Technology, Engineering & Agriculture Books

19323 products


  • Sevick's Transmission Line Transformers: Theory

    SciTech Publishing Inc Sevick's Transmission Line Transformers: Theory

    1 in stock

    Book SynopsisThe long awaited revision of the classic book Transmission Line Transformers, by Jerry Sevick, is now in its fifth edition and has been updated and reorganised by Raymond Mack to provide communication engineers with a clear technical presentation of both the theory and practical applications of the transmission of radio communication. Sevick's Transmission Line Transformers: Theory and Practice, 5th Edition reviews the underlying principles that promote a better understanding of transmission line transformers. Ideal for academics and practicing engineers, this edition is divided into two clear parts for easy reference. Part one is a review of the theory and new concepts, including a discussion on the magnetic properties that affect the core of a transmission line transformer. Part two essentially focuses on the 'practice' element of the book title. This section has been updated to reflect the significant changes in component suppliers over the 30 years since the first edition of the book. Highlights of this title include the coverage of substantial background theory, recent work on fractional ratio transformers and high power Balun designs, and provides updated sources for transformer materials to reflect mergers, sales, and business failures over the past 20 years. There is also expanded coverage of commercial sources of low impedance coaxial cable; expanded construction hints for purpose built rectangular parallel transmission lines; plus an updated test equipment chapter to reflect modern computer based experimenter grade test equipment sources. Ray has leveraged his experience with ferrite materials for switching power to explain the performance characteristics of the ferrite materials used for RF power transmission line transformers.Table of Contents Chapter 1: Transformer Basics Chapter 2: Ferrite Materials Chapter 3: Guanella Analysis Chapter 4: Ruthroff Analysis Chapter 5: Transmission Line Construction Chapter 6: 1:4 Unun Transformer Designs Chapter 7: Unun Transformer Designs with Impedance Ratios Less Than 1:4 Chapter 8: Unun Transformer Designs with Impedance Ratios Greater Than 1:4 Chapter 9: Baluns Chapter 10: Multimatch Transformers Chapter 11: Equal Delay Transformers Chapter 12: Simple Test Equipment Chapter 13: Construction Techniques Appendix A: Reprint of Guanella Article Appendix B: Some Broad-Band Transformers

    1 in stock

    £67.45

  • Getting Started in Amateur Radio

    Radio Society of Great Britain Getting Started in Amateur Radio

    1 in stock

    Book Synopsis

    1 in stock

    £8.54

  • Claret Press Final Approach: My Father and Other Turbulence

    Out of stock

    Book SynopsisFinal Approach charts the turbulent flightpath between a jetsetting father and a planespotting son. The 1970s were the final gasp of the Golden Age of Flying. Mark Blackburn grew up amidst this fuel-guzzling splendour, with airports his playground of choice. He came to adulthood well-heeled and well-travelled. However, he had to contend with his multimillionaire father. Luxury cars. Private planes. Racing stables. Foreign Mistresses. Paranoia, bullying and power plays. At the centre was the inescapable pull of the father. Half memoir and half travelogue, wrapped in an ode to planespotting, this is one man’s journey to break free. It’s the trip of a lifetime. Take your seat and buckle up for take-off.Trade Review"Excellent - moving and engaging and really original - there is nothing like this." -- Lara Feigel, writer, reviewer and professor at Kings College London"Mark has a clear and clean, unfussy writing style - a very good idea for a book." -- Colin Grant, author of Negro with a Hat"Final Approach is a beautiful and tender work." -- Shaun Levin, A3 Press"A delightful blast from the past." -- Isabel Costello, The Literary Sofa

    Out of stock

    £999.99

  • Psychotronics and a Biodynamic Garden: How to

    Floris Books Psychotronics and a Biodynamic Garden: How to

    2 in stock

    Book SynopsisRadionics treatments have been recognised for their ability to rebalance the soil to produce quality crops and to treat pests and disease. Dowsing can enable gardeners to identify the best planting locations by considering the influence of the moon and underground water patterns. Together, these procedures can be combined with traditional biodynamic approaches to help boost the growth of crops and plants. Drawing on his decades of experience in sustainable and organic farming and gardening, George Kuepper describes practical methods for implementing these practices in this helpful and clear guidebook. With numerous illustrations, photographs, tables and examples this is a useful and practical resource for gardeners and farmers looking to improve the quality of their crops and plants.

    2 in stock

    £16.19

  • Springer Nature Switzerland AG Fundamentals of Music Processing: Using Python

    1 in stock

    Book SynopsisThe textbook provides both profound technological knowledge and a comprehensive treatment of essential topics in music processing and music information retrieval (MIR). Including numerous examples, figures, and exercises, this book is suited for students, lecturers, and researchers working in audio engineering, signal processing, computer science, digital humanities, and musicology.The book consists of eight chapters. The first two cover foundations of music representations and the Fourier transform—concepts used throughout the book. Each of the subsequent chapters starts with a general description of a concrete music processing task and then discusses—in a mathematically rigorous way—essential techniques and algorithms applicable to a wide range of analysis, classification, and retrieval problems. By mixing theory and practice, the book’s goal is to offer detailed technological insights and a deep understanding of music processing applications.As a substantial extension, the textbook’s second edition introduces the FMP (fundamentals of music processing) notebooks, which provide additional audio-visual material and Python code examples that implement all computational approaches step by step. Using Jupyter notebooks and open-source web applications, the FMP notebooks yield an interactive framework that allows students to experiment with their music examples, explore the effect of parameter settings, and understand the computed results by suitable visualizations and sonifications. The FMP notebooks are available from the author’s institutional web page at the International Audio Laboratories Erlangen.Table of Contents1. Music Representations.- 2. Fourier Analysis of Signals.- 3. Music Synchronization.- 4. Music Structure Analysis.- 5. Chord Recognition.- 6. Tempo and Beat Tracking.- 7. Content-Based Audio Retrieval.- 8. Musically Informed Audio Decomposition.

    1 in stock

    £61.74

  • The Science of Vehicle Dynamics: Handling,

    Springer International Publishing AG The Science of Vehicle Dynamics: Handling,

    1 in stock

    Book SynopsisThis textbook offers a comprehensive treatment of vehicle dynamics using an innovative, compelling approach, suitable for engineering students and professionals alike. Written by an authoritative contributor in the fields of applied mathematics and mechanics, it focuses on the development of vehicle models paying special attention to all the relevant assumptions, and providing explanations for each step. Some classical concepts of vehicle dynamics are revisited and reformulated, making this book also interesting for experienced readers. Using clear definitions, sound mathematics, and worked-out exercises, the book helps readers to truly understand the essence of vehicle dynamics for solving practical problems. With respect to the previous edition, which was the recipient of a 2019 TAA Textbook Excellence Award, this thoroughly revised third edition presents a more extensive and in-depth analysis of braking and handling of race cars.Table of ContentsIntroduction.- Mechanics of the Wheel with Tire.- Vehicle Model for Handling and Performance.- Braking Performance.

    1 in stock

    £67.49

  • Unmanned Aircraft Design

    Springer Unmanned Aircraft Design

    Out of stock

    Book SynopsisPreface.- Design Fundamentals.- Design Disciplines.- Fundamentals of Autopilot.- Control System Design.- Navigation System Design.- Guidance System Design.- Microcontroller.- Ground Control Station.- Launch and Recovery Systems.- Payloads Selection/Design.- Bibliography.- Author Biography.

    Out of stock

    £999.99

  • Wiley-VCH Verlag GmbH Composite Structures according to Eurocode 4: Worked Examples

    Out of stock

    a huge range and FREE tracked UK delivery on ALL orders.

