Electronic devices and materials Books

Book SynopsisBuilds on the concepts of forward- and backward-travelling waves. Many examples are included of advanced techniques for analysing and designing transmission line networks with microstrip lines primarily used in design examples.

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Book SynopsisPresents the tools and techniques required to analyse and design microwave and RF circuits. The topics covered include scattering parameters, signal flow graphs, and Smith charts. This book is suitable as both an undergraduate and graduate textbook, as well as a career-long reference book.

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Book SynopsisFocuses on the design of systems based on microwave modules. A variety of RF modules, including amplifiers, local oscillators, isolators, phase detectors, frequency multipliers and dividers, phase-locked loops, and direct digital synthesizers are considered. Design strategies for synthesizing filters based on parallel coupled lines are presented.

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Book SynopsisAn investigation of how-to guides for sensor technologies Sensors are increasingly common within citizen-sensing and DIY projects, but these devices often require the use of a how-to guide. From online instructional videos for troubleshooting sensor installations to handbooks for using and abusing the Internet of Things, the how-to genres and formats of digital instruction continue to expand and develop. As the how-to proliferates, and instructions unfold through multiple aspects of technoscientific practices, Jennifer Gabrys asks why the how-to has become one of the prevailing genres of the digital. How to Do Things with Sensors explores the ways in which things are made do-able with and through sensors and further considers how worlds are made sense-able and actionable through the instructional mode of citizen-sensing projects.Forerunners: Ideas FirstShort books of thought-in-process scholarship, where intense analysis, questioning, and speculation take the leadTrade Review"How to Do Thing with Sensors is a relatively condensed argument, considering its complexity. It is one that has the potential to open up its readers to a more nuanced and complex understanding of making and maker culture."—Hyperrhiz"Gabrys encourages those with curiosity to develop and refine questions through the iterative process of making sensors and taking readings. Like a character or reader exploring a new world for the first time, she fosters new modes of engagement with the built world."—Public Books

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Book SynopsisArduino 101 houses an Intel Curie module which offers a better performance at a lower power footprint. The module has two 32-bit MCUs - an x86 Intel Quark processor and an ARC EM4 processor along with 384kB flash memory and 80kB SRAM. These onboard MCUs combine a variety of new technologies including wireless communication via Bluetooth Low Energy, 6 axis motion sensor with an accelerometer, and a gyroscope. With this book, you will:Explore neural net pattern matching Have the Arduino learn gesture recognitionPerfect for students, teachers, and hobbyists who need just enough information to get started with the Arduino 101

