Electronics: circuits and components Books
John Wiley & Sons Inc Electromagnetic Compatibility Engineering
Book SynopsisThis expanded third edition of the most popular book on electromagnetic compatibility reflects all of the latest advances and developments in the field. It demonstrates how and why noise in electronic digital systems can be avoided or minimized.Trade Review"This is an outstanding book. At 872 pages thick, it is a valuable follow-up to Ott's earlier books, Noise Reduction Techniques in Electronic Systems (first edition, 1975; second edition, 1987) . . . EMC will remain with us in the foreseeable future, and we need books like this one." (The Radio Science Bulletin, 1 June 2011) Table of ContentsPreface xxiii Part 1 EMC Theory 1 1 Electromagnetic Compatibility 3 1.1 Introduction 3 1.2 Noise and Interference 3 1.3 Designing for Electromagnetic Compatibility 4 1.4 Engineering Documentation and EMC 6 1.5 United States’ EMC Regulations 6 1.6 Canadian EMC Requirements 19 1.7 European Union’s EMC Requirements 20 1.8 International Harmonization 26 1.9 Military Standards 27 1.10 Avionics 28 1.11 The Regulatory Process 30 1.12 Typical Noise Path 30 1.14 Miscellaneous Noise Sources 33 1.15 Use of Network Theory 36 Summary 38 Problems 39 References 41 Further Reading 42 2 Cabling 44 2.1 Capacitive Coupling 45 2.2 Effect of Shield on Capacitive Coupling 48 2.3 Inductive Coupling 52 2.4 Mutual Inductance Calculations 54 2.5 Effect of Shield on Magnetic Coupling 56 2.6 Shielding to Prevent Magnetic Radiation 64 2.7 Shielding a Receptor Against Magnetic Fields 67 2.8 Common Impedance Shield Coupling 69 2.9 Experimental Data 70 2.10 Example of Selective Shielding 74 2.11 Shield Transfer Impedance 75 2.12 Coaxial Cable Versus Twisted Pair 75 2.13 Braided Shields 79 2.14 Spiral Shields 81 2.15 Shield Terminations 84 2.16 Ribbon Cables 94 2.17 Electrically Long Cables 96 Summary 96 Problems 98 References 103 Further Reading 104 3 Grounding 106 3.1 AC Power Distribution and Safety Grounds 107 3.2 Signal Grounds 120 3.3 Equipment/System Grounding 132 3.4 Ground Loops 142 3.5 Low-Frequency Analysis of Common-Mode Choke 147 3.6 High-Frequency Analysis of Common-Mode Choke 152 3.7 Single Ground Reference for a Circuit 154 Summary 155 Problems 156 References 157 Further Reading 157 4 Balancing and Filtering 158 4.1 Balancing 158 4.2 Filtering 174 4.3 Power Supply Decoupling 178 4.4 Driving Capacitive Loads 186 4.5 System Bandwidth 188 4.6 Modulation and Coding 190 Summary 190 Problems 191 References 192 Further Reading 193 5 Passive Components 194 5.1 Capacitors 194 5.2 Inductors 203 5.3 Transformers 204 5.4 Resistors 206 5.5 Conductors 208 5.6 Transmission Lines 215 5.7 Ferrites 225 Summary 233 Problems 234 References 237 Further Reading 237 6 Shielding 238 6.1 Near Fields and Far Fields 238 6.2 Characteristic and Wave Impedances 241 6.3 Shielding Effectiveness 243 6.4 Absorption Loss 245 6.5 Reflection Loss 249 6.6 Composite Absorption and Reflection Loss 257 6.7 Summary of Shielding Equations 260 6.8 Shielding with Magnetic Materials 260 6.9 Experimental Data 265 6.10 Apertures 267 6.11 Waveguide Below Cutoff 280 6.12 Conductive Gaskets 282 6.13 The ‘‘IDEAL’’ Shield 287 6.14 Conductive Windows 288 6.16 Internal Shields 293 6.17 Cavity Resonance 295 6.18 Grounding of Shields 296 Summary 296 Problems 297 References 299 Further Reading 300 7 Contact Protection 302 7.1 Glow Discharges 302 7.2 Metal-Vapor or Arc Discharges 303 7.3 AC Versus DC Circuits 305 7.4 Contact Material 306 7.5 Contact Rating 306 7.6 Loads with High Inrush Currents 307 7.7 Inductive Loads 308 7.8 Contact Protection Fundamentals 310 7.9 Transient Suppression for Inductive Loads 314 7.10 Contact Protection Networks for Inductive Loads 318 7.11 Inductive Loads Controlled by a Transistor Switch 322 7.12 Resistive Load Contact Protection 323 7.13 Contact Protection Selection Guide 323 7.14 Examples 324 Summary 325 Problems 326 References 327 Further Reading 327 8 Intrinsic Noise Sources 328 8.1 Thermal Noise 328 8.2 Characteristics of Thermal Noise 332 8.3 Equivalent Noise Bandwidth 334 8.4 Shot Noise 337 8.5 Contact Noise 338 8.6 Popcorn Noise 339 8.7 Addition of Noise Voltages 340 8.8 Measuring Random Noise 341 Summary 342 Problems 343 References 345 Further Reading 345 9 Active Device Noise 346 9.1 Noise Factor 346 9.2 Measurement of Noise Factor 349 9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor 351 9.4 Noise Voltage and Current Model 353 9.5 Measurment of Vn and In 355 9.6 Calculating Noise Factor and S/N Ratio from Vn–In 356 9.7 Optimum Source Resistance 357 9.8 Noise Factor of Cascaded Stages 360 9.9 Noise Temperature 362 9.10 Bipolar Transistor Noise 364 9.11 Field-Effect Transistor Noise 368 9.12 Noise in Operational Amplifiers 370 Summary 375 Problems 376 References 377 Further Reading 378 10 Digital Circuit Grounding 379 10.1 Frequency Versus Time Domain 380 10.2 Analog Versus Digital Circuits 380 10.3 Digital Logic Noise 380 10.4 Internal Noise Sources 381 10.5 Digital Circuit Ground Noise 384 10.6 Ground Plane Current Distribution and Impedance 391 10.7 Digital Logic Current Flow 412 Summary 419 Problems 420 References 421 Further Reading 422 Part 2 EMC Applications 423 11 Digital Circuit Power Distribution 425 11.1 Power Supply Decoupling 425 11.2 Transient Power Supply Currents 426 11.3 Decoupling Capacitors 431 11.4 Effective Decoupling Strategies 436 11.5 The Effect of Decoupling on Radiated Emissions 454 11.6 Decoupling Capacitor Type and Value 456 11.7 Decoupling Capacitor Placement and Mounting 457 11.8 Bulk Decoupling Capacitors 459 11.9 Power Entry Filters 460 Summary 461 Problems 461 References 463 Further Reading 463 12 Digital Circuit Radiation 464 12.1 Differential-Mode Radiation 465 12.2 Controlling Differential-Mode Radiation 471 12.3 Common-Mode Radiation 477 12.4 Controlling Common-Mode Radiation 480 Summary 488 Problems 489 References 490 Further Reading 491 13 Conducted Emissions 492 13.1 Power Line Impedance 492 13.2 Switched-Mode Power Supplies 495 13.3 Power-Line Filters 511 13.4 Primary-to-Secondary Common-Mode Coupling 523 13.5 Frequency Dithering 524 13.6 Power Supply Instability 524 13.7 Magnetic Field Emissions 525 13.8 Variable Speed Motor Drives 528 13.9 Harmonic Suppression 536 Summary 541 Problems 542 References 544 Further Reading 544 14 RF and Transient Immunity 545 14.1 Performance Criteria 545 14.2 RF Immunity 546 14.3 Transient Immunity 557 14.4 Power Line Disturbances 572 Summary 575 Problems 576 References 578 Further Reading 579 15 Electrostatic Discharge 580 15.1 Static Generation 580 15.2 Human Body Model 587 15.3 Static Discharge 589 15.4 ESD Protection in Equipment Design 592 15.5 Preventing ESD Entry 594 15.6 Hardening Sensitive Circuits 608 15.7 ESD Grounding 608 15.8 Nongrounded Products 609 15.9 Field-Induced Upset 610 15.10 Transient Hardened Software Design 612 15.11 Time Windows 617 Summary 617 Problems 619 References 620 Further Reading 621 16 PCB Layout and Stackup 622 16.1 General PCB Layout Considerations 622 16.2 PCB-to-Chassis Ground Connection 625 16.3 Return Path Discontinuities 626 16.4 PCB Layer Stackup 635 Summary 655 Problems 657 References 658 Further Reading 658 17 Mixed-Signal PCB Layout 660 17.1 Split Ground Planes 660 17.2 Microstrip Ground Plane Current Distribution 662 17.3 Analog and Digital Ground Pins 665 17.4 When Should Split Ground Planes Be Used? 668 17.5 Mixed Signal ICs 669 17.6 High-Resolution A/D and D/A Converters 671 17.7 A/D and D/A Converter Support Circuitry 676 17.8 Vertical Isolation 679 17.9 Mixed-Signal Power Distribution 681 17.10 The IPC Problem 684 Summary 685 Problems 686 References 687 Further Reading 687 18 Precompliance EMC Measurements 688 18.1 Test Environment 689 18.2 Antennas Versus Probes 689 18.3 Common-Mode Currents on Cables 690 18.4 Near Field Measurements 694 18.5 Noise Voltage Measurements 697 18.6 Conducted Emission Testing 700 18.7 Spectrum Analyzers 707 18.8 EMC Crash Cart 711 18.9 One-Meter Radiated Emission Measurements 713 18.10 Precompliance Immunity Testing 717 18.11 Precompliance Power Quality Tests 723 18.12 Margin 726 Summary 728 Problems 729 References 730 Further Reading 731 Appendix 733 A. The Decibel 733 B. The Ten Best Ways to Maximize the Emission from Your Product 740 C. Multiple Reflections of Magnetic Fields in Thin Shields 743 D. Dipoles for Dummies 746 E. Partial Inductance 765 F. Answers to Problems 790 Index 825
£109.76
Taylor & Francis Ltd (Sales) Electronic Systems Maintenance Handbook
Book SynopsisThe days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up.The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances.Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.Trade Review"…should take its place as a fundamental work in general engineering reference…The handbook shares the very fine organization and multiple access points of other recent CRC Press handbooks…"-Science & Technology Librariesd take its place as a fundamental work in general engineering reference…The handbook shares the very fine organization and multiple access points of other recent CRC Press handbooks…"-Science & Technology LibrariesTable of ContentsProbability and Statistics. Electronic Hardware Reliability. Software Reliability. Thermal Properties. Heat Management. Shielding and EMI Considerations. Resistors and Resistive Materials. Capacitance and Capacitors. Inductors and Magnetic Properties. Printed Wiring Boards. Hybrid Microelectronics Technology. Surface Mount Technology. Semiconductor Failure Modes. Power System Protection Alternatives. Facility Grounding. Network Switching Concepts. Network Communication. Data Acquisition. Computer-Based Circuit Simulation. Audio Frequency Distortion Mechanisms and Analysis. Video Display Distortion Mechanisms and Analysis. Radio Frequency Distortion Mechanisms and Analysis. Digital Test Equipment and Measurement Systems. Fourier Waveform Analysis. Computer Based Signal Analysis. Systems Engineering Concepts. Disaster Planning and Recovery. Safety and Protection Systems. Conversion Tables. Index
£204.25
CRC Press Classical to Quantum Transport in MultiDimensional Field Effect Transistors
a huge range and FREE tracked UK delivery on ALL orders.