    Out of stock

    £104.92

  • Wiley-VCH Verlag GmbH Bioreactors: Design, Operation and Novel

    Out of stock

    Book SynopsisIn this expert handbook both the topics and contributors are selected so as to provide an authoritative view of possible applications for this new technology. The result is an up-to-date survey of current challenges and opportunities in the design and operation of bioreactors for high-value products in the biomedical and chemical industries. Combining theory and practice, the authors explain such leading-edge technologies as single-use bioreactors, bioreactor simulators, and soft sensor monitoring, and discuss novel applications, such as stem cell production, process development, and multi-product reactors, using case studies from academia as well as from industry. A final section addresses the latest trends, including culture media design and systems biotechnology, which are expected to have an increasing impact on bioreactor design. With its focus on cutting-edge technologies and discussions of future developments, this handbook will remain an invaluable reference for many years to come.Table of ContentsPreface xv List of Contributors xvii 1 Challenges for Bioreactor Design and Operation 1 Carl-Fredrik Mandenius 1.1 Introduction 1 1.2 Biotechnology Milestones with Implications on Bioreactor Design 2 1.3 General Features of Bioreactor Design 8 1.4 Recent Trends in Designing and Operating Bioreactors 12 1.5 The Systems Biology Approach 17 1.6 Using Conceptual Design Methodology 20 1.7 An Outlook on Challenges for Bioreactor Design and Operation 29 References 32 2 Design and Operation of Microbioreactor Systems for Screening and Process Development 35 Clemens Lattermann and Jochen Büchs 2.1 Introduction 35 2.2 Key Engineering Parameters and Properties in Microbioreactor Design and Operation 36 2.2.1 Specific Power Input 37 2.2.2 Out-of-Phase Phenomena 40 2.2.3 Mixing in Microbioreactors 42 2.2.4 Gas–Liquid Mass Transfer 44 2.2.4.1 Influence of the Reactor Material 47 2.2.4.2 Influence of the Viscosity 49 2.2.5 Influence of Shear Rates 50 2.2.6 Ventilation in Shaken Microbioreactors 51 2.2.7 Hydromechanical Stress 52 2.3 Design of Novel Stirred and Bubble Aerated Microbioreactors 53 2.4 Robotics for Microbioreactors 54 2.5 Fed-Batch and Continuous Operation of Microbioreactors 56 2.5.1 Diffusion-Controlled Feeding of the Microbioreactor 56 2.5.2 Enzyme Controlled Feeding of the Microbioreactor 58 2.5.3 Feeding of Continuous Microbioreactors by Pumps 59 2.6 Monitoring and Control of Microbioreactors 60 2.6.1 DOT and pH Measurement 62 2.6.2 Respiratory Activity 63 2.7 Conclusion 66 Terms 67 Greek Letters 68 Dimensionless Numbers 69 List of Abbreviations 69 References 69 3 Bioreactors on a Chip 77 Danny van Noort 3.1 Introduction 77 3.2 Advantages of Microsystems 79 3.2.1 Concentration Gradients 81 3.3 Scaling Down the Bioreactor to the Microfluidic Format 82 3.4 Microfabrication Methods for Bioreactors-On-A-Chip 82 3.4.1 Etching of Silicon/Glass 83 3.4.2 Soft Lithography 83 3.4.3 Hot Embossing 84 3.4.4 Mechanical Fabrication Technique (Or Poor Man’s Microfluidics) 84 3.4.5 Laser Machining 85 3.4.6 Thin Metal Layers 86 3.5 Fabrication Materials 86 3.5.1 Inorganic Materials 86 3.5.2 Elastomers and Plastics 87 3.5.2.1 Elastomers 87 3.5.2.2 Thermosets 87 3.5.2.3 Thermoplastics 87 3.5.3 Hydrogels 88 3.5.4 Paper 88 3.6 Integrated Sensors for Key Bioreactor Parameters 89 3.6.1 Temperature 89 3.6.2 pH 90 3.6.3 O2 90 3.6.4 Co2 90 3.6.5 Cell Concentration (OD) 90 3.6.6 Humidity and Environment Stability 91 3.6.7 Oxygenation 91 3.7 Model Organisms Applied to BRoCs 91 3.8 Applications of Microfluidic Bioreactor Chip 92 3.8.1 A Chemostat BRoC 92 3.8.2 Using a BRoC as a Single-Cell Chemostat 95 3.8.3 Mammalian Cells in the Bioreactor on a Chip 96 3.8.4 Body-on-a-Chip Bioreactors 98 3.8.5 Organ-on-a-Chip Bioreactor-Like Applications 99 3.9 Scale Up 100 3.10 Conclusion 101 Abbreviations 102 References 103 4 Scalable Manufacture for Cell Therapy Needs 113 Qasim A. Rafiq, Thomas R.J. Heathman, Karen Coopman, Alvin W. Nienow, and Christopher J. Hewitt 4.1 Introduction 113 4.2 Requirements for Cell Therapy 115 4.2.1 Quality 115 4.2.2 Number of Cells Required 117 4.2.3 Anchorage-Dependent Cells 118 4.3 Stem Cell Types and Products 119 4.4 Paradigms in Cell Therapy Manufacture 120 4.4.1 Haplobank 121 4.4.2 Autologous Products 121 4.4.3 Allogeneic Products 123 4.5 Cell Therapy Manufacturing Platforms 124 4.5.1 Scale-Out Technology 125 4.5.2 Scale-Up Technology 127 4.6 Microcarriers and Stirred-Tank Bioreactors 128 4.6.1 Overview of Studies Using a Stirred-Tank Bioreactor and Microcarrier System 130 4.7 Future Trends for Microcarrier Culture 136 4.8 Preservation of Cell Therapy Products 138 4.9 Conclusions 139 References 140 5 Artificial Liver Bioreactor Design 147 Katrin Zeilinger and Jörg C. Gerlach 5.1 Need for Innovative Liver Therapies 147 5.2 Requirements to Liver Support Systems 147 5.3 Bioreactor Technologies Used in Clinical Trials 148 5.3.1 Artificial Liver Support Systems 148 5.3.2 Bioartificial Liver Support Systems 149 5.4 Optimization of Bioartificial Liver Bioreactor Designs 152 5.5 Improvement of Cell Biology in Bioartificial Livers 155 5.6 Bioreactors Enabling Cell Production for Transplantation 157 5.7 Cell Sources for Bioartificial Liver Bioreactors 158 5.7.1 Primary Liver Cells 158 5.7.2 Hepatic Cell Lines 161 5.7.3 Stem Cells 161 5.8 Outlook 163 References 164 6 Bioreactors for Expansion of Pluripotent Stem Cells and Their Differentiation to Cardiac Cells 175 Robert Zweigerdt, Birgit Andree, Christina Kropp, and Henning Kempf 6.1 Introduction 175 6.1.1 Requirement for Advanced Cell Therapies for Heart Repair 175 6.1.2 Pluripotent Stem Cell–Based Strategies for Heart Repair 176 6.2 Culture Technologies for Pluripotent Stem Cell Expansion 179 6.2.1 Matrix-Dependent Cultivation in 2D 179 6.2.2 Outscaling hPSC Production in 2D 179 6.2.3 Hydrogel-Supported Transition to 3D 182 6.3 3D Suspension Culture 182 6.3.1 Advantages of Using Instrumented Stirred Tank Bioreactors 182 6.3.2 Process Inoculation and Passaging Strategies: Cell Clumps Versus Single Cells 186 6.3.3 Microcarriers or Matrix-Free Suspension Culture: Pro and Contra 187 6.3.4 Optimization and Current Limitations of hPSC Processing in Stirred Bioreactors 188 6.4 Autologous Versus Allogeneic Cell Therapies: Practical and Economic Considerations for hPSC Processing 189 6.5 Upscaling hPSC Cardiomyogenic Differentiation in Bioreactors 190 6.6 Conclusion 192 List of Abbreviations 193 References 193 7 Culturing Entrapped Stem Cells in Continuous Bioreactors 201 Rui Tostoes and Paula M. Alves 7.1 Introduction 201 7.2 Materials Used in Stem Cell Entrapment 202 7.3 Synthetic Materials 203 7.3.1 Polymers 203 7.3.2 Peptides 207 7.3.3 Ceramic 208 7.4 Natural Materials 208 7.4.1 Proteins 208 7.4.2 Polysaccharides 209 7.4.3 Complex 211 7.5 Manufacturing and Regulatory Constraints 212 7.6 Mass Transfer in the Entrapment Material 214 7.7 Continuous Bioreactors for Entrapped Stem Cell Culture 216 7.8 Future Perspectives 220 References 221 8 Coping with Physiological Stress During Recombinant Protein Production by Bioreactor Design and Operation 227 Pau Ferrer and Francisco Valero 8.1 Major Physiological Stress Factors in Recombinant Protein Production Processes 227 8.1.1 Physiological Constraints Imposed by High-Cell-Density Cultivation Conditions 227 8.1.2 Metabolic and Physiologic Constraints Imposed by High-Level Expression of Recombinant Proteins 229 8.1.3 Physiological Constraints in Large-Scale Cultures 230 8.2 Monitoring Physiological Stress and Metabolic Load as a Tool for Bioprocess Design and Optimization 230 8.2.1 Monitoring of Physiological Responses to Recombinant Gene Expression Using Flow Cytometry 231 8.2.2 Monitoring of Reporter Metabolites 233 8.2.3 Omics Analytical Tools to