Microwave technology Books

Book SynopsisNanoscale materials are showing great promise in various electronic, optoelectronic, and energy applications. Silicon (Si) has especially captured great attention as the leading material for microelectronic and nanoscale device applications. Recently, various silicides have garnered special attention for their pivotal role in Si device engineering and for the vast potential they possess in fields such as thermoelectricity and magnetism. The fundamental understanding of Si and silicide material processes at nanoscale plays a key role in achieving device structures and performance that meet real-world requirements and, therefore, demands investigation and exploration of nanoscale device applications. This book comprises the theoretical and experimental analysis of various properties of silicon nanocrystals, research methods and techniques to prepare them, and some of their promising applications.Table of ContentsIn situ Observations of Vapor–Liquid–Solid Growth of Silicon Nanowires. Growth of Germanium, Silicon, and Ge–Si Heterostructured Nanowires. Transition Metal Silicide Nanowires: Synthetic Methods and Applications. Metal Silicide Nanowires: Growth and Properties. Formation of Epitaxial Silicide in Silicon Nanowires. Interaction between Inverse Kirkendall Effect and Kirkendall Effect in Nanoshells and Nanowires. Electrical Transport Properties of Doped Silicon Nanowires. Silicon Nanowires and Related Nanostructures as Lithium-Ion Battery Anodes. Porous Silicon Nanowires. Nanoscale Contact Engineering for Si Nanowire Devices. Index.

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Book SynopsisA comprehensive overview, this book focuses on two directions of study: discovery of new effects that take place in magnetic wires and optimization of the magnetic, electrical, and mechanical properties of the wires, taking into account the technological application. The book presents the idea of moving to nanoscale, maintaining the achieved optimal parameters of microwires. While the focus remains on glass-covered wires of micrometer scale, it covers the first steps of the movement to "nano" range as an example of the versatility of the basic effects initially discovered for microscale.Table of ContentsKerr Effect as Method of Investigation of Magnetization Reversal in Magnetic Wires. Cold-Drawn Fe-Rich Amorphous Wire. Conventional Co-Rich Amorphous Wire. Interaction Between Glass-Covered Microwires. Circular Magnetic Bistability in Co-Rich Amorphous Microwires. Effect of High-Frequency Driving Current on Magnetization Reversal in Co-Rich Amorphous Microwires. Relation Between Surface Magnetization Reversal and Magnetoimpedance. Helical Magnetic Structure. Magnetization Reversal in Crossed Magnetic Field. Visualization of Barkhausen Jump. Magnetization Reversal in Glass-Covered Nanowires of Cylindrical Shape. Magnetic Domain-Wall Dynamics in Co-Rich Glass-Covered Microwires. Nucleation and Transformation of Circular Magnetic Domain Structure: Control of Domain Nucleation. Magnetization Reversal in Co-Rich Microwires with Different Values of Magnetostriction. Application of Magneto-Optical Indicator Film Method to Study Domain Magnetic Structure in Microwires.

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Book SynopsisEnergy transport and conversion in nanoscale structures is a rapidly expanding area of science. It looks set to make a significant impact on human life and, with numerous commercial developments emerging, will become a major academic topic over the coming years. Owing to the difficulty in experimental measurement, computational simulation has become a powerful tool in the study of nanoscale energy transport and harvesting.This book provides an introduction to the current computational technology and discusses the applications of nanostructures in renewable energy and the associated research topics. It will be useful for theorists, experimentalists, and graduate-level students who want to explore this new field of research. The book addresses the currently used computational technologies and their applications in study of nanoscale energy transport and conversion. With content relevant to both academic and commercial viewpoints, it will interest researchers and postgraduates as well as consultants in the renewable energy industry.Trade Review"This book provides a timely and extensive introduction on the current status of energy transport and harvesting using nanomaterials and various computational technologies to study such materials. Current advancement in computational sciences has made it a vital tool in the development of nanosciences and nanotechnologies. This book should be a very useful reference for scientists who are working in this field and an excellent textbook for advanced-level students who would like to learn these techniques and applications."—Prof. Su-Huai Wei, National Renewable Energy Laboratory, USATable of ContentsMolecular Dynamics Simulations for Computing Thermal Conductivity of Nano Materials. Nonequilibrium Phonon Green’s Function Simulation and Its Application to Carbon Nanotubes. Thermal Conduction of Graphene. Ballistic Thermal Transport by Phonons at Low Temperatures in Low-Dimensional Quantum Structures. Surface functionalization induced thermal conductivity attenuation in silicon nanowires: A molecular dynamics study.

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Book SynopsisIn the big data era, data storage is one of the cores in the whole information chain, which includes production, transfer, sharing, and finally processing. Over the years, the growth of data volume has been explosive. Today, various storage services need memories with higher density and capacity. Moreover, information storage in the big data applications should be green, safe, and long life. The storage density of memories was largely enhanced in recent years because of the rapid development of nanotechnology. The minimum feature size of optical, magnetic, and electrical memories is already at the nanometer scale. Furthermore, the interdisciplinary cooperation of nanotechnology can facilitate the development of data storage technology to achieve higher operation speed, lower power consumption, and increased retention time. This book compiles the cutting-edge research progress of nanometer-scale data storage. The main topics covered include optical memory, random access memory, magnetic memory, and hybrid memory. The text emphasizes more practical methods for data storage development and applications. Table of ContentsOverview of Information Data Storage: An Introduction; Super-Resolution Optical Data Storage Using Binary Optics. Focal Spot Engineering for Bit-by-bit Recording. Plasmonic Nanofocusing and Data Storage. Nano-optical Data Storage With Nonlinear Super-Resolution Thin Films. Mastering Technology for High-Density Optical Disk. Laser-Induced Phase Transition and Its Application in Nano-optical Storage. SPIN-Based Optical Data Storage. Magnetic Random Access Memory (MRAM). Resistive Random Access Memory (RRAM). Phase Change Random Access Memory (PCRAM). Nano-DRAM Technology for Data Storage Application. Ferroelectric Memory. Nano-magnetic and Hybrid Recording.

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Book SynopsisMicroelectromechanical systems (MEMS)-based sensors and actuators have become remarkably popular in the past few decades. Rapid advances have taken place in terms of both technologies and techniques of fabrication of MEMS structures. Wet chemical–based silicon bulk micromachining continues to be a widely used technique for the fabrication of microstructures used in MEMS devices. Researchers all over the world have contributed significantly to the advancement of wet chemical–based micromachining, from understanding the etching mechanism to exploring its application to the fabrication of simple to complex MEMS structures. In addition to its various benefits, one of the unique features of wet chemical–based bulk micromachining is the ability to fabricate slanted sidewalls, such as 45° walls as micromirrors, as well as freestanding structures, such as cantilevers and diaphragms. This makes wet bulk micromachining necessary for the fabrication of structures for myriad applications.This book provides a comprehensive understating of wet bulk micromachining for the fabrication of simple to advanced microstructures for various applications in MEMS. It includes introductory to advanced concepts and covers research on basic and advanced topics on wet chemical–based silicon bulk micromachining. The book thus serves as an introductory textbook for undergraduate- and graduate-level students of physics, chemistry, electrical and electronic engineering, materials science, and engineering, as well as a comprehensive reference for researchers working or aspiring to work in the area of MEMS and for engineers working in microfabrication technology.Table of ContentsA Brief Introduction of the Crystal Structure. Brief Overview of Silicon Wafer Manufacturing and Microfabrication Techniques. Isotropic Etching of Silicon and Related Materials. KOH-Based Anisotropic Etching TMAH-Based Anisotropic Etching. Convex and Concave Corners in Silicon Wet Bulk Micromachining. Alignment of Mask Patterns to Crystallographic Directions. Simple to Complex Structures Using Wet Bulk Micromachining.

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Book SynopsisThe rapid advancement of integrated optoelectronics has been driven considerably by miniaturization. Following the path taken in electronics of reducing devices to their ultimately fundamental forms, for instance single-electron transistors, now optical devices have also been scaled down, creating the increasingly active research fields of integrated and coupled photonic systems. The interactions between the coupled integrated micro- and nanostructures can provide us with the fundamental understanding and engineering of complex systems for a variety of applications.This book aims to bring to the readers the latest developments in the rapidly emerging field of integrated nanophotonic resonators and devices. It compiles cutting-edge research from leading experts who form an interdisciplinary team around the world. The book also introduces the fundamental knowledge of coupled integrated photonic/electronic/mechanical micro- and nanoresonators and their interactions, as well as advanced research in the field.Trade Review"This unique book introduces readers to the rapid advancement in a variety of active areas in coupled and integrated nanophotonics. All the chapters represent the latest cutting-edge research in this emerging field. Readers from both academia and industry who are interested in integrated nanophotonic resonators and devices will definitely benefit from this timely book."— Dr. Terry L. Smith, 3M Co., USA"This is a leading book in the field of nanophotonic resonators and devices and presents the latest developments. Integrated nanophotonics will play a pivotal role in future semiconductor chips, and this text provides scientists, engineers, and professionals with invaluable resources in this cutting-edge field."— Dr. Xiaoman Duan, Massachusetts Institute of Technology, USA"In this book, some typical topics in the field of integrated nanophotonic resonators are reviewed from the point of view of fundamentals, devices, and applications. The emerging new advances in integrated microresonators, optoplasmonics, silicon-based photonic devices, optomechanical systems, optical trapping, and photonic-structured scintillators and the theoretical simulation methods described in this book will open the door to realizing an unprecedented development. Undoubtedly, this book is beneficial to this community."— Prof. Hong Chen, Tongji University, China"This unique book introduces readers to the rapid advancement in a variety of active areas in coupled and integrated nanophotonics. All the chapters represent the latest cutting-edge research in this emerging field. Readers from both academia and industry who are interested in integrated nanophotonic resonators and devices will definitely benefit from this timely book."— Dr. Terry L. Smith, 3M Co., USA"This is a leading book in the field of nanophotonic resonators and devices and presents the latest developments. Integrated nanophotonics will play a pivotal role in future semiconductor chips, and this text provides scientists, engineers, and professionals with invaluable resources in this cutting-edge field."— Dr. Xiaoman Duan, Massachusetts Institute of Technology, USA"In this book, some typical topics in the field of integrated nanophotonic resonators are reviewed from the point of view of fundamentals, devices, and applications. The emerging new advances in integrated microresonators, optoplasmonics, silicon-based photonic devices, optomechanical systems, optical trapping, and photonic-structured scintillators and the theoretical simulation methods described in this book will open the door to realizing an unprecedented development. Undoubtedly, this book is beneficial to this community."— Prof. Hong Chen, Tongji University, ChinaTable of ContentsHybrid and coupled photonic system between nanoparticle and integrated micro resonator. Coupled mode theory and its applications in computational nanophotonics. Template-guided self-assembly of discrete optoplasmonic molecules and extended optoplasmonic arrays. Nanophotonic resonators for enhancement of absorption and transmission cross sections of subwavelength plasmonic devices. Photoluminescent centers interacting with silicon-based photonic devices. Nonclassical light sources and frequency converters with integrated optomechanical systems. Scintillators boosted by nanophotonics. Optical trapping of nanoparticles. Rainbow trapping effect in horizontal and vertical directions.

