Electronics: circuits and components Books

Book SynopsisThis book is an introduction on the principles of digital logic circuits. While providing coverage to the usual topics in combinational and sequential circuit principles, it also includes a chapter on the use of the hardware description language ABEL in the design of circuits using PLDs and a chapter on computer organization.Table of ContentsNumber Representation, Codes, and Code Conversion. Switching Algebra and Logic Gates. Representation and Implementation of Logic Functions. Combinational Logic Design. Sequential Circuit Components. Synchronous Sequential Machines. Asynchronous Sequential Machines. Design Using Hardware Description Languages. Computer Organization. Appendix: MOSFETS and Bipolar Junction Transistors. Bibliography. Index.

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Book SynopsisRoubik Gregorian, a well-known industry expert, provides circuit designers with the technical knowledge needed to design high-performance op-amps and comparators suitable for most analog circuit applications.Table of ContentsMOS Devices as Circuit Elements. Basic Analog CMOS Subcircuits. CMOS Operational Amplifier. Comparators. Digital-to-Analog Converters. Analog-to-Digital Converters. Practical Considerations and Design Examples. Index.

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Book SynopsisPraise for the First Edition . . . A unique piece of work, a book for electronics engineering, in general, but well suited and excellently applicable also to biomedical engineering . . . I recommend it with no reservation, congratulating the authors for the job performed. -IEEE Engineering in Medicine & Biology Describes a broad range of sensors in practical use and some circuit designs; copious information about electronic components is supplied, a matter of great value to electronic engineers. A large number of applications are supplied for each type of sensor described . . . This volume is of considerable importance.-Robotica In this new edition of their successful book, renowned authorities Ramon Pallàs-Areny and John Webster bring you up to speed on the latest advances in sensor technology, addressing both the explosive growth in the use of microsensors and improvements made in classical macrosensors. They continue to offer the only combined treatment foTrade Review"...It is sufficiently detailed to be useful to just about anyone involved with sensor development and implementation..." (n-lux.net, 4 February 2003)Table of ContentsIntroduction to Sensor-Based Measurement Systems. Resistive Sensors. Signal Conditioning for Resistive Sensors. Reactance Variation and Electromagnetic Sensors. Signal Conditioning for Reactance Variation Sensors. Self-Generating Sensors. Signal Conditioning for Self-Generating Sensors. Digital and Intelligent Sensors. Other Sensing Methods. Appendix. Index.

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Book SynopsisA cutting-edge guide to the theory and practice of high-speed digital system design An understanding of high-speed interconnect phenomena is essential for digital designers who must deal with the challenges posed by the ever-increasing operating speeds of today''s microprocessors. This book provides a much-needed, practical guide to the state of the art of modern digital system design, combining easily accessible explanations with immensely useful problem-solving strategies. Written by three leading Intel engineers, High-Speed Digital System Design clarifies difficult and often neglected topics involving the effects of high frequencies on digital buses and presents a variety of proven techniques and application examples. Extensive appendices, formulas, modeling techniques as well as hundreds of figures are also provided. Coverage includes: * A thorough introduction to the digital aspects of basic transmission line theory * Crosstalk and nonideal transmissTrade Review"...an excellent guidebook for interconnect design...this very valuable work is highly recommended for design engineers and recent graduates struggling to transition from theory to real-world design." (Choice, Vol. 38, No. 8, April 2001) "This is an excellent book for anyone who has basic circuit theory knowledge.... It is a recommended book for all academic engineering libraries and would, also, be useful for the practicing engineer." (E-Streams, Vol. 4, No. 8, August 2001)Table of ContentsPreface. 1. The Importance of Interconnect Design. 1.1 The Basics. 1.2 The Past and the Future. 2. Ideal Transmission Line Fundamentals. 2.1 Transmission Line Structures on a PCB or MCM. 2.2 Wave Propagation. 2.3 Transmission Line Parameters. 2.3.1 Characteristic Impedance. 2.3.2 Propagation Velocity, Time, and Distance. 2.3.3 Equivalent Circuit Models for SPICE Simulation. 2.4 Launching Initial Wave and Transmission Line Reflections. 2.4.1 Initial Wave. 2.4.2 Multiple Reflections. 2.4.3 Effect of Rise Time on Reflections. 2.4.4 Reflections From Reactive Loads. 2.4.5 Termination Schemes to Eliminate Reflections. 2.5 Additional Examples. 2.5.1 Problem. 2.5.2 Goals. 2.5.3 Calculating the Cross-Sectional Geometry of the PCB. 2.5.4 Calculating the Propagation Delay. 2.5.5 Determining the Wave Shape Seen at the Receiver. 2.5.6 Creating an Equivalent Circuit. 3. Crosstalk. 3.1 Mutual Inductance and Mutual Capacitance. 3.2 Inductance and Capacitance Matrix. 3.3 Field Simulators. 3.4 Crosstalk-Induced Noise. 3.5 Simulating Crosstalk Using Equivalent Circuit Models. 3.6 Crosstalk-Induced Flight Time and Signal Integrity Variations. 3.6.1 Effect of Switching Patterns on Transmission Line Performance. 3.6.2 Simulating Traces in a Multiconductor System Using a Single-Line Equivalent Model. 3.7 Crosstalk Trends. 3.8 Termination of Odd- and Even-Mode Transmission Line Pairs. 3.8.1 Pi Termination Network. 3.8.2 T Termination Network. 3.9 Minimization of Crosstalk. 3.10 Additional Examples. 3.10.1 Problem. 3.10.2 Goals. 3.10.3 Determining the Maximum Crosstalk-Induced Impedance and Velocity Swing. 3.10.4 Determining if Crosstalk Will Induce False Triggers. 4. Nonideal Interconnect Issues. 4.1 Transmission Line Losses. 4.1.1 Conductor DC Losses. 4.1.2 Dielectric DC Losses. 4.1.3 Skin Effect. 4.1.4 Frequency-Dependent Dielectric Losses. 4.2 Variations in the Dielectric Constant. 4.3 Serpentine Traces. 4.4 Intersymbol Interference. 4.5 Effects of 90 Bends. 4.6 Effect of Topology. 5. Connectors, Packages, and Vias. 5.1 Vias. 5.2 Connectors. 5.2.1 Series Inductance. 5.2.2 Shunt Capacitance. 5.2.3 Connector Crosstalk. 5.2.4 Effects of Inductively Coupled Connector Pin Fields. 5.2.5 EMI. 5.2.6 Connector Design Guidelines. 5.3 Chip Packages. 5.3.1 Common Types of Packages. 5.3.2 Creating a Package Model. 5.3.3 Effects of a Package. 5.3.4 Optimal Pin-Outs. 6. Nonideal Return Paths, Simultaneous Switching Noise, and Power Delivery. 6.1 Nonideal Current Return Paths. 6.1.1 Path of Least Inductance. 6.1.2 Signals Traversing a Ground Gap. 6.1.3 Signals That Change Reference Planes. 6.1.4 Signals Referenced to a Power or a Ground Plane. 6.1.5 Other Nonideal Return Path Scenarios. 6.1.6 Differential Signals. 6.2 Local Power Delivery Networks. 6.2.1 Determining the Local Decoupling Requirements for High-Speed I/O. 6.2.2 System-Level Power Delivery. 6.2.3 Choosing a Decoupling Capacitor. 6.2.4 Frequency Response of a Power Delivery System. 6.3 SSO/SSN. 6.3.1 Minimizing SSN. 7. Buffer Modeling. 7.1 Types of Models. 7.2 Basic CMOS Output Buffer. 7.2.1 Basic Operation. 7.2.2 Linear Modeling of the CMOS Buffer. 7.2.3 Behavioral Modeling of the Basic CMOS Buffer. 7.3 Output Buffers That Operate in the Saturation Region. 7.4 Conclusions. 8. Digital Timing Analysis. 8.1 Common-Clock Timing. 8.1.1 Common-Clock Timing Equations. 8.2 Source Synchronous Timing. 8.2.1 Source Synchronous Timing Equations. 8.2.2 Deriving Source Synchronous Timing Equations from an Eye Diagram. 8.2.3 Alternative Source Synchronous Schemes. 8.3 Alternative Bus Signaling Techniques. 8.3.1 Incident Clocking. 8.3.2 Embedded Clock. 9. Design Methodologies. 9.1 Timings. 9.1.1 Worst-Case Timing Spreadsheet. 9.1.2 Statistical Spreadsheets. 9.2 Timing Metrics, Signal Quality Metrics, and Test Loads. 9.2.1 Voltage Reference Uncertainty. 9.2.2 Simulation Reference Loads. 9.2.3 Flight Time. 9.2.4 Flight-Time Skew. 9.2.5 Signal Integrity. 9.3 Design Optimization. 9.3.1 Paper Analysis. 9.3.2 Routing Study. 9.4 Sensitivity Analysis. 9.4.1 Initial Trend and Significance Analysis. 9.4.2 Ordered Parameter Sweeps. 9.4.3 Phase 1 Solution Space. 9.4.4 Phase 2 Solution Space. 9.4.5 Phase 3 Solution Space. 9.5 Design Guidelines. 9.6 Extraction. 9.7 General Rules of Thumb to Follow When Designing a System. 10. Radiated Emissions Compliance and System Noise Minimization. 10.1 FCC Radiated Emission Specifications. 10.2 Physical Mechanisms of Radiation. 10.2.1 Differential-Mode Radiation. 10.2.2 Common-Mode Radiation. 10.2.3 Wave Impedance. 10.3 Decoupling and Choking. 10.3.1 High-Frequency Decoupling at the System Level. 10.3.2 Choking Cables and Localized Power and Ground Planes. 10.3.3 Low-Frequency Decoupling and Ground Isolation. 10.4 Additional PCB Design Criteria, Package Considerations, and Pin-Outs. 10.4.1 Placement of High-Speed Components and Traces. 10.4.2 Crosstalk. 10.4.3 Pin Assignments and Package Choice. 10.5 Enclosure (Chassis) Considerations. 10.5.1 Shielding Basics. 10.5.2 Apertures. 10.5.3 Resonances. 10.6 Spread Spectrum Clocking. 11. High-Speed Measurement Techniques. 11.1 Digital Oscilloscopes. 11.1.1 Bandwidth. 11.1.2 Sampling. 11.1.3 Other Effects. 11.1.4 Statistics. 11.2 Time-Domain Reflectometry. 11.2.1 TDR Theory. 11.2.2 Measurement Factors. 11.3 TDR Accuracy. 11.3.1 Launch Parasitics. 11.3.2 Probe Types. 11.3.3 Reflections. 11.3.4 Interface Transmission Loss. 11.3.5 Cable Loss. 11.3.6 Amplitude Offset Error. 11.4 Impedance Measurement. 11.4.1 Accurate Characterization of Impedance. 11.4.2 Measurement Region in TDR Impedance Profile. 11.5 Odd- and Even-Mode Impedance. 11.6 Crosstalk Noise. 11.7 Propagation Velocity. 11.7.1 Length Difference Method. 11.7.2 Y-Intercept Method. 11.7.3 TDT Method. 11.8 Vector Network Analyzer. 11.8.1 Introduction to S Parameters. 11.8.2 Equipment. 11.8.3 One-Port Measurements (ZO,L,C). 11.8.4 Two-Port Measurements (Td, Attenuation, Crosstalk). 11.8.5 Calibration. 11.8.6 Calibration for One-Port Measurements. 11.8.7 Calibration for Two-Port Measurements. 11.8.8 Calibration Verification. Appendix A: Alternative Characteristic Impedance Formulas. A.1 Microstrip. A.2 Symmetric Stripline. A.3 Offset Stripline. Appendix B: GTL Current-Mode Analysis. B.1 Basic GTL Operation. B.2 GTL Transitions When a Middle Agent Is Driving. B.3 GTL Transitions When an End Agent With a Termination Is Driving. B.4 Transitions When There is a Pull-Up at the Middle Agent. Appendix C: Frequency-Domain Components in a Digital Signal. Appendix D: Useful S-Parameter Conversions. D.1 ABCD, Z, and Y Parameters. D.2 Normalizing the S Matrix to a Different Characteristic Impedance. D.3 Derivation of the Formulas Used to Extract the Mutual Inductance and Capacitance from a Short Structure Using S21 Measurements. D.4 Derivation of the Formula to Extract Skin Effect Resistance from a Transmission Line. Appendix E: Definition of the Decibel. Appendix F: FCC Emission Limits. Bibliography. Index.

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Book Synopsis* Introduces the operational amplifier early, and uses it as a basic element throughout the book. * Provides numerous exercises and examples throughout. * Written in a clear, precise style that has been highly praised throughout many editions. .

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Book SynopsisKalman filtering is a well-established topic in the field of control and signal processing and represents by far the most refined method for the design of neural networks. This book takes a nontraditional nonlinear approach and reflects the fact that most practical applications are nonlinear.Trade Review"Although the traditional approach to the subject is usually linear, this book recognizes and deals with the fact that real problems are most often nonlinear." (SciTech Book News, Vol. 25, No. 4, December 2001)Table of ContentsPreface. Contributors. Kalman Filters (S. Haykin). Parameter-Based Kalman Filter Training: Theory and Implementaion (G. Puskorius and L. Feldkamp). Learning Shape and Motion from Image Sequences (G. Patel, et al.). Chaotic Dynamics (G. Patel and S. Haykin). Dual Extended Kalman Filter Methods (E. Wan and A. Nelson). Learning Nonlinear Dynamical System Using the Expectation-Maximization Algorithm (S. Roweis and Z. Ghahramani). The Unscencted Kalman Filter (E. Wan and R. van der Merwe). Index.

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Book SynopsisRadio-Frequency Integrated-Circuit Engineering addresses the theory, analysis and design of passive and active RFIC''s using Si-based CMOS and Bi-CMOS technologies, and other non-silicon based technologies. The materials covered are self-contained and presented in such detail that allows readers with only undergraduate electrical engineering knowledge in EM, RF, and circuits to understand and design RFICs. Organized into sixteen chapters, blending analog and microwave engineering, Radio-Frequency Integrated-Circuit Engineering emphasizes the microwave engineering approach for RFICs. * Provides essential knowledge in EM and microwave engineering, passive and active RFICs, RFIC analysis and design techniques, and RF systems vital for RFIC students and engineers * Blends analog and microwave engineering approaches for RFIC design at high frequencies * Includes problems at the end of each chapterTable of ContentsPreface xvii 1 Introduction 1 Problems 5 2 Fundamentals of Electromagnetics 6 2.1 EM Field Parameters 6 2.2 Maxwell’s Equations 7 2.3 Auxiliary Relations 8 2.3.1 Constitutive Relations 8 2.3.2 Current Relations 9 2.4 Sinusoidal Time-Varying Steady State 9 2.5 Boundary Conditions 10 2.5.1 General Boundary Conditions 11 2.5.2 Specific Boundary Conditions 11 2.6 Wave Equations 12 2.7 Power 13 2.8 Loss and Propagation Constant in Medium 14 2.9 Skin Depth 16 2.10 Surface Impedance 17 Problems 19 3 Lumped Elements 20 3.1 Fundamentals of Lumped Elements 20 3.1.1 Basic Equations 23 3.2 Quality Factor of Lumped Elements 28 3.3 Modeling of Lumped Elements 30 3.4 Inductors 32 3.4.1 Inductor Configurations 32 3.4.2 Loss in Inductors 36 3.4.3 Equivalent-Circuit Models of Inductors 39 3.4.4 Resonance in Inductors 45 3.4.5 Quality Factor of Inductors 46 3.4.6 High Q Inductor Design Considerations 51 3.5 Lumped-Element Capacitors 60 3.5.1 Capacitor Configurations 60 3.5.2 Equivalent-Circuit Models of Capacitors 63 3.5.3 Resonance 68 3.5.4 Quality Factor 69 3.5.5 High Q Capacitor Design Considerations 71 3.6 Lumped-Element Resistors 72 3.6.1 Resistor Configurations 72 3.6.2 Basic Resistor Equations 72 3.6.3 Equivalent-Circuit Models of Resistors 75 References 75 Problems 76 4 Transmission Lines 85 4.1 Essentials of Transmission Lines 85 4.2 Transmission-Line Equations 86 4.2.1 General Transmission-Line Equations 86 4.2.2 Sinusoidal Steady-State Transmission-Line Equations 91 4.3 Transmission-Line Parameters 93 4.3.1 General Transmission Lines 93 4.3.2 Lossless Transmission Lines 96 4.3.3 Low Loss Transmission Lines 96 4.4 Per-Unit-Length Parameters R,L,C, and G 97 4.4.1 General Formulation 97 4.4.2 Formulation for Simple Transmission Lines 104 4.5 Dielectric and Conductor Losses in Transmission Lines 107 4.5.1 Dielectric Attenuation Constant 108 4.5.2 Conductor Attenuation Constant 109 4.6 Dispersion and Distortion in Transmission Lines 111 4.6.1 Dispersion 111 4.6.2 Distortion 111 4.6.3 Distortion-Less Transmission Lines 113 4.7 Group Velocity 115 4.8 Impedance, Reflection Coefficients, and Standing-Wave Ratios 117 4.8.1 Impedance 117 4.8.2 Reflection Coefficients 119 4.8.3 Standing-Wave Ratio 120 4.8.4 Perfect Match and Total Reflection 122 4.8.5 Lossless Transmission Lines 123 4.9 Synthetic Transmission Lines 126 4.10 Tem and Quasi-Tem Transmission-Line Parameters 128 4.10.1 Static or Quasi-Static Analysis 129 4.10.2 Dynamic Analysis 130 4.11 Printed-Circuit Transmission Lines 132 4.11.1 Microstrip Line 133 4.11.2 CoplanarWaveguide 135 4.11.3 Coplanar Strips 138 4.11.4 Strip Line 139 4.11.5 Slot Line 141 4.11.6 Field Distributions 142 4.12 Transmission Lines in RFICs 144 4.12.1 Microstrip Line 145 4.12.2 CoplanarWaveguide 146 4.12.3 Coplanar Strips 149 4.12.4 Strip Line 149 4.12.5 Slot Line 150 4.12.6 Transitions and Junctions Between Transmission Lines 150 4.13 Multi-Conductor Transmission Lines 152 4.13.1 Transmission-Line Equations 152 4.13.2 Propagation Modes 156 4.13.3 Characteristic Impedance and Admittance Matrix 157 4.13.4 Mode Characteristic Impedances and Admittances 159 4.13.5 Impedance and Admittance Matrix 161 4.13.6 Lossless Multiconductor Transmission Lines 163 References 173 Problems 174 Appendix 4: Transmission-Line Equations Derived From Maxwell’s Equations 182 5 Resonators 186 5.1 Fundamentals of Resonators 186 5.1.1 Parallel Resonators 187 5.1.2 Series Resonators 188 5.2 Quality Factor 189 5.2.1 Parallel Resonators 190 5.2.2 Series Resonators 193 5.2.3 Unloaded Quality Factor 195 5.2.4 Loaded Quality Factor 195 5.2.5 Evaluation of and Relation between Unloaded and Loaded Quality Factors 198 5.3 Distributed Resonators 205 5.3.1 Quality-Factor Characteristics 206 5.3.2 Transmission-Line Resonators 207 5.3.3 Waveguide Cavity Resonators 216 5.4 Resonator’s Slope Parameters 231 5.5 Transformation of Resonators 231 5.5.1 Impedance and Admittance Inverters 231 5.5.2 Examples of Resonator Transformation 236 References 237 Problems 238 6 Impedance Matching 244 6.1 Basic Impedance Matching 244 6.1.1 Smith Chart 244 6.2 Design of Impedance-Matching Networks 248 6.2.1 Impedance-Matching Network Topologies 249 6.2.2 Impedance Transformation through Series and Shunt Inductor and Capacitor 249 6.2.3 Examples of Impedance-Matching Network Design 252 6.2.4 Transmission-Line Impedance-Matching Networks 255 6.3 Kuroda Identities 262 References 266 Problems 266 7 Scattering Parameters 271 7.1 Multiport Networks 271 7.2 Impedance Matrix 273 7.3 Admittance Matrix 274 7.4 Impedance and Admittance Matrix in RF Circuit Analysis 274 7.4.1 T-Network Representation of Two-Port RF Circuits 275 7.4.2 π-Network Representation of Two-Port RF Circuits 278 7.5 Scattering Matrix 279 7.5.1 Fundamentals of Scattering Matrix 279 7.5.2 Examples for Scattering Parameters 287 7.5.3 Effect of Reference-Plane Change on Scattering Matrix 288 7.5.4 Return Loss, Insertion Loss, and Gain 290 7.6 Chain Matrix 293 7.7 Scattering Transmission Matrix 294 7.8 Conversion between Two-Port Parameters 295 7.8.1 Conversion from [Z] to [ABCD] 295 References 298 Problems 298 8 RF Passive Components 304 8.1 Characteristics of Multiport RF Passive Components 304 8.1.1 Characteristics of Three-Port Components 304 8.1.2 Characteristics of Four-Port Components 309 8.2 Directional Couplers 311 8.2.1 Fundamentals of Directional Couplers 311 8.2.2 Parallel-Coupled Directional Couplers 313 8.3 Hybrids 326 8.3.1 Hybrid T 326 8.3.2 Ring Hybrid 328 8.3.3 Branch-Line Coupler 335 8.4 Power Dividers 339 8.4.1 Even-Mode Analysis 340 8.4.2 Odd-Mode Analysis 342 8.4.3 Superimposition of Even and Odd Modes 343 8.5 Filters 345 8.5.1 Low Pass Filter 345 8.5.2 High Pass Filter Design 357 8.5.3 Band-Pass Filter Design 359 8.5.4 Band-Stop Filter Design 361 8.5.5 Filter Design Using Impedance and Admittance Inverters 364 References 371 Problems 372 9 Fundamentals of CMOS Transistors For RFIC Design 379 9.1 MOSFET Basics 379 9.1.1 MOSFET Structure 379 9.1.2 MOSFET Operation 382 9.2 MOSFET Models 386 9.2.1 Physics-Based Models 387 9.2.2 Empirical Models 387 9.2.3 SPICE Models 402 9.2.4 Passive MOSFET Models 404 9.3 Important MOSFET Frquencies 407 9.3.1 fT 408 9.3.2 fmax 408 9.4 Other Important MOSFET Parameters 409 9.5 Varactor Diodes 409 9.5.1 Varactor Structure and Operation 409 9.5.2 Varactor Model and Characteristics 410 References 412 Problems 412 10 Stability 418 10.1 Fundamentals of Stability 418 10.2 Determination of Stable and Unstable Regions 421 10.3 Stability Consideration for N-Port Circuits 427 References 427 Problems 428 11 Amplifiers 430 11.1 Fundamentals of Amplifier Design 430 11.1.1 Power Gain 430 11.1.2 Gain Design 433 11.2 Low Noise Amplifiers 443 11.2.1 Noise Figure Fundamentals 443 11.2.2 MOSFET Noise Parameters 446 11.2.3 Noise Figure of Multistage Amplifiers 447 11.2.4 Noise-Figure Design 448 11.2.5 Design for Gain and Noise Figure 450 11.3 Design Examples 451 11.3.1 Unilateral Amplifier Design 451 11.3.2 Bilateral Amplifier Design 454 11.4 Power Amplifiers 455 11.4.1 Power-Amplifier Parameters 455 11.4.2 Power-Amplifier Types 458 11.5 Balanced Amplifiers 470 11.5.1 Differential Amplifiers 470 11.5.2 Ninety-Degree Balanced Amplifiers 485 11.5.3 Push–Pull Amplifiers 487 11.6 Broadband Amplifiers 489 11.6.1 Compensated Matching Networks 489 11.6.2 Distributed Amplifiers 490 11.6.3 Feedback Amplifiers 523 11.6.4 Cascoded Common-Source Amplifiers 540 11.7 Current Mirrors 548 11.7.1 Basic Current Mirror 550 11.7.2 Cascode Current Mirror 550 References 552 Problems 553 A11.1 Fundamentals of Signal Flow Graph 563 A11.2 Signal Flow Graph of Two-Port Networks 563 A11.2.1 Transistor’s Signal Flow Graph 563 A11.2.2 Input Matching Network’s Signal Flow Graph 564 A11.2.3 Output Matching Network’s Signal Flow Graph 565 A11.2.4 Signal Flow Graph of the Composite Two-Port Network 566 A11.3 Derivation of Network’s Parameters Using Signal Flow Graphs 566 A11.3.1 Examples of Derivation 567 A11.3.2 Derivation of Reflection Coefficients and Power Gain 568 References 571 12 Oscillators 572 12.1 Principle of Oscillation 572 12.1.1 Oscillation Conditions 573 12.1.2 Oscillation Determination 574 12.2 Fundamentals of Oscillator Design 575 12.2.1 Basic Oscillators 576 12.2.2 Feedback Oscillators 579 12.3 Phase Noise 587 12.3.1 Fundamentals of Phase Noise 588 12.3.2 Phase Noise Modeling 593 12.3.3 Low Phase-Noise Design Consideration 599 12.3.4 Effects of Phase Noise on Systems 599 12.3.5 Analysis Example of Effects of Phase Noise 601 12.4 Oscillator Circuits 602 12.4.1 Cross-Coupled Oscillators 602 12.4.2 Distributed Oscillators 612 12.4.3 Push-Push Oscillators 617 References 626 Problems 627 13 Mixers 633 13.1 Fundamentals of Mixers 633 13.1.1 Mixing Principle 633 13.1.2 Mixer Parameters 636 13.2 Mixer Types 641 13.2.1 Single-Ended Mixer 642 13.2.2 Single-Balanced Mixer 642 13.2.3 Double-Balanced Mixer 646 13.2.4 Doubly Double-Balanced Mixer 649 13.3 Other Mixers 650 13.3.1 Passive Mixer 650 13.3.2 Image-Reject Mixer 651 13.3.3 Quadrature Mixer 652 13.3.4 Distributed Mixer 652 13.4 Mixer Analysis and Design 656 13.4.1 Switching Mixer Fundamental 656 13.4.2 Single-Ended Mixer 658 13.4.3 Single-Balanced Mixer 661 13.4.4 Double-Balanced Mixer 663 13.4.5 Source Degeneration in Mixer Design 665 13.5 Sampling Mixer 667 13.5.1 Fundamentals of Sampling 668 13.5.2 Sampling Theory 669 13.5.3 Sampling Process 670 13.5.4 Sample and Hold 673 13.5.5 Sampling Switch 678 13.5.6 Integrated Sampling Mixer 678 References 689 Problems 690 14 Switches 694 14.1 Fundamentals of Switches 694 14.1.1 Switch Operation 694 14.1.2 Important Parameters 695 14.2 Analysis of Switching MOSFET 697 14.2.1 Analysis of Shunt Transistor 697 14.2.2 Analysis of Series Transistor 698 14.2.3 Analysis of Combined Series and Shunt Transistors 699 14.2.4 Selection of MOSFET 699 14.2.5 Design Consideration for Improved Insertion Loss and Isolation 701 14.3 SPST Switches 702 14.3.1 SPST Switch Employing Two Parallel MOSFETs 702 14.3.2 SPST Switch Employing Two Series MOSFETs 703 14.3.3 SPST Switch Employing Two Series and Two Shunt MOSFETs 703 14.3.4 SPST Switch Using Impedance or Admittance Inverters 703 14.4 SPDT Switches 712 14.4.1 SPDT Switch Topologies 712 14.4.2 SPDT Switch Analysis 713 14.5 Ultra-Wideband Switches 714 14.5.1 Ultra-Wideband SPST Switch 715 14.5.2 Ultra-Wideband T/R Switch 721 14.6 Ultra-High-Isolation Switches 727 14.6.1 Ultra-High-Isolation Switch Architecture and Analysis 727 14.6.2 Ultra-High-Isolation SPST Switch Design 733 14.7 Filter Switches 737 References 739 Problems 739 15 RFIC Simulation, Layout, and Test 747 15.1 RFIC Simulation 748 15.1.1 DC Simulation 749 15.1.2 Small-Signal AC Simulation 749 15.1.3 Transient Simulation 749 15.1.4 Periodic Steady State Simulation 749 15.1.5 Harmonic-Balance Simulation 750 15.1.6 Periodic Distortion Analysis 751 15.1.7 Envelope Simulation 751 15.1.8 Periodic Small Signal Analysis 751 15.1.9 EM Simulation 751 15.1.10 Statistical and Mismatch Simulation 754 15.2 RFIC Layout 754 15.2.1 General Layout Issues 754 15.2.2 Passive and Active Component Layout 755 15.3 RFIC Measurement 758 15.3.1 On-Wafer Measurement 759 15.3.2 Off-Chip Measurement 782 References 784 Problems 784 16 Systems 788 16.1 Fundamentals of Systems 788 16.1.1 Friis Transmission Equation 788 16.1.2 System Equation 790 16.1.3 Signal-to-Noise Ratio of System 791 16.1.4 Receiver Sensitivity 793 16.1.5 System Performance Factor 794 16.1.6 Power 796 16.1.7 Angle and Range Resolution 797 16.1.8 Range Accuracy 800 16.2 System Type 801 16.2.1 Pulse System 801 16.2.2 FMCW System 803 16.2.3 Receiver Architectures 808 References 826 Problems 826 Appendix: RFIC Design Example: Mixer 830 A1.1 Circuit Design Specifications and General Design Information 830 A1.2 Mixer Design 830 A1.2.1 Single-Ended to Differential Input Active Balun 832 A1.2.2 Double-Balanced Gilbert Cell 832 A1.2.3 Differential to Single-Ended Output Active Balun 834 A1.2.4 Band-Pass Filter 834 A1.3 Mixer Optimization and Layout 835 A1.4 Simulation Results 836 A1.4.1 Stability 836 A1.4.2 Return Loss 836 A1.4.3 Conversion Gain 836 A1.4.4 Noise Figure 837 A1.4.5 Other Mixer Performance 837 A1.5 Measured Results 838 References 840 Index 841