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Book SynopsisThis book offers a comprehensive review of the state-of-the-art in innovative Beyond-CMOS nanodevices for developing novel functionalities, logic and memories dedicated to researchers, engineers and students. It particularly focuses on the interest of nanostructures and nanodevices (nanowires, small slope switches, 2D layers, nanostructured materials, etc.) for advanced More than Moore (RF-nanosensors-energy harvesters, on-chip electronic cooling, etc.) and Beyond-CMOS logic and memories applications.Table of ContentsACKNOWLEDGMENTS xiii GENERAL INTRODUCTION xv Francis BALESTRA PART 1. SILION NANOWIRE BIOCHEMICAL SENSORS 1 PART 1. INTRODUCTION 3 Per-Erik HELLSTRÖM and Mikael ÖSTLING CHAPTER 1. FABRICATION OF NANOWIRES 5 Jens BOLTEN, Per-Erik HELLSTRÖM, Mikael ÖSTLING, Céline TERNON and Pauline SERRE 1.1. Introduction 5 1.2. Silicon nanowire fabrication with electron beam lithography 6 1.2.1. Key requirements 6 1.2.2. Why electron beam lithography? 7 1.2.3. Lithographic requirements 8 1.2.4. Tools, resist materials and development processes 9 1.2.5. Exposure strategies and proximity effect correction 10 1.2.6. Technology limitations and how to circumvent them 11 1.3. Silicon nanowire fabrication with sidewall transfer lithography 14 1.4. Si nanonet fabrication 17 1.4.1. Si NWs fabrication 18 1.4.2. Si nanonet assembling 19 1.4.3. Si nanonet morphology and properties 19 1.5. Acknowledgments 21 1.6. Bibliography 21 CHAPTER 2. FUNCTIONALIZATION OF SI-BASED NW FETs FOR DNA DETECTION 25 Valérie STAMBOULI, Céline TERNON, Pauline SERRE and Louis FRADETAL 2.1. Introduction 25 2.2. Functionalization process 27 2.3. Functionalization of Si nanonets for DNA biosensing 28 2.3.1. Detection of DNA hybridization on the Si nanonet by fluorescence microscopy 31 2.3.2. Preliminary electrical characterizations of NW networks 33 2.4. Functionalization of SiC nanowire-based sensor for electrical DNA biosensing35 2.4.1. SiC nanowire-based sensor functionalization process 35 2.4.2. DNA electrical detection from SiC nanowire-based sensor 38 2.5. Acknowledgments 39 2.6. Bibliography 40 CHAPTER 3. SENSITIVITY OF SILICON NANOWIRE BIOCHEMICAL SENSORS 43 Pierpaolo PALESTRI, Mireille MOUIS, Aryan AFZALIAN, Luca SELMI, Federico PITTINO, Denis FLANDRE and Gérard GHIBAUDO 3.1. Introduction 43 3.1.1. Definitions 43 3.1.2. Main parameters affecting the sensitivity 47 3.2. Sensitivity and noise 47 3.3. Modeling the sensitivity of Si NW biosensors 50 3.3.1. Modeling the electrolyte 52 3.4. Sensitivity of random arrays of 1D nanostructures 54 3.4.1. Electrical characterization 55 3.4.2. Low-frequency noise characterization 56 3.4.3. Simulation of electron conduction in random networks of 1D nanostructures 56 3.4.4. Discussion 59 3.5. Conclusions 59 3.6. Acknowledgments 60 3.7. Bibliography 60 CHAPTER 4. INTEGRATION OF SILICON NANOWIRES WITH CMOS 65 Per-Erik HELLSTRÖM, Ganesh JAYAKUMAR and Mikael ÖSTLING 4.1. Introduction 65 4.2. Overview of CMOS process technology 66 4.3. Integration of silicon nanowire after BEOL 66 4.4. Integration of silicon nanowires in FEOL 67 4.5. Sensor architecture design 69 4.6. Conclusions 71 4.7. Bibliography 72 CHAPTER 5. PORTABLE, INTEGRATED LOCK-IN-AMPLIFIER-BASED SYSTEM FOR REAL-TIME IMPEDIMETRIC MEASUREMENTS ON NANOWIRES BIOSENSORS 73 Michele ROSSI and Marco TARTAGNI 5.1. Introduction 73 5.2. Portable stand-alone system 74 5.3. Integrated impedimetric interface 76 5.4. Impedimetric measurements on nanowire sensors 78 5.5. Bibliography 81 PART 2. NEW MATERIALS, DEVICES AND TECHNOLOGIES FOR ENERGY HARVESTING 83 PART 2. INTRODUCTION 85 Enrico SANGIORGI CHAPTER 6. VIBRATIONAL ENERGY HARVESTING 89 Luca LARCHER, Saibal ROY, Dhiman MALLICK, Pranay PODDER, Massimo DE VITTORIO, Teresa TODARO, Francesco GUIDO, Alessandro BERTACCHINI, Ronan HINCHET, Julien KERAUDY and Gustavo ARDILA 6.1. Introduction 89 6.2. Piezoelectric energy transducer 91 6.2.1. Introduction 91 6.2.2. State-of-the-art devices and materials 92 6.2.3. MEMS piezoelectric vibration energy harvesting transducers 95 6.2.4. RMEMS prototypes characterization and discussions of experimental results 102 6.2.5. Near field characterization techniques 104 6.2.6. Dedicated electro-mechanical models for piezoelectric transducer design 106 6.3. Electromagnetic energy transducers 109 6.3.1. Introduction 109 6.3.2. State-of-the-art devices and materials 109 6.3.3. Vibration energy harvester exploiting both the piezoelectric and electromagnetic effect 122 6.3.4. Device design 125 6.4. Bibliography 128 CHAPTER 7. THERMAL ENERGY HARVESTING 135 Mireille MOUIS, Emigdio CHÁVEZ-ÁNGEL, Clivia SOTOMAYOR-TORRES, Francesc ALZINA, Marius V. COSTACHE, Androula G. NASSIOPOULOU, Katerina VALALAKI, Emmanouel HOURDAKIS, Sergio O. VALENZUELA, Bernard VIALA, Dmitry ZAKHAROV, Andrey SHCHEPETOV and Jouni AHOPELTO 7.1. Introduction 135 7.1.1. Basics of thermoelectric conversion 136 7.1.2. Strategies to increase ZT 137 7.1.3. Heavy-metal-free TE generation 140 7.1.4. Alternatives to TE harvesting for self-powered solid-state microsystems 141 7.2. Thermal transport at nanoscale 142 7.2.1. Brief review of nanoscale thermal conductivity 143 7.2.2. The effect of phonon confinement 146 7.2.3. Fabrication of ultrathin free-standing silicon membranes 153 7.2.4. Advanced methods of characterizing phonon dispersion, lifetimes and thermal conductivity 156 7.3. Porous silicon for thermal insulation on silicon wafers 172 7.3.1. Introduction 172 7.3.2. Thermal conductivity of nanostructured porous Si 172 7.3.3. Thermal isolation using thick porous Si layers 176 7.3.4. Thermoelectric generator using porous Si thermal isolation 177 7.4. Spin dependent thermoelectric effects 185 7.4.1. Physical principle and interest for thermal energy harvesting 186 7.4.2. Demonstration of the magnon drag effect 188 7.5. Composites of thermal shape memory alloy and piezoelectric materials 192 7.5.1. Introduction 192 7.5.2. Physical principle and interest for thermal energy harvesting 193 7.5.3. Novelty and realizations 194 7.5.4. Theoretical considerations 195 7.5.5. Examples of use 196 7.5.6. Summary of composite harvesting by the combination of SMA and piezoelectric materials 204 7.6. Conclusions 204 7.7. Bibliography 205 CHAPTER 8. NANOWIRE BASED SOLAR CELLS 221 Mauro ZANUCCOLI, Anne KAMINSKI-CACHOPO, Jérôme MICHALLON, Vincent CONSONNI, Igar SEMENIKHIN, Mehdi DAANOUNE, Frédérique DUCROQUET, David KOHEN, Christine MORIN and Claudio FIEGNA 8.1 Introduction 221 8.2. Design of NW-based solar cells 223 8.2.1. Geometrical optimization of NW-based solar cells by numerical simulations 223 8.2.2. TCAD simulation of NW-based solar cells 230 8.3. Fabrication and opto-electrical characterization of NW-based solar cells 235 8.3.1. Elaboration of NW-based solar cells 235 8.3.2. Opto-electrical characterization of NW-based solar cells 236 8.4 Conclusion 243 8.5 Acknowledgments 243 8.6 Bibliography 243 CHAPTER 9. SMART ENERGY MANAGEMENT AND CONVERSION 249 Wensi WANG, James F. ROHAN, Ningning WANG, Mike HAYES, Aldo ROMANI, Enrico MACRELLI, Michele DINI, Matteo FILIPPI, Marco TARTAGNI and Denis FLANDRE 9.1. Introduction 249 9.2. Power management solutions for energy harvesting devices 251 9.2.1. Ultra-low voltage thermoelectric energy harvesting 251 9.2.2. Sub-1mW photovoltaic energy harvesting 256 9.2.3. Piezoelectric and micro-electromagnetic energy harvesting 260 9.2.4. DC/DC power management for future micro-generator 262 9.3. Sub-mW energy storage solutions 266 9.4. Conclusions 270 9.5. Bibliography 271 PART 3. ON-CHIP ELECTRONIC COOLING 277 CHAPTER 10. TUNNEL JUNCTION ELECTRONIC COOLERS 279 Martin PREST, James RICHARDSON-BULLOCK, Terry WHALL, Evan PARKER and David LEADLEY 10.1. Introduction and motivation 279 10.1.1. Existing cryogenic technology 280 10.2. Tunneling junctions as coolers 281 10.2.1. The NIS junction 281 10.2.2. Cooling power 284 10.2.3. Thermometry 286 10.2.4. The superconductor-insulator-normal metal-insulator-superconductor (SINIS) structure 287 10.2.5. Double junction superconductor-silicon-superconductor (SSmS) cooler 288 10.3. Limitations to cooling 289 10.3.1. States within the superconductor gap 290 10.3.2. Joule heating 291 10.3.3. Series resistance 291 10.3.4. Quasi-particle-related heating 293 10.3.5. Andreev reflection 295 10.4. Heavy fermion-based coolers 297 10.5. Summary 299 10.6. Bibliography 300 CHAPTER 11. SILICON-BASED COOLING ELEMENTS 303 David LEADLEY, Martin PREST, Jouni AHOPELTO, Tom BRIEN, David GUNNARSSON, Phil MAUSKOPF, Juha MUHONEN, Maksym MYRONOV, Hung NGUYEN, Evan PARKER, Mika PRUNNILA, James RICHARDSON-BULLOCK, Vishal SHAH, Terry WHALL and Qing-Tai ZHAO 11.1. Introduction to semiconductor-superconductor tunnel junction coolers 303 11.2. Silicon-based Schottky barrier junctions 304 11.3. Carrier-phonon coupling in strained silicon 308 11.3.1. Measurement of electron-phonon coupling constant 312 11.4. Strained silicon Schottky barrier mK coolers 315 11.5. Silicon mK coolers with an oxide barrier [GUN 13] 318 11.5.1. Reduction of sub-gap leakage 318 11.5.2. Effects of strain 319 11.6. The silicon cold electron bolometer 321 11.7. Integration of detector and electronics 324 11.8. Summary and future prospects 325 11.9. Acknowledgments 327 11.10 Bibliography 327 CHAPTER 12. THERMAL ISOLATION THROUGH NANOSTRUCTURING. 331 David LEADLEY, Vishal SHAH, Jouni AHOPELTO, Francesc ALZINA, Emigdio CHÁVEZ-ÁNGEL, Juha MUHONEN, Maksym MYRONOV, Androula G. NASSIOPOULOU, Hung NGUYEN, Evan PARKER, Jukka PEKOLA, Martin PREST, Mika PRUNNILA, Juan Sebastian REPARAZ, Andrey SHCHEPETOV, Clivia SOTOMAYOR-TORRES, Katerina VALALAKI and Terry WHALL 12.1. Introduction 331 12.2. Lattice cooling by physical nanostructuring 331 12.3. Porous Si membranes as cryogenic thermal isolation platforms 337 12.3.1. Porous Si micro-coldplates 337 12.3.2. Porous Si thermal conductivity 339 12.4. Crystalline membrane platforms 343 12.4.1. Strained germanium membranes 343 12.4.2. Thermal conductance measurements in Si and Ge membranes 350 12.4.3. Epitaxy-compatible thermal isolation platform 355 12.5. Summary of thermal conductance measurements 355 12.6. Acknowledgments. 358 12.7. Bibliography 358 PART 4. NEW MATERIALS, DEVICES AND TECHNOLOGIES FOR RF APPLICATIONS 365 PART 4. INTRODUCTION 367 Androula G. NASSIOPOULOU CHAPTER 13. SUBSTRATE TECHNOLOGIES FOR SILICON-INTEGRATED RF AND MM-WAVE PASSIVE DEVICES 373 Androula G. NASSIOPOULOU, Panagiotis SARAFIS, Jean-Pierre RASKIN, Hanza ISSA, Philippe FERRARI 13.1. Introduction 373 13.2. High-resistivity Si substrate for RF 374 13.2.1. Losses along coplanar waveguide transmission lines 375 13.2.2. Crosstalk 380 13.2.3. Nonlinearities along CPW lines 384 13.3. Porous Si substrate technology 385 13.3.1. General properties of porous Si 386 13.3.2. Dielectric properties of porous Si 389 13.3.3. Broadband electrical characterization of CPWT Lines on porous Si 393 13.3.4. Inductors on porous Si397 13.3.5. Antennas on porous Si399 13.4. Comparison between HR Si and local porous Si substrate technologies 400 13.4.1. Comparison of similar CPW TLines on different substrates 400 13.4.2. Comparison of inductors on different RF substrates 404 13.5. Design of slow-wave CPWs and filters on porous silicon 404 13.5.1. Slow-wave CPW TLines on porous Si 405 13.5.2. Simulation results for S-CPW TLines 406 13.5.3. Stepped impedance low-pass filter on porous silicon 408 13.5.4. Simulation results for filters 409 13.6. Conclusion 411 13.7. Acknowledgments 411 13.8. Bibliography 411 CHAPTER 14. METAL NANOLINES AND ANTENNAS FOR RF AND MM-WAVE APPLICATIONS 419 Philippe BENECH, Chuan-Lun HSU, Gustavo ARDILA, Panagiotis SARAFIS and Androula G. NASSIOPOULOU 14.1. Introduction 419 14.2. Metal nanowires (nanolines) 420 14.2.1. General properties 420 14.2.2. Transmission nanolines in microstrip configuration: characterization and modeling 426 14.2.3. Transmission nanolines in CPW configuration: fabrication, characterization and modeling 430 14.2.4. Characterization up to 200 GHz 440 14.3. Antennas 441 14.3.1. On-chip antennas: general 441 14.3.2. On-chip antenna characterization method 443 14.3.3. Measurement results 444 14.3.4. Discussion on antenna results 451 14.4. Conclusion 451 14.5. Acknowledgments 452 14.6. Bibliography 452 CHAPTER 15. NANOSTRUCTURED MAGNETIC MATERIALS FOR HIGH-FREQUENCY APPLICATIONS 457 Saibal ROY, Jeffrey GODSELL and Tuhin MAITY 15.1. Introduction 457 15.2. Power conversion and integration 457 15.3. Materials and integration 459 15.4. Controlling the magnetic properties 463 15.5. Magnetic properties of nanocomposite materials 467 15.6. Magnetic properties of nanomodulated continuous films 470 15.7. Conclusion 478 15.8. Bibliography 479 LIST OF AUTHORS 485 INDEX 493

