Electronic devices and materials Books
ISTE Ltd and John Wiley & Sons Inc Software Architecture 2
Book SynopsisOver the past 20 years, software architectures have significantly contributed to the development of complex and distributed systems. Nowadays, it is recognized that one of the critical problems in the design and development of any complex software system is its architecture, i.e. the organization of its architectural elements. Software Architecture presents the software architecture paradigms based on objects, components, services and models, as well as the various architectural techniques and methods, the analysis of architectural qualities, models of representation of architectural templates and styles, their formalization, validation and testing and finally the engineering approach in which these consistent and autonomous elements can be tackled.Table of ContentsChapter 1. Metamodeling in Software Architectures 1 Adel SMEDA and Mourad Chabane OUSSALAH 1.1. Introduction 1 1.2. Metamodeling, why? 3 1.3. Software architecture metamodeling 3 1.4. MADL: a meta-architecture description language 5 1.4.1. Four levels of modeling in software architectures 5 1.4.2. MADL: reflexive core dedicated to the meta-meta-architecture 7 1.4.3. MADL structure 8 1.4.4. MADL instantiation: example of the ADL Acme 11 1.4.5. Comparison of MADL and MDA/MOF 13 1.5. Mapping of ADLs to UML 17 1.5.1. Why to map an ADL to UML? 18 1.5.2. ADL mapping to UML 19 1.6. A mapping example: the case of the Acme language. 31 1.7. Some remarks on the mapping of ADL concepts to UML 32 1.7.1. UML 2.0 as an ADL 32 1.7.2. Mapping strategies 33 1.8. Conclusion 34 1.9. Bibliography 34 Chapter 2. Architecture Constraints 37 Chouki TIBERMACINE 2.1. Introduction 38 2.2. State of the art 40 2.2.1. Expression of architecture constraints in the design phase 40 2.2.2. Expression of architecture constraints in the implementation phase 49 2.3. Architecture constraints on object-oriented applications 57 2.3.1. Architecture constraints in the design phase 57 2.3.2. Architecture constraints in the implementation phase 61 2.4. Architecture constraints on component-based applications 68 2.4.1. Architecture constraints in the design phase 69 2.4.2. Architecture constraints in the implementation phase 75 2.5. Architecture constraints on service-oriented applications 79 2.6. Conclusion 85 2.7. Bibliography 86 Chapter 3. Software Architectures and Multiple Variability 91 Mathieu ACHER, Philippe COLLET and Philippe LAHIRE 3.1. Introduction 91 3.2. Variability: foundations and principles 95 3.2.1. Variability and product lines 95 3.2.2. Feature models 97 3.3. Framework of studies and connected work 99 3.3.1. From multiplicity to variability 100 3.3.2. Extraction and evolution of architectural variability 101 3.4. Video surveillance component architecture 102 3.4.1. Case study 102 3.4.2. Accounting for multiple variability 104 3.4.3. Results 108 3.5. SOA for scientific workflows 110 3.5.1. Case study 110 3.5.2. Accounting for multiple variability 112 3.5.3. Results 114 3.6. Reverse engineering plugin-based architecture 116 3.6.1. Case study 116 3.6.2. Accounting for multiple variability 118 3.6.3. Results 120 3.7. Evaluation 122 3.7.1. The necessity of tooling 122 3.7.2. Summary of case studies 123 3.8. Conclusion 125 3.9. Bibliography 126 Chapter 4. Architecture and Quality of Software Systems 133 Nicole LÉVY, Francisca LOSAVIO and Yann POLLET 4.1. Introduction 133 4.2. Quality approach 135 4.2.1. ISO 25010 quality 135 4.2.2. Quality reference 137 4.2.3. Quality model of a system 138 4.2.4. Functional quality model 139 4.2.5. Quality model of the architecture 140 4.3. Approach for architecture development of a domain 142 4.3.1. General principles 142 4.3.2. Functional quality model 145 4.3.3. Architectural quality model 145 4.3.4. Reference architecture 145 4.3.5. Transition from domain level to system level 147 4.4. Development of the reference architecture in a functional domain 148 4.4.1. Example of functional domain 148 4.4.2. Functional refinement 148 4.4.3. Development of the FQM 150 4.4.4. Definition of the preliminary architecture 151 4.4.5. Development of architectural quality model 152 4.4.6. Integration of the reference architecture of the domain 152 4.5. Architectures at system level 156 4.5.1. Functional refinement 156 4.5.2. Functional quality model 157 4.5.3. Basic architecture 158 4.5.4. Architectural quality model 158 4.5.5. Architecture of the Dopamine and Samarkand systems 159 4.6. Related work 161 4.7. Conclusion 166 4.8. Bibliography 167 Chapter 5. Software Architectures and Multiagent Systems 171 Jean-Paul ARCANGELI, Victor NOËL and Frédéric MIGEON 5.1. Introduction 172 5.2. MAS and agent-oriented software engineering 172 5.2.1. Agent 173 5.2.2. System and interactions 174 5.2.3. MAS 175 5.2.4. Examples of MAS 177 5.2.5. Agent-oriented software engineering 178 5.3. MAS as an architectural style 183 5.3.1. Positioning the “MAS” style 183 5.3.2. Characteristics in terms of abstraction 184 5.3.3. Characteristics in terms of (de)composition 188 5.3.4. Link with the requirements 190 5.3.5. A family of architectural styles 194 5.4. The architectural gap 195 5.4.1. State of the practice 196 5.4.2. Analysis from an architectural point of view 197 5.4.3. Assessment 200 5.5. How to fill the architectural gap 200 5.5.1. Limitations of existing solutions 200 5.5.2. Realization of the microarchitecture 201 5.6. Conclusion 204 5.7. Bibliography 205 Chapter 6. Software Architectures and Software Processes 209 Fadila AOUSSAT, Mourad Chabane OUSSALAH and Mohamed AHMED-NACER 6.1. Introduction 209 6.2. Software process architectures 211 6.2.1. Software process models: definition 211 6.2.2. Modeling software architecture-based software processes 213 6.3. Comparison framework for SA-based SP model reuse solutions 214 6.3.1. The software process axis evaluation criteria 217 6.3.2. The software architecture axis evaluation criteria 220 6.3.3. The quality axis evaluation criteria 223 6.4. Evaluation of SA-based SP modeling and execution approaches 225 6.4.1. SP axis evaluation of SA-based SP reuse approaches 225 6.4.2. SA axis evaluation of SA-based SP reuse approaches 229 6.4.3. Quality axis evaluation of SA-based SP reuse approaches 232 6.4.4. Assessment and discussions 234 6.5. Conclusion 235 6.6. Bibliography 236 List of Authors 241 Index 243
£125.06
ISTE Ltd and John Wiley & Sons Inc Haptic Feedback Teleoperation of Optical Tweezers
Book SynopsisThe authors of this book provide the first review of haptic optical tweezers, a new technique which brings together force feedback teleoperation and optical tweezers. This technique allows users to explore the microworld by sensing and exerting piconewton-scale forces with trapped microspheres. The design of optical tweezers for high-quality haptic feedback is challenging, given the requirements for very high sensitivity and dynamic stability. The concept, design process and specification of optical tweezers reviewed throughout this book focus on those intended for haptic teleoperation. The authors provide two new specific designs as well as the current state of the art. Furthermore, the remaining important issues are identified for further developments. Haptic optical tweezers will soon become an invaluable tool for force feedback micromanipulation of biological samples and nano- and micro-assembly parts.Table of ContentsPREFACE ix INTRODUCTION xi CHAPTER 1. INTRODUCTION TO HAPTIC OPTICAL TWEEZERS 1 1.1. Introduction 1 1.2. A dexterous experimental platform 3 1.2.1. A dexterous micromanipulation technique 3 1.2.2. A dexterous user interaction for micromanipulation 5 1.2.3. Pioneering works 8 1.3. Interactive optical tweezers 10 1.3.1. Displacement techniques 10 1.3.2. Impact of the laser deflection 14 1.3.3. Measurement techniques 16 1.4. Specific designs for haptic interactions 21 1.4.1. Temporal sharing 22 1.4.2. Spatial sharing 24 1.5. Discussion 26 1.6. Conclusion 29 1.7. Bibliography 30 CHAPTER 2. HIGH-SPEED VISION: FROM FRAME-BASED TO EVENT-BASED 45 2.1. High-speed cameras 45 2.1.1. Image data acquisition 46 2.1.2. Image data transmission 48 2.1.3. Image data processing 51 2.2. Silicon retinas 52 2.2.1. Neuromorphic engineering 52 2.2.2. Dynamic vision sensor (DVS) 54 2.2.3. Asynchronous time-based image sensor 57 2.3. The advantages of asynchronous event-based vision 59 2.3.1. Frame-based methodology 59 2.3.2. Event-based acquisition 60 2.3.3. Event-based processing 62 2.4. The fundamentals of event-based computation 64 2.5. State of the art of silicon retina applications 67 2.6. High-speed vision in robotics 70 2.6.1. Examples 71 2.6.2. Difficulties 74 2.7. Necessity of high-speed vision in microrobotics 76 2.7.1. Automatic control of a microrobot 76 2.7.2. Teleoperated micromanipulation 77 2.7.3. Two concrete applications 80 2.8. Bibliography 85 CHAPTER 3. ASYNCHRONOUS EVENT-BASED 2D MICROSPHERE TRACKING 93 3.1. Reliable haptic optical tweezers 93 3.2. State of the art of high-speed microparticle tracking 95 3.2.1. Position detection devices 96 3.2.2. Candidate algorithms 98 3.3. Microsphere tracking using DVS 101 3.3.1. Event-based continuous Hough transform 101 3.3.2. Multiple microsphere tracking 103 3.3.3. Brownian motion detection 108 3.4. 2D haptic feedback micromanipulation with optical tweezers 112 3.4.1. Strategy of haptic coupling with optical tweezer 113 3.4.2. Haptic feedback optical tweezer system setup 114 3.4.3. First experiments on force sensing in the microworld 117 3.4.4. A comparison of frame-based and event-based vision in micromanipulation 121 3.5. Conclusions 124 3.6. Bibliography 125 CHAPTER 4. ASYNCHRONOUS EVENT-BASED 3D MICROSPHERE TRACKING 129 4.1. 3D sphere tracking methods 130 4.1.1. Defocus 131 4.1.2. Intensity average on frame-based images 133 4.1.3. Polarity integration 135 4.1.4. Extension of continuous Hough transform 137 4.1.5. Robust circle fitting 139 4.1.6. Summary of different methods 143 4.2. 3D haptic feedback teleoperation of optical tweezers 144 4.2.1. Configuration and method 144 4.2.2. Z-axis force feedback 147 4.3. Haptic feedback on multitrap optical tweezers 149 4.3.1. Time multiplexing multitrapping by galvanometer 149 4.3.2. Events-trap correspondence 152 4.3.3. Multitrap experimental results 154 4.3.4. Marketability 158 4.4. Piezoelectric microgripper tracking for stable haptic feedback 160 4.4.1. System setup 161 4.4.2. Vision system 164 4.4.3. Haptic coupling strategy 167 4.4.4. Experimental results 170 4.4.5. Interest to industry 177 4.5. Conclusions 177 4.6. Bibliography 178 CONCLUSIONS AND PERSPECTIVES 181 INDEX 187
£125.06
ISTE Ltd and John Wiley & Sons Inc Supercapacitors Based on Carbon or
Book SynopsisElectrochemical capacitors are electrochemical energy storage devices able to quickly deliver or store large quantities of energy. They have stimulated numerous innovations throughout the last 20 years and are now implemented in many fields. Supercapacitors Based on Carbon or Pseudocapacitive Materials provides the scientific basis for a better understanding of the characteristics and performance of electrochemical capacitors based on electrochemical double layer electrodes or pseudocapacitive materials, as well as providing information on the design and conception of new devices such as lithium-ion capacitors. This book details the various applications of supercapacitors, ranging from power electronics and stationary use, to transportation (hybrid vehicles, trams, planes, etc.). They are increasingly used in the automotive sector, especially as part of stop/start systems that have allowed for energy recovery through braking and reduced fuel consumption. Table of Contents1. Electrochemical Double-Layer Capacitors (EDLC). 2. Electrolytes. 3. Pseudocapacitive Materials. 4. Hybrid and/or Asymmetric Systems.