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Book SynopsisThis new edition of the popular guide to telecommunications circuit design offers the same comprehensive coverage found in the first edition, but now features additional sections on mobile and wireless phones and pagers, compact antennas, switches, power amplifiers, and TDMA and CDMA modulation schemes.Trade Review"...useful as a reference for beginning students...and for self-study..." (IEEE Circuits & Devices Magazine, May 2003)Table of ContentsPreface. Chapter One. The Hstory of Telecommunications. Chapter Two. Amplitude Modulated Radio Transmitter. Chapter Three. The Amplitude-Modulated Radio Receiver. Chapter Four. Frequency Modulated Radio Transmitter. Chapter Five. The Frequency Modulated Radio Receiver. Chapter Six. The Television Transmitter. Chapter Seven. The Television Receiver. Chapter Eight. The Telephone Network. Chapter Nine. Signal Processing in the Telephone System. Chapter Ten. The Facsimile Machine. Chapter Eleven. Personal Wireless Communication System. Chapter Twelve. Telecommunication Transmission Media. Appendix A. The Transformer. Appendix B. Designation of Frequencies. Appendix C. The Electromagnetic Spectrum. Appendix D. The Modified Huffman Data Compression Code. Appendix E. Electronic Memory. Appendix F. Binary Coded Decimal to Seven-Segment Decoder. Index.

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Book Synopsis* Builds on the success of the first Razavi book, covering the most recent developments in phase-locked loop technology* Will include an introductory "tutorial" chapter composed by the editor which will outline and explain in brief the recent advances in PLL design. .Table of ContentsPreface. About the Author. Part I: Original Contributions. Devices and Circuits for Phase-Locked Systems. Delay-Locked Loops - An Overview. Delta-Sigma Fractional-N Phase-Locked Loops. Design Bang-Bang PLLs for Clock and Data Recovery in Serial Data Transmission Systems. Predicting the Phase Noise and Jitter of PLL-Based Frequency Synthesizers. Part II: Devices. Physics-Based Closed-Form Inductance Expression for Compact Modeling of Integrated Spiral Inductors. The Modeling, Characterization, and Design of Monolithic Inductors for Silicon RF IC's. Analysis, Design, and Optimization of Spiral Inductors and Transformers for Si RF IC's. Stacked Inductors and Transformers in CMOS Technology. Estimation Methods for Quality Factors of Inductors Fabricated in Silicon Integrated Circuit Process Technologies. A Q-Factor Enhancement Technique for MMIC Inductors. On-Chip Spiral Inductors with Patterned Ground Shields for Si-Based RF IC's. The Effects of a Ground Shield on the Characteristics and Performance of Spiral Inductors. Temperature Dependence of Q and Inductance in Spiral Inductors Fabricated in a Silicon-Germanium/BiCMOS Technology. Substrate Noise Coupling Through Planar Spiral Inductor. Design of High-Q Varactors for Low-Power Wireless Applications Using a Standard CMOS Process. On the Use of MOS Varactors in RF VCO's. Part III: Phase Noise and Jitter. Low-Noise Voltage-Controlled Oscillators Using Enhanced LC-Tanks. A Study of Phase Noise in CMOS Oscillators. A General Theory of Phase Noise in Electrical Oscillators. Physical Processes of Phase Noise in Differential LC Oscillators. Phase Noise in LC Oscillators. The Effect of Varactor Nonlinearity on the Phase Noise of Completely Integrated VCOs. Jitter in Ring Oscillators. Jitter and Phase Noise in Ring Oscillators. A Study of Oscillator Jitter Due to Supply and Substrate Noise. Measurements and Analysis of PLL Jitter Caused by Digital Switching Noise. On-Chip Measurement of the Jitter Transfer Function of Charge-Pump Phase-Locked Loops. Part IV: Building Blocks. A Low-Noise, Low-Power VCO with Automatic Amplitude Control for Wireless Applications. A Fully Integrated VCO at 2 GHz. Tail Current Noise Suppression in RF CMOS VCOs. Low-Power Low-Phase-Noise Differentially Tuned Quadrature VCO Design in Standard CMOS. Analysis and Design of an Optimally Coupled 5-GHz Quadrature LC Oscillator. A 1.57-GHz Fully Integrated Very Low-Phase-Noise Quadrature VCO. A Low-Phase-Noise 5GHz Quadrature CMOS VCO Using Common-Mode Inductive Coupling. An Integrated 10/5GHz Injection-Locked Quadrature LC VCO in a 0.18[mu]m Digital CMOS Process. Rotary Traveling-Wave Oscillator Arrays: A New Clock Technology. 35-GHz Static and 48-GHz Dynamic Frequency Divider IC's Using 0.2-[mu]m AlGaAs/GaAs-HEMT's. Superharmonic Injection-Locked Frequency Dividers. A Family of Low-Power Truly Modular Programmable Dividers in Standard 0.35-[mu]m CMOS Technology. A 1.75-GHz/3-V Dual-Modulus Divide-by-128/129 Prescaler in 0.7-[mu]m CMOS. A 1.2 GHz CMOS Dual-Modulus Prescaler Using New Dynamic D-Type Flip-Flops. High-Speed Architecture for a Programmable Frequency Divider and a Dual-Modulus Prescaler. A 1.6-GHz Dual Modulus Prescaler Using the Extended True-Single-Phase-Clock CMOS Circuit Technique (E-TSPC). A Simple Precharged CMOS Phase Frequency Detector. Part V: Clock Generation by PLLs and DLLs. A 320 MHz, 1.5 mW @ 1.35 V CMOS PLL for Microprocessor Clock Generation. A Low Jitter 0.3-165 MHz CMOS PLL Frequency Synthesizer for 3 V/5 V Operation. Low-Jitter Process-Independent DLL and PLL Based on Self-Biased Techniques. A Low-Jitter PLL Clock Generator for Microprocessors with Lock Range of 340-612 MHz. A 960-Mb/s/pin Interface for Skew-Tolerant Bus Using Low Jitter PLL. Active GHz Clock Network Using Distributed PLLs. A Low-Noise Fast-Lock Phase-Locked Loop with Adaptive Bandwidth Control. A Low-Jitter 125-1250-MHz Process-Independent and Ripple-Poleless 0.18-[mu]m CMOS PLL Based on a Sample-Reset Loop Filter. A Dual-Loop Delay-Locked Loop Using Multiple Voltage-Controlled Delay Lines. An All-Analog Multiphase Delay-Locked Loop Using a Replica Delay Line for Wide-Range Operation and Low-Jitter Performance. A Semidigital Dual Delay-Locked Loop. A Wide-Range Delay-Locked Loop with a Fixed Latency of One Clock Cycle. A Portable Digital DLL for High-Speed CMOS Interface Circuits. CMOS DLL-Base 2-V 3.2-ps Jitter 1-GHz Clock Synthesizer and Temperature-Compensated Tunable Oscillator. A 1.5V 86 mW/ch 8-Channel 622-3125-Mb/s/ch CMOS SerDes Macrocell with Selectable Mux/Demux Ratio. A Register-Controlled Symmetrical DLL for Double-Data-Rate DRAM. A Low-Jitter Wide-Range Skew-Calibrated Dual-Loop DLL Using Antifuse Circuitry for High-Speed DRAM. Part VI: RF Synthesis. An Adaptive PLL Tuning System Architecture Combining High Spectral Purity and Fast Settling Time. A 2-V 900-MHz Monolithic CMOS Dual-Loop Frequency Synthesizer for GSM Receivers. A CMOS Frequency Synthesizer with an Injection-Locked Frequency Divider for a 5-GHz Wireless LAN Receiver. A 2.6-GHz/5.2-GHz Frequency Synthesizer in 0.4-[mu]m CMOS Technology. Fast Switching Frequency Synthesizer with a Discriminator-Aided Phase Detector. Low-Power Dividerless Frequency Synthesis Using Aperture Phase Detection. A Stabilization Technique for Phase-Locked Frequency Synthesizers. A Modeling Approach for [Sigma]-[Delta] Fractional-N Frequency Synthesizers Allowing Straightforward Noise Analysis. A Fully Integrated CMOS Frequency Synthesizer with Charge-Averaging Charge Pump and Dual-Path Loop Filter for PCS- and Cellular-CDMA Wireless Systems. A 1.1-GHz CMOS Fraction-N Frequency Synthesizer With a 3-b Third-Order [Sigma]-[Delta] Modulator. A 1.8-GHz Self-Calibrated Phase-Locked Loop with Precise I/Q Matching. A 27-mW CMOS Fractional-N Synthesizer Using Digital Compensation for 2.5-Mb/s GFSK Modulation. A CMOS Monolothic [Sigma][Delta]-Controlled Fractional-N Frequency Synthesizer for DSC-1800. Part VII: Clock and Data Recovery. A 2.5-Gb/s Clock and Data Recovery IC with Tunable Jitter Characteristics for Use in LAN's and WAN's. Clock/Data Recovery PLL Using Half-Frequency Clock. A 0.5-[mu]m CMOS 4.0-Gbit/s Serial Link Transceiver with Data Recovery Using Oversampling. A 2-1600-MHz CMOS Clock Recovery PLL with Low-Vdd Capability. SiGe Clock and Data Recovery IC with Linear-Type PLL for 10-Gb/s SONET Application. A Fully Integrated SiGe Receiver IC for 10-Gb/s Data Rate. A 10-Gb/s CMOS Clock and Data Recovery Circuit with a Half-Rate Linear Phase Detector. A 10-Gb/s CMOS Clock and Data Recovery Circuit with Frequency Detection. A 10-Gb/s CDR/DEMUX with LC Delay Line VCO in 0.18[mu]m CMOS. A 40-Gb/s Integrated Clock and Data Recovery Circuit in a 50-GHz f[subscript T] Silicon Bipolar Technology. A Fully Integrated 40-Gb/s Clock and Data Recovery IC With 1:4 DEMUX in SiGe Technology. Clock and Data Recovery IC for 40-Gb/s Fiber-Optic Receiver. Index.

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Book Synopsis* Examines the various methods available for circuit protection, including coverage of the newly developed ESD circuit protection schemes for VLSI circuits. * Provides guidance on the implementation of circuit protection measures. * Includes new sections on ESD design rules, layout approaches, package effects, and circuit concepts. * Reviews the new Charged Device Model (CDM) test method and evaluates design requirements necessary for circuit protection.Table of ContentsPreface 1. Introduction Background The ESD Problem Protecting against ESD Outline of the Book 2. ESD Phenomenon Introduction Electrostatic Voltage Discharge ESD Stress Models 3. Test Methods Introduction Human Body Model (HBM) Machine Model (MM) Charged Device Model (CDM) Socket Device Model (SDM) Metrology, Calibration, Verification Transmission Line Pulsing (TLP) Failure Criteria Summary 4 Physics and Operation of ESD Protection Circuits Introduction Resistors Diodes Transistor Operation Transistor Operation Under ESD Conditions Electrothermal Effects SCR Operation Conclusion 5 ESD Protection Design Concepts and Strategy The Qualities of Good ESD Protection ESD Protection Design Methods Selecting an ESD Strategy Summary 6 Design and Layout Requirements Introduction Thick Field Device NMOS Transistors (FPDs) Gate-Coupled NMOS (GCNMOS) Gate Driven nMOS (GDNMOS) SCR Protection Device ESD Protection Design Synthesis Total Input Protection ESD Protection Using Diode-Based Devices Power Supply Clamps BiPolar and BiCMOS Protection Circuits Summary 7 Advanced Protection Design Introduction PNP Driven NMOS (PDNMOS) Substrate Triggered NMOS (STNMOS) NMOS Triggered NMOS (NTNMOS) ESD for Mixed Voltage I/O CDM Protection SOI Technology High Voltage Transistors BiCMOS Protection RF Designs General I/O Protection Schemes Design/layout Errors Summary 8 Failure Modes, Reliability Issues, and Case Studies Introduction Failure Mode Analysis Reliability and Performance Considerations Advanced CMOS Input Protection Optimizing the Input Protection Scheme Designs for Special Applications Process Effects on Input Protection Design Total IC Chip Protection Power Bus Protection Internal Chip ESD Damage Stress Dependent ESD Behavior Failure Mode Case Studies Summary 9 Influence of Processing on ESD Introduction High Current Behavior Cross-section of a MOS Transistor Drain-Source Implant Effects P-Well Effects N-Well Effects Epitaxial Layers and Substrates Gate Oxides Silicides Contacts Interconnect and Metallization Gate Length Dependencies Silicon-On-Insulator (SOI) Bipolar Transistors Diodes Resistors Reliability Trade-Offs Summary 10 Device Modeling of High Current Effects Introduction The Physics of ESD Damage Thermal ("Second") Breakdown Analytical Models Using the Heat Equation Electrothermal Device Simulations Conclusions Circuit Simulation Basics, Approaches, and Simulations Introduction Modeling the MOSFET Modeling Bipolar Junction Transistors Modeling Diffusion Resistors Modeling Protection Diodes Simulation of Protection Circuits Electrothermal Circuit Simulations Conclusion 12 Conclusions Long-term Relevance of ESD in ICs State-of-the-art for ESD Protection Current Limitations Future Issues

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Book SynopsisFocuses on the basic operating principles and the techniques used to incorporate the devices into circuit applications. Part one reviews fundamental principles in transmission lines and circuits as well as semiconductor physics. Two-terminal solid-state devices, circuits and applications are covered in the second section. Part three discusses three-terminal solid-state devices, circuits and applications. Introduces noise figures and system parameters for receiver design. Includes numerous examples and problems.Table of ContentsTransmission Lines and Waveguides. S Parameters and Circuit Representations. Review of Semiconductor Physics. Varactor Devices and Circuits. Detector and Mixed Devices and Circuits. Receiver Noise Figure and Dynamic Range. p-i-n Diodes and Control Devices. Oscillator and Amplifier Circuits Using Two-Terminal Devices. Transferred Electron Devices and Circuits. IMPATT Devices and Circuits. Field-Effect Transistors. Bipolar Transistors, HEMTs, and HBTs. Transistor Amplifiers. Transistor Oscillators. Transistor Mixers, Switches, Phase Shifters, and Multipliers. Appendices.