Assess the Impact of Recombinant Protein Production on Cell Physiology 233 8.3 Design and Operation Strategies to Minimize/Overcome Problems Associated with Physiological Stress and Metabolic Load 241 8.3.1 Overcoming Overflow Metabolism and Substrate Toxicity 241 8.3.2 Improving the Energy and Building Block Supply 244 8.3.3 Expression Strategies and Recombinant Gene Transcriptional Tuning for Stress Minimization 245 8.4 Bioreactor Design Considerations to Minimize Shear Stress 246 Acknowledgments 247 References 248 9 Design, Applications, and Development of Single-Use Bioreactors 261 Nico M.G. Oosterhuis and Stefan Junne 9.1 Introduction 261 9.2 Design Challenges of Single-Use Bioreactors 263 9.2.1 Material Choice and Testing 263 9.2.2 Sterilization 267 9.2.3 Sensors and Sampling 267 9.2.4 Challenges for Scale-Up and Scale-Down of Single-Use Bioreactors 268 9.2.4.1 Scalability of Stirred Single-Use Bioreactors 270 9.2.4.2 Scalability of Orbital-Shaken Single-Use Bioreactors 273 9.2.4.3 Scalability of Wave-Mixed Single-Use Bioreactors 275 9.2.4.4 Recent Advances in the Description of the Mass Transfer in SUBs 276 9.3 Cell Culture Application 277 9.3.1 Wave-Mixed Bioreactors 277 9.3.2 Stirred Single-Use Bioreactors 278 9.3.3 Orbital-Shaken Single-Use Bioreactors 280 9.3.4 Mass Transfer Requirements for Cell Culture 280 9.3.5 Perfusion Processes in Single-Use Equipment 282 9.3.6 Plant, Phototrophic Algae and Hairy Root Cell Cultivation in Single-Use Bioreactors 284 9.4 Microbial Application of Single-Use Bioreactors 285 9.5 Outlook 288 List of Abbreviations 289 References 290 10 Computational Fluid Dynamics for Bioreactor Design 295 Anurag S. Rathore, Lalita Kanwar Shekhawat, and Varun Loomba 10.1 Introduction 295 10.2 Multiphase Flows 298 10.2.1 Eulerian–Lagrangian Approach 298 10.2.2 Euler–Euler Approach 303 10.2.3 Volume of Fluid Approach (VOF) 304 10.3 Turbulent Flow 305 10.3.1 Reynolds Stress Model 305 10.3.2 k–ε Model 306 10.3.3 Population Balance Model 306 10.4 CFD Simulations 308 10.4.1 Creation of Bioreactor Geometry 308 10.4.2 Meshing of Solution Domain 308 10.4.3 Solver 310 10.5 Case Studies for Application of CFD in Modeling of Bioreactors 310 10.5.1 CaseStudy1:UseofCFDasaToolforEstablishingProcessDesign Space for Mixing in a Bioreactor 311 10.5.2 Case Study 2: Prediction of Two-Phase Mass Transfer Coefficient in Stirred Vessel 313 10.5.3 Case Study 3: Numerical Modeling of Gas–Liquid Flow in Stirred Tanks 315 Summary 318 References 319 11 Scale-Up and Scale-Down Methodologies for Bioreactors 323 Peter Neubauer and Stefan Junne 11.1 Introduction 323 11.2 Bioprocess Scale-Down Approaches 324 11.2.1 A Historical View on the Development of Scale-Down Systems 324 11.2.1.1 Phase 1: Initial Studies of Mixing Behavior and Spatial Distribution Phenomena 325 11.2.1.2 Phase 2: Evolvement of Scale-Down Systems Based on Computational Fluid Dynamics 327 11.2.1.3 Phase 3: Recent Approaches Considering Hybrid Models 328 11.2.2 Scale-Up of Bioreactors 330 11.2.2.1 Dissolved Oxygen Concentration 331 11.2.2.2 Consideration of Similarities and Dimensionless Numbers 332 11.2.2.3 Shear Rate 333 11.2.2.4 Cell Physiology 333 11.2.3 Most Severe Challenges During Scale-Up 333 11.3 Characterization of the Large Scale 334 11.4 Computational Methods to Describe the Large Scale 337 11.5 Scale-Down Experiments and Physiological Responses 340 11.5.1 Scale-Down Experiments with Escherichia coli Cultures 340 11.5.2 Scale-Down Experiments with Corynebacterium glutamicum Cultures 343 11.5.3 Scale-Down Experiments with Bacillus subtilis Cultures 344 11.5.4 Scale-Down Experiments with Yeast Cultures 345 11.5.5 Scale-Down Experiments with Cell Line Cultures 346 11.6 Outlook 346 Nomenclature 347 References 347 12 Integration of Bioreactors with Downstream Steps 355 Ajoy Velayudhan and Nigel Titchener-Hooker 12.1 Introduction 355 12.2 Improvements in Cell-Culture 358 12.3 Interactions with Centrifugation Steps 359 12.4 Interactions with Filtration Steps 360 12.5 Interactions with Chromatographic Steps 361 12.6 Integrated Processes 364 12.7 Integrated Models 366 12.8 Conclusions 367 References 368 13 Multivariate Modeling for Bioreactor Monitoring and Control 369 Jarka Glassey 13.1 Introduction 369 13.2 Analytical Measurement Methods for Bioreactor Monitoring 370 13.2.1 Traditional Measurement Methods 371 13.2.2 Advanced Measurement Methods 372 13.2.2.1 Spectral Methods 372 13.2.2.2 Other Fingerprinting Methods 374 13.2.3 Data Characteristics and Challenges for Modeling 374 13.3 Multivariate Modeling Approaches 376 13.3.1 Feature Extraction and Classification 376 13.3.2 Regression Models 378 13.4 Case Studies 379 13.4.1 Feature Extraction Using PCA 379 13.4.2 Prediction of CQAs 383 13.5 Conclusions 386 Acknowledgments 387 References 387 14 Soft Sensor Design for Bioreactor Monitoring and Control 391 Carl-Fredrik Mandenius and Robert Gustavsson 14.1 Introduction 391 14.2 The Process Analytical Technology Perspective on Soft Sensors 392 14.3 Conceptual Design of Soft Sensors for Bioreactors 394 14.4 "Hardware Sensor" Alternatives 395 14.5 The Modeling Part of Soft Sensors 400 14.6 Strategy for Using Soft Sensors 402 14.7 Applications of Soft Sensors in Bioreactors 403 14.7.1 Online Fluorescence Spectrometry for Estimating Media Components in a Bioreactor 404 14.7.2 Temperature Sensors for Growth Rate Estimation of a Fed-Batch Bioreactor 405 14.7.3 Base Titration for Estimating the Growth Rate in a Batch Bioreactor 407 14.7.4 Online HPLC for the Estimation of Mixed-Acid Fermentation By-Products 409 14.7.5 Electronic Nose and NIR Spectroscopy for Controlling Cholera Toxin Production 411 14.8 Concluding Remarks and Outlook 413 References 414 15 Design-of-Experiments for Development and Optimization of Bioreactor Media 421 Carl-Fredrik Mandenius 15.1 Introduction 421 15.2 Fundamentals of Design-of-Experiments Methodology 422 15.2.1 Screening of Factors 423 15.2.2 Evaluation of the Experimental Design 425 15.2.3 Specific Design-of-Experiments Methods 429 15.3 Optimization of Culture Media by Design-of-Experiments 431 15.3.1 Media for Production of Metabolites and Proteins in Microbial Cultures 432 15.3.2 Media for the Production of Monoclonal Antibodies and Other Proteins in Mammalian Cell Cultures 438 15.3.3 Media for Differentiation and Production of Cells 441 15.3.4 Other Applications to Media Design 443 15.4 Conclusions and Outlook 447 References 448 16 Operator Training Simulators for Bioreactors 453 Volker C. Hass 16.1 Introduction 453 16.2 Simulators in the Process Industry 455 16.3 Training Simulators 456 16.3.1 Training Simulator Types 457 16.3.1.1 Simulators for "Standard" Processes 457 16.3.1.2 Company-Specific Simulators (Taylor-Made Simulators) 457 16.3.1.3 Process Automation and Control 458 16.3.1.4 Training Simulators in Academic Education 458 16.3.2 Training Simulator Purposes 459 16.3.2.1 Training of Process Handling 459 16.3.2.2 Training Simulators Supporting Engineering Tasks 461 16.4 Requirements on Training Simulators 461 16.4.1 Precise Simulation of the Chemical, Biological and Physical Events 462 16.4.2 Realistic Simulation of Automation and Control Actions 462 16.4.3 Real-Time and Accelerated Simulation 463 16.4.4 Realistic User Interfaces 463 16.4.5 Multipurpose Usage 463 16.4.6 Maintainability for User-Friendly Model Updates 464 16.4.7 Adaptability to Modified or Different Processes 464 16.5 Architecture of Training Simulators 464 16.6 Tools and Development Strategies 466 16.7 Process Models and Simulation Technology 468 16.7.1 Process Models 468 16.7.2 Modeling Strategy 471 16.7.3 Software Systems for Model Development 473 16.7.4 Multiple Use of Models 473 16.8 Training Simulator Examples 474 16.8.1 Bioreactor Training Simulator 474 16.8.2 Anaerobic Digestion Training Simulator 477 16.8.3 Bioethanol Plant Simulator 479 16.9 Concluding Remarks 482 References 484 Index 487