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Book SynopsisFollowing two decades of intense research globally, the organic light-emitting diode (OLED) has steadily emerged as the ultimate display technology of choice for the coming decades. Portable active matrix OLED displays have already become prevalent, and even large-sized ultra-high definition 4K TVs are being mass-produced. More exotic applications such as wearable displays have been commercialized recently. With the burgeoning success in displays, researchers are actively bringing the technology forward into the exciting solid-state lighting market.This book presents the knowledge needed for students and researchers from diverse disciplines to understand the underlying principles in OLED technology. It begins with a brief history and fundamental working principles of OLEDs. After introducing the fundamentals, it discusses more efficient OLED designs, as well as advanced strategies to enhance the performance. The text covers in detail important areas such as top-emission, p- and n-type doping, device stability, light extraction, and stacked white OLEDs. It also throws light on the current industry practice and major areas of focus in the near future.Trade Review"OLEDs are a rapidly developing new technology having applications in both display and lighting. Although broad commercial application has been reached for small OLED displays, there are many more challenges in chemistry, physics, and engineering to be addressed to exploit the full potential of this technology. Yi-Lu Chang’s book fills a gap by providing a concise review of the state of the art of this fast-progressing field. The author has worked in one of the world’s leading groups on high-efficiency OLEDs and can thus provide deep insight into the key issues of improving this technology."— Prof. Karl Leo, Technische Universität Dresden, GermanyTable of ContentsIntroduction. OLED Working Principles. Charge Carrier Injection and Transport. Efficient Device Architectures. Advanced Device Architectures: Exciton Harvesting. P-type intrinsic n-type (p-i-n) OLEDs. Top-Emission OLEDs. Efficient White OLEDs. Optical Light Out-Coupling. Stability and Degradation. Applications in Displays and Lighting. Conclusions and Outlook.

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Book SynopsisNanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques. Table of ContentsModel-Based Scanning Electron Microscopy Critical Dimension Metrology for 3D Nanostructures. X-Ray Metrology for Semiconductor Fabrication. Advancements in Ellipsometric and Scatterometric Analysis. 3D-AFM Measurements for Semiconductor Structures and Devices. Microstructure Characterization of Nanoscale Materials and Interconnects. Characterization of the Chemistry and Mechanical Properties of Interconnect Materials and Interfaces: Impact on Interconnect Reliability. Characterization of Plasma Damage for Low-κ Dielectric Films. Defect Characterization and Metrology. 3D Electron Tomography for Nanostructures. Methodology and Challenges in Characterization of 3D Package Interconnection Materials and Processes. 3D Interconnect Characterization using Raman Spectroscopy. Optical and Electrical Nanoprobing for Circuit Diagnostics. Automated Tools and Methods for Debugging and Diagnosis.

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Book SynopsisThe rapid development of technology based on metamaterials coupled with the recent introduction of the transformation optics technique provides an unprecedented ability for device designers to manipulate and control the behavior of electromagnetic wave phenomena. Many of the early metamaterial designs, such as negative index materials and electromagnetic bandgap surfaces, were limited to operation only over a very narrow bandwidth. However, recent groundbreaking work reported by several international research groups on the development of broadband metamaterials has opened up the doors to an exciting frontier in the creation of new devices for applications ranging from radio frequencies to visible wavelengths. This book contains a collection of eight chapters that cover recent cutting-edge contributions to the theoretical, numerical, and experimental aspects of broadband metamaterials.Table of ContentsBroadband Anisotropic Metamaterials for Antenna Applications. Broadband Low-loss Metamaterial-enabled Horn Antennas. Realization of Slow Wave Phenomena Using Coupled Transmission Lines and their Application to Antennas and Vacuum Electronics. Design Synthesis of Multi- and Broad-band Gap Electromagnetic Metasurfaces. Temporal and Spatial Dispersion Engineering using Metamaterial Concepts and Structures. Broadband Performance of Lenses Designed with Quasiconformal Transformation Optics. Broadband Chirality in Twisted Metamaterials. Broadband Optical Metasurfaces and Metamaterials.

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Book SynopsisOne dimensional electronic materials are expected to be key components owing to their potential applications in nanoscale electronics, optics, energy storage, and biology. Besides, compound semiconductors have been greatly developed as epitaxial growth crystal materials. Molecular beam and metalorganic vapor phase epitaxy approaches are representative techniques achieving 0D–2D quantum well, wire, and dot semiconductor III-V heterostructures with precise structural accuracy with atomic resolution. Based on the background of those epitaxial techniques, high-quality, single-crystalline III-V heterostructures have been achieved. III-V Nanowires have been proposed for the next generation of nanoscale optical and electrical devices such as nanowire light emitting diodes, lasers, photovoltaics, and transistors. Key issues for the realization of those devices involve the superior mobility and optical properties of III-V materials (i.e., nitride-, phosphide-, and arsenide-related heterostructure systems). Further, the developed epitaxial growth technique enables electronic carrier control through the formation of quantum structures and precise doping, which can be introduced into the nanowire system. The growth can extend the functions of the material systems through the introduction of elements with large miscibility gap, or, alternatively, by the formation of hybrid heterostructures between semiconductors and another material systems. This book reviews recent progresses of such novel III-V semiconductor nanowires, covering a wide range of aspects from the epitaxial growth to the device applications. Prospects of such advanced 1D structures for nanoscience and nanotechnology are also discussed.Table of ContentsEpitaxial Heterostructure Nanowires. Molecular beam epitaxial growth of GaN nanocolumns and related nanocolumn emitters. Novel GaNP nanowires for advanced optoelectronics and photonics. GaNAs-based nanowires for near-infrared optoelectronics. Dilute Bismide Nanowires. Ferromagnetic MnAs/III-V Hybrid Nanowires for Spintronics. GaAs-Fe3Si Semiconductor-Ferromagnet Core-Shell Nanowires for Spintronics. GaAs/AlGaOx Heterostructured Nanowires Synthesized by Post Growth Wet Oxidation. GaAs/SrTiO3 Core-Shell Nanowires. Ga(In)N nanowires grown by Molecular Beam Epitaxy: from quantum light emitters to nano-transistors. InP-related nanowires for light-emitting applications. InP/InAs quantum heterostructure nanowires. III-Nitride Nanowires and Their Laser, LED photovoltaic Applications. III-V nanowires: transistor and photovoltaic applications.

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Book SynopsisGraphene, the wonder material of the 21st century, is expected to play an important role in future nanoelectronic applications, but the only way to achieve this goal is to grow graphene directly on a semiconductor, integrating it in the chain for the production of electronic circuits and devices. This book summarizes the latest achievements in this field, with particular attention to the graphitization of SiC. Through high-temperature annealing in a controlled environment, it is possible to decompose the topmost SiC layers, obtaining quasi-ideal graphene by Si sublimation with record electronic mobilities, while selective growth on patterned structures makes possible the opening of a gap by quantum confinement.The book starts with a review chapter on the significance and challenges of graphene growth on semiconductors, followed by three chapters dedicated to an up-to-date analysis of the synthesis of graphene in ultrahigh vacuum, and concludes with two chapters discussing possible ways of tailoring the electronic band structure of epitaxial graphene by atomic intercalation and of creating a gap by the growth of templated graphene nanostructures.Table of ContentsForeword. The significance and challenges of direct growth of graphene on semiconductor surfaces. Graphene synthesized on cubic-SiC(001) in ultra-high vacuum: Atomic and electronic structure, transport properties. Epitaxial Graphene from UHV decomposition of 3C-SiC/Si. Diffusion and kinetics in epitaxial graphene growth on SiC. Atomic intercalation at the SiC/graphene interface. Epitaxial graphene on SiC: 2D sheets, selective growth and nanoribbons.

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Book SynopsisSince its invention, the integrated circuit has necessitated new process modules and numerous architectural changes to improve application performances, power consumption, and cost reduction. Silicon CMOS is now well established to offer the integration of several tens of billions of devices on a chip or in a system. At present, there are important challenges in the introduction of heterogeneous co-integration of materials and devices with the silicon CMOS 2D- and 3D-based platforms. New fabrication techniques allowing strong energy and variability efficiency come in as possible players to improve the various figures of merit of fabrication technology. Integrated Nanodevice and Nanosystem Fabrication: Breakthroughs and Alternatives is the second volume in the Pan Stanford Series on Intelligent Nanosystems. The book contains 8 chapters and is divided into two parts, the first of which reports breakthrough materials and techniques such as single ion implantation in silicon and diamond, graphene and 2D materials, nanofabrication using scanning probe microscopes, while the second tackles the scaling and architectural aspects of silicon devices through HiK scaling for nanoCMOS, nanoscale epitaxial growth of group IV semiconductors, design for variability co-optimization in SOI FinFETs, and nanowires for CMOS and diversifications.Trade Review"A timely book that showcases some of the most important advances in nanodevices and nanofabrication, written by world-renowned experts."Prof. H.-S. Philip Wong, Stanford University, USA"This seven-chapter book reviews important new trends in nanotechnology and nanodevices, ranging from single-ion implantation and two-dimensional materials, such as graphene, to nanofabrication with a scanning probe microscope. The second part of the book deals with unconventional approaches to scaling nanoscale CMOS devices and to reducing device variability. Taken together, the book provides a wealth of information for graduate students and nanotechnology researchers, as well as a good insight into the future developments for engineers involved with nanosystem design and fabrication."Prof. George Celler, Rutgers University, USA"In this book, the authors address various advanced nanofabrication techniques and device issues for nano-CMOS extension. The topics are timely and their description is well balanced between innovation and practicality, as the authors evaluate each technique on the basis of the current CMOS technology. I strongly recommend the book to graduate students, researchers, and engineers in the industry and academia."Prof. Byung Gook Park, Seoul National University, KoreaTable of ContentsIntroduction: Will new materials, fabrication and architecture schemes emerge for CMOS survival?. Deterministic single-ion implantation method for quantum processing in silicon and diamond. Graphene and two-dimensional materials : extending silicon technology for the future? Nanofabrication using scanning probe microscopes. High-k dielectric scaling for nano CMOS technology. Nanometer scale epitaxial growth of group IV semiconductors. TCAD-based design technology co-optimization for variability in nanoscale SOI FinFETs. Nanowires for CMOS and diversifications.