£114.00
John Wiley & Sons Inc CMOS
Book SynopsisTable of ContentsPreface xxxiii Chapter 1 Introduction to CMOS Design 1 1.1 The CMOS IC Design Process 1 1.1.1 Fabrication 2 1.2 CMOS Background 5 1.3 An Introduction to SPICE 8 Chapter 2 The Well 31 2.1 Patterning 32 2.1.1 Patterning the N-well 35 2.2 Laying Out the N-well 35 2.2.1 Design Rules for the N-well 36 2.3 Resistance Calculation 36 2.3.1 The N-well Resistor 38 2.4 The N-well/Substrate Diode 39 2.4.1 A Brief Introduction to PN Junction Physics 39 2.4.2 Depletion Layer Capacitance 42 2.4.3 Storage or Diffusion Capacitance 45 2.4.4 SPICE Modeling 46 2.5 The RC Delay through the N-well 48 2.6 Twin Well Processes 51 Chapter 3 The Metal Layers 59 3.1 The Bonding Pad 59 3.1.1 Laying Out the Pad I 60 3.2 Design and Layout Using the Metal Layers 63 3.2.1 Metal1 and Via1 63 3.2.2 Parasitics Associated with the Metal Layers 63 3.2.3 Current-Carrying Limitations 67 3.2.4 Design Rules for the Metal Layers 68 3.2.5 Contact Resistance 69 3.3 Crosstalk and Ground Bounce 70 3.3.1 Crosstalk 71 3.3.2 Ground Bounce 72 3.4 Layout Examples 74 3.4.1 Laying Out the Pad II 74 3.4.2 Laying Out Metal Test Structures 76 Chapter 4 The Active and Poly Layers 83 4.1 Layout Using the Active and Poly Layers 83 4.1.1 Process Flow 90 4.2 Connecting Wires to Poly and Active 93 4.3 Electrostatic Discharge (ESD) Protection 99 Chapter 5 Resistors, Capacitors, MOSFETs 107 5.1 Resistors 107 5.2 Capacitors 115 5.3 MOSFETs 118 5.4 Layout Examples 125 Chapter 6 MOSFET Operation 135 6.1 MOSFET Capacitance Overview/Review 136 6.2 The Threshold Voltage 139 6.3 IV Characteristics of MOSFETs 144 6.3.1 MOSFET Operation in the Triode Region 144 6.3.2 The Saturation Region 146 6.4 SPICE Modeling of the MOSFET 149 6.4.1 Some SPICE Simulation Examples 151 6.4.2 The Subthreshold Current 152 6.5 Short-Channel MOSFETs 154 6.5.1 MOSFET Scaling 155 6.5.2 Short-Channel Effects 156 6.5.3 SPICE Models for Our Short-Channel CMOS Process 157 Chapter 7 CMOS Fabrication by Jeff Jessing 165 7.1 CMOS Unit Processes 165 7.1.1 Wafer Manufacture 165 7.1.2 Thermal Oxidation 167 7.1.3 Doping Processes 168 7.1.4 Photolithography 170 7.1.5 Thin Film Removal 173 7.1.6 Thin Film Deposition 177 7.2 CMOS Process Integration 180 7.2.1 Frontend-of-the-Line Integration 182 7.2.2 Backend-of-the-Line Integration 196 7.3 Backend Processes 210 7.4 Advanced CMOS Process Integration 212 7.4.1 FinFETs 213 7.4.2 Dual Damascene Low-k/Cu Interconnects 216 7.5 Summary 219 Chapter 8 Electrical Noise: An Overview 221 8.1 Signals 221 8.1.1 Power and Energy 221 8.1.2 Power Spectral Density 223 8.2 Circuit Noise 226 8.2.1 Calculating and Modeling Circuit Noise 227 8.2.2 Thermal Noise 231 8.2.3 Signal-to-Noise Ratio 237 8.2.4 Shot Noise 247 8.2.5 Flicker Noise 251 8.2.6 Other Noise Sources 258 8.3 Discussion 260 8.3.1 Correlation 260 8.3.2 Noise and Feedback 264 8.3.3 Some Final Notes Concerning Notation 267 Chapter 9 Models for Analog Design 277 9.1 Long-Channel MOSFETs 277 9.1.1 The Square-Law Equations 279 9.1.2 Small Signal Models 286 9.1.3 Temperature Effects 300 9.2 Short-Channel MOSFETs 302 9.2.1 General Design (A Starting Point) 303 9.2.2 Specific Design (A Discussion) 306 9.3 MOSFET Noise Modeling 308 Chapter 10 Models for Digital Design 327 10.1 The Digital MOSFET Model 328 10.1.2 Process Characteristic Time Constant 331 10.1.3 Delay and Transition Times 333 10.1.4 General Digital Design 326 10.2 The MOSFET Pass Gate 326 10.2.1 Delay through a Pass Gate 338 10.2.2 Delay through Series-Connected PGs 340 10.3 A Final Comment Concerning Measurements 341 Chapter 11 The Inverter 347 11.1 DC Characteristics 347 11.2 Switching Characteristics 352 11.3 Layout of the Inverter 356 11.4 Sizing for Large Capacitive Loads 358 11.5 Other Inverter Configurations 364 Chapter 12 Static Logic Gates 369 12.1 DC Characteristics of the NAND and NOR Gates 369 12.1.1 DC Characteristics of the NAND Gate 369 12.1.2 DC Characteristics of the NOR Gate 372 12.2 Layout of the NAND and NOR Gates 373 12.3 Switching Characteristics 374 12.3.1 NAND Gate 375 12.3.2 Number of Inputs 378 12.4 Complex CMOS Logic Gates 379 Chapter 13 Clocked Circuits 389 13.1 The CMOS TG 389 13.2 Applications of the Transmission Gate 391 13.3 Latches and Flip-Flops 395 13.4 Examples 402 Chapter 14 Dynamic Logic Gates 411 14.1 Fundamentals of Dynamic Logic 411 14.1.1 Charge Leakage 411 14.1.2 Simulating Dynamic Circuits 414 14.1.3 Nonoverlapping Clock Generation 415 14.1.4 CMOS TG in Dynamic Circuits 416 14.2 Clocked CMOS Logic 417 Chapter 15 CMOS Layout Examples 425 15.1 Chip Layout 426 15.2 Layout Steps by Dean Moriarty 434 Chapter 16 Memory Circuits 445 16.1 Array Architectures 446 16.1.1 Sensing Basics 446 16.1.2 The Folded Array 452 16.1.3 Chip Organization 458 16.2 Peripheral Circuits 458 16.2.1 Sense Amplifier Design 458 16.2.2 Row/Column Decoders 467 16.2.3 Row Drivers 470 16.3 Memory Cells 471 16.3.1 The SRAM Cell 473 16.3.2 Read-Only Memory (ROM) 473 16.3.3 Floating Gate Memory 473 Chapter 17 Sensing Using Modulation 493 17.1 Qualitative Discussion 494 17.1.1 Examples of DSM 494 17.1.2 Using DSM for Sensing in Flash Memory 496 17.2 Sensing Resistive Memory 506 17.3 Sensing in CMOS Imagers 513 Chapter 18 Special Purpose CMOS Circuits 533 18.1 The Schmitt Trigger 533 18.1.1 Design of the Schmitt Trigger 534 18.1.2 Applications of the Schmitt Trigger 536 18.2 Multivibrator Circuits 538 18.2.1 The Monostable Multivibrator 539 18.2.2 The Astable Multivibrator 540 18.3 Input Buffers 541 18.3.1 Basic Circuits 541 18.3.2 Differential Circuits 543 18.3.3 DC Reference 547 18.3.4 Reducing Buffer Input Resistance 550 18.4 Charge Pumps (Voltage Generators) 551 18.4.1 Increasing the Output Voltage 553 18.4.2 Generating Higher Voltages: The Dickson Charge Pump 553 18.4.3 Example 556 Chapter 19 Digital Phase-Locked Loops 561 19.1 The Phase Detector 563 19.1.1 The XOR Phase Detector 563 19.1.2 The Phase Frequency Detector 567 19.2 The Voltage-Controlled Oscillator 570 19.2.1 The Current-Starved VCO 570 19.2.2 Source-Coupled VCOs 574 19.3 The Loop Filter 576 19.3.1 XOR DPLL 577 19.3.2 PFD DPLL 583 19.4 System Concerns 590 19.4.1 Clock Recovery from NRZ Data 593 19.5 Delay-Locked Loops 600 19.6 Some Examples 603 19.6.1 A 2 GHz DLL 603 19.6.2 A 1 Gbit/s Clock-Recovery Circuit 609 Chapter 20 Current Mirrors 621 20.1 The Basic Current Mirror 621 20.1.1 Long-Channel Design 622 20.1.2 Matching Currents in the Mirror 624 20.1.3 Biasing the Current Mirror 628 20.1.4 Short-Channel Design 634 20.1.5 Temperature Behavior 638 20.1.6 Biasing in the Subthreshold Region 642 20.2 Cascoding the Current Mirror 643 20.2.1 The Simple Cascode 643 20.2.2 Low-Voltage (Wide-Swing) Cascode 645 20.2.3 Wide-Swing, Short-Channel Design 648 20.2.4 Regulated Drain Current Mirror 651 20.3 Biasing Circuits 653 20.3.1 Long-Channel Biasing Circuits 653 20.3.2 Short-Channel Biasing Circuits 656 20.3.3 A Final Comment 657 Chapter 21 Amplifiers 671 21.1 Gate-Drain Connected Loads 671 21.1.1 Common-Source (CS) Amplifiers 671 21.1.2 The Source Follower (Common-Drain Amplifier) 683 21.1.3 Common Gate Amplifier 684 21.2 Current Source Loads 685 21.2.1 Common-Source Amplifier 685 21.2.2 The Cascode Amplifier 698 21.2.3 The Common-Gate Amplifier 702 21.2.4 The Source Follower (Common-Drain Amplifier) 702 21.3 The Push-Pull Amplifier 710 21.3.1 DC Operation and Biasing 711 21.3.2 Small-Signal Analysis 714 21.3.3 Distortion 716 Chapter 22 Differential Amplifiers 735 22.1 The Source-Coupled Pair 735 22.1.1 DC Operation 735 22.1.2 AC Operation 741 22.1.3 Common-Mode Rejection Ratio 745 22.1.4 Matching Considerations 746 22.1.5 Noise Performance 749 22.1.6 Slew-Rate Limitations 750 22.2 The Source Cross-Coupled Pair 750 22.2.1 Current Source Load 754 22.3 Cascode Loads (The Telescopic Diff-Amp) 756 22.4 Wide-Swing Differential Amplifiers 758 22.4.1 Current Differential Amplifier 760 22.4.2 Constant Transconductance Diff-Amp 760 Chapter 23 Voltage References 773 23.1 MOSFET-Resistor Voltage References 774 23.1.1 The Resistor-MOSFET Divider 774 23.1.2 The MOSFET-Only Voltage Divider 777 23.1.3 Self-Biased Voltage References 778 23.2 Parasitic Diode-Based References 784 23.2.1 Long-Channel BGR Design 787 23.2.2 Short-Channel BGR Design 795 Chapter 24 Operational Amplifiers I 803 24.1 The Two-Stage Op-Amp 804 24.2 An Op-Amp with Output Buffer 822 24.3 The Operational Transconductance Amplifier (OTA) 824 24.4 Gain-Enhancement 835 24.5 Some Examples and Discussions 839 Chapter 25 Dynamic Analog Circuits 857 25.1 The MOSFET Switch 857 25.1.1 Sample-and-Hold Circuits 861 25.2 Fully-Differential Circuits 864 25.2.1 A Fully-Differential Sample-and-Hold 866 25.3 Switched-Capacitor Circuits 869 25.3.1 Switched-Capacitor Integrator 871 25.4 Circuits 879 Chapter 26 Operational Amplifiers II 889 26.1 Biasing for Power and Speed 889 26.1.1 Device Characteristics 890 26.1.2 Biasing Circuit 891 26.2 Basic Concepts 892 26.3 Basic Op-Amp Design 900 26.4 Op-Amp Design Using Switched-Capacitor CMFB 920 Chapter 27 Nonlinear Analog Circuits 933 27.1 Basic CMOS Comparator Design 933 27.1.1 Characterizing the Comparator 939 27.1.2 Clocked Comparators 942 27.1.3 Input Buffers Revisited 943 27.2 Adaptive Biasing 943 27.3 Analog Multipliers 946 27.3.1 The Multiplying Quad 947 Chapter 28 Data Converter Fundamentals by Harry Li 955 28.1 Analog Versus Discrete Time Signals 955 28.2 Converting Analog Signals to Digital Signals 956 28.3 Sample-and-Hold (S/H) Characteristics 959 28.4 Digital-to-Analog Converter (DAC) Specifications 961 28.5 Analog-to-Digital Converter (ADC) Specifications 970 28.6 Mixed-Signal Layout Issues 979 Chapter 29 Data Converter Architectures by Harry Li 987 29.1 DAC Architectures 987 29.1.1 Digital Input Code 987 29.1.2 Resistor String 987 29.1.3 R-2R Ladder Networks 992 29.1.4 Current Steering 995 29.1.5 Charge-Scaling DACs 999 29.1.6 Cyclic DAC 1003 29.1.7 Pipeline DAC 1005 29.2 ADC Architectures 1006 29.2.1 Flash 1006 29.2.2 The Two-Step Flash ADC 1010 29.2.3 The Pipeline ADC 1014 29.2.4 Integrating ADCs 1018 29.2.5 The Successive Approximation ADC 1022 29.2.6 The Oversampling ADC 1027 Chapter 30 Implementing Data Converters 1043 30.1 R-2R Topologies for DACs 1043 30.1.1 The Current-Mode R-2R DAC 1044 30.1.2 The Voltage-Mode R-2R DAC 1045 30.1.3 A Wide-Swing Current-Mode R-2R DAC 1047 30.1.4 Topologies Without an Op-Amp 1057 30.2 Op-Amps in Data Converters 1063 30.2.1 Op-Amp Gain 1066 30.2.2 Op-Amp Unity Gain Frequency 1067 30.2.3 Op-Amp Offset 1067 30.3 Implementing ADCs 1070 30.3.1 Implementing the S/H 1071 30.3.2 The Cyclic ADC 1077 30.3.3 The Pipeline ADC 1084 Chapter 31 Feedback Amplifiers with Harry Li 1115 31.1 The Feedback Equation 1115 31.2 Properties of Negative Feedback on Amplifier Design 1117 31.2.1 Gain Desensitivity 1117 31.3 Recognizing Feedback Topologies 1120 31.3.1 Input Mixing 1121 31.3.2 Output Sampling 1121 31.3.3 The Feedback Network 1122 31.3.4 Calculating Open-Loop Parameters 1125 31.3.5 Calculating Closed-Loop Parameters 1127 31.4 The Voltage Amp (Series-Shunt Feedback) 1128 31.5 The Transimpedance Amp (Shunt-Shunt Feedback) 1134 31.5.1 Simple Feedback Using a Gate-Drain Resistor 1140 31.6 The Transconductance Amp (Series-Series Feedback) 1142 31.7 The Current Amplifier (Shunt-Series Feedback) 1146 31.8 Stability 1148 31.8.1 The Return Ratio 1151 31.9 Design Examples 1154 31.9.1 Voltage Amplifiers 1154 31.9.2 A Transimpedance Amplifier 1158 Chapter 32 Hysteretic Power Converters 1175 32.1 A Review of Power and Energy Basics 1176 32.1.1 Energy Storage in Inductors and Capacitors 1177 32.1.2 Energy Use in Transmitting Data 1180 32.1.3 Selection and use of Switches 1181 32.2 Switching Power Supplies: Some Examples 1189 32.2.1 The Buck SPS 1189 32.2.2 The Boost SPS 1196 32.2.3 The Flyback SPS 1200 32.2.4 Pulse Width Modulation: A Control Loop Example 1204 32.3 Hysteretic Control 1210 32.3.1 Topologies 1211 32.3.2 Examples 1212 Index 1219 About the Author 1235
£109.76
Taylor & Francis Inc Electronics
Book SynopsisElectronics: Basic, Analog, and Digital with PSpice does more than just make unsubstantiated assertions about electronics. Compared to most current textbooks on the subject, it pays significantly more attention to essential basic electronics and the underlying theory of semiconductors.In discussing electrical conduction in semiconductors, the author addresses the important but often ignored fundamental and unifying concept of electrochemical potential of current carriers, which is also an instructive link between semiconductor and ionic systems at a time when electrical engineering students are increasingly being exposed to biological systems. The text presents the background and tools necessary for at least a qualitative understanding of new and projected advances in microelectronics. The author provides helpful PSpice simulations and associated procedures (based on schematic capture, and using OrCAD 16.0 Demo software), which are availaTable of ContentsBasic Diode Circuits. Basic Principles of Semiconductors. pn Junction and Semiconductor Diodes. Semiconductor Fabrication. Field Effect Transistors. Bipolar Junction Transistor. Two-Port Circuits, Amplifiers, and Feedback. Single-Stage Transistor Amplifiers. Multistage and Feedback Amplifiers. Differential and Operational Amplifiers. Power Amplifiers and Switches. Basic Elements of Digital Circuits. Digital Logic Circuit Families.
