cross Talk. Alternative Methods: Output Deviations-Based SDD Testing. Hybrid/Top-off Test Pattern Generation Schemes for Small-Delay Defects. Circuit Topology-Based Test Pattern Generation for Small-Delay Defects. SDD Metrics: Small-Delay Defect Coverage Metrics. Conclusion. References.

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Book SynopsisPresenting the cutting-edge results of new device developments and circuit implementations, High-Speed Devices and Circuits with THz Applications covers the recent advancements of nano devices for terahertz (THz) applications and the latest high-speed data rate connectivity technologies from system design to integrated circuit (IC) design, providing relevant standard activities and technical specifications. Featuring the contributions of leading experts from industry and academia, this pivotal work: Discusses THz sensing and imaging devices based on nano devices and materials Describes silicon on insulator (SOI) multigate nanowire field-effect transistors (FETs) Explains the theory underpinning nanoscale nanowire metal-oxide-semiconductor field-effect transistors (MOSFETs), simulation methods, and their results Explores the physics of the silicon-germanium (SiGe) heterojunction bipolar transistor (HBT), as well as commercially availableTrade Review"... a valuable reference for high-speed device and circuit researchers and design engineers."—James Chu, Kennesaw State University, Marietta, Georgia, USA, from IEEE Microwave Magazine, November 2015 Table of ContentsTerahertz Technology based on Nanoelectronic Devices. Ultimate FDSOI Multigate MOSFETs and Multibarrier Boosted Gate Resonant Tunneling FETs for a New High-Performance Low-Power Paradigm. SiGe BiCMOS Technology and Devices. SiGe HBT Technology and Circuits for THz Applications. Multiwavelength Sub-THz Sensor Array with Integrated Lock-In Amplifier and Signal Processing in 90 nm CMOS Technology. 40/100 GbE Physical Layer Connectivity for Servers and Data Centers. Equalization and Multilevel Modulation for Multi-Gbps Chip-to-Chip Links. 25 G/40 G CMOS SerDes: Need, Architecture, and Implementation. Clock and Data Recovery Circuits.

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Book SynopsisTable of ContentsMicrofluidics and Biosensors. Chemical and Environmental Sensors. Automotive and Industrial Sensors. Software and Sensor Systems.

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Book SynopsisRecently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe.Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academic developments beyond silicon and complementary metaloxidesemiconductor (CMOS) technology. From quantum-dot cellular automata (QCA) to chips for cochlear implants, this must-have resource: Investigates the trend of combining multiple cores in a single chip to boost perforTable of ContentsIntegration of Graphics Processing Cores with Microprocessors. Arithmetic Implemented with Semiconductor Quantum-Dot Cellular Automata. Novel Capacitor-Less A2RAM Memory Cells for Beyond 22-nm Nodes. Four-State Hybrid Spintronics–Straintronics: Extremely Low-Power Information Processing with Multiferroic Nanomagnets Possessing Biaxial Anisotropy. Improvement and Applications of Large-Area Flexible Electronics with Organic Transistors. Soft-Error Mitigation Approaches for High-Performance Processor Memories. Design Space Exploration of Wavelength-Routed Optical Networks-on-Chip Topologies for 3D Stacked Multi- and Many-Core Processors. Quest for Energy Efficiency in Digital Signal Processing: Architectures, Algorithms, and Systems. Nanoelectromechanical Relays: An Energy Efficient Alternative in Logic Design. High-Performance and Customizable Bioinformatic and Biomedical Very-Large-Scale-Integration Architectures. Basics, Applications, and Design of Reversible Circuits. Three-Dimensional Spintronics. Soft-Error-Aware Power Optimization Using Dynamic Threshold. Future of Asynchronous Logic. Memristor-CMOS-Hybrid Synaptic Devices Exhibiting Spike-Timing-Dependent Plasticity. Very-Large-Scale Integration Implementations of Cryptographic Algorithms. Dynamic Intrinsic Chip ID for Hardware Security. Ultra-Low-Power Audio Communication System for Full Implantable Cochlear Implant Application. Heterogeneous Memory Design. Soft Error Resilient Circuit Design.