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Book SynopsisThe active technique of microwave imaging has recently proven to provide excellent diagnostic capabilities in several areas.Table of Contents1 Introduction. 2 Electromagnetic Scattering. 2.1 Maxwell’s Equations. 2.2 Interface Conditions. 2.3 Constitutive Equations. 2.4 Wave Equations and Their Solutions. 2.5 Volume Scattering by Dielectric Targets. 2.6 Volume Equivalence Principle. 2.7 Integral Equations. 2.8 Surface Scattering by Perfectly Electric Conducting Targets. References. 3 The Electromagnetic Inverse Scattering Problem. 3.1 Introduction. 3.2 Three-Dimensional Inverse Scattering. 3.3 Two-Dimensional Inverse Scattering. 3.4 Discretization of the Continuous Model. 3.5 Scattering by Canonical Objects: The Case of Multilayer Elliptic Cylinders. References. 4 Imaging Configurations and Model Approximations. 4.1 Objectives of the Reconstruction. 4.2 Multiillumination Approaches. 4.3 Tomographic Confi gurations. 4.4 Scanning Confi gurations. 4.5 Confi gurations for Buried-Object Detection. 4.6 Born-Type Approximations. 4.7 Extended Born Approximation. 4.8 Rytov Approximation. 4.9 Kirchhoff Approximation. 4.10 Green's Function for Inhomogeneous Structures. References. 5 Qualitative Reconstruction Methods. 5.1 Introduction. 5.2 Generalized Solution of Linear Ill-Posed Problems. 5.3 Regularization Methods. 5.4 Singular Value Decomposition. 5.5 Singular Value Decomposition for Solving Linear Problems. 5.6 Regularized Solution of a Linear System Using Singular Value Decomposition. 5.7 Qualitative Methods for Object Localization and Shaping. 5.8 The Linear Sampling Method. 5.9 Synthetic Focusing Techniques. 5.10 Qualitative Methods for Imaging Based on Approximations. 5.11 Diffraction Tomography. 5.12 Inversion Approaches Based on Born-Like Approximations. 5.13 The Born Iterative Method. 5.14 Reconstruction of Equivalent Current Density. References. 6 Quantitative Deterministic Reconstruction Methods. 6.1 Introduction. 6.2 Inexact Newton Methods. 6.3 The Truncated Landweber Method. 6.4 Inexact Newton Method for Electric Field Integral Equation Formulation. 6.5 Inexact Newton Method for Contrast Source Formulation. 6.6 The Distorted Born Iterative Method. 6.7 Inverse Scattering as an Optimization Problem. 6.8 Gradient-Based Methods. References. 7 Quantitative Stochastic Reconstruction Methods. 7.1 Introduction. 7.2 Simulated Annealing. 7.3 The Genetic Algorithm. 7.4 The Differential Evolution Algorithm. 7.5 Particle Swarm Optimization. 7.6 Ant Colony Optimization. 7.7 Code Parallelization. References. 8 Hybrid Approaches. 8.1 Introduction. 8.2 The Memetic Algorithm. 8.3 Linear Sampling Method and Ant Colony Optimization. References. 9 Microwave Imaging Apparatuses and Systems. 9.1 Introduction. 9.2 Scanning Systems for Microwave Tomography. 9.3 Antennas for Microwave Imaging. 9.4 The Modulated Scattering Technique and Microwave Cameras. References. 10 Applications of Microwave Imaging. 10.1 Civil and Industrial Applications. 10.2 Medical Applications of Microwave Imaging. 10.3 Shallow Subsurface Imaging. References. 11 Microwave Imaging Strategies, Emerging Techniques, and Future Trends. 11.1 Introduction. 11.2 Potentialities and Limitations of Three-Dimensional Microwave Imaging. 11.3 Amplitude-Only Methods. 11.4 Support Vector Machines. 11.5 Metamaterials for Imaging Applications. 11.6 Through-Wall Imaging. References. INDEX.

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Book SynopsisDo you want to know how to design high efficiency RF and microwave solid state power amplifiers? Read this book to learn the main concepts that are fundamental for optimum amplifier design. Practical design techniques are set out, stating the pros and cons for each method presented in this text. In addition to novel theoretical discussion and workable guidelines, you will find helpful running examples and case studies that demonstrate the key issues involved in power amplifier (PA) design flow. Highlights include: Clarification of topics which are often misunderstood and misused, such as bias classes and PA nomenclatures. The consideration of both hybrid and monolithic microwave integrated circuits (MMICs). Discussions of switch-mode and current-mode PA design approaches and an explanation of the differences. Coverage of the linearity issue in PA design at circuit level, with advice on low distortion power stages. Analysis of Table of ContentsPreface. About the Authors. Acknowledgments. 1 Power Amplifier Fundamentals. 1.1 Introduction. 1.2 Definition of Power Amplifier Parameters. 1.3 Distortion Parameters. 1.4 Power Match Condition. 1.5 Class of Operation. 1.6 Overview of Semiconductors for PAs. 1.7 Devices for PA. 1.8 Appendix: Demonstration of Useful Relationships. 1.9 References. 2 Power Amplifier Design. 2.1 Introduction. 2.2 Design Flow. 2.3 Simplified Approaches. 2.4 The Tuned Load Amplifier. 2.5 Sample Design of a Tuned Load PA. 2.6 References. 3 Nonlinear Analysis for Power Amplifiers. 3.1 Introduction. 3.2 Linear vs. Nonlinear Circuits. 3.3 Time Domain Integration. 3.4 Example. 3.5 Solution by Series Expansion. 3.6 The Volterra Series. 3.7 The Fourier Series. 3.8 The Harmonic Balance. 3.9 Envelope Analysis. 3.10 Spectral Balance. 3.11 Large Signal Stability Issue. 3.12 References. 4 Load Pull. 4.1 Introduction. 4.2 Passive Source/Load Pull Measurement Systems. 4.3 Active Source/Load Pull Measurement Systems. 4.4 Measurement Test-sets. 4.5 Advanced Load Pull Measurements. 4.6 Source/Load Pull Characterization. 4.7 Determination of Optimum Load Condition. 4.8 Appendix: Construction of Simplified Load Pull Contours through Linear Simulations. 4.9 References. 5 High Efficiency PA Design Theory. 5.1 Introduction. 5.2 Power Balance in a PA. 5.3 Ideal Approaches. 5.4 High Frequency Harmonic Tuning Approaches. 5.5 High Frequency Third Harmonic Tuned (Class F). 5.6 High Frequency Second Harmonic Tuned. 5.7 High Frequency Second and Third Harmonic Tuned. 5.8 Design by Harmonic Tuning. 5.9 Final Remarks. 5.10 References. 6 Switched Amplifiers. 6.1 Introduction. 6.2 The Ideal Class E Amplifier. 6.3 Class E Behavioural Analysis. 6.4 Low Frequency Class E Amplifier Design. 6.5 Class E Amplifier Design with 50% Duty-cycle. 6.6 Examples of High Frequency Class E Amplifiers. 6.7 Class E vs. Harmonic Tuned. 6.8 Class E Final Remarks. 6.9 Appendix: Demonstration of Useful Relationships. 6.10 References. 7 High Frequency Class F Power Amplifiers. 7.1 Introduction. 7.2 Class F Description Based on Voltage Wave-shaping. 7.3 High Frequency Class F Amplifiers. 7.4 Bias Level Selection. 7.5 Class F Output Matching Network Design. 7.6 Class F Design Examples. 7.7 References. 8 High Frequency Harmonic Tuned Power Amplifiers. 8.1 Introduction. 8.2 Theory of Harmonic Tuned PA Design. 8.3 Input Device Nonlinear Phenomena: Theoretical Analysis. 8.4 Input Device Nonlinear Phenomena: Experimental Results. 8.5 Output Device Nonlinear Phenomena. 8.6 Design of a Second HT Power Amplifier. 8.7 Design of a Second and Third HT Power Amplifier. 8.8 Example of 2nd HT GaN PA. 8.9 Final Remarks. 8.10 References. 9 High Linearity in Efficient Power Amplifiers. 9.1 Introduction. 9.2 Systems Classification. 9.3 Linearity Issue. 9.4 Bias Point Influence on IMD. 9.5 Harmonic Loading Effects on IMD. 9.6 Appendix: Volterra Analysis Example. 9.7 References. 10 Power Combining. 10.1 Introduction. 10.2 Device Scaling Properties. 10.3 Power Budget. 10.4 Power Combiner Classification. 10.5 The T-junction Power Divider. 10.6 Wilkinson Combiner. 10.7 The Quadrature (90◦) Hybrid. 10.8 The 180◦ Hybrid (Ring Coupler or Rat-race). 10.9 Bus-bar Combiner. 10.10 Other Planar Combiners. 10.11 Corporate Combiners. 10.12 Resonating Planar Combiners. 10.13 Graceful Degradation. 10.14 Matching Properties of Combined PAs. 10.15 Unbalance Issue in Hybrid Combiners. 10.16 Appendix: Basic Properties of Three-port Networks. 10.17 References. 11 The Doherty Power Amplifier. 11.1 Introduction. 11.2 Doherty’s Idea. 11.3 The Classical Doherty Configuration. 11.4 The ‘AB-C’ Doherty Amplifier Analysis. 11.5 Power Splitter Sizing. 11.6 Evaluation of the Gain in a Doherty Amplifier. 11.7 Design Example. 11.8 Advanced Solutions. 11.9 References. Index.