£125.06
Royal Society of Chemistry Guanine Quartets: Structure and Application
Book SynopsisGuanosine and its derivatives have a high potential for self-recognition and self-assembly, as well as the recognition ability for other biologically important molecules. This book explores in detail these properties with the goal of increasing knowledge of the basic principles of guanosine-assembly, synthesis of new optimised materials and exploration of their electronic and optical properties. Following the work of COST Action MP0802, the aim is to design novel reproducible and well ordered supramolecular structures to serve as molecular-scale architectures for new hybrid molecular electronics. Coverage includes synthesis, characterisation and optimisation, theoretical modelling and prediction, biochemical and biorecognition properties and applications in nanotechnology especially in molecular electronics. Appealing to researchers working in the field ranging from chemists, biologists and material scientists, this title will be a welcome addition to the inter-disciplinary literature providing direction for future research and ideas for industrial applications.Table of ContentsFrom G-Quartet to G-Quadruplex and its Nanoarchitectures; Synthesis and Characterisation; Theoretical Modelling, Analysis and Prediction; Recognition of Quadruplexes; Applications in Bioanalytics, Therapy and Molecular Electronics; Subject Index
£113.95
Royal Society of Chemistry Supramolecular Materials for Opto-Electronics
Book SynopsisFor years, concepts and models relevant to the fields of molecular electronics and organic electronics have been invented in parallel, slowing down progress in the field. This book illustrates how synthetic chemists, materials scientists, physicists, and device engineers can work together to reach their desired, shared goals, and provides the knowledge and intellectual basis for this venture. Supramolecular Materials for Opto-Electronics covers the basic principles of building supramolecular organic systems that fulfil the requirements of the targeted opto-electronic function; specific material properties based on the fundamental synthesis and assembly processes; and provides an overview of the current uses of supramolecular materials in opto-electronic devices. To conclude, a “what’s next” section provides an outlook on the future of the field, outlining the ways overarching work between research disciplines can be utilised. Postgraduate researchers and academics will appreciate the fundamental insight into concepts and practices of supramolecular systems for opto-electronic device integration.Table of ContentsSelf-Assembled Supramolecular Systems in Organic Electronics; Multicomponent Assembly Strategies for Supramolecular Systems; Low-Dimensional Supramolecular Assemblies on Surfaces; Rational Design of Supramolecular Photovoltaic Materials to Improve the Stability of Bulk Heterojunction Solar Cells; Amphiphilic Design for Supramolecular Materials with Opto-Electronic Functions; Chiral Supramolecular Structures as Spin Filters; Modeling Charge Transport in Organic Electronic Materials; Modeling of the Morphology and Charge Transport in Supramolecular Systems; Towards Highly Efficient Multilayer Pleds Based on all Solution Processing; Self-Assembled Mono and Multilayers for Functional Opto-Electronic Devices;
£166.25
Imperial College Press Microelectronic Devices (2nd Edition)
Book SynopsisThe second edition of this introductory book sets out clearly and concisely the principles of operation of the semiconductor devices that lie at the heart of the microelectronic revolution.The book aims to teach the reader how semiconductor devices are modelled. It begins by providing a firm background in the relevant semiconductor physics. These ideas are then used to construct both circuit models and mathematical models for diodes, bipolar transistors and MOSFETs. It also describes the processes involved in fabricating silicon chips containing these devices.The first edition has already proved a highly useful textbook to first and second year degree students in electrical and electronic engineering, and related disciplines. It is also useful to HND students in similar subject areas, and as supplementary reading for anyone involved in integrated circuit design and fabrication.Table of ContentsConduction in semiconductors; energy bands and carrier statistics; p-n junction diodes; MOSFETs; the bipolar transistor; integrated device fabrication.
£43.70
Imperial College Press Microelectronic Devices (2nd Edition)
Book SynopsisThe second edition of this introductory book sets out clearly and concisely the principles of operation of the semiconductor devices that lie at the heart of the microelectronic revolution.The book aims to teach the reader how semiconductor devices are modelled. It begins by providing a firm background in the relevant semiconductor physics. These ideas are then used to construct both circuit models and mathematical models for diodes, bipolar transistors and MOSFETs. It also describes the processes involved in fabricating silicon chips containing these devices.The first edition has already proved a highly useful textbook to first and second year degree students in electrical and electronic engineering, and related disciplines. It is also useful to HND students in similar subject areas, and as supplementary reading for anyone involved in integrated circuit design and fabrication.Table of ContentsConduction in semiconductors; energy bands and carrier statistics; p-n junction diodes; MOSFETs; the bipolar transistor; integrated device fabrication.
£22.80
Imperial College Press Phase Transition Approach To High Temperature
Book SynopsisThe discovery of superconductivity at 30 K by Bednorz and Müller in 1986 ignited an explosion of interest in high temperature superconductivity. The initial development rapidly evolved into an intensive worldwide research effort — which still persists after more than a decade — to understand the phenomenon of cuprate superconductivity, to search for ways to raise the transition temperature and to produce materials which have the potential for technological applications.During the past decade of research on this subject, significant progress has been made on both the fundamental science and technological application fronts. A great deal of experimental data is now available on the cuprates, and various properties have been well characterized using high quality single crystals and thin films. Despite this enormous research effort, however, the underlying mechanisms responsible for superconductivity in the cuprates are still open to question.This book offers an understanding from the phase transition point of view, surveys and identifies thermal and quantum fluctuation effects, identifies material-independent universal properties and provides constraints for the microscopic description of the various phenomena. The text is presented in a format suitable for use in a graduate level course.
£126.00
Imperial College Press Principles Of Semiconductor Laser Diodes And
Book SynopsisOptical communications technology is growing increasingly in importance, with a rapid pace of development. Innovative optical devices have emerged from the integration of semiconductor laser diodes, amplifiers and filters with optical waveguide technology. This well-researched volume traces the evolution of semiconductor laser amplifiers (SLAs) from these technologies. Focusing on the principle applications of SLAs, the author illustrates the growing importance of these functional components in the future of optical communications systems.This book will provide engineering and science students with a basic understanding of laser diode and optical amplification through the analysis of the performance characteristics of these devices both in theory and application. Practising device engineers wishing to consolidate their knowledge in lightwave technology will also find this book an invaluable reference.Table of ContentsThe Evolution of Optical Fibre Communication Systems Basic Principles of Optical Amplifiers Optical Amplification in Semiconductor Laser Diodes Analysis of Transverse Modal Fields in Semiconductor Laser Amplifiers Analysis and Modelling of Semiconductor Laser Diode Amplifiers: Gain and Saturation Characteristics Analysis and Modelling of Semiconductor Laser Diode Amplifiers: Noise Characteristics Experimental Studies on Semiconductor Laser Diode Amplifiers Novel Semiconductor Laser Diode Amplifier Structure Picosecond Pulse Amplification in Tapered-Waveguide Semiconductor Laser Diode Amplifiers Sub-Picosecond Gain Dynamic in Highly-Index Guided Tapered-Waveguide Semiconductor Laser Diode Optical Amplifiers Saturation Intensity of InGaAsP Tapered Travelling-Wave Semiconductor Laser Amplifier Structures Wavelength Conversion in Tapered-Waveguide Laser Diode Amplifiers Using Cross-Gain Modulation The Semiconductor Laser: Basic Concepts and Applications Microwave Circuit Techniques and Semiconductor Laser Modelling Microwave Circuit Models of Semiconductor Lasers Transmission-Line Laser Model of Tapered Waveguide Lasers and Amplifiers Novel Integrated Mode-Locked Laser Design Summary, Conclusion and Suggestions
£90.00
ISTE Ltd and John Wiley & Sons Inc Model Driven Engineering for Distributed
Book SynopsisModel-based development methods, and supporting technologies, can provide the techniques and tools needed to address the dilemma between reducing system development costs and time, and developing increasingly complex systems. The Model Driven Architecture (MDA) initiative of the Object Management Group (OMG) is concerned with the development of standards and technologies that enable and support model-based system development. The aim of this book is to provide the information needed to understand and apply MDE (including MDA) approaches to the development of embedded systems. Chapters, written by experts from academia and industry, cover topics relating to MDE practices and methods, as well as emerging MDE technologies. Much of the writing is based on the presentations given at the Summer School 'MDE for Embedded Systems' held at Brest, France, in September 2004.Table of Contents1. Model engineering: from principles to platforms - Jean Bezivin; 2. Model-driven development of distributed real-time and embedded systems - Douglas C. Schmidt; 3. About model-transformations: QVT vs. OCL vs.... - Pierre-Alain Muller; 4. Separating dependability and technology-specific concerns using aspect-oriented modelling techniques - Robert France; 5. Model-driven systems engineering: SysML & the MDSysE approach at THALES - Veronique Normand and Daniel Exertier; 6. Maturity of model driven engineering for embedded control systems from a mechatronic perspective - Martin Torngren; 7. Real time components and contracts - Jean-Marc Jezequel; 8. The THINK component-based operating system - Jean-Philippe Fassino; 9. Model-driven schedulability analysis - Jean-Philippe Babau and Sebastien Gerard; 10. Performance analysis based on the UML SPT profile - Dorina C. Petriu; 11. Embedded code generation - Ivan Porres; 12 - Model-driven architecture for intensive embedded systems - Lossan Bonde, Pierre Boulet, Arnaud Cuccuru, Jean-Luc Dekeyser, Cedric Dumoulin, Philippe Marquet and Michael Samyn; 13. Spidergon: a NoC modeling paradigm - Marcello Coppola.
£128.66
Copperhill Media Corporation Sae J1939 ECU Programming & Vehicle Bus Simulation with Arduino
£22.70
Adventures Unlimited Press Water: the Key to New Energy: Cavitating
Book Synopsis
£15.72
Springer Nature Switzerland AG Introduction to Semiconductor Lasers for Optical
Book SynopsisThis updated, second edition textbook provides a thorough and accessible treatment of semiconductor lasers from a design and engineering perspective. It includes both the physics of devices as well as the engineering, designing and testing of practical lasers. The material is presented clearly with many examples provided. Readers of the book will come to understand the finer aspects of the theory, design, fabrication and test of these devices and have an excellent background for further study of optoelectronics.Table of ContentsIntroduction: The Basics of Optical Communications.- The Basics of Lasers.- Semiconductors as Laser Material 1: Fundamentals.- Semiconductors as Laser Materials 2: Density of States, Quantum Wells and Gain.- Semiconductor Laser Operation.- Electrical Characteristics of Semiconductor Lasers.- The Optical Cavity.- Laser Modulation.- Distributed Feedback Lasers.- Assorted Miscellany: Dispersion, Fabrication, and Reliability.- Laser Communication Systems I: Amplitude Modulated Systems.- Coherent Communication Systems.
£67.49
Springer Nature Switzerland AG Sensors and Microsystems: Proceedings of the 20th AISEM 2019 National Conference
Book SynopsisThis book showcases the state of the art in the field of sensors and microsystems, revealing the impressive potential of novel methodologies and technologies. It covers a broad range of aspects, including: bio-, physical and chemical sensors; actuators; micro- and nano-structured materials; mechanisms of interaction and signal transduction; polymers and biomaterials; sensor electronics and instrumentation; analytical microsystems, recognition systems and signal analysis; and sensor networks, as well as manufacturing technologies, environmental, food and biomedical applications. The book gathers a selection of papers presented at the 20th AISEM National Conference on Sensors and Microsystems, held in Naples, Italy in February 2019, the event brought together researchers, end users, technology teams and policy makers.
£170.99
Springer Nature Switzerland AG Understanding Electromagnetic Waves
Book SynopsisThis one-semester textbook teaches students Electromagnetic Waves, via an early introduction to Maxwell’s Equations in the first chapter. Mathematics fundamentals are used as needed, but rigor is de-emphasized in preference to understanding the basic ideas and principles of EM waves. Each chapter includes extensive, step-by-step, solved examples, as well as abundant exercises. Designed for a one-semester course in electromagnetic waves; Introduces Maxwell’s equations in the first chapter; De-emphasizes mathematical rigor in order to make key ideas and principles easy to understand; Makes material accessible to readers of varying backgrounds, with extensive use of solved examples; Includes abundant exercises for each chapter. Trade Review“The book includes a huge number of figures, a large number of exercises and a reasonable number of solved examples, which, altogether, help the reader to understand quickly the exposition.” (Luis Filipe Pinheiro de Castro, zbMATH 1455.78001, 2021)Table of ContentsIntroduction.- Maxwell’s Equations.- Plane Waves and Wave Equations.- Characteristics and Parameters of EM Waves.- Boundary Conditions and Behavior of EM Waves.- Transmission Line.- Smith Chart.- Antenna.