£39.99
Artech House Publishers Modern Vulnerability Management: Predictive
Book SynopsisThis book comprehensively covers the principles of Risk-based vulnerability management (RBVM) – one of the most challenging tasks in cybersecurity -- from the foundational mathematical models to building your own decision engine to identify, mitigate, and eventually forecast the vulnerabilities that pose the greatest threat to your organization. You will learn: how to structure data pipelines in security and derive and measure value from them; where to procure open-source data to better your organization’s pipeline and how to structure it; how to build a predictive model using vulnerability data; how to measure the return on investment a model in security can yield; which organizational structures and policies work best, and how to use data science to detect when they are not working in security; and ways to manage organizational change around data science implementation. You’ll also be shown real-world examples of how to mature an RBVM program and will understand how to prioritize remediation efforts based on which vulnerabilities pose the greatest risk to your organization. The book presents a fresh approach, rooted in risk management, and taking advantage of rich data and machine learning, helping you focus more on what matters and ultimately make your organization more secure with a system commensurate to the scale of the threat. This is a timely and much-needed book for security managers and practitioners who need to evaluate their organizations and plan future projects and change. Students of cybersecurity will also find this a valuable introduction on how to use their skills in the enterprise workplace to drive change.Table of ContentsChapter 1 - The State of the Vulnerability Landscape1.1 The security canon: Fundamental cybersecurity terminology1.2 Security metrics: The new guard Chapter 2 - Data Science to Define Risk2.1 Risk management history and challenges2.1.1 The birth of operations research2.1.2 The scale of cybersecurity2.1.3 Origins of the risk-based approach to vulnerability management Chapter 3 - Decision Support: Tapping Mathematical Models and Machine Learning3.1 Mathematical modelling3.1.1 Mathematical scale3.1.1 Statistics3.1.2 Game theory3.1.2.1 Stochastic processes3.1.2.2 OODA loops3.1.3 Machine learning for cybersecurity3.1.3.1 Supervised models3.1.3.2 Unsupervised models Chapter 4 - How to Build a Decision Engine to Forecast Risk4.1 The Data4.1.1 Definitions vs. instances4.1.2 Vulnerability data4.1.2.1 Vulnerability assessment4.1.2.2 SAST/DAST4.1.3 Threat intel sources4.1.4 Asset discovery and categorization (CMDB)4.1.5 Data validation4.1.5.1 ETL4.2 Building a logistic regression model4.2.1 Data sources and feature engineering4.2.1.1 Feature engineering4.2.1.2 Interpretation of features4.2.2 Testing model performance4.2.2.1 Calibration plot4.2.2.2 Simplicity vs performance4.2.3 Implementing in production4.2.3.1 Data preparation4.2.3.2 Application of the model4.2.3.3 Converting log odds to probability4.2.4 Communicating the results4.3 Designing a neural network4.3.1 Preparing the data4.3.2 Developing a neural network model4.3.2.1 Neural network architecture4.3.3 Hyper-parameter exploration and evaluation4.3.4 Scoring4.3.4.1 Score scaling4.3.4.2 Volume scaling4.3.4.3 Combining scores4.3.4.4 Comparison to existing scoring model4.3.5 Future work Chapter 5 - Measuring Performance5.1 Risk vs performance5.2 What makes a metric “good”?5.2.1 7 characteristics of good metrics5.2.2 Evaluating metrics using the 7 criteria5.2.3 More considerations for good metrics5.3 Remediation metrics5.3.1 Mean-time-tos5.3.2 Remediation volume and velocity5.3.3 R values and average remediation rates5.4 Why does performance matter?5.5 Measuring what matters5.5.1 Coverage and efficiency5.5.1.1 Optimizing the tradeoff between coverage and efficiency with predictive models5.5.1.2 Coverage and efficiency in the real world5.5.2 Velocity and capacity5.5.2.1 How much does capacity cost?5.5.2.2 The power law of capacity5.5.3 Vulnerability debt5.5.3.1 The move to the cloud5.5.3.2 Paying down security debt5.5.4 Remediation SLAs Chapter 6 - Building a System for Scale6.1 Considerations before you build6.1.1 Asset management assessment6.1.2 Where your organization is going6.1.3 Other tools as constraints6.2 On-premise vs. cloud6.3 Processing considerations6.3.1 Speed of decisions and alerts6.3.2 SOC volume6.4 Database architecture6.4.1 Assets change faster than decisions6.4.2 Real-time risk measurement6.4.2.1 Vulnerability forecasts6.4.2.2 Batch where acceptable6.5 Search capabilities6.5.1 Who is searching?6.5.1.1 Risk hunting vs. threat hunting6.5.1.2 Reporting as a service6.6 Role-based access controls (RBAC) Chapter 7 - Aligning Internal Process and Teams7.1 The shift to a risk-based approach7.1.1 Common goals and key risk measurements7.1.2 Case study: More granular risk scores for better prioritization7.1.2.1 The importance of culture in adopting RBVM7.2 Driving down risk7.2.1 Aligning teams with your goals7.2.2 The importance of executive buy-in7.2.3 Reporting new metrics7.2.4 Gamification7.3 SLA adherence7.3.1 High-risk vs. low-risk vulnerabilities7.3.2 When to implement or revise SLAs7.3.3 What to include in your SLA7.4 Shifting from security-centric to IT self-service7.4.1 How to approach change management7.4.2 Enabling distributed decision-making7.4.3 Signs of self-service maturity7.5 Steady state workflow7.5.1 The limits of remediation capacity7.5.2 Media-boosted vulnerabilities7.5.3 Exception handling7.6 The importance of process and teams Chapter 8 - Real World Examples8.1 A word from the real world by Will LaRiccia8.1.1 Vulnerability discovery8.1.2 Vulnerability assessment and prioritization8.1.3 Vulnerability communication8.1.4 Vulnerability remediation8.1.5 What success looks like Chapter 9 - The Future of Modern VM9.1 Steps toward a predictive response to risk9.1.1 Passive data collection9.2 Forecasting vulnerability exploitation with EPSS9.3 Support from intelligent awareness9.4 The rise of extended detection and response (XDR)9.5 The other side of the coin: Remediation9.6 The wicked problem of security advances
£98.10
Raspberry Pi Press Retro Gaming With Raspberry Pi: 180 pages of
Book SynopsisHot on the heels of Raspberry Pi 5, this update to our best-selling Retro Gaming with Raspberry Pi line opens up a new generation of 1990s and 2000s consoles to rediscover. Building a retro console is one of the most popular starter projects. Retro Gaming with Raspberry Pi 3rd Edition walks new Raspberry Pi owners step-by-step to build their own games console with the latest cases, screens, joysticks, and gaming components. Readers learn how to program their own games, including nineties virtual pets, text adventures, Pong, and Mole-Bop. Build arcade machines. Recreate consoles. Rediscover classic computers. It's packed with projects and inspiration!
£14.00
Springer Nature Switzerland AG Physical Design and Mask Synthesis for Directed Self-Assembly Lithography
a huge range and FREE tracked UK delivery on ALL orders.
£80.99
Springer Nature Switzerland AG Using Artificial Neural Networks for Analog Integrated Circuit Design Automation
Book SynopsisThis book addresses the automatic sizing and layout of analog integrated circuits (ICs) using deep learning (DL) and artificial neural networks (ANN). It explores an innovative approach to automatic circuit sizing where ANNs learn patterns from previously optimized design solutions. In opposition to classical optimization-based sizing strategies, where computational intelligence techniques are used to iterate over the map from devices’ sizes to circuits’ performances provided by design equations or circuit simulations, ANNs are shown to be capable of solving analog IC sizing as a direct map from specifications to the devices’ sizes. Two separate ANN architectures are proposed: a Regression-only model and a Classification and Regression model. The goal of the Regression-only model is to learn design patterns from the studied circuits, using circuit’s performances as input features and devices’ sizes as target outputs. This model can size a circuit given its specifications for a single topology. The Classification and Regression model has the same capabilities of the previous model, but it can also select the most appropriate circuit topology and its respective sizing given the target specification. The proposed methodology was implemented and tested on two analog circuit topologies. Table of ContentsIntroduction.- Related Work.- Overview of Artificial Neural Networks (ANNs).- On the Exploration of Promising Analog IC Designs via ANNs.- ANNs as an Alternative for Automatic Analog IC Placement.- Conclusions.
£52.24
Springer Nature Switzerland AG Bandwidth and Efficiency Enhancement in Radio
Book SynopsisThis book focuses on broadband power amplifier design for wireless communication. Nonlinear model embedding is described as a powerful tool for designing broadband continuous Class-J and continuous class F power amplifiers. The authors also discuss various techniques for extending bandwidth of load modulation based power amplifiers, such as Doherty power amplifier and Chireix outphasing amplifiers. The book also covers recent trends on digital as well as analog techniques to enhance bandwidth and linearity in wireless transmitters. Presents latest trends in designing broadband power amplifiers; Covers latest techniques for using nonlinear model embedding in designing power amplifiers based on waveform engineering; Describes the latest techniques for extending bandwidth of load modulation based power amplifiers such as Doherty power amplifier and Chireix outphasing amplifiers; Includes coverage of hybrid analog/digital predistortion as wideband solution for wireless transmitters; Discusses recent trends on on-chip power amplifier design with GaN /GaAs MMICs for high frequency applications. Table of ContentsIntroduction to RF Power Amplifier Design and Architecture.- Non-linear Device Characterization and Modeling for Power Amplifier Design.- Power Amplifier Design using nonlinear Model Embedding.- Broadband Techniques in Power Amplifiers.- Digital Techniques for Broadband and Linearized Transmitters.- Advance Material for Power Amplifiers Design and Packaging.
£85.49
Springer Nature Switzerland AG A Synergistic Framework for Hardware IP Privacy and Integrity Protection
a huge range and FREE tracked UK delivery on ALL orders.
£79.20
Springer Nature Switzerland AG Plasma and Spot Phenomena in Electrical Arcs
a huge range and FREE tracked UK delivery on ALL orders.
£134.99
Springer Nature Switzerland AG Soft Error Reliability Using Virtual Platforms: Early Evaluation of Multicore Systems
a huge range and FREE tracked UK delivery on ALL orders.
£80.99
Springer Nature Switzerland AG Embedded System Design: Embedded Systems
Book SynopsisA unique feature of this open access textbook is to provide a comprehensive introduction to the fundamental knowledge in embedded systems, with applications in cyber-physical systems and the Internet of things. It starts with an introduction to the field and a survey of specification models and languages for embedded and cyber-physical systems. It provides a brief overview of hardware devices used for such systems and presents the essentials of system software for embedded systems, including real-time operating systems. The author also discusses evaluation and validation techniques for embedded systems and provides an overview of techniques for mapping applications to execution platforms, including multi-core platforms. Embedded systems have to operate under tight constraints and, hence, the book also contains a selected set of optimization techniques, including software optimization techniques. The book closes with a brief survey on testing. This fourth edition has been updated and revised to reflect new trends and technologies, such as the importance of cyber-physical systems (CPS) and the Internet of things (IoT), the evolution of single-core processors to multi-core processors, and the increased importance of energy efficiency and thermal issues.Table of ContentsChapter 1. Introduction.- Chapter 2. Specifications and Modeling.- Chapter 3. Embedded System Hardware.- Chapter 4. System Software.- Chapter 5. Evaluation and Validation.- Chapter 6. Application Mapping.- Chapter 7. Optimization.- Chapter 8. Test.
£40.49
Springer Nature Switzerland AG Essential Circuit Analysis using NI Multisim™ and
Book SynopsisThis textbook provides a compact but comprehensive treatment that guides students through the analysis of circuits, using NI Multisim™ and MATLAB®. Ideal as a hands-on source for courses in Circuits, Electronics, Digital Logic and Power Electronics this text focuses on solving problems using market-standard software, corresponding to all key concepts covered in the classroom. The author uses his extensive classroom experience to guide students toward deeper understanding of key concepts, while they gain facility with software they will need to master for later studies and practical use in their engineering careers.Table of ContentsEssentials of MATLAB®: basic operations on real numbers; operations on complex numbers; differentiation/integration; roots of equations; solution of ordinary differential equations; Fast Fourier Transform (FFT), drawing different types of graphs; control statements; optimization.- Essentials of Simulink®: modelling of dynamical systems; circuit analysis.- Essentials of Multisim™: basic resistive circuits; first and second order circuits; diode circuits (clamp circuit, rectifier, etc); amplifiers (common base/emitter/collector, differential); calculation of gain, frequency response, etc.); op-amp circuits (Filters, amplifiers, oscillators); transmission lines and digital circuits.
£42.74
Springer Nature Switzerland AG Advanced X-Ray Radiation Detection:: Medical
Book SynopsisThis book offers readers an overview of some of the most recent advances in the field of technology for X-ray medical imaging. Coverage includes both technology and applications in SPECT, PET and CT, with an in-depth review of the research topics from leading specialists in the field. Coverage includes conversion of the X-ray signal into analogue/digital value, as well as a review of CMOS chips for X-ray image sensors. Emphasis is on high-Z materials like CdTe, CZT and GaAs, since they offer the best implementation possibilities for direct conversion X-ray detectors. The discussion includes material challenges, detector operation physics and technology and readout integrated circuits required to detect signals processes by high-Z sensors. Authors contrast these emerging technologies with more established ones based on scintillator materials. This book is an excellent reference for people already working in the field as well as for people wishing to enter it.Table of ContentsX-ray Detectors in Medical Imaging.- Modelling spectroscopic performance of pixelated semiconductor detectors through Monte-Carlo simulation.- Status of DEXA Instrumentation Using Direct and Indirect Detectors.- CZT Detectors for Nuclear Medicine.- Positron Emission Tomography (PET) Imaging Based on Sub-Millimeter Pixelated CdZnTe Detectors.- Medical Photon-Counting CT – Status and Clinical Applications Review.- Multi-material decomposition (m-MD) based spectral imaging in photon-counting CT.- X-ray Multispectral CT Imaging by Projection Sequences Blind Separation based on Basis-effect or Basis-material decomposition.- Direct Iterative Basis Image Reconstruction Based on MAP-EM Algorithm for Spectral CT.- Linearly Polarized X-ray Fluorescence Computed Tomography with a Photon Counting Detector.- Detector shift iteration method for improving spatial resolution and suppressing pixel value distortion in direct and indirect X-ray detectors.- A new method of estimating incident x-ray spectra with photon counting detectors using a limited number of energy bins with dedicated clinical x-ray imaging systems.