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Book SynopsisThis book describes the latest development in optical fiber devices, and their applications to sensor technology. Optical fiber sensors, an important application of the optical fiber, have experienced fast development, and attracted wide attentions in basic science as well as in practical applications.Trade Review“The book provides a well-organized and in-depth treatment of optical fiber sensors for students and can also serve as a convenient reference for engineers and scientists working in the field.” (IEEE Electrical Insulation Magazine, 1 March 2014) Table of ContentsPreface xi 1 Introduction 1 1.1 Historical Review and Perspective 1 1.2 Classifications of Optical Fiber Sensors 3 1.3 Overview of the Chapters 6 References 8 2 Fundamentals of Optical Fibers 10 2.1 Introduction to Optical Fibers 10 2.1.1 Basic Structure and Fabrication of Optical Fiber 10 2.1.2 Basic Characteristics 12 2.1.3 Classifications of Optical Fibers 17 2.2 Electromagnetic Theory of Step-Index Optical Fibers 18 2.2.1 Maxwell Equations in Cylindrical Coordinates 19 2.2.2 Boundary Conditions and Eigenvalue Equations 23 2.2.3 Weakly Guiding Approximation, Hybrid Modes, and Linear Polarized Modes 26 2.2.4 Field Distribution and Polarization Characteristics 29 2.2.5 Multimode Fiber and Cladding Modes 35 2.2.6 Propagation of Optical Pulses in Optical Fibers 39 2.3 Basic Theory of the Gradient-Index Optical Fiber 42 2.3.1 Ray Equation in Inhomogeneous Media 42 2.3.2 Ray Optics of GRIN Fiber 46 2.3.3 Wave Optics of GRIN Fiber 51 2.3.4 Basic Characteristics of Gradient Index Lens 56 2.4 Special Optical Fibers 57 2.4.1 Rare-Earth-Doped Fibers and Double-Cladding Fibers 57 2.4.2 Polarization Maintaining Fibers 60 2.4.3 Photonic Crystal Fiber and Microstructure Fiber 64 Problems 69 References 71 3 Fiber Sensitivities and Fiber Devices 76 3.1 Fiber Sensitivities to Physical Conditions 76 3.1.1 Sensitivity to Axial Strain 77 3.1.2 Sensitivity to Lateral Pressure 78 3.1.3 Bending-Induced Birefringence 83 3.1.4 Torsion-Induced Polarization Mode Cross-Coupling 87 3.1.5 Bending Loss 91 3.1.6 Vibration and Mechanical Waves in Fiber 95 3.1.7 Sensitivity to Temperature 96 3.2 Fiber Couplers 97 3.2.1 Structures and Fabrications of 2×2 Couplers 98 3.2.2 Basic Characteristics and Theoretical Analyses of the Coupler 99 3.2.3 N×N and 1×N Fiber Star Couplers 110 3.2.4 Coupling in Axial Direction and Tapered Fiber 114 3.3 Fiber Loop Devices Incorporated with Couplers 118 3.3.1 Fiber Sagnac Loops 118 3.3.2 Fiber Rings 126 3.3.3 Fiber Mach–Zehnder Interferometers and Michelson Interferometers 131 3.3.4 Fiber Loops Incorporated with 3×3 Couplers 135 3.4 Polarization Characteristics of Fibers 142 3.4.1 Polarization State Evolution in Fibers 142 3.4.2 Basic Characteristics of Polarization Mode Dispersion 154 3.4.3 Spun Fiber and Circular Birefringence Fiber 157 3.4.4 Faraday Rotation and Optical Activity 159 3.5 Fiber Polarization Devices 162 3.5.1 Fiber Polarizers 162 3.5.2 Fiber Polarization Controller 165 3.5.3 Fiber Depolarizer and Polarization Scrambler 166 3.5.4 Fiber Optical Isolator and Circulator 170 Problems 172 References 174 4 Fiber Gratings and Related Devices 183 4.1 Introduction to Fiber Gratings 183 4.1.1 Basic Structure and Principle 183 4.1.2 Photosensitivity of Optical Fiber 186 4.1.3 Fabrication and Classifications of Fiber Gratings 190 4.2 Theory of Fiber Grating 194 4.2.1 Theory of Uniform FBG 194 4.2.2 Theory of Long-Period Fiber Grating 202 4.2.3 Basic Theory of Nonuniform Fiber Gratings 208 4.2.4 Inverse Engineering Design 214 4.2.5 Apodization of Fiber Grating 219 4.3 Special Fiber Grating Devices 222 4.3.1 Multisection FBGs 222 4.3.2 Chirped Fiber Bragg Grating 233 4.3.3 Tilted Fiber Bragg Gratings 236 4.3.4 Polarization Maintaining Fiber Gratings 243 4.3.5 In-Fiber Interferometers and Acoustic Optic Tunable Filter 246 4.4 Fiber Grating Sensitivities and Fiber Grating Sensors 249 4.4.1 Sensitivities of Fiber Gratings 250 4.4.2 Tunability of Fiber Gratings 252 4.4.3 Packaging of Fiber Grating Devices 255 4.4.4 Fiber Grating Sensor Systems and Their Applications 259 Problems 263 References 266 5 Distributed Optical Fiber Sensors 278 5.1 Optical Scattering in Fiber 278 5.1.1 Elastic Optical Scattering 279 5.1.2 Inelastic Optical Scattering 281 5.1.3 Stimulated Raman Scattering and Stimulated Brillouin Scattering 285 5.2 Distributed Sensors Based on Rayleigh Scattering 286 5.2.1 Optical Time Domain Reflectometer 286 5.2.2 Polarization OTDR 292 5.2.3 Coherent OTDR and Phase Sensitive OTDR 294 5.2.4 Optical Frequency Domain Reflectometry 298 5.3 Distributed Sensors Based on Raman Scattering 300 5.3.1 Raman Scattering in Fiber 301 5.3.2 Distributed Anti-Stokes Raman Thermometry 304 5.3.3 Frequency Domain DART 307 5.4 Distributed Sensors Based on Brillouin Scattering 308 5.4.1 Brillouin Scattering in Fiber 308 5.4.2 Brillouin Optical Time Domain Reflectrometer 312 5.4.3 Brillouin Optical Time Domain Analyzer 316 5.5 Distributed Sensors Based on Fiber Interferometers 322 5.5.1 Configuration and Characteristics of Interferometric Fiber Sensors 323 5.5.2 Low Coherence Technology in a Distributed Sensor System 327 5.5.3 Sensors Based on Speckle Effect and Mode Coupling in Multimode Fiber 331 Problems 335 References 337 6 Fiber Sensors With Special Applications 351 6.1 Fiber Optic Gyroscope 351 6.1.1 Interferometric FOG 352 6.1.2 Brillouin Laser Gyro and Resonance Fiber Optic Gyroscope 362 6.2 Fiber Optic Hydrophone 364 6.2.1 Basic Structures 365 6.2.2 Sensor Arrays and Multiplexing 370 6.2.3 Low Noise Laser Source 372 6.3 Fiber Faraday Sensor 373 6.3.1 Faraday Effect in Fiber 374 6.3.2 Electric Current Sensor Based on Faraday Rotation 376 6.4 Fiber Sensors Based on Surface Plasmon Effect 379 6.4.1 Surface Plasmon Effect 379 6.4.2 Sensors Based on SPW 383 Problems 386 References 387 7 Extrinsic Fiber Fabry–Perot Interferometer Sensor 395 7.1 Basic Principles and Structures of Extrinsic Fiber F-P Sensors 395 7.1.1 Structures of EFFP Devices 396 7.1.2 Basic Characteristics of a Fabry–Perot Interferometer 398 7.2 Theory of a Gaussian Beam Fabry–Perot Interferometer 401 7.2.1 Basic Model and Theoretical Analysis 401 7.2.2 Approximation as a Fizeau Interferometer 404 7.3 Basic Characteristics and Performances of EFFPI Sensors 406 7.3.1 Sensitivity of an EFFPI Sensor 406 7.3.2 Linear Range and Dynamic Range of Measurement 408 7.3.3 Interrogation and Stability 410 7.3.4 Frequency Response 413 7.4 Applications of the EFFPI Sensor and Related Techniques 417 7.4.1 Localization of the Sound Source 417 7.4.2 Applications in an Atomic Force Microscope 418 7.4.3 More Application Examples 419 Problems 421 References 422 Appendices 427 Appendix 1 Mathematical Formulas 427 A1.1 Bessel Equations and Bessel Functions 427 A1.2 Runge–Kutta Method 432 A1.3 The First-Order Linear Differential Equation 433 A1.4 Riccati Equation 433 A1.5 Airy Equation and Airy Functions 434 Appendix 2 Fundamentals of Elasticity 435 A2.1 Strain, Stress, and Hooke’s Law 435 A2.2 Conversions Between Coordinates 438 A2.3 Plane Deformation 440 A2.4 Equilibrium of Plates and Rods 443 A2.5 Photoelastic Effect 446 Appendix 3 Fundamentals of Polarization Optics 446 A3.1 Polarized Light and Jones Vector 446 A3.2 Stokes Vector and Poincar´e Sphere 447 A3.3 Optics of Anisotropic Media 449 A3.4 Jones Matrix and Mueller Matrix 450 A3.5 Measurement of Jones Vector and Stokes Vector 453 Appendix 4 Specifications of Related Materials and Devices 454 A4.1 Fiber Connectors 456 Index 459

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Book SynopsisCompiling the authors? combined decades of experience, Microwave Noncontact Motion Sensing and Analysis sheds light on microwave noncontact vital sign detection from bench-top module to CMOS integrated microchip, covering a frequency range of over 30 GHz.Table of ContentsPreface xi 1 Introduction 1 1.1 Background, 1 1.2 Recent Progress on Microwave Noncontact Motion Sensors, 2 1.2.1 Microwave/Millimeter-Wave Interferometer and Vibrometer, 2 1.2.2 Noncontact Vital Sign Detection, 3 1.3 About This Book, 4 2 Theory of Microwave Noncontact Motion Sensors 7 2.1 Introduction to Radar, 7 2.1.1 Antennas, 8 2.1.2 Propagation and Antenna Gain, 10 2.1.3 Radio System Link and Friis Equation, 13 2.1.4 Radar Cross Section and Radar Equation, 15 2.1.5 Radar Signal-To-Noise Ratio, 16 2.1.6 Signal-Processing Basics, 17 2.2 Mechanism of Motion Sensing Radar, 18 2.2.1 Doppler Frequency Shift, 18 2.2.2 Doppler Nonlinear Phase Modulation, 19 2.2.3 Pulse Radar, 26 2.2.4 FMCW Radar, 27 2.2.5 Comparison of Different Detection Mechanisms, 29 2.3 Key Theory and Techniques of Motion Sensing Radar, 31 2.3.1 Null and Optimal Detection Point, 31 2.3.2 Complex Signal Demodulation, 33 2.3.3 Arctangent Demodulation, 34 2.3.4 Double-Sideband Transmission, 36 2.3.5 Optimal Carrier Frequency, 43 2.3.6 Sensitivity: Gain and Noise Budget, 49 3 Hardware Development of Microwave Motion Sensors 53 3.1 Radar Transceiver, 53 3.1.1 Bench-Top Radar Systems, 53 3.1.2 Board Level Radar System Integration, 61 3.1.3 Motion Sensing Radar-On-Chip Integration, 63 3.1.4 Pulse-Doppler Radar and Ultra-Wideband Technologies, 85 3.1.5 FMCW Radar, 89 3.2 Radar Transponders, 92 3.2.1 Passive Harmonic Tag, 93 3.2.2 Active Transponder for Displacement Monitoring, 95 3.3 Antenna Systems, 99 3.3.1 Phased Array Systems, 99 3.3.2 Broadband Antenna, 100 3.3.3 Helical Antenna, 103 4 Advances in Detection and Analysis Techniques 107 4.1 System Design and Optimization, 107 4.1.1 Shaking Noise Cancellation Using Sensor Node Technique, 107 4.1.2 DC-Coupled Displacement Radar, 111 4.1.3 Random Body Movement Cancellation Technique, 116 4.1.4 Nonlinear Detection of Complex Vibration Patterns, 124 4.1.5 Motion Sensing Based on Self-Injection-Locked Oscillators, 131 4.2 Numerical Methods: Ray-Tracing Model, 136 4.3 Signal Processing, 141 4.3.1 MIMO, MISO, SIMO Techniques, 141 4.3.2 Spectral Estimation Algorithms, 142 4.3.3 Joint Time–Frequency Signal Analysis, 153 5 Applications and Future Trends 157 5.1 Application Case Studies, 158 5.1.1 Assisted Living and Smart Homes, 158 5.1.2 Sleep Apnea Diagnosis, 164 5.1.3 Wireless Infant Monitor, 169 5.1.4 Measurement of Rotational Movement, 173 5.1.5 Battlefield Triage and Enemy Detection, 178 5.1.6 Earthquake and Fire Emergency Search and Rescue, 179 5.1.7 Tumor Tracking in Radiation Therapy, 180 5.1.8 Structural Health Monitoring, 185 5.2 Development of Standards and State of Acceptance, 194 5.3 Future Development Trends, 196 5.4 Microwave Industry Outlook, 202 References 203 Index 215

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Book SynopsisIntroducing several important and useful methods for analyzing planar transmission line structures, this text discusses such topics as the theory and applications of Green's functions, the conformal mapping method, spectral domain methods, variational methods.Trade Review"...this book introduces the most commonly used techniques for analyzing microwave planar transmission live structures." (SciTech Book News, Vol. 25, No. 2, June 2001) "All important fundamental concepts and principles are covered as far as is possible with in a text of reasonable size...addresses student of electromagnetic theory...also...the engineer who is need of knowledge and practical, easy-to-apply formulas for the various line systems." (Measurement Science & Technology, Vol. 12, No. 10, October 2001) "...covers the analysis methods...from basics to advanced levels. All important fundamental concepts and principles are covered as far as is possible within a text of reasonable size." (Measurement Science & Technology, Vol. 12, No. 10, October 2001)Table of ContentsFundamentals of Electromagnetic Theory. Green's Function. Planar Transmission Lines. Conformal Mapping. Variational Methods. Spectral-Domain Method. Mode-Matching Method. Index.