£52.24
Springer Nature Switzerland AG Thin Film and Flexible Thermoelectric Generators,
Book SynopsisThis book presents and facilitates new research and development results with hot topics in the thermoelectric generators (TEGs) field. Topics include: novel thin film; multilayer, composite and nanostructured thermoelectric materials; simulation of phenomena related to thermoelectricity; thermoelectric thin film and multilayer materials manufacturing technologies; measurement techniques for characterization; thermoelectric generators; and the simulation, modeling, design, thermal, and mechanical degradation problems. This book helps researchers tackle the challenges that still remain in creating cheap and effective TEGs and presents the latest trends and technologies in development and production of advanced thermoelectric generation devices.Table of ContentsNovel thin film and multilayer thermoelectric materials.- Simulation of phenomena related to thermoelectricity.- Thermoelectric thin film and multilayer materials manufacturing technologies.- Measurement techniques for Characterization thin film and multilayer materials and devices.- Thermolectric generators simulation, modeling, and design.- Thermal and mechanical degradation problems in prospective thin film and multilayer thermoeclectric materials and TEG modules.
£52.24
Springer Nature Switzerland AG Analysis of Piezoelectric Semiconductor
Book SynopsisThis book presents the mechanics of piezoelectric semiconductor structures where the main electromechanical coupling of interest is the interaction between mechanical fields and semiconduction. This volume stands as the first full book treatment of this multi-physical subject from the mechanics angle. The analysis of piezoelectric semiconductor structures and devices is an emerging and rapidly growing interdisciplinary area involving materials, electronics, and solid mechanics. It has direct applications in the new area of piezotronics and piezo-phototronics. The book is theoretical, beginning with a phenomenological framework and progressing to include solutions to problems fundamental to the theory and application. Dr. Yang illustrates how in piezoelectric semiconductors, mechanical fields interact with semiconduction through the piezoelectrically produced electric fields by mechanical loads. This provides the foundation of piezotronic and piezo-phototronic devices in which semiconduction is induced, affected, manipulated, or controlled by mechanical fields. Also discussing composite structures of piezoelectric dielectrics and nonpiezoelectric semiconductors as well as thermal effects, the book is an ideal basic reference on the topic for researchers.Table of ContentsChapter 1. Macroscopic Theory.- Chapter 2. Exact Solutions.- Chapter 3. Extension of Rods.- Chapter 4. Bending of Beams.- Chapter 5. Extension and Bending of Plates.- Chapter 6. Composite Structures.- Chapter 7. Thermal Effects.
£143.99
Springer Nature Switzerland AG Integrated Ring Resonators: A Compendium
Book SynopsisThe optical filter is resonator based. The required passband shape of ring resonator-filters can be custom designed by the use of configurations of various ring coupled resonators. This book describes the current state-of-the-art on these devices. It provides an in-depth knowledge of the simulation, fabrication and characterization of ring resonators for use as example filters, lasers, sensors.Table of Contents1. Introduction2. Ring Resonators: Theory and Modeling2.1 Single Ring Resonators2.1.1 Ring Structure2.1.2 Racetrack Shaped Resonators2.2 Double Ring Resonators2.2.1 Serially Coupled Double Ring Resonator2.2.2 Parallel Coupled Double Ring Resonator2.3 Multiple Coupled Resonators2.3.1 Serially Coupled Ring Resonators2.3.2 Parallel Coupled Ring Resonators3. Materials, Fabrication and Characterization Methods3.1 Wafer Bonding3.1.1 Bonding with Intermediate Layer3.1.2 Bonding without Intermediate Layer3.1.3 Benzocyclobutene (BCB) Wafer Bonding3.2 Dry Etching3.3 Si based Materials3.3.1 Ring Resonators based on Si–SiO23.3.2 Ring Resonators based on Ta2O5–SiO23.3.3 Ring Resonators based on SiN, SiON and Si3N43.3.4 Ring Resonators based on SiO2-GeO23.4 III-V Materials3.4.1 The Quaternary Semiconductor Compound GaInAsP3.4.2 The Semiconductor Compound AlGaAs3.4.3 Lateral Coupling in GaInAsP/InP3.4.4 Vertical Coupling in GaInAsP/InP3.4.5 Lateral Coupling in AlGaAs/GaAs3.4.6 Vertical Coupling in AlGaAs/GaAs3.4.7 Implementation of Gain in Ring Resonators3.5 Polymers3.5.1 Conventional Fabrication Techniques3.5.2 Replication and Nanoimprinting3.5.3 Novel Polymer Devices3.6 Temperature Insensitivity3.7 Polarization Independence3.8 Characterization Methods3.8.1 Conventional Characterization3.8.2 Optical Low Coherence Reflectometry (OLCR)3.8.3 Evanescent Field Measurement Methods3.9 Lithium niobate and hydrid solutions3.9.1 Ring Resonators based on Lithium niobate3.9.2 Ring Resonators based on Lithium niobate on Insulators ( LNOI)3.9.3 Ring Resonators based on Lithium niobate in hybrid configurations with nitrides4. Building Blocks of Ring Resonator Devices4.1 Couplers4.1.1 Directional Couplers4.1.2 Multimode Interference Couplers4.1.3 Y-Couplers4.2 Bends4.3 Spot Size Converters for Light In- and Outcoupling4.4 Gratings for Light In- and Outcoupling5. Devices & Applications5.1 Filters5.1.1 Passive Devices5.1.2 Devices with gain section5.2 Tunability Methods5.2.1 Wavelength Tuning5.2.2 Center Wavelength Trimming5.2.3 Tunable Couplers in Ring Resonators5.3 Dispersion Compensators5.4 Mach-Zehnder combined with Ring Resonator5.5 Modulators5.6 Lasers5.6.1 All Active Lasers5.6.2 Devices with gain section5.6.3 Passive Ring Resonator Coupled Lasers5.7 Wavelength Converters5.8 Optical Signal Processing5.8.1 Logic Gates5.8.2 Switching5.8.3 Telecom Operations6. Sensors6.1 Microfluidics6.2 Optofluidics6.3 Biosensors7. Whispering Gallery Mode Devices7.1 Whispering Gallery Modes (WGM)7.2 WGM Filters7.3 WGM Lasers7. OutlookReferencesIndex
£113.99
Springer Nature Switzerland AG Advanced X-ray Detector Technologies: Design and
Book SynopsisThis book offers readers an overview of some of the most recent advances in the field of detectors for X-ray imaging. Coverage includes both technology and applications, with an in-depth review of the research topics from leading specialists in the field. Emphasis is on high-Z materials like CdTe, CZT and perovskites, since they offer the best implementation possibilities for direct conversion X-ray detectors. Authors discuss material challenges, detector operation physics and technology and readout integrated circuits required to detect signals processes by high-Z sensors.Table of ContentsIntroduction to High-Z Semiconductor Detectors.- High-Z compound semiconductors as sensors for hybrid pixel area detectors.- Photon-integrating hybrid pixel array detectors for high-energy x-ray applications.- Photon counting detectors and their applications in medical imaging.- CZT Detectors for High-Flux.- Position-sensitive virtual Frisch-grid CdZnTe detectors and their applications.- Drift detectors and Compton cameras.- CdTe Pixel Detectors for Hard X-Ray Astronomy.- High-Z pixel sensor characterization for synchrotron applications.- High Performance CdTe/CZT Spectro-Imagers.
£67.49
Springer Nature Switzerland AG Interval Reachability Analysis: Bounding Trajectories of Uncertain Systems with Boxes for Control and Verification
Book SynopsisThis brief presents a suite of computationally efficient methods for bounding trajectories of dynamical systems with multi-dimensional intervals, or ‘boxes’. It explains the importance of bounding trajectories for evaluating the robustness of systems in the face of parametric uncertainty, and for verification or control synthesis problems with respect to safety and reachability properties. The methods presented make use of: interval analysis; monotonicity theory; contraction theory; and data-driven techniques that sample trajectories. The methods are implemented in an accompanying open-source Toolbox for Interval Reachability Analysis. This brief provides a tutorial description of each method, focusing on the requirements and trade-offs relevant to the user, requiring only basic background on dynamical systems. The second part of the brief describes applications of interval reachability analysis. This makes the brief of interest to a wide range of academic researchers, graduate students, and practising engineers in the field of control and verification. Trade Review“The motivation of this book is to provide to the readers tutorial presentations of several approaches for interval reachability analysis, without requiring any previous knowledge and experience of reachability analysis. Two parts, Part I and Part II, are used for this purpose. Part I describes six main methods for interval reachability analysis and in Part II several applications are presented.” (Takashi Amemiya, Mathematical Reviews, October, 2022)Table of ContentsChapter 1. Introduction.- Part 1: Reachability Methods.- Chapter 2. Interval Analysis.- Chapter 3. Monotonicity.- Chapter 4. Mixed-Monotonicity.- Chapter 5. Sampled-Data Mixed-Monotonicity.- Chapter 6. Growth Bounds.- Chapter 7. Sampling-Based Methods.- Part 2: Applications.- Chapter 8. Safety and Reachability Verification.- Chapter 9. Interval Volume as a Robustness Measure.- Chapter 10. Abstraction-Based Control Synthesis.
£49.49
Springer Nature Switzerland AG Annals of Scientific Society for Assembly,
Book SynopsisThis Open Access proceedings presents a good overview of the current research landscape of assembly, handling and industrial robotics.The objective of MHI Colloquium is the successful networking at both academic and management level. Thereby, the colloquium focuses an academic exchange at a high level in order to distribute the obtained research results, to determine synergy effects and trends, to connect the actors in person and in conclusion, to strengthen the research field as well as the MHI community. In addition, there is the possibility to become acquatined with the organizing institute. Primary audience is formed by members of the scientific society for assembly, handling and industrial robotics (WGMHI). Table of ContentsAssembly Planning: Generic Modeling Technique for flexible and highly available Assembly Systems.- Transmitter Positioning of Distributed Large-scale Metrology within Lineless Mobile Assembly Systems.- Optimized High Precision Stacking of Fuel Cell Components for Medium to Large Production Volumes.- Mobile, Modular and Adaptive Assembly Jigs for Large-scale Products.- Design of an Automated Assembly Station for Process Development of All-Solid-State Battery Cell Assembly.-Grasping: Combined Structural and Dimensional Synthesis of a Parallel Robot for Cryogenic Handling Tasks.- Secure Clamping of Parts for Disassembly for Remanufacturing.- Aerial grasping and transport using an unmanned aircraft (UA) equipped with an industrial suction gripper.- Computing Gripping Points in 2D Parallel Surfaces via Polygon Clipping.- Concept for robot-based cable assembly regarding industrial production.- Human-Machine Interaction: Improving the understanding of a remote environment by immersive Man-Machine interaction.- Towards a Modular Elbow Exoskeleton: Concepts for Design and SystemControl.- Adaptive Motion Control Middleware for Teleoperation based on Pose Tracking and Trajectory Planning.- Approach of a Decision Support Matrix for the Implementation of Exoskeletons in Industrial Workplaces.- An approach to integrate a blockchain-based payment model and independent secure documentation for a Robot as a Service.- Human-Robot Collaboration: Human Body Simulation within a Hybrid Operating Method for a Safe and Efficient Human-Robot Collaboration.- Towards Semi Automated Pre-assembly for Aircraft Interior Production.- An approach for direct offline programming of high precision assembly tasks on 3D scans using tactile control and automatic program adaption.- Industry 4.0: Implementation of innovative manufacturing technologies in foundries for large-volume components.- The Digital Twin as a mediator for the digitalization and conservation of expert knowledge.- Web Service for Point Cloud supported Robot Programming using Machine Learning.- Using of Augmented Reality for improved Human-Machine interaction and Real-Time Error Correction of Laboratory Units.- Scalability of assembly line automation based on the integrated product development approach.- Machine Vision: Robot-based Creation of Complete 3D Workpiece Models.- Classification of assembly operations using recurrent neural networks.- Configuration and enablement of vision sensor solutions through a combined simulation based process chain.- Towards Synthetic AI Training Data for Image Classification in Intralogistic Settings.- Evaluation of ML-based Grasping Approaches inthe Field of Automated Assembly.- Robot Programming: Playback Robot Programming Framework for Fiber Spray Processes.- LiDAR-Based Localization for Formation Control of Multi-Robot Systems.- Playback Robot Programming With Loop Increments.- Web-based platform for the configuration of robot applications: A retrospective view on the research project ROBOTOP.- Partial Automated Multi-Pass-Welding for Thick Sheet Metal Connections.