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Book SynopsisThis advanced text studies the special interactions that occur between circuits and devices, which lead to an understanding of the design and performance characteristics of solid-state microwave amplifiers and oscillators.Table of ContentsMICROWAVE CIRCUITS. Review of Transmission Lines, Waveguides, and Smith ChartAnalysis. Linear Microwave Network Parameters. Waveguide and Transmission Line Parameters. Transmission Lines as Resonators and Circuit Elements. Microwave Networks and Components. MICROWAVE SOLID-STATE DEVICES. Solid-State Theory: Special Topics. Schottky Barrier Diodes. Microwave Transistors. IMPATT Diodes. Gunn Diodes. DEVICE-CIRCUIT INTERACTION. Transistor Amplifier Properties. Two-Terminal Negative-Resistance Amplifiers. Oscillators. Noise. Appendix. Index.

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Book SynopsisTimely, authoritative, application-oriented. an in-depthexploration of current and future uses of FPGAs in digital systemsThe development of field-programmable gate arrays (FPGAs) may wellbe the most important breakthrough for the microelectronicsindustry since the invention of the microprocessor. Using FPGAs, asystem designer working on a PC can now develop a working prototypein a few hours and change it at will in just a few minutes, ratherthan waiting weeks or months for a printed-circuit assembly or acustom integrated circuit to be built. This newfound ability tochange a system by simply altering its configuration memory is alsoleading to exciting new forms of computing, such as arrayapplications that exploit parallelism. Now in a book that functionsequally well as a working professional reference and apedagogically consistent computer engineering text, John V.Oldfield and Richard C. Dorf: * Provide a detailed overview of FPGAs in digital systemsdesign * Explain the underlyTable of ContentsSystem Implementation Strategies. Review of Logic Design and Electrical Aspects. Introduction to FPGA Architecture. Design Process Flows and Software Tools. Case Studies. Computational Applications. Business Development. Recent Developments. Afterword. Glossary. Index.

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Book SynopsisApplications oriented, it contains all the pertinent and comprehensive information necessary to meet the growing demands placed upon solid-state power conversion equipment. These demands include improved reliability, increased efficiency, higher packing density, improved performance plus meeting safety and EMC regulations. Features a thorough assessment of basic electrical and magnetic aspects of power conversion as well as thermal, protection, radiation and reliability considerations. Stresses semiconductor and magnetic components and gives an analysis of diverse topologies.Table of ContentsTransient Analysis, Circuit Analysis, and Waveforms. Semiconductors, Resistors, and Capacitors. Transformers, Inductors, and Conductors. Rectifiers and Filters. Phase Control Circuits. Transistor Inverters. Thyristor Inverters. Switching Regulators. dc-dc Converters. Resonant Mode Converters. Modulator and Control Analysis. Pulse-Forming Networks and Modulators. Protection and Safety. Electromagnetic Compatibility and Grounding. Semiconductor and Equipment Cooling. Reliability and Quality. Regulated Power Supplies. Uninterruptible Power Systems. Power Factor Correction. Glossary. Index.

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Book SynopsisDevices enormously smaller than before will remodel engineering,chemistry, medicine, and computer technology. How can we understandmachines that are so small? Nanosystems covers it all: powerand strength, friction and wear, thermal noise and quantumuncertainty. This is the book for starting the next century ofengineering. - Marvin Minsky MIT Science magazine calls Eric Drexler Mr. Nanotechnology.For years, Drexler has stirred controversy by declaring thatmolecular nanotechnology will bring a sweeping technologicalrevolution - delivering tremendous advances in miniaturization,materials, computers, and manufacturing of all kinds. Now, he''swritten a detailed, top-to-bottom analysis of molecular machinery -how to design it, how to analyze it, and how to build it.Nanosystems is the first scientifically detailed description ofdevelopments that will revolutionize most of the industrialprocesses and products currently in use. This groundbreaking work draws on physics and cheTable of ContentsPHYSICAL PRINCIPLES. Classical Magnitudes and Scaling Laws. Potential Energy Surfaces. Molecular Dynamics. Positional Uncertainty. Transitions, Errors, and Damage. Energy Dissipation. Mechanosynthesis. COMPONENTS AND SYSTEMS. Nanoscale Structural Components. Mobile Interfaces and Moving Parts. Intermediate Subsystems. Nanomechanical Computational Systems. Molecular Sorting, Processing, and Assembly. Molecular Manufacturing Systems. IMPLEMENTATION STRATEGIES. Macromolecular Engineering. Paths to Molecular Manufacturing. Appendices. Afterword. Symbols, Units, and Constants. Glossary. References. Index.

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Book SynopsisCircuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book''s microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * CharacterizTable of ContentsDesign for Reliability Concepts. Starting the Design Process. Substrates. Wire and Wirebonds. Tape Automated Bonding. Flip-Chip Bonding. Attachment. Case. Leads. Lead Seals. Lid Seal and Lid. Index.

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Book SynopsisThe first book to combine all of the various topics relevant to low--cost automation. Practical approach covers methods immediately applicable to industrial problems, showing how to select the most appropriate control method for a given application, then design the necessary circuit.Table of ContentsMotion Actuators. Sensors. Introduction to Switching Theory. Industrial Switching Elements. Electric Ladder Diagrams. Sequential Systems with Random Inputs. Pneumatic Control Circuits. Miscellaneous Switching Elements and Systems. Semiflexible Automation: Hardware Programmers. Flexible Automation: Programmable Controllers. Flexible Automation: Microcomputers. Introduction to Assembly Automation. Robotics and Numerical Control. Appendices. Index.

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Book SynopsisA new and innovative paradigm for RF frequency synthesis and wireless transmitter design Learn the techniques for designing and implementing an all-digital RF frequency synthesizer. In contrast to traditional RF techniques, this innovative book sets forth digitally intensive design techniques that lead the way to the development of low-cost, low-power, and highly integrated circuits for RF functions in deep submicron CMOS processes. Furthermore, the authors demonstrate how the architecture enables readers to integrate an RF front-end with the digital back-end onto a single silicon die using standard ASIC design flow. Taking a bottom-up approach that progressively builds skills and knowledge, the book begins with an introduction to basic concepts of frequency synthesis and then guides the reader through an all-digital RF frequency synthesizer design: Chapter 2 presents a digitally controlled oscillator (DCO), which is the foundation of a novel architectureTable of ContentsPREFACE xiii 1 INTRODUCTION 1 1.1 Frequency Synthesis 1 1.1.1 Noise in Oscillators 2 1.1.2 Frequency Synthesis Techniques 5 1.2 Frequency Synthesizer as an Integral Part of an RF Transceiver 9 1.2.1 Transmitter 10 1.2.2 Receiver 11 1.2.3 Toward Direct Transmitter Modulation 12 1.3 Frequency Synthesizers for Mobile Communications 16 1.3.1 Integer-N PLL Architecture 17 1.3.2 Fractional-N PLL Architecture 18 1.3.3 Toward an All-Digital PLL Approach 23 1.4 Implementation of an RF Synthesizer 25 1.4.1 CMOS vs. Traditional RF Process Technologies 25 1.4.2 Deep-Submicron CMOS 25 1.4.3 Digitally Intensive Approach 26 1.4.4 System Integration 27 1.4.5 System Integration Challenges for Deep-Submicron CMOS 29 2 DIGITALLY CONTROLLED OSCILLATOR 30 2.1 Varactor in a Deep-Submicron CMOS Process 31 2.2 Fully Digital Control of Oscillating Frequency 33 2.3 LC Tank 35 2.4 Oscillator Core 37 2.5 Open-Loop Narrowband Digital-to-Frequency Conversion 39 2.6 Example Implementation 45 2.7 Time-Domain Mathematical Model of a DCO 47 2.8 Summary 51 3 NORMALIZED DCO 52 3.1 Oscillator Transfer Function and Gain 52 3.2 DCO Gain Estimation 53 3.3 DCO Gain Normalization 54 3.4 Principle of Synchronously Optimal DCO Tuning Word Retiming 55 3.5 Time Dithering of DCO Tuning Input 56 3.5.1 Oscillator Tune Time Dithering Principle 56 3.5.2 Direct Time Dithering of Tuning Input 57 3.5.3 Update Clock Dithering Scheme 59 3.6 Implementation of PVT and Acquisition DCO Bits 60 3.7 Implementation of Tracking DCO Bits 64 3.7.1 High-Speed Dithering of Fractional Varactors 64 3.7.2 Dynamic Element Matching of Varactors 70 3.7.3 DCO Varactor Rearrangement 71 3.8 Time-Domain Model 73 3.9 Summary 74 4 ALL-DIGITAL PHASE-LOCKED LOOP 76 4.1 Phase-Domain Operation 77 4.2 Reference Clock Retiming 79 4.3 Phase Detection 81 4.3.1 Difference Mode of ADPLL Operation 85 4.3.2 Integer-Domain Operation 86 4.4 Modulo Arithmetic of the Reference and Variable Phases 86 4.4.1 Variable-Phase Accumulator (PV Block) 89 4.5 Time-to-Digital Converter 91 4.5.1 Frequency Reference Edge Estimation 93 4.6 Fractional Error Estimator 94 4.6.1 Fractional-Division Ratio Compensation 96 4.6.2 TDC Resolution Effect on Estimated Frequency Resolution 97 4.6.3 Active Removal of Fractional Spurs Through TDC (Optional) 98 4.7 Frequency Reference Retiming by a DCO Clock 100 4.7.1 Sense Amplifier–Based Flip-Flop 102 4.7.2 General Idea of Clock Retiming 103 4.7.3 Implementation 104 4.7.4 Time-Deferred Calculation of the Variable Phase (Optional) 107 4.8 Loop Gain Factor 109 4.8.1 Phase-Error Dynamic Range 111 4.9 Phase-Domain ADPLL Architecture 112 4.9.1 Close-in Spurs Due to Injection Pulling 114 4.10 PLL Frequency Response 115 4.10.1 Conversion Between the s- and z-Domains 119 4.11 Noise and Error Sources 119 4.11.1 TDC Resolution Effect on Phase Noise 120 4.11.2 Phase Noise Due to DCO SD Dithering 122 4.12 Type II ADPLL 127 4.12.1 PLL Frequency Response of a Type II Loop 130 4.13 Higher-Order ADPLL 133 4.13.1 PLL Stability Analysis 136 4.14 Nonlinear Differential Term of an ADPLL 139 4.14.1 Quality Monitoring of an RF Clock 140 4.15 DCO Gain Estimation Using a PLL 141 4.16 Gear Shifting of PLL Gain 142 4.16.1 Autonomous Gear-Shifting Mechanism 143 4.16.2 Extended Gear-Shifting Scheme with Zero-Phase Restart 148 4.17 Edge Skipping Dithering Scheme (Optional) 154 4.18 Summary 155 5 APPLICATION: ADPLL-BASED TRANSMITTER 156 5.1 Direct Frequency Modulation of a DCO 157 5.1.1 Discrete-Time Frequency Modulation 158 5.1.2 Hybrid of Predictive/Closed PLL Operation 158 5.1.3 Effect of FREF/CKR Clock Misalignment 163 5.2 Just-in-Time DCO Gain Calculation 164 5.3 GFSK Pulse Shaping of Transmitter Data 167 5.3.1 Interpolative Filter Operation 172 5.4 Power Amplifier 175 5.5 Digital Amplitude Modulation 177 5.5.1 Discrete Pulse-Slimming Control 180 5.5.2 Regulation of Transmitting Power 181 5.5.3 Tuning Word Adjustment 182 5.5.4 Fully Digital Amplitude Control 183 5.6 Going Forward: Polar Transmitter 183 5.6.1 Generic Modulator 186 5.6.2 Polar TX Realization 187 5.7 Summary 188 6 BEHAVIORAL MODELING AND SIMULATION 189 6.1 Simulation Methodology 190 6.2 Digital Blocks 191 6.3 Support of Digital Stream Processing 192 6.4 Random Number Generator 192 6.5 Time-Domain Modeling of DCO Phase Noise 192 6.5.1 Modeling Oscillator Jitter 192 6.5.2 Modeling Oscillator Wander 194 6.5.3 Modeling Oscillator Flicker (1/f ) Noise 195 6.5.4 Clock Edge Divider Effects 200 6.5.5 VHDL Model Realization of a DCO 201 6.5.6 Support of Physical KDCO 202 6.6 Modeling Metastability in Flip-Flops 203 6.7 Simulation Results 206 6.7.1 Time-Domain Simulations 206 6.7.2 Frequency-Deviation Simulations 207 6.7.3 Phase-Domain Simulations of Transmitters 209 6.7.4 Synthesizer Phase-Noise Simulations 209 6.8 Summary 212 7 IMPLEMENTATION AND EXPERIMENTAL RESULTS 213 7.1 DSP and Its RF Interface to DRP 213 7.2 Transmitter Core Implementation 214 7.3 IC Chip 216 7.4 Evaluation Board 218 7.5 Measurement Equipment 218 7.6 GFSK Transmitter Performance 219 7.7 Synthesizer Performance 221 7.8 Synthesizer Switching Transients 224 7.9 DSP-Driven Modulation 225 7.10 Performance Summary 226 7.11 Summary 227 APPENDIX A: SPURS DUE TO DCO SWITCHING 228 A.1 Spurs Due to DCO Modulation 229 APPENDIX B: GAUSSIAN PULSE-SHAPING FILTER 232 APPENDIX C: VHDL SOURCE CODE 237 C.1 DCO Level 2 237 C.2 Period-Controlled Oscillator 239 C.3 Tactical Flip-Flop 241 C.4 TDC Pseudo-Thermometer Output Decoder 243 REFERENCES 247 INDEX 253

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Book SynopsisFrom the electronic nose and the intelligent ear to the modern ink jet nozzle, the applications of smart devices incorporating microsensors are increasing rapidly. Microsensors are miniature devices that convert a non--electrical quantity into an electrical signal. By integrating a microsensor with a microprocessor, a smart sensor is produced.Table of ContentsIntroduction Electronic Materials and Processing MEMS Materials and their Preparation Standard Microelectronic Technologies Silicon Micromachining:Bulk Silicon Micromachining: Surface Microstereolithography for MEMS Microsensors Introduction to SAW Devices Surface Acoustic Waves in Solids IDT Microsensor Parameter Measurement IDT Microsensor Fabrication IDT Microsensors MEMS-IDT Microsensors Smart Sensors and MEMS Appendices Index

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Book SynopsisMicrowave devices, circuits and subsystems are used in modern microwave communication systems. These include fixed and mobile microwave communications services as well as terrestrial cellular applications. Volume 1 in this two-volume series provides an up-to-date and comprehensive reference to these communications.Trade Review"…this book is a good reference for [the] microwave engineering community." (IEEE Circuits & Devices Magazine, November/December 2006)Table of ContentsList of contributors. Preface. 1. Overview of the Book (I.A. Glover, S.R. Pennock and P.R. Shepherd). 1.1 Introduction. 1.2 RF Devices. 1.3 Signal Transmission and Network Methods. 1.4 Amplifiers. 1.5 Mixers. 1.6 Filters. 1.7 Oscillators and Frequency Synthesisers. 2. RF Devices: Characteristics and Modelling (A. Suarez and T. Fernandez). 2.1 Introduction 2.2 Semiconductor Properties 2.3 P-N Junction. 2.4 The Schottky Diode. 2.5 PIN Diodes. 2.6 Step-Recovery Diodes. 2.7 Gunn Diodes. 2.8 IMPATT Diodes. 2.9 Transistors. References. 3. Signal Transmission, Network Methods and Impedance Matching (N.J. McEwan, T.C. Edwards, D. Dernikas and I.A. Glover). 3.1 Introduction. 3.2 Transmission Lines: General Considerations. 3.3 The Two-Conductor Transmission Line: Revision of Distributed Circuit Theory. 3.4 Loss, Dispersion, Phase and Group Velocity. 3.5 Field Theory Method for Ideal TEM Case. 3.6 Microstrip. 3.7 Coupled Microstrip Lines. 3.8 Network Methods. 3.9 Impedance Matching. 3.10 Network Analysers. 3.11 Summary. References. 4. Amplifier Design (N.J. McEwan and D. Dernikas). 4.1 Introduction. 4.2 Amplifier Gain Definitions. 4.3 Stability. 4.4. Broadband Amplifier Design. 4.5 Low Noise Amplifier Design. 4.6 Practical Circuit Considerations. 4.7 Computer-Aided Design (CAD). References. 5. Mixers: Theory and Design (A. Tazon and L. de la Fuente). 5.1 Introduction. 5.2 General Properties. 5.3 Devices for Mixers. 5.4 Non-Linear Analysis. 5.5 Diode Mixer Theory. 5.6 FET Mixers. 5.7 IF Amplifier. 5.8 Single-Balanced FET Mixers. 5.9 Double-Balanced FET Mixers. 5.10 Harmonic Mixers. 5.11 Monolithic Mixers. References. 6. Filters (A Mediavilla). 6.1 Introduction. 6.2 Filter Fundamentals. 6.3 Mathematical Filter Responses. 6.4 Low Pass Prototype Filter Design. 6.5 Filter Impedance and Frequency Scaling. 6.6 Elliptic Filter Transformation. 6.7 Filter Normalisation. 7. Oscillators, Frequency Synthesisers and PLL Techniques (E. Artal, J.P. Pascal and J. Portilla). 7.1 Introduction. 7.2 Solid State Microwave Oscillators. 7.3 Negative Resistance Diode Oscillators. 7.4 Transistor Oscillators. 7.5 Voltage-Controlled Oscillators. 7.6 Oscillator Characterisation and Testing, 7.7 Microwave Phase Locked Oscillators. 7.8 Subsystems for Microwave Phase Locked Oscillators (PLOs). 7.9 Phase Noise. 7.10 Examples of PLOs. References. Index.

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Book SynopsisThe VHDL Reference: The essential guide for students and professionals working in computer hardware design and synthesis. The definitive guide to VHDL, this book combines a comprehensive reference of the VHDL syntax with tutorial and workshop materials that guide the reader through the principles of digital hardware design.Trade Review"...combines a comprehensive reference of the VHDL syntax with tutorial and workshop materials that guide readers through the principles f digital hardware design." (SciTech Book News, Vol. 26, No. 2, June 2002)Table of ContentsVHDL TUTORIAL. VHDL: Overview and Application Field. VHDL Language and Syntax. Synthesis. Simulation. Project Management. VHDL-AMS TUTORIAL. VHDL-AMS. VHDL WORKSHOP. VHDL Working Environment. Exercises. REFERENCE. Design Entities and Configurations. Subprograms and Packages. Types. Declarations. Specification. Names. Expressions. Sequential Statements. Concurrent Statements. Miscellaneous. Elaboration and Simulation. Lexical Elements. Predefined Attributes. Package STANDARD. Package TEXTIO. BNF. Literature. Index.

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Book SynopsisProvides the reader with memory fundamentals as well as directions for future research. Examines memory history, current memory technology and offers a glimpse at the future of memories.Table of ContentsThe Strategic Nature of Semiconductor Memories. The Basics of Memories: Market, Technology and Product. Trends in Memory Applications. Memory Device and Process Technology. Basic Memory Architecture and Cell Structure. Dynamic Random Access Memory Trends--4k to 256Mb. Application-Specific DRAMs. Trends in Static RAMs. Future, Fast and Application-Specific SRAMs. MOS ROMs, PROMs and EPLDs. Field Alterable ROMs I: EPROM, OTP, and Flash Memories. Field Alterable ROMs 2: EEPROM, EAROM, NV-RAM. Packaging--Single, Module and Wafer Scale Integration. Memory Electrical and Reliability Testing. Yield, Cost and the Modern Factory. Memory Trends in the Future. Index.

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Book SynopsisBroadband networks based on the ATM standard are gaining global popularity for their flexibility in providing integrated transmission of sound, image and data signals. Research into ATM networks is spreading quickly from academic prototyping, to commercial applications by manufacturers and service providers.Table of ContentsBroadband Integrated Services Digital Network. Interconnection Networks. Rearrangeable Networks. Non-Blocking Networks. ATM Switch Model. ATM Switching with Minimum-Depth Blocking Networks. ATM Switching with Non-Blocking Single-Queueing Networks. ATM Switching with Non-Blocking Multiple-Queueing Networks. ATM Switching with Arbitrary-Depth Blocking Networks. Appendix. Index.

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Book SynopsisReuse in Electronic Design From Information Modelling to Intellectual Properties Peter Conradi Berlin, Germany Reuse of existing IC intellectual property blocks is currently the hot topic in electronic design automation. By cutting development time and improving designer productivity, reuse offers a faster time to market and consequently increased profitability. Conradi encompasses the fundamentals of physical system modelling, design methodologies and basic design architectures plus reuse strategies and tasks. Features include: * Graph-oriented visualisations enabling the reader to understand the requirements of future interdisciplinary design tools * Guidance on information modelling languages, system classification and decomposition of systems under development * Section on reuse strategies and tasks examining the practical aspects of the technique for both analogue and digital design * Data management and retrieval methods including the algebra of the selection procTable of ContentsPhysical System Modelling Basics. Design Methodologies and Basic Design Architectures. Reuse Strategies and Tasks. Conclusion. Appendices. Definitions. References. Index.