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Book SynopsisA comprehensive overview of microstrip and printed antennas-antennas that have been the subject of much research in recent years due to their potential applications in communications and radar systems.Table of ContentsProbe-Fed Microstrip Antennas (K. Lee, et al.). Aperture-Coupled Multilayer Microstrip Antennas (K. Luk, et al.). Microstrip Arrays: Analysis, Design, and Applications (J. Huang & D. Pozar). Dual and Circularly Polarized Microstrip Antennas (P. Hall & J. Dahele). Computer-Aided Design of Rectangular Microstrip Antennas (D. Jackson, et al.). Multifunction Printed Antennas (J. James & G. Andrasic). Superconducting Microstrip Antennas (J. Williams, et al.). Active Microstrip Antennas (J. Navarro & K. Chang). Tapered Slot Antenna (R. Lee & R. Simons). Efficient Modeling of Microstrip Antennas Using the Finite-Difference Time-Domain Method (S. Chebolu, et al.). Analysis of Dielectric Resonator Antennas (K. Luk, et al.). References. Index.

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Book SynopsisThis is the first book to provide comprehensive coverage of hardware and circuit design specifically for engineers working in wireless communications. It serves as a reference for practicing engineers and technicians working in the areas of RF, microwaves, communications, solid-state devices, and radar.Table of ContentsPreface. Introduction. General Wireless Systems. Overview of Active Devices and Circuit Technologies. Transmitter and Receiver System Parameters. Transmission Lines and Impedance Matching Techniques. Filters and Couplers. Switches. Low Noise Amplifiers. Mixers. Oscillators and Modulation. Power Amplifiers. Antennas. Index.

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Book Synopsis...Ben has been the world-wide guru of this technology, providing support to applications of all types. His genius lies in handling the extremely complex mathematics, while at the same time seeing the practical matters involved in applying the results. As this book clearly shows, Ben is able to relate to novices interested in using frequency selective surfaces and to explain technical details in an understandable way, liberally spiced with his special brand of humor... Ben Munk has written a book that represents the epitome of practical understanding of Frequency Selective Surfaces. He deserves all honors that might befall him for this achievement. -William F. Bahret. Mr. W. Bahret was with the United States Air Force but is now retired. From the early 50s he sponsored numerous projects concerning Radar Cross Section of airborne platforms in particular antennas and absorbers. Under his leadership grew many of the concepts used extensively today, as for example the metallic radTrade Review"...well-organized and worth reading...The analysis and design concepts, as well as physical insight, presented in this book would provide the reader a great benefit." (IEEE Circuits & Devices Magazine, Jan/Feb 2005) "This book provides: a complete derivation of the Periodic Method of Moments, band pass and bandstop filters..." (IEE Signal Processing, Vol. 18, No. 1, January 2001)Table of ContentsGeneral Overview. Element Types: A Comparison. Evaluating Periodic Structures: An Overview. Spectral Expansion of One- and Two-Dimensional Periodic Structures. Dipole Arrays in a Stratified Medium. Slot Arrays in a Stratified Medium. Band-Pass Filter Designs: The Hybrid Radome. Band-Stop and Dichroic Filter Designs. Jaumann and Circuit Analog Absorbers. Power Handling of Periodic Surfaces. Concluding Remarks and Future Trends. Appendices. References. Index.

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Book SynopsisEmphasizes electromagnetic and microwave problems and the fundamental algorithms which can be used as the basis for computer programs that produce useful numerical results. Includes relevant computer project descriptions in related chapters. A requirement for any student doing work in electromagnetics.Table of ContentsFinite-Difference Method. Finite-Difference Determination of Eigenvalues. Finite-Difference Time-Domain Method. Variational and Related Methods. Finite-Element Method. Method of Moments. Scattering Solutions by Mehtod of Moments. Spectral Analysis with Fourier Series and Fourier Integral. Spectral Analysis of Microstrip Transmission Lines. Spectral Analysis of Microstrip Circuits. Mode Matching. Concluding Comments. Index.

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Book SynopsisNoise theory is continuing to gain momentum as a leading topic.Developments in the field are proving increasingly important to theelectronics engineer or researcher specialising in communicationsand microwave engineering. This text provides a comprehensiveoverview of noise theory in linear and nonlinear circuits andserves as a practical guide for engineers designing circuits wherenoise is a significant factor. Features include: * A practical approach to the design of noise circuits * Graphical representations of noise quantities * Definition of all noise quantities for both active and passivecircuits * Formulae for the conversion of different sets of noiseparameters * Equations derived for the overall noise parameters of embeddednoisy networks * Determination of Volterra transfer functions of nonlinearmulti-port networks containing multi-dimensionalnonlinearities * Analysis of noise theory in nonlinear networks based on themultiTable of ContentsLINEAR SYSTEMS. Some Milestones in the Development of Noise Theory. Noise in One-Ports. Noise Characteristics of Multi-Ports. Noise Parameters. Noise Measure and Graphic Representations. Noise of Embedded Networks. NON-LINEAR SYSTEMS. Noise in Non-Linear Systems: Theory. Noise in Non-Linear Systems: Examples and Conclusion. Multi-Port Volterra Transfer Functions. Appendices.

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Book SynopsisThe waveguide junction circulator is a microwave circuit used in antennae in mobile cellular telephones, radars, amplifiers and other microwave equipment. This volume bridges the important interface between the theory and practice of circulators for waveguide arrangement.Table of ContentsPreface ix 1 Architecture of Symmetrical Waveguide Junction Circulators 1 2 Scattering Matrix of m-Port Circulator 23 3 Eigenvalue Adjustment pf 3-Port Circulator 39 4 Impedance Matrix of Junction Circulator 57 5 The Post Gyromagnetic Resonator 77 6 Okada Resonator 89 7 Isotropic, Anisotropic and Gyromagnetic Circular Waveguides 109 8 Isotropic, Anisotropic Open Circular Wavelengths 139 9 The Dialectric Cavity Resonator 155 10 The Gyromagnetic Cavity Resonator 179 11 Impedance in Rectangular, Ridge and Radial Waveguides 199 12 Junction Circular Using Post Resonators 229 13 Complex Gyrator Circuit of a Waveguide Junction Circulator using an Okada Resonator 255 14 Degree-1 and 2 Okada Circulators 279 15 An Evanescent Mode Okada Junction Circulator 297 16 Complex Gyrator Circuit of an H-Plane Junction Circulator using an Okada Resonator 311 17 Complex Gyrator Circuit of an Evanescent-Mode E-Plane Junction Circulator using H-Plane Turnstile Resonators 339 18 Waveguide Circulators using Triangular and Prism Resonators 359 19 Synthesis of Quarter-Wave Coupled Junction Circulators with Degrees 1 and 2 Complex Gyrator Circuits 379 20 The 4-Port Single Junction Waveguide Circulator 399 21 Microwave Switching using Junction Circulators 431 22 Insertion Loss of Waveguide Circulators 431 23 Synthesis of Stepped Impedance Transducers 445 24 Experimental Evaluation of Junction Circulators 471 25 Circulator Specifications 489 26 Gyromagnetic Effect in Magnetic Insulator 511 Index 537

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Book SynopsisThis invaluable book provides a comprehensive framework for the formulation and solution ofnumerous problems involving the radiation, reception, propagation, and scattering of electromagnetic and acoustic waves. Filled with original derivations and theorems, it includes the first rigorous development of plane-wave expansions for time-domain electromagnetic and acoustic fields. For the past 35 years, near-field measurement techniques have been confined to the frequency domain. Now, with the publication of this book, probe-corrected near-field measurement techniques have been extended to ultra-wide-band, short-pulse transmitting and receiving antennas and transducers. By combining unencumbered straightforward derivations with in-depth expositions of prerequisite material, the authors have created an invaluable resource for research scientists and engineers in electromagnetics and acoustics, and a definitive reference on plane-wave expansions and near-field measuTable of ContentsPreface. Acknowledgments. Introduction. Electromagnetic and Acoustic Field Equations. Frequency-Domain Representations. Static Electric and Magnetic Fields. Time-Domain Representations. Probe Correction in the Frequency Domain. Probe Correction in the Time Domain. Sampling Theorems and Computation Schemes. Appendix A: Uniqueness of Solution to Laplace's Equation. Appendix B: Proofs of Theorems 2-I and 2-II. Appendix C: Uniqueness of Solution to the Scalar Helmholtz Equation. Appendix D: Validation of the Plane-Wave Spectrum Representation. References. Glossary of Symbols. Index. About the Authors.

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Book SynopsisElectrical Engineering High-Power Microwave Sources and Technologies A volume in the IEEE Press Series on RF and Microwave Technology Roger D. Pollard and Richard Booton, Series Editors Written by a prolific group of leading researchers, High-Power Microwave Sources and Technologies focuses primarily on the high-power microwave (HPM) technology most appropriate for military applications. It highlights the advances achieved from 1995 to 2000 as the result of a US Department of Defense (DoD) funded, $15 million Multidisciplinary University Research Initiative (MURI) program. The grant created a synergy between researchers in the DoD laboratories and the academic community, and established links with the microwave vacuum electronics industry, which has led to unprecedented collaborations that transcend laboratory and disciplinary boundaries. This essential reference provides the history, state-of-the-art, and possible future of HPM source research and technologies. The first alternative tTrade Review"...important and unique..." (Microwave Journal, 2003)Table of ContentsForeword by Dr. Delores Etter. Preface. Acknowledgments. List of Contributors. List of Acronyms and Abbreviations. Introduction. HPM Sources: The DOD Perspective. Gigawatt-Class Sources. Pulse Shortening. Relativistic erenkov Devices. Gyrotron Oscillators and Amplifiers. Active Plasma Loading of HPM Devices. Beam Transport and RF Control. Cathodes and Electron Guns. Windows and RF Breakdown. Computational Techniques. Alternative Approaches and Future Challenges. Index. About the Editors.