£31.49
Springer Nature Switzerland AG Ten Materials That Shaped Our World
Book SynopsisThis book examines ten materials—flint, clay, iron, gold, glass, cement, rubber, polyethylene, aluminum, and silicon—explaining how they formed, how we discovered them, why they have the properties they do, and how they have transformed our lives. Since the dawn of the Stone Age, we have shaped materials to meet our needs and, in turn, those materials have shaped us.The fracturing of flint created sharp, curved surfaces that gave our ancestors an evolutionary edge. Molding clay and then baking it in the sun produced a means of recording the written word and exemplified human artistic imagination. As our ability to control heat improved, earthenware became stoneware and eventually porcelain, the most prized ceramic of all. Iron cast at high temperatures formed the components needed for steam engines, locomotives, and power looms—the tools of the Industrial Revolution. Gold has captivated humans for thousands of years and has recently found important uses in biology, medicine, and nanotechnology. Glass shaped into early and imperfect lenses not only revealed the microscopic world of cells and crystals, but also allowed us to discover stars and planets beyond those visible with the naked eye. Silicon revolutionized the computer, propelling us into the Information Age and with it our interconnected social networks, the Internet of Things, and artificial intelligence.Written by a materials scientist, this book explores not just why, but also how certain materials came to be so fundamental to human society. This enlightening study captivates anyone interested in learning more about the history of humankind, our ingenuity, and the materials that have shaped our world.Table of ContentsChapter 1. Introduction.- Chapter 2. Flint – The Material of Evolution.- Chapter 3. Clay – The Material of Life.- Chapter 4. Iron – The Material of Industry.- Chapter 5. Gold – The Material of Empire.- Chapter 6. Glass – The Material of Clarity.- Chapter 7. Cement – The Material of Grandeur.- Chapter 8. Rubber – The Material of Possibilities.- Chapter 9. Polyethylene – The Material of Chance.- Chapter 10. Aluminum – The Material of Flight.- Chapter 11. Silicon – The Material of Information.- Conclusion.
£18.99
Springer Nature Switzerland AG Computational Electronic Circuits: Simulation and
Book SynopsisThis textbook teaches in one, coherent presentation the three distinct topics of analysis of electronic circuits, mathematical numerical algorithms and coding in a software such as MATLAB®. By combining the capabilities of circuit simulators and mathematical software, the author teaches key concepts of circuit analysis and algorithms, using a modern approach. The DC, Transient, AC, Noise and behavioral analyses are implemented in MATLAB to study the complete characteristics of a variety of electronic circuits, such as amplifiers, rectifiers, hysteresis circuits, harmonic traps and passes, polyphaser filters, directional couplers, electro-static discharge and piezoelectric crystals. This book teaches basic and advanced circuit analysis, by incorporating algorithms and simulations that teach readers how to develop their own simulators and fully characterize and design electronic circuits. Teaches students and practitioners DC, AC, Transient, Noise and Behavioral analyses using MATLAB; Shows readers how to create their own complete simulator in MATLAB by adding materials learned in all 6 chapters of the book; Balances theory, math and analysis; Introduces many examples such as noise minimization, parameter optimization, power splitters, harmonic traps and passes, directional couplers, polyphase filters and electro-static discharge that are hardly referenced in other textbooks; Teaches how to create the fundamental analysis functions such as linear and nonlinear equation solvers, determinant calculation, random number generation and Fast Fourier transformation rather than using the built-in native MATLAB codes. Table of ContentsIntroduction.- Framework.- DC Analysis.- Transient Analysis.- AC Analysis.- Noise Analysis.- Behavioral Analysis.
£62.99
Springer Nature Switzerland AG Electronic Devices, Circuits, and Applications
Book SynopsisThis textbook for a one-semester course in Electrical Circuits and Devices is written to be concise, understandable, and applicable. Every new concept is illustrated with numerous examples and figures, in order to facilitate learning. The simple and clear style of presentation is complemented by a spiral and modular approach to the topic. This method supports the learning of those who are new to the field, as well as provides in-depth coverage for those who are more experienced. The author discusses electronic devices using a spiral approach, in which key devices such as diodes and transistors are first covered with simple models that beginning students can easily understand. After the reader has grasped the fundamental concepts, the topics are covered again with greater depth in the latter chapters.Table of ContentsInterpreting I-V Curves Introduction to the Diode Semiconductor Physics Introduction to the BJT Introduction to MOSFETs Single Transistor Amplifiers PMOS & CMOS Frequency Response Device Physics Revisited Diode Circuits Diode & BJT Equations Practical Tips in ElectronicsIndex
£61.74
Springer Nature Switzerland AG Intelligent Systems and Applications: Proceedings
Book SynopsisThis book presents Proceedings of the 2021 Intelligent Systems Conference which is a remarkable collection of chapters covering a wider range of topics in areas of intelligent systems and artificial intelligence and their applications to the real world. The conference attracted a total of 496 submissions from many academic pioneering researchers, scientists, industrial engineers, and students from all around the world. These submissions underwent a double-blind peer-review process. Of the total submissions, 180 submissions have been selected to be included in these proceedings.As we witness exponential growth of computational intelligence in several directions and use of intelligent systems in everyday applications, this book is an ideal resource for reporting latest innovations and future of AI. The chapters include theory and application on all aspects of artificial intelligence, from classical to intelligent scope.We hope that readers find the book interesting and valuable; it provides the state-of-the-art intelligent methods and techniques for solving real-world problems along with a vision of the future research. Table of ContentsZero-Touch Customer Order Fulfillment to Support the New Normal of Retail in the 21st Century.- VitrAI: Applying Explainable AI in the Real World.- Contactless Interface for Navigation in Medical Imaging Systems.- Mobile Apps for 3D Face Scanning.- Tabu Search for Locating-Routing in the Goods Delivery and Waste Pickup in Trujillo-Peru.- The Emergence of Hybrid Edge-Cloud Computing for Energy Efficiency in Buildings.- Particle Swarm Model for Predicting Student Performance in Computing Programs.- A Genetic Algorithm for Quantum Circuit Generation in OpenQASM.- An Improved Clustering-based Harmony Search Algorithm (IC-HS).- Supporting Financial Inclusion with Graph Machine Learning and Super-App Alternative Data.- Electromagnetism-Like Algorithm and Harmony Search for Chemical Kinetics Problem.- Learning Incorrect Verdict Patterns of the Established Face Recognizing CNN Models using Meta-Learning Supervisor ANN.- SmartData: An Intelligent Decision Support System to Predict the Readers Permanence in News.- High Capacity Data Hiding for AMBTC Decompressed Images using Pixel Modification and Difference Expansion.- Fraud Detection in Online Market Research.
£161.99
Springer Nature Switzerland AG Advances in Automation and Robotics Research:
Book SynopsisThis book gathers the proceedings of the 3rd Latin American Congress on Automation and Robotics, held at Monterrey, Mexico, on November 17–19, 2021. This book presents recent advances in the modeling, design, control, and development of autonomous and robotic systems and explores current exciting applications and future challenges of these technologies. The scope of this book covers a wide range of research fields associated with automation and robotics encountered within engineering, scientific research, and practice. These topics are related to autonomous systems, industrial automation and robotics, modelling and systems identification, simulation procedures and experimental validations, control theory, artificial intelligence, computer vision, sensing and sensor fusion, multi-robot and multi-agent systems, field and service robotics, human robot interaction and interfaces, modelling of robotic systems, and the design of new robotic platforms.Table of ContentsDecidable Fragments of Calculi Used in CatLog.- Interactive Theorem Proving for Logic and Information.- A Valence Catalogue for Norwegian.- Arabic Computational Linguistics: Potential, Pitfalls and Challenges.
£134.99
Springer Nature Switzerland AG Theory of Applied Robotics: Kinematics, Dynamics,
Book SynopsisTheory of Applied Robotics: Kinematics, Dynamics, and Control presents detailed robotics concepts at a theoretical-practical level, concentrating on their practical use. Related theorems and formal proofs are provided, as are real-life applications. This new edition is completely revised, and includes updated and expanded example sets and problems and new materials. This textbook is designed for undergraduate or first-year graduate programs in mechanical, systems, and industrial engineering. Practicing engineers, researchers, and related professionals will appreciate the book’s user-friendly presentation of a wealth of robotics topics, most notably in 3D kinematics and dynamics of manipulator robots.Table of ContentsIntroduction.- Kinematics.- Rotation Kinematics.- Orientation Kinematics.- Motion Kinematics.- Forward Kinematics.- Inverse Kinematics.- Angular Velocity.- Velocity Kinematics.- Numerical Methods in Kinematics.- Dynamics.- Acceleration Kinematics.- Motion Dynamics.- Robot Dynamics.- Control.- Path Planning.- F Time Optimal Control.- Control Techniques.- Appendix A: Global Frame Triple Rotation.- Appendix B: Local Frame Triple Rotation.- Appendix C: Principal Central Screws Triple Combination. Appendix D: Trigonometric Formula.
£85.49
Springer International Publishing AG Production Planning and Control in Semiconductor
Book SynopsisThis book systematically analyzes the applicability of big data analytics and Industry 4.0 from the perspective of semiconductor manufacturing management. It reports in real examples and presents case studies as supporting evidence. In recent years, technologies of big data analytics and Industry 4.0 have been frequently applied to the management of semiconductor manufacturing. However, related research results are mostly scattered in various journal issues or conference proceedings, and there is an urgent need for a systematic integration of these results. In addition, many related discussions have placed too much emphasis on the theoretical framework of information systems rather than on the needs of semiconductor manufacturing management. This book addresses these issues. Table of ContentsChapter 1. Big Data Analytics for Semiconductor Manufacturing.- Chapter 2. Industry 4.0 for Semiconductor Manufacturing.- Chapter 3. Cycle Time Prediction and Output Projection.- Chapter 4. Defect Pattern Analysis, Yield Learning Modeling and Yield Prediction.- Chapter 5. Job Sequencing and Scheduling.