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Book SynopsisThis book offers a comprehensive review of the state-of-the-art in innovative Beyond-CMOS nanodevices for developing novel functionalities, logic and memories dedicated to researchers, engineers and students. The book will particularly focus on the interest of nanostructures and nanodevices (nanowires, small slope switches, 2D layers, nanostructured materials, etc.) for advanced More than Moore (RF-nanosensors-energy harvesters, on-chip electronic cooling, etc.) and Beyond-CMOS logic and memories applications.Table of ContentsACKNOWLEDGMENTS ix GENERAL INTRODUCTION xi Francis BALESTRA INTRODUCTION TO VOLUME 2: SILICON NANOWIRE BIO-CHEMICAL SENSORS 1 Francis BALESTRA CHAPTER 1. SMALL SLOPE SWITCHES 5 Adrian M. IONESCU and Francis BALESTRA, Kathy BOUCART, Giovanni SALVATORE and Alexandru RUSU 1.1. Introduction 5 1.2. Tunnel FETs 6 1.3. Ferroelectric gate FET 14 1.4. Bibliography 21 CHAPTER 2. NANOWIRE DEVICES 25 Gérard GHIBAUDO, Sylvain BARRAUD, Mikaël CASSÉ, Xin Peng WANG, Guo Qiang LO, Dim-Lee KWONG, Marco PALA and Zheng FANG 2.1. Introduction 25 2.2. NW for logic CMOS devices 26 2.2.1. NW fabrication and technology 26 2.2.2. Quantum simulation of NWs 37 2.2.3. Electrical characterization of NWs 49 2.3. Nano-CMOS ultimate memories 66 2.3.1. Overview of memory 66 2.3.2. NW application in the evolutive solution path 67 2.3.3. NW technology along the disruptive solution path 73 2.4. Conclusions 81 2.5. Acknowledgments 82 2.6. Bibliography 82 CHAPTER 3. GRAPHENE AND 2D LAYER DEVICES FOR MORE MOORE AND MORE-THAN-MOORE APPLICATIONS 97 Max C. LEMME 3.1. Introduction 97 3.2. Graphene 98 3.2.1. Graphene fabrication 98 3.2.2. Macroscopic graphene field effect transistors 101 3.2.3. Graphene nanoribbon transistors 103 3.2.4. Bilayer graphene and substrate effects 105 3.2.5. RF transistors 106 3.2.6. Alternative graphene switches 107 3.3. 2D materials beyond graphene 108 3.4. Conclusions 109 3.5. Acknowledgments 110 3.6. Bibliography 110 CHAPTER 4. NANOELECTROMECHANICAL SWITCHES 117 Hervé FANET 4.1. Context 117 4.2. Nanorelay principles 118 4.2.1. The electrostatic actuation 119 4.2.2. The piezoelectrical actuation 120 4.2.3. The magnetic actuation 120 4.2.4. The thermal actuation 120 4.3. Electrostatic nanorelay modeling and optimization 121 4.3.1. Dynamic modeling 121 4.3.2. Quasi-static modeling 124 4.4. Technological challenges for NEMS computing 127 4.4.1. Low voltage operation 127 4.4.2. Reliability of contact technology 128 4.5. NEMS-based architectures 129 4.5.1. Conventional architectures 129 4.5.2. Adiabatic architectures 130 4.6. Conclusions 131 4.7. Bibliography 132 LIST OF AUTHORS 133 INDEX 135