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Book SynopsisDesign higher-quality embedded software from concept through production.  This book assumes basic C and microcontroller programming knowledge and is organized into three critical areas: Software Architecture and Design; Agile, DevOps, and Processes; and Development and Coding Skills.You''ll start with a basic introduction to embedded software architecture and the considerations for a successful design. The book then breaks down how to architect an RTOS-based application and explore common design patterns and building blocks. Next, you''ll review embedded software design processes such as TDD, CI/CD, modeling, and simulation that can be used to accelerate development. Finally, the book will examine how to select a microcontroller, write configurable code, coding strategies, techniques, and tools developers can''t live without. Embedded systems are typically designed using microcontrollers to build electronic systems wTable of ContentsPart 1 - Software Architecture DesignEmbedded System Design Philosophy⁃ Challenges Facing Embedded Developers⁃ Traditional Embedded Software Development⁃ The Age of Modeling, Simulation and Off-chip Development⁃ SOLID Design Principles⁃ Test Driven Development (TDD)⁃ Why Best Practices?Embedded Software Architecture Design⁃ Architect First, Code Second⁃ Architectural Layers⁃ Single vs Multicore Architectures⁃ Application Domain Decomposition⁃ Interface Design Principles⁃ Architectural LanguagesRTOS Application Design⁃ Tasks, Threads and Processes⁃ Task Decomposition Techniques⁃ Task Scheduling Algorithms⁃ Setting Task Priorities⁃ Schedule-ability using Rate Monotonic Analysis⁃ Designing Application Data Flow⁃ Producer, Consumer, Processor and Transfer MechanismsSecure Application Design⁃ Platform Security Architecture (PSA)⁃ Security through Isolation⁃ TrustZone⁃ Memory map design⁃ Memory Protection Units (MPUs)⁃ Secure boot⁃ Secure bootloaders and OTAsDesign Patterns⁃ pub / sub⁃ Rtos patterns⁃ Handling interrupts⁃ State machines⁃ Active objectsPart 2 - Development ProcessesSoftware Quality⁃ Coding Standards⁃ Code Reviews⁃ Code Metrics⁃ Code Analysis (static vs dynamic)Software Testing and Verification⁃ Integration Testing⁃ Performance Testing⁃ Regression Testing Software Verification Results⁃ Testing of executable object code⁃ Code coverage analysis⁃ Test ReportsApplication Modeling and Simulation⁃ Modeling Methodologies⁃ Simulations Role⁃ wxWidgets⁃ ExampleTest Driven Development⁃ Overview⁃ Test Harnesses⁃ Code Coverage⁃ Test DesignContinuous Integration / Continuous Deployment⁃ Process Overview⁃ Docker⁃ Jenkins⁃ Git Integrations⁃ Merge Process⁃ DeploymentPart 3 - Where the Bits hit the SiliconSelecting a Microcontroller⁃ Traditional Techniques⁃ Modern Selection Process⁃ Selection Considerations⁃ KT Matrix Design and UseCode Implementation Techniques⁃ Interfaces⁃ Command Processing⁃ Task initialization⁃ Assertions⁃ TelemetryDiagnostic and Fault Handling⁃ Design failure mode and effect analysis (DFMEA)⁃ Fault Handling Strategies⁃ Diagnostic Tasks⁃ Error Checking Code (ECC)⁃ WatchdogsApplication Optimization⁃ Models and Simulation versus Reality⁃ Scalability⁃ Maintenance⁃ Code size versus speed⁃ Compilation Settings⁃ Memory managementThe Right Tool for the Job⁃ Tracing⁃ Code Analyzers⁃ Protocol analysis⁃ Metric tools⁃ Open source versus commercial

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Book SynopsisWith this practical guide, author Justin Rajewski shows you hands-on how to create FPGA projects, whether you're a programmer, engineer, product designer, or maker. You'll quickly go from the basics to designing your own processor.

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Book SynopsisThis book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity.With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harshTrade Review"Engineers are developing electronic systems for applications in environments significantly more taxing than those seen in classical computing applications. This book exposes engineers to the range of challenges faced and fosters an understanding of the approaches useful to succeed in those taxing application environments. It has an outstanding overview of the challenges to design electronic systems to operate in the presence of hazards in extreme environments."—Klaus Schuegraf, Cymer, San Diego, California, USATable of ContentsSection I Radiation. Commercial Off-the-Shelf Components in Space Applications. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues. Simulation of Single-Event Effects on Fully Depleted Siliconon-Insulator (FDSOI) CMOS. Section II Sensors and Operating Conditions. Electronic Sensors for the Detection of Ovarian Cancer. Sensors and Sensor Systems for Harsh Environment Applications. III-Nitride Electronic Devices for Harsh Environments. Section III Packaging and System Design. Packaging for Systems in Harsh Environments. Corrosion Resistance of Lead-Free Solders under Environmental Stress. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via.