£56.24
Springer Nature Switzerland AG Computer Systems: Digital Design, Fundamentals of
Book SynopsisThis updated textbook covers digital design, fundamentals of computer architecture, and ARM assembly language. The book starts by introducing computer abstraction, basic number systems, character coding, basic knowledge in digital design, and components of a computer. The book goes on to discuss information representation in computing, Boolean algebra and logic gates, and sequential logic. The book also presents introduction to computer architecture, Cache mapping methods, and virtual memory. The author also covers ARM architecture, ARM instructions, ARM assembly language using Keil development tools, and bitwise control structure using C and ARM assembly language. The book includes a set of laboratory experiments related to digital design using Logisim software and ARM assembly language programming using Keil development tools. In addition, each chapter features objectives, summaries, key terms, review questions, and problems.Table of ContentsChapter1: Signal and number systems.- Chapter2: Boolean Logics and Logic Gates.- Chapter3: Minterms, Maxterms, Karnaugh Map (K-Map), and Universal Gates.- Chapter4: Combinational Logic.- Chapter5: Synchronous Sequential Logic.- Chapter6: Introduction to Computer Architecture.- Chapter7: Memory.- Chapter8: Assembly Language and ARM Instructions Part I.- Chapter9: ARM Assembly Language Programming Using Keil Development Tools.- Chapter10: ARM Instructions Part II and Instraction Formats.- Chapter11: Bitwise and Control Structures Used for Programming with C and ARM Assembly Language.
£44.99
Springer Nature Switzerland AG Mapping Innovation: The Discipline of Building
Book SynopsisThis book is an eye-opener for businesses unveiling how technology trends can be deployed to redesign products, services and processes. The authors provide business opportunities based on technological innovation across 10 industrial sectors in easy to read case studies. Each case study is a story that narrates the potential and influence of a technological innovation on an enterprise, by defining the challenges faced, the type of technology adopted, and the impact. Provides readers with compelling reasons for implementing technology trends in industrial value chains; Written in a simple, easy to read and exciting manner to be accessible to readers with different backgrounds and interests; Uses a single, structured paradigm in all the case studies. Table of Contents1-Agriculture 2-Automotive 3-Banking And Financial Services 4-Construction 5-Education 6-Food And Beverage 7-Healthcare 8-Media And Entertainment 9-Oil And Gas 10-Printing And Packaging 11-Real-Estate 12-Retail 13-Telecommunications 14-Textiles 15-Tourism
£40.49
Springer Nature Switzerland AG Feedback Control Systems Analysis and Design:
Book SynopsisThis study guide is designed for students taking courses in feedback control systems analysis and design. The textbook includes examples, questions, and exercises that will help electrical engineering students to review and sharpen their knowledge of the subject and enhance their performance in the classroom. Offering detailed solutions, multiple methods for solving problems, and clear explanations of concepts, this hands-on guide will improve student’s problem-solving skills and basic and advanced understanding of the topics covered in these courses.Trade Review“The book is very nicely written and may be suggested for lecturers to help them in lecturing, students for better understanding of the topic and also researchers, as the book is a concise collection of control methods to be used. I strongly support using this book extensively.” (Krzysztof Gałkowski, zbMATH 1490.93001, 2022)Table of Contents1: Problems: Different representations of linear time-invariant (LTI) systems2: Solutions of Problems: Different representations of linear time-invariant (LTI) systems3: Problems: Stability analysis of linear time-invariant (LTI) systems4: Solutions of Problems: Stability analysis of linear time-invariant (LTI) systems5: Problems: Analysis of transient response6: Solutions of Problems: Analysis of transient response7: Problems: Analysis of steady state response8: Solutions of Problems: Analysis of steady state response9: Problems: Graphical analysis and design in time domain10: Solutions of Problems: Graphical analysis and design in time domain11: Problems: Controller design in time domain12: Solutions of Problems: Controller design in time domain
£47.49
Springer Nature Switzerland AG Comparators
Book SynopsisThis book explores circuit designs that accomplish the conversion of an analog signal to a digital signal of a single bit. Starting with the simple comparator, many alternative circuit arrangements and enhancements are elaborated, including hysteresis, negative feedback and a variety of adaptive thresholds. Further, the non-ideal behavior of practical elements and circuits are covered, including input offsets, noise, delay, delay dispersion and oscillation, along with techniques for dealing with these aspects. The wide variety of available components is discussed in terms of performance and applicability. No stone is left unturned in addressing each and every issue that can affect the engineering tasks related to comparators, from the viewpoint of how their performance can affect the system in which they are a critical component.Table of Contents1) Basic Concepts2) Major Applications3) Enhancements4) Non-Ideal Parameters5) Application Details6) Logic Elements7) Comparator Design and Effects
£49.49
Springer Nature Switzerland AG SoC Physical Design: A Comprehensive Guide
Book SynopsisSoC Physical Design is a comprehensive practical guide for VLSI designers that thoroughly examines and explains the practical physical design flow of system on chip (SoC). The book covers the rationale behind making design decisions on power, performance, and area (PPA) goals for SoC and explains the required design environment algorithms, design flows, constraints, handoff procedures, and design infrastructure requirements in achieving them. The book reveals challenges likely to be faced at each design process and ways to address them in practical design environments. Advanced topics on 3D ICs, EDA trends, and SOC trends are discussed in later chapters. Coverage also includes advanced physical design techniques followed for deep submicron SOC designs. The book provides aspiring VLSI designers, practicing design engineers, and electrical engineering students with a solid background on the complex physical design requirements of SoCs which are required to contribute effectively in design roles.Table of ContentsIntroduction.- SoC Physical Design Flow and Algorithms.- Physical Design Floor Plan and Placement.- Clock, Reset, and HFN.- Physical Design Routing.- Physical Design Verification.
£66.49
Springer Nature Switzerland AG Flexible Bioelectronics with Power Autonomous
Book SynopsisThis book provides readers with an introduction to the materials and devices necessary for flexible sensors and electronics, followed by common techniques for fabrication of such devices and system-level integration. Key insights into fabrication and processing will guide readers through the tradeoff choices in designing such platforms. A comprehensive review of two specific, flexible bioelectronic platforms, related to smart bandages for wound monitoring and thread-based diagnostics for wearable health, will demonstrate practical application at the system level. The book also provides a unique electrical engineering perspective by reviewing circuit architectures for low noise signal conditioning of weak signals from sensors,, and for low power analog to digital converters for signal acquisition. To achieve energy autonomy, authors provide several example of CMOS energy harvesting front end circuits and voltage boosters. Beyond circuit architectures, the book also provides a review of the modern theory of sampling and recovery of sparse signals, also known as compressed sensing. They then highlight how these principles can be leveraged for design and implementation of efficient signal acquisition hardware and reliable processing of acquired data for flexible electronic platforms.Table of ContentsChapter 1. Materials and Processing for Flexible Bioelectronics.- Chapter 2. Sensors and Platforms for Flexible Bioelectronics.- Chapter 3. Low-noise CMOS Signal Conditioning Circuits.- Chapter 4. Data Converters for Wearable Sensor Applications.- Chapter 5. Power Management Circuits for Energy Harvesting.- Chapter 6. Sampling and recovery of signals with spectral sparsity.- Chapter 7. Compressed Sensing.
£54.99
Springer International Publishing AG On-Chip Networks, Second Edition
Book SynopsisThis book targets engineers and researchers familiar with basic computer architecture concepts who are interested in learning about on-chip networks. This work is designed to be a short synthesis of the most critical concepts in on-chip network design. It is a resource for both understanding on-chip network basics and for providing an overview of state of-the-art research in on-chip networks. We believe that an overview that teaches both fundamental concepts and highlights state-of-the-art designs will be of great value to both graduate students and industry engineers. While not an exhaustive text, we hope to illuminate fundamental concepts for the reader as well as identify trends and gaps in on-chip network research. With the rapid advances in this field, we felt it was timely to update and review the state of the art in this second edition. We introduce two new chapters at the end of the book. We have updated the latest research of the past years throughout the book and also expanded our coverage of fundamental concepts to include several research ideas that have now made their way into products and, in our opinion, should be textbook concepts that all on-chip network practitioners should know. For example, these fundamental concepts include message passing, multicast routing, and bubble flow control schemes.Table of ContentsPreface.- Acknowledgments.- Introduction.- Interface with System Architecture.- Topology.- Routing.- Flow Control.- Router Microarchitecture.- Modeling and Evaluation.- Case Studies.- Conclusions.- References.- Authors' Biographies.
£37.85
Springer International Publishing AG Electronics for Embedded Systems
Book SynopsisThis book provides semester-length coverage of electronics for embedded systems, covering most common analog and digital circuit-related issues encountered while designing embedded system hardware. It is written for students and young professionals who have basic circuit theory background and want to learn more about passive circuits, diode and bipolar transistor circuits, the state-of-the-art CMOS logic family and its interface with older logic families such as TTL, sensors and sensor physics, operational amplifier circuits to condition sensor signals, data converters and various circuits used in electro-mechanical device control in embedded systems. The book also provides numerous hardware design examples by integrating the topics learned in earlier chapters. The last chapter extensively reviews the combinational and sequential logic design principles to be able to design the digital part of embedded system hardware.Table of ContentsFundamentals of Passive Circuit Analysis.- Diode and Bipolar Transistor Circuits.- MOS Transistors and CMOS Circuits.- TTL Logic and CMOS-TTL Interface.- Physics of Sensors.- Operational Amplifiers and Circuits.- Data Converters.- Front-End Electronics for Embedded Systems.- Review of Combinational and Sequential Logic Circuits and Design.
£62.99
Springer International Publishing AG Neuro-inspired Computing Using Resistive Synaptic Devices
a huge range and FREE tracked UK delivery on ALL orders.
£107.99
Springer International Publishing AG Inkjet-Configurable Gate Array: Towards Application Specific Printed Electronic Circuits
a huge range and FREE tracked UK delivery on ALL orders.
£80.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Photonic Packaging Sourcebook: Fiber-Chip
Book SynopsisThis book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.Table of ContentsIntroduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.
£123.49
Springer Selected Sensor Circuits: From Data Sheet to Simulation
Book SynopsisThis book shows the steps from data sheets of sensors to the extraction of model parameters for the program PSPICE in order to realize circuit analyses. Physical ENTITIES as temperature, humidity, light, pressure and sound are included by equations. The simulation concerns temperature displays, characteristics of humidity-sensors, light-to-voltage Converters, strain gauges, reed relays and Piezol-electric-sounders US-Converters and SAW ComponentsTable of ContentsNTC- and PTC-Sensors.- Band Gap Reference.- Humidity-Sensors.- RGB-Colour-Sensors.- light barreer.- force sensing resistor.- Hall-Sensor.- Piezoelectric sounder.- self-drive and external drive.- US-transmitter and -receiver.- SAW-Delay-Line
£29.99
Springer Fachmedien Wiesbaden Sensor networks in theory and practice:
Book SynopsisThe book provides an important foundation for understanding the Internet of Things by offering insight into common networking protocols from the microcontroller world and introducing important sensors and other devices, as well as their use and programming. All concepts shown are illustrated with practical circuit and programming examples from the authors' many years of experience. In addition, open libraries for controlling the devices presented in the book are available for readers to download from the publisher's home page. The second edition includes some new devices, especially in the area of networks, a more detailed description of the operating principles of some sensors as well as further tips and tricks for programming.Table of Contents
£52.24
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Advances in Solar Photovoltaic Power Plants
a huge range and FREE tracked UK delivery on ALL orders.
£125.99
Springer Low-Power Crystal and MEMS Oscillators: The Experience of Watch Developments
a huge range and FREE tracked UK delivery on ALL orders.
£151.99
Springer Verlag, Singapore Advances in Communication and Computational Technology: Select Proceedings of ICACCT 2019
Book SynopsisThis book presents high-quality peer-reviewed papers from the International Conference on Advanced Communication and Computational Technology (ICACCT) 2019 held at the National Institute of Technology, Kurukshetra, India. The contents are broadly divided into four parts: (i) Advanced Computing, (ii) Communication and Networking, (iii) VLSI and Embedded Systems, and (iv) Optimization Techniques.The major focus is on emerging computing technologies and their applications in the domain of communication and networking. The book will prove useful for engineers and researchers working on physical, data link and transport layers of communication protocols. Also, this will be useful for industry professionals interested in manufacturing of communication devices, modems, routers etc. with enhanced computational and data handling capacities.Table of ContentsPart 1: Advanced Computing.- Distributed Computing.- Cloud Computing.- Cluster and Grid Computing.- Green Computing.- Image and Video Processing-. Big Data Computing.- Machine Learning.- Parallel Computing.- Soft Computing.- Quantum Computing.- Mobile Computing.- Quantum Computing.- Mobile Computing.- Biomedical Computing, Bioinformatics.- Swarm Intelligence & Swarm Robotics.- Evolutionary Computing.- Cellular Automata.- Cellular Computing.- Membrane Computing.- Part 2: Communication & Networking.- Signal Processing.- Image Processing.- Computer Network.- Wireless Network.- Ad-hoc Network.- Internet of Things (IOT).- Network Security.- Cryptography.- Physical Layer Security.- Cognitive Radios.- Software Defined Radio.- Optical Communication.- Antenna.- Satellite and Space Communications.- Next Generation Computing and Communication.- Network Analytics.- Vehicular, Underground and Underwater Networks.- RFID and Sensor Network.- Mobile & Ubiquitous Communication Networks.- Mobile Cloud.- Internet Technologies.- Information-Centric Networking.- Remote Sensing and GIS.- Network Protocols.- Modelling & Simulation of Communication Networks and Systems.- Software-Defined Networking.- Fault Tolerance, Reliability, and Survivability.- Flow and Congestion Control.- Network Architectures.- Part 3: VLSI & Embedded Systems.- Computer Architecture.- VLSI Circuit Design and CAD Tools.- Material Science and Nano Technology.- Nano Electronics and VLSI Technology.- Embedded Systems.- Mathematical Modeling and Scientific Computing.- Hybrid Intelligent Models and Applications.- Medical Informatics.- Part 4: Optimization Technique.- Control Systems and Applications.- Renewable Energy.- Power Electronics.- Cloud and Systems Management.- Big Data Communication and Analytics.- Algorithm Heuristic.- Graph, Geometric Algorithms and Applications.- Computer Graphics, Simulation, and Modelling.- Pattern Recognition and Analysis.- Intelligent Image Analysis.- Neuroimaging Techniques.- Robotics and Machine Vision.- Systems and Software Engineering.- Real-time Systems.- Intelligent Control.- Intelligent E-Learning Systems.- Fuzzy Logic.- Artificial Neural Network.- Evolutionary Computation.- Learning Theory.- Probabilistic Methods.- Multimedia.- Text mining.- Social media systems.- Adaptive hypermedia.- Crowd sourcing.- Personalization.- Security, privacy and social impact.- Applications of Computational Intelligence techniques in Science, Engineering, medicine, finance and education etc.- Mechatronics and Robotics.