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Book SynopsisRF and Microwave Circuit Design Provides up-to-date coverage of the fundamentals of high-frequency microwave technology, written by two leading voices in the field RF and Microwave Circuit Design: Theory and Applications is an authoritative, highly practical introduction to basic RF and microwave circuits. With an emphasis on real-world examples, the text explains how distributed circuits using microstrip and other planar transmission lines can be designed and fabricated for use in modern high-frequency passive and active circuits and sub-systems. The authors provide clear and accurate guidance on each essential aspect of circuit design, from the theory of transmission lines to the passive and active circuits that form the basis of modern high-frequency circuits and sub-systems. Assuming a basic grasp of electronic concepts, the book is organized around first principles and includes an extensive set of worked examples to guide student readers with no priTable of ContentsPreface 1. RF Transmission lines 1.0 Introduction 1.1 Voltage, current and impedance relationships on a transmission line 1.2 Propagation constant 1.2.1 Dispersion 1.2.2 Amplitude distortion 1.3 Lossless transmission lines 1.4 Matched and mismatched transmission lines 1.5 Waves on a transmission line 1.6 The Smith chart 1.6.1 Derivation of the chart 1.6.2 Properties of the chart 1.7 Stubs 1.8 Distributed matching circuits 1.9 Manipulation of lumped impedance using the Smith chart 1.10 Lumped impedance matching 1.10.1 Matching a complex load impedance to a real source impedance 1.10.2 Matching a complex load impedance to a complex source impedance 1.11 Equivalent lumped circuit of a lossless transmission line 1.12 Supplementary problems 1.13 Appendices Appendix A1.1 Coaxial cable A1.1.1 Electromagnetic field patterns in coaxial cable A1.1.2 Essential properties of coaxial cables Appendix A1.2 Coplanar waveguide A1.2.1 Structure of coplanar waveguide (CPW) A1.2.2 Electromagnetic field distribution on a CPW line A1.2.3 Essential properties of coplanar (CPW) lines A1.2.4 Summary of key points relating to CPW lines Appendix A1.3 Metal waveguide A1.3.1 Waveguide principles A1.3.2 Waveguide propagation A1.3.3 Rectangular waveguide modes A1.3.4 The waveguide equation A1.3.5 Phase and group velocities A1.3.6 Field theory analysis of rectangular waveguides A1.3.7 Waveguide impedance A1.3.8 Higher-order rectangular waveguide modes A1.3.9 Waveguide attenuation A1.3.10 Sizes of rectangular waveguide, and waveguide designation A1.3.11 Circular waveguide Appendix A1.4 Microstrip Appendix A1.5 Equivalent lumped circuit representation of a transmission line References 2. Planar Circuit Design I: Designing using Microstrip 2.0 Introduction 2.1 Electromagnetic field distribution across a microstrip line 2.2 Effective relative permittivity, 2.3 Microstrip design graphs and CAD software 2.4 Operating frequency limitations 2.5 Skin depth 2.6 Examples of microstrip components 2.6.1 Branch-line coupler 2.6.2 Quarter-wave transformer 2.6.3 Wilkinson power divider 2.7 Microstrip coupled-line structures 2.7.1 Analysis of microstrip coupled lines 2.7.2 Microstrip directional couplers 2.7.2.1 Design of microstrip directional couplers 2.7.2.2 Directivity of microstrip directional couplers 2.7.2.3 Improvements to microstrip directional couplers 2.7.3 Examples of other common microstrip coupled-line structures 2.7.3.1 Microstrip DC break 2.7.3.2 Edge-coupled microstrip band-pass filter 2.7.3.3 Lange coupler 2.8 Summary 2.9 Supplementary problems 2.10 Appendix A2.1: Microstrip design graphs References 3. Fabrication processes for RF and microwave circuits 3.1 Introduction 3.2 Review of essential materials parameters 3.2.1 Dielectrics 3.2.2 Conductors 3.3 Requirements for RF circuit materials 3.4 Fabrication of planar high-frequency circuits 3.4.1 Etched circuits 3.4.2 Thick-film circuits (direct screen printed) 3.4.3 Thick-film circuits (using photoimageable materials) 3.4.4 LTCC (low temperature co-fired ceramic) circuits 3.4.5 Use of ink jet technology 3.5 Characterization of materials for RF and microwave circuits 3.5.1 Measurement of dielectric loss and dielectric constant 3.5.1.1 Cavity resonators 3.5.1.2 Dielectric characterization by cavity perturbation 3.5.1.3 Use of the split post dielectric resonator (SPDR) 3.5.1.4 Open-resonator 3.5.1.5 Free-space transmission measurements 3.5.2 Measurement of planar line properties 3.5.2.1 The microstrip resonant ring 3.5.2.2 Non-resonant lines 3.5.3 Physical properties of microstrip lines 3.6 Supplementary problems references 4. Planar Circuit Design II: Refinements to basic designs 4.1 Introduction 4.2 Discontinuities in microstrip 4.2.1 Open-end effect 4.2.2 Step width 4.2.3 Corners 4.2.4 Gaps 4.2.5 T-junctions 4.3 Microstrip enclosures 4.4 Packaged lumped-element passive components 4.4.1 Typical packages for RF passive components 4.4.2 Lumped-element resistors 4.4.3 Lumped-element capacitors 4.4.4 Lumped-element inductors 4.5 Miniature planar components 4.5.1 Spiral inductors 4.5.2 Loop inductors 4.5.3 Interdigitated capacitors 4.5.4 MIM (metal-insulator-metal) capacitors 4.6 Appendix 4.1: Insertion loss due to a microstrip gap References 5. S-parameters 5.1 Introduction 5.2 S-parameter definitions 5.3 Signal flow graphs 5.4 Mason’s non-touching loop rule 5.5 Reflection coefficient of a 2-port network 5.6 Power gains of two-port networks 5.7 Stability 5.8 Supplementary Problems 5.9 Appendix A5.1 Relationships between network parameters A5.1.1 Transmission parameters (ABCD parameters) A5.1.2 Admittance parameters (Y-parameters) A5.1.3 Impedance parameters (Z-parameters) References 6. Microwave Ferrites 6.1 Introduction 6.2 Basic properties of ferrite materials 6.2.1 Ferrite materials 6.2.2 Precession in ferrite materials 6.2.3 Permeability tensor 6.2.4 Faraday rotation 6.3 Ferrites in metallic waveguide 6.3.1 Resonance isolator 6.3.2 Field displacement isolator 6.3.3 Waveguide circulator 6.4 Ferrites in planar circuits 6.4.1 Planar circulators 6.4.2 Edge-guided-mode propagation 6.4.3 Edge-guided-mode isolator 6.4.4 Phase shifters 6.5 Self-biased ferrites 6.6 Supplementary problems References 7. Measurements 7.1 Introduction 7.2 RF and Microwave connectors 7.2.1 Maintenance of connectors 7.2.2 Connecting to planar circuits 7.3 Microwave vector network analyzers 7.3.1 Description and configuration 7.3.2 Error models representing a VNA 7.3.3 Calibration of a VNA 7.4 On-wafer measurements 7.5 Summary References 8. RF Filters 8.1 Introduction 8.2 Review of filter responses 8.3 Filter parameters 8.4 Design strategy for RF and microwave filters 8.5 Multi-element low-pass filter 8.6 Practical filter responses 8.7 Butterworth (or maximally-flat) response 8.7.1 Butterworth low-pass filter 8.7.3 Butterworth band-pass filter 8.7.3 Butterworth band-pass filter 8.8 Chebyshev (equal ripple) response 8.9 Microstrip low-pass filter, using stepped impedances 8.10 Microstrip low-pass filter, using stubs 8.11 Microstrip edge-coupled band-pass filters 8.12 Microstrip end-coupled band-pass filters 8.13 Practical points associated with filter design 8.14 Summary 8.15 Supplementary problems 8.16 Appendix A8.1 Equivalent lumped T-network representation of a transmission line References 9. Microwave Small-Signal Amplifiers 9.1 Introduction 9.2 Conditions for matching 9.3 Distributed (microstrip) matching networks 9.4 DC biasing circuits 9.5 Microwave transistor packages 9.6 Typical hybrid amplifier 9.7 DC finger breaks 9.8 Constant gain circles 9.9 Stability circles 9.10 Noise circles 9.11 Low-noise amplifier design 9.12 Simultaneous conjugate match 9.13 Broadband matching 9.14 Summary 9.15 Supplementary problems References 10. Switches and Phase Shifters 10.1 Introduction 10.2 Switches 10.2.1 PIN diodes 10.2.2 FETs (Field Effect Transistors) 10.2.3 MEMS (Microelectromechanical Systems) 10.2.4 IPCS (Inline Phase Change Switch) devices 10.3 Digital phase shifters 10.3.1 Switched-path phase shifter 10.3.2 Loaded-line phase shifter 10.3.3 Reflection-type phase shifter 10.3.4 Schiffman 90 phase shifter 10.3.5 Single switch phase shifter 10.4 Supplementary problems References 11. Oscillators 11.1 Introduction 11.2 Criteria for oscillation in a feedback circuit 11.3 RF (transistor) oscillators 11.3.1 Colpitts oscillator 11.3.2 Hartley Oscillator 11.3.3 Clapp-Gouriet Oscillator 11.4 Voltage controlled oscillator (VCO) 11.5 Crystal-controlled oscillators 11.5.1 Crystals 11.5.2 Crystal-controlled oscillators 11.6 Frequency synthesizers 11.6.1 The phase-locked loop 11.6.1.1 Principle of a phase-locked loop 11.6.1.2 Main components of a phase-locked loop 11.6.1.3 Gain of a phase-locked loop 11.6.1.4 Transient analysis of a phase-locked loop 11.6.2 Indirect frequency synthesizer circuits 11.7 Microwave oscillators 11.7.1 Dielectric resonator oscillator 11.7.2 Delay line stabilized oscillator 11.7.3 Diode oscillators 11.7.3.1 Gunn diode oscillator 11.7.3.2 IMPATT diode oscillator 11.8 Oscillator noise 11.9 Measurement of oscillator noise 11.10 Supplementary problems References 12. RF and Microwave Antennas 12.1 Introduction 12.2 Antenna parameters 12.3 Spherical polar coordinates 12.4 Radiation from a Hertzian dipole 12.4.1 Basic principles 12.4.2 Gain of a Hertzian dipole 12.5 Radiation from a half-wave dipole 12.5.1 Basic principles 12.5.2 Gain of a half-wave dipole 12.5.3 Summary of the properties of a half-wave dipole 12.6 Antenna arrays 12.7 Mutual impedance 12.8 Arrays containing parasitic elements 12.9 Yagi-Uda array 12.10 Log-periodic array 12.11 Loop antenna 12.12 Planar antennas 12.12.1 Linearly polarized patch antennas 12.12.2 Circularly polarized planar antennas 12.13 Horn antennas 12.14 Parabolic reflector antennas 12.15 Slot radiators 12.16 Supplementary problems 12.17 Appendix: Microstrip design graphs for substrates with r = 2.3 References 13. Power Amplifiers and Distributed Amplifiers 13.1 Introduction 13.2 Power amplifiers 13.2.1 Overview of power amplifier parameters 13.2.1.1 Power gain 13.2.1.2 Power added efficiency (PAE) 13.2.1.3 Input and output impedances 13.2.2 Distortion 13.2.2.1 Gain compression 13.2.2.2 Third-order intercept point 13.2.3 Linearization 13.2.3.1 Pre-distortion 13.2.3.2 Negative feedback 13.2.3.3 Feedforward 13.2.4 Power combining 13.2.5 Doherty amplifier 13.3 Load matching of power amplifiers 13.4 Distributed amplifiers 13.4.1 Description and principle of operation 13.4.2 Analysis 13.5 Developments in materials and packaging for power amplifiers References 14. Receivers and Sub-Systems 14.1 Introduction 14.2 Receiver noise sources 14.2.1 Thermal noise 14.2.2 Semiconductor noise 14.3 Noise measures 14.3.1 Noise figure (F) 14.3.2 Noise temperature (Te) 14.4 Noise figure of cascaded networks 14.5 Antenna noise temperature 14.6 System noise temperature 14.7 Noise figure of a matched attenuator 14.8 Superhet receiver 14.8.1 Single-conversion superhet receiver 14.8.2 Image frequency 14.8.3 Key figures-of-merit for a superhet receiver 14.8.4 Double-conversion superhet receiver 14.8.5 Noise budget graph for a superhet receiver 14.9 Mixers 14.9.1 Basic mixer principles 14.9.2 Mixer parameters 14.9.3 Active and passive mixers 14.9.4 Single-ended diode mixer 14.9.5 Single balanced mixer 14.9.6 Double balanced mixer 14.9.7 Active FET mixers 14.10 Supplementary problems 14.11 Appendices Appendix A14.1 Error function table Appendix A14.2 Measurement of noise figure References Answers to selected supplementary problems