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Book SynopsisThis book, the second of two volumes, describes heterostructures and optoelectronic devices made from GaN and ZnO nanowires. Over the last decade, the number of publications on GaN and ZnO nanowires has grown exponentially, in particular for their potential optical applications in LEDs, lasers, UV detectors or solar cells. So far, such applications are still in their infancy, which we analyze as being mostly due to a lack of understanding and control of the growth of nanowires and related heterostructures. Furthermore, dealing with two different but related semiconductors such as ZnO and GaN, but also with different chemical and physical synthesis methods, will bring valuable comparisons in order to gain a general approach for the growth of wide band gap nanowires applied to optical devices.Table of ContentsPREFACE xi PART 1. GaN AND ZnO NANOWIRE HETEROSTRUCTURES 1 CHAPTER 1. AlGaN/GaN NANOWIRE HETEROSTRUCTURES 3 Jörg TEUBERT, Jordi ARBIOL and Martin EICKHOFF 1.1. A model system for AlGaN/GaN heterostructures 3 1.2. Axial AlGaN/GaN nanowire heterostructures 4 1.2.1. Structural properties of axial AlGaN/GaN nanowire heterostructures 5 1.2.2. Optical properties of axial AlGaN/GaN nanowire heterostructures 8 1.2.3. Lateral internal electric fields 12 1.2.4. Axial internal electric fields 14 1.2.5. Optical characterization of single-AlGaN/GaN nanowires containing GaN nanodisks 15 1.2.6. Electrical transport properties 18 1.3. AlGaN/GaN core–shell nanowire heterostructures 19 1.3.1. Structural properties 20 1.3.2. Optical characteristics 23 1.3.3. Electronic properties 24 1.3.4. True one-dimensional GaN quantum wire second-order self-assembly 28 1.4. Application examples 29 1.4.1. AlGaN/GaN nanowire heterostructure optochemical gas sensors 30 1.4.2. AlGaN/GaN nanowire heterostructure resonant tunneling diodes 33 1.5. Conclusions 34 1.6. Bibliography 35 CHAPTER 2. InGaN NANOWIRE HETEROSTRUCTURES 41 Bruno DAUDIN 2.1. Introduction 41 2.2. Self-assembled InGaN nanowires 43 2.3. X-ray characterization of InGaN nanowires 46 2.4. InGaN nanodisks and nanoislands in GaN nanowires 49 2.5. Selective area growth (SAG) of InGaN nanowires 52 2.6. Conclusion 55 2.7. Bibliography 56 CHAPTER 3. ZnO-BASED NANOWIRE HETEROSTRUCTURES 61 Guy FEUILLET and Pierre FERRET 3.1. Introduction 61 3.2. Designing ZnO-based nanowire heterostructures 63 3.3. Growth of ZnxMg1-xO/ZnO core–shell heterostructures by metal-organic vapor phase epitaxy 66 3.4. Misfit relaxation processes in Znx Mg1-xO/ZnO core–shell structures 70 3.5. Optical efficiency of core–shell oxidebased nanowire heterostructures 73 3.6. Axial nanowire heterostructures 76 3.7. Conclusions and perspectives 80 3.8. Bibliography 81 CHAPTER 4. ZnO AND Ga NANOWIRE-BASED TYPE II HETEROSTRUCTURES 85 Yong ZHANG 4.1. Semiconductor heterostructures 85 4.2. Type II heterostructures 87 4.3. Optimal device architecture 88 4.4. Electronic structure of type II core–shell nanowires 91 4.5. Synthesis of the type II core–shell nanowires and their signatures 94 4.6. Demonstration of type II effects in ZnO–ZnSe core–shell nanowires and photovoltaic devices 96 4.7. Summary 101 4.8. Acknowledgments 102 4.9. Bibliography 102 PART 2. INTEGRATION OF GaN AND ZnO NANOWIRES IN OPTOELECTRONIC DEVICES 105 CHAPTER 5. AXIAL GaN NANOWIRE-BASED LEDS 107 Qi WANG, Hieu N’GUYEN, Songrui ZHAO and Zetian MI 5.1. Introduction 107 5.2. Top-down GaN-based axial nanowire LEDs 108 5.2.1. Fabrication of top-down GaN-based axial nanowires 108 5.2.2. Device fabrication of axial nanowire LEDs 110 5.2.3. Performance characteristics of top-down axial nanowire LEDs 111 5.3. Bottom-up GaN-based axial nanowire LEDs 112 5.3.1. Growth techniques 112 5.3.2. Doping, polarity and surface charge properties 113 5.3.3. Design and typical performance of bottom-upaxial nanowire LEDs 114 5.4. Carrier loss processes of axial nanowire LEDs 121 5.4.1. Auger recombination 121 5.4.2. Electron overflow 122 5.4.3. Surface recombination 123 5.5. Controlling carrier loss of GaN-based nanowire LEDs 124 5.5.1. p-type modulation doping and AlGaN electron blocking layer 124 5.5.2. InGaN/GaN/AlGaN core–shell dot-in-a-wire phosphor-free white LEDs 126 5.6. Conclusions 127 5.7. Bibliography 127 CHAPTER 6. RADIAL GaN NANOWIRE-BASED LEDS 135 Shunfeng LI 6.1. Radial GaN nanowire-based LED: an emerging device 135 6.2. Growth of GaN nanowires and radial nanowire-based devices 138 6.3. Radial GaN nanowire-based LED structure 145 6.4. Characteristics of radial NW devices 150 6.5. Further work and perspectives 152 6.6. Bibliography 154 CHAPTER 7. GaN NANOWIRE-BASED LASERS 161 Xiang ZHOU, Jordan Paul CHESIN and Silvija GRADEÈAK 7.1. Introduction to nanowire lasers 161 7.2. Theoretical considerations and simulations 163 7.3. The first experimental observations of lasing in nanowires 165 7.4. GaN nanowire-based lasers 166 7.5. Toward wavelength tunability: nanowire lasers based on GaN/InxGa1-xN heterostructures 169 7.6. GaN nanowire lasers coupled with hybrid structures 171 7.7. Challenges and opportunities 173 7.8. Bibliography 175 CHAPTER 8. GaN NANOWIRE-BASED ULTRAVIOLET PHOTODETECTORS 179 Lorenzo RIGUTTI and Maria TCHERNYCHEVA 8.1. Introduction 179 8.2. Growth and fabrication techniques 180 8.3. GaN nanowire photoconductive detectors 183 8.4. p–i–n junction-based GaN nanowire detectors 187 8.5. Single-wire GaN/AlN multiple quantum disk photodetectors 190 8.6. Single-wire InGaN/GaN core–shell photodetectors 193 8.7. Conclusions 197 8.8. Acknowledgments 197 8.9. Bibliography 198 CHAPTER 9. ZnO NANOWIRE-BASED LEDS 203 Magnus WILLANDER and Omer NOUR 9.1. Outline 203 9.2. Introduction 203 9.3. Growth of ZnO nanowires 205 9.4. White light emission from ZnO nanowires 209 9.5. ZnO NW white LEDs on solid crystalline substrates 212 9.6. ZnO NWs white LEDs on flexible substrates 214 9.7. Enhancing the emission of ZnO nanowire-based LEDs 220 9.8. Conclusion and future prospective 222 9.9. Bibliography 222 CHAPTER 10. ZnO NANOWIRE-BASED SOLAR CELLS 227 Jason B. BAXTER 10.1. Introduction 227 10.1.1. Solar energy conversion and nanostructured solar cells 227 10.1.2. Use of ZnO in solar cells 228 10.2. ZnO nanowire dye-sensitized solar cells 229 10.3. Quantum dot-sensitized nanowire solar cells 235 10.4. Extremely thin absorber solar cells 237 10.5. Nanowire arrays completely filled with inorganic absorbers 239 10.6. ZnO nanorod – organic hybrid solar cells 241 10.7. ZnO nanowire arrays for photoelectrochemical water splitting 244 10.8. Conclusions 245 10.9. Acknowledgments 247 10.10. Bibliography 247 LIST OF AUTHORS 253