£161.99
Springer Verlag, Singapore Electromagnetic Compatibility: Principles and
Book SynopsisThis book highlights principles and applications of electromagnetic compatibility (EMC). After introducing the basic concepts, research progress, standardizations and limitations of EMC, the book puts emphasis on presenting the generation mechanisms and suppression principles of conducted electromagnetic interference (EMI) noise, radiated EMI noise, and electromagnetic susceptibility (EMS) problems such as electrostatic discharge (ESD), electric fast transient (EFT) and surge. By showing EMC case studies and solved examples, the book provides effective solutions to practical engineering problems. Students and researchers will be able to use the book as practical reference for EMC-related measurements and problem- solution.Table of ContentsChapter 1 Summary of Electromagnetic Compatibility Chapter 2 Conducted EMI Noise Generated Mechanism, Measurement and Diagnosis Chapter 3 Conducted Electromagnetic Interference Suppression Methods and Case Studies Chapter 4 Radiated EMI Noise Generated Mechanism, Measurement and Diagnosis Chapter 5 Radiated Electromagnetic Interference Suppression Methods and Case Study Chapter 6 Principle and Analysis of Electromagnetic Susceptibility Chapter 7 Case Study of Electromagnetic Susceptibility
£49.49
Springer Verlag, Singapore Deep Learning for Computational Problems in
Book SynopsisThe book discusses a broad overview of traditional machine learning methods and state-of-the-art deep learning practices for hardware security applications, in particular the techniques of launching potent "modeling attacks" on Physically Unclonable Function (PUF) circuits, which are promising hardware security primitives. The volume is self-contained and includes a comprehensive background on PUF circuits, and the necessary mathematical foundation of traditional and advanced machine learning techniques such as support vector machines, logistic regression, neural networks, and deep learning. This book can be used as a self-learning resource for researchers and practitioners of hardware security, and will also be suitable for graduate-level courses on hardware security and application of machine learning in hardware security. A stand-out feature of the book is the availability of reference software code and datasets to replicate the experiments described in the book.Table of ContentsChapter 1: Introduction.- Chapter 2: Fundamental Concepts of Machine Learning.- Chapter 3: Supervised Machine Learning Algorithms for PUF Modeling Attacks.- Chapter 4: Deep Learning based PUF Modeling Attacks.- Chapter 5: Tensor Regression based PUF Modeling Attack.- Chapter 6: Binarized Neural Network based PUF Modeling.- Chapter 7: Conclusions and Future Work.
£72.50
O'Reilly Media Applied Embedded Electronics
Book SynopsisThis book guides you through all of the techniques listed, which are required for a reliable integrated system. Through extensive illustrations and minimal equations, anyone with an interest in electronics will quickly grasp the ideas discussed.
£33.74
Pearson Education Limited Electric Circuits Global Edition
Book SynopsisTable of Contents 1. Circuit Variables 2. Circuit Elements 3. Simple Resistive Circuits 4. Techniques of Circuit Analysis 5. The Operational Amplifier 6. Inductance, Capacitance, and Mutual Inductance 7. Response of First-Order RL and RC Circuits 8. Natural and Step Responses of RLC Circuits 9. Sinusoidal Steady-State Analysis 10. Sinusoidal Steady-State Power Calculations 11. Balanced Three-Phase Circuits 12. Introduction to the Laplace Transform 13. The Laplace Transform in Circuit Analysis 14. Introduction to Frequency Selective Circuits 15. Active Filter Circuits 16. Fourier Series 17. The Fourier Transform 18. Two-Port Circuits Appendix A: The Solution of Linear Simultaneous Equations Appendix B: Complex Numbers Appendix C: More on Magnetically Coupled Coils and Ideal Transformers Appendix D: The Decibel Appendix E: Bode Diagrams Appendix F: An Abbreviated Table of Trigonometric Identities Appendix G: An Abbreviated Table of Integrals Appendix H: Common Standard Component Values
£80.74
John Wiley & Sons Inc FPGA Prototyping by VHDL Examples
Book SynopsisA hands-on introduction to FPGA prototyping and SoC design This Second Edition of the popular book follows the same learning-by-doing approach to teach the fundamentals and practices of VHDL synthesis and FPGA prototyping. It uses a coherent series of examples to demonstrate the process to develop sophisticated digital circuits and IP (intellectual property) cores, integrate them into an SoC (system on a chip) framework, realize the system on an FPGA prototyping board, and verify the hardware and software operation. The examples start with simple gate-level circuits, progress gradually through the RT (register transfer) level modules, and lead to a functional embedded system with custom I/O peripherals and hardware accelerators. Although it is an introductory text, the examples are developed in a rigorous manner, and the derivations follow strict design guidelines and coding practices used for large, complex digital systems. The new edition is completely Table of ContentsPreface ix Acknowledgments xv PART I BASIC DIGITAL CIRCUITS DEVELOPMENT 1 Gate-level Combinational Circuit 1 1.1 Overview of VHDL 1 1.2 General description 2 1.3 Structural description 6 1.4 Top-level signal mapping 8 1.5 Testbench 9 1.6 Bibliographic notes 11 1.7 Suggested experiments 11 2 Overview of FPGA and EDA software 13 2.1 FPGA 13 2.2 Overview of the Digilent Nexys 4 DDR board 15 2.3 Development flow 16 2.4 Xilinx Vivado Design Suite 18 2.5 Bibliographic notes 18 2.6 Suggested experiments 18 3 RT-level combinational circuit 23 3.1 RT-level components 23 3.2 Routing circuit with concurrent assignment statements 29 3.3 Modeling with a process 34 3.4 Routing circuit with if and case statements 36 3.5 Constants and generics 41 3.6 Replicated structure 44 3.7 Design examples 46 3.8 Bibliographic notes 58 3.9 Suggested experiments 58 4 Regular Sequential Circuit 61 4.1 Introduction 61 4.2 HDL code of the FF and register 64 4.3 Simple design examples 67 4.4 Testbench for sequential circuits 72 4.5 Case study 75 4.6 Timing and clocking 87 4.7 Bibliographic notes 90 4.8 Suggested experiments 90 5 FSM 93 5.1 Introduction 93 5.2 FSM code development 97 5.3 Design examples 100 5.4 Bibliographic notes 110 5.5 Suggested experiments 110 6 FSMD 113 6.1 Introduction 113 6.2 Code development of an FSMD 119 6.3 Design examples 125 6.4 Bibliographic notes 140 6.5 Suggested experiments 141 7 RAM and Buffer of FPGA 145 7.1 Embedded memory of FPGA device 145 7.2 General description for RAM-like component 147 7.3 FIFO buffer 153 7.4 HDL templates for memory inference 158 7.5 Overview of memory controller 164 7.6 Bibliographic notes 166 7.7 Suggested experiments 166 PART II EMBEDDED SOC I: VANILLA FPRO SYSTEM 8 Overview of Embedded SoC Systems 171 8.1 Embedded SoC 171 8.2 Development Flow of Embedded SoC 173 8.3 FPro SoC Platform 176 8.4 Adaption on Digilent Nexys 4 DDR board 180 8.5 Portability 182 8.6 Organization 184 8.7 Bibliographic notes 184 9 Bare Metal System Software Development 187 9.1 Bare metal system development overview 187 9.2 Memory-mapped I/O 189 9.3 Direct I/O Register Access 191 9.4 Robust I/O Register Access 193 9.5 Techniques for low-level I/O operations 197 9.6 Device Drivers 199 9.7 FPro Utility Routines and Directory Structure 204 9.8 Test program 208 9.9 Bibliographic notes 211 9.10 Suggested experiments 211 10 FPro Bus Protocol and MMIO Slot Specification 213 10.1 FPro Bus 213 10.2 Interface with bus 216 10.3 MMIO I/O core 222 10.4 Timer core development 226 10.5 MMIO controller 229 10.6 MCS I/O bus and bridge 234 10.7 Vanilla FPRO System Construction 238 10.8 Bibliographic notes 240 10.9 Suggested experiments 240 11 UART Core 243 11.1 Introduction 243 11.2 UART Construction 245 11.3 UART core development 253 11.4 UART driver 256 11.5 Additional Project Ideas 262 11.6 Bibliographic notes 265 11.7 Suggested experiments 266 PART III EMBEDDED SOC II: BASIC I/O CORES 12 Xilinx XADC Core 271 12.1 Overview of XADC 271 12.2 XADC core development 273 12.3 XADC core device driver 278 12.4 Sampler FPro System 281 12.5 Additional Project Ideas 291 12.6 Bibliographic notes 292 12.7 Suggested experiments 292 13 Pulse Width Modulation Core 295 13.1 Introduction 295 13.2 PWM Design 296 13.3 PWM core development 299 13.4 PWM driver 302 13.5 Testing 303 13.6 Project ideas 304 13.7 Suggested experiments 305 14 Debouncing core and LED-Mux Core 307 14.1 Debouncing Core 307 14.2 LED-Mux Core 313 14.3 Project Ideas 319 14.4 Suggested Experiments 320 15 SPI Core 323 15.1 Overview 323 15.3 SPI Core Development 333 15.4 SPI Driver 336 15.5 Test 338 15.6 Project Ideas 341 15.7 Bibliographic notes 342 15.8 Suggested Experiments 342 16 I2C Core 347 16.1 Overview 347 16.2 I2C Controller 350 16.3 I2C Core Development 360 16.4 I2C Driver 361 16.5 Test 365 16.6 Project Idea 366 16.7 Bibliographic notes 367 16.8 Suggested experiments 367 17 PS2 Core 371 17.1 Introduction 371 17.2 PS2 Controller 373 17.3 PS2 core development 383 17.4 PS2 driver 384 17.5 Test 393 17.6 Bibliographic notes 394 17.7 Suggested experiments 394 18 Sound I: DDFS Core 397 18.1 Introduction 397 18.2 Design and implementation 397 18.3 Fixed-point arithmetic 400 18.4 DDFS Construction 402 18.5 DAC (digital-to-analog converter) 404 18.6 DDFS core development 407 18.7 DDFS driver 409 18.8 Testing 412 18.9 Bibliographic notes 413 18.10 Suggested experiments 413 19 Sound II: ADSR Core 415 19.1 Introduction 415 19.2 ADSR envelope generator 416 19.3 ADSR core development 421 19.4 ADRS driver 423 19.5 Testing 429 19.6 Project Idea 430 19.7 Bibliographic notes 431 19.8 Suggested experiments 431 PART IV EMBEDDED SOC III: VIDEO CORES 20 Introduction to Video System 435 20.1 Introduction to a video display 435 20.2 Stream interface 437 20.3 VGA Synchronization 439 20.4 Bar test-pattern generator 448 20.5 Color-to-grayscale conversion circuit 449 20.6 Demo video system 451 20.7 Advanced video standards 452 20.8 Bibliographic notes 453 20.9 Suggested experiments 454 21 FPro Video Subsystem 457 21.1 Organization of video subsystem 457 21.2 FPro video IP core 461 21.3 Example video cores 466 21.4 FPro video synchronization core 470 21.5 Daisy video subsystem 479 21.6 Vanilla daisy FPro system 486 21.7 Video driver and testing program 490 21.8 Bibliographic notes 493 21.9 Suggested experiments 493 22 Sprite Core 497 22.1 Introduction 497 22.2 Basic design 498 22.3 Mouse pointer core 500 22.4 “Ghost” character core 505 22.5 Sprite core driver and testing program 513 22.6 Bibliographic notes 516 22.7 Suggested experiments 516 23 On-Screen-Display Core 519 23.1 Introduction to tile graphics 519 23.2 Basic OSD design 521 23.3 OSD core 524 23.4 OSD core driver and testing program 530 23.5 Bibliographic notes 532 23.6 Suggested experiments 532 24 VGA Frame Buffer Core 535 24.1 Overview 535 24.2 Frame buffer core 536 24.3 Register map 540 24.4 Driver and testing program 542 543 24.5 Project Ideas 545 24.6 Bibliographic notes 547 24.7 Suggested experiments 547 PART V EPILOGUE 25 What Next 553 References 557 Appendix A: Tutorials 561 A.1 Overview of Xilinx Vivado IDE 561 A.2 Short tutorial on Vivado hardware development 565 A.3 Short tutorial on Vivado simulation 570 A.4 Tutorial on IP instantiation 574 A.5 Short tutorial on FPro system development 580 A.6 Bibliographic notes 587 Topic Index 589
£83.66
O'Reilly Media Easy Electronics
Book Synopsis
£7.59
John Wiley & Sons Inc SigmaDelta Converters Practical Design Guide