£37.99
Springer International Publishing AG Handbook of II-VI Semiconductor-Based Sensors and
Book SynopsisThree-volumes book “Handbook of II-VI Semiconductor-Based Sensors and Radiation Detectors” is the first to cover both chemical sensors and biosensors and all types of photodetectors and radiation detectors based on II-VI semiconductors. It contains a comprehensive and detailed analysis of all aspects of the application of II-VI semiconductors in these devices. The second volume “Photodetectors” of a three-volume set, focus on the consideration of all types of optical detectors, including IR detectors, visible and UV photodetectors. This consideration includes both the fundamentals of the operation of detectors and the peculiarities of their manufacture and use. In particular, describes numerous strategies for their fabrication and characterization. An analysis of new trends in development of II-VI semiconductors-based photodetectors such as graphene/HgCdTe-, nanowire- and quantum dot-based photodetectors, as well as solution-processed, multicolor, flexible and self-powered photodetectors, are also given. Table of ContentsBasic principles of solid state X-ray radiation detector operation .- (classification, materials, requirements, advantages of II-VI compounds, limitations, application) .- ZnSe-based radiation detectors .- (Single crystal detectors, polycrystalline detectors, design, performances) .- CdTe/CdZnTe-based radiation detectors .- (Single crystal detectors, polycrystalline and epitaxial-based detectors, design, progresses in Growth of High Quality crystals, Performances) .- X-ray and gamma imaging using II-VI semiconductor-based detectors .- (approaches, applications) .- Introduction in gas and humidity sensing .- (principles of operation, main applications) .- II-VI semiconductor-based thin film electric and electronic gas sensors .- (conductometric, QCM, SAW-based sensors, thin film and thick film technology; light activation, surface decoration, performances) .- Nanocomposite and hybrid-based electric and electronic gas sensors .- (all types of sensors based on polymer-II-VI composites, carbon-based- II-VI, and metal oxide-II-VI based composites and heterostructures) .- Nanomaterial-based electric and electronic gas sensors .- (all types of sensors based on QDs, 1D, 2D, 3D, core/shells structures) .- II-VI-based electric and electronic humidity sensors .- (all types of sensors; conventional materials; nanomaterials: QDs, 1D, 2D, 3D;) .- II-VI-based optical gas sensors .- (CdSe, CdTe, CdS, luminescence, fluorescence, fiber-optic, QDs, performances, etc.) .- Spectroscopic gas sensing systems .- (systems based on II-VI lasers) .- II-VI-based luminescence and fluorescence ion sensors .- (toxic metals, pH) .- Photoelectrochemical ion sensors .- (toxic metals, electrodes, ion-exchange reactions, applications) .- Introduction in biosensing .- (approaches, materials used, QDs, applications) .- Toxicity and biocompatibility of II-VI semiconductors .- (biocompatibility evaluation, toxicological researches, genotoxicity, cytotoxicity, photoinduced toxicity, QDs, mechanism of QDs toxicity, core-shall structures, surface treatment, ligand exchange, additional coating layers, etc.) .- Biofunctionalization of II-VI QDs .- (semiconductor/biomolecular heterojunctions, functionalization of QDs, solubilization, bioconjugation, functionalization chemistry, ligand exchange, chemical functional groups, biomolecules, limitations) .- Fluorescent biosensors based on II-VI QDs .- (principles of operation, performances, functionalization, advantages, disadvantages, applications, etc.) .- Bioluminescent biosensors based on II-VI QDs .- (principles of operation, performances, functionalization, advantages, disadvantages, applications, etc.) .- Chemiluminescent biosensors based on II-VI QDs .- (principles of operation, performances, functionalization, advantages, disadvantages, applicatios, etc.) .- Electrochemiluminescent biosensors based on II-VI QDs .- (principles of operation, performances, functionalization, advantages, disadvantages, applicatios, etc.) .- Electrochemical biosensors .- (principles of operation, performances, functionalization, advantages, disadvantages, applications, etc.) .- Photoelectrochemical biosensors .- (principles of operation, performances, functionalization, advantages, disadvantages, applications, etc.) .- Surface plasmon resonance biosensors .- (CdSe, CdTe, CdS, Au QDs, principles of operation, performances, functionalization, advantages, disadvantages, applications, etc.) .- Biomarkers, Bioimaging .- (in vitro and in vivo imaging, downconverting and upconverting nanophosphors for bioimaging) .- Specific application of biosensors-1 .- Specific application of biosensors-2 .- Specific application of biosensors-3 .- Magnetoresistice sensors .- (HgTe, HgSe, quantum wells) .- Infrared temperature sensors .- (principles of operation, thermal detectors, thermal imaging, Sprite detectors, applications, advantage, disadvantages) .- Strain and pressure sensors .- (HgTe, topological insulator, quantum dots)
£104.49
Springer International Publishing AG Introduction to Electronic Devices
Book SynopsisThis textbook offers a comprehensive introduction to the basic principles ruling the working mechanism of the most common solid-state electronic devices. It covers the physics of semiconductors and the properties of junctions of semiconductors with semiconductors, metals, and insulators. The exposition makes a minimal use of quantum mechanics concepts and methods. On the other hand, it avoids the pure phenomenological description of the properties of electronic devices. Thus, using a semi-classical approach the book provides a rigorous treatment of the subject. The book is addressed to undergraduate students of scientific and technological faculties as well to professionals who wish to be introduced to the basic principles of electronic devices.Table of ContentsThe Physical Background.- The Metal-Semiconductor junction.- Generation and Recombination processes.- PN Junction.- Negative Differential Resistance Effects.- Bipolar Junction Transistor.- Heterojunctions.- Metal-Oxide-Semiconductor junction.- Field Effect Transistors.
£42.74
Springer Emerging Applications of Novel Nanoparticles
Book SynopsisChapter 1. 2D nanomaterials for Adsorption of Wastewater Pollutants.- Chapter 2. UNVEILING THE POWER OF NANOMATERIALS IN THE AREA OF FORENSICS.- Chapter 3. Buckypapers: Applications in Composite Materials.- Chapter 4. Nanoparticles for Diagnosis and Treatment of Infectious Diseases.- Chapter 5. Ti3C2Tx MXene based nanostructured materials for emerging applications.- Chapter 6. Molybdenum Disulfide: A 2D material.- Chapter 7. Surface Functionalization of 2D MOs for Enhanced Biocompatibility and Biomedical Applications.- Chapter 8. Application of a novel Nanotherapeutic strategy in Ayurvedic treatment.- Chapter 9. Biosynthesis of Iron Oxide Nanoparticles (IONPs): Toxicity Evaluation and Applications for Magnetic Resonance Imaging and Magnetic Hyperthermia.- Chapter 10. Effect of annealing temperature on structural, morphological and optical properties of CdZnTe thin films.- Chapter 11. Two-dimensional Molybdenum Disulfide Nanosheets based Optoelectronic Devices.- Chapter 12. Pho
£143.99
Springer Conductors Semiconductors Superconductors
Book SynopsisSpectacular Advances.- Well Ordered Lattice Structures in Crystals.- Permanent Movement in the Crystal Lattice.- Electric Conductor or Insulator?—Energy Bands.- Metals Obey the Rules of Quantum Statistics.- Less Can Be More: Semiconductors.- Circling Electrons in High Magnetic Fields.- The Winner: Superconductors.- The Big Surprise: High-Temperature Superconductivity.- Magnetism: Order Among the Elementary Magnets.- Nanostructures: Superlattices, Quantum Wires, and Quantum Dots.- Defects in the Crystal Lattice: Useful orHarmful?.
£53.99
De Gruyter Fiber-Based Optical Resonators: Cavity QED,
Book SynopsisAfter laying the foundation by explaining the fundamental principles of light propagation and optical resonators, this book delves into the realm of implementing resonators through a fiber-based approach. It extensively explores fiber-based resonators, encompassing a comprehensive discussion spanning from their intricacies of design to their pivotal roles in advancing quantum optics experiments. Furthermore, it details the design techniques, meticulously explaining the latest developments within this dynamic field. There are vivid illustrations highlighting the various applications of resonators in experimental optics and cavity quantum electrodynamics. Also, a discourse is presented regarding the future potential of fiber-based resonators in quantum technology. The book serves as a valuable resource for individuals with an interest in optical resonators and their boundless possibilities.
£86.45
De Gruyter Semiconductor Spintronics
£64.60
£56.95
de Gruyter Nanoelectronics
Book Synopsis
£64.60
De Gruyter Pattern Recognition
Book SynopsisThe book offers a thorough introduction to Pattern Recognition aimed at master and advanced bachelor students of engineering and the natural sciences. Besides classification - the heart of Pattern Recognition - special emphasis is put on features: their typology, their properties and their systematic construction. Additionally, general principles that govern Pattern Recognition are illustrated and explained in a comprehensible way. Rather than presenting a complete overview over the rapidly evolving field, the book clarifies the concepts so that the reader can easily understand the underlying ideas and the rationale behind the methods. For this purpose, the mathematical treatment of Pattern Recognition is pushed so far that the mechanisms of action become clear and visible, but not farther. Therefore, not all derivations are driven into the last mathematical detail, as a mathematician would expect it. Ideas of proofs are presented instead of complete proofs. From the authors' point of
£65.70
de Gruyter Elektronik
Book Synopsis
£141.54
de Gruyter Elektronik Für Naturwissenschaftler
Book Synopsis
£134.09
de Gruyter Der Einfluß Von Leistungs Und Mikroelektronik Auf
Book Synopsis
£134.09
de Gruyter Heinrich Barkhausen Und Die Entwicklung Der
Book Synopsis
£134.09
De Gruyter Erlangen 1960
Book Synopsis
£134.09
Springer International Publishing AG FIB Nanostructures
Book SynopsisFIB Nanostructures reviews a range of methods, including milling, etching, deposition, and implantation, applied to manipulate structures at the nanoscale. Focused Ion Beam (FIB) is an important tool for manipulating the structure of materials at the nanoscale, and substantially extends the range of possible applications of nanofabrication. FIB techniques are widely used in the semiconductor industry and in materials research for deposition and ablation, including the fabrication of nanostructures such as nanowires, nanotubes, nanoneedles, graphene sheets, quantum dots, etc. The main objective of this book is to create a platform for knowledge sharing and dissemination of the latest advances in novel areas of FIB for nanostructures and related materials and devices, and to provide a comprehensive introduction to the field and directions for further research. Chapters written by leading scientists throughout the world create a fundamental bridge between focused ion beam and nanotechnology that is intended to stimulate readers' interest in developing new types of nanostructures for application to semiconductor technology. These applications are increasingly important for the future development of materials science, energy technology, and electronic devices. The book can be recommended for physics, electrical engineering, and materials science departments as a reference on materials science and device design.Table of ContentsPrefaceChapter 1: Focused Ion Beam (FIB) technology for micro and nanoscale fabricationsChapter 2: Epitaxial ferroelectric nanostructures fabricated by FIB millingChapter 3: Low current focused-ion-beam milling for freestanding nanomaterial characterizationChapter 4: Focused ion beam milling of carbon nanotube yarns and Bucky-papers: Correlating their internal structure with their macro-propertiesChapter 5: Nanoscale electrical contacts grown by Focused-Ion-Beam (FIB) Induced DepositionChapter 6: Metal induced crystallization of focused ion beam induced deposition for functional patterned ultrathin nanocarbonChapter 7: Deterministic Fabrication of Micro- and Nano-Structures by Focused Ion BeamChapter 8: Application of ion beam processes to scanning probe microscopyChapter 9: Fabrication of needle-shaped specimens containing sub-surface nanostructures for Electron TomographyChapter 10: Fabrication technique of deformation carriers (gratings and speckle patterns) with FIB for micro/nano-scale deformation measurementChapter 11: Controlled Quantum Dot Formation on Focused Ion Beam patterned GaAs SubstratesChapter 12: Development of Functional Metallic Glassy Materials by FIB and Nano-imprint TechnologiesChapter 13: Nanostructured Materials Driven by Dielectrophoresis on Nanoelectrods Patterned by Focused Ion BeamChapter 14: Focused Ion Beam Assisted Nano-Scale Processing and Thermoelectrical CharacterizationChapter 15: FIB design for Nanofluidic applicationsChapter 16: FIB Patterning of Stainless Steel for the Development of Nano-Structured Stent Surfaces for Cardiovascular ApplicationsChapter 17: Evaluation of damages induced by Ga+ focused ion beam in piezoelectric nanostructuresChapter 18: Instabilities in Focused Ion Beam-patterned nanostructuresChapter 19: Nanostructures by mass-separated FIB Index
£123.49
Springer International Publishing AG Dry Etching Technology for Semiconductors
Book SynopsisThis book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.Trade ReviewThis book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. Table of ContentsContribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.