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Book SynopsisFeaturing an extensive 40 page tutorial introduction, this carefully compiled anthology of 65 of the most important papers on phase-locked loops and clock recovery circuits brings you comprehensive coverage of the field-all in one self-contained volume. You''ll gain an understanding of the analysis, design, simulation, and implementation of phase-locked loops and clock recovery circuits in CMOS and bipolar technologies along with valuable insights into the issues and trade-offs associated with phase locked systems for high speed, low power, and low noise.Table of ContentsPreface. Design of Monolithic Phase-Locked Loops and Clock Recovery Circuits—A Tutorial (B. Razavi). BASIC THEORY. Theory of AFC Synchronization (W. Gruen). Color-Carrier Reference Phase Synchronization Accuracy in NTSC Color Television (D. Richman). Charge-Pump Phase-Locked Loops (F. Gardner). z-Domain Model for Discrete-Time PLLs (J. Hein & J. Scott). Analyze PLLs with Discrete Time Modeling (J. Kovacs). Properties of Frequency Difference Detectors (F. Gardner). Frequency Detectors for PLL Acquisition in Timing and Carrier Recovery (D. Messerschmitt). Analysis of Phase-Locked Timing Extraction Circuits for Pulse Code Transmission (E. Roza). Optimization of Phase-Locked Loop Performance in Data Recovery Systems (R. Co & J. Mulligan). Noise Properties of PLL Systems (V. Kroupa). PLL/DLL System Noise Analysis for Low Jitter Clock Synthesizer Design (B. Kim, et al.). Practical Approach Augurs PLL Noise in RF Synthesizers (M. O'Leary). The Effects of Noise in Oscillators (E. Hafner). A Simple Model of Feedback Oscillator Noise Spectrum (D. Leeson). Noise in Relaxation Oscillators (A. Abidi & R. Meyer). Analysis of Timing Jitter in CMOS Ring Oscillators (T. Weigandt, et al.). Analysis, Modeling, and Simulation of Phase Noise in Monolithic Voltage-Controlled Oscillators (B. Razavi). BUILDING BLOCKS. Start-up and Frequency Stability in High-Frequency Oscillators (N. Nguyen & R. Meyer). MOS Oscillators with Multi-Decade Tuning Range and Gigahertz Maximum Speed (M. Banu). A Bipolar 1 GHz Multi-Decade Monolithic Variable-Frequency Oscillator (J. Wu). A Digital Phase and Frequency Sensitive Detector (J. Brown). A 3-State Phase Detector Can Improve Your Next PLL Design (C. Sharpe). GaAs Monolithic Phase/Frequency Discriminator (I. Shahriary, et al.). A New Phase-Locked Loop Timing Recovery Method for Digital Regenerators (J. Bellisio). A Phase-Locked Loop with Digital Frequency Comparator for Timing Signal Recovery (J. Afonso, et al.). Clock Recovery from Random Binary Signals (J. Alexander). A Si Bipolar Phase and Frequency Detector IC for Clock Extraction up to 8 Gb/s (A. Pottbacker, et al.). A Self-Correcting Clock Recovery Circuit (C. Hogge). MODELING AND SIMULATION. An Integrated PLL Clock Generator for 275 MHz Graphic Displays (G. Gutierrez & D. DeSimone). The Macro Modeling of Phase-Locked Loopes for the SPICE Simulator (M. Sitkowski). Modeling and Simulation of an Analog Charge Pump Phase-Locked Loop (S. Can & Y. Sahinkaya). Mixed-Mode Simulation of Phase-Locked Loops (B. Antao, et al.). Behavioral Representation for VCO and Detectors in Phase-Lock Systems (E. Liu & A. Sangiovanni-Vincentelli). Behavioral Simulation Techniques for Phase/Delay-Locked Systems (A. Demir, et al.). PHASE-LOCKED LOOPS. A Monolithic Phase-Locked Loop with Detection Processor (E. Murthi). A 200-MHz CMOS Phase-Locked Loop with Dual Phase Detectors (K. Ware, et al.). High-Frequency Phase-Locked Loops in Monolithic Bipolar Technology (M. Soyuer & R. Meyer). A 6-GHz Integrated Phase-Locked Loop Using AlGaAs/GaAs Heterojunction Bipolar Transistors (A. Buchwald, et al.). A 6-GHz 60-mW BiCMOS Phase-Locked Loop with 2-V Supply (B. Razavi & J. Sung). Design of PLL-Based Clock Generation Circuits (D. Jeong). A Variable Delay Line PLL for CPU-Coprocessor Synchronization (M. Johnson & E. Hudson). A PLL Clock Generator with 5 to 110 MHz of Lock Range for Microprocessors (I. Young, et al.). A Wide-Bandwidth Low-Voltage PLL for PowerPC Microprocessors (J. Alvarez, et al.). A 30-128 MHz Frequency Synthesizer Standard Cell (R. Bitting & W. Repasky). Cell-Based Fully Integrated CMOS Frequency Synthesizers (D. Mijuskovic, et al.). Fully-Integrated CMOS Phase-Locked Loop with 15 to 240 MHz Locking Range and ±50 psec Jitter (I. Novof, et al.). PLL Design for a 500 MB/s Interface (M. Horowitz, et al.). CLOCK AND DATA RECOVERY CIRCUITS. An Analog PLL-Based Clock and Data Recovery Circuit with High Input Jitter Tolerance (S. Sun). A 30-MHz Hybrid Analog/Digital Clock Recovery Circuit in 2-μm CMOS (B. Kim, et al.). A BiCMOS PLL-Based Data Separator Circuit with High Stability and Accuracy (S. Miyazawa, et al.). A Versatile Clock Recovery Architecture and Monlithic Implementation (L. De Vito). A 155-MHz Clock Recovery Delay- and Phase-Locked Loop (T. Lee & J. Bulzacchelli). A Monolithic 156 Mb/s Clock and Data Recovery PLL Circuit using the Sample- and-Hold Technique (N. Ishihara & Y. Akazawa). A Monolithic 480 Mb/s Parallel AGC/Decision/Clock Recovery Circuit in 1.2-μm CMOS (T. Hu & P. Gray). A Monolithic 622 Mb/sec Clock Extraction and Data Retiming Circuit (B. Lai & R. Walker). A 660 Mb/s CMOS Clock Recovery Circuit with Instantaneous Locking for NRZ Data and Burst-Mode Transmission (M. Banu & A. Dunlop). A Monolithic 2.3-Gb/s 100-mW Clock and Data Recovery Circuit in Silicon Bipolar Technology (M. Soyuer). A 50 MHz Phase- and Frequency-Locked Loop (R. Cordell, et al.). NMOS ICs for Clock and Data Regeneration in Gigabit-per-Second Optical-Fiber Receivers (S. Enam & A. Abidi). A PLL-Based 2.5-Gb/s Clock and Data Regenerator IC (H. Ransijn & P. O'Connor). A 2.5-Gb/sec 15-mW BiCMOS Clock Recovery Circuit (B. Razavi & J. Sung). An 8 GHz Silicon Bipolar Clock Recovery and Data Regenerator IC (A. Pottbacker & U. Langmann). Author Index. Subject Index. Editor's Biography.

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Book SynopsisMarkov modeling has long been accepted as a fundamental and powerful technique for the fault tolerance analysis of mission-critical applications. However, the elaborate computations required have often made Markov modeling too time-consuming to be of practical use on these complex systems. With this hands-on tool, designers can use the Markov modeling technique to analyze safety, reliability, maintainability, and cost-effectiveness factors in the full range of complex systems in use today. Featuring ground-breaking simulation software and a comprehensive reference manual, MARKOV MODELING FOR RELIABILITY ANALYSIS helps system designers surmount the mathematical computations that have previously prevented effective reliability analysis. The text and software compose a valuable self-study tool that is complete with detailed explanations, examples, and a library of Markov models that can be used for experiments and as derivations for new simulation models. The book details howTable of ContentsSeries Introduction. Preface. Introduction. System Requirements and Design. Foundations of Probability Theory. Basic Reliability Concepts. Basic Reliability Models. Markov Process Fundamentals. Hardware Reliability Modeling. Software Reliability Modeling. Combined Hardware-Software Reliability Modeling. Modeling of Large and Complex Systems. Maintainability Modeling. Availability Modeling. Safety Modeling. Markov Model Evaluation. Effectiveness Modeling. Support Analyses. Application Examples. Practical Design of Fault-Tolerant Systems. CARMS User's Guide. CARMS Model Library. CARMS Reference. Definitions and Acronyms. References. Index. About the Authors.

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Book SynopsisThis book covers the design of next generation microprocessors in deep submicron CMOS technologies. The chapters in Design of High Performance Microprocessor Circuits were written by some of the world's leading technologists, designers, and researchers.Table of ContentsPreface. OVERVIEW. Impact of Physical Technology on Architecture (John H. Edmondson). TECHNOLOGY ISSUES. CMOS Scaling and Issues in SUB-0.25µm Systems (Yuan Taur). Techniques for Leakage Power Reduction (Vivek De, Yibin Ye, et al.). Low-Voltage Technologies (Tadahiro Kuroda and Takayasu Sakurai). SOI Technology and Circuits (Ghavam G. Shahidi, Fari Assaderaghi and Dimitri Antoniadis). Models of Process Variations in Device and Interconnect (Duane Boning and Sani Nassif). CIRCUIT STYLES FOR LOGIC. Basic Logic Families (Kerry Bernstein). Issues in Dynamic Logic Design (Paul Gronowski). Self-Timed Pipelines (Ted Williams). High-Speed VLSI Arithmetic Units: Adders and Multipliers (Vojin G. Oklobdzija). CLOCKING. Clocked Storage Elements (Hamid Partovi). Design of High-Speed CMOS PLLs and DLLs (John George Maneatis). Clock Distribution (Daniel W. Bailey). MEMORY SYSTEM DESIGN. Register Files and Caches (Ronald Preston). Embedded DRAM (Tadaaki Yamauchi and Michihiro Yamada). INTERCONNECT AND I/O. Analyzing On-Chip Interconnect Effects (Noel Menezes and Lawrence Pileggi). Techniques for Driving Interconnect (Shannon V. Morton). I/O and ESD Circuit Design (Stephen C. Thierauf and Warren R. Anderson). High-Speed Electrical Signaling (Stefanos Sidropoulos, Chih-Kong Ken Yang, and Mark Horowitz). RELIABILITY. Electromigration Reliability (J. Joseph Clement). Hot Carrier Reliability (Kaizad Mistry). CAD TOOLS AND TEST. Overview of Computer-Aided Design Tools (Yao-Tsung Yen). Timing Verification (Victor Peng). Design and Analysis of Power Distribution Networks (David Blaauw, Rajendran Panda, and Rajat Chaudhry). Testing of High-Performance Processors (Dilip K. Bhavsar). Index.

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Book SynopsisAnswers the commonly asked questions about how digital signal processing--based machines work and what role DSP plays in the process. It shows you how DSP performs in real--test situations and uses mathematical concepts rather than derivations.Table of ContentsPreface. Chapter 1: Introduction to DSP-Based Testing. Overview of Testing. Emulation versus Automation. Invisible Instruments. Numerical Vectors. Vector Transfer. Vector and Array Processing Speed. Processor Speed. Floating-Point Mathematics. Phase-Lock Synchronization. Representative Digitizer. DSP-Based Test Advantages Summarized. Price of Using DSP . . . Chapter 2: Accuracy and Speed of Emulated Instruments. Hardware Emulation. Integration versus Filtering for AC Measurements. Coherent Measurement. Unit Test Period. Coherent Filtering. Correlation. Fourier Voltmeter. Software Version of the FVM. Orthogonal Signals and Fourier Voltmeters. DFT and FFT. Synthesis. Frequency Leakage. Graphical Example of FFT Application. Chapter 3: Noncoherent Sampling. Reconstruction. Time and Spectral Vectors. Imaging and Noncoherent Undersampling. Heterodyning and Reconstruction. Rules of Imaging. Sampling Rates and Spacing. Nyquist's Limit. Universal Rule for Noncoherent Sampling. Sine-X-over-X Distortion and Correction. Receiver/Reconstruction Filtering. Chapter 4: Coherence. Vector Periodicity. Amount of Information in a Vector. Effective Sampling Rate. Chapter 5: Multitone Testing. Multitone Distortion Measurement. Multitone Frequency Measurement. Multitone versus Single Tone Applications. Error Sources and Accuracy. Effect of Device Uncertainty on Multitone Tests. Factors Affecting Accuracy. Out-of-Band Measurement Uncertainty. Estimating Multitone Accuracy. Estimating Multitone Uncertainty Due to Quantization. Chapter 6: Vector Operations for DSP Testing. Vector Operations in DSP-Programming. Program Examples. Chapter 7: Event Digitizing. Explicit versus Implicit Sampling. Event Digitizer. Testing Tape Decks. Chapter 8: Measuring Random Noise. Equivalent Input Noise. Normalized Spectral Noise Density. Typical DSP Procedure. Input Resistors. Coupling Capacitor. Noise Bandwidth. Accuracy and Repeatability of Noise Measurements. Statistical Sampling versus DSP Sampling. Estimating the Repeatability of Local Measurements. Cautions about Averaging. Computing Spectral Power from a Sparsely Sampled Signal. Exercises. Chapter 9: Introduction to A/D Testing. A/D versus D/A Conversion. Transfer Maps. Transmission Parameters versus Intrinsic Parameters. Conversion Formats and Types. Uncertainty and Distortion of the Ideal ADC. DAC Transfer Error. Superposition Error. Adapting D/A Parameters to ADC Measurement. Probabilistic Estimation of ADC Input Noise. Dynamic Testing. Noise Improvement Figure. Random Voltage Noise. Induced Jitter Noise. Equivalent Number of Bits. Idle Noise and Noise Power Ratio. Separating Quantization Distortion from Noise. Chapter 10: Techniques for Flash Converter Testing. Linear Histogram Testing. Histograms with Sparkle Codes and Missing Codes. Obtaining the Transfer Function from the Histogram. Integral Linearity Error from the Transfer Curve. ILE Directly from DLE: A Fast Method. Centerlines for Histogram-Derived ILE. Integral Linearity from Weighted Code Centers. MIL-STD Regression Line Approach. Extreme Values of Linearity Error. Differential Linearity from Weighted Code Center Information. Dynamic Testing. Sinusoidal Histogram Testing. Using the Tally to Find MAT T2. Errors with Sinusoidal Histograms. Spectral Analysis. Noise Measurement. Noise Separation. Progressive Spectra. Unscrambling. Differential Phase (DP). Differential Gain (DG). Chapter 11: Incremental Models for DSP-Based Testing with Applications to Transient and Flutter Measurement. Introduction. Limitations of Vector Processors. Incremental Modeling. Comparison with Continuous Equations. RC High Pass Model. Time Scaling and Normalization. Ballistic Peaks. Ballistic Peak Detection Models. Generalized Approach. Wow and Flutter Measurement. DIN/IEEE/ANSI/Quasi-Peak Detection. DIN Frequency Weighting. Importance of Phase Response in Peak-Reading Instruments. Finite Impulse Response (FIR) Filtering. Chapter 12: CODEC Testing. Pulse Code Modulation (PCM) CODEC Channel. Encoding Law. Five Kinds of Tests. Full Channel versus Half Channel. Normalized Mu-Law and A-Law Measurement Units. Review of Decibel-Based Measurement Units. CODEC Performance Tests. Gain and Loss. Choosing the Test Frequency. Frequency Distribution. Intrinsic versus Extrinsic Error. Transmission Parameters. Half Channel Encoder Testing. Decoder Testing. Other Decoder Performance Tests. References for CODEC (PCM) Telephone Standards. Chapter 13: Selected Reprints. Automated Measurement of 12- to 16-Bit Converters M. Mahoney (Proceedings of the 1981 IEEE Test Conference, 1981. pages 319-327). DSP Measurement of Frequency E. Rosenfeld (Proceedings of the International Test Conference, 1986, pages 981-986). DSP Synthesized Signal Source for Analog Testing Stimulus and New Test Method H. Kitayoshi, S. Sumida. K. Shirakawa, and S. Takeshita (Proceedings of the International Test Conference, 1985, pages 825-834). An NBS Calibration Service for A/D and D/A Conveners TM. Souders and D.R. Flach (Proceedings of the 1981 IEEE Test Conference, 1981, pages 290-303). Production Testing of PCM (Digital) Audio Circuits M. Landry (Proceedings of the International Test Conference, 1983, pages 767-770). Chapter 14: Appendix: References/Bibliography.

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Book SynopsisThis revised edition immerses practicing and aspiring industry professionals in the complex world of RF design.Table of ContentsPREFACE TO THE SECOND EDITION xix PART 1 DESIGN TECHNOLOGIES AND SKILLS 1 1 DIFFERENCE BETWEEN RF AND DIGITAL CIRCUIT DESIGN 3 1.1 Controversy 3 1.2 Difference of RF and Digital Block in a Communication System 6 1.3 Conclusions 9 1.4 Notes for High-Speed Digital Circuit Design 9 2 REFLECTION AND SELF-INTERFERENCE 15 2.1 Introduction 15 2.2 Voltage Delivered from a Source to a Load 16 2.3 Power Delivered from a Source to a Load 23 2.4 Impedance Conjugate Matching 33 2.5 Additional Effect of Impedance Matching 42 3 IMPEDANCE MATCHING IN THE NARROW-BAND CASE 61 3.1 Introduction 61 3.2 Impedance Matching by Means of Return Loss Adjustment 63 3.3 Impedance Matching Network Built by One Part 68 3.4 Impedance Matching Network Built by Two Parts 74 3.5 Impedance Matching Network Built By Three Parts 84 3.6 Impedance Matching When ZS Or ZL Is Not 50 85 3.7 Parts In An Impedance Matching Network 93 4 IMPEDANCE MATCHING IN THE WIDEBAND CASE 131 4.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart 131 4.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch 136 4.3 Impedance Variation Due to the Insertion of Two Parts Per Arm or Per Branch 145 4.4 Partial Impedance Matching for an IQ (in Phase Quadrature) Modulator in a UWB (Ultra Wide Band) System 151 4.5 Discussion of Passive Wideband Impedance Matching Network 174 5 IMPEDANCE AND GAIN OF A RAW DEVICE 181 5.1 Introduction 181 5.2 Miller Effect 183 5.3 Small-Signal Model of a Bipolar Transistor 187 5.4 Bipolar Transistor with CE (Common Emitter) Configuration 190 5.5 Bipolar Transistor with CB (Common Base) Configuration 204 5.6 Bipolar Transistor with CC (Common Collector) Configuration 214 5.7 Small-Signal Model of a MOSFET 221 5.8 Similarity Between a Bipolar Transistor and a MOSFET 225 5.9 MOSFET with CS (Common Source) Configuration 235 5.10 MOSFET with CG (Common Gate) Configuration 244 5.11 MOSFET with CD (Common Drain) Configuration 249 5.12 Comparison of Transistor Configuration of Single-stage Amplifiers with Different Configurations 252 6 IMPEDANCE MEASUREMENT 259 6.1 Introduction 259 6.2 Scalar and Vector Voltage Measurement 260 6.3 Direct Impedance Measurement by a Network Analyzer 263 6.4 Alternative Impedance Measurement by Network Analyzer 272 6.5 Impedance Measurement Using a Circulator 276 7 GROUNDING 281 7.1 Implication of Grounding 281 7.2 Possible Grounding Problems Hidden in a Schematic 283 7.3 Imperfect or Inappropriate Grounding Examples 284 7.4 'Zero' Capacitor 290 7.5 Quarter Wavelength of Microstrip Line 300 8 EQUIPOTENTIALITY AND CURRENT COUPLING ON THE GROUND SURFACE 325 8.1 Equipotentiality on the Ground Surface 325 8.2 Forward and Return Current Coupling 335 8.3 PCB or IC Chip with Multimetallic Layers 344 9 LAYOUT 349 9.1 Difference in Layout between an Individual Block and a System 349 9.2 Primary Considerations of a PCB 350 9.3 Layout of a PCB for Testing 352 9.4 VIA Modeling 355 9.5 Runner 360 9.6 Parts 369 9.7 Free Space 371 10 MANUFACTURABILITY OF PRODUCT DESIGN 377 10.1 Introduction 377 10.2 Implication of 6σ Design 379 10.3 Approaching 6σ Design 383 10.4 Monte Carlo Analysis 386 11 RFIC (RADIO FREQUENCY INTEGRATED CIRCUIT) 401 11.1 Interference and Isolation 401 11.2 Shielding for an RF Module by a Metallic Shielding Box 403 11.3 Strong Desirability to Develop RFIC 405 11.4 Interference going along IC Substrate Path 406 11.5 Solution for Interference Coming from Sky 411 11.6 Common Grounding Rules for RF Module and RFIC Design 412 11.7 Bottlenecks in RFIC Design 414 11.8 Calculating of Quarter Wavelength 420 PART 2 RF SYSTEM 427 12 MAIN PARAMETERS AND SYSTEM ANALYSIS IN RF CIRCUIT DESIGN 429 12.1 Introduction 429 12.2 Power Gain 431 12.3 Noise 441 12.4 Nonlinearity 453 12.5 Other Parameters 480 12.6 Example of RF System Analysis 482 13 SPECIALITY OF "‘ZERO IF"’ SYSTEM 501 13.1 Why Differential Pair? 501 13.2 Can DC Offset be Blocked out by a Capacitor? 508 13.3 Chopping Mixer 511 13.4 DC Offset Cancellation by Calibration 516 13.5 Remark on DC Offset Cancellation 517 14 DIFFERENTIAL PAIRS 521 14.1 Fundamentals of Differential Pairs 521 14.2 CMRR (Common Mode Rejection Ratio) 533 15 RF BALUN 547 15.1 Introduction 547 15.2 Transformer Balun 549 15.3 LC Balun 571 15.4 Microstrip Line Balun 580 15.5 Mixing Type of Balun 583 16 SOC (SYSTEM-ON-A-CHIP) AND NEXT 611 16.1 SOC 611 16.2 What is Next 612 PART 3 INDIVIDUAL RF BLOCKS 625 17 LNA (LOW-NOISE AMPLIFIER) 627 17.1 Introduction 627 17.2 Single-Ended Single Device LNA 628 17.3 Single-Ended Cascode LNA 662 17.4 LNA with AGC (Automatic Gain Control) 684 18 MIXER 695 18.1 Introduction 695 18.2 Passive Mixer 698 18.3 Active Mixer 706 18.4 Design Schemes 717 19 TUNABLE FILTER 731 19.1 Tunable Filter in A Communication System 731 19.2 Coupling between two Tank Circuits 733 19.3 Circuit Description 738 19.4 Effect of Second Coupling 739 19.5 Performance 743 20 VCO (VOLTAGE-CONTROLLED OSCILLATOR) 749 20.1 "Three-Point" Types of Oscillator 749 20.2 Other Single-Ended Oscillators 755 20.3 VCO and PLL (Phase Lock Loop) 759 20.4 Design Example of a Single-Ended VCO 769 20.5 Differential VCO and Quad-Phases VCO 778 21 PA (POWER AMPLIFIER) 789 21.1 Classification of PA 789 21.2 Single-Ended PA 794 21.3 Single-Ended PA IC Design 798 21.4 Push–Pull PA Design 799 21.5 PA with Temperature Compensation 822 21.6 PA with Output Power Control 823 21.7 Linear PA 824 References 828 Further Reading 828 Exercises 829 Answers 829 INDEX 833