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Book SynopsisOver the past 20 years, software architectures have significantly contributed to the development of complex and distributed systems. Nowadays, it is recognized that one of the critical problems in the design and development of any complex software system is its architecture, i.e. the organization of its architectural elements. Software Architecture presents the software architecture paradigms based on objects, components, services and models, as well as the various architectural techniques and methods, the analysis of architectural qualities, models of representation of architectural templates and styles, their formalization, validation and testing and finally the engineering approach in which these consistent and autonomous elements can be tackled.Table of ContentsChapter 1. Metamodeling in Software Architectures 1 Adel SMEDA and Mourad Chabane OUSSALAH 1.1. Introduction 1 1.2. Metamodeling, why? 3 1.3. Software architecture metamodeling 3 1.4. MADL: a meta-architecture description language 5 1.4.1. Four levels of modeling in software architectures 5 1.4.2. MADL: reflexive core dedicated to the meta-meta-architecture 7 1.4.3. MADL structure 8 1.4.4. MADL instantiation: example of the ADL Acme 11 1.4.5. Comparison of MADL and MDA/MOF 13 1.5. Mapping of ADLs to UML 17 1.5.1. Why to map an ADL to UML? 18 1.5.2. ADL mapping to UML 19 1.6. A mapping example: the case of the Acme language. 31 1.7. Some remarks on the mapping of ADL concepts to UML 32 1.7.1. UML 2.0 as an ADL 32 1.7.2. Mapping strategies 33 1.8. Conclusion 34 1.9. Bibliography 34 Chapter 2. Architecture Constraints 37 Chouki TIBERMACINE 2.1. Introduction 38 2.2. State of the art 40 2.2.1. Expression of architecture constraints in the design phase 40 2.2.2. Expression of architecture constraints in the implementation phase 49 2.3. Architecture constraints on object-oriented applications 57 2.3.1. Architecture constraints in the design phase 57 2.3.2. Architecture constraints in the implementation phase 61 2.4. Architecture constraints on component-based applications 68 2.4.1. Architecture constraints in the design phase 69 2.4.2. Architecture constraints in the implementation phase 75 2.5. Architecture constraints on service-oriented applications 79 2.6. Conclusion 85 2.7. Bibliography 86 Chapter 3. Software Architectures and Multiple Variability 91 Mathieu ACHER, Philippe COLLET and Philippe LAHIRE 3.1. Introduction 91 3.2. Variability: foundations and principles 95 3.2.1. Variability and product lines 95 3.2.2. Feature models 97 3.3. Framework of studies and connected work 99 3.3.1. From multiplicity to variability 100 3.3.2. Extraction and evolution of architectural variability 101 3.4. Video surveillance component architecture 102 3.4.1. Case study 102 3.4.2. Accounting for multiple variability 104 3.4.3. Results 108 3.5. SOA for scientific workflows 110 3.5.1. Case study 110 3.5.2. Accounting for multiple variability 112 3.5.3. Results 114 3.6. Reverse engineering plugin-based architecture 116 3.6.1. Case study 116 3.6.2. Accounting for multiple variability 118 3.6.3. Results 120 3.7. Evaluation 122 3.7.1. The necessity of tooling 122 3.7.2. Summary of case studies 123 3.8. Conclusion 125 3.9. Bibliography 126 Chapter 4. Architecture and Quality of Software Systems 133 Nicole LÉVY, Francisca LOSAVIO and Yann POLLET 4.1. Introduction 133 4.2. Quality approach 135 4.2.1. ISO 25010 quality 135 4.2.2. Quality reference 137 4.2.3. Quality model of a system 138 4.2.4. Functional quality model 139 4.2.5. Quality model of the architecture 140 4.3. Approach for architecture development of a domain 142 4.3.1. General principles 142 4.3.2. Functional quality model 145 4.3.3. Architectural quality model 145 4.3.4. Reference architecture 145 4.3.5. Transition from domain level to system level 147 4.4. Development of the reference architecture in a functional domain 148 4.4.1. Example of functional domain 148 4.4.2. Functional refinement 148 4.4.3. Development of the FQM 150 4.4.4. Definition of the preliminary architecture 151 4.4.5. Development of architectural quality model 152 4.4.6. Integration of the reference architecture of the domain 152 4.5. Architectures at system level 156 4.5.1. Functional refinement 156 4.5.2. Functional quality model 157 4.5.3. Basic architecture 158 4.5.4. Architectural quality model 158 4.5.5. Architecture of the Dopamine and Samarkand systems 159 4.6. Related work 161 4.7. Conclusion 166 4.8. Bibliography 167 Chapter 5. Software Architectures and Multiagent Systems 171 Jean-Paul ARCANGELI, Victor NOËL and Frédéric MIGEON 5.1. Introduction 172 5.2. MAS and agent-oriented software engineering 172 5.2.1. Agent 173 5.2.2. System and interactions 174 5.2.3. MAS 175 5.2.4. Examples of MAS 177 5.2.5. Agent-oriented software engineering 178 5.3. MAS as an architectural style 183 5.3.1. Positioning the “MAS” style 183 5.3.2. Characteristics in terms of abstraction 184 5.3.3. Characteristics in terms of (de)composition 188 5.3.4. Link with the requirements 190 5.3.5. A family of architectural styles 194 5.4. The architectural gap 195 5.4.1. State of the practice 196 5.4.2. Analysis from an architectural point of view 197 5.4.3. Assessment 200 5.5. How to fill the architectural gap 200 5.5.1. Limitations of existing solutions 200 5.5.2. Realization of the microarchitecture 201 5.6. Conclusion 204 5.7. Bibliography 205 Chapter 6. Software Architectures and Software Processes 209 Fadila AOUSSAT, Mourad Chabane OUSSALAH and Mohamed AHMED-NACER 6.1. Introduction 209 6.2. Software process architectures 211 6.2.1. Software process models: definition 211 6.2.2. Modeling software architecture-based software processes 213 6.3. Comparison framework for SA-based SP model reuse solutions 214 6.3.1. The software process axis evaluation criteria 217 6.3.2. The software architecture axis evaluation criteria 220 6.3.3. The quality axis evaluation criteria 223 6.4. Evaluation of SA-based SP modeling and execution approaches 225 6.4.1. SP axis evaluation of SA-based SP reuse approaches 225 6.4.2. SA axis evaluation of SA-based SP reuse approaches 229 6.4.3. Quality axis evaluation of SA-based SP reuse approaches 232 6.4.4. Assessment and discussions 234 6.5. Conclusion 235 6.6. Bibliography 236 List of Authors 241 Index 243

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Book SynopsisThe authors of this book provide the first review of haptic optical tweezers, a new technique which brings together force feedback teleoperation and optical tweezers. This technique allows users to explore the microworld by sensing and exerting piconewton-scale forces with trapped microspheres. The design of optical tweezers for high-quality haptic feedback is challenging, given the requirements for very high sensitivity and dynamic stability. The concept, design process and specification of optical tweezers reviewed throughout this book focus on those intended for haptic teleoperation. The authors provide two new specific designs as well as the current state of the art. Furthermore, the remaining important issues are identified for further developments. Haptic optical tweezers will soon become an invaluable tool for force feedback micromanipulation of biological samples and nano- and micro-assembly parts.Table of ContentsPREFACE ix INTRODUCTION xi CHAPTER 1. INTRODUCTION TO HAPTIC OPTICAL TWEEZERS 1 1.1. Introduction 1 1.2. A dexterous experimental platform 3 1.2.1. A dexterous micromanipulation technique 3 1.2.2. A dexterous user interaction for micromanipulation 5 1.2.3. Pioneering works 8 1.3. Interactive optical tweezers 10 1.3.1. Displacement techniques 10 1.3.2. Impact of the laser deflection 14 1.3.3. Measurement techniques 16 1.4. Specific designs for haptic interactions 21 1.4.1. Temporal sharing 22 1.4.2. Spatial sharing 24 1.5. Discussion 26 1.6. Conclusion 29 1.7. Bibliography 30 CHAPTER 2. HIGH-SPEED VISION: FROM FRAME-BASED TO EVENT-BASED 45 2.1. High-speed cameras 45 2.1.1. Image data acquisition 46 2.1.2. Image data transmission 48 2.1.3. Image data processing 51 2.2. Silicon retinas 52 2.2.1. Neuromorphic engineering 52 2.2.2. Dynamic vision sensor (DVS) 54 2.2.3. Asynchronous time-based image sensor 57 2.3. The advantages of asynchronous event-based vision 59 2.3.1. Frame-based methodology 59 2.3.2. Event-based acquisition 60 2.3.3. Event-based processing 62 2.4. The fundamentals of event-based computation 64 2.5. State of the art of silicon retina applications 67 2.6. High-speed vision in robotics 70 2.6.1. Examples 71 2.6.2. Difficulties 74 2.7. Necessity of high-speed vision in microrobotics 76 2.7.1. Automatic control of a microrobot 76 2.7.2. Teleoperated micromanipulation 77 2.7.3. Two concrete applications 80 2.8. Bibliography 85 CHAPTER 3. ASYNCHRONOUS EVENT-BASED 2D MICROSPHERE TRACKING 93 3.1. Reliable haptic optical tweezers 93 3.2. State of the art of high-speed microparticle tracking 95 3.2.1. Position detection devices 96 3.2.2. Candidate algorithms 98 3.3. Microsphere tracking using DVS 101 3.3.1. Event-based continuous Hough transform 101 3.3.2. Multiple microsphere tracking 103 3.3.3. Brownian motion detection 108 3.4. 2D haptic feedback micromanipulation with optical tweezers 112 3.4.1. Strategy of haptic coupling with optical tweezer 113 3.4.2. Haptic feedback optical tweezer system setup 114 3.4.3. First experiments on force sensing in the microworld 117 3.4.4. A comparison of frame-based and event-based vision in micromanipulation 121 3.5. Conclusions 124 3.6. Bibliography 125 CHAPTER 4. ASYNCHRONOUS EVENT-BASED 3D MICROSPHERE TRACKING 129 4.1. 3D sphere tracking methods 130 4.1.1. Defocus 131 4.1.2. Intensity average on frame-based images 133 4.1.3. Polarity integration 135 4.1.4. Extension of continuous Hough transform 137 4.1.5. Robust circle fitting 139 4.1.6. Summary of different methods 143 4.2. 3D haptic feedback teleoperation of optical tweezers 144 4.2.1. Configuration and method 144 4.2.2. Z-axis force feedback 147 4.3. Haptic feedback on multitrap optical tweezers 149 4.3.1. Time multiplexing multitrapping by galvanometer 149 4.3.2. Events-trap correspondence 152 4.3.3. Multitrap experimental results 154 4.3.4. Marketability 158 4.4. Piezoelectric microgripper tracking for stable haptic feedback 160 4.4.1. System setup 161 4.4.2. Vision system 164 4.4.3. Haptic coupling strategy 167 4.4.4. Experimental results 170 4.4.5. Interest to industry 177 4.5. Conclusions 177 4.6. Bibliography 178 CONCLUSIONS AND PERSPECTIVES 181 INDEX 187