Book SynopsisThoroughly revised and expanded to help readers systematically increase their knowledge and insight about Sigma-Delta Modulators Sigma-Delta Modulators (SDMs) have become one of the best choices for the implementation of analog/digital interfaces of electronic systems integrated in CMOS technologies. Compared to other kinds of Analog-to-Digital Converters (ADCs), S?Ms cover one of the widest conversion regions of the resolution-versus-bandwidth plane, being the most efficient solution to digitize signals in an increasingly number of applications, which span from high-resolution low-bandwidth digital audio, sensor interfaces, and instrumentation, to ultra-low power biomedical systems and medium-resolution broadband wireless communications. Following the spirit of its first edition, Sigma-Delta Converters: Practical Design Guide, 2nd Edition takes a comprehensive look at SDMs, their diverse types of architectures, circuit techniques, analysis synthesis methTable of ContentsPreface xix Acknowledgements xxv List of Abbreviations xxvii 1 Introduction to 𝚺𝚫 Modulators: Fundamentals, Basic Architecture and Performance Metrics 1 1.1 Basics of Analog-to-Digital Conversion 2 1.1.1 Sampling 3 1.1.2 Quantization 4 1.1.3 Quantization White Noise Model 5 1.1.4 Noise Shaping 8 1.2 Sigma-Delta Modulation 9 1.2.1 From Noise-shaped Systems to ΣΔ Modulators 10 1.2.2 Performance Metrics of ΣΔMs 11 1.3 The First-order ΣΔ Modulator 13 1.4 Performance Enhancement and Taxonomy of ΣΔMs 16 1.4.1 ΣΔM System-level Design Parameters and Strategies 17 1.4.2 Classification of ΣΔMs 18 1.5 Putting All The Pieces Together: From ΣΔMs to ΣΔ ADCs 19 1.5.1 Some Words about ΣΔ Decimators 20 1.6 ΣΔ DACs 22 1.6.1 System Design Trade-offs and Signal Processing in ΣΔ DACs 22 1.6.2 Implementation of Digital ΣΔMs used in DACs 24 1.7 Summary 25 References 26 2 Taxonomy of 𝚺𝚫 Architectures 29 2.1 Second-order ΣΔ Modulators 30 2.1.1 Alternative Representations of Second-order ΣΔMs 31 2.1.2 Second-Order ΣΔM with Unity STF 34 2.2 High-order Single-loop ΣΔMs 35 2.3 Cascade ΣΔ Modulators 39 2.3.1 SMASH ΣΔM Architectures 46 2.4 Multi-bit ΣΔ Modulators 49 2.4.1 Influence of Multi-bit DAC Errors 49 2.4.2 Dynamic Element Matching Techniques 50 2.4.3 Dual Quantization 53 2.4.3.1 Dual-quantization Single-loop ΣΔMs 53 2.4.3.2 Dual-quantization Cascade ΣΔMs 54 2.5 Band-pass ΣΔ Modulators 55 2.5.1 Quadrature BP-ΣΔMs 56 2.5.2 The z → −z2 LP–BP Transformation 58 2.5.3 BP-ΣΔMs with Optimized NTF 58 2.5.4 Time-interleaved and Polyphase BP-ΣΔMs 61 2.6 Continuous-time ΣΔ Modulators: Architecture and Basic Concepts 64 2.6.1 An Intuitive Analysis of CT-ΣΔMs 66 2.6.2 Some Words about Alias Rejection in CT-ΣΔMs 69 2.7 DT–CT Transformation of ΣΔMs 70 2.7.1 The Impulse-invariant Transformation 70 2.7.2 DT–CT Transformation of a Second-order ΣΔM 72 2.8 Direct Synthesis of CT-ΣΔMs 74 2.9 Summary 76 References 76 3 Circuit Errors in Switched-capacitor 𝚺𝚫 Modulators 83 3.1 Overview of Nonidealities in Switched-capacitor ΣΔ Modulators 84 3.2 Finite Amplifier Gain in SC-ΣΔMs 86 3.3 Capacitor Mismatch in SC-ΣΔMs 90 3.4 Integrator Settling Error in SC-ΣΔMs 91 3.4.1 Behavioral Model for the Integrator Settling 91 3.4.2 Linear Effect of Finite Amplifier Gain–Bandwidth Product 95 3.4.3 Nonlinear Effect of Finite Amplifier Slew Rate 98 3.4.4 Effect of Finite Switch On-resistance 100 3.5 Circuit Noise in SC-ΣΔMs 101 3.6 Clock Jitter in SC-ΣΔMs 105 3.7 Sources of Distortion in SC-ΣΔMs 107 3.7.1 Nonlinear Amplifier Gain 107 3.7.2 Nonlinear Switch On-Resistance 109 3.8 Case Study: High-level Sizing of a ΣΔM 111 3.8.1 Ideal Modulator Performance 111 3.8.2 Noise Leakages 112 3.8.3 Circuit Noise 115 3.8.4 Settling Error 116 3.8.5 Overall High-Level Sizing and Noise Budget 117 3.9 Summary 119 References 119 4 Circuit Errors and Compensation Techniques in Continuous-time 𝚺𝚫 Modulators 123 4.1 Overview of Nonidealities in Continuous-time ΣΔ Modulators 123 4.2 CT Integrators and Resonators 124 4.3 Finite Amplifier Gain in CT-ΣΔMs 126 4.4 Time-constant Error in CT-ΣΔMs 128 4.5 Finite Integrator Dynamics in CT-ΣΔMs 130 4.5.1 Effect of Finite Gain–Bandwidth Product on CT-ΣΔMs 131 4.5.2 Effect of Finite Slew Rate on CT-ΣΔMs 133 4.6 Sources of Distortion in CT-ΣΔMs 134 4.6.1 Nonlinearities in the Front-end Integrator 134 4.6.2 Intersymbol Interference in the Feedback DAC 136 4.7 Circuit Noise in CT-ΣΔMs 137 4.7.1 Noise Analysis Considering NRZ Feedback DACs 137 4.7.2 Noise Analysis Considering SC Feedback DACs 139 4.8 Clock Jitter in CT-ΣΔMs 140 4.8.1 Jitter in Return-to-zero DACs 141 4.8.2 Jitter in Non-return-to-zero DACs 142 4.8.3 Jitter in Switched-capacitor DACs 144 4.8.4 Lingering Effect of Clock Jitter Error 145 4.8.5 Reducing the Effect of Clock Jitter with FIR and Sine-shaped DACs 147 4.9 Excess Loop Delay in CT-ΣΔMs 149 4.9.1 Intuitive Analysis of ELD 149 4.9.2 Analysis of ELD based on Impulse-invariant DT-CT Transformation 151 4.9.3 Alternative ELD Compensation Techniques 154 4.10 Quantizer Metastability in CT-ΣΔMs 155 4.11 Summary 159 References 160 5 Behavioral Modeling and High-level Simulation 165 5.1 Systematic Design Methodology of ΣΔ Modulators 165 5.1.1 System Partitioning and Abstraction Levels 167 5.1.2 Sizing Process 167 5.2 Simulation Approaches for the High-level Evaluation of ΣΔMs 169 5.2.1 Alternatives to Transistor-level Simulation 169 5.2.2 Event-driven Behavioral Simulation Technique 171 5.2.3 Programming Languages and Behavioral Modeling Platforms 172 5.3 Implementing ΣΔM Behavioral Models 173 5.3.1 From Circuit Analysis to Computational Algorithms 173 5.3.2 Time-domain versus Frequency-domain Behavioral Models 175 5.3.3 Implementing Time-domain Behavioral Models in MATLAB 178 5.3.4 Building Time-domain Behavioral Models as SIMULINK C-MEX S-functions 182 5.4 Efficient Behavioral Modeling of ΣΔM Building Blocks using C-MEX S-functions 188 5.4.1 Modeling of SC Integrators using S-functions 188 5.4.1.1 Capacitor Mismatch and Nonlinearity 190 5.4.1.2 Input-referred Thermal Noise 191 5.4.1.3 Switch On-resistance Dynamics 194 5.4.1.4 Incomplete Settling Error 197 5.4.2 Modeling of CT Integrators using S-functions 200 5.4.2.1 Single-pole Gm-C Model 200 5.4.2.2 Two-pole Dynamics Model 201 5.4.2.3 Modeling Transconductors as S-functions 203 5.4.3 Behavioral Modeling of Quantizers using S-functions 205 5.4.3.1 Modeling Multi-level ADCs as S-functions 205 5.4.3.2 Modeling Multi-level DACs as S-functions 207 5.5 SIMSIDES: A SIMULINK-based Behavioral Simulator for ΣΔMs 209 5.5.1 Model Libraries Included in SIMSIDES 210 5.5.2 Structure of SIMSIDES and its User Interface 211 5.5.2.1 Creating a New ΣΔM Block Diagram 212 5.5.2.2 Setting Model Parameters 215 5.5.2.3 Simulation Analyses 215 5.6 Using SIMSIDES for High-level Sizing and Verification of ΣΔMs 216 5.6.1 SC Second-order Single-Bit ΣΔM 216 5.6.1.1 Effect of Amplifier Finite DC Gain 218 5.6.1.2 Effect of Thermal Noise 218 5.6.1.3 Effect of the Incomplete Settling Error 220 5.6.1.4 Cumulative Effect of All Errors 221 5.6.2 CT Fifth-order Cascade 3-2 Multi-bit ΣΔM 224 5.6.2.1 Effect of Nonideal Effects 227 5.6.2.2 High-level Synthesis and Verification 229 5.7 Summary 231 References 231 6 Automated Design and Optimization of 𝚺𝚫Ms 235 6.1 Architecture Exploration and Selection: Schreier’s Toolbox 236 6.1.1 Basic Functions of Schreier’s Delta-Sigma Toolbox 236 6.1.2 Synthesis of a Fourth-order CRFF LP/BP SC-ΣΔM with Tunable Notch 238 6.1.3 Synthesis of a Fourth-order BP CT-ΣΔM with Tunable Notch 240 6.2 Optimization-based High-level Synthesis of ΣΔ Modulators 245 6.2.1 Combining Behavioral Simulation and Optimization 246 6.2.2 Using Simulated Annealing as Optimization Engine 247 6.2.3 Combining SIMSIDES with MATLAB Optimizers 253 6.3 Lifting Method and Hardware Acceleration to Optimize CT-ΣΔMs 255 6.3.1 Hardware Emulation of CT-ΣΔMs on an FPGA 257 6.3.2 GPU-accelerated Computing of CT-ΣΔMs 258 6.4 Using Multi-objective Evolutionary Algorithms to Optimize ΣΔMs 259 6.4.1 Combining MOEA with SIMSIDES 261 6.4.2 Applying MOEA and SIMSIDES to the Synthesis of CT-ΣΔMs 262 6.5 Summary 269 References 269 7 Electrical Design of 𝚺𝚫Ms: From Systems to Circuits 271 7.1 Macromodeling ΣΔMs 272 7.1.1 SC Integrator Macromodel 272 7.1.1.1 Switch Macromodel 272 7.1.1.2 OTA Macromodel 274 7.1.2 CT Integrator Macromodel 274 7.1.2.1 Active-RC Integrators 274 7.1.2.2 Gm-C Integrators 274 7.1.3 Nonlinear OTA Transconductor 275 7.1.4 Embedded Flash ADC Macromodel 276 7.1.5 Feedback DAC Macromodel 277 7.2 Examples of ΣΔM Macromodels 279 7.2.1 SC Second-order Example 279 7.2.2 Second-order Active-RC ΣΔM 283 7.3 Including Noise in Transient Electrical Simulations of ΣΔMs 286 7.3.1 Generating and Injecting Noise Data Sequences in HSPICE 287 7.3.2 Analyzing the Impact of the Main Noise Sources in SC Integrators 289 7.3.3 Generating and Injecting Flicker Noise Sources in Electrical Simulations 289 7.3.4 Test Bench to Include Noise in the Simulation of ΣΔMs 293 7.4 Processing ΣΔM Output Results of Electrical Simulations 294 7.5 Summary 298 References 298 8 Design Considerations of 𝚺𝚫M Subcircuits 301 8.1 Design Considerations of CMOS Switches 302 8.1.1 Trade-Off Between Ron and the CMOS Switch Drain/Source Parasitic Capacitances 302 8.1.2 Characterizing the Nonlinear Behavior of Ron 302 8.1.3 Influence of Technology Downscaling on the Design of Switches 304 8.1.4 Evaluating Harmonic Distortion due to CMOS Switches 305 8.2 Design Considerations of Operational Amplifiers 308 8.2.1 Typical Amplifier Topologies 309 8.2.2 Common-mode Feedback Networks 311 8.2.3 Characterization of the Amplifier in AC 313 8.2.4 Characterization of the Amplifier in DC 313 8.2.5 Characterization of the Amplifier Gain Nonlinearity 316 8.3 Design Considerations of Transconductors 317 8.3.1 Highly Linear Front-end Transconductor 318 8.3.2 Loop-filter Transconductors 320 8.3.3 Widely Programmable Transconductors 323 8.4 Design Considerations of Comparators 324 8.4.1 Regenerative Latch-based Comparators 325 8.4.2 Design Guidelines of Comparators 327 8.4.3 Characterization of Offset and Hysteresis Based on the Input-ramp Method 328 8.4.4 Characterization of Offset and Hysteresis Based on the Bisectional Method 328 8.4.5 Characterizing the Comparison Time 330 8.5 Design Considerations of Current-Steering DACs 332 8.5.1 Fundamentals and Basic Concepts of CS DACs 333 8.5.2 Practical Realization of CS DACs 333 8.5.3 Current Cell Circuits, Error Limitations, and Design Criteria 336 8.5.4 CS 4-bit DAC Example 336 8.6 Summary 338 References 338 9 Practical Realization of 𝚺𝚫Ms: From Circuits to Chips 341 9.1 Auxiliary ΣΔM Building Blocks 341 9.1.1 Clock-phase Generators 342 9.1.1.1 Phase Generation 342 9.1.1.2 Phase Buffering 342 9.1.1.3 Phase Distribution 344 9.1.2 Generation of Common-mode Voltage, Reference Voltage, and Bias Currents 345 9.1.2.1 Bandgap Circuit 345 9.1.2.2 Reference Voltage Generator 345 9.1.2.3 Master Bias Current Generator 346 9.1.2.4 Common-mode Voltage Generator 346 9.1.3 Additional Digital Logic 347 9.2 Layout Design, Floorplanning, and Practical Issues 348 9.2.1 Layout Floorplanning 348 9.2.1.1 Divide Layout into Different Parts or Regions 348 9.2.1.2 Shield Sensitive ΣΔM Analog Subcircuits from Switching Noise 349 9.2.1.3 Buses to Distribute Signals Shared by Different ΣΔM Parts 349 9.2.1.4 Be Obsessive about Layout Symmetry and Details of Analog Parts 349 9.2.2 I/O Pad Ring 350 9.2.3 Importance of Layout Verification and Catastrophic Failure 350 9.3 Chip Package, Test PCB, and Experimental Setup 354 9.3.1 Bonding Diagram and Package 354 9.3.2 Test PCB 355 9.4 Experimental Test Set-Up 355 9.4.1 Planning the Type and Number of Instruments Needed 357 9.4.2 Connecting Lab Instruments 357 9.4.3 Measurement Set-Up Example 358 9.5 ΣΔM Design Examples and Case Studies 359 9.5.1 Programmable-gain ΣΔMs for High Dynamic Range Sensor Interfaces 360 9.5.1.1 Main Design Criteria and Performance Limitations 361 9.5.1.2 SC Realization with Programmable Gain and Double Sampling 362 9.5.1.3 Influence of Chopper Frequency on Flicker Noise 362 9.5.2 Reconfigurable SC-ΣΔMs for Multi-standard Direct Conversion Receivers 364 9.5.2.1 Power-scaling Circuit Techniques 367 9.5.2.2 Experimental Results 368 9.5.3 Using Widely-programmable Gm-LC BP-ΣΔMs for RF Digitizers 368 9.5.3.1 Application