    Out of stock

    £999.99

  • Wiley-VCH Verlag GmbH Synthesis of Inorganic Materials

    Out of stock

    Book SynopsisIntroduces readers to the field of inorganic materials, while emphasizing synthesis and modification techniques Written from the chemist's point of view, this newly updated and completely revised fourth edition of Synthesis of Inorganic Materials provides a thorough and pedagogical introduction to the exciting and fast developing field of inorganic materials and features all of the latest developments. New to this edition is a chapter on self-assembly and self-organization, as well as all-new content on: demixing of glasses, non-classical crystallization, precursor chemistry, citrate-gel and Pechini liquid mix methods, ice-templating, and materials with hierarchical porosity. Synthesis of Inorganic Materials, 4th Edition features chapters covering: solid-state reactions; formation of solids from the gas phase; formation of solids from solutions and melts; preparation and modification of inorganic polymers; self-assembly and self-organization; templated materials; and nanostructured materials. There is also an extensive glossary to help bridge the gap between chemistry, solid state physics and materials science. In addition, a selection of books and review articles is provided at the end of each chapter as a starting point for more in-depth reading. -Gives the students a thorough overview of the fundamentals and the wide variety of different inorganic materials with applications in research as well as in industry -Every chapter is updated with new content -Includes a completely new chapter covering self-assembly and self-organization -Written by well-known and experienced authors who follow an intuitive and pedagogical approach Synthesis of Inorganic Materials, 4th Edition is a valuable resource for advanced undergraduate students as well as masters and graduate students of inorganic chemistry and materials science. Table of ContentsPreface ix Acknowledgements xi Abbreviations xv 1 Introduction 1 2 Solid-State Reactions 5 2.1 Reactions Between Solid Compounds 5 2.1.1 Ceramic Method 5 2.1.1.1 General Aspects of Solid-State Reactions 8 2.1.1.2 Facilitating Solid-State Reactions 12 2.1.2 Mechanochemical Synthesis 16 2.1.3 Carbothermal Reduction 17 2.1.4 Combustion Synthesis 22 2.1.4.1 Solution Combustion Synthesis 29 2.2 Solid–Gas Reactions 31 2.3 Ceramics Processing 34 2.3.1 Sintering 38 2.4 Intercalation Reactions 41 2.4.1 Mechanistic Aspects 47 2.4.2 Preparative Methods 49 2.4.3 Intercalation of Polymers in Layered Systems 51 2.4.4 Pillaring of Layered Compounds 52 Further Reading 55 3 Formation of Solids from the Gas Phase 57 3.1 Chemical Vapour Transport 57 3.1.1 Halogen Lamps 59 3.1.2 Transport Reactions 63 3.2 Chemical Vapour Deposition 65 3.2.1 General Aspects 65 3.2.2 Techniques 73 3.2.3 Metal CVD 78 3.2.3.1 Silicon and Aluminium 79 3.2.3.2 Tungsten 82 3.2.3.3 Copper 83 3.2.4 CVD of Carbon 86 3.2.5 CVD of Binary and Multinary Compounds 89 3.2.5.1 Metal Oxides 90 3.2.5.2 Metal Nitrides 92 3.2.5.3 Metal Chalcogenides and Pnictides 95 3.2.6 Aerosol-Assisted CVD 97 3.2.7 Chemical Vapour Infiltration 99 3.3 Gas-Phase Powder Syntheses 101 Further Reading 110 4 Formation of Solids from Solutions and Melts 113 4.1 Glass 113 4.1.1 The Structural Theory of Glass Formation 115 4.1.2 Crystallization Versus Glass Formation 118 4.1.3 Glass Melting 123 4.1.4 Phase Separation 127 4.1.5 Metallic Glasses 128 4.2 Crystallization from Solution 132 4.2.1 Monodispersity 133 4.2.2 Shape Control of Crystals 135 4.2.3 Non-classical Crystallization 137 4.2.4 Biomineralization 140 4.2.4.1 Biogenic Materials 140 4.2.4.2 Biomineralization 146 4.2.4.3 Bioinspired Materials Chemistry 151 4.3 Electrodeposition 156 4.3.1 Colloids 156 4.3.2 Electrodeposition of Ceramics 159 4.4 Solvothermal Processes 161 4.4.1 Fundamentals 161 4.4.2 Growing Single Crystals 165 4.4.3 Solvothermal Synthesis 168 4.4.3.1 Metal Oxides 169 4.4.3.2 Synthetic Calcium Phosphate Biomaterials 171 4.4.3.3 Zeolites 172 4.5 Sol–Gel Processes 177 4.5.1 The Chemistry of Alkoxide Precursors 181 4.5.2 Hydrolysis and Condensation 185 4.5.2.1 Silica-Based Materials 186 4.5.2.2 Metal Oxide-Based Materials 192 4.5.3 The Sol–Gel Transition (Gelation) 195 4.5.4 Aging and Drying 201 4.5.5 Nonhydrolytic Sol–Gel Processes 203 4.5.6 Inorganic–Organic Hybrid Materials 204 4.5.7 Aerogels 208 Further Reading 214 5 Preparation and Modification of Inorganic Polymers 217 5.1 General Aspects 218 5.1.1 Synthesis and Crosslinking 219 5.1.2 Copolymers 221 5.2 Polysiloxanes (Silicones) 222 5.2.1 Properties and Applications 222 5.2.2 Structure 226 5.2.3 Preparation 227 5.2.4 Curing (‘Vulcanizing’) 231 5.3 Polyphosphazenes 233 5.3.1 Properties and Applications 233 5.3.2 Preparation and Modification 236 5.4 Polysilanes 239 5.4.1 Properties and Applications 239 5.4.2 Preparation 242 5.5 Polycarbosilanes 245 5.6 Polysilazanes and Related Polymers 249 5.7 Polymers with B–N Backbones 252 5.8 Other Inorganic Polymers 253 5.8.1 Other Phosphorus-Containing Polymers 254 5.8.2 Polymers with S–N Backbones 255 5.8.3 Metallopolymers 255 5.9 Polymer-to-Ceramic Transformation 258 Further Reading 264 6 Self-Assembly 267 6.1 Self-Assembled Monolayers 268 6.2 Metal–Organic Frameworks 271 6.2.1 Modularity of the Structures 271 6.2.2 Synthesis and Modification 276 6.3 Supramolecular Arrangements of Surfactants and Block Copolymers 279 6.4 Layer-by-Layer Assembly 282 Further Reading 285 7 Templating 287 7.1 Introduction to Porosity and High Surface Area Materials 289 7.2 Infiltration and Coating of Templates 292 7.2.1 Replica Technique 293 7.2.2 Sacrificial Templates 295 7.2.2.1 Colloidal Crystals 296 7.2.2.2 Hollow Particles 298 7.2.3 Direct Foaming 300 7.2.4 Nanocasting 302 7.3 In Situ Formation of Templates 305 7.3.1 Breath Figures 305 7.3.2 Freeze Casting 306 7.3.3 Supramolecular Assemblies of Amphiphiles 307 7.3.3.1 Synthesis of Periodic Mesoporous Silicas 310 7.3.3.2 Evaporation-Induced Self-Assembly 314 7.3.3.3 Incorporation of Organic Groups 315 7.4 Reorganization and Transformation Processes 317 7.4.1 Pseudomorphic Transformation 317 7.4.2 Kirkendall Effect 319 7.4.3 Galvanic Replacement 320 7.4.4 Phase Separation and Leaching 321 Further Reading 325 8 Nanomaterials 327 8.1 Properties of Nanomaterials 329 8.1.1 Properties Due to Surface Effects 329 8.1.2 Properties of Nanocrystalline Materials 331 8.1.3 Catalytic Properties 332 8.1.4 Optical Properties 333 8.1.5 Electrical Properties 336 8.1.6 Magnetic Properties 337 8.2 Syntheses of Nanoparticles 339 8.2.1 Severe Plastic Deformation 340 8.2.2 Formation from Vapours 341 8.2.3 Formation from Solution 343 8.2.4 Surface Modification with Organic Groups 348 8.3 One-Dimensional Nanostructures 352 8.3.1 Nanowires and Nanorods 352 8.3.2 Nanotubes 357 8.3.2.1 Carbon Nanotubes 357 8.3.2.2 Titania Nanotubes 362 8.4 Two-Dimensional Nanomaterials 365 8.4.1 Graphene 365 8.4.2 Other 2D Nanomaterials 369 8.5 Heterostructures and Composites 370 8.5.1 Core–Shell Nanoparticles 370 8.5.2 Vertical 2D Heterostructures 373 8.5.3 Polymer–Matrix Nanocomposites 374 8.5.4 Supported Metal Nanoparticles 376 Further Reading 378 Glossary 381 Index 389

    Out of stock

    £999.99

  • Alphascript Publishing Dodge Charger BBody

    Out of stock

    Book Synopsis

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    £999.99

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  • Smart Water Utilities: Complexity Made Simple

    IWA Publishing Smart Water Utilities: Complexity Made Simple

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    Book SynopsisToday there is increasing pressure on the water infrastructure and although unsustainable water extraction and wastewater handling can continue for a while, at some point water needs to be managed in a way that is sustainable in the long-term. We need to handle water utilities “smarter”. New and effective tools and technologies are becoming available at an affordable cost and these technologies are steadily changing water infrastructure options. The quality and robustness of sensors are increasing rapidly and their reliability makes the automatic handling of critical processes viable. Online and real-time control means safer and more effective operation. The combination of better sensors and new water treatment technologies is a strong enabler for decentralised and diversified water treatment. Plants can be run with a minimum of personnel attendance. In the future, thousands of sensors in the water utility cycle will handle all the complexity in an effective way. Smart Water Utilities: Complexity Made Simple provides a framework for Smart Water Utilities based on an M-A-D (Measurement-Analysis-Decision). This enables the organisation and implementation of “Smart” in a water utility by providing an overview of supporting technologies and methods. The book presents an introduction to methods and tools, providing a perspective of what can and could be achieved. It provides a toolbox for all water challenges and is essential reading for the Water Utility Manager, Engineer and Director and for Consultants, Designers and Researchers.

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  • Elsevier Science & Technology Advances in Composites Manufacturing and Process

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    Book SynopsisThe manufacturing processes of composite materials are numerous and often complex. Continuous research into the subject area has made it hugely relevant with new advances enriching our understanding and helping us overcome design and manufacturing challenges. Advances in Composites Manufacturing and Process Design provides comprehensive coverage of all processing techniques in the field with a strong emphasis on recent advances, modeling and simulation of the design process. Part One reviews the advances in composite manufacturing processes and includes detailed coverage of braiding, knitting, weaving, fibre placement, draping, machining and drilling, and 3D composite processes. There are also highly informative chapters on thermoplastic and ceramic composite manufacturing processes, and repairing composites. The mechanical behaviour of reinforcements and the numerical simulation of composite manufacturing processes are examined in Part Two. Chapters examine the properties and behaviour of textile reinforcements and resins. The final chapters of the book investigate finite element analysis of composite forming, numerical simulation of flow processes, pultrusion processes and modeling of chemical vapour infiltration processes.Table of ContentsPreface Part One: Advances in composite manufacturing processes 1 Braiding processes for composites manufacture 2 Knitting processes for composites manufacture 3 Weaving processes for composites manufacture 4 Fibre placement processes for composites manufacture 5 Draping processes for composites manufacture 6 Thermoplastic composites manufacturing by thermoforming 7 Three-dimensional composite manufacturing processes 8 Chemical vapour deposition/infiltration processes for ceramic composites 9 Machining and drilling processes in composites manufacture: damage and material integrity 10 Repairing composites Part Two: Mechanical behaviour of reinforcements and numerical simulation of processes in composites manufacturing 11 Mechanical properties of textile reinforcements for composites 12 Mechanical behaviour of non crimp fabric (NCF) preforms in composite materials manufacturing 13 Epoxy/amine reactive systems for composites materials and their thermo-mechanical properties 14 Finite element analysis of composite forming at macroscopic and mesoscopic scale 15 Numerical simulation of flow processes in composites manufacturing 16 Pultrusion processes for composite manufacture 17 Modeling of chemical vapour infiltration (CVI) processes

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  • Royal Society of Chemistry Soft Matter Approaches to Structured Foods:

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    Book SynopsisFood materials are unusual as soft matter. They are highly complex, operating on multiple length scales and phases and structured via multiple externally applied fields. A growing number of scientists are applying a soft matter physics approach to food science. This Faraday Discussion on Soft Matter Approaches to Structured Food will introduce and strengthen the concept of the soft matter approach to food scientists, and bring food scientists together with non-food experts (both experimental and theoretical) from the field of soft matter physics. The Discussion will allow for the exchange of views on state-of-the-art approaches like soft-glass rheology, multiscale/mesoscale simulation techniques, theories on slow dynamics, and driven soft matter systems. The Discussion will be held in the city of Wageningen in the Netherlands - one of the prime centres for food science in Europe. The Scientific Committee warmly invites you to take part in the Discussion and looks forward to welcoming you in Wageningen.Table of ContentsIntroductory Lecture: Soft matter approaches to structured foods: from ‘‘cook-and-look’’ to rational food design?; Designing colloidal structures for micro and macro nutrient content and release in foods; Protein cluster formation during enzymatic cross-linking of globular proteins; Anomalies in moisture transport during broccoli drying monitored by MRI?; Structural changes of deposited casein micelles induced by membrane filtration; Model for particle migration in bidisperse suspensions by use of effective temperature; General discussion; Stability of aqueous food grade fibrillar systems against pH change; Quinoa starch granules as stabilizing particles for production of Pickering emulsions; Soy milk oleosome behaviour at the air–water interface; Critical laminar shear-temperature effects on the nano- and mesoscale structure of a model fat and its relationship to oil binding and rheological properties; Surface shear rheology of hydrophobin adsorption layers: laws of viscoelastic behaviour with applications to long-term foam stability; Elucidation of density profile of self-assembled sitosterol + oryzanol tubules with small-angle neutron scattering; General Discussion; New Routes to food gels and glasses; Protein structure and interactions in the solid state studied by small-angle neutron scattering; The role of quench rate in colloidal gels; Delayed solidifcationof soft glasses: new experiments, and a theoretical challenge; Slow dynamics and structure in jammed milk protein suspensions; Arrested coalescence of viscoelastic droplets with internal microsctructure; General discussion; Viscoelastic phase seperation in soft matter and foods; Kinetic model for the mechanical response of suspensions of sponge-like particles; Nanoscale characteristics of triacylglycerol oils: phase separation and binding energies of two-component oils to crystalline nanoplatelets; Soft matter approaches as enablers for food macroscale simulation; Numerical study of the effect of thiol-disulfide exchange in the cluster phase of beta-lactoglobulin aggregation; A multiscale approach to triglycerides simulations: from atomistic to coarse-grained models and back; General discussion; Concluidng remarks: the future of soft matter and food strucure; Additional information; Poster titles; List of Participants; Index of contributors

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  • Artificial Intelligence in Practice

    Springer Artificial Intelligence in Practice

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    Book SynopsisIntroduction.- Part I Foundations of AI: Concepts and Frameworks for Cybersecurity and Digital Forensics.- The Evolution of Artificial Intelligence and Machine Learning.- Technical Foundations of Cybersecurity.- Digital Forensics: Tools, Techniques, and Methodologies.- Integrating AI/ML with Cybersecurity and Digital Forensics.- Part II AI in Action: Real-World Strategies for Cybersecurity and Digital Forensics.- AI and ML Frontier Technologies for Digital Forensic Applications.- Enhancing Cyber Security with Machine Learning.- Future of AI-Driven Digital Forensic.- Conclusion.

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  • Springer Interface Ionics

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    Book SynopsisIntroduction.- Overview of Interface Ionics project.- Model Interface.- Preparation of a standard model battery and electrode solid electrolyte interface.- Thin film battery with epitaxial LiCoO2 cathode.- Insertion and extraction mechanism at epitaxial graphene.

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  • Orthographic Projection Simplified Student Text

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  • The StripBuilt Sea Kayak Three Rugged Beautiful

    McGraw-Hill Education - Europe The StripBuilt Sea Kayak Three Rugged Beautiful

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    Book SynopsisAlthough books on strip building canoes abound, this is among the first to adapt the technique to crafting attractive, functional kayaks. Using high-quality, computer-generated illustrations and photographs to explain key techniques, the book provides complete plans and measurements for three different kayaks: 1) A simple solo craft for beginners, 2) A high-performance solo kayak for intermediate paddlers, and 3) A tandem design for two paddlers. With its easy-to-follow guidance and instructions, The Strip-Built Sea Kayak makes top-notch kayaks accessible to budget-minded paddlers.Trade Review"Nick Schade has managed to raise the craft of strip building to the art of graphic design in wood" Sea KayakerTable of ContentsAcknowledgmentsIntroductionPart I The Background1 Why Build A Kayak?Why Use Wood?Why Use Strips?2 How Design Affects PerformanceStabilityThe Importance of SpeedManeuverability and TrackingVolume, or Interior SizeChoosing the Right BoatSome Proven Designs3 Tools and MaterialsToolsMaterials4 LoftingOffsets for the Hull FormsOffsets for the End FormsDrawing the PatternsMaking Small ChangesPart II The Building Process5 Getting StartedWhere to BuildCutting the StripsCutting FormsThe StrongbackAligning Forms6 Building the Hull & DeckStripping the HullStripping the DeckFinishing the EndsFairing7 Fiberglassing and FinishingFiberglassingThe Coaming UpMaking the HatchesInstalling Cheek PlatesJoining Hull and DeckUsing a SheerclampFinishing Off8 Artistic CreationPatterns from StripsDotted LinesDressing Up the SurfacePart III After It's Done9 Fitting OutThe SeatFootbracesKnee and Thigh BracesBulkheadsDeck LinesHatch GasketsGrab-LoopsRudders10 And a Paddle to MatchMaking the ShaftMaking the BladesRounding the ShaftFiberglassing the PaddleVariations on a ThemeTools for PaddlesMaterials for Paddles11 Maintenance and RepairsYearly Wear and TearBad ScratchesDealing with BruisesPatching HolesPart IV AppendicesA-1 Materials ListA-2 Material & Tool SourcesWoodGlass and ResinOutfitting and ToolsBooksA-3 Sources of PlansA-4 Custom DesigningDesigning Your Own BoatStealing DesignsModifying a DesignMoving the CockpitLast WarningA-5 English and Metric Conversion FactorsA-6 SafetyDangers in the ShopOn the WaterA-7 GlossaryA-8 BibliographyIndex

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  • TimeSaver Standards for Interior Design and Space

    McGraw-Hill Education - Europe TimeSaver Standards for Interior Design and Space

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    Book SynopsisPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.The "Silver Bible" -- thoroughly revised, updated and redesignedInterior designers, architects, and other design professionals can still turn to the fieldâs beloved "Silver Bible" for a wealth of information related to the design and planning of residential and commercial interiors. But now, Time-Saver Standards for Interior Design and Space Planning, Second Edition goes even further to truly make the classic interior design reference the standard in its field.From standard furniture dimensions to architectural woodwork details, youâll find a vast array of time-saving data and details. Editors Joseph DeChiara, Julius Panero, and Martin Zelnik have brought together contributions from well-known architectural and interior design firms to give yoTable of ContentsChapter 1: Planning and Design of Interior Spaces. Chapter 2: Construction Details and Finishes. Chapter 3: Architectural Woodwork. Chapter 4: Specialties. Chapter 5: Accessible Design/ADA. Chapter 6: General Reference Data.

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  • Roofing Instant Answers

    McGraw-Hill Education Roofing Instant Answers

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    Book SynopsisPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A highly portable (5 x 8â) quick tab reference system brimming with all of the graphics and readily understood tables needed for fast, on-the-job references. The author includes a mix of text and graphics in a way that will empower readers to solve problems quickly, effectively, and economically.Table of ContentsAcknowledgments About the Author Chapter 1: Before the Job Starts Chapter 2: Job Mobilization Chapter 3: Safety Means Success Chapter 4: Maintenance, Callbacks amd Ancillary Business Chapter 5: Built-Up Roofing Chapter 6: Single-Ply Roofs Chapter 7: Asphalt Roofs Chapter 8: Wood Shingles Chapter 9: Slate Roofs Chapter 10: Clay and Concrete Tiles Chapter 11: Metal Roofs Chapter 12: Reroofing Chapter 13: Resources Index

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  • TimeSaver Standards for Architectural Design

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    7 in stock

    Book SynopsisPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.BUILDING A NEW TRADITION Bundled CD-ROM with additional, still-current chapters from the Seventh Edition More graphic illustrations, figures, tables and summaries Latest on building envelope design and diagnostics Updated data on universaTable of ContentsPrefaceAbout the EditorsIntroductionPart A. Substructure: Foundations and Basement ConstructionPart B. Shell: Superstructure, Exterior Closure, RoofingPart C. Interiors: Interior Constructions, Staircases, DimensionsPart D. Services: Conveying Systems, Plumbing, HVAC systems, Fire Protection, Electrical systemsPart E. AppendicesCD-ROM table of contentsIndex

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  • Troubleshooting and Repairing Major Appliances

    McGraw-Hill Education - Europe Troubleshooting and Repairing Major Appliances

    5 in stock

    Book SynopsisPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Diagnose and repair home appliances and air conditioners using the latest techniques"The book has it all...written by a pro with 40 years of hands-on repair and teaching experience...this book is like brain candy"--GeekDad (Wired.com)Fully updated for current technologies and packed withhundreds of photos and diagrams, this do-it-yourself guideshows you how to safely install, operate, maintain, and fixgas and electric appliances of all types. Troubleshooting and Repairing Major Appliances, Third Edition provides easy-tofollow procedures for using test meters, replacing parts, reading circuit diagrams, interpreting fault and error codes, and diagnosing problems. Featuring a new chapter on becoming a service technician, this practical, money-saving resource isTable of ContentsPart I: Fundamentals of Service1 Selecting, Purchasing, and Installing Major Home Appliances and Air Conditioners 2 Safety Precautions3 Tools Needed for Installation and Repair 4. Becoming a Professional Technician5 Basic Techniques Part II: Electricity, Electronics and Gas 6 Electricity7 Electronics 8 Gas Part III: Refrigeration and Air Conditioning 9 Principles of Air Conditioning and Refrigeration Part IV: Parts10 Electric Appliance and Air Conditioner Parts11 Electronic Parts12 Gas Appliance Parts Part V: Fault and Error Codes13 Fault Codes Part VI: Appliance Service, Installation, and Preventive Maintenance Procedures 14 Automatic Dishwashers 15 Garbage Disposers 16 Electric Water Heaters 17 Gas Water Heaters 18 Top Load Automatic Washers 19 Front Load Automatic Washers 20 Automatic Electric Dryers 21 Automatic Gas Dryers 22 Electric Ranges, Cooktops and Ovens 23 Gas Ranges, Cooktops and Ovens 24 Microwave Ovens 25 Refrigerators 26 Freezers 27 Automatic Ice Makers 28 Residential Under the counter Ice Makers 29 Room Air Conditioners 30 Dehumidifiers Glossary