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Book SynopsisElectrochemical capacitors are electrochemical energy storage devices able to quickly deliver or store large quantities of energy. They have stimulated numerous innovations throughout the last 20 years and are now implemented in many fields. Supercapacitors Based on Carbon or Pseudocapacitive Materials provides the scientific basis for a better understanding of the characteristics and performance of electrochemical capacitors based on electrochemical double layer electrodes or pseudocapacitive materials, as well as providing information on the design and conception of new devices such as lithium-ion capacitors. This book details the various applications of supercapacitors, ranging from power electronics and stationary use, to transportation (hybrid vehicles, trams, planes, etc.). They are increasingly used in the automotive sector, especially as part of stop/start systems that have allowed for energy recovery through braking and reduced fuel consumption. Table of Contents1. Electrochemical Double-Layer Capacitors (EDLC). 2. Electrolytes. 3. Pseudocapacitive Materials. 4. Hybrid and/or Asymmetric Systems.

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Book SynopsisModel-based development methods, and supporting technologies, can provide the techniques and tools needed to address the dilemma between reducing system development costs and time, and developing increasingly complex systems. The Model Driven Architecture (MDA) initiative of the Object Management Group (OMG) is concerned with the development of standards and technologies that enable and support model-based system development. The aim of this book is to provide the information needed to understand and apply MDE (including MDA) approaches to the development of embedded systems. Chapters, written by experts from academia and industry, cover topics relating to MDE practices and methods, as well as emerging MDE technologies. Much of the writing is based on the presentations given at the Summer School 'MDE for Embedded Systems' held at Brest, France, in September 2004.Table of Contents1. Model engineering: from principles to platforms - Jean Bezivin; 2. Model-driven development of distributed real-time and embedded systems - Douglas C. Schmidt; 3. About model-transformations: QVT vs. OCL vs.... - Pierre-Alain Muller; 4. Separating dependability and technology-specific concerns using aspect-oriented modelling techniques - Robert France; 5. Model-driven systems engineering: SysML & the MDSysE approach at THALES - Veronique Normand and Daniel Exertier; 6. Maturity of model driven engineering for embedded control systems from a mechatronic perspective - Martin Torngren; 7. Real time components and contracts - Jean-Marc Jezequel; 8. The THINK component-based operating system - Jean-Philippe Fassino; 9. Model-driven schedulability analysis - Jean-Philippe Babau and Sebastien Gerard; 10. Performance analysis based on the UML SPT profile - Dorina C. Petriu; 11. Embedded code generation - Ivan Porres; 12 - Model-driven architecture for intensive embedded systems - Lossan Bonde, Pierre Boulet, Arnaud Cuccuru, Jean-Luc Dekeyser, Cedric Dumoulin, Philippe Marquet and Michael Samyn; 13. Spidergon: a NoC modeling paradigm - Marcello Coppola.

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Book SynopsisThis textbook for core courses in Electronic Circuit Design teaches students the design and application of a broad range of analog electronic circuits in a comprehensive and clear manner. Readers will be enabled to design complete, functional circuits or systems. The authors first provide a foundation in the theory and operation of basic electronic devices, including the diode, bipolar junction transistor, field effect transistor, operational amplifier and current feedback amplifier. They then present comprehensive instruction on the design of working, realistic electronic circuits of varying levels of complexity, including power amplifiers, regulated power supplies, filters, oscillators and waveform generators. Many examples help the reader quickly become familiar with key design parameters and design methodology for each class of circuits. Each chapter starts from fundamental circuits and develops them step-by-step into a broad range of applications of real circuits and systems. Written to be accessible to students of varying backgrounds, this textbook presents the design of realistic, working analog electronic circuits for key systems; Includes worked examples of functioning circuits, throughout every chapter, with an emphasis on real applications; Includes numerous exercises at the end of each chapter; Uses simulations to demonstrate the functionality of the designed circuits; Enables readers to design important electronic circuits including amplifiers, power supplies and oscillators. Table of ContentsIntroduction.- Semiconductor Diodes.- Bipolar Junction Transistor.- Field Effect Transistor.- BJT Models.- FET Models.- Multi-Transistor and Special Circuits.- Frequency Response of Transistor Amplifiers.- Feedback Amplifiers.- Operational Amplifiers.- Power Amplifiers.- Oscillators.- Power Supplies.- Active Filters.- Waveform Generators.- Special Devices.

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Book SynopsisThis Open Access proceedings presents a good overview of the current research landscape of assembly, handling and industrial robotics.The objective of MHI Colloquium is the successful networking at both academic and management level. Thereby, the colloquium focuses an academic exchange at a high level in order to distribute the obtained research results, to determine synergy effects and trends, to connect the actors in person and in conclusion, to strengthen the research field as well as the MHI community. In addition, there is the possibility to become acquatined with the organizing institute. Primary audience is formed by members of the scientific society for assembly, handling and industrial robotics (WGMHI). Table of ContentsAssembly Planning: Generic Modeling Technique for flexible and highly available Assembly Systems.- Transmitter Positioning of Distributed Large-scale Metrology within Lineless Mobile Assembly Systems.- Optimized High Precision Stacking of Fuel Cell Components for Medium to Large Production Volumes.- Mobile, Modular and Adaptive Assembly Jigs for Large-scale Products.- Design of an Automated Assembly Station for Process Development of All-Solid-State Battery Cell Assembly.-Grasping: Combined Structural and Dimensional Synthesis of a Parallel Robot for Cryogenic Handling Tasks.- Secure Clamping of Parts for Disassembly for Remanufacturing.- Aerial grasping and transport using an unmanned aircraft (UA) equipped with an industrial suction gripper.- Computing Gripping Points in 2D Parallel Surfaces via Polygon Clipping.- Concept for robot-based cable assembly regarding industrial production.- Human-Machine Interaction: Improving the understanding of a remote environment by immersive Man-Machine interaction.- Towards a Modular Elbow Exoskeleton: Concepts for Design and SystemControl.- Adaptive Motion Control Middleware for Teleoperation based on Pose Tracking and Trajectory Planning.- Approach of a Decision Support Matrix for the Implementation of Exoskeletons in Industrial Workplaces.- An approach to integrate a blockchain-based payment model and independent secure documentation for a Robot as a Service.- Human-Robot Collaboration: Human Body Simulation within a Hybrid Operating Method for a Safe and Efficient Human-Robot Collaboration.- Towards Semi Automated Pre-assembly for Aircraft Interior Production.- An approach for direct offline programming of high precision assembly tasks on 3D scans using tactile control and automatic program adaption.- Industry 4.0: Implementation of innovative manufacturing technologies in foundries for large-volume components.- The Digital Twin as a mediator for the digitalization and conservation of expert knowledge.- Web Service for Point Cloud supported Robot Programming using Machine Learning.- Using of Augmented Reality for improved Human-Machine interaction and Real-Time Error Correction of Laboratory Units.- Scalability of assembly line automation based on the integrated product development approach.- Machine Vision: Robot-based Creation of Complete 3D Workpiece Models.- Classification of assembly operations using recurrent neural networks.- Configuration and enablement of vision sensor solutions through a combined simulation based process chain.- Towards Synthetic AI Training Data for Image Classification in Intralogistic Settings.- Evaluation of ML-based Grasping Approaches inthe Field of Automated Assembly.- Robot Programming: Playback Robot Programming Framework for Fiber Spray Processes.- LiDAR-Based Localization for Formation Control of Multi-Robot Systems.- Playback Robot Programming With Loop Increments.- Web-based platform for the configuration of robot applications: A retrospective view on the research project ROBOTOP.- Partial Automated Multi-Pass-Welding for Thick Sheet Metal Connections.