Scenario 371 9.5.3.2 Gm-LC BP-ΣΔM High-level Sizing 371 9.5.3.3 BP CT-ΣΔM Loop-Filter Reconfiguration Techniques 375 9.5.3.4 Embedded 4-bit Quantizer with Calibration 378 9.5.3.5 Biasing, Digital Control Programmability and Testability 382 9.6 Summary 385 References 386 10 Frontiers, Trends and Challenges: Towards Next-generation 𝚺𝚫 Modulators 389 10.1 State-of-the-Art ADCs: Nyquist-rate versus ΣΔ Converters 390 10.1.1 Conversion Energy 391 10.1.2 Figures of Merit 392 10.2 Comparison of Different Categories of ΣΔ ADCs 393 10.2.1 Aperture Plot of ΣΔMs 406 10.2.2 Energy Plot of ΣΔMs 407 10.3 Empirical and Statistical Analysis of State-of-the-Art ΣΔMs 408 10.3.1 SC versus CT ΣΔMs 408 10.3.2 Technology used in State-of-the-Art ΣΔMs 410 10.3.3 Single-Loop versus Cascade ΣΔMs 410 10.3.4 Single-bit versus Multi-bit ΣΔMs 411 10.3.5 Low-pass versus Band-pass ΣΔMs 413 10.3.6 Emerging ΣΔM Techniques 415 10.4 Gigahertz-range ΣΔMs for RF-to-digital Conversion 415 10.5 Enhanced Cascade ΣΔMs 418 10.5.1 SMASH CT-ΣΔMs 418 10.5.2 Two-stage 0-L MASH 419 10.5.3 Stage-sharing Cascade ΣΔMs 420 10.5.4 Multi-rate and Hybrid CT/DT ΣΔMs 420 10.5.4.1 Upsampling Cascade MR-ΣΔMs 421 10.5.4.2 Downsampling Hybrid CT/DT Cascade MR-ΣΔMs 422 10.6 Power-efficient ΣΔM Loop-filter Techniques 423 10.6.1 Inverter-based ΣΔMs 423 10.6.2 Hybrid Active/Passive and Amplifier-less ΣΔMs 424 10.6.3 Power-efficient Amplifier Techniques 426 10.7 Hybrid ΣΔM/Nyquist-rate ADCs 428 10.7.1 Multi-bit ΣΔM Quantizers based on Nyquist-rate ADCs 428 10.7.2 Incremental ΣΔ ADCs 429 10.8 Time-based ΣΔ ADCs 431 10.8.1 ΣΔMs with VCO/PWM-based Quantization 432 10.8.2 Scaling-friendly Mostly-digital ΣΔMs 433 10.8.3 GRO-based ΣΔMs 434 10.9 DAC Techniques for High-performance CT-ΣΔMs 436 10.10 Classification of State-of-the-Art References 437 10.11 Summary and Conclusions 437 References 438 A State-space Analysis of Clock Jitter in CT-𝚺𝚫Ms 463 A.1 State-space Representation of NTF (z) 463 A.2 Expectation Value of (Δqn)2 465 A.3 In-band Noise Power due to Clock Jitter 466 References 467 B SIMSIDES User Guide 469 B.1 Getting Started: Installing and Running SIMSIDES 470 B.2 Building and Editing ΣΔM Architectures in SIMSIDES 470 B.3 Analyzing ΣΔMs in SIMSIDES 473 B.3.1 Node Spectrum Analysis 474 B.3.2 Integrated Power Noise 474 B.3.3 SNR/SNDR 475 B.3.4 Harmonic Distortion 475 B.3.5 Integral and Differential Non-Linearity 477 B.3.6 Multi-tone Power Ratio 477 B.3.7 Histogram 478 B.3.8 Parametric Analysis 478 B.3.9 Monte Carlo Analysis 479 B.4 Optimization Interface 480 B.5 Tutorial Example: Using SIMSIDES to Model and Analyze ΣΔMs 482 B.5.1 Creating the Cascade 2-1 ΣΔM Block Diagram in SIMSIDES 482 B.5.2 Setting Model Parameters 482 B.5.3 Computing the Output Spectrum 484 B.5.4 SNR versus Input Amplitude Level 486 B.5.5 Parametric Analysis Considering Only One Parameter 487 B.5.6 Parametric Analysis Considering Two Parameters 488 B.5.7 Computing Histograms 489 B.6 Getting Help 489 C SIMSIDES Block Libraries and Models 491 C.1 Overview of SIMSIDES Libraries 491 C.2 Ideal Libraries 492 C.2.1 Ideal Integrators 492 C.2.1.1 Building-block Model Purpose and Description 492 C.2.1.2 Model Parameters 493 C.2.2 Ideal Resonators 493 C.2.2.1 Ideal_LD_Resonator 493 C.2.2.2 Ideal_FE_Resonator 493 C.2.2.3 Ideal_CT_Resonator 493 C.2.3 Ideal Quantizers 494 C.2.3.1 Ideal_Comparator 494 C.2.3.2 Ideal_Comparator_for_SI 495 C.2.3.3 Ideal_Multibit_Quantizer 495 C.2.3.4 Ideal_Multibit_Quantizer_for_SI 496 C.2.3.5 Ideal_Multibit_Quantizer_levels 496 C.2.3.6 Ideal_Multibit_Quantizer_levels_SD2 496 C.2.3.7 Ideal_Sampler 496 C.2.4 Ideal D/A Converters 496 C.2.4.1 Ideal_DAC_for_SI 496 C.2.4.2 Ideal_DAC_dig_level_SD2 497 C.3 Real SC Building-Block Libraries 497 C.3.1 Real SC Integrators 497 C.3.2 Real SC Resonators 501 C.4 Real SI Building-Block Libraries 503 C.4.1 Real SI Integrators 503 C.4.2 Real SI Resonators 505 C.4.3 SI Errors and Model Parameters 506 C.4.3.1 Basic_SI_FE(LD)_Integrator and Basic_SI_FE(LD)_Resonator 506 C.4.3.2 SI_FE(LD)_Int_Finite_Conductance 507 C.4.3.3 SI_FE(LD)_Int_Finite_Conductance & Settling & ChargeInjection 508 C.5 Real CT Building-Block Libraries 508 C.5.1 Real CT Integrators 508 C.5.1.1 Model Parameters used in Transconductors and Gm-C Integrator Building Blocks 511 C.5.1.2 Gm-MC Integrators 511 C.5.1.3 Active-RC Integrators 512 C.5.1.4 MOSFET-C Integrators 513 C.5.2 Real CT Resonators 513 C.5.2.1 Gm-C Resonators 514 C.5.2.2 Gm-LC Resonators 517 C.6 Real Quantizers & Comparators 517 C.7 Real D/A Converters 518 C.8 Auxiliary Blocks 519 Index 523
£108.86
O'Reilly Media Getting Started with Soldering: A Hands-On Guide
Book SynopsisGetting Started with Soldering not only teaches new makers and experimenters the core principles of soldering, it also functions as an excellent reference and resource for beginners and more advanced makers alike. The book guides readers through the fundamentals of soldering, explains the tools and materials, demonstrates proper techniques, and shows how to fix mistakes or broken connections. It even includes guidance on more advanced techniques such as surface-mount soldering for electronics. From choosing the right soldering iron to making perfect connections, readers will acquire the knowledge and skills needed to form a strong foundation for a lifetime of making. Soldering is a core concept in making, electronics prototyping, and home repairs The many different types of soldering -- requiring different materials and tools -- are explained with easy-to-follow instructions Full-color photographs and illustrations throughout create a visually engaging format for learning Pricing and technical considerations help readers select the best tools for their budgets and needs Troubleshooting guidelines show how to repair solder connections that have failed from improper technique or from age
£14.39
Pearson Education Electric Circuits Global Edition Mastering
Book Synopsis
£79.21
John Wiley & Sons Inc Grounds for Grounding
Book SynopsisTable of ContentsPreface to the Second Edition ix Preface to First Edition xi About the Companion Website xiii 1 What is Density Functional Theory? 1 1.1 How to Approach This Book 1 1.2 Examples of DFT in Action 2 1.2.1 Ammonia Synthesis by Heterogeneous Catalysis 2 1.2.2 Embrittlement of Metals by Trace Impurities 3 1.2.3 Materials Properties for Modeling Planetary Formation 4 1.2.4 Screening Large Collections of Materials to Develop Photoanodes 5 1.3 The Schrödinger Equation 7 1.4 Density Functional Theory – From Wavefunctions to Electron Density 9 1.5 The Exchange-Correlation Functional 12 1.6 The Quantum Chemistry Tourist 13 1.6.1 Localized and Spatially Extended Functions 13 1.6.2 Wavefunction-Based Methods 15 1.6.3 The Hartree–Fock Method 15 1.6.4 Beyond Hartree–Fock 18 1.7 What Can DFT Not Do? 22 1.8 Density Functional Theory in Other Fields 23 1.9 How to Approach This Book (Revisited) 24 1.10 Which Code Should I Use? 25 Further Reading 26 References 27 2 DFT Calculations for Simple Solids 29 2.1 Periodic Structures, Supercells, and Lattice Parameters 29 2.2 Face-Centered Cubic Materials 31 2.3 Hexagonal Close-Packed Materials 32 2.4 Crystal Structure Prediction 35 2.5 Phase Transformations 35 Exercises 37 Further Reading 37 Appendix – Calculation Details 38 Reference 38 3 Nuts and Bolts of DFT Calculations 39 3.1 Reciprocal Space and k-Points 40 3.1.1 Plane Waves and the Brillouin Zone 40 3.1.2 Integrals in k-Space 42 3.1.3 Choosing k-Points in the Brillouin Zone 43 3.1.4 Metals – Special Cases in k-Space 47 3.1.5 Summary of k-Space 48 3.2 Energy Cutoffs 49 3.2.1 Pseudopotentials 50 3.3 Numerical Optimization 51 3.3.1 Optimization in One Dimension 52 3.3.2 Optimization in More Than One Dimension 54 3.3.3 What Do I Really Need to Know About Optimization? 57 3.4 DFT Total Energies – An Iterative Optimization Problem 58 3.5 Geometry Optimization 59 3.5.1 Internal Degrees of Freedom 59 3.5.2 Geometry Optimization with Constrained Atoms 61 3.5.3 Optimizing Supercell Volume and Shape 61 Exercises 62 Further Reading 63 Appendix – Calculation Details 64 References 64 4 Accuracy of DFT Calculations 65 4.1 How Accurate are DFT Calculations? 65 4.2 Choosing a Functional 69 4.3 Examples of Physical Accuracy 73 4.3.1 Benchmark Calculations for Molecular Systems – Energy and Geometry 74 4.3.2 Benchmark Calculations for Molecular Systems – Vibrational Frequencies 75 4.3.3 Crystal Structures and Cohesive Energies 75 4.3.4 Adsorption Energies and Bond Strengths 76 4.4 When Might DFT Fail? 77 Exercises 78 Further Reading 79 References 79 5 DFT Calculations for Surfaces of Solids 81 5.1 Why Surfaces are Important 81 5.2 Periodic Boundary Conditions and Slab Models 82 5.3 Choosing k-Points for Surface Calculations 85 5.4 Classification of Surfaces by Miller Indices 85 5.5 Surface Relaxation 88 5.6 Calculation of Surface Energies 91 5.7 Symmetric and Asymmetric Slab Models 92 5.8 Surface Reconstruction 93 5.9 Adsorbates on Surfaces 95 5.9.1 Accuracy of Adsorption Energies 98 5.10 Effects of Surface Coverage 99 5.11 DFT Calculations for Grain Boundaries 101 Exercises 102 Further Reading 103 Appendix – Calculation Details 104 References 105 6 DFT Calculations of Vibrational Frequencies 107 6.1 Isolated Molecules 107 6.2 Vibrations of a Collection of Atoms 110 6.3 Molecules on Surfaces 112 6.4 Zero-Point Energies 114 6.5 Reaction Energies at Finite Temperatures 118 6.6 Phonons and Delocalized Modes 119 Exercises 120 Further Reading 120 Appendix – Calculation Details 121 Reference 122 7 Calculating Rates of Chemical Processes Using Transition State Theory 123 7.1 One-Dimensional Example 124 7.2 Multidimensional Transition State Theory 128 7.3 Finding Transition States 131 7.3.1 Elastic Band Method 132 7.3.2 Nudged Elastic Band Method 134 7.3.3 Initializing NEB Calculations 135 7.4 Finding the Right Transition States 137 7.5 Connecting Individual Rates to Overall Dynamics 139 7.6 Quantum Effects and Other Complications 141 7.6.1 High Temperatures/Low Barriers 142 7.6.2 Quantum Tunneling 142 7.6.3 Zero-Point Energies 142 Exercises 143 Further Reading 144 Appendix – Calculation Details 145 Reference 146 8 Predicting Equilibrium Phase Diagrams and Electrochemistry Using Open Ensemble Methods 147 8.1 Stability of Bulk Metal Oxides 148 8.1.1 Examples Including Disorder – Configurational Entropy 152 8.2 Stability of Metal and Metal Oxide Surfaces 154 8.3 DFT for Electrochemistry: The Computational Hydrogen Electrode 156 8.4 Using DFT to Predict Dissolution of Solids in Electrochemical Environments 159 Exercises 161 Further Reading 162 Appendix – Calculation Details 163 References 163 9 Electronic Structure and Magnetic Properties 165 9.1 Electronic Density of States 165 9.2 Local DOS and Atomic Charges 170 9.3 Magnetism 172 Exercises 174 Further Reading 174 Appendix – Calculation Details 175 10 Ab Initio Molecular Dynamics 177 10.1 Classical Molecular Dynamics 177 10.1.1 Molecular Dynamics with Constant Energy 177 10.1.2 Molecular Dynamics in the Canonical Ensemble 179 10.1.3 Practical Aspects of Classical Molecular Dynamics 180 10.2 Ab Initio Molecular Dynamics 180 10.3 Applications of Ab Initio MD 182 10.3.1 Exploring Structurally Complex Materials: Liquids and Amorphous Phases 182 10.3.2 Exploring Complex Energy Surfaces 183 Exercises 186 Further Reading 186 Appendix – Calculation Details 188 References 188 11 Methods Beyond “Standard” Calculations 189 11.1 Estimating Uncertainties in DFT 189 11.2 DFT+X Methods for Improved Treatment of Electron Correlation 191 11.2.1 Dispersion Interactions and DFT-D 191 11.2.2 Self-Interaction Error, Strongly Correlated Electron Systems and DFT+U 192 11.3 Random Phase Approximation 194 11.4 TD-DFT 196 11.5 Larger System Sizes with Linear Scaling Methods and Classical Forcefields 197 11.6 Conclusion 197 Further Reading 198 References 199 Index 201
£112.50
Cambridge University Press Integration of Passive RF Front End Components in Socs
a huge range and FREE tracked UK delivery on ALL orders.