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Book SynopsisThe only book on integrated circuits for optical communications that fully covers High-Speed IOs, PLLs, CDRs, and transceiver design including optical communication The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design.Table of ContentsPreface to First Edition xiii Preface xv About the Author xvii 1 Introduction to Optical Communications 1 1.1 Brief History 1 1.2 Generic Optical System 2 1.3 Design Challenges 5 1.4 State of the Art 6 2 Basic Concepts 8 2.1 Properties of Random Binary Data 8 2.2 Generation of Random Data 12 2.3 Data Formats 14 2.4 Effect of Bandwidth Limitation on Random Data 16 2.5 Effect of Noise on Random Data 21 2.6 Phase Noise and Jitter 24 2.7 Transmission Lines 30 3 Optical Devices 36 3.1 Laser Diodes 36 3.2 Optical Fibers 46 3.3 Photodiodes 55 3.4 Optical Systems 58 4 Transimpedance Amplifiers 62 4.1 General Considerations 62 4.2 Open-Loop TIAs 73 4.3 Feedback TIAs 87 4.4 Supply Rejection 97 4.5 Differential TIAs 100 4.6 High-Performance Techniques 103 4.7 Automatic Gain Control 114 4.8 Case Studies 118 4.9 New Developments in TIA Design 122 5 Limiting Amplifiers and Output Buffers 130 5.1 General Considerations 130 5.2 Broadband Techniques 138 5.3 Output Buffers 149 5.4 Distributed Amplification 159 5.5 Other Broadband Techniques 171 6 Oscillator Fundamentals 185 6.1 General Considerations 185 6.2 Ring Oscillators 187 6.3 LC Oscillators 198 6.4 Voltage-Controlled Oscillators 211 6.5 Mathematical Model of VCOs 227 7 LC Oscillators 233 7.1 Monolithic Inductors 233 7.2 Monolithic Varactors 246 7.3 Basic LC Oscillators 248 7.4 Quadrature Oscillators 255 7.5 Distributed Oscillators 261 8 Phase-Locked Loops 264 8.1 Simple PLL 264 8.2 Charge-Pump PLLs 280 8.3 Nonideal Effects in PLLs 293 8.4 Delay-Locked Loops 300 8.5 Applications 302 9 Clock and Data Recovery 308 9.1 General Considerations 308 9.2 Phase Detectors for Random Data 320 9.3 Frequency Detectors for Random Data 333 9.4 CDR Architectures 338 9.5 Jitter in CDR Circuits 344 10 Multiplexers and Laser Drivers 356 10.1 Multiplexers 356 10.2 Frequency Dividers 364 10.3 Laser and Modulator Drivers 374 10.4 Design Principles 378 10.5 New Developments in Laser Driver Design 385 11 Burst-Mode Circuits 393 11.1 Passive Optical Networks 393 11.2 Burst-Mode TIAs 395 11.3 Burst-Mode CDR Circuits 404 11.4 Alternative BM CDR Architectures 413 Index 417

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Book SynopsisPresented in three parts, this book provides readers with an immersive introduction to this rapidly growing segment of the computer industry.Table of ContentsPreface xv Contributors xvii 1 Low Power Multicore Processors for Embedded Systems 1 Fumio Arakawa 1.1 Multicore Chip with Highly Efficient Cores 1 1.2 SuperH RISC Engine Family (SH) Processor Cores 5 1.3 SH-X: A Highly Efficient CPU Core 9 1.4 SH-X FPU: A Highly Efficient FPU 20 1.5 SH-X2: Frequency and Efficiency Enhanced Core 33 1.6 SH-X3: Multicore Architecture Extension 34 1.7 SH-X4: ISA and Address Space Extension 47 2 Special-Purpose Hardware for Computational Biology 61 Siddharth Srinivasan 2.1 Molecular Dynamics Simulations on Graphics Processing Units 62 2.2 Special-Purpose Hardware and Network Topologies for MD Simulations 72 2.3 Quantum MC Applications on Field-Programmable Gate Arrays 77 2.4 Conclusions and Future Directions 82 3 Embedded GPU Design 85 Byeong-Gyu Nam and Hoi-Jun Yoo 3.1 Introduction 85 3.2 System Architecture 86 3.3 Graphics Modules Design 88 3.4 System Power Management 95 3.5 Implementation Results 99 3.6 Conclusion 102 4 Low-Cost VLSI Architecture for Random Block-Based Access of Pixels in Modern Image Sensors 107 Tareq Hasan Khan and Khan Wahid 4.1 Introduction 107 4.2 The DVP Interface 108 4.3 The iBRIDGE-BB Architecture 109 4.4 Hardware Implementation 116 4.5 Conclusion 123 5 Embedded Computing Systems on FPGAs 127 Lesley Shannon 5.1 FPGA Architecture 128 5.2 FPGA Confi guration Technology 129 5.3 Software Support 133 5.4 Final Summary of Challenges and Opportunities for Embedded Computing Design on FPGAs 135 6 FPGA-Based Emulation Support for Design Space Exploration 139 Paolo Meloni, Simone Secchi, and Luigi Raffo 6.1 Introduction 139 6.2 State of the Art 140 6.3 A Tool for Energy-Aware FPGA-Based Emulation: The MADNESS Project Experience 144 6.4 Enabling FPGA-Based DSE: Runtime-Reconfi gurable Emulators 147 6.5 Use Cases 161 7 FPGA Coprocessing Solution for Real-Time Protein Identifi cation Using Tandem Mass Spectrometry 169 Daniel Coca, István Bogdán, and Robert J. Beynon 7.1 Introduction 169 7.2 Protein Identifi cation by Sequence Database Searching Using MS/MS Data 171 7.3 Reconfi gurable Computing Platform 174 7.4 FPGA Implementation of the MS/MS Search Engine 176 7.5 Summary 180 8 Real-Time Confi gurable Phase-Coherent Pipelines 185 Robert L. Shuler, Jr., and David K. Rutishauser 8.1 Introduction and Purpose 185 8.2 History and Related Methods 188 8.3 Implementation Framework 191 8.4 Prototype Implementation 204 8.5 Assessment Compared with Related Methods 207 9 Low Overhead Radiation Hardening Techniques for Embedded Architectures 211 Sohan Purohit, Sai Rahul Chalamalasetti, and Martin Margala 9.1 Introduction 211 9.2 Recently Proposed SEU Tolerance Techniques 213 9.3 Radiation-Hardened Reconfi gurable Array with Instruction Rollback 223 9.4 Conclusion 234 10 Hybrid Partially Adaptive Fault-Tolerant Routing for 3D Networks-on-Chip 239 Sudeep Pasricha and Yong Zou 10.1 Introduction 239 10.2 Related Work 240 10.3 Proposed 4NP-First Routing Scheme 242 10.4 Experiments 250 10.5 Conclusion 255 11 Interoperability in Electronic Systems 259 Andrew Leone 11.1 Interoperability 259 11.2 The Basis for Interoperability: The OSI Model 261 11.3 Hardware 263 11.4 Firmware 266 11.5 Partitioning the System 268 11.6 Examples of Interoperable Systems 270 12 Software Modeling Approaches for Presilicon System Performance Analysis 273 Kenneth J. Schultz and Frederic Risacher 12.1 Introduction 273 12.2 Methodologies 275 12.3 Results 283 12.4 Conclusion 288 13 Advanced Encryption Standard (AES) Implementation in Embedded Systems 291 Issam Hammad, Kamal El-Sankary, and Ezz El-Masry 13.1 Introduction 291 13.2 Finite Field 292 13.3 The AES 293 13.4 Hardware Implementations for AES 300 13.5 High-Speed AES Encryptor with Efficient Merging Techniques 306 13.6 Conclusion 315 14 Reconfi gurable Architecture for Cryptography over Binary Finite Fields 319 Samuel Antão, Ricardo Chaves, and Leonel Sousa 14.1 Introduction 319 14.2 Background 320 14.3 Reconfigurable Processor 333 14.4 Results 350 14.5 Conclusions 358 References 359 Index 363

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Book SynopsisThis book covers instantaneous power theory as well as the importance of design of shunt, series, and combined shunt-series power active filters and hybrid passive-active power filters Illustrates pioneering applications of the p-q theory to power conditioning, which highlights distinct differences from conventional theories Explores p-q-r theory to give a new method of analyzing the different powers in a three-phase circuit Provides exercises at the end of many chapters that are unique to the second edition Table of ContentsPREFACE xiii CHAPTER 1 INTRODUCTION 1 1.1 Concepts and Evolution of Electric Power Theory 1 1.2 Applications of the P-q Theory to Power Electronics Equipment 4 1.3 Harmonic Voltages in Power Systems 5 1.4 Identified and Unidentified Harmonic-Producing Loads 6 1.5 Harmonic Current and Voltage Sources 8 1.6 Basic Principles of Harmonic Compensation 9 1.7 Basic Principle of Power Flow Control 13 References 15 CHAPTER 2 ELECTRIC POWER DEFINITIONS: BACKGROUND 17 2.1 Power Definitions Under Sinusoidal Conditions 18 2.2 Voltage and Current Phasors and Complex Impedance 20 2.3 Complex Power and Power Factor 21 2.4 Concepts of Power Under Nonsinusoidal Conditions: Conventional Approaches 22 2.4.1 Power Definitions by Budeanu 22 2.4.1.A Power Tetrahedron and Distortion Factor 25 2.4.2 Power Definitions by Fryze 27 2.5 Electric Power in Three-Phase Systems 28 2.5.1 Classifications of Three-Phase Systems 28 2.5.2 Power in Balanced Three-Phase Systems 31 2.5.3 Power in Three-Phase Unbalanced Systems 33 2.6 Summary 34 2.7 Exercises 34 References 35 CHAPTER 3 THE INSTANTANEOUS POWER THEORY 37 3.1 Basis of the p-q Theory 37 3.1.1 Historical Background of the p-q Theory 38 3.1.2 The Clarke Transformation 39 3.1.2.A Calculation of Voltage and Current Vectors When Zero-Sequence Components Are Excluded 41 3.1.3 Three-Phase Instantaneous Active Power in Terms of Clarke Components 43 3.1.4 The Instantaneous Powers of the p-q Theory 44 3.2 The p-q Theory in Three-Phase, Three-Wire Systems 44 3.2.1 Comparisons with the Conventional Theory 48 3.2.1.A Example #1—Sinusoidal Voltages and Currents 49 3.2.1.B Example #2—Balanced Voltages and Capacitive Loads 49 3.2.1.C Example #3—Sinusoidal Balanced Voltage and Nonlinear Load 50 3.2.2 Use of the p-q Theory for Shunt Current Compensation 54 3.2.2.A Examples of Appearance of Hidden Currents 59 3.2.3 The Dual p-q Theory 63 3.3 The p-q Theory in Three-Phase, Four-Wire Systems 65 3.3.1 The Zero-Sequence Power in a Three-Phase Sinusoidal Voltage Source 67 3.3.2 Presence of Negative-Sequence Components 68 3.3.3 General Case Including Distortions and Imbalances in the Voltages and in the Currents 69 3.3.4 Physical Meanings of the Instantaneous Real, Imaginary, and Zero-Sequence Powers 74 3.3.5 Avoiding the Clarke Transformation in the p-q Theory 75 3.3.6 Modified p-q Theory 77 3.4 Instantaneous abc Theory 81 3.4.1 Active and Nonactive Current Calculation by Means of a Minimization Method 83 3.4.2 Generalized Fryze Currents Minimization Method 88 3.5 Comparisons Between the p-q Theory and the abc Theory 91 3.5.1 Selection of Power Components to be Compensated 95 3.6 The p-q-r Theory 97 3.7 Summary 104 3.8 Exercises 105 References 106 CHAPTER 4 SHUNT ACTIVE FILTERS 111 4.1 General Description of Shunt Active Filters 113 4.1.1 PWM Converters for Shunt Active Filters 114 4.1.2 Active Filter Controllers 115 4.2 Three-Phase, Three-Wire Shunt Active Filters 118 4.2.1 Active Filters for Constant Power Compensation 119 4.2.2 Active Filters for Sinusoidal Current Control 135 4.2.2.A Positive-Sequence Voltage Detector 138 4.2.2.B Simulation Results 145 4.2.3 Active Filters for Current Minimization 145 4.2.4 Active Filters for Harmonic Damping 149 4.2.4.A Shunt Active Filter Based on Voltage Detection 151 4.2.4.B Active Filter Controller Based on Voltage Detection 152 4.2.4.C An Application Case of an Active Filter for Harmonic Damping 156 4.2.5 A Digital Controller 171 4.2.5.A System Configuration of the Digital Controller 172 4.2.5.B Current Control Methods 177 4.3 Three-Phase, Four-Wire Shunt Active Filters 180 4.3.1 Converter Topologies for Three-Phase, Four-Wire Systems 181 4.3.2 Dynamic Hysteresis-Band Current Controller 182 4.3.3 Active Filter dc Voltage Regulator 184 4.3.4 Optimal Power Flow Conditions 185 4.3.5 Constant Instantaneous Power Control Strategy 187 4.3.6 Sinusoidal Current Control Strategy 189 4.3.7 Performance Analysis and Parameter Optimization 192 4.3.7.A Influence of the System Parameters 192 4.3.7.B Dynamic Response of the Shunt Active Filter 193 4.3.7.C Economical Aspects 198 4.3.7.D Experimental Results 199 4.4 Compensation Methods Based on the p-q-r Theory 204 4.4.1 Reference Power Control Method 206 4.4.2 Reference Current Control Method 211 4.4.3 Alternative Control Method 213 4.4.4 The Simplified Sinusoidal Source Current Strategy 215 4.4.4.A The PLL Circuit and the Positive-Sequence Detector 215 4.4.4.B The Sinusoidal Source Current Control Strategy with Energy Balance Inside the Active Filter 217 4.5 Comparisons Between Control Methods Based on the p-q Theory and the p-q-r Theory 218 4.6 Shunt Selective Harmonic Compensation 224 4.7 Summary 231 4.8 Exercises 231 References 233 CHAPTER 5 HYBRID AND SERIES ACTIVE FILTERS 237 5.1 Basic Series Active Filter 237 5.2 Combined Series Active Filter and Shunt Passive Filter 239 5.2.1 Example of an Experimental System 242 5.2.1.A Compensation Principle 243 5.2.1.B Filtering Characteristics 245 5.2.1.C Control Circuit 246 5.2.1.D Filter to Suppress Switching Ripples 248 5.2.1.E Experimental Results 249 5.2.2 Some Remarks about the Hybrid Filters 252 5.3 Series Active Filter Integrated with a Double-Series Diode Rectifier 253 5.3.1 The First-Generation Control Circuit 255 5.3.1.A Circuit Configuration and Delay Time 255 5.3.1.B Stability of the Active Filter 257 5.3.2 The Second-Generation Control Circuit 258 5.3.3 Stability Analysis and Characteristics Comparison 260 5.3.3.A Transfer Function of the Control Circuits 260 5.3.3.B Characteristics Comparisons 261 5.3.4 Design of a Switching-Ripple Filter 263 5.3.4.A Design Principle 263 5.3.4.B Effect on the System Stability 263 5.3.4.C Experimental Testing 264 5.3.5 Experimental Results 266 5.4 Comparisons Between Hybrid and Pure Active Filters 268 5.4.1 Low-Voltage Transformerless Hybrid Active Filter 268 5.4.2 Low-Voltage, Transformerless, Pure Shunt Active Filter 271 5.4.3 Comparisons through Simulation Results 273 5.5 Hybrid Active Filters for Medium-Voltage Motor Drives 274 5.5.1 Hybrid Active Filter for a Three-Phase Six-Pulse Diode Rectifier 275 5.5.1.A System Configuration 275 5.5.1.B Experimental System 277 5.5.1.C Control System 277 5.5.1.D Common Sixth-Harmonic Zero-Sequence Voltage Injection 281 5.5.1.E Three-Phase Second-Harmonic Negative Sequence Voltages Injection 283 5.5.1.F Experimental Results 286 5.5.1.G Appendix 292 5.5.2 Hybrid Active Filter for a Three-Phase 12-Pulse Diode Rectifier 292 5.5.2.A Medium-Voltage High-Power Motor Drive Systems 293 5.5.2.B Experimental System 295 5.5.2.C Control System 298 5.5.2.D Three-Phase Second-Harmonic Negative Sequence Voltages Injection 300 5.5.2.E Experimental Results 303 5.5.2.F Overall System Efficiency 308 5.6 Summary 308 5.7 Exercises 309 References 310 CHAPTER 6 COMBINED SERIES AND SHUNT POWER CONDITIONERS 313 6.1 The Unified Power Flow Controller 314 6.1.1 FACTS and UPFC Principles 315 6.1.1.A Voltage Regulation Principle 317 6.1.1.B Power Flow Control Principle 318 6.1.2 A Controller Design for the UPFC 321 6.1.3 UPFC Approach Using a Shunt Multipulse Converter 328 6.1.3.A Six-Pulse Converter 328 6.1.3.B Quasi 24-Pulse Converter 332 6.1.3.C Control of Active and Reactive Power in Multipulse Converters 334 6.1.3.D Shunt Multipulse Converter Controller 336 6.2 The Unified Power Quality Conditioner 339 6.2.1 General Description of the UPQC 340 6.2.2 A Three-Phase, Four-Wire UPQC 342 6.2.2.A Power Circuit of the UPQC 343 6.2.2.B The UPQC Controller 344 6.2.2.C Analysis of the UPQC Dynamic 353 6.2.3 The UPQC Combined with Passive Filters (the Hybrid UPQC) 370 6.2.3.A Controller of the Hybrid UPQC 374 6.2.3.B Experimental Results 380 6.3 The Universal Active Power Line Conditioner 386 6.3.1 General Description of the UPLC 386 6.3.2 The Controller of the UPLC 389 6.3.2.A Controller for Configuration #2 of the UPLC 396 6.3.3 Performance of the UPLC 397 6.3.3.A Normalized System Parameters 397 6.3.3.B Simulation Results of Configuration #1 of the UPLC 401 6.3.3.C Simulation Results of Configuration #2 of the UPLC 409 6.3.4 General Aspects 411 6.4 Combined Shunt-Series Filters for AC and DC Sides of Three-Phase Rectifiers 411 6.4.1 The Combined Shunt-Series Filter 414 6.4.2 Instantaneous Real and Imaginary Powers in the ac Source 415 6.4.3 The Instantaneous Power in the dc Side of the Rectifier 416 6.4.4 Comparison of Instantaneous Powers on the ac and dc Sides of the Rectifier 418 6.4.5 Control Algorithm of the Active Shunt-Series Filter 418 6.4.6 The Common dc Link 421 6.4.7 Digital Simulation 424 6.4.8 Experimental Results 426 6.5 Summary 427 6.6 Exercises 428 References 429 INDEX 431