£104.49
Springer International Publishing AG Three-Dimensional Integration of Semiconductors:
Book SynopsisThis book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.Table of ContentsChapter 1 - Research and Development History of Three Dimensional (3D) Integration Technology 1.1 Introduction 1.1.1 The International Technology Roadmap for Semiconductors 1.1.2 Three-dimensional Integration Technology 1.2 Motivation for 3D Integration Technology y 1.3 Research and Development History of 3D Integration Technology R&D History of 3D Packaging Technology 1.3.1 3D Packaging Technology 1.3.2 Origin of the TSV Concept 1.3.3 Research and Development History of 3D Technology in Organizations 1.3.3.1 Japan 1.3.3.2 Japanese 3D Integration Technology Research and Development Project (Dream Chip) 1.3.3.3 USA 1.3.3.4 Europe 1.3.3.5 Asia 1.3.3.6 International 1.4 Research and Development History of 3D Integration Technology for Applications 1.4.1 CMOS Image Sensor and MEMS 1.4.2 DRAM 1.4.3 2.5D with Interposer 1.4.4 Others Chapter 2- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology 2.1 Recent Announcement of Research and Development Activities 2.2 Dynamic Random-Access Memory (DRAM) 2.2.1 Through-Silicon Via (TSV) Technology for DRAM 2.2.2 Wide I/O and Wide I/O2 Mobile DRAM 2.3 Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) DRAM 2.3.1 Hybrid Memory Cube (HMC)High Bandwidth Memory (HBM) DRAM 2.3.2 High Bandwidth Memory (HBM) DRAM 2.4 FPGA and 2.5D 2.5 Others 2.6 New Energy and Industrial Technology Development Organization (NEDO) Japan 2.6.1 Next Generation “Smart Device” Project 2.6.2 Background, Purpose and Target of “Smart Device” Project Chapter 3- TSV Processes 3.1 Deep Silicon Etching by Bosch process 3.1.1 Introduction 3.1.2 Basic characteristics of the Bosch process 3.1.3 Bosch Etching Equipment for TSV 3.1.4 Conclusions 3.2 High Rate Silicon-Via Etching and Basics of Sidewall Etch Reaction by Steady-State Etch Process 3.2.1 Introduction 3.2.2 MERIE Process for TSV Application 3.2.2.1 Effect of RF Frequency 3.2.2.2 Effect of Pressure 3.2.2.3 Effect of Oxygen Addition 3.2.3 Investigation of Sidewall Etch Reaction Induced by SF6/O2 Plasma 3.2.3.1 Effect of Oxygen Addition 3.2.3.2 Effect of Temperature 3.2.3.3 Effect of SiF4 Addition 3.2.4 Conclusion 3.3 Low Temperature CVD Technology 3.3.1 Introduction 3.3.2 Cathode-Coupled PECVD (LS-CVD) 3.3.3 Low Temperature SiO2 Deposition 3.3.3.1 Wafer Temperature During Low Temperature Deposition 3.3.3.2 Step Coverage in Si Via Holes 3.3.3.3 Electrical Characteristics of SiO2 Film Deposited at Low Temperature 3.3.3.4 Stress Control of SiO2 Film Deposited Using LS-CVD 3.3.4 Conclusion 3.4 Electrodeposition for Via-Filling 3.4.1 Cu+ Ion as an Accelerant Additive of Copper Electrodeposition 3.4.2 Relation between via Filling and Cu+ Ion by Periodical Reverse Current Waveform 3.4.3 Simulation of Cu+ Ion Distribution inside the Via 3.4.4 High Speed via Filling Electrodeposition by Other Organizations 3.4.5 Reduction of Thermal Expansion Coefficient of Electrodeposited Copper for TSV by Additive Chapter 4 - Wafer Handling and Thinning Processes 4.1 Wafer Thinning Solution for TSV Devices 4.1.1 Introduction 4.1.2 General Thinning 4.1.3 Wafer Thinning for TSV devices 4.1.4 TTV control 4.1.5 Summary 4.2 A Novel Via Middle TSV Thinning Technology by Si/Cu Grinding and CMP 4.2.1 Introduction 4.2.2 Methods 4.2.3 Results and Discussion 4.2.3.1 Si/Cu Same Rate CMP (1st CMP) 4.2.3.2 TSV Protrusion CMP (2nd CMP) 4.2.3.3 Post CMP Cleaning after 2nd CMP 4.2.4 Conclusion 4.3 Temporally Bonding 4.3.1 Background 4.3.2 The 3MTM Temporary Bonding Materials 4.3.3 The 3MTM Temporary Adhesive 4.3.4 Laser Absorbing Layer 4.3.5 The Next Steps 4.4 Temporary Bonding and Debonding for Through-Silicon Via (TSV) Processing 4.4.1 Introduction 4.4.2 Temporary Bonding and Debonding Process 4.4.3 Debonding Method 4.4.4 Functions and Performance Requirements for Temporary Bonding Device 4.4.5 Ability and Performance Requirements for Debonding Devices 4.4.6 Tokyo Electron’s Temporary Bonder and Debonder Device Concept and Lineup 4.4.7 Future Outlook Chapter 5- Wafer and Die Bonding Processes 5.1 Permanent Wafer Bonding 5.1.1 Introduction 5.1.2 Low Temperature or Room Temperature Wafer Direct Bonding Method and Application 5.1.2.1 Fusion Bonding 5.1.2.2 Surface Activated Bonding 5.1.2.3 Anodic Bonding 5.1.2.4 Cu2Cu/Oxide Hybrid bonding 5.1.2.5 Conclusion of Low Temperature or Room Temperature Wafer Direct Bonding Methods and Their Applications 5.1.2.6 Future Outlook for Bonding Application Using Low Temperature or Normal Room Temperature Wafer Direct Bonding Methods 5.1.3 Requests Made to Equipment Makers and Initiatives Regarding Low Temperature or Room Temperature Wafer Direct Bonding Methods 5.1.3.1 Post BAA 5.1.3.2 Scaling 5.1.3.3 Distortion 5.1.3.4 Bonding strength 5.1.3.5 Void 5.1.4 Tokyo Electron Initiatives 5.1.5 Conclusion 5.2 Underfill Materials 5.2.1 Technical Trend for Three Dimensional Integration Packages and Underfill Materials 5.2.2 Requirements for Underfill Materials 5.2.2.1 Requirements for CUF and Material Technology Trend 5.2.2.2 Requirements for NCP and Material Technology Trend 5.2.3 Application to CUF between the Stacked Chips 5.3 Non-Conductive Films 5.3.1 Introduction 5.3.2 Required Material Feature from Bonding Process 5.3.3 Voiding Issue in NC 5.3.4 High Through Put NCF-TCB Chapter 6- Metrology and Inspection 6.1 Principles of Spectroscopic Reflectometry 6.1.1 Introduction 6.1.2 Measurement 6.1.3 Setup 6.1.4 Analysis 6.1.5 Conclusion 6.2 Low Coherence Interferometry for 3D-IC TSV 6.2.1 Optical Measurement of Topographies and Thicknesses 6.2.1.1 3D-IC TSV Needs Tomography 6.2.1.2 Tomography with Low Coherence Interferometry 6.2.2 Theory of Optical Coherence Tomography 6.2.2.1 Basic Principle 6.2.2.2 Time Domain OCT 6.2.2.3 Fourier Domain OCT 6.2.3 Practical Considerations 6.2.4 Conclusion 6.3 Silicon and Glue Thickness Measurement for Grinding 6.3.1 Introduction 6.3.2 TSV Wafer Manufacturing Method and Challenges of Grinding 6.3.3 Features of BGM300 6.3.4 Verifying BGM300 Measurement Results 6.3.5 Measurement after Grinding 6.3.6 Optimized wafer Grinding Based on Via Height Information from BGM300 6.3.7 Conclusion 6.4 3D X-ray Microscopy Technology for Non-Destructive Analysis of Through-Silicon Vias 6.4.1 Introduction 6.4.2 Fundamentals of X-ray Microscopy 6.4.2.1 Physics of X-ray Imaging 6.4.2.2 3D X-ray Microscopy 6.4.3 Applications for TSV Process Development 6.4.4 Applications for TSV Failure Analysis 6.4.5 Summary 6.5 Wafer Warpage and Local Distortion Measurement 6.5.1 Introduction 6.5.2 Basic Functions of WDM300 6.5.3 Measurement and Analysis of Local Deformations 6.5.4 Application 6.5.5 Summary Chapter 7 - TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability 7.1 Introduction 7.2 Impact of Cu Contamination on Device Reliabilities in Thinned 3D-IC Chip 7.2.1 Impact of Cu Diffusion at Backside Surface in Thinned 3D-IC Chip 7.2.1.1 Effect of Intrinsic Gettering (IG) layer 7.2.1.2 Effect of Extrinsic Gettering (EG) layer 7.2.2 Impact of Cu Diffusion from Cu Via 7.2.2.1 Effect of the Barrier Thickness and the Scallop Roughness 7.2.2.2 Effect of the Annealing Temperature 7.2.2.3 Keep Out Zone (KOZ) Characterization by Cu Diffusion from Cu Via 7.3 Impact of Mechanical Stress/Strain on Device Reliability in Stacked IC 7.3.1 Micro-Bump Induced Local Stress in Stacked IC 7.3.2 Si Mechanical Strength Reduction by Thinning 7.4 Impact of 3D Integration Process on DRAM Retention Characteristics 7.4.1 Impact of Mechanical Strength on Retention Characteristics in Thinn DRAM Chip 7.4.2 Impact of Cu Contamination on Memory Retention Characteristics in DRAM Chip Chapter 8 - Trends in 3D Integrated Circuit (3D-IC) Testing Technology 8.1 Crucial Issues and Key Technologies for 3D-IC Testing 8.2 Research Trends in Pre-bond Test for 3D-IC 8.3 Research Trends in Post-bond Test for 3D-IC 8.4 Research Trends in Automatic Test Pattern Generator (ATPG) and Test Scheduling for TSVs in 3D-IC 8.5 An Accurate Resistance Measuring Method for TSVs in 3D-IC 8.5.1 Background of Our Study 8.5.2 Problems of Conventional Analog Boundary-Scan for TSV Resistance Measurement 8.5.2.1 Analog Boundary-Scan 8.5.2.2 Standard resistance measuring method by 1149.4 8.5.2.3 Problems of conventional Analog Boundary-Scan for TSV resistance measuring 8.5.3 Proposed Measuring Method 8.5.3.1 Floating Measurement method 8.5.3.2 Complete isolation of the current path and the voltage path 8.5.3.3 Segmenting the internal analog BUS (AB1, AB2) 8.5.4 Summary 8.6 Delay Measurement Circuits for Detecting TSV Delay Faults 8.6.1 Application of Time-to-Digital Converter Embedded in Boundary-Scan for 3D-IC Testing 8.6.2 Delay Measurement Circuit Using the Vernier Delay Line 8.6.3 Estimation of Defect Size Detectable by the Test Method 8.6.4 Summary 8.7 Electrical Interconnect Tests of Open Defects in a 3D-IC with a Built-in Supply Current Test Circuit 8.7.1 Electrical Tests with a Built-in Supply Current Test Circuit 8.7.2 Experimental Evaluation of Our Electrical Test Method 8.7.3 Summary Chapter 9 - Dream Chip Project at ASET 9.1 Overview of Japanese 3D Integration Technology R&D Project (Dream Chip) 9.2 Thermal Management and Chip Stacking Technology 9.2.1 Background 9.2.2 Chip Stacking/Joining Technology 9.2.2.1 Metal Bump Materials and Structure 9.2.2.2 Reliability Study of Micro Bump 9.2.2.3 Electro Migration Test to Understand Current Density of Micro Bump Joint 9.2.2.4 Flip Chip Bonding Density Towards 10 μm Connection Bump Pitch 9.2.2.5 Stack and Gang Bonding 9.2.2.6 Non-destructive Inspection Technologies of Micro Joint 9.2.3 Thermal Management Study 9.2.3.1 Evaluation Technology of 3D Integrated Chip Stack 9.2.3.2 TV200 Measurement Result and Correlation with Simulation 9.2.3.3 Thermal Conductivity Anisotropy Induced by Cu TSV 9.2.4 Development of Automobile Drive Assistance Camera 9.2.4.1 Development of Integration Process 9.2.4.2 Development of Cooling System for Automobile Drive Assistance Camera 9.2.5 Summery 9.3 Thin Wafer Technology 9.3.1 Back Ground of Wafer Thinning Technology 9.3.2 Issues of Wafer Thinning 9.3.3 Ultrathin Wafer Thinning Process 9.3.3.1 Wafer Support System (WSS) 9.3.3.2 Thermal Resistance of the Resin Used for WSS Temporary Bonding 9.3.3.3 Dicing Technology of Thin Chip 9.3.3.4 Die Pick-up Technology of Thin Chip 9.3.3.5 Thin Wafer Processing Technique in the Wafer Stacking Process 9.3.4 Issues on Wafer Thinning to Prevent Device Characteristics Change and Metal Contamination 9.3.4.1 Evaluation Method of a Crystal Defect and Metal Pollution in the Thin Wafer 9.3.4.2 Backside Grinding Methods and Their EG Effect 9.3.4.3 Electrical Characteristics Deviation by Mechanical Stress 9.3.5 Standardization 9.3.6 Summary 9.4 3D Integration Technology 9.4.1 Background and Scope 9.4.2 C2C Process 9.4.2.1 C2C Integration Overview 9.4.2.2 C2C Integration Results 9.4.3 W2W Process 9.4.3.1 W2W Integration Overview 9.4.3.2 Wafer Bonding Technology 9.4.3.3 W2W Integration Results 9.4.4 Summary 9.5 Ultra-wide Bus 3D-System-in Package (3D-SiP) Technology 9.5.1 Background 9.5.2 The Test Vehicle Fabrication 9.5.3 Evaluation 9.5.4 Summary 9.6 Mixed Signal (Digital and Analog) 3D Integration Technology for Automotive Application 9.6.1 Introduction 9.6.2 Challenges 9.6.3 Result of Basic Technology Development on Mixed-Signal 3D Integration Technology 9.6.3.1 Basic Technology Development on 3D Integrated Imaging Sensor Module for In-Vehicle 9.6.3.2 Realization of Mixed-Signal (CIS/CDS/ADC/IF) Integrated Structure by TSV Connection 9.6.3.3 Development of Si Interposer Which Allotted TSV Type Decoupling Capacitor 9.6.3.4 A Trial production and Evaluation of Car Drive Assist Image Processing System for Cars 9.6.4 Conclusion 9.7 Heterogeneous 3D Integration Technology for Radio Frequency Micro Electro Mechanical Systems RF MEMS (RF MEMS) 9.7.1 Background and Issues 9.7.2 Development Result 9.7.2.1 Structure of 3D integration RF Module 9.7.2.2 MEMS Tunable Filter 9.7.2.3 MEMS Switch 9.7.2.4 CMOS Driving IC 9.7.2.5 3D Integration of Tunable Filter Module 9.7.2.6 RF and Tuning Performances of the Fabricated 3D Tunable Filter Module 9.7.3 Summary
£80.99
Springer International Publishing AG Low-Power Analog Techniques, Sensors for Mobile
Book SynopsisThis book is based on the 18 invited tutorials presented during the 27th workshop on Advances in Analog Circuit Design. Expert designers from both industry and academia present readers with information about a variety of topics at the frontiers of analog circuit design, including the design of analog circuits in power-constrained applications, CMOS-compatible sensors for mobile devices and energy-efficient amplifiers and drivers. For anyone involved in the design of analog circuits, this book will serve as a valuable guide to the current state-of-the-art.Provides a state-of-the-art reference in analog circuit design, written by experts from industry and academia;Presents material in a tutorial-based format;Covers the design of analog circuits in power-constrained applications, CMOS-compatible sensors for mobile devices and energy-efficient amplifiers and drivers.Table of ContentsIntroduction.- Hybrid Data Converters.- Hybrid and Segmented ADC Techniques to Optimize Power Efficiency and Area. The Case of a 0.076mm2 600MS/s 12b SAR-DS ADC.- Interleaved Pipelined SAR ADCs: Combined Power for Efficient Accurate High-Speed Conversion.- Hybrid VCO-based 0-1 MASH and Hybrid DS SAR ADCs.- Hybrid Architecture for Reconfigurable SAR ADC.- A Hybrid ADC for High Resolution: the Zoom-ADC.- Advances in Bio-Medical Sensor Systems for Wearable Health.- An Ultra-Low Power, Robust Photoplethysomographic Readout Exploiting Compressive Sampling, Artifact Reduction and Sensor Fusion.- A 32kHz-DTCXO RTC Module with an Overall Accuracy of ±1ppm and an All-Digital 0.1ppm Compensation-Resolution Scheme.- Energy-Efficient High-Resolution resistor-based temperature sensors.- Ultra-Low Power Charge-Pump-Based Bandgap References.- An Energy-Efficient Integrating Dual-Slope Capacitance-to-Digital Converter.- FD-SOI Technology, Advantages for Analog/RF and Mixed-Signal Designs.- Pipeline and SAR ADCs for Advanced Nodes.- Time-Based Biomedical AFE Readout in Ultra-Low Voltage, Small-Scale CMOS Technology.- An Ultra-Low Power Bluetooth Low-Energy Transceiver for IoT Applications.- Analog/Mixed-Signal Design in FinFET Technologies.- Analog design in 14nm and 28nm.