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Book SynopsisRecent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed. Table of ContentsIntroduction. Packaging techniques of future ICs. Integrated architectures. Summary. Through Silicon Vias: Materials, Properties and Fabrication. Introduction. History of graphene material. Carbon nanotube. Graphene nanoribbon. Properties of TSV. Fabrication of TSVs. Challenges for the TSV implementations. Summary. Copper Based TSVs. Introduction. Physical configuration. Modelling of Cu based TSVs. Performance analysis of Cu based TSVs. Summary. Carbon Nanotube Based TSVs. Introduction. Physical configuration. Modelling. Performance analysis of CNT based TSVs. Summary. Mixed CNT Bundled Based TSVs. Introduction. Configurations of mixed CNT bundled TSVs. Modelling of MCB based TSVs. Signal integrity analysis of MCB based TSVs. Summary. Graphene Nanoribbon Based TSVs. Introduction. Configurations of GNR based TSVs. Fabrication challenges and limitations. Modelling of GNR based TSVs with smooth edges. Modelling of GNR based TSVs with rough edges. Signal integrity analysis of GNR based TSVs. Summary. Liners in TSVs. Introduction. Types of liners and their impact on performance. Fabrication challenges. Modelling of CNT bundled TSV with SiO2 and polymer liners. Impact of polymer liners on delay. Summary.

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Book SynopsisThis book deals with some emerging semiconductor devices and their applications in terms of electronic circuits. The basic concept plays a key role in development of any new electronic devices and circuits. The implementation of complex integrated circuits becomes easier with understanding of basic concepts of solid state devices and its circuit behavior. The book covers the latest trends in development of advanced electronic devices and applications for undergraduate, graduate and post graduate level courses. It combines the right blend of theory and practice to present a simplified and methodical way to develop researchers' understanding of the clarity between theoretical, practical and simulated results in the analysis of solid state devices, circuit characteristics and other important issues based on their applications. The book also covers the broad applications of electronic devices in biomedical and low power portable smart IOT systems. This book is well organized into 13 chapters. Chapters 1 to 4 cover design of low power FET devices compatible to technology scaling trends meeting required performance enhancement in terms of power, delay and speed. Chapter 5 and 6 are focused on analog application of CMOS technology. Chapter 7 describes power MOSFET design with advance materials for lowest possible on-resistance resulting into enhance performance. Chapter 8 deals with biomedical application of advance electronic devices introducing new materials and structure. Chapter 9 introduces a neuromorphic model and real-time simulation for the study of biological neuron model in the human body on circuit level. Chapter 10 and 11 presents the applications of sensors growing over a wide range of sensing targets along with advance sensing technology for human-computer interaction. Chapter 12 and 13 describe optoelectronic devices like photodetectors, optical sensors and solar cells etc.Table of ContentsPrefaceDesign of Advance Bulk and SOI Multi-Gate MOSFET StructuresLow Power Gate Engineered Pocket nDGTFET, pDGTEFTTunnel Field Effect Transistors as an Emerging Semiconductor TechnologyPower Analysis to Ensure Secure CMOS ArchitectureLow Power Analog Circuit Design with CMOS TechnologyCurrent Conveyor Based All Pass FilterDesign and Analysis of Trench Gate InGaAs LDMOSComprehensive Analysis of Biosensors and ApplicationNeuromorphic Electronic Circuit Implementation for Cortical NeuronsSensorsGesture Recognition Sensor Technology: Google SoliOptoelectronic Devices and Their ApplicationDevelopment of Solar CellIndex.

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Book SynopsisUnlike books currently on the market, this book attempts to satisfy two goals: combine circuits and electronics into a single, unified treatment, and establish a strong connection with the contemporary world of digital systems. It will introduce a new way of looking not only at the treatment of circuits, but also at the treatment of introductory coursework in engineering in general. Using the concept of ''abstraction,'' the book attempts to form a bridge between the world of physics and the world of large computer systems. In particular, it attempts to unify electrical engineering and computer science as the art of creating and exploiting successive abstractions to manage the complexity of building useful electrical systems. Computer systems are simply one type of electrical systems.Trade Review"The book issued by two professors at MIT is intended to initiate a new approach in presenting and developing analog and digital electronics. Traditionally, analog and digital elements and circuits are given in separate courses. Here, the authors want to show that in presenting both topics (analog and digital), a deeper insight of the real problems of the actual electronics is obtained." --Dumitru Stanomir (Bucuresti) "Elsevier, the academic publishing giant, announced [1] on Tuesday that it will offer a free version of one of its textbooks this fall to students who register for Circuits & Electronics, a massive open online course (MOOC) being offered by edX…The MIT Press text that benefited from a Coursera plug was co-written by Daphne Koller, the co-founder of Coursera. Similarly, the Elsevier textbook that will be featured this fall in Circuits & Electronics was co-written by Anant Agarwal, the president of edX." --Inside HigherEd "Elsevier announced its plan to provide free content through edX, the online learning initiative founded by Harvard University and the Massachusetts Institute of Technology (MIT) launched in May. Students who enroll in edX’s course 6.002X: Circuits and Electronics will have free access to an online version of the course textbook, Foundations of Analog and Digital Electronic Circuits, written by Anant Agarwal and Jeffrey Lang and published under Elsevier’s Morgan Kaufmann imprint." --Information Today, Inc. "STM publisher Elsevier, Netherlands, has announced plans to provide free content through edX, the online learning initiative founded by Harvard University and the Massachusetts Institute of Technology (MIT). Students who enroll in edX's course 6.002X: Circuits and Electronics will have free access to an online version of the course textbook, Foundations of Analog and Digital Electronic Circuits, written by Anant Agarwal and Jeffrey Lang and published under Elsevier's Morgan Kaufmann imprint." --KnowledgeSpeak "Elsevier, a world-leading provider of scientific, technical and medical information products and services, today announced its plan to provide free content through edX, the online learning initiative founded by Harvard University and the Massachusetts Institute of Technology (MIT) launched in May… Students who enroll in edX’s course 6.002X: Circuits and Electronics will have free access to an online version of the course textbook, Foundations of Analog and Digital Electronic Circuits, written by Anant Agarwal and Jeffrey Lang and published under Elsevier’s Morgan Kaufmann imprint." --edXTable of Contents1 The Circuit Abstraction 2 Resistive Networks 3 Network Theorems 4 Analysis of Nonlinear Circuits 5 The Digital Abstraction 6 The MOSFET Switch 7 The MOSFET Amplifier 8 The Small Signal Model 9 Energy Storage Elements 10 First-order Transients 11 Energy and Power in Digital Circuits 12 Transients in Second Order Circuits 13 Sinusoidal Steady State 14 Sinusoidal Steady State: Resonance 15 The Operational Amplifier Abstraction 16 Diodes