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Book SynopsisA unique text on the theory and design fundaments of inductors and transformers, updated with more coverage on the optimization of magnetic devices and many new design examples The first edition is popular among a very broad audience of readers in different areas of engineering and science.Trade Review“What sets this book apart from previous magnetics books recently reviewed in How2Power Today is its depth of coverage, especially of topics that are hard to analyze such as winding resistance caused by the skin and proximity effects, and parasitic winding capacitances. Kazimierczuk—I’ll call him “Kaz” for short, as Apple co-founder Steve Wozniak is called “Woz”—has worked out in sufficient detail the mathematical derivations of design equations that usually appear in the literature as either given (or else ignored entirely) rather than derived.” (How2Power.com, 1 September 2015) “Loaded with essential formulas and design methods, this book will give the designer of high-frequency magnetic components not only a better design but will reinforce an understanding of the high-frequency magnetic component design.” (IEEE Electrical Engineering magazine, 1 March 2015) Table of ContentsPreface xvii About the Author xix List of Symbols xxi 1 Fundamentals of Magnetic Devices 1 1.1 Introduction 1 1.2 Fields 2 1.3 Magnetic Relationships 2 1.4 Magnetic Circuits 6 1.5 Magnetic Laws 9 1.6 Eddy Currents 29 1.7 Core Saturation 32 1.8 Inductance 40 1.9 Air Gap in Magnetic Core 51 1.10 Fringing Flux 54 1.11 Inductance of Strip Transmission Line 62 1.12 Inductance of Coaxial Cable 62 1.13 Inductance of Two-Wire Transmission Line 63 1.14 Magnetic Energy and Magnetic Energy Density 64 1.15 Self-Resonant Frequency 69 1.16 Quality Factor of Inductors 69 1.17 Classification of Power Losses in Magnetic Components 69 1.18 Noninductive Coils 71 1.19 Summary 71 1.20 References 74 1.21 Review Questions 76 1.22 Problems 78 2 Magnetic Cores 81 2.1 Introduction 81 2.2 Properties of Magnetic Materials 81 2.3 Magnetic Dipoles 83 2.4 Magnetic Domains 89 2.5 Curie Temperature 90 2.6 Magnetic Susceptibility and Permeability 91 2.7 Linear, Isotropic, and Homogeneous Magnetic Materials 93 2.8 Magnetic Materials 93 2.9 Hysteresis 96 2.10 Low-Frequency Core Permeability 98 2.11 Core Geometries 99 2.12 Ferromagnetic Core Materials 103 2.13 Superconductors 108 2.14 Hysteresis Loss 109 2.15 Eddy-Current Core Loss 113 2.16 Steinmetz Empirical Equation for Total Core Loss 129 2.17 Core Losses for Nonsinusoidal Inductor Current 135 2.18 Complex Permeability of Magnetic Materials 136 2.19 Cooling of Magnetic Cores 151 2.20 Summary 152 2.21 References 157 2.22 Review Questions 160 2.23 Problems 161 3 Skin Effect 163 3.1 Introduction 163 3.2 Resistivity of Conductors 164 3.3 Skin Depth 166 3.4 AC-to-DC Winding Resistance Ratio 173 3.5 Skin Effect in Long Single Round Conductor 173 3.6 Current Density in Single Round Conductor 175 3.7 Magnetic Field Intensity for Round Wire 193 3.8 Other Methods of Determining the Round Wire Inductance 195 3.9 Power Loss Density in Round Conductor 200 3.10 Skin Effect in Single Rectangular Plate 204 3.11 Skin Effect in Rectangular Foil Conductor Placed Over Ideal Core 215 3.12 Summary 218 3.13 Appendix 220 3.14 References 222 3.15 Review Questions 223 3.16 Problems 224 4 Proximity Effect 226 4.1 Introduction 226 4.2 Orthogonality of Skin and Proximity Effects 227 4.3 Proximity Effect in Two Parallel Round Conductors 227 4.4 Proximity Effect in Coaxial Cable 228 4.5 Proximity and Skin Effects in Two Parallel Plates 230 4.6 Antiproximity and Skin Effects in Two Parallel Plates 244 4.7 Proximity Effect in Open-Circuit Conductor 249 4.8 Proximity Effect in Multiple-Layer Inductor 250 4.9 Self-Proximity Effect in Rectangular Conductors 256 4.10 Summary 259 4.11 Appendix 260 4.12 References 261 4.13 Review Questions 263 4.14 Problems 263 5 Winding Resistance at High Frequencies 265 5.1 Introduction 265 5.2 Eddy Currents 265 5.3 Magnetic Field Intensity in Multilayer Foil Inductors 266 5.4 Current Density in Multilayer Foil Inductors 274 5.5 Winding Power Loss Density in Individual Foil Layers 278 5.6 Complex Winding Power in nth Layer 281 5.7 Winding Resistance of Individual Foil Layers 282 5.8 Orthogonality of Skin and Proximity for Individual Foil Layers 284 5.9 Optimum Thickness of Individual Foil Layers 286 5.10 Winding Inductance of Individual Layers 291 5.11 Power Loss in All Layers 292 5.12 Impedance of Foil Winding 293 5.13 Resistance of Foil Winding 294 5.14 Dowell’s Equation 294 5.15 Approximation of Dowell’s Equation 298 5.16 Winding AC Resistance with Uniform Foil Thickness 300 5.17 Transformation of Foil Conductor to Rectangular, Square, and Round Conductors 308 5.18 Winding AC Resistance of Rectangular Conductor 309 5.19 Winding Resistance of Square Wire 318 5.20 Winding Resistance of Round Wire 326 5.21 Inductance 335 5.22 Solution for Round Conductor Winding in Cylindrical Coordinates 338 5.23 Litz Wire 338 5.24 Winding Power Loss for Inductor Current with Harmonics 351 5.25 Winding Power Loss of Foil Inductors Conducting DC and Harmonic Currents 364 5.26 Winding Power Loss of Round Wire Inductors Conducting DC and Harmonic Currents 366 5.27 Effective Winding Resistance for Nonsinusoidal Inductor Current 367 5.28 Thermal Effects on Winding Resistance 370 5.29 Thermal Model of Inductors 373 5.30 Summary 374 5.31 Appendix 375 5.32 References 377 5.33 Review Questions 381 5.34 Problems 381 6 Laminated Cores 383 6.1 Introduction 383 6.2 Low-Frequency Eddy-Current Laminated Core Loss 384 6.3 Comparison of Solid and Laminated Cores 389 6.4 Alternative Solution for Low-Frequency Eddy-Current Core Loss 389 6.4.1 Sinusoidal Inductor Voltage 391 6.4.2 Square-Wave Inductor Voltage 393 6.4.3 Rectangular Inductor Voltage 393 6.5 General Solution for Eddy-Current Laminated Core Loss 393 6.6 Summary 408 6.7 References 409 6.8 Review Questions 410 6.9 Problems 411 7 Transformers 412 7.1 Introduction 412 7.2 Transformer Construction 413 7.3 Ideal Transformer 413 7.4 Voltage Polarities and Current Directions in Transformers 416 7.5 Nonideal Transformers 417 7.6 Neumann’s Formula for Mutual Inductance 422 7.7 Mutual Inductance 424 7.8 Magnetizing Inductance 425 7.9 Coupling Coefficient 427 7.10 Leakage Inductance 429 7.11 Dot Convention 432 7.12 Series-Aiding and Series-Opposing Connections 435 7.13 Equivalent T Network 435 7.14 Energy Stored in Coupled Inductors 436 7.15 High-Frequency Transformer Model 437 7.16 Stray Capacitances 438 7.17 Transformer Efficiency 438 7.18 Transformers with Gapped Cores 438 7.19 Multiple-Winding Transformers 439 7.20 Autotransformers 439 7.21 Measurements of Transformer Inductances 440 7.22 Noninterleaved Windings 442 7.23 Interleaved Windings 444 7.24 Wireless Energy Transfer 446 7.25 AC Current Transformers 446 7.26 Saturable Reactors 454 7.27 Transformer Winding Power Losses with Harmonics 455 7.28 Thermal Model of Transformers 464 7.29 Summary 465 7.30 References 467 7.31 Review Questions 470 7.32 Problems 471 8 Integrated Inductors 472 8.1 Introduction 472 8.2 Skin Effect 472 8.3 Resistance of Rectangular Trace with Skin Effect 474 8.4 Inductance of Straight Rectangular Trace 477 8.5 Inductance of Rectangular Trace with Skin Effect 478 8.6 Construction of Integrated Inductors 480 8.7 Meander Inductors 481 8.8 Inductance of Straight Round Conductor 485 8.9 Inductance of Circular Round Wire Loop 486 8.10 Inductance of Two-Parallel Wire Loop 486 8.11 Inductance of Rectangle of Round Wire 486 8.12 Inductance of Polygon Round Wire Loop 486 8.13 Bondwire Inductors 487 8.14 Single-Turn Planar Inductor 488 8.15 Inductance of Planar Square Loop 490 8.16 Planar Spiral Inductors 490 8.17 Multimetal Spiral Inductors 505 8.18 Planar Transformers 506 8.19 MEMS Inductors 507 8.20 Inductance of Coaxial Cable 509 8.21 Inductance of Two-Wire Transmission Line 509 8.22 Eddy Currents in Integrated Inductors 509 8.23 Model of RF-Integrated Inductors 510 8.24 PCB Inductors 512 8.25 Summary 514 8.26 References 515 8.27 Review Questions 518 8.28 Problems 519 9 Self-Capacitance 520 9.1 Introduction 520 9.2 High-Frequency Inductor Model 520 9.3 Self-Capacitance Components 530 9.4 Capacitance of Parallel-Plate Capacitor 531 9.5 Self-Capacitance of Foil Winding Inductors 532 9.6 Capacitance of Two Parallel Round Conductors 533 9.7 Capacitance of Round Conductor and Parallel Conducting Plane 539 9.8 Capacitance of Straight Parallel Wire Pair Over Ground 540 9.9 Capacitance Between Two Parallel Straight Round Conductors with Uniform Charge Density 540 9.10 Capacitance of Cylindrical Capacitor 542 9.11 Self-Capacitance of Single-Layer Inductors 542 9.12 Self-Capacitance of Multilayer Inductors 545 9.13 Self-Capacitance of Single-Layer Inductors 553 9.14 T-to-Y Transformation of Capacitors 557 9.15 Overall Self-Capacitance of Single-Layer Inductor with Core 557 9.16 Measurement of Self-Capacitance 559 9.17 Inductor Impedance 560 9.18 Summary 564 9.19 References 565 9.20 Review Questions 566 9.21 Problems 566 10 Design of Inductors 568 10.1 Introduction 568 10.2 Magnet Wire 569 10.3 Wire Insulation 572 10.4 Restrictions on Inductors 572 10.5 Window Utilization Factor 574 10.6 Temperature Rise of Inductors 581 10.7 Mean Turn Length of Inductors 585 10.8 Area Product Method 586 10.9 Design of AC Inductors 590 10.10 Inductor Design for Buck Converter in CCM 603 10.11 Inductor Design for Buck Converter in DCM Using Ap Method 619 10.12 Core Geometry Coefficient Kg Method 654 10.13 Inductor Design for Buck Converter in CCM Using Kg Method 658 10.14 Inductor Design for Buck Converter in DCM Using Kg Method 660 10.15 Summary 663 10.16 References 664 10.17 Review Questions 666 10.18 Problems 666 11 Design of Transformers 668 11.1 Introduction 668 11.2 Area Product Method 668 11.3 Optimum Flux Density 673 11.4 Area Product Ap for Sinusoidal Voltages 674 11.5 Transformer Design for Flyback Converter in CCM 675 11.6 Transformer Design for Flyback Converter in DCM 689 11.7 Geometrical Coefficient Kg Method 702 11.8 Transformer Design for Flyback Converter in CCM Using Kg Method 705 11.9 Transformer Design for Flyback Converter in DCM Using Kg Method 709 11.10 Summary 714 11.11 References 714 11.12 Review Questions 715 11.13 Problems 715 Appendix A Physical Constants 717 Appendix B Maxwell's Equations 718 Answers to Problems 719 Index 725

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Book SynopsisUses Verilog HDL to illustrate computer architecture and microprocessor design, allowing readers to readily simulate and adjust the operation of each design, and thus build industrially relevant skills Introduces the computer principles, computer design, and how to use Verilog HDL (Hardware Description Language) to implement the designProvides the skills for designing processor/arithmetic/cpu chips, including the unique application of Verilog HDL material for CPU (central processing unit) implementationDespite the many books on Verilog and computer architecture and microprocessor design, few, if any, use Verilog as a key tool in helping a student to understand these design techniquesA companion website includes color figures, Verilog HDL codes, extra test benches not found in the book, and PDFs of the figures and simulation waveforms for instructorsTable of ContentsList of Figures xv List of Tables xxvii Preface xxix 1 Computer Fundamentals and Performance Evaluation 1 2 A Brief Introduction to Logic Circuits and Verilog HDL 19 3 Computer Arithmetic Algorithms and Implementations 63 4 Instruction Set Architecture and ALU Design 111 5 Single-Cycle CPU Design in Verilog HDL 143 6 Exceptions and Interrupts Handling and Design in Verilog HDL 170 7 Multiple-Cycle CPU Design in Verilog HDL 192 8 Design of Pipelined CPU with Precise Interrupt in Verilog HDL 212 9 Floating-Point Algorithms and FPU Design in Verilog HDL 266 10 Design of Pipelined CPU with FPU in Verilog HDL 323 11 Memory Hierarchy and Virtual Memory Management 353 12 Design of Pipelined CPU with Caches and TLBs in Verilog HDL 386 13 Multithreading CPU and Multicore CPU Design in Verilog HDL 425 14 Input/Output Interface Controller Design in Verilog HDL 443 15 High-Performance Computers and Interconnection Networks 509 Bibliography 536 Index 539

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Book SynopsisApplies basic field behavior in circuit design anddemonstrates how it relates togrounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field. Grounding and Shielding: Circuits and Interference, Sixth Edition: Includes new material on vias and field control, capacitTable of ContentsPreface to the Sixth Edition xi A Historical Perspective into Grounding and Shielding xv 1. Voltage and Capacitors 1 1.1. Introduction 1 1.2. Charges and Electrons 4 1.3. The Electric Force Field 6 1.4. Field Representations 6 1.5. The Definition of Voltage 9 1.6. Equipotential Surfaces 10 1.7. The Force Field or E Field Between Two Conducting Plates 11 1.8. Electric Field Patterns 12 1.9. The Energy Stored in An Electric Field 16 1.10. Dielectrics 17 1.11. The D Field 18 1.12. Capacitance 19 1.13. Mutual Capacitance 21 1.14. Displacement Current 22 1.15. Energy Stored in a Capacitor 23 1.16. Forces in the Electric Field 24 1.17. Capacitors 25 1.18. Dielectric Absorption 25 1.19. Resistance of Plane Conductors 26 2. Magnetics 27 2.1. Magnetic Fields 27 2.2. Ampere’s Law 29 2.3. The Solenoid 30 2.4. Faraday’s Law and the Induction Field 30 2.5. The Definition of Inductance 32 2.6. The Energy Stored in an Inductance 32 2.7. Magnetic Field Energy in Space 34 2.8. Electron Drift 36 2.9. The Magnetic Circuit 36 2.10. A Magnetic Circuit with a Gap 38 2.11. Small Inductors 39 2.12. Self- and Mutual Inductance 40 2.13. Transformer Action 40 2.14. Hysteresis and Permeability 45 2.15. Eddy Currents 46 3. Digital Electronics 48 3.1. Introduction 49 3.2. The Transport of Electrical Energy 49 3.3. Transmission Lines–Introduction 50 3.4. Transmission Line Operations 52 3.5. Transmission Line Field Patterns 54 3.6. A Terminated Transmission Line 54 3.7. The Unterminated Transmission Line 56 3.8. A Short Circuit Termination 58 3.9. The Real World 59 3.10. SineWaves Versus Step Voltages 60 3.11. A Bit of History 61 3.12. Ideal Conditions 61 3.13. Reflection and Transmission Coefficients 62 3.14. Taking Energy from an Ideal Energy Source 63 3.15. A Capacitor as a Transmission Line 63 3.16. Decoupling Capacitors and Natural Frequencies 65 3.17. Printed Circuit Boards 66 3.18. Two-Layer Logic Boards 67 3.19. Vias 68 3.20. The Termination of Transmission Lines 70 3.21. Energy in the Ground/Power Plane Capacitance 72 3.22. Poynting’s Vector 73 3.23. Skin Effect 74 3.24. Measurement Problems: Ground Bounce 75 3.25. Balanced Transmission 76 3.26. Ribbon Cable and Connectors 77 3.27. Interfacing Analog and Digital Circuits 78 4. Analog Circuits 80 4.1. Introduction 80 4.2. Instrumentation 81 4.3. History 83 4.4. The Basic Shield Enclosure 83 4.5. The Enclosure and Utility Power 86 4.6. The Two-Ground Problem 88 4.7. Instrumentation and the Two-Ground Problem 89 4.8. Strain-Gauge Instrumentation 92 4.9. The Floating Strain Gauge 93 4.10. The Thermocouple 95 4.11. The Basic Low-Gain Differential Amplifier (Forward Referencing Amplifer) 96 4.12. Shielding in Power Transformers 98 4.13. Calibration and Interference 99 4.14. The Guard Shield Above 100 kHz 100 4.15. Signal Flow Paths in Analog Circuits 101 4.16. Parallel Active Components 101 4.17. Feedback Stability–Introduction 102 4.18. Feedback Theory 103 4.19. Output Loads and Circuit Stability 105 4.20. Feedback Around a Power Stage 105 4.21. Constant Current Loops 106 4.22. Filters and Aliasing Errors 107 4.23. Isolation and DC-To-DC Converters 108 4.24. Charge Converter Basics 110 4.25. DC Power Supplies 113 4.26. Guard Rings 113 4.27. Thermocouple Effects 114 4.28. Some Thoughts on Instrumentation 114 5. Utility Power and Facility Grounding 115 5.1. Introduction 115 5.2. History 116 5.3. Semantics 116 5.4. Utility Power 117 5.5. The Earth as a Conductor 119 5.6. The Neutral Connection to Earth 120 5.7. Ground Potential Differences 122 5.8. Field Coupling to Power Conductors 124 5.9. Neutral Conductors 125 5.10. k Factor in Transformers 126 5.11. Power Factor Correction 127 5.12. Ungrounded Power 127 5.13. A Request for Power 128 5.14. Earth Power Currents 129 5.15. Line Filters 129 5.16. Isolated Grounds 130 5.17. Facility Grounds–Some More History 132 5.18. Ground Planes in Facilities 134 5.19. Other Ground Planes 137 5.20. Ground at Remote Sites 137 5.21. Extending Ground Planes 137 5.22. Lightning 138 5.23. Lightning and Facilities 139 5.24. Lightning Protection for Boats and Ships 141 5.25. Grounding of Boats and Ships at Dock 143 5.26. Aircraft Grounding (Fueling) 144 5.27. Ground Fault Interruption (GFI) 144 5.28. Isolation Transformers 145 5.29. Grounding and the Pacific Intertie 147 5.30. SolarWind 148 6. Radiation 149 6.1. Handling Radiation and Susceptibility 149 6.2. Radiation 150 6.3. SineWaves and Transmission Lines 151 6.4. Approximations for Pulses and SquareWaves 152 6.5. Radiation from Components 156 6.6. The Dipole Antenna 157 6.7. Wave Impedance 158 6.8. Field Strength and Antenna Gain 159 6.9. Radiation from Loops 160 6.10. E-Field Coupling to a Loop 162 6.11. Radiation from Printed Circuit Boards 163 6.12. The Sniffer and the Antenna 164 6.13. Microwave Ovens 165 7. Shielding from Radiation 166 7.1. Cables with Shields 166 7.2. Low-Noise Cables 168 7.3. Transfer Impedance 169 7.4. Waveguides 172 7.5. Electromagnetic Fields over a Ground Plane 173 7.6. Fields and Conductors 174 7.7. Conductive Enclosures–Introduction 175 7.8. Coupling Through EnclosureWalls by an Induction Field 176 7.9. Reflection and Absorption of Field Energy at a Conducting Surface 177 7.10. Independent Apertures 178 7.11. Dependent Apertures 179 7.12. Honeycombs 180 7.13. Summing Field Penetrations 181 7.14. Power Line Filters 182 7.15. Backshell Connectors 184 7.16. H-Field Coupling 186 7.17. Gaskets 186 7.18. Finger Stock 187 7.19. Glass Apertures 188 7.20. Guarding Large Transistors 188 7.21. Mounting Components on Surfaces 188 7.22. Zappers 190 7.23. Shielded and Screen Rooms 190 AppendixA. The Decibel 192 Further Reading 194 Index 195

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Book SynopsisLinear Circuit Transfer Functions: An introduction to Fast Analytical Techniques teaches readers how to determine transfer functions of linear passive and active circuits by applying Fast Analytical Circuits Techniques. Building on their existing knowledge of classical loop/nodal analysis, the book improves and expands their skills to unveil transfer functions in a swift and efficient manner. Starting with simple examples, the author explains step-by-step how expressing circuits time constants in different configurations leads to writing transfer functions in a compact and insightful way. By learning how to organize numerators and denominators in the fastest possible way, readers will speed-up analysis and predict the frequency response of simple to complex circuits. In some cases, they will be able to derive the final expression by inspection, without writing a line of algebra. Key features: Emphasizes analysis through employing time Table of ContentsAbout the Author ix Preface xi Acknowledgement xiii 1 Electrical Analysis – Terminology and Theorems 1 1.1 Transfer Functions, an Informal Approach 1 1.1.1 Input and Output Ports 3 1.1.2 Different Types of Transfer Function 6 1.2 The Few Tools and Theorems You Did Not Forget . . . 11 1.2.1 The Voltage Divider 11 1.2.2 The Current Divider 12 1.2.3 Thévenin’s Theorem at Work 14 1.2.4 Norton’s Theorem at Work 19 1.3 What Should I Retain from this Chapter? 25 1.4 Appendix 1A – Finding Output Impedance/Resistance 26 1.5 Appendix 1B – Problems 37 Answers 39 2 Transfer Functions 41 2.1 Linear Systems 41 2.1.1 A Linear Time-invariant System 43 2.1.2 The Need for Linearization 43 2.2 Time Constants 44 2.2.1 Time Constant Involving an Inductor 47 2.3 Transfer Functions 49 2.3.1 Low-entropy Expressions 54 2.3.2 Higher Order Expressions 59 2.3.3 Second-order Polynomial Forms 60 2.3.4 Low-Q Approximation for a 2nd-order Polynomial 62 2.3.5 Approximation for a 3rd-order Polynomial 68 2.3.6 How to Determine the Order of the System? 69 2.3.7 Zeros in the Network 76 2.4 First Step Towards a Generalized 1st-order Transfer Function 78 2.4.1 Solving 1st-order Circuits with Ease, Three Examples 82 2.4.2 Obtaining the Zero with the Null Double Injection 89 2.4.3 Checking Zeros Obtained in Null Double Injection with SPICE 94 2.4.4 Network Excitation 95 2.5 What Should I Retain from this Chapter? 100 References 101 2.6 Appendix 2A – Problems 102 Answers 105 3 Superposition and the Extra Element Theorem 116 3.1 The Superposition Theorem 116 3.1.1 A Two-input/Two-output System 120 3.2 The Extra Element Theorem 126 3.2.1 The EET at Work on Simple Circuits 130 3.2.2 The EET at Work – Example 2 132 3.2.3 The EET at Work – Example 3 137 3.2.4 The EET at Work – Example 4 138 3.2.5 The EET at Work – Example 5 140 3.2.6 The EET at Work – Example 6 146 3.2.7 Inverted Pole and Zero Notation 150 3.3 A Generalized Transfer Function for 1st-order Systems 153 3.3.1 Generalized Transfer Function – Example 1 156 3.3.2 Generalized Transfer Function – Example 2 159 3.3.3 Generalized Transfer Function – Example 3 163 3.3.4 Generalized Transfer Function – Example 4 170 3.3.5 Generalized Transfer Function – Example 5 174 3.4 Further Reading 180 3.5 What Should I Retain from this Chapter? 180 References 182 3.6 Appendix 3A – Problems 183 Answers 185 References 218 4 Second-order Transfer Functions 219 4.1 Applying the Extra Element Theorem Twice 219 4.1.1 Low-entropy 2nd-order Expressions 227 4.1.2 Determining the Zero Positions 231 4.1.3 Rearranging and Plotting Expressions 233 4.1.4 Example 1 – A Low-Pass Filter 235 4.1.5 Example 2 – A Two-capacitor Filter 241 4.1.6 Example 3 – A Two-capacitor Band-stop Filter 245 4.1.7 Example 4 – An LC Notch Filter 248 4.2 A Generalized Transfer Function for 2nd-Order Systems 255 4.2.1 Inferring the Presence of Zeros in the Circuit 256 4.2.2 Generalized 2nd–order Transfer Function – Example 1 257 4.2.3 Generalized 2nd–order Transfer Function – Example 2 262 4.2.4 Generalized 2nd–order Transfer Function – Example 3 266 4.2.5 Generalized 2nd–order Transfer Function – Example 4 273 4.3 What Should I Retain from this Chapter ? 277 References 279 4.4 Appendix 4A – Problems 279 Answers 282 References 311 5 Nth-order Transfer Functions 312 5.1 From the 2EET to the NEET 312 5.1.1 3rd-order Transfer Function Example 317 5.1.2 Transfer Functions with Zeros 320 5.1.3 A Generalized Nth-order Transfer Function 327 5.2 Five High-order Transfer Functions Examples 335 5.2.1 Example 2: A 3rd-order Active Notch Circuit 341 5.2.2 Example 3: A 4th-order LC Passive Filter 349 5.2.3 Example 4: A 4th-order Band-pass Active Filter 355 5.2.4 Example 5: A 3rd-order Low-pass Active GIC Filter 368 5.3 What Should I Retain from this Chapter ? 383 References 385 5.5 Appendix 5A – Problems 385 Answers 388 References 431 Conclusion 433 Glossary of Terms 435 Index 439