£107.99
Carl Hanser Verlag GmbH & Co Automotive High Speed Communication Technologies:
Book SynopsisThe demands for processing power, software, and communication are continuously increasing; in all industries and also in the automotive one. In vehicles, the need for higher data rates is driven by more electronic functions in general, but especially by ever more potent (camera) sensors, displays, and high performance ECUs.This book provides a holistic view on new SerDes and Ethernet high-speed communication solutions for cars. It addresses core physical components such as cables, connectors, or PCB design, as well as physical layer processing, use-case-specific protocols, and the use cases as such. It is important to the authors not only to explain the technologies, but also to provide context and background in respect to various technical choices. The intent is to help readers understand the current eco-system end-to-end, whether they are new to the automotive industry or experts who want to deepen their understanding on specific items, whether they are working for a car manufacturer directly or any of the suppliers, whether they are already involved or evaluating to get involved.This is the first book to address the following topics: the >10 Gbps Automotive Ethernet technologies IEEE 802.3cy and IEEE 802.3cz asymmetric Ethernet the new automotive SerDes Standard, the ASA Motion Link the MIPI Automotive SerDes Solutions ( MASS ) power supply over coaxial data cables design for testability in an automotive context
£78.20
Wiley-VCH Verlag GmbH Handbook of 3D Integration, Volume 3: 3D Process
Book SynopsisEdited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.Table of ContentsList of Contributors xvii 1 3D IC Integration Since 2008 1 Philip Garrou, Peter Ramm, and Mitsumasa Koyanagi 1.1 3D IC Nomenclature 1 1.2 Process Standardization 2 1.3 The Introduction of Interposers (2.5D) 4 1.4 The Foundries 6 1.4.1 TSMC 6 1.4.2 UMC 7 1.4.3 GlobalFoundries 7 1.5 Memory 7 1.5.1 Samsung 7 1.5.2 Micron 8 1.5.3 Hynix 9 1.6 The Assembly and Test Houses 9 1.7 3D IC Application Roadmaps 10 References 11 2 Key Applications and Market Trends for 3D Integration and Interposer Technologies 13 Rozalia Beica, Jean-Christophe Eloy, and Peter Ramm 2.1 Introduction 13 2.2 Advanced Packaging Importance in the Semiconductor Industry is Growing 16 2.3 3D Integration-Focused Activities – The Global IP Landscape 18 2.4 Applications, Technology, and Market Trends 22 References 32 3 Economic Drivers and Impediments for 2.5D/3D Integration 33 Philip Garrou 3.1 3D Performance Advantages 33 3.2 The Economics of Scaling 33 3.3 The Cost of Future Scaling 34 3.4 Cost Remains the Impediment to 2.5D and 3D Product Introduction 37 3.4.1 Required Economics for Interposer Use in Mobile Products 38 3.4.2 Silicon Interposer Pricing 38 References 40 4 Interposer Technology 41 Venky Sundaram and Rao R. Tummala 4.1 Definition of 2.5D Interposers 41 4.2 Interposer Drivers and Need 42 4.3 Comparison of Interposer Materials 44 4.4 Silicon Interposers with TSV 45 4.5 Lower Cost Interposers 48 4.5.1 Glass Interposers 48 4.5.1.1 Challenges in Glass Interposers 49 4.5.1.2 Small-Pitch Through-Package Via Hole Formation and Ultrathin Glass Handling 49 4.5.1.3 Metallization of Glass TPV 51 4.5.1.4 Reliability of Copper TPVs in Glass Interposers 52 4.5.1.5 Thermal Dissipation of Glass 53 4.5.1.6 Glass Interposer Fabrication with TPV and RDL 53 4.5.2 Low-CTE Organic Interposers 53 4.5.3 Polycrystalline Silicon Interposer 55 4.5.3.1 Polycrystalline Silicon Interposer Fabrication Process 56 4.6 Interposer Technical and Manufacturing Challenges 57 4.7 Interposer Application Examples 58 4.8 Conclusions 60 References 61 5 TSV Formation Overview 65 Dean Malta 5.1 Introduction 65 5.2 TSV Process Approaches 67 5.2.1 TSV-Middle Approach 68 5.2.2 Backside TSV-Last Approach 68 5.2.3 Front-Side TSV-Last Approach 69 5.3 TSV Fabrication Steps 70 5.3.1 TSV Etching 70 5.3.2 TSV Insulation 71 5.3.3 TSV Metallization 71 5.3.4 Overburden Removal by CMP 72 5.3.5 TSV Anneal 73 5.3.6 Temporary Carrier Wafer Bonding and Debonding 74 5.3.7 Wafer Thinning and TSV Reveal 74 5.4 Yield and Reliability 75 References 76 6 TSV Unit Processes and Integration 79 Sesh Ramaswami 6.1 Introduction 79 6.2 TSV Process Overview 80 6.3 TSV Unit Processes 82 6.3.1 Etching 82 6.3.2 Insulator Deposition with CVD 83 6.3.3 Metal Liner/Barrier Deposition with PVD 84 6.3.4 Via Filling by ECD of Copper 84 6.3.5 CMP of Copper 85 6.3.6 Temporary Bonding between Carrier and Device Wafer 86 6.3.7 Wafer Backside Thinning 86 6.3.8 Backside RDL 87 6.3.9 Metrology, Inspection, and Defect Review 87 6.4 Integration and Co-optimization of Unit Processes in Via Formation Sequence 88 6.5 Co-optimization of Unit Processes in Backside Processing and Via-Reveal Flow 89 6.6 Integration and Co-optimization of Unit Processes in Via-Last Flow 91 6.7 Integration with Packaging 92 6.8 Electrical Characterization of TSVs 92 6.9 Conclusions 96 References 97 7 TSV Formation at ASET 99 Hiroaki Ikeda 7.1 Introduction 99 7.2 Via-Last TSV for Both D2D and W2W Processes in ASET 103 7.3 TSV Process for D2D 105 7.3.1 Front-Side Bump Forming 106 7.3.2 Attach WSS and Thinning 106 7.3.3 Deep Si Etching from the Backside 107 7.3.4 Liner Deposition 107 7.3.5 Removal of SiO 2 at the Bottom of Via 107 7.3.6 Barrier Metal and Seed Layer Deposition by PVD 110 7.3.7 Cu Electroplating 110 7.3.8 Cmp 110 7.3.9 Backside Bump 111 7.3.10 Detach WSS 111 7.3.11 Dicing 112 7.4 TSV Process for W2W 113 7.4.1 Polymer Layer Coat and Development 114 7.4.2 Barrier Metal and Seed Layer Deposition 114 7.4.3 Cu Plating 114 7.4.4 CMP 115 7.4.5 First W2W Stacking (Face to Face) 116 7.4.6 Wafer Thinning and Deep Si Etching 116 7.4.7 TSV Liner Deposition and SiO2 Etching of Via Bottom 117 7.4.8 Barrier Metal and Seed Layer Deposition and Cu Plating 117 7.4.9 CMP 117 7.4.10 Next W2W Stacking 118 7.5 Conclusions 119 References 119 8 Laser-Assisted Wafer Processing: New Perspectives in Through-Substrate Via Drilling and Redistribution Layer Deposition 121 Marc B. Hoppenbrouwers, Gerrit Oosterhuis, Guido Knippels, and Fred Roozeboom 8.1 Introduction 121 8.2 Laser Drilling of TSVs 121 8.2.1 Cost of Ownership Comparison 121 8.2.2 Requirements for an Industrial TSV Laser Driller 123 8.2.3 Drilling Strategy 124 8.2.3.1 Mechanical 124 8.2.3.2 Optical 125 8.2.4 Experimental Drilling Results 126 8.3 Direct-Write Deposition of Redistribution Layers 126 8.3.1 Introduction on Redistribution Layers 126 8.3.2 Direct-Write Characteristics 127 8.3.3 Direct-Write Laser-Induced Forward Transfer 128 8.3.4 LIFT Results 130 8.4 Conclusions and Outlook 131 References 132 9 Temporary Bonding Material Requirements 135 Rama Puligadda 9.1 Introduction 135 9.2 Technology Options 136 9.2.1 Tapes and Waxes 136 9.2.2 Chemical Debonding 136 9.2.3 Thermoplastic Bonding Material and Slide Debonding 136 9.2.4 Debonding Using Release Layers 137 9.3 Requirements of a Temporary Bonding Material 138 9.4 Considerations for Successful Processing 139 9.4.1 Application of the Temporary Bonding Adhesive to the Device Wafer and Bonding to Carrier 139 9.4.2 Moisture and Contaminants on Surface 139 9.4.3 Total Thickness Variation 140 9.4.4 Squeeze Out 140 9.5 Surviving the Backside Process 141 9.5.1 Edge Trimming 142 9.5.2 Edge Cleaning 142 9.5.3 Temperature Excursions in Plasma Processes 143 9.5.4 Wafer Warpage due to CTE Mismatch 143 9.6 Debonding 144 9.6.1 Debonding Parameters in Slide-Off Debonding 144 9.6.2 Mechanical Damage to Interconnects 144 References 145 10 Temporary Bonding and Debonding – An Update on Materials and Methods 147 Wilfried Bair 10.1 Introduction 147 10.2 Carrier Selection for Temporary Bonding 148 10.3 Selection of Temporary Bonding Adhesives 151 10.4 Bonding and Debonding Processes 152 10.5 Equipment and Process Integration 155 References 156 11 ZoneBOND 1 : Recent Developments in Temporary Bonding and Room-Temperature Debonding 159 Thorsten Matthias, J€urgen Burggraf, Daniel Burgstaller, Markus Wimplinger, and Paul Lindner 11.1 Introduction 159 11.2 Thin Wafer Processing 159 11.2.1 Thin Wafer Total Thickness Variation 161 11.2.2 Wafer Alignment 163 11.3 ZoneBOND Room-Temperature Debonding 163 11.4 Conclusions 165 References 166 12 Temporary Bonding and Debonding at TOK 167 Shoji Otaka 12.1 Introduction 167 12.2 Zero Newton Technology 168 12.2.1 The Wafer Bonder 168 12.2.2 The Wafer Debonder 170 12.2.3 The Wafer Bonder and Debonder Equipment Lineups 170 12.2.4 Adhesives 170 12.2.5 Integration Process Performance 172 12.3 Conclusions 174 References 174 13 The 3MTM Wafer Support System (WSS) 175 Blake Dronen and Richard Webb 13.1 Introduction 175 13.2 System Description 175 13.3 General Advantages 177 13.4 High-Temperature Material Solutions 178 13.5 Process Considerations 180 13.5.1 Wafer and Adhesive Delamination 180 13.5.2 LTHC