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  • Printed Circuits Handbook Seventh Edition

    McGraw-Hill Education - Europe Printed Circuits Handbook Seventh Edition

    5 in stock

    Book SynopsisPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The Most Complete and Widely Used Guide to Printed Circuits, Now Updated and Thoroughly RevisedThe Printed Circuits Handbook has served as the definitive source for coverage of every facet of printed circuit boards and assemblies for 50 years. And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality anTable of ContentsPart 1: Printed Circuit Technology DriversChapter 1. Electronic Packaging and High-Density Interconnectivity Clyde F. Coombs, Jr., and Happy T. Holden 3 1.1 Introduction / 3 1.2 Measuring the Interconnectivity Revolution / 3 1.3 Hierarchy of Interconnections / 6 1.4 Factors Affecting Selection of Interconnections / 7 1.5 ICs and Packages / 9 1.6 Density Evaluations / 10 1.7 Methods to Increase PWB Density / 13 1.8 References / 18Chapter 2. Types of Printed Wiring Boards Hayao Nakahara 19 2.1 Introduction / 19 2.2 Classification of Printed Wiring Boards / 19 2.3 Organic and Nonorganic Substrates / 21 2.4 Graphical and Discrete-Wire Boards / 21 2.5 Rigid and Flexible Boards / 22 2.6 Graphically Produced Boards / 22 2.7 Molded Interconnection Devices / 27 2.8 Plated-Through-Hole Technologies / 27 2.9 Summary / 30 2.10 References / 30Part 2: Managing the Printed Circuit Supply ChainChapter 3. Basics of Printed Circuit Supply Chain Management Tim Rodgers 33 3.1 Introduction / 33 3.2 General Business Considerations / 34 3.3 Contract Manufacturers / 35 3.4 Criteria for Evaluating Suppliers / 35 3.5 Supplier Selection Criteria Example / 41 Chapter 4. Design for Manufacturability Tim Rodgers 43 4.1 General Principles / 43 4.2 PCB/PCA Pricing Models / 44 4.3 Process Cost Drivers / 49 4.4 Production Yield and Design for Manufacturability / 51 4.5 DFM Complexity Models / 59Chapter 5. Manufacturing Information, Documentation, Formatting, and Exchange Happy T. Holden 63 5.1 Introduction / 63 5.2 Manufacturing Information / 64 5.3 Fabrication Information Exchange / 68 5.4 Data Exchange Formats / 73 5.5 Initial Design Review / 86 5.6 Design Input / 94 5.7 Design Analysis and Review / 99 5.8 Acknowledgments / 99 5.9 References / 100 Chapter 6. Supplier Selection and Qualification Tim Rodgers 101 6.1 Introduction / 101 6.2 Evaluating Suppliers / 102 6.3 Supplier Selection / 113 6.4 Supplier Qualification / 114 Chapter 7. Process Control, Monitoring, and Incoming Inspection Tim Rodgers 117 7.1 Introduction / 117 7.2 Process Capability and Process Control / 117 7.3 Process Monitoring and Troubleshooting / 122 7.4 Assessing a PCB Fabricators Capability / 122 7.5 Testing and Inspection / 156 7.6 Incoming Inspection / 158 Chapter 8. Product Acceptance and Feedback Tim Rodgers 159 8.1 Introduction / 159 8.2 Design Qualification / 159 8.3 Incoming Inspection and Lot Acceptance / 160 8.4 Supplier Performance Management / 162 8.5 Business Reviews / 165 8.6 Strategic Supplier Management / 167 Part 3: MaterialsChapter 9. Introduction to Base Materials Edward Kelley and Douglas Trobough 171 9.1 Introduction / 171 9.2 Grades and Specifications / 171 9.3 Properties Used to Classify Base Materials / 178 9.4 Types of FR-4 / 184 9.5 Laminate Identification Scheme / 185 9.6 Prepreg Identification Scheme / 186 9.7 Laminate and Prepreg Manufacturing Processes / 189 9.8 References / 195 Chapter 10. Base Material Components Edward Kelley and Douglas Trobough 197 10.1 Introduction / 197 10.2 Other Resin Systems / 201 10.3 Legislative Issues / 203 10.4 Additives / 207 10.5 Reinforcements / 209 10.6 Conductive Materials / 217 10.7 References / 224 Chapter 11. Properties of Base Materials Edward Kelley and Douglas Trobough 225 11.1 Introduction / 225 11.2 Thermal, Physical, and Mechanical Properties / 225 11.3 Electrical Properties / 236 11.4 Other Test Methods / 240 11.5 References / 240 Chapter 12. Base Material Performance in PCBs Edward Kelley and Douglas Trobough 241 12.1 Introduction / 241 12.2 Methods of Increasing Circuit Density / 241 12.3 Copper Foil / 242 12.4 Laminate Constructions / 247 12.5 Prepreg Options and Yield-per-Ply Values / 248 12.6 Dimensional Stability / 249 12.7 High-Density Interconnect/Microvia Materials / 250 12.8 Conductive Anodic Filament Growth / 252 12.9 Electrical Performance / 258 12.10 Electrical Performance of Lower Dk/Df Lead-Free Compatible Materials / 268 12.11 Resin and Glass Micro-Dk Effects / 268 12.12 References / 272 Chapter 13. The Impact of Lead-Free Assembly on Base Materials Edward Kelley and Douglas Trobough 273 13.1 Introduction / 273 13.2 RoHS Basics / 273 13.3 Base Material Compatibility Issues / 274 13.4 The Impact of Lead-Free Assembly on Base Material Components / 276 13.5 Critical Base Material Properties / 276 13.6 Impact on Printed Circuit Reliability and Material Selection / 288 13.7 Summary / 292 13.8 Further Reading / 292 Chapter 14. Selecting Base Materials Edward Kelley and Douglas Trobough 293 14.1 Introduction / 293 14.2 Selecting Materials for Thermal Reliability / 293 14.3 Selecting a Base Material for Thermal Reliability / 298 14.4 Selecting Materials for Electrical Performance / 304 14.5 CAF Resistance / 309 14.6 References / 315Chapter 15. Laminate Qualification and Testing Michael Roesch and Sylvia Ehrler 317 15.1 Introduction / 317 15.2 Industry Standards / 318 15.3 Laminate Test Strategy / 319 15.4 Initial Tests / 321 15.5 Full Material Characterization / 324 15.6 Characterization Test Plan / 335 15.7 Manufacturability in the Shop / 337Part 4: Engineering and DesignChapter 16. Planning for Design, Fabrication, and Assembly Happy T. Holden 341 16.1 Introduction / 341 16.2 General Considerations / 342 16.3 New Product Design / 343 16.4 Specification: Capture of System Description / 346 16.5 Layout Trade-Off Planning / 349 16.6 PWB Fabrication Trade-Off Planning / 355 16.7 Assembly Trade-Off Planning / 362 16.8 References / 364Chapter 17. Physical Characteristics of the PCB Lee W. Ritchey 365 17.1 Introduction / 365 17.2 Types of PCBs or Substrates / 366 17.3 Methods of Attaching Components / 369 17.4 Component Package Types / 369 17.5 Materials Choices / 371 17.6 Fabrication Methods / 372Chapter 18. Electronic Design Automation and Printed Circuit Design Tools Andy Shaughnessy 373 18.1 Description of PCB Design Tools / 373 18.2 Using PCB Design Tools / 374 18.3 Major PCB Design Tools / 376 18.4 Lower-Cost PCB Design Tools / 378 18.5 Free PCB Design Tools / 379 18.6 Signal Integrity and EMC Tools / 381 18.7 Key Questions to Consider / 383 18.8 Further Reading / 383Chapter 19. The PCB Design Process Lee W. Ritchey 385 19.1 Introduction / 385 19.2 The Virtual Prototyping Process / 387 19.3 Making the Conversion from Hardware Prototyping to Virtual Prototyping / 394 Chapter 20. Electrical and Mechanical Design Parameters Bill Hargin and Mark I. Montrose 395 20.1 Electrical and Mechanical Design Parameters Overview / 395 20.2 Introduction to Digital Signal Integrity / 396 20.3 Which Nets to Terminate and What Type of Termination to Use / 406 20.4 Introduction to Differential Signaling / 415 20.5 Introduction to Power Integrity / 419 20.6 Introduction to Electromagnetic Compatibility / 426 20.7 Introduction to Mechanical Design Requirements / 434 20.8 Types of Edge Mounting for Circuit Boards / 438 20.9 Acknowledgments / 441 20.10 References / 441Chapter 21. The Basics of Printed Circuit Board Design Susy Webb 443 21.1 Software Selection / 443 21.2 Standards / 443 21.3 The Schematic / 445 21.4 Parts / 446 21.5 Padstacks / 448 21.6 Starting a New Board / 449 21.7 Placement / 453 21.8 Planes / 456 21.9 Stackup / 457 21.10 Routing / 458 21.11 Finishing / 464 21.12 Saving / 466 21.13 Conclusion / 466Chapter 22. Current Carrying Capacity in Printed Circuits Mike Jouppi 469 22.1 Introduction / 469 22.2 Conductor (Trace) Sizing Charts / 470 22.3 Baseline Charts / 473 22.4 Summary / 480 22.5 References / 480Chapter 23. PCB Design for Thermal Performance Mike Jouppi 481 23.1 Introduction / 481 23.2 The PCB as a Heat Sink Soldered to the Component / 482 23.3 Optimizing the PCB for Thermal Performance / 482 23.4 Conducting Heat to the Chassis / 490 23.5 PCB Requirements for