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Book SynopsisA concise and original presentation of the fundamentals for new to the subject electrical engineers This book has been written for students on electrical engineering courses who don t necessarily possess prior knowledge of electrical circuits.Table of ContentsImportant Units xi Conventions with Examples xiii Preface xv About the Companion Website xix 1 Introduction 1 1.1 Circuits and Important Quantities 1 1.1.1 Electric Charge 1 1.1.2 Electric Potential (Voltage) 3 1.1.3 Electric Current 4 1.1.4 Electric Voltage and Current in Electrical Circuits 5 1.1.5 Electric Energy and Power of a Component 6 1.1.6 dc and AC Signals 7 1.1.7 Transient State and Steady State 8 1.1.8 Frequency in Circuits 9 1.2 Resistance and Resistors 9 1.2.1 Current Types, Conductance, and Ohm’s Law 10 1.2.2 Good Conductors and Insulators 10 1.2.3 Semiconductors 11 1.2.4 Superconductivity and Perfect Conductivity 11 1.2.5 Resistors as Circuit Components 12 1.3 Independent Sources 13 1.4 Dependent Sources 14 1.5 Basic Connections of Components 15 1.6 Limitations in Circuit Analysis 19 1.7 What You Need to Know before You Continue 20 2 Basic Tools: Kirchhoff’s Laws 23 2.1 Kirchhoff’s Current Law 23 2.2 Kirchhoff’s Voltage Law 24 2.3 When Things Go Wrong with KCL and KVL 36 2.4 Series and Parallel Connections of Resistors 40 2.4.1 Series Connection 40 2.4.2 Parallel Connection 41 2.5 When Things Go Wrong with Series/Parallel Resistors 45 2.6 What You Need to Know before You Continue 46 3 Analysis of Resistive Networks: Nodal Analysis 47 3.1 Application of Nodal Analysis 47 3.2 Concept of Supernode 59 3.3 Circuits with Multiple Independent Voltage Sources 72 3.4 Solving Challenging Problems Using Nodal Analysis 74 3.5 When Things Go Wrong with Nodal Analysis 86 3.6 What You Need to Know before You Continue 90 4 Analysis of Resistive Networks: Mesh Analysis 93 4.1 Application of Mesh Analysis 93 4.2 Concept of Supermesh 107 4.3 Circuits with Multiple Independent Current Sources 121 4.4 Solving Challenging Problems Using the Mesh Analysis 122 4.5 When Things Go Wrong with Mesh Analysis 135 4.6 What You Need to Know before You Continue 137 5 Black-Box Concept 139 5.1 Thévenin and Norton Equivalent Circuits 139 5.2 Maximum Power Transfer 158 5.3 Shortcuts in Equivalent Circuits 173 5.4 When Things Go Wrong with Equivalent Circuits 176 5.5 What You Need to Know before You Continue 178 6 Transient Analysis 181 6.1 Capacitance and Capacitors 181 6.2 Inductance and Inductors 191 6.3 Time-Dependent Analysis of Circuits in Transient State 195 6.3.1 Time-Dependent Analysis of RC Circuits 195 6.3.2 Time-Dependent Analysis of RL Circuits 204 6.3.3 Impossible Cases 207 6.4 Switching and Fixed-Time Analysis 208 6.5 Parallel and Series Connections of Capacitors and Inductors 218 6.5.1 Connections of Capacitors 218 6.5.2 Connections of Inductors 220 6.6 When Things Go Wrong in Transient Analysis 222 6.7 What You Need to Know before You Continue 224 7 Steady-State Analysis of Time-Harmonic Circuits 227 7.1 Steady-State Concept 227 7.2 Time-Harmonic Circuits with Sinusoidal Sources 228 7.2.1 Resistors Connected to Sinusoidal Sources 229 7.2.2 Capacitors Connected to Sinusoidal Sources 230 7.2.3 Inductors Connected to Sinusoidal Sources 231 7.2.4 Root-Mean-Square Concept 232 7.3 Concept of Phasor Domain and Component Transformation 234 7.3.1 Resistors in Phasor Domain 236 7.3.2 Capacitors in Phasor Domain 236 7.3.3 Inductors in Phasor Domain 237 7.3.4 Impedance Concept 238 7.4 Special Circuits in Phasor Domain 243 7.4.1 RC Circuits in Phasor Domain 243 7.4.2 RL Circuits in Phasor Domain 244 7.4.3 RLC Circuits in Phasor Domain 246 7.4.4 Other Combinations 247 7.5 Analysis of Complex Circuits at Fixed Frequencies 248 7.6 Power in Steady State 259 7.6.1 Instantaneous and Average Power 259 7.6.2 Complex Power 260 7.6.3 Impedance Matching 266 7.7 When Things Go Wrong in Steady-State Analysis 271 7.8 What You Need to Know before You Continue 274 8 Selected Components of Modern Circuits 275 8.1 When Connections Are via Magnetic Fields: Transformers 275 8.2 When Components Behave Differently from Two Sides: Diodes 278 8.3 When Components Involve Many Connections: OP-AMPs 284 8.4 When Circuits Become Modern: Transistors 288 8.5 When Components Generate Light: LEDs 293 8.6 Conclusion 294 9 Practical Technologies in Modern Circuits 295 9.1 Measurement Instruments 295 9.2 Three-Phase Power Delivery 297 9.3 AD and DA Converters 300 9.4 Logic Gates 303 9.5 Memory Units 307 9.6 Conclusion 309 10 Next Steps 311 10.1 Energy Is Conserved, Always! 311 10.2 Divide and Conquer Complex Circuits 313 10.3 Appreciate the Package 314 10.4 Consider Yourself as a Circuit Element 316 10.5 Safety First 317 11 Photographs of Some Circuit Elements 321 A Appendix 325 A.1 Basic Algebra Identities 325 A.2 Trigonometry 325 A.3 Complex Numbers 325 B Solutions to Exercises 327 Index 401

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Book SynopsisHarmonic Modeling of Voltage Source Converters using Basic Numerical Methods One of the first books to bridge the gap between frequency domain and time-domain methods of steady-state modeling of power electronic converters Harmonic Modeling of Voltage Source Converters using Basic Numerical Methods presents detailed coverage of steady-state modeling of power electronic devices (PEDs). This authoritative resource describes both large-signal and small-signal modeling of power converters and how some of the simple and commonly used numerical methods can be applied for harmonic analysis and modeling of power converter systems. The book covers a variety of power converters including DC-DC converters, diode bridge rectifiers (AC-DC), and voltage source converters (DC-AC). The authors provide in-depth guidance on modeling and simulating power converter systems. Detailed chapters contain relevant theory, practical examples, clear illustrations, sample Python and Table of ContentsPreface xiii Acknowledgments xvii List of Symbols xix 1 Fundamental Theory 1 1.1 Background 1 1.2 Definition of Harmonics 2 1.3 Fourier Series 2 1.3.1 Trigonometric Form 3 1.3.2 Phasor Form 4 1.3.3 Exponential Form 4 1.4 Waveform Symmetry 5 1.4.1 Even Symmetry 5 1.4.2 Odd Symmetry 6 1.4.3 Half-Wave Symmetry 6 1.5 Phase Sequence of Harmonics 8 1.6 Frequency Domain and Harmonic Domain 8 1.7 Power Definitions 9 1.7.1 Average Power 9 1.7.2 Apparent and Reactive Power 9 1.8 Harmonic Indices 11 1.8.1 Total Harmonic Distortion (THD) 11 1.8.2 Total Demand Distortion (TDD) 12 1.8.3 True Power Factor 12 1.9 Detrimental Effects of Harmonics 13 1.9.1 Resonance 13 1.9.2 Misoperations of Meters and Relays 17 1.9.3 Harmonics Impact on Motors 18 1.9.4 Harmonics Impact on Transformers 18 1.10 Characteristic Harmonic and Non-Characteristic Harmonic 19 1.11 Harmonic Current Injection Method 21 1.12 Steady-State vs. Transient Response 21 1.13 Steady-State Modeling 22 1.14 Large-Signal Modeling vs. Small-Signal Modeling 24 1.15 Discussion of IEEE Standard (STD) 519 25 1.16 Supraharmonics 30 2 Power Electronics Basics 37 2.1 Some Basics 37 2.2 Semiconductors vs. Wide Bandgap Semiconductors 38 2.3 Types of Static Switches 40 2.3.1 Uncontrolled Static Switch 40 2.3.2 Semi-Controllable Switches 41 2.3.3 Controlled Switch 42 2.4 Combination of Switches 44 2.5 Classification Based on Commutation Process 45 2.6 Voltage Source Converter vs. Current Source Converter 46 3 Basic Numerical Iterative Methods 49 3.1 Definition of Error 49 3.2 The Gauss–Seidel Method 50 3.3 Predictor-Corrector 52 3.4 Newton’s Method 55 3.4.1 Root Finding 55 3.4.2 Numerical Integration 56 3.4.3 Power Flow 57 3.4.4 Harmonic Power Flow 61 3.4.5 Shooting Method 63 3.4.6 Advantages of Newton’s Method 67 3.4.7 Quasi-Newton Method 69 3.4.8 Limitation of Newton’s Method 71 3.5 PSO 71 4 Matrix Exponential 73 4.1 Definition of Matrix Exponential 74 4.2 Evaluation of Matrix Exponential 75 4.2.1 Inverse Laplace Transform 75 4.2.2 Cayley–Hamilton Method 76 4.2.3 Padé Approximation 78 4.2.4 Scaling and Squaring 80 4.3 Krylov Subspace Method 80 4.4 Krylov Space Method with Restarting 83 4.5 Application of Augmented Matrix on DC-DC Converters 86 4.6 Runge–Kutta Methods 90 5 Modeling of Voltage Source Converters 95 5.1 Single-Phase Two-Level VSCs 95 5.1.1 Switching Functions 95 5.1.2 Switched Circuits 97 5.2 Three-Phase Two-Level VSCs 99 5.3 Three-Phase Multilevel Voltage Source Converter 112 5.3.1 Multilevel PWM 112 5.3.2 Diode Clamped Multilevel VSCs 114 5.3.3 Flying Capacitor Multilevel VSCs 120 5.3.4 Cascaded Multi-Level VSCs 128 5.3.5 Modular Multi-Level VSC 140 6 Frequency Coupling Matrices 149 6.1 Construction of FCM in the Harmonic Domain 149 6.2 Construction of FCM in the Time Domain 155 7 General Control Approaches of a VSC 179 7.1 Reference Frame 179 7.1.1 Stationary-abc Frame 179 7.1.2 Stationary-𝛼𝛽 Frame 180 7.1.3 Synchronous-dq Frame 181 7.1.4 Phase-Locked Loop 182 7.2 Control Strategies 183 7.2.1 Vector-Current Controller 183 7.2.2 Direct Power Controller 186 7.2.3 DC-bus Voltage Controller 188 7.2.4 Circulating Current Controller 189 8 Generalized Steady-State Solution Procedure for Closed-Loop Converter Systems 193 8.1 Introduction 193 8.2 Generalized Procedure 193 8.2.1 Step 1: Determine How and Where to Break the Loop 195 8.2.2 Step 2: Check if the Calculation Flows of the Broken System are Feasible 195 8.2.3 Step 3: Determine What Domain of Each Component in the System Should be Modeled 196 8.2.4 Step 4: Formulate the Mismatch Equations 197 8.2.5 Step 5: Iterate to Find the Solution 197 8.3 Previously Proposed Methods Derived from the Proposed Solution Procedures 197 8.3.1 Steady-State Methods Derived from Loop-Breaking 1 Method 197 8.3.2 Steady-State Methods Derived from Loop-Breaking 2 Method 198 8.4 The Loop-Breaking 3 Method 200 9 Loop-Breaking 1 Method 205 9.1 A Typical Two-Level VSC with AC Current Control and DC Voltage Control 205 9.2 Loop-Breaking 1 Method for a Two-Level VSC 206 9.2.1 Block 1 208 9.2.2 Current Controller Block 208 9.2.3 Voltage Controller Block 210 9.3 Solution Flow Diagram 210 9.3.1 Initialization 212 9.3.2 Jacobian Matrix 212 9.3.3 Number of Modulating Voltage Harmonics to be Included 228 10 Loop-Breaking 2 Method for Solving a VSC 245 10.1 Modeling for a Closed-Loop DC-DC Converter 245 10.1.1 Model of the Buck Converter 245 10.1.2 Constraints of Steady-State 247 10.1.3 Switching Time Constraints 248 10.1.4 Solution Flow Diagram 248 10.2 Two-Level VSC Modeling: Open-Loop Equations 252 10.2.1 Steady-State Constraints 256 10.2.2 Switching Time Constraints 257 10.2.3 Solution Flow Diagram 260 10.2.4 Initialization 260 10.2.5 Jacobian Matrix 260 10.2.6 Discussions of Results 269 10.3 Comparison Between the LB 1 and LB 2 Methods 270 10.3.1 Case #1: Balanced System 270 10.3.2 Case #2: Unbalanced System with AC Waveform Exhibiting Half-Wave Symmetry 270 10.3.3 Case #3: Unbalanced System, No Waveform Symmetry 272 10.4 Large-Signal Modeling for Line-Commutated Power Converter 272 10.4.1 Discontinuous Conduction Mode 273 10.4.2 Continuous Conduction Mode 282 10.4.3 Steady-State Constraint Equations 284 10.4.4 General Comments 291 11 Loop-Breaking 3 Method 293 11.1 OpenDSS 293 11.2 Interfacing OpenDSS with MATLAB 294 11.3 Interfacing OpenDSS with Harmonic Models of VSCs 299 12 Small-Signal Harmonic Model of a VSC 315 12.1 Problem Statement 315 12.2 Gauss–Seidel LB 3 and Newton LB 3 316 12.2.1 Current Injection Method 316 12.2.2 Norton Circuit Method 317 12.3 Small-Signal Analysis of DC-DC Converter 320 12.4 Small-Signal Analysis of a Two-Level VSC 325 12.4.1 Approach from Section 12.3 325 12.4.2 Simpler Approach 326 13 Parameter Estimation for a Single VSC 335 13.1 Background on Parameter Estimation 335 13.2 Parameter Estimator Based on White-Box-and-Black-Box Models 337 13.3 Estimation Validations 339 13.3.1 Experimental Validation 340 13.3.2 PSCAD/EMTDC Validation 343 14 Parameter Estimation for Multiple VSCs with Domain Adaptation 349 14.1 Introduction of Deep Learning 349 14.2 Domain Adaptation 351 14.3 Parameter Estimation for Multiple VSCs 352 14.4 Notations for DA 353 14.5 Supervised Domain Adaptation for Regression 355 14.6 Supervised Domain Adaptation for Classification 356 14.7 Test Setup 358 14.7.1 Data Generator 359 14.7.2 Data Preprocessing 359 14.8 Performance Metrics 361 14.8.1 R square (Regression) 361 14.8.2 Mean Absolute Percentage Error, MAPE (Regression) 361 14.8.3 Accuracy (Classification) 362 14.8.4 F1 score (Classification) 362 14.9 Test Results 363 14.9.1 Classification Task on Multiple VSC 363 14.9.2 Regression Task on Multiple VSC 363 14.10 Software for Running the Codes 370 14.11 Implementation of Domain Adaptation 370 14.11.1 Data Generation 370 14.11.2 Regression 372 14.11.3 Classification network 375 References 379 Index 389