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Book SynopsisThis textbook for a one-semester course in Electrical Circuits and Devices is written to be concise, understandable, and applicable. Every new concept is illustrated with numerous examples and figures, in order to facilitate learning. The simple and clear style of presentation is complemented by a spiral and modular approach to the topic. This method supports the learning of those who are new to the field, as well as provides in-depth coverage for those who are more experienced. The author discusses electronic devices using a spiral approach, in which key devices such as diodes and transistors are first covered with simple models that beginning students can easily understand. After the reader has grasped the fundamental concepts, the topics are covered again with greater depth in the latter chapters.Table of ContentsInterpreting I-V Curves Introduction to the Diode Semiconductor Physics Introduction to the BJT Introduction to MOSFETs Single Transistor Amplifiers PMOS & CMOS Frequency Response Device Physics Revisited Diode Circuits Diode & BJT Equations Practical Tips in ElectronicsIndex

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Book SynopsisThis book presents Proceedings of the 2021 Intelligent Systems Conference which is a remarkable collection of chapters covering a wider range of topics in areas of intelligent systems and artificial intelligence and their applications to the real world. The conference attracted a total of 496 submissions from many academic pioneering researchers, scientists, industrial engineers, and students from all around the world. These submissions underwent a double-blind peer-review process. Of the total submissions, 180 submissions have been selected to be included in these proceedings.As we witness exponential growth of computational intelligence in several directions and use of intelligent systems in everyday applications, this book is an ideal resource for reporting latest innovations and future of AI. The chapters include theory and application on all aspects of artificial intelligence, from classical to intelligent scope.We hope that readers find the book interesting and valuable; it provides the state-of-the-art intelligent methods and techniques for solving real-world problems along with a vision of the future research. Table of ContentsZero-Touch Customer Order Fulfillment to Support the New Normal of Retail in the 21st Century.- VitrAI: Applying Explainable AI in the Real World.- Contactless Interface for Navigation in Medical Imaging Systems.- Mobile Apps for 3D Face Scanning.- Tabu Search for Locating-Routing in the Goods Delivery and Waste Pickup in Trujillo-Peru.- The Emergence of Hybrid Edge-Cloud Computing for Energy Efficiency in Buildings.- Particle Swarm Model for Predicting Student Performance in Computing Programs.- A Genetic Algorithm for Quantum Circuit Generation in OpenQASM.- An Improved Clustering-based Harmony Search Algorithm (IC-HS).- Supporting Financial Inclusion with Graph Machine Learning and Super-App Alternative Data.- Electromagnetism-Like Algorithm and Harmony Search for Chemical Kinetics Problem.- Learning Incorrect Verdict Patterns of the Established Face Recognizing CNN Models using Meta-Learning Supervisor ANN.- SmartData: An Intelligent Decision Support System to Predict the Readers Permanence in News.- High Capacity Data Hiding for AMBTC Decompressed Images using Pixel Modification and Difference Expansion.- Fraud Detection in Online Market Research.

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Book SynopsisThis book gathers the proceedings of the 3rd Latin American Congress on Automation and Robotics, held at Monterrey, Mexico, on November 17–19, 2021. This book presents recent advances in the modeling, design, control, and development of autonomous and robotic systems and explores current exciting applications and future challenges of these technologies. The scope of this book covers a wide range of research fields associated with automation and robotics encountered within engineering, scientific research, and practice. These topics are related to autonomous systems, industrial automation and robotics, modelling and systems identification, simulation procedures and experimental validations, control theory, artificial intelligence, computer vision, sensing and sensor fusion, multi-robot and multi-agent systems, field and service robotics, human robot interaction and interfaces, modelling of robotic systems, and the design of new robotic platforms.Table of ContentsDecidable Fragments of Calculi Used in CatLog.- Interactive Theorem Proving for Logic and Information.- A Valence Catalogue for Norwegian.- Arabic Computational Linguistics: Potential, Pitfalls and Challenges.

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Book SynopsisT​his textbook offers a comprehensive introduction to the basic principles ruling the working mechanism of the most common solid-state electronic devices. It covers the physics of semiconductors and the properties of junctions of semiconductors with semiconductors, metals, and insulators. The exposition makes a minimal use of quantum mechanics concepts and methods. On the other hand, it avoids the pure phenomenological description of the properties of electronic devices. Thus, using a semi-classical approach the book provides a rigorous treatment of the subject. The book is addressed to undergraduate students of scientific and technological faculties as well to professionals who wish to be introduced to the basic principles of electronic devices.Table of ContentsThe Physical Background.- The Metal-Semiconductor junction.- Generation and Recombination processes.- PN Junction.- Negative Differential Resistance Effects.- Bipolar Junction Transistor.- Heterojunctions.- Metal-Oxide-Semiconductor junction.- Field Effect Transistors.

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Book SynopsisIntroduction.- The structure of crystalline materials.- Electronic band structure.- Electrons and holes.- Density of states, equilibrium occupancy of band states, doping.- Equilibrium carrier concentration.- Phonons.- Carrier transport.- Carrier generation & recombination.- pn-junctions: From materials to devices.- Optoelectronic devices.

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Book SynopsisIntroduction to Thin Film Transistors reviews the operation, application and technology of the main classes of thin film transistor (TFT) of current interest for large area electronics. The TFT materials covered include hydrogenated amorphous silicon (a-Si:H), poly-crystalline silicon (poly-Si), transparent amorphous oxide semiconductors (AOS), and organic semiconductors. The large scale manufacturing of a-Si:H TFTs forms the basis of the active matrix flat panel display industry. Poly-Si TFTs facilitate the integration of electronic circuits into portable active matrix liquid crystal displays, and are increasingly used in active matrix organic light emitting diode (AMOLED) displays for smart phones. The recently developed AOS TFTs are seen as an alternative option to poly-Si and a-Si:H for AMOLED TV and large AMLCD TV applications, respectively. The organic TFTs are regarded as a cost effective route into flexible electronics. As well as treating the highly divergent preparation and properties of these materials, the physics of the devices fabricated from them is also covered, with emphasis on performance features such as carrier mobility limitations, leakage currents and instability mechanisms. The thin film transistors implemented with these materials are the conventional, insulated gate field effect transistors, and a further chapter describes a new thin film transistor structure: the source gated transistor, SGT.The driving force behind much of the development of TFTs has been their application to AMLCDs, and there is a chapter dealing with the operation of these displays, as well as of AMOLED and electrophoretic displays. A discussion of TFT and pixel layout issues is also included.For students and new-comers to the field, introductory chapters deal with basic semiconductor surface physics, and with classical MOSFET operation. These topics are handled analytically, so that the underlying device physics is clearly revealed. These treatments are then used as a reference point, from which the impact of additional band-gap states on TFT behaviour can be readily appreciated.This reference book, covering all the major TFT technologies, will be of interest to a wide range of scientists and engineers in the large area electronics industry. It will also be a broad introduction for research students and other scientists entering the field, as well as providing an accessible and comprehensive overview for undergraduate and postgraduate teaching programmes. Table of ContentsIntroduction.- Semiconductor Device Physics for TFTs.- Insulated Gate Field Effect Transistors, IGFETs.- Active Matrix Flat Panel Displays.- Hydrogenated Amorphous Silicon TFT Technology and Architecture.- Hydrogenated Amorphous Silicon TFT Performance.- Poly-Si TFT Technology and Architecture.- Poly-Si TFT Performance.- Transparent Amorphous Oxide Semiconductor TFTs.- Organic TFTs.- TFTs on Flexible Substrates.- Source-Gated Transistors.