High-Power Heat Sink Attach / 492 23.6 Modeling the Thermal Performance of the PCB / 493 23.7 Heat Sources / 496 23.8 Acknowledgment / 497 23.9 References / 497Chapter 24. Embedded Components Vern Solberg 499 24.1 Introduction / 499 24.2 Definitions and Example / 499 24.3 Applications and Trade-Offs / 500 24.4 Designing for Embedded Component Applications / 50124.5 Materials / 505 24.6 Material Supply Types / 509 24.7 Conclusion / 515 24.8 Acknowledgment / 515Part: 5 High-Density InterconnectionChapter 25. Introduction to High-Density Interconnection Technology Happy T. Holden 519 25.1 Introduction / 519 25.2 Definit ions / 519 25.3 HDI Structures / 523 25.4 Design / 527 25.5 Dielectric Materials and Coating Methods / 529 25.6 HDI Manufacturing Processes / 541 25.7 Appendix / 549 25.8 References / 550 25.9 Further Reading / 550Chapter 26. Advanced High-Density Interconnection Technologies Happy T. Holden 551 26.1 Introduction / 551 26.2 Definitions of HDI Process Factors / 551 26.3 HDI Fabrication Processes / 553 26.4 Next-Generation HDI Processes / 572 26.5 References / 578 26.6 Further Reading / 579Part 6: FabricationChapter 27. CAM Tooling for Fab and Assembly Happy T. Holden 583 27.1 Introduction / 583 27.2 Manufacturing Information / 583 27.3 Design Analysis and Review / 585 27.4 The CAM-Tooling Process / 586 27.5 Additional Processes / 597 27.6 Acknowledgments / 600Chapter 28. Drilling Processes Matthias Stickel 601 28.1 Introduction / 601 28.2 Materials / 602 28.3 Machines / 608 28.4 Methods / 612 28.5 Hole Quality / 618 28.6 Troubleshooting / 619 28.7 Postdrilling Inspection / 621 28.8 Drilling Cost per Hole / 621 28.9 Acknowledgment / 624 Chapter 29. Precision Interconnect and Laser Drilling Matthias Stickel 625 29.1 Introduction / 625 29.2 Factors Affecting High-Density Drilling / 625 29.3 Laser versus Mechanical / 626 29.4 Factors Affecting High-Density Mechanical Drilling / 629 29.5 Depth-Controlled Drilling Methods / 633 29.6 Controlled Depth Via Drilling / 633 29.7 Innerlayer Registration of Multilayer Boards / 637 29.8 Laser Drilling / 637 29.9 Laser Via Formation / 639 29.10 Laser Tool Types / 639 29.11 Acknowledgment / 640 29.12 Further Reading / 640Chapter 30. Imaging and Automated Optical Inspection Gareth Parry 641 30.1 Introduction / 641 30.2 Photosensitive Materials / 641 30.3 Dry-Film Resists / 644 30.4 Liquid Photoresists / 646 30.5 Electrophoretic Depositable Photoresists / 647 30.6 Resist Processing / 648 30.7 Design for Manufacturing / 665 30.8 Inkjet Imaging / 667 30.9 Automatic Optical Inspection / 668 30.10 References / 668Chapter 31. Multilayer Materials and Processing C. D. (Don) Dupriest and Happy T. Holden 671 31.1 Introduction / 671 31.2 Multilayer Construction Types / 672 31.3 ML-PWB Processing and Flows / 690 31.4 Lamination Process / 697 31.5 Lamination Process Control and Troubleshooting / 704 31.6 Lamination Overview / 706 31.7 ML-PWB Summary / 707 31.8 Acknowledgment / 708 31.9 Further Reading / 708Chapter 32. Preparing Boards for Plating Michael Carano 709 32.1 Introduction / 709 32.2 Process Decisions / 709 32.3 Process Feedwater / 711 32.4 Multilayer PTH Preprocessing / 713 32.5 Electroless Copper / 717 32.6 Acknowledgments / 719 32.7 References / 719Chapter 33. Electroplating George Milad 721 33.1 Introduction / 721 33.2 Electroplating Basics / 721 33.3 Acid Copper Electroplating / 722 33.4 Tin Electroplating / 735 33.5 Nickel Electroplating / 736 33.6 Gold Electroplate / 739Chapter 34. Direct Plating Hayao Nakahara 743 34.1 Direct Metallization Technology / 743 34.2 References / 753Chapter 35. Printed Circuit Board Surface Finishes George Milad 755 35.1 Introduction / 755 35.2 PWB Surface Finishes / 757 35.3 Hot Air Solder Level / 758 35.4 Electroless Nickel Immersion Gold / 758 35.5 Nickel Palladium Gold / 761 35.6 Organic Solderability Preservatives / 763 35.7 Immersion Silver / 765 35.8 Immersion Tin / 766 35.9 Other Surface Finishes / 767Chapter 36. Solder Mask David A. Vaughan 771 36.1 Introduction / 771 36.2 Trends and Challenges for Solder Mask / 772 36.3 Types of Solder Mask / 773 36.4 Solder Mask Selection / 774 36.5 Solder Mask Application and Processing / 778 36.6 Via Protection / 785 36.7 Solder Mask Final Properties / 786 36.8 Legend and Marking (Nomenclature) / 787Chapter 37. Etching Process and Technologies Gareth Parry 789 37.1 Introduction / 789 37.2 General Etching Considerations and Procedures / 790 37.3 Resist Removal / 792 37.4 Etching Solutions / 793 37.5 Other Materials for Board Construction / 804 37.6 Metals Other than Copper / 805 37.7 Basics of Etched Line Formation / 806 37.8 Equipment and Techniques / 811 37.9 Acknowledgment / 814 37.10 References / 814Chapter 38. Routing and V-Scoring Matthias Stickel 817 38.1 Introduction / 817 38.2 The Routing Operation / 817 38.3 Materials / 821 38.4 Machines / 822 38.5 Routers / 824 38.6 Parameters / 825 38.7 Depth Controlled Routing / 827 38.8 V-Scoring / 828 38.9 References / 831Part 7: Bare Board TestChapter 39. Bare Board Test Objectives and Definitions David J. Wilkie 835 39.1 Introduction / 835 39.2 The Impact of HDI / 835 39.3 Why Test? / 836 39.4 Circuit Board Faults / 838Chapter 40. Bare Board Test Methods David J. Wilkie 841 40.1 Introduction / 841 40.2 Nonelectrical Testing Methods / 841 40.3 Basic Electrical Testing Methods / 842 40.4 Specialized Electrical Testing Methods / 848 40.5 Data and Fixture Preparation / 851 40.6 Combined Testing Methods / 857Chapter 41. Bare Board Test Equipment David J. Wilkie 859 41.1 Introduction / 859 41.2 System Alternatives / 859 41.3 Universal Grid Systems / 861 41.4 Flying-Probe/Moving-Probe Test Systems / 872 41.5 Verification and Repair / 876 41.6 Test Department Planning and Management / 876Chapter 42. HDI Bare Board Special Testing Methods David J. Wilkie 879 42.1 Introduction / 879 42.2 Fine-Pitch Tilt-Pin Fixtures / 880 42.3 Bending Beam Fixtures / 880 42.4 Flying Probe / 881 42.5 Coupled Plate / 881 42.6 Shorting Plate / 881 42.7 Conductive Rubber Fixtures / 882 42.8 Optical Inspection / 882 42.9 Noncontact Test Methods / 882 42.10 Combinational Test Methods / 884Part 8: Assembly, Soldering Materials, and ProcessesChapter 43. Assembly Processes Happy T. Holden 887 43.1 Introduction / 887 43.2 Through-Hole Technology / 889 43.3 Surface-Mount Technology / 89943.4 Odd-Form Component Assembly / 923 43.5 Process Equipment Selection / 930 43.6 Conformal Coating, Encapsulation, and Underfill Materials / 933 43.7 Acknowledgments / 934Chapter 44. Conformal Coating Jason Keeping 935 44.1 Introduction / 935 44.2 Types of Conformal Coatings / 936 44.3 Product Preparation / 940 44.4 Application Processes / 946 44.5 Cure, Inspection, and Demasking / 949 44.6 Repair Methods / 951 44.7 Design for Conformal Coating / 952 44.8 References / 955Chapter 45. Fluxes and Cleaning Gregory C. Munie and Laura J. Turbini 957 45.1 Introduction / 957 45.2 Assembly Process / 958 45.3 Surface Finishes / 959 45.4 Soldering Flux / 960 45.5 Flux Form versus Soldering Process / 961 45.6 Rosin Flux / 962 45.7 Water-Soluble Flux / 963 45.8 Low Solids Flux / 964 45.9 Cleaning Issues / 965 45.10 Summary / 967 45.11 References / 967Chapter 46. Soldering Fundamentals Gary M. Freedman 969 46.1 Introduction / 969 46.2 Elements of a Solder Joint / 970 46.3 Solder Overview / 971 46.4 Soldering Basics / 971 46.5 References / 975Chapter 47. Soldering Materials and Metallurgy Gary M. Freedman 977 47.1 Introduction / 977 47.2 Solders / 978 47.3 Solder Alloys and Corrosion / 980 47.4 Pb-Free Solders: Alternatives and Implications / 980 47.5 Board Surface Finishes / 986 47.6 References / 994Chapter 48. Solder Fluxes Gary M. Freedman 997 48.1 Introduction to Fluxes / 997 48.2 Flux Functions / 997 48.3 Flux Delivery Methods / 999 48.4 Flux Activity and Attributes / 999 48.5 Flux: Ideal versus Reality / 100048.6 Flux Types / 1000 48.7 Soldering Atmospheres / 1009 48.8 References / 1012Chapter 49. Soldering Techniques Gary M. Freedman 1015 49.1 Introduction / 1015 49.2 Mass Soldering Methods / 1015 49.3 Oven Reflow Soldering / 1015 49.4 Wave Soldering / 1039 49.5 Wave Solder Defects / 1054 49.6 Vapor-Phase Reflow Soldering / 1055 49.7 Laser Reflow Soldering / 1057 49.8 Hot-Bar Soldering / 1064 49.9 Hot-Gas Soldering / 1069 49.10 Ultrasonic Soldering / 1071 49.11 