£80.09
Cambridge University Press Electronic Sensor Design Principles
Book SynopsisGet up to speed with the fundamentals of electronic sensor design with this comprehensive guide, and discover powerful techniques to reduce the overall design timeline for your specific applications. Includes a step-by-step introduction to a generalized information-centric approach for designing electronic sensors, demonstrating universally applicable practical approaches to speed up the design process. Features detailed coverage of all the tools necessary for effective characterization and organization of the design process, improving overall process efficiency. Provides a coherent and rigorous theoretical framework for understanding the fundamentals of sensor design, to encourage an intuitive understanding of sensor design requirements. Emphasising an integrated interdisciplinary approach throughout, this is an essential tool for professional engineers and graduate students keen to improve their understanding of cutting-edge electronic sensor design.Table of ContentsPart I. Fundamentals; 1. Introduction; 2. Sensors Modeling and Characterization; 3. Sensor Design Optimization and Tradeoffs; 4. Overview of Mathematical Tools; 5. Compressive Sensing; Part II. Noise and Electronic Interfaces; 6. The Origin of Noise; 7. Noise in Electronic Devices and Circuits; 8. Detection Techniques; Part III. Selected Topics on Physics of Transduction; 9. Selected Topics on Photon Transduction; 10. Selected Topics on Ionic-Electronic Transduction; 11. Selected Topics on Mechanical and Thermal Transduction; Part IV. Problems and Solutions; 12. Problems and Solutions.
£89.29
Cambridge University Press Microwave Electronics
Book SynopsisDrawing on over twenty years of teaching experience, this comprehensive yet self-contained text provides an in-depth introduction to the field of integrated microwave electronics. Ideal for a first course on the subject, it covers essential topics such as passive components and transistors, linear, low-noise and power amplifiers, and microwave measurements. An entire chapter is devoted to CAD techniques for analysis and design, covering examples of easy-to-medium difficulty for both linear and non-linear subsystems, and supported online by ADS and AWR project files. More advanced topics are also covered, providing an up-to-date overview of compound semiconductor technologies and treatment of electromagnetic issues and models. Readers can test their knowledge with end-of-chapter questions and numerical problems, and solutions and lecture slides are available online for instructors. This is essential reading for graduate and senior undergraduate students taking courses in microwave, radiTable of Contents1. A system introduction to microwave electronics; 2. Passive elements and circuit layout; 3. CAD techniques; 4. Directional couplers and power dividers; 5. Active RF and microwave semiconductor devices; 6. Microwave linear amplifiers; 7. Low-noise amplifier design; 8. Power amplifiers; 9. Microwave measurements; 10. Computer-Aided Design (CAD) projects.
£67.44
Cambridge University Press SParameters for Signal Integrity
Book SynopsisMaster the usage of s-parameters in signal integrity applications and gain full understanding of your simulation and measurement environment with this rigorous and practical guide. Solve specific signal integrity problems including calculation of the s-parameters of a network, linear simulation of circuits, de-embedding, and virtual probing, all with expert guidance. Learn about the interconnectedness of s-parameters, frequency responses, filters, and waveforms. This invaluable resource for signal integrity engineers is supplemented with the open-source software SignalIntegrity, a Python package for scripting solutions to signal integrity problems.Trade Review'The most modern and up-to-date book on linear network theory with applications. Deep and comprehensive theory is coupled with detailed applications, making this book a must-have not only for signal integrity professionals, but for any microwave engineer.' Andrea Ferrero, Keysight'This book provides unique and consistent description of S-parameters use for analysis of linear networks, signal measurement and processing in one volume, supplemented and illustrated with free open source signal integrity software. The book can be used for learning the subject of emerging microwave signal integrity or as a comprehensive and indispensable reference for every microwave and signal integrity engineer and scientist.' Yuriy Shlepnev, Simberian Inc.'This is an outstanding and refreshing book for the novice and advanced engineer alike. Written by a well-known expert in the field, it provides a rather unique access to the difficult topic of signal integrity, through a systematic learning by doing approach. A software, which is freely accessible through an open-source Python library, 'Signal Integrity', allows the user to easily program the numerous examples that accompany the theory. The material ranges from simple to complex problems, using the S-parameter concept for high-speed signal integrity as a unifying theme. The book is appropriate for self-study and as a reference for teaching, and empowers the reader with a very unusual and stimulating blend of competences.' Peter Wittwer, University of Geneva'S-parameters for Signal Integrity is a more circuit-heavy look at the S-parameter data/simulation/design environment than one usually sees and that approach can be very helpful for a number of problems.' Jon Martens, Anritsu'This is a long overdue and amazing book that will equally appeal to people looking for a deep theoretical foundation in the mathematics behind some of the commonly-used signal integrity computations we use today and also to those practicing engineers who are looking for real-life answers about S-parameter simulations, measurements and applications. This is also a 'must-read' book for anyone who wants to learn and use the open-source code that does pretty much everything we need to simulate in signal integrity.' Istvan Novak, IEEE Life Fellow, Samtec'S-parameters are the industry-standard way of describing the electrical properties of interconnects; in measurement, in simulation and in specifications. While there are scattered resources on the formalism of S-parameters, they all focus on RF and microwave applications. Here, in one resource, is the definitive standard for using S-parameters in signal integrity applications where a time domain transform is essential. This new book, written by a world-class expert, establishes the foundations for using S-parameters to solve real world signal integrity related problems.' Eric Bogatin, Teledyne LeCroy Signal Integrity Academy and University of Colorado, Boulder'… combines frequency-domain concepts from S-parameter theory with the time-domain concepts of digital oscilloscope technology to optimize transmission of digital signals through circuitry. Pupalaikis, an engineer for Teledyne LeCroy and IEEE Fellow, has produced what is likely to be the definitive work on scattering parameters as applied to modern digital systems. Supplementing its descriptive character, the book also provides code for use with an open-source Python package to perform many of the extremely complex operations discussed in the text … The ideal reader is a Python programmer and linear algebra expert who is also familiar with graduate-level signals and systems topics. That said, for specialists in signal integrity, Pupalaikis appears to have asked and answered most of the important questions about modeling and measurements with respect to passive linear circuits for digital transmission, including coverage of equalization and other recent developments.' K. D. Stephan, ChoiceTable of ContentsIntroduction; Part I. Scattering Parameters: 1. Network parameter models; 2. Waves; 3. Scattering parameters; 4. S-parameter system models; 5. Reference impedance; 6. Sources; 7. Transmission lines; Part II. Applications: 8. System descriptions; 9. Simulation; 10. De-embedding; 11. Virtual probing; Part III. Signal Processing and Measurement: 12. Frequency responses, impulse responses and convolution; 13. Waveforms and filters; 14. The impedance profile; 15. Measurement; 16. Model extraction; Part IV. SignalIntegrity: 17. SignalIntegrity.Lib package; 18. SignalIntegrity app; Afterword; Appendices: A. Terminology and conventions; B. Telegrapher's equations; C. Matrix algebra; D. Symbolic device solutions; References; Index.
£105.45
Cambridge University Press MillimeterWave Circuits for 5G and Radar
Book SynopsisDiscover the concepts, architectures, components, tools, and techniques needed to design millimeter-wave circuits for current and emerging wireless system applications. Focusing on applications in 5G, connectivity, radar, and more, leading experts in radio frequency integrated circuit (RFIC) design provide a comprehensive treatment of cutting-edge physical-layer technologies for radio frequency (RF) transceivers - specifically RF, analog, mixed-signal, and digital circuits and architectures. The full design chain is covered, from system design requirements through to building blocks, transceivers, and process technology. Gain insight into the key novelties of 5G through authoritative chapters on massive MIMO and phased arrays, and learn about the very latest technology developments, such as FinFET logic process technology for RF and millimeter-wave applications. This is an essential reading and an excellent reference for high-frequency circuit designers in both academia and industry.Trade Review'The 5G cellular standard has been under development for a number of years and is projected to support speeds far greater than those of earlier generations. This ambitious goal relies on innovations at all levels of abstraction, and is well served by the publication of Millimeter-Wave Circuits for 5G and Radar. Written by nearly thirty experts in the field, this book provides a great overview of the state of the art and will benefit those who wish to advance their knowledge of millimeter-wave circuits.' Behzad Razavi, University of California, Los Angeles'A book of landmark importance for practitioners of 5G RF system and RF circuit design covering millimeter-wave and frequency-division duplex (FDD) transceivers. It covers the essential topics of transceiver system design, beam forming and circuit design for advanced 5G and radar systems.' Kamal Sahota, Qualcomm'This book is an excellent read with topics ranging from architecture to layouts, and the concepts are illustrated by test results from manufactured circuits in advance technology nodes. Leading industry and academic researchers give a comprehensive overview of system aspects as well as in-depth state-of-the-art circuit design solutions. The scope is also very timely, as integration of advanced radio and radar transceivers is the key enabling technology for 5G communication and automotive application hardware.' Sven Mattisson, Ericsson'This book is on the 5G system and radar, which are both part of our future indeed. A wide range of experts have been brought together to discuss the design of high-frequency circuitry for 5G and radar. Both the system level and the transistor level are addressed in great detail. It includes 5G system considerations and transceivers, Digital PLLs, VCOs, and power amplifiers, etc. Actually in systems of such complexity few circuits of importance can be missing. Linearity and noise considerations are omnipresent as well. The last chapter provides the trade-off between planar CMOS and FinFETs. This is a choice which each designer faces sooner or later. As a result this book is a must for whoever wants to play a design role in the coming 5G or radar systems.' Willy Sansen, Katholieke Universiteit LeuvenTable of ContentsForeword Thomas Lee; 1. Introduction Gernot Hueber and Ali M. Niknejad; 2. 5G Transceivers from requirements to system models and analysis Aarno Pärsinnen; 3. MU-MIMO and massive MIMO for 5G radios Antonio Puglielli, Greg LaCaille, Elad Alon, Borivoje Nikolić and Ali M. Niknejad; 4. RF and millimeter-wave full-duplex wireless for 5G and beyond Harish Krishnaswamy and Tolga Dinc; 5. Flexible integrated architectures for frequency division duplex communication Lucas A. Calderin, Sameet Ramakrishnan, Elad Alon, Borivoje Nikolić and Ali M. Niknejad; 6. Scalable RF and millimeter-wave multi-beam approaches Arun Natarajan; 7. Millimeter-wave radar SoC integration in CMOS Piet Wambacq, Davide Guermandi, André Bourdoux and Jan Craninckx; 8. CMOS transceiver design for ultra-high-speed millimeter-wave wireless communication Kenichi Okada and Rui Wu; 9. Phased arrays for 5G millimeter-wave communications Bodhisatwa Sadhu and Leonard Rexberg; 10. Millimeter-wave frequency synthesis based on frequency multiplications Payam Heydari; 11. Digitally intensive PLL and clock generation Wanghua Wu and R. Bogdan Staszewski; 12. Practical VCO design Mohyee Mikhemar; 13. CMOS power amplifier design for 5G mobile applications Yang Zhang and Patrick Reynaert; 14. FinFET process technology for RF and millimeter-wave applications Hyung-Jin Lee and Bernhard Sell.
£99.75
Nova Science Publishers Inc Integrated Circuits, Photodiodes & Organic Field
Book SynopsisThis book begins with metamaterials technology, a novel approach for the design of radiofrequency and microwave components and circuits. Since reliability is a key success factor to engineering products today, the different misconceptions in the common reliability practices of integrated circuits manufacturers are presented. A bio-inspired approach designed to solve some tasks raised in the "Bionic Eyeglass Project" is described, which aims to help the everyday life of visually impaired people. This book also discusses the intrinsic charge transport in organic field-effect transistors based on self-assembled monolayers and on the nature of transport in organic systems. A combined view of spectroscopic studies on electronic states in working organic thin film is presented based on experimental results. Solution-processed organic thin-film transistors are also introduced. The use of photodiode array detectors as a powerful tool in HLPC is examined with an emphasis in peak identification and confirmatory results. The mechanisms of avalanche photodiodes as a particle detector and its latest results are reviewed. The main characteristics and properties of photodiodes and their applications in textile industry and biomedicine are also discussed. Finally, the specific application of photodiodes in cardiac optical mapping is presented.
£129.74