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Book SynopsisThis new edition of a proven textbook provides comprehensive, in-depth coverage of the fundamental concepts of electrical and computer engineering. It is written from an engineering perspective, with special emphasis on circuit functionality and applications. Reliance on higher-level mathematics and physics, or theoretical proofs has been intentionally limited in order to prioritize the practical aspects of electrical engineering. This text is therefore suitable for a number of introductory circuit courses for other majors such as robotics, mechanical, biomedical, aerospace, civil, architecture, petroleum, and industrial engineering. The authors’ primary goal is to teach the aspiring engineering student all fundamental tools needed to understand, analyze and design a wide range of practical circuits and systems. Their secondary goal is to provide a comprehensive reference, for both major and non-major students as well as practicing engineers.Table of Contents

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Book SynopsisReiner Thiele leitet die Lösungen partieller Riccati-Differenzialgleichungen her und zeigt den Zusammenhang zwischen allgemeinem Integral und singulärer Lösung auf. Dazu appliziert er eine neue Zerlegungsmethode dieser nichtlinearen Differenzialgleichungen (DGL) in jeweils zwei lineare Gleichungen. Nach der Bestimmung der Eigenwerte liegen die Lösungen vor, die bei Faraday-Effekt-Stromsensoren auftreten und durch eine lineare Beziehung zwischen Messgröße und Messwert gekennzeichnet sind. Praxisrelevante Beispiele für Messgrößen und Messwerte beweisen die große Applikationsbreite der patentierten Faraday-Effekt-Stromsensoren des Autors.Der AutorProf. Dr.-Ing. Reiner Thiele lehrte an der Hochschule Zittau/Görlitz und lehrt an der Staatlichen Studienakademie Bautzen.Table of Contents

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Book SynopsisThis book gathers selected research papers presented at the Third International Conference on Energy Systems, Drives, and Automations (ESDA 2020). It covers a broad range of topics in the fields of renewable energy, power management, drive systems for electrical machines, and automation. In a spam of about a few interesting articles, effort had gone in to critically discuss about the control system, energy management and distribution in a unified approach common to electrical, Control and mechanical engineering. This book also comprehensively discusses a variety of related tools and techniques and will be a valuable resource for researchers, professionals, and students in electrical and mechanical engineering disciplines.Table of ContentsIndustrial Scenario of Renewable Energy BasedElectromobility.- Covid-19: Impact Analysis on Power Sector (A Comprehensive Review on Demand Change).- Electricity Price Forecasting using LSTM Network and K-means clustering by considering the effect of wind power generation.- Solid waste management challenges in India.- Electrochemical conversion of CO2 into useful chemicals and PKL electricity.- Graphical Approach to Recognize Optimal Distribution Network Reconfiguration.

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Book SynopsisThis book illustrates various applications of quantum dots (QDs) in the biomedical field and future perspectives. It first introduces the synthesis procedures and fundamental properties of QDs. In addition, the optical detection techniques and toxicologic reviews of QDs are presented. A focus of the book is also on the applications of QDs in cancer therapy, drug delivery, bio-sensing, and targeted molecular therapy. This book is exciting and valuable to a wide variety of readership communities (students, early-stage researchers, and scientists) in the various fields of biology and medicine.Table of ContentsIntroduction to Quantum Dots Synthetic Developments of Semiconductor Quantum Dot for Biological Applications All-Optical Detection of Biocompatible Quantum Dots A Toxicologic Review of Quantum Dots: Recent Insights and Future Directions Advantages And Disadvantages of Using Quantum Dots in Lateral Flow and Other Biological Assay Formats Recent Developments in Quantum Dots Technologies as Effective Theranostic Tools Against Cancer The Underlying Mechanism of Quantum Dot-Induced Apoptosis: Potential Application in Cancer Therapy Fluorescent Quantum Dots, A Technological Marvel for Optical Bio-Imaging: A Perspective on Associated In Vivo Toxicity Quantum Dots in Biosensing, Bioimaging and Drug Delivery Quantum Dots: Potential Cell Imaging Agent Quantum Dot: A Boon for Biological and Biomedical Research Upconversion and Downconversion Quantum Dots for Biomedical and Therapeutic Applications Present Status and Future Perspective

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Book SynopsisThis book presents the basics of building various types of amplifiers, the most widely used in the composition of modern specialized radio receivers, as well as the principles of building digital radio receivers. The rapid development of modern telecommunications systems, aviation equipment, and space systems for various functional purposes, as well as new information technologies, is inextricably linked with the theory of building radio receivers. Radio receivers are an integral part of the radio line, which largely determine the quality of its operation, both in normal operating conditions and in a complex interference environment. Since the creation of the first lightning detector in 1895, the technique of radio receiving devices went a long way to the development of modern automated digital systems. Table of ContentsIntroduction.- Chapter 1. Technical characteristics and block diagrams of radio receivers.- Chapter 2. Noise ratios in the receiving devices.- Chapter 3. Circuit fundamentals of input circuits and selective amplifiers.- Chapter 4. Selective amplifiers. Principles of optimization of their parameters.- Chapter 5. Multi-stage single-circuit selective amplifiers.- Chapter 6. Frequency converters.- Chapter 7. Low-noise amplifiers.- Chapter 8. Radio signal detectors.- Chapter 9. Adjustments in radio receivers.- Chapter 10. Digital radio devices.

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Table of ContentsContributor contact details Chapter 1: Introduction to adhesives joining technology for electronics Abstract: 1.1 Introduction 1.2 Classification of adhesives used in electronic packaging 1.3 A brief overview of electronic assemblies 1.4 Typical uses of advanced adhesives in electronics Chapter 2: Thermally conductive adhesives in electronics Abstract: 2.1 Introduction 2.2 Model of heat conductance 2.3 Heat transport in thermally conductive adhesives 2.4 Thermally conductive fillers 2.5 Role of polymer base materials 2.6 Thermal conductivity of adhesives and methods for its measurement 2.7 Conclusions Chapter 3: Anisotropic conductive adhesives in electronics Abstract: 3.1 Introduction 3.2 Nature of adhesive bond 3.3 Materials and processing 3.4 Critical loading 3.5 Evaluation methods 3.6 Case studies 3.7 Conclusions 3.8 Acknowledgments 3.10 Appendix: List of abbreviations Chapter 4: Isotropic conductive adhesives in electronics Abstract: 4.1 Introduction 4.2 General isotropic conductive adhesive (ICA) properties 4.3 Reliability 4.4 Modeling 4.5 Nanotechnologies in isotropic conductive adhesives 4.6 Conclusions Chapter 5: Underfill adhesive materials for flip chip applications Abstract: 5.1 Introduction: flip chip and direct chip attachment technology 5.2 Advantages of direct chip attachment technology 5.3 Reliability challenge of flip chip technology 5.4 Advances in the flip chip underfill process and encapsulant materials 5.5 New material challenges to lead-free solder 5.6 The ′no-flow′ pre-applied underfill process 5.7 The wafer level pre-applied underfill process 5.8 The wafer level dual encapsulation process 5.9 Conclusions Chapter 6: Structural integrity of metal–polymer adhesive interfaces in microelectronics Abstract: 6.1 Introduction 6.2 Theoretical considerations of work of fracture and bonding strength of adhesive joints 6.3 Chemical and physical intermolecular interactions at interfaces 6.4 Other influential factors determining bond strength of real adhesive joints 6.5 Effect of environmental factors 6.6 Interconnections using electrically conductive adhesives 6.7 Conclusions Chapter 7: Modelling techniques used to assess conductive adhesive properties Abstract: 7.1 Introduction 7.2 Numerical modelling technologies 7.3 Modelling applied to packaging processes 7.4 Modelling the thermal, electrical and mechanical performance of adhesives 7.5 Future trends 7.6 Conclusions Chapter 8: Adhesive technology for photonics Abstract: 8.1 Introduction 8.2 The major characteristics of adhesives for photonic applications 8.3 Types of adhesive used in photonics 8.4 Major applications of adhesives in photonics 8.5 Adhesives for photonic packaging 8.6 Adhesives used in photonic devices 8.7 Typical challenges for reliable fabrication of photonic devices 8.8 Conclusions Index

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Book SynopsisOffers coverage of some of the major topics related to the performance and failure of materials used in electronic devices and electronics packaging. This book explains the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage.Table of Contents1. An Overview of Electronic Devices and Their Reliability 2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated 3. Defects, Contamination and Yield 4. The Mathematics of Failure and Reliability 5. Mass Transport-Induced Failure 6. Electronic Charge-Induced Damage 7. Environmental Damage to Electronic Products 8. Packaging Materials, Processes, and Stresses 9. Degradation of Contacts and Packages 10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices 11. Characterization and Failure Analysis of Material, Devices and Packages 12. Future Directions and Reliability Issues

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

Read more less

a huge range and FREE tracked UK delivery on ALL orders.

Read more less