Glass Delamination 181 13.6 Future Directions 181 13.6.1 Thermal Stability 181 13.6.2 Elimination of Adhesion Control Agents 182 13.6.3 Laser-Free Release Layer 183 13.7 Summary 183 Reference 184 14 Comparison of Temporary Bonding and Debonding Process Flows 185 Matthew Lueck 14.1 Introduction 185 14.2 Studies of Wafer Bonding and Thinning 186 14.3 Backside Processing 186 14.4 Debonding and Cleaning 188 References 189 15 Thinning, Via Reveal, and Backside Processing – Overview 191 Eric Beyne, Anne Jourdain, and Alain Phommahaxay 15.1 Introduction 191 15.2 Wafer Edge Trimming 192 15.3 Thin Wafer Support Systems 194 15.3.1 Glass Carrier Support System with Laser Debonding Approach 196 15.3.2 Thermoplastic Glue Thin Wafer Support System – Thermal Slide Debondable System 196 15.3.3 Room-Temperature, Peel-Debondable Thin Wafer Support Systems 197 15.4 Wafer Thinning 198 15.5 Thin Wafer Backside Processing 202 15.5.1 Via-Middle Thin Wafer Backside Processing: “Via-Reveal” Process 202 15.5.1.1 Mechanical Via Reveal 202 15.5.1.2 “Soft” Via Reveal 202 15.5.2 Via-Last Thin Wafer Backside Processing 203 References 205 16 Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers 207 Christof Landesberger, Christoph Paschke, Hans-Peter Sp€ohrle, and Karlheinz Bock 16.1 Introduction 207 16.2 Thin Semiconductor Devices 207 16.3 Wafer Thinning Techniques 208 16.3.1 Wafer Grinding 209 16.3.2 Wet-Chemical Spin Etching 210 16.3.3 CMP Polishing 211 16.3.4 Plasma Dry Etching 212 16.3.5 Dry Polish 213 16.3.6 Chemical–Mechanical Grinding (CMG) 214 16.4 Fracture Tests for Thin Silicon Wafers 214 16.5 Comparison of Stress-Relief Techniques for Wafer Backside Thinning 216 16.6 Process Flow for Wafer Thinning and Dicing 220 16.7 Summary and Outlook on 3D Integration 222 References 223 17 Via Reveal and Backside Processing 227 Mitsumasa Koyanagi and Tetsu Tanaka 17.1 Introduction 227 17.2 Via Reveal and Backside Processing in Via-Middle Process 227 17.3 Backside Processing in Back-Via Process 232 17.4 Backside Processing and Impurity Gettering 234 17.5 Backside Processing for RDL Formation 237 References 239 18 Dicing, Grinding, and Polishing (Kiru Kezuru and Migaku) 241 Akihito Kawai 18.1 Introduction 241 18.2 Grinding and Polishing 241 18.2.1 Grinding General 241 18.2.1.1 Grinding Method 241 18.2.1.2 Rough Grinding and Fine Grinding 242 18.2.1.3 The Grinder Polisher 243 18.2.2 Thinning 243 18.2.2.1 Stress Relief 245 18.2.2.2 Die Attach Film 246 18.2.2.3 All-in-One System 246 18.2.2.4 Dicing Before Grinding 246 18.2.3 Grinding Topics for 3DIC Such as TSV Devices 246 18.2.3.1 Wafer Support System 246 18.2.3.2 Edge Trimming 247 18.2.3.3 Grinding to Improve Flatness 248 18.2.3.4 Higher Level of Cleanliness 248 18.2.3.5 Via Reveal 249 18.2.3.6 Planarization 249 18.3 Dicing 250 18.3.1 Blade Dicing General 250 18.3.1.1 Dicing Method 250 18.3.1.2 Blade Dicing Point 250 18.3.1.3 Blade 251 18.3.1.4 Optimization of Process Control 252 18.3.1.5 Dicer 252 18.3.1.6 Dual Dicing Applications 252 18.3.2 Thin Wafer Dicing 253 18.3.3 Low-k Dicing 254 18.3.4 Other Laser Dicing 254 18.3.4.1 Ablation 254 18.3.4.2 Laser Full Cut Application 255 18.3.4.3 Stealth Dicing (SD) 256 18.3.5 Dicing Topics for 3D-IC Such as TSV 257 18.3.5.1 Cutting of Chip on Chip (CoC) and Chip on Wafer (CoW) 258 18.3.5.2 Singulation of CoW and Wafer on Wafer (WoW) 259 18.4 Summary 260 Further Reading 260 19 Overview of Bonding and Assembly for 3D Integration 261 James J.-Q. Lu, Dingyou Zhang, and Peter Ramm 19.1 Introduction 261 19.2 Direct, Indirect, and Hybrid Bonding 262 19.3 Requirements for Bonding Process and Materials 263 19.4 Bonding Quality Characterization 267 19.5 Discussion of Specific Bonding and Assembly Technologies 269 19.6 Summary and Conclusions 273 References 274 20 Bonding and Assembly at TSMC 279 Douglas C.H. Yu 20.1 Introduction 279 20.2 Process Flow 280 20.3 Chip-on-Wafer Stacking 281 20.4 CoW-on-Substrate (CoWoS) Stacking 283 20.5 CoWoS Versus CoCoS 283 20.6 Testing and Known Good Stacks (KGS) 284 20.7 Future Perspectives 285 References 285 21 TSV Packaging Development at STATS ChipPAC 287 Rajendra D. Pendse 21.1 Introduction 287 21.2 Development of the 3DTSV Solution for Mobile Platforms 289 21.3 Alternative Approaches and Future Developments 293 References 294 22 Cu–SiO2 Hybrid Bonding 295 Léa Di Cioccio, S. Moreau, Loïc Sanchez, Floriane Baudin, Pierric Gueguen, Sebastien Mermoz, Yann Beilliard, and Rachid Taibi 22.1 Introduction 295 22.2 Blanket Cu–SiO2 Direct Bonding Principle 296 22.2.1 Chemical–Mechanical Polishing Parameters 296 22.3 Aligned Bonding 299 22.3.1 Wafer-to-Wafer Bonding 299 22.3.2 Die-to-Wafer Bonding in Pick-and-Place Equipment 299 22.3.3 Die-to-Wafer by the Self-Assembly Technique 300 22.4 Blanket Metal Direct Bonding Principle 302 22.5 Electrical Characterization 304 22.5.1 Wafer-to-Wafer and Die-to-Wafer Copper-Bonding Electrical Characterization 304 22.5.2 Reliability 307 22.5.3 Thermal Cycling 307 22.5.4 Stress Voiding (SIV) Test on 200 °C Postbonding Annealed Samples 308 22.5.5 Package-Level Electromigration Test 309 22.6 Conclusions 310 References 311 23 Bump Interconnect for 2.5D and 3D Integration 313 Alan Huffman 23.1 History 313 23.2 C4 Solder Bumps 315 23.3 Copper Pillar Bumps 316 23.4 Cu Bumps 319 23.5 Electromigration 320 References 322 24 Self-Assembly Based 3D and Heterointegration 325 Takafumi Fukushima and Jicheol Bea 24.1 Introduction 325 24.2 Self-Assembly Process 325 24.3 Key Parameters of Self-Assembly on Alignment Accuracies 327 24.4 How to Interconnect Self-Assembled Chips to Chips or Wafers 328 24.4.1 Flip-Chip-to-Wafer 3D Integration 329 24.4.2 Reconfigured-Wafer-to-Wafer 3D Integration 331 References 332 25 High-Accuracy Self-Alignment of Thin Silicon Dies on Plasma-Programmed Surfaces 335 Christof Landesberger, Mitsuru Hiroshima, Josef Weber, and Karlheinz Bock 25.1 Introduction 335 25.2 Principle of Fluidic Self-Alignment Process for Thin Dies 335 25.3 Plasma Programming of the Surface 336 25.4 Preparation of Materials for Self-Alignment Experiments 337 25.5 Self-Alignment Experiments 338 25.6 Results of Self-Alignment Experiments 339 25.7 Discussion 341 25.8 Conclusions 342 References 343 26 Challenges in 3D Fabrication 345 Douglas C.H. Yu 26.1 Introduction 345 26.2 High-Volume Manufacturing for 3D Integration 346 26.3 Technology Challenges 346 26.4 Front-Side and Backside Wafer Processes 346 26.5 Bonding and Underfills 350 26.6 Multitier Stacking 352 26.7 Wafer Thinning and Thin Die and Wafer Handling 353 26.8 Strata Packaging and Assembly 356 26.9 Yield Management 359 26.10 Reliability 360 26.11 Cost Management 362 26.12 Future Perspectives 362 References 364 27 Cu TSV Stress: Avoiding Cu Protrusion and Impact on Devices 365 Eric Beyne, Joke De Messemaeker, and Wei Guo 27.1 Introduction 365 27.2 Cu Stress in TSV 365 27.3 Mitigation of Cu Pumping 368 27.4 Impact of TSVs on FEOL Devices 371 References 378 28 Implications of Stress/Strain and Metal Contamination on Thinned Die 379 Kangwook Lee and Mariappan Murugesan 28.1 Introduction 379 28.2 Impacts of Cu Contamination on Device Reliabilities in Thinned 3DLSI 379 28.3 Impacts of Local Stress and Strain on Device Reliabilities in Thinned 3DLSI 386 28.3.1 Microbump-Induced Stresses in Stacked LSIs 387 28.3.2 Microbump-Induced TMS in LSI 388 28.3.3 Microbump-Induced LMS 389 References 391 29 Metrology Needs for 2.5D/3D Interconnects 393 Victor H. Vartanian, Richard A. Allen, Larry Smith, Klaus Hummler, Steve Olson, and Brian Sapp 29.1 Introduction: 2.5D and 3D Reference Flows 393 29.2 TSV Formation 394 29.2.1 TSV Etch Metrology 395 29.2.2 Liner, Barrier, and Seed Metrology 397 29.2.3 Copper Fill Metrology (TSV Voids) 399 29.2.4 Cross-Sectional SEM (Focused Ion Beam Milling Sample Preparation) 400 29.2.5 X-Ray Microscopy and CT Inspection 400 29.2.6 Stress Metrology in Cu and Si 402 29.3 MEOL Metrology 404 29.3.1 Edge Trim Inspection 405 29.3.2 Bond Voids and Bond Strength Metrology 406 29.3.2.1 Acoustic Microscopy: Operation 407 29.3.2.2 Acoustic Microscopy for Defect Inspection and Review 407 29.3.2.3 Other Bond Void Detection Techniques 408 29.3.3 Bond Strength Metrology 409 29.3.4 Bonded Wafer Thickness, Bow, and Warp 410 29.3.4.1 Chromatic White Light 411 29.3.4.2 Infrared Interferometry 412 29.3.4.3 White Light Interferometry (or Coherence Scanning Interferometry) 414 29.3.4.4 Laser Profiling 415 29.3.4.5 Capacitance Probes 416 29.3.4.6 Differential Backpressure Metrology 417 29.3.4.7 Acoustic Microscopy for Measuring Bonded Wafer Thickness 417 29.3.5 TSV Reveal Metrology 418 29.4 Assembly and Packaging Metrology 420 29.4.1 Wafer-Level C4 Bump and Microbump Metrology and Inspection 421 29.4.2 Package-Level Inspection: Scanning Acoustic Microscopy 422 29.4.3 Package-Level Inspection: X-Rays 424 29.5 Summary 426 References 427 Index 431
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