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Book SynopsisRetaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.Stay Current with the Latest TechnologiesIn addition to updates to nearly every existing chapter, this edition features five entirely new contributions on…Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs)Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication.While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.Table of ContentsIntroduction to Semiconductor Devices. Overview of Interconnect-Copper and Low-κ Integration. Silicon Materials. SOI Materials and Devices. Surface Preparation. Supercritical Carbon Dioxide in Semiconductor Cleaning. Ion Implantation. Dopant Diffusion. Oxidation and Gate Dielectrics. Silicides. Rapid Thermal Processing. Low-κ Dielectrics. Chemical Vapor Deposition. Atomic Layer Deposition. Physical Vapor Deposition. Damascene Copper Electroplating. Chemical-Mechanical Polishing. Optical Lithography. Photoresist Materials and Processing. Photomask Fabrication. Plasma Etch. Equipment Reliability. Overview of Process Control. In-Line Metrology. In-Situ Metrology. Yield Modeling. Yield Management. Electrical, Physical, and Chemical Characterization. Failure Analysis. Reliability Physics. Effects of Terrestrial Radiation on Integrated Circuits. Integrated-Circuit Packaging. 300 mm Wafer Fab Logistics and Automated Material Handling Systems. Factory Modeling. Economics of Semiconductor Manufacturing. Appendix A: Physical Constants. Appendix B: Units Conversion. Appendix C: Standards Commonly Used in Semiconductor Manufacturing. Appendix D: Acronyms. Index.

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Book SynopsisIn today's globally competitive wireless industry, the design-to-production cycle is critically important. Circuit and system engineers must be able to develop robust designs that can be mass produced. To accomplish this, engineers need to learn the requirements of, and solutions leading to, optimum performance. The first of a two-volume set, this text takes a practical approach to RF (radio frequency) circuit design, offering an understanding of the fundamental concepts that practitioners need to know and use for their work in this industry. It seeks to lay the groundwork for efficient passive circuit design.Table of ContentsIntroduction to RF circuit design; the radio as a typical RF system; RF circuit fundamentals; CAD of linear RF/MW circuits; scattering parameters and the Smith Chart; passive component modelling; impedance matching; lumped and distributed filters; high-speed circuit design considerations.

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Book SynopsisPower distribution networks (PDNs) are key components in today's high-performance electronic circuitry. They ensure that circuits have a constant, stable supply of power. The complexities of designing PDNs have been dramatically reduced by frequency-domain analysis. This book examines step-by-step how electrical engineers can use frequency-domain techniques to accurately simulate, measure, and model PDNs. It guides engineers through the ins and outs of these techniques to ensure they develop the right PDN for any type of circuit. Circuit engineers gain valuable insight from the book's best practices for measuring, simulating, and modeling. Practical examples illustrate every phase in PDN development from material characterization and component design to modeling the entire network.Table of ContentsIntroduction. Simulation Methods and Tools. Modeling of Vias; Modeling of Planes. Measurement Basics. Probes and Calibrations; Measurements - Practical Details. Modeling of Capacitors. Modeling of Inductors, Converters and Systems.

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