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Book SynopsisLIQUID CRYSTAL DISPLAYS THE NEW EDITION OF THE GOLD-STANDARD IN TEACHING AND REFERENCING THE FUNDAMENTALS OF LCD TECHNOLOGIES This book presents an up-to-date view of modern LCD technology. Offering balanced coverage of all major aspects of the field, this comprehensive volume provides the theoretical and practical information required for the development and manufacture of high-performance, energy-efficient LCDs. The third edition incorporates new technologies and applications throughout. Several brand-new chapters discuss topics such as the application of Oxide TFTs and high mobility circuits, high-mobility TFT-semiconductors in LCD addressing, liquid crystal displays in automotive instrument clusters and touch-screen systems, and the use of ultra-high-resolution LCD panels in augmented reality (AR) and virtual reality (VR) displays. This practical reference and guide: Provides a complete account of commercially relevant LCD technologies, including Table of ContentsSeries Editor's Preface to the Third Edition Foreword to the Second Edition Preface to the Third Edition Preface to the Second Edition Preface to the First Edition About the Authors 1 Introduction 1 2 Liquid Crystal Materials and Liquid Crystal Cells 3 2.1 Properties of Liquid Crystals 3 2.1.1 Shape and phases of liquid crystals 3 2.1.2 Material properties of anisotropic liquid crystals 6 2.2 The Operation of a Twisted Nematic LCD 11 2.2.1 The electro-optical effects in transmissive twisted nematic LC cells 11 2.2.2 The addressing of LCDs by TFTs 18 3 Electro-optic Effects in Untwisted Nematic Liquid Crystals 21 3.1 The Planar and Harmonic Wave of Light 21 3.2 Propagation of Polarized Light in Birefringent Untwisted Nematic Liquid Crystal Cells 26 3.2.1 The propagation of light in a Fre´edericksz cell 26 3.2.2 The transmissive Fre´edericksz cell 31 3.2.3 The reflective Fre´edericksz cell 37 3.2.4 The Fre´edericksz cell as a phase-only modulator 39 3.2.5 The DAP cell or the vertically aligned cell 42 3.2.6 The HAN cell 44 3.2.7 The p cell 46 3.2.8 Switching dynamics of untwisted nematic LCDs 48 3.2.9 Fast blue phase liquid crystals 54 4 Electro-optic Effects in Twisted Nematic Liquid Crystals 57 4.1 The Propagation of Polarized Light in Twisted Nematic Liquid Crystal Cells 57 COPYRIGHTED MATERIAL 4.2 The Various Types of TN Cells 67 4.2.1 The regular TN cell 67 4.2.2 The supertwisted nematic LC cell (STN-LCD) 70 4.2.3 The mixed mode twisted nematic cell (MTN cell) 74 4.2.4 Reflective TN cells 76 4.3 Electronically Controlled Birefringence for the Generation of Colour 80 5 Descriptions of Polarization 83 5.1 The Characterizations of Polarization 83 5.2 A Differential Equation for the Propagation of Polarized Light through Anisotropic Media 91 5.3 Special Cases for Propagation of Light 95 5.3.1 Incidence of linearly polarized light 95 5.3.2 Incident light is circularly polarized 97 6 Propagation of Light with an Arbitrary Incident Angle through Anisotropic Media 99 6.1 Basic Equations for the Propagation of Light 99 6.2 Enhancement of the Performance of LC Cells 107 6.2.1 The degradation of picture quality 107 6.2.2 Optical compensation foils for the enhancement of picture quality 109 6.2.2.1 The enhancement of contrast 109 6.2.2.2 Compensation foils for LC molecules with different optical axis 110 6.2.3 Suppression of grey shade inversion and the preservation of grey shade stability 115 6.2.4 Fabrication of compensation foils 116 6.3 Electro-optic Effects with Wide Viewing Angle 116 6.3.1 Multidomain pixels 116 6.3.2 In-plane switching 117 6.3.3 Optically compensated bend cells 119 6.4 Multidomain VA Cells, Especially for TV 121 6.4.1 The torque generated by an electric field 122 6.4.2 The requirements for a VA display, especially for TV 124 6.4.2.1 The speeds of operation 124 6.4.2.2 Colour shift, change in contrast and image sticking 124 6.4.3 VA cells for TV applications 129 6.4.3.1 Multidomain VA cells with protrusions (MVAs) 129 6.4.3.2 Patterned VA cells (PVAs) 130 6.4.3.3 PVA cells with two subpixels (CS-S-PVAs) 132 6.4.3.4 Cell technologies avoiding a delayed optical response 136 – Polymer sustained alignment (PSA) 136 – Mountain shaped cell surface 137 6.4.3.5 The continuous pinwheel alignment (CPA) 139 6.5 Polarizers with Increased Luminous Output 140 6.5.1 A reflective linear polarizer 140 6.5.2 A reflective polarizer working with circularly polarized light 141 6.6 Two Non-birefringent Foils 142 7 Modified Nematic Liquid Crystal Displays 145 7.1 Polymer Dispersed LCDs (PDLCDs) 145 7.1.1 The operation of a PDLCD 145 7.1.2 Applications of PDLCDs 149 7.2 Guest-Host Displays 150 7.2.1 The operation of Guest-Host Displays 150 7.2.2 Reflective Guest-Host Displays 154 8 Bistable Liquid Crystal Displays 159 8.1 Ferroelectric Liquid Crystal Displays (FLCDs) 159 8.2 Chiral Nematic Liquid Crystal Displays 168 8.3 Bistable Nematic Liquid Crystal Displays 174 8.3.1 Bistable twist cells 174 8.3.2 Grating aligned nematic devices 175 8.3.3 Monostable surface anchoring switching 177 9 Continuously Light Modulating Ferroelectric Displays 179 9.1 Deformed Helix Ferroelectric Devices 179 9.2 Antiferroelectric LCDs 181 10 Addressing Schemes for Liquid Crystal Displays 185 11 Direct Addressing 189 12 Passive Matrix Addressing of TN Displays 191 12.1 The Basic Addressing Scheme and the Law of Alt and Pleshko 191 12.2 Implementation of PM Addressing 196 12.3 Multiple Line Addressing 201 12.3.1 The basic equations 201 12.3.2 Waveforms for the row selection 203 12.3.3 Column voltage for MLA 205 12.3.4 Implementation of multi-line addressing 206 12.3.5 Modified PM addressing of STN cells 210 12.3.5.1 Decreased levels of addressing voltages 210 12.3.5.2 Contrast and grey shades for MLA 212 12.4 Two Frequency Driving of PMLCDs 218 13 Passive Matrix Addressing of Bistable Displays 223 13.1 Addressing of Ferroelectric LCDs 223 13.1.1 The V–tmin addressing scheme 225 13.1.2 The V–1/t addressing scheme 226 13.1.3 Reducing crosstalk in FLCDs 228 13.1.4 Ionic effects during addressing 228 13.2 Addressing of Chiral Nematic Liquid Crystal Displays 231 14 Addressing of Liquid Crystal Displays with a-Si Thin Film Transistors (a-Si-TFTs) 239 14.1 Properties of a-Si Thin Film Transistors 239 14.2 Static Operation of TFTs in an LCD 244 14.3 The Dynamics of Switching by TFTs 252 14.4 Bias-Temperature Stress Test of TFTs 259 14.5 Drivers for AMLCDs 260 14.6 The Entire Addressing System 266 14.7 Layouts of Pixels with TFT Switches 269 14.8 Fabrication Processes of a-Si TFTs 272 14.9 Addressing of VA Displays 277 14.9.1 Overshoot and undershoot driving of LCDs 277 14.9.2 The dynamic capacitance compensation (DCC) 281 14.9.3 Fringe field accelerated decay of luminance 288 14.9.4 The addressing of two subpixels 292 14.9.5 Biased vertical alignment (BVA) 295 14.10 Motion Blur 298 14.10.1 Causes, characterization and remedies of blur 298 14.10.2 Systems with decreased blur 310 14.10.2.1 Edge enhancement for reduced blur 310 14.10.2.2 Black insertion techniques 312 14.10.2.3 Scanning backlights 313 14.10.2.4 Higher frame rates for reducing blur 315 14.10.3 Modelling of blur 320 14.11 The Optical Response of a VA Cell 329 14.12 Reduction of the Optical Response Time by a Special Addressing Waveform 334 15 Addressing of LCDs with Poly-Si TFTs 339 15.1 Fabrication Steps for Top- and Bottom-Gate Poly-Si TFTs 340 15.2 Laser Crystallization by Scanning or Large Area Anneal 344 15.3 Lightly Doped Drains for Poly-Si TFTs 345 15.4 The Kink Effect and its Suppression 347 15.5 Circuits with Poly-Si TFTs 349 16 Liquid Crystal on Silicon Displays 353 16.1 Fabrication of LCOS with DRAM-Type Analog Addressing 353 16.2 SRAM-Type Digital Addressing of LCOS 355 16.3 Microdisplays Using LCOS Technology 360 17 Addressing of Liquid Crystal Displays with Metal-Insulator-Metal Pixel Switches 363 18 Addressing of LCDs with Two-Terminal Devices and Optical, Plasma, Laser and e-beam Techniques 373 19 Components of LCD Cells 381 19.1 Additive Colours Generated by Absorptive Photosensitive Pigmented Colour Filters 381 19.2 Additive and Subtractive Colours Generated by Reflective Dichroic Colour Filters 383 19.3 Colour Generation by Three Stacked Displays 385 19.4 LED Backlights 386 19.4.1 The advantages of LEDs as backlights 386 19.4.2 LED technology 386 19.4.3 Optics for LED backlights 395 19.4.4 Special applications for LED backlights 405 19.4.4.1 Saving power and realizing scanning with LED backlights 405 19.4.4.2 Field sequential displays with LED backlights 407 19.4.4.3 Active matrix addressed LED backlights 409 19.4.5 The electronic addressing of LEDs 409 19.5 Cell Assembly 411 20 Projectors with Liquid Crystal Light Valves 415 20.1 Single Transmissive Light Valve Systems 415 20.1.1 The basic single light valve system 415 20.1.2 The field sequential colour projector 416 20.1.3 A single panel scrolling projector 417 20.1.4 Single light valve projector with angular colour separation 418 20.1.5 Single light valve projectors with a colour grating 418 20.2 Systems with Three Light Valves 420 20.2.1 Projectors with three transmissive light valves 420 20.2.2 Projectors with three reflective light valves 421 20.2.3 Projectors with three LCOS light valves 422 20.3 Projectors with Two LC Light Valves 422 20.4 A Rear Projector with One or Three Light Valves 422 20.5 A Projector with Three Optically Addressed Light Valves 423 21 Liquid Crystal Displays with Plastic Substrates 427 21.1 Advantages of Plastic Substrates 427 21.2 Plastic Substrates and their Properties 428 21.3 Barrier Layers for Plastic Substrates 429 21.4 Thermo-Mechanical Problems with Plastics 430 21.5 Fabrication of TFTs and MIMs at Low Process Temperatures 435 21.5.1 Fabrication of a-Si:H TFTs at low temperature 435 21.5.2 Fabrication of low temperature poly-Si TFTs 435 21.5.3 Fabrication of MIMs at low temperature 437 21.5.4 Conductors and transparent electrodes for plastic substrates 438 21.6 Transfer of High Temperature Fabricated AMLCDs to a Flexible Substrate 438 22 Printing of Layers for LC Cells 443 22.1 Printing Technologies 443 22.1.1 Flexographic printing 443 22.1.2 Knife coating 444 22.1.3 Ink-jet printing 444 22.1.4 Silk screen printing 448 22.2 Surface Properties for Printing 449 22.3 Printing of Components for Displays 455 22.3.1 Ink-jet printed colour filters, alignment layers and phosphors for LED Backlights 455 22.3.2 Flexographic printing of alignment layers and of nematic liquid crystals 456 22.3.3 Printing of OTFTs 457 22.4 Cell Building by Lamination 461 23 Advances in TFTs and Structures for Enhancing Mobility 24 Fringe-Field Switching (FFS) Technologies 25 Automotive Applications of Liquid Crystal Displays Appendix 1: Formats of Flat Panel Displays 463 Appendix 2: Optical Units of Displays 465 Appendix 3: Properties of Polarized Light 467 References 473 Index

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LTspice® for Linear Circuits Introduce yourself to the industry-leading software in electronic circuit simulation The simulation of electronic circuits is a crucial tool in modern electrical engineering. Many currently available software toolkits for circuit simulation are expensive, or nominally free but with significant restrictions on features and applications. LTspice®, a software distributed by semiconductor manufacturer Analog Devices, is not only the most widely used SPICE-based circuit simulator in the industry, but also free and unrestricted. LTspice®for Linear Circuits provides a comprehensive introduction to this software and its circuit simulation capabilities. Focusing on the fostering of practical knowledge, the book develops a six-step strategy for solving circuit analysis problems, beginning with the formulation of the problem, and proceeding through the simulation and the review of results. Readable and built around an easy-to-use, accessible software, LTspice® for Linear Circuits is an essential tool for any would-be electrical engineer. LTspice® for Linear Circuits readers will also find: Practical examples of circuit analysis problems and their solutions Detailed treatment of problems involving DC Circuits, First-Order Circuits, AC Circuits, Frequency Response and more Educational content from an author with decades of experience teaching electrical circuits LTspice®for Linear Circuits is perfect for undergraduates in electrical engineering and adjacent subjects, as well as anyone looking for an introduction to this widely used software.

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Book SynopsisThis cross-disciplinary title features contributions by key-note specialists from Europe, Israel and the United States. It deals with the rapidly growing area of microwave photonics, and includes an extended study of the interactions between optical signals and microwave and millimetre-wave electrical signals for broadband applications. Table of ContentsPreface. Acknowledgements. General introduction. 1: Microwave photonics components. 1. Introduction. 2. Fast lasers sources. 2.1. Fast lasers sources; F. Deborgies. 2.2. Tunable/selectable sources; F. Brillouet. 2.3. Transverse mode, patterns and polarization behavior in VCSELs; J.G. McInerney. 2.4. Mode locked microchip lasers for the generation of low noise millimeter wave carriers; P.R. Herczfeld. 3. Semiconductors optical amplifiers; J.C. Simon. 4. Fast Modulators. 4.1. Fast modulators; M. Varasi. 4.2. Electroabsorption modulators and photo-oscillators for conversion of optics to millimeterwaves; C. Minot. 5. High speed photodetection. 5.1. Microwave optical interaction devices; D. Jager. 5.2. The GaAs MESFET as an optical detector; A. Madjar, et al. 5.3. HBT phototransistors as an optic/millimetre-wave converter. Part I: The device 100; C. Gonzalez. 5.4. HBT phototransistor as an optical millimeter wave converter. Part II: Simulation; C. Rumelhard, et al. 6. References. 2: Electronics for optics: integrated circuits. 1. Introduction. 2. Electronics for optics: introduction to MMICs; I. Darwazeh. 3. High speed ICs for optoelectronic modules; R. Lefevre. 4. High efficiency optical transmitter and receiver modules using integrated MMIC impedance matching and low noise 50.0 amplifier; M. Schaller, et al. 5. References. 3: Modeling methods for optoelectronics. 1. Introduction. 2. Foundations for integrated optics modeling; I. Montrosset, G. Perrone. 3. Tools for microwave-optic co-simulation; D. Breuer, et al. 4. The TLM method - Application to the microwaves and optics; F. Ndagijimana, et al. 5. References. 4 : Microwave - photonics systems. 1. Introduction. 2. Microwave optical links. 2.1. Analog optical links: models, measures and limits of performances; C.H. Cox, III. 2.2. Optoelectronic and optical devices for applications to microwave systems; P. Richin, D. Mongardien. 3. Telecommunication systems. 3.1. Microwave and millimeter-wave photonics for telecommunications; D. Wake. 3.2. Fibre supported MM-wave systems; P. Lane. 3.3. Optics and microwaves in telecommunications networks, today and in the future; M. Joindot. 4. Wireless systems; J.F. Cadiou, et al. 4.2. Broadband access networks: the opportunities of wireless; G. Kalbe. 5. Antenna - Beam fonning. 5.1. Planar antenna technology for microwave-optical interactions; Y. Qian, et al. 5.2. Antenna applications of RF photonics; J.J. Lee. 5.3. Microwave/photonic feed networks for phased array antenna systems; R.A. Sparks. 5.4. Photonics and phased array antennas; J. Chazelas, D. Dolfi. 6. Phase noise degradation in nonlinear fiber optic links distribution networks for communication satellites; A.S. Daryoush. 7. References. 5: All optical processing of microwave functions. 1. Introduction. 2. Photonic base microwave functions. 2.1. Microwave

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Book Synopsis

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Book Synopsis

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Do It Together!Making is better when you're doing it with friends! In Make: Volume 58, we explore different ways to tackle large scale projects that are way bigger than one person can handle alone. In our cover story, get the scoop on how a team of engineers built giant robot Megabot to fight for glory in the world's first real-life mecha battle. Then, discover the latest in robo races and build your own autonomous R/C car.You'll find 14 projects inside, including: Send stealthy messages with Morse code over the internetPlay electronic audio games by drawing circuits with conductive inkKeep kitty entertained with a chaotic double pendulum toyAnd more!

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Book SynopsisArduino 101 houses an Intel Curie module which offers a better performance at a lower power footprint. The module has two 32-bit MCUs - an x86 Intel Quark processor and an ARC EM4 processor along with 384kB flash memory and 80kB SRAM. These onboard MCUs combine a variety of new technologies including wireless communication via Bluetooth Low Energy, 6 axis motion sensor with an accelerometer, and a gyroscope. With this book, you will:Explore neural net pattern matching Have the Arduino learn gesture recognitionPerfect for students, teachers, and hobbyists who need just enough information to get started with the Arduino 101

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Book SynopsisFrom Adafruit Industries, a leader in products to Makers, designers, students young and old, comes the Circuit Playground Express. Connect it to your PC, Mac or Linux computer, and you can be programming interactive projects in minutes. You have a choice of programming environments to choose from: Python, the Microsoft MakeCode graphical building block environment, C/C++ via the Arduino development environment and JavaScript. Whether you are learning interactive programming, have an Internet of Things project in mind, or are looking to design on-the-go wearable electronics, the versatile Circuit Playground Express is the device to start with. In Getting Started with the Adafruit Circuit Playground Express, you'll learn how to:Get up and running quickly with programmable boards Understand the basics of coding in multiple programming languages Use the built-in sensors for a variety of projects Make colorful interactive displays Design programs for the Internet of Things (IoT

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Book SynopsisGaN and ZnO nanowires can by grown using a wide variety of methods from physical vapor deposition to wet chemistry for optical devices. This book starts by presenting the similarities and differences between GaN and ZnO materials, as well as the assets and current limitations of nanowires for their use in optical devices, including feasibility and perspectives. It then focuses on the nucleation and growth mechanismsof ZnO and GaN nanowires, grown by various chemical and physical methods. Finally, it describes the formation of nanowire heterostructures applied to optical devices.Table of ContentsPreface xi Part 1 GaN and ZnO Nanowires: Low-Dimensionality Effects 1 Chapter 1 Quantum and Optical Confinement 3 Le Si Dang Chapter 2 Stress Relaxation in Nanowires with Heterostructures 25 Frank Glas Chapter 3 Surface-Related Optical Properties of GaN-Based Nanowires 59 Pierre Lefebvre Chapter 4 Surface Related Optical Properties of ZnO Nanowires 81 Tobias Voss and Jürgen Gutowski Chapter 5 Doping and Transport 99 Julien Pernot, Fabrice Donatini and Pierre Tchoulfian Chapter 6 Microstructure of Group III-N Nanowires 125 Achim Trampert, Xiang Kong, Esperanza Luna, Javier Grandal and Bernd Jenichen Part 2 Nucleation and Growth Mechanisms of GaN and ZnO Nanowires 157 Chapter 7 Ni Collector-Induced Growth of GaN Nanowire on C-Plane Sapphere by Plama-Assisted Molecular Beam Epitaxy 159 Caroline Chèze Chapter 8 Self-Induced Growth of GaN Nanowires by Molecular Beam Epitaxy 177 Vincent Consonni Chapter 9 Selective Area Growth of GaN Nanowires by Plama-Assisted Molecular Beam Epitaxy 215 Miguel A Sanchez-Garcia, steven Albert, Ana M. Bengoechea-Encabo, Francesca Barbagini and Enrique Calleja Chapter 10 Metal-Organic Vapor Phase Epitaxy Growth of GaN Nanorods 245 Joël Eymery Chapter 11 Metal-Organic Chemical Vaport Deposition Growth of ZnO Nanowires 265 Vincent Sallet Chapter 12 Pulsed-Laser Deposition of ZnO Nanowires 303 Christoph Peter Dietrich and Marius Grundmann Chapter 13 Preparation of ZnO Nanorods and Nanowires by Wet Chemistry 325 Thierry Pauporté List of Authors 379

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Book SynopsisA vital tool for researchers, engineers, and students, New Sensors and Processing Chain focuses on the processing chain to set up in order to extract relevant information on various systems. Highlighting the design of new microsensors and various applications, the authors present recent progress in instrumentation and microsystem design, providing insight to the modification of the sensor itself as well as its environment. Various applications illustrate the presentations, which show how a processing chain is organized from the data acquired by a specific sensor.Table of ContentsPREFACE ix CHAPTER 1. FABRICATION OF MICROELECTRODES USING ORIGINAL “SOFT LITHOGRAPHY” PROCESSES 1 Stéphane COTTE, Abdellatif BARAKET, François BESSUEILLE, Stéphane GOUT, Nourdin YAAKOUBI, Didier LEONARD and Abdelhamid ERRACHID 1.1. Introduction 1 1.2. Materials and methods 2 1.2.1. Selective peeling 2 1.2.2. Localized passivation 3 1.3. Selective peeling process development and results 4 1.4. Localized passivation process development and results 5 1.5. Conclusions 8 1.6. Bibliography 8 CHAPTER 2. LOVE WAVE CHARACTERIZATION OF MESOPOROUS TITANIA FILMS 11 Laurianne BLANC, Grégory TORTISSIER, Cédric BOISSIÈRE, Corinne DEJOUS and Dominique REBIÈRE 2.1. Introduction 11 2.2. Love wave platform 12 2.3. Mesoporous materials 13 2.4. Environmental ellipsometric porosimetry 15 2.4.1. Measurement principle 15 2.4.2. Sorption isotherm 16 2.5. Experimental set-up 17 2.5.1. Mesoporous sensitive layer deposition 17 2.5.2. Test bench 17 2.5.3. Results 19 2.6. Numerical simulations 19 2.6.1. Love wave propagation numerical model 19 2.6.2. Simulation of sensor frequency response 23 2.6.3. Extraction of shear modulus of the TiO2 film 25 2.7. Causes of mechanical stress induced by humidity sorption 27 2.7.1. Capillary contraction 27 2.7.2. Swelling and residual sol–gel stress 28 2.8. Conclusions 30 2.9. Bibliography 31 CHAPTER 3. IMMUNOSENSING WITH SURFACE ACOUSTIC WAVE SENSORS: TOWARD HIGHLY SENSITIVE AND SELECTIVE IMPROVED PIEZOELECTRIC BIOSENSORS 35 Najla FOURATI and Chouki ZERROUKI 3.1. Introduction 35 3.2. SAW sensors and measurement systems 36 3.2.1. SAW transducers 36 3.2.2. Measurement instrumentation 38 3.2.3. An example of SAW device and conditioning system 40 3.2.4. SAW immunosensors’ potential and their possible improvement 42 3.3. Immunosensing applications to evaluate SAW device performances 45 3.4. Survey of clinical applications of SAW immunosensor systems 54 3.4.1. Cardiac biomarker detection 55 3.4.2. Bacterial detection 57 3.4.3. Cell detection 57 3.4.4. Virus detection 60 3.4.5. Cocaine detection 61 3.5. Conclusion 62 3.6. Bibliography 62 CHAPTER 4. AC NANOCALORIMETER ON SELF-STANDING PARYLENE MEMBRANE 69 Emmanuel ANDRE, Aitor FERNANDEZ LOPEANDIA, Jean-Luc GARDEN, Dominique GIVORD and Olivier BOURGEOIS 4.1. Introduction 69 4.2. Advantage of this type of microdevice 69 4.2.1. The samples 70 4.2.2. Measurement method: the AC calorimetry 70 4.3. Nanocalorimeter for measuring nano objects 71 4.3.1. The parylene membrane 72 4.3.2. Thermometer and heater in NbNx 73 4.3.3. Manufacturing 74 4.3.4. Sample placement 77 4.4. Device performances 77 4.4.1. Temperature calibration 77 4.4.2. Thermal conductance of the empty cell 78 4.4.3. Dynamic characterization of an empty calorimetric cell 79 4.4.4. Heat capacity of an empty calorimetric cell 80 4.4.5. Heat capacity of a GdAl2 microcrystal 81 4.5. Conclusion 83 4.6. Acknowledgments 83 4.7. Bibliography 83 CHAPTER 5. OSCILLATORY FAILURE DETECTION IN THE FLIGHT CONTROL SYSTEM OF A CIVIL AIRCRAFT USING SOFT SENSORS 85 Do Hieu TRINH, Benoît MARX, Philippe GOUPIL and José RAGOT 5.1. Introduction 85 5.2. Modeling of the studied system 86 5.3. Design of a soft sensor for the oscillatory failure detection 88 5.4. Fault detection by standard deviation test 90 5.4.1. Residual generation 90 5.4.2. Generation of failure indicators 93 5.4.3. Failure detection by standard deviation test 94 5.4.4. Discussion on failure detection by standard deviation test 96 5.5. Fault detection by correlation test 97 5.5.1. Pattern generation 98 5.5.2. Failure indicator generation and fault detection by correlation test 100 5.5.3. Discussion on the failure detection by correlation test 103 5.6. Conclusion 104 5.7. Acknowledgments 104 5.8. Bibliography 104 CHAPTER 6. EMBEDDED SENSORS FOR THE ANALYSIS OF DRIVERS’ BEHAVIOR 107 Patrick PLAINCHAULT, Sébastien AUBIN, Patrice BRIAND, Jean-Michel AUBERLET and Thierry BOSCH 6.1. Introduction 107 6.2. Trajectories’ observatory 109 6.2.1. Trajectory 110 6.2.2. The measurement 110 6.2.3. Bragg fibers 110 6.2.4. Resistive sensors 112 6.2.5. Electromagnetic loops 114 6.3. The sensors’ network 115 6.3.1. Spacing between the sensors 115 6.3.2. The sensor network’s display 116 6.4. Weather conditions 117 6.5. Analysis processing 117 6.5.1. Analysis before installation 118 6.5.2. Analysis of the development’s aftermath 120 6.6. Conclusion 122 6.7. Acknowledgments 122 6.8. Bibliography 123 CHATPER 7. LARGE DEFORMABLE ANTENNAS 125 Sylvain GIRARD, Hervé GILLES, Philippe LEPRINCE, Olivier CLOUARD, Mourad CHTIOUI, Isabelle BARBEREAU, Guillaume LESUEUR and Thomas MERLET 7.1. Introduction 125 7.2. Mechanical analysis 128 7.3. Optical instrumentation for deformable antennas128 7.3.1. Principle of the optical sensor based on fiber ribbons 132 7.3.2. Principle of optical sensor based on polarization rotation 135 7.4. Experience on a planar structure 139 7.5. Conclusion 145 7.6. Acknowledgments 146 7.7. Bibliography 146 LIST OF AUTHORS 149 INDEX 153

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