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Book SynopsisThis groundbreaking volume covers the significant advantages of wave technologies in the development of innovative machine building where high technologies with appreciable economic effect are applied. These technologies cover many industries, including the oil-and-gas industry, refining and other chemical processing, petrochemical industry, production of new materials, composite and nano-composites including, construction equipment, environmental protection, pharmacology, power generation, and many others. The technological problem of grinding, fine-scale grinding and activation of solid particles (dry blends) is disclosed. This task is common for the production of new materials across these various industries. At present in this sphere the traditional methods have reached their limits and in some cases are economically ineffective from both scientific and practical points of view. The authors have detailed, through their extensive groundbreaking research, how these new methTable of ContentsPreface xi1 Introduction: Capabilities and Perspectives of Wave Technologies in Industries and in Nanotechnologies 12 Fragmentation and Activation of Dry Solid Components: Wave Turbulization of the Medium and Increasing Process Efficiency 112.1 Calcium Carbonate (limestone) Fragmentation 172.2 Wave Activation of Cements and Cement-limestone Compositions 212.3 Grinding Blast-furnace Sullage 252.4 Production of Coloring Pigment Based on Titanium Dioxide and Dolomitic Marble 272.5 Wave Treatment of Aluminium Oxide 293 Wave Stirring (actuation) of Multicomponent Materials (dry mixes) 353.1 Technologic Experiments with Installations of Wave Mixing 414 Wave Metering Devices and Dosage Metering of Loose Components 475 Creating Automated Wave Treatment Trains of Dry Solid Components: High Effi ciency in a Restricted Manufacturing Room 536 Manufacturing and Wave Treatment Technologies of Emulsions, Suspensions and Foam/Skim 596.1 Stirring (actuation) Wave Technologies of Various Liquids, Including High-viscosity Media 626.2 Hydrodynamic Running (through-flowing) Wave Installations 646.3 Wave Technology for Stirring (actuation) of High-viscosity Media 676.4 Production of Cosmetic Cream 726.6 Production of Finely-dispersed, Chemically Precipitated Barium Sulphate With the Assigned Particle Size 756.7 Accelerating Fermentation of Sponge Wheat Dough After Wave Treatment 817 Wave Mixing of Epoxy Resin with Nanocarbon Micro-additives: Production of Composite Materials 877.1 Experimental Studies of Mixing the Epoxy Resin with Fullerenes 887.2 Experimental Studies Mixing Epoxy Resin Technical Carbon 917.3 Experimental Studies of Mixing Epoxy Resin with Carbon Nanotubes 947.4 Production of Highly-fi lled Composite Materials with Wave Technologies 1017.5 Using the Installation of Wave Mixing for the Preparation of Polymer-cement and Cement Composite Materials Reinforced by Polymer and Inorganic Fibers 1047.6 Production of Organoclay 1088 Wave Technologies for Food, Including Bread Baking and Confectionary Industries 1119 Wave Technologies in Oil Production: Improving Oil, Gas and Condensate Yield 11710 Wave Technologies in Ecology and Energetics 12510.1 Production of Mixed Fuels and Improvement in Combustion Effi ciency 12711 Stabilizing Wave Regimes, Damping Noise, Vibration and Hydraulic Shocks Pipeline Systems 13112 Wave Technologies in Engineering 13713 Wave Technologies in Oil Refi ning, Chemical and Petrochemical Industries 14314 Conclusions: On Wave Engineering 147Literature (the Russian-language original is at the end) 153Index 155

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Book SynopsisThis textbook is an introduction to microwave engineering. The scope of this book extends from topics for a first course in electrical engineering, in which impedances are analyzed using complex numbers, through the introduction of transmission lines that are analyzed using the Smith Chart, and on to graduate level subjects, such as equivalent circuits for obstacles in hollow waveguides, analyzed using Green's Functions. This book is a virtual encyclopedia of circuit design methods. Despite the complexity, topics are presented in a conversational manner for ease of comprehension. The book is not only an excellent text at the undergraduate and graduate levels, but is as well a detailed reference for the practicing engineer. Consider how well informed an engineer will be who has become familiar with these topics as treated in High Frequency Techniques: (in order of presentation) Brief history of wireless (radio) and the Morse codeU.S. Radio Frequency AllocatTable of ContentsPreface xv Acknowledgments xvii 1 Introduction 1 1.1 Beginning of Wireless 1 1.2 Current Radio Spectrum 4 1.3 Conventions Used in This Text 8 Sections 8 Equations 8 Figures 8 Exercises 8 Symbols 8 Prefixes 10 Fonts 10 1.4 Vectors and Coordinates 11 1.5 General Constants and Useful Conversions 14 2 Review of AC Analysis and Network Simulation 16 2.1 Basic Circuit Elements 16 The Resistor 16 Ohm’s Law 18 The Inductor 19 The Capacitor 20 2.2 Kirchhoff’s Laws 22 2.3 Alternating Current (AC) Analysis 23 Ohm’s Law in Complex Form 26 2.4 Voltage and Current Phasors 26 2.5 Impedance 28 Estimating Reactance 28 Addition of Series Impedances 29 2.6 Admittance 30 Admittance Definition 30 Addition of Parallel Admittances 30 The Product over the Sum 32 2.7 LLFPB Networks 33 2.8 Decibels, dBW, and dBm 33 Logarithms (Logs) 33 Multiplying by Adding Logs 34 Dividing by Subtracting Logs 34 Zero Powers 34 Bel Scale 34 Decibel Scale 35 Decibels—Relative Measures 35 Absolute Power Levels—dBm and dBW 37 Decibel Power Scales 38 2.9 Power Transfer 38 Calculating Power Transfer 38 Maximum Power Transfer 39 2.10 Specifying Loss 40 Insertion Loss 40 Transducer Loss 41 Loss Due to a Series Impedance 42 Loss Due to a Shunt Admittance 43 Loss in Terms of Scattering Parameters 44 2.11 Real RLC Models 44 Resistor with Parasitics 44 Inductor with Parasitics 44 Capacitor with Parasitics 44 2.12 Designing LC Elements 46 Lumped Coils 46 High μ Inductor Cores—the Hysteresis Curve 47 Estimating Wire Inductance 48 Parallel Plate Capacitors 49 2.13 Skin Effect 51 2.14 Network Simulation 53 3 LC Resonance and Matching Networks 59 3.1 LC Resonance 59 3.2 Series Circuit Quality Factors 60 Q of Inductors and Capacitors 60 QE, External Q 61 QL, Loaded Q 62 3.3 Parallel Circuit Quality Factors 62 3.4 Coupled Resonators 63 Direct Coupled Resonators 63 Lightly Coupled Resonators 63 3.5 Q Matching 67 Low to High Resistance 67 Broadbanding the Q Matching Method 70 High to Low Resistance 71 4 Distributed Circuits 78 4.1 Transmission Lines 78 4.2 Wavelength in a Dielectric 81 4.3 Pulses on Transmission Lines 82 4.4 Incident and Reflected Waves 83 4.5 Reflection Coefficient 85 4.6 Return Loss 86 4.7 Mismatch Loss 86 4.8 Mismatch Error 87 4.9 The Telegrapher Equations 91 4.10 Transmission Line Wave Equations 92 4.11 Wave Propagation 94 4.12 Phase and Group Velocities 97 4.13 Reflection Coefficient and Impedance 100 4.14 Impedance Transformation Equation 101 4.15 Impedance Matching with One Transmission Line 108 4.16 Fano’s (and Bode’s) Limit 109 Type A Mismatched Loads 109 Type B Mismatched Loads 112 Impedance Transformation Not Included 113 5 The Smith Chart 119 5.1 Basis of the Smith Chart 119 5.2 Drawing the Smith Chart 124 5.3 Admittance on the Smith Chart 130 5.4 Tuning a Mismatched Load 132 5.5 Slotted-Line Impedance Measurement 135 5.6 VSWR = r 139 5.7 Negative Resistance Smith Chart 140 5.8 Navigating the Smith Chart 140 5.9 Smith Chart Software 145 5.10 Estimating Bandwidth on the Smith Chart 147 5.11 Approximate Tuning May Be Better 148 5.12 Frequency Contours on the Smith Chart 150 5.13 Using the Smith Chart without Transmission Lines 150 5.14 Constant Q Circles 151 5.15 Transmission Line Lumped Circuit Equivalent 153 6 Matrix Analysis 161 6.1 Matrix Algebra 161 6.2 Z and Y Matrices 164 6.3 Reciprocity 166 6.4 The ABCD Matrix 167 6.5 The Scattering Matrix 172 6.6 The Transmission Matrix 177 7 Electromagnetic Fields and Waves 183 7.1 Vector Force Fields 183 7.2 E and H Fields 185 7.3 Electric Field E 185 7.4 Magnetic Flux Density 187 7.5 Vector Cross Product 188 7.6 Electrostatics and Gauss’s Law 193 7.7 Vector Dot Product and Divergence 194 7.8 Static Potential Function and the Gradient 196 7.9 Divergence of the B Field 200 7.10 Ampere’s Law 201 7.11 Vector Curl 202 7.12 Faraday’s Law of Induction 208 7.13 Maxwell’s Equations 209 Maxwell’s Four Equations 209 Auxiliary Relations and Definitions 210 Visualizing Maxwell’s Equations 211 7.14 Primary Vector Operations 214 7.15 The Laplacian 215 7.16 Vector and Scalar Identities 218 7.17 Free Charge within a Conductor 219 7.18 Skin Effect 221 7.19 Conductor Internal Impedance 224 7.20 The Wave Equation 227 7.21 The Helmholtz Equations 229 7.22 Plane Propagating Waves 230 7.23 Poynting’s Theorem 233 7.24 Wave Polarization 236 7.25 EH Fields on Transmission Lines 240 7.26 Waveguides 246 General Waveguide Solution 246 Waveguide Types 250 Rectangular Waveguide Fields 251 Applying Boundary Conditions 252 Propagation Constants and Waveguide Modes 253 Characteristic Wave Impedance for Waveguides 256 Phase and Group Velocities 257 TE and TM Mode Summary for Rectangular Waveguide 257 7.27 Fourier Series and Green’s Functions 261 Fourier Series 261 Green’s Functions 263 7.28 Higher Order Modes in Circuits 269 7.29 Vector Potential 271 7.30 Retarded Potentials 274 7.31 Potential Functions in the Sinusoidal Case 275 7.32 Antennas 275 Short Straight Wire Antenna 275 Radiation Resistance 279 Radiation Pattern 280 Half-Wavelength Dipole 280 Antenna Gain 283 Antenna Effective Area 284 Monopole Antenna 285 Aperture Antennas 286 Phased Arrays 288 7.33 Path Loss 290 7.34 Electromagnetic (EM) Simulation 294 8 Directional Couplers 307 8.1 Wavelength Comparable Dimensions 307 8.2 The Backward Wave Coupler 307 8.3 Even- and Odd-Mode Analysis 309 8.4 Reflectively Terminated 3-dB Coupler 320 8.5 Coupler Specifications 323 8.6 Measurements Using Directional Couplers 325 8.7 Network Analyzer Impedance Measurements 326 8.8 Two-Port Scattering Measurements 327 8.9 Branch Line Coupler 327 8.10 Hybrid Ring Coupler 330 8.11 Wilkinson Power Divider 330 9 Filter Design 335 9.1 Voltage Transfer Function 335 9.2 Low-Pass Prototype 336 9.3 Butterworth or Maximally Flat Filter 337 9.4 Denormalizing the Prototype Response 339 9.5 High-Pass Filters 343 9.6 Bandpass Filters 345 9.7 Bandstop Filters 349 9.8 Chebyshev Filters 351 9.9 Phase and Group Delay 356 9.10 Filter Q 361 9.11 Diplexer Filters 364 9.12 Top-Coupled Bandpass Filters 367 9.13 Elliptic Filters 369 9.14 Distributed Filters 370 9.15 The Richards Transformation 374 9.16 Kuroda’s Identities 379 9.17 Mumford’s Maximally Flat Stub Filters 381 9.18 Filter Design with the Optimizer 384 9.19 Statistical Design and Yield Analysis 386 Using Standard Part Values 386 The Normal Distribution 387 Other Distributions 391 10 Transistor Amplifier Design 399 10.1 Unilateral Design 399 Evaluating S Parameters 399 Transistor Biasing 400 Evaluating RF Performance 403 10.2 Amplifier Stability 405 10.3 K Factor 409 10.4 Transducer Gain 413 10.5 Unilateral Gain Design 416 10.6 Unilateral Gain Circles 422 Input Gain Circles 422 Output Gain Circles 424 10.7 Simultaneous Conjugate Match Design 428 10.8 Various Gain Definitions 431 10.9 Operating Gain Design 433 10.10 Available Gain Design 437 10.11 Noise in Systems 442 Thermal Noise Limit 442 Other Noise Sources 444 Noise Figure of a Two-Port Network 445 Noise Factor of a Cascade 447 Noise Temperature 448 10.12 Low-Noise Amplifiers 450 10.13 Amplifier Nonlinearity 455 Gain Saturation 455 Intermodulation Distortion 456 10.14 Broadbanding with Feedback 460 10.15 Cascading Amplifier Stages 466 10.16 Amplifier Design Summary 468 Appendices A. Symbols and Units 474 B. Complex Mathematics 478 C. Diameter and Resistance of Annealed Copper Wire by Gauge Size 483 D. Properties of Some Materials 485 E. Standard Rectangular Waveguides 486 Frequently Used Relations 487 Index 491

