Description

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology.
Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Handbook of 3D Integration, Volume 3: 3D Process Technology

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Hardback by Philip Garrou , Mitsumasa Koyanagi

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Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this... Read more

    Publisher: Wiley-VCH Verlag GmbH
    Publication Date: 04/06/2014
    ISBN13: 9783527334667, 978-3527334667
    ISBN10: 3527334661

    Number of Pages: 474

    Non Fiction , Technology, Engineering & Agriculture , Education

    Description

    Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology.
    Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

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