References / 1072Chapter 50. Soldering Repair and Rework Gary M. Freedman 1075 50.1 Introduction / 1075 50.2 Hot-Gas Repair / 1075 50.3 Manual Solder Fountain / 1080 50.4 Automated Solder Fountain (Single-Point Soldering) / 1080 50.5 Laser / 1080 50.6 Considerations for Repair / 1081 50.7 Reference / 1082Part 9: Nonsolder InterconnectionChapter 51. Press-Fit Interconnection Gary M. Freedman 1085 51.1 Introduction / 1085 51.2 The Rise of Press-Fit Technology / 1086 51.3 Compliant Pin Configurations / 1086 51.4 Press-Fit Considerations / 1089 51.5 Press-Fit Pin M aterials / 1089 51.6 Surface Finishes and Effects / 1090 51.7 Equipment / 1093 51.8 Assembly Process / 1093 51.9 Rework for Press-Fit Connectors / 1096 51.10 PCB Design and Board Procurement Tips / 1098 51.11 Press-Fit Process Tips / 1099 51.12 Further Reading / 1101Chapter 52. Pressure-Interconnect Land Grid Array Systems Gary M. Freedman 1103 52.1 Introduction / 1103 52.2 LGA and the Environment / 1103 52.3 Elements of the LGA System / 1103 52.4 Assembly / 1107 52.5 PCA Rework / 1109 52.6 Design Guidelines / 1110 52.7 Reference / 1110Part 10: QualityChapter 53. Acceptability and Quality of Fabricated Boards Robert (Bob) Neves 1113 53.1 Introduction / 1113 53.2 Specific Quality and Acceptability Criteria by PCB Type / 1114 53.3 Methods for Verification of Acceptability / 1115 53.4 Inspection Lot Formation / 1116 53.5 Inspections Categories / 1117 53.6 Acceptability and Quality After Simulated Solder Cycle(s) / 1118 53.7 Nonconforming PCBs and Material Review Board Function / 1120 53.8 The Cost of the Assembled PCB / 1120 53.9 How to Develop Acceptability and Quality Criteria / 1121 53.10 Class of Service / 1122 53.11 Inspection Criteria / 1123 53.12 Reliability Inspection Using Accelerated Environmental Exposure / 1142Chapter 54. Acceptability of Printed Circuit Board Assemblies Mel Parrish 1145 54.1 Understanding Customer Requirements / 1145 54.2 Handling to Protect the PCBA / 1150 54.3 PCBA Hardware Acceptability Considerations / 1153 54.4 Component Installation or Placement Requirements / 1158 54.5 Component and PCB Solderability Requirements / 1166 54.6 Solder-Related Defects / 1166 54.7 PCBA Laminate Condition, Cleanliness, and Marking Requirements / 1171 54.8 PCBA Coatings / 1174 54.9 Solderless Wrapping of Wire to Posts (Wire Wrap) / 1175 54.10 PCBA Modifications / 1176 54.11 References / 1178Chapter 55. Asssembly Inspection Stacy Kalisz Johnson and Stig Oresjo 1179 55.1 Introduction / 1179 55.2 Definition of Defects, Faults, Process Indicators, and Potential Defects / 1181 55.3 Reasons for Inspection / 1182 55.4 Lead-Free Impact on Inspection / 1184 55.5 Miniaturization and Higher Complexity / 1185 55.6 Visual Inspection / 1186 55.7 Automated Inspection / 1189 55.8 Three-Dimensional Automated Solder Paste Inspection / 1191 55.9 Pre-Reflow AOI / 1193 55.10 Post-Reflow Automated Inspection / 1194 55.11 Implementation of Inspection Systems / 1199 55.12 Design Implications of Inspection Systems / 1200 55.13 References / 1201Chapter 56. Design for Testing Kenneth P. Parker 1203 56.1 Introduction / 1203 56.2 Definitions / 1204 56.3 Ad Hoc Design for Testability / 1204 56.4 Structured Design for Testability / 1206 56.5 Standards-Based Testing / 1207 56.6 References / 1213 Chapter 57. Loaded Board Testing Kenneth P. Parker 1215 57.1 Introduction / 1215 57.2 The Process of Test / 1216 57.3 Definitions / 1217 57.4 Testing Approaches / 1221 57.5 In-Circuit Test Techniques / 1224 57.6 Alternatives to Conventional Electrical Tests / 1229 57.7 Tester Comparison / 1232 57.8 References / 1232Chapter 58. Failure Modes and Effects Analysis Happy T. Holden 1233 58.1 Prognostics and Health Management / 1233 58.2 Theory / 1235 58.3 What Is Process FMEA? / 1241 58.4 Reference / 1244 58.5 Further Reading / 1244Part 11: ReliabilityChapter 59. Conductive Anodic Filament Formation Laura J. Turbini and Antonio Caputo 1247 59.1 Introduction / 1247 59.2 Electrochemical Migration / 1247 59.3 Developing a Quantitative Copper Corrosion Test / 1249 59.4 Understanding CAF Formation / 1256 59.5 Factors That Affect CAF Formation / 1260 59.6 Test Method for CAF-Resistant Materials / 1266 59.7 Manufacturing Tolerance Considerations / 1267 59.8 References / 1267Chapter 60. Reliability of Printed Circuit Boards Reza Ghaffarian 1271 60.1 Introduction / 1271 60.2 PCB and Microelectronics Trends and Reliability / 1272 60.3 PCB Fabrication and Failure Mechanisms / 1283 60.4 PTH Thermal Cycle Reliability and Projections Methods / 1294 60.5 Acknowledgments / 1322 60.6 References / 1322 60.7 Further Reading / 1325Chapter 61. Reliability of Microvia Printed Circuit Boards Reza Ghaffarian 1327 61.1 Microvia Fabrication / 1327 61.2 Summary / 1342 61.3 List of Acronyms / 1342 61.4 Acknowledgments / 1345 61.5 References / 1345 61.6 Further Reading / 1346 Chapter 62. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free Mudasir Ahmad and Mark Brillhart 1347 62.1 Introduction / 1347 62.2 Packaging Challenges / 1348 62.3 Variables That Impact Reliability / 1351 62.4 References / 1373Chapter 63. Lead-Free Solder Joint Reliability: Fundamentals and Design-for-Reliability Rules Jean-Paul Clech 1375 63.1 Introduction / 1375 63.2 Reliability Definition and Goals / 1376 63.3 Why Do Solder Joints Fail? / 1377 63.4 Main Effects and Basic Rules-of-Thumb / 1378 63.5 Parameters That Affect Solder Joint Reliability Under Thermal Cycling Conditions / 1384 63.6 Significance of Board Parameter Effects / 1387 63.7 Lead-Free Reliability Trends / 1393 63.8 Conclusions / 1397 63.9 Further Reading / 1397Chapter 64. Component-to-PWB Reliability: Estimating Solder Joint Reliability and the Impact of Lead-Free Solders Mudasir Ahmad and Mark Brillhart 1401 64.1 Introduction / 1401 64.2 Thermomechanical Reliability / 1403 64.3 Mechanical Reliability / 1418 64.4 Finite Element Analysis / 1425 64.5 References / 1432Part 12: Flexible CircuitsChapter 65. Flexible Circuit Applications and Materials Happy T. Holden 1439 65.1 Introduction to Flexible Circuits / 1439 65.2 Applications of Flexible Circuits / 1441 65.3 High-Density Flexible Circuits / 1442 65.4 Materials for Flexible Circuits / 1443 65.5 Substrate Material Properties / 1445 65.6 Conductor Materials / 1459 65.7 Copper-Clad Laminates / 1460 65.8 Coverlay Materials / 1464 65.9 Stiffener Materials / 1469 65.10 Adhesive Materials / 1469 65.11 Restriction of Hazardous Substances Issues / 1470 65.12 Acknowledgments / 1470Chapter 66. Design of Flexible Circuits Happy T. Holden 1471 66.1 Introduction / 1471 66.2 Types of Flexible Circuits / 1472 66.3 Multilayer Rigid Flex (Multilayer Flex) / 1478 66.4 Circuit Designs for Flexibility / 1480 66.5 Electrical Design of the Circuits / 1485 66.6 Design of Flexible Printed Wiring with Transmission Line Properties / 1490 66.7 Circuit Designs for Higher Reliability / 1500 66.8 Acknowledgments / 1502 Chapter 67. Manufacturing Flexible Circuits Joseph Fjelstad 1503 67.1 Introduction / 1503 67.2 Fundamental Flex Circuit Processing Steps / 1504 67.3 Equipment for Wet Processing of Flexible Materials / 1507 67.4 Coverlayer/Cover-Coating Methods / 1509 67.5 Interconnection Surface Treatments / 1516 67.6 Depanelization of Flexible Circuits / 1517 67.7 Stiffener Processes / 1519 67.8 Packaging for Flex / 1520 67.9 High-Density Flexible Circuit Manufacturing / 1520 67.10 Acknowledgments / 1529 Chapter 68. Termination Options for Flexible Circuits Joseph Fjelstad 1531 68.1 Introduction / 1531 68.2 Wirebonding Technology / 1533 68.3 Solutions Where the Flex Circuit Is Half of the Mated Pair / 1536 68.4 Summary / 1541 68.5 Acknowledgments / 1541 Chapter 69. Multilayer Flex and Rigid Flex Joseph Fjelstad 1543 69.1 Introduction / 1543 69.2 Multilayer Flex versus Rigid Flex / 1543 69.3 Aluminum Rigid Flex Circuit—Prospective Structure for the Future / 1550 69.4 Summary / 1554 69.5 Acknowledgments / 1555 Chapter 70. Special Constructions of Flexible Circuits Dominique K. Numakura 1557 70.1 Introduction / 1557 70.2 Flying-Lead Construction / 1557 70.3 Tape Automated Bonding / 1564 70.4 Microbump Arrays / 1566 70.5 Thick-Film Conductor Flex Circuits / 1568 70.6 Shielding of the Flexible Cables / 1569 70.7 Functional Flexible Circuits / 1570 Chapter 71. 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