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Book SynopsisRF/MICROWAVE ENGINEERING AND APPLICATIONS IN ENERGY SYSTEMS An essential text with a unique focus on RF and microwave engineering theory and its applications In RF/Microwave Engineering and Applications in Energy Systems, accomplished researcher Abdullah Eroglu delivers a detailed treatment of key theoretical aspects of radio-frequency and microwave engineering concepts along with parallel presentations of their practical applications. The text includes coverage of recent advances in the subject, including energy harvesting methods, RFID antenna designs, HVAC system controls, and smart grids. The distinguished author provides step-by-step solutions to common engineering problems by way of numerous examples and offers end-of-chapter problems and solutions on each topic. These practical applications of theoretical subjects aid the reader with retention and recall and demonstrate a solid connection between theory and practice. The author also applies common simulation tools in several cTable of ContentsPreface xiii Biography xv Acknowledgments xvii About the Companion Website xix 1 Fundamentals of Electromagnetics 1 1.1 Introduction 1 1.2 Line, Surface, and Volume Integrals 1 1.2.1 Vector Analysis 1 1.2.1.1 Unit Vector Relationship 1 1.2.1.2 Vector Operations and Properties 2 1.2.2 Coordinate Systems 4 1.2.2.1 Cartesian Coordinate System 4 1.2.2.2 Cylindrical Coordinate System 5 1.2.2.3 Spherical Coordinate System 6 1.2.3 Differential Length (dl), Differential Area (ds), and Differential Volume (dv) 8 1.2.3.1 dl, ds, and dv in a Cartesian Coordinate System 8 1.2.3.2 dl, ds, and dv in a Cylindrical Coordinate System 8 1.2.3.3 dl, ds, and dv in a Spherical Coordinate System 9 1.2.4 Line Integral 10 1.2.5 Surface Integral 12 1.2.6 Volume Integral 12 1.3 Vector Operators and Theorems 13 1.3.1 Del Operator 13 1.3.2 Gradient 13 1.3.3 Divergence 15 1.3.4 Curl 16 1.3.5 Divergence Theorem 16 1.3.6 Stokes’ Theorem 19 1.4 Maxwell’s Equations 21 1.4.1 Differential Forms of Maxwell’s Equations 21 1.4.2 Integral Forms of Maxwell’s Equations 22 1.5 Time Harmonic Fields 23 References 25 Problems 25 2 Passive and Active Components 27 2.1 Introduction 27 2.2 Resistors 27 2.3 Capacitors 29 2.4 Inductors 32 2.4.1 Air Core Inductor Design 34 2.4.2 Magnetic Core Inductor Design 36 2.4.3 Planar Inductor Design 37 2.4.4 Transformers 38 2.5 Semiconductor Materials and Active Devices 39 2.5.1 Si 40 2.5.2 Wide-Bandgap Devices 40 2.5.2.1 GaAs 41 2.5.2.2 GaN 41 2.5.3 Active Devices 41 2.5.3.1 BJT and HBTs 41 2.5.3.2 FETs 43 2.5.3.3 MOSFETs 44 2.5.3.4 LDMOS 53 2.5.3.5 High Electron Mobility Transistor (HEMT) 54 2.6 Engineering Application Examples 55 References 62 Problems 63 3 Transmission Lines 71 3.1 Introduction 71 3.2 Transmission Line Analysis 71 3.2.1 Limiting Cases for Transmission Lines 75 3.2.2 Transmission Line Parameters 76 3.2.2.1 Coaxial Line 76 3.2.2.2 Two-wire Transmission Line 80 3.2.2.3 Parallel Plate Transmission Line 80 3.2.3 Terminated Lossless Transmission Lines 81 3.2.4 Special Cases of Terminated Transmission Lines 85 3.2.4.1 Short-circuited Line 85 3.2.4.2 Open-circuited Line 85 3.3 Smith Chart 86 3.3.1 Input Impedance Determination with a Smith Chart 91 3.3.2 Smith Chart as an Admittance Chart 95 3.3.3 ZY Smith Chart and Its Applications 95 3.4 Microstrip Lines 97 3.5 Striplines 104 3.6 Engineering Application Examples 107 References 109 Problems 109 4 Network Parameters 113 4.1 Introduction 113 4.2 Impedance Parameters – Z Parameters 113 4.3 Y Admittance Parameters 116 4.4 ABCD Parameters 117 4.5 h Hybrid Parameters 117 4.6 Network Connections 123 4.7 MATLAB Implementation of Network Parameters 129 4.8 S-Scattering Parameters 141 4.8.1 One-port Network 141 4.8.2 N-port Network 143 4.8.3 Normalized Scattering Parameters 146 4.9 Measurement of S Parameters 154 4.9.1 Measurement of S Parameters for Two-port Network 154 4.9.2 Measurement of S Parameters for a Three-port Network 156 4.10 Chain Scattering Parameters 158 4.11 Engineering Application Examples 160 References 176 Problems 176 5 Impedance Matching 181 5.1 Introduction 181 5.2 Impedance Matching Network with Lumped Elements 181 5.3 Impedance Matching with a Smith Chart – Graphical Method 184 5.4 Impedance Matching Network with Transmission Lines 187 5.4.1 Quarter-wave Transformers 187 5.4.2 Single Stub Tuning 188 5.4.2.1 Shunt Single Stub Tuning 188 5.4.2.2 Series Single Stub Tuning 189 5.4.3 Double Stub Tuning 190 5.5 Impedance Transformation and Matching between Source and Load Impedances 193 5.6 Bandwidth of Matching Networks 195 5.7 Engineering Application Examples 197 References 219 Problems 220 6 Resonator Circuits 223 6.1 Introduction 223 6.2 Parallel and Series Resonant Networks 223 6.2.1 Parallel Resonance 223 6.2.2 Series Resonance 229 6.3 Practical Resonances with Loss, Loading, and Coupling Effects 232 6.3.1 Component Resonances 232 6.3.2 Parallel LC Networks 235 6.3.2.1 Parallel LC Networks with Ideal Components 235 6.3.2.2 Parallel LC Networks with Nonideal Components 236 6.3.2.3 Loading Effects on Parallel LC Networks 237 6.3.2.4 LC Network Transformations 240 6.3.2.5 LC Network with Series Loss 244 6.4 Coupling of Resonators 245 6.5 LC Resonators as Impedance Transformers 249 6.5.1 Inductive Load 249 6.5.2 Capacitive Load 250 6.6 Tapped Resonators as Impedance Transformers 252 6.6.1 Tapped-C Impedance Transformer 252 6.6.2 Tapped-L Impedance Transformer 256 6.7 Engineering Application Examples 256 References 265 Problems 265 7 Couplers, Combiners, and Dividers 271 7.1 Introduction 271 7.2 Directional Couplers 271 7.2.1 Microstrip Directional Couplers 272 7.2.1.1 Two-line Microstrip Directional Couplers 272 7.2.1.2 Three-line Microstrip Directional Couplers 276 7.2.2 Multilayer and Multiline Planar Directional Couplers 279 7.2.3 Transformer Coupled Directional Couplers 281 7.2.3.1 Four-port Directional Coupler Design and Implementation 282 7.2.3.2 Six-port Directional Coupler Design 284 7.3 Multistate Reflectometers 289 7.3.1 Multistate Reflectometer Based on Four-port Network and Variable Attenuator 289 7.4 Combiners and Dividers 292 7.4.1 Analysis of Combiners and Dividers 292 7.4.2 Analysis of Dividers with Different Source Impedance 300 7.4.3 Microstrip Implementation of Combiners/Dividers 313 7.5 Engineering Application Examples 318 References 347 Problems 348 8 Filters 351 8.1 Introduction 351 8.2 Filter Design Procedure 351 8.3 Filter Design by the Insertion Loss Method 360 8.3.1 Low Pass Filters 361 8.3.1.1 Binomial Filter Response 362 8.3.1.2 Chebyshev Filter Response 365 8.3.2 High Pass Filters 376 8.3.3 Bandpass Filters 378 8.3.4 Bandstop Filters 382 8.4 Stepped Impedance Low Pass Filters 383 8.5 Stepped Impedance Resonator Bandpass Filters 386 8.6 Edge/Parallel-coupled, Half-wavelength Resonator Bandpass Filters 388 8.7 End-Coupled, Capacitive Gap, Half-Wavelength Resonator Bandpass Filters 394 8.8 Tunable Tapped Combline Bandpass Filters 400 8.8.1 Network Parameter Representation of Tunable Tapped Filter 402 8.9 Dual Band Bandpass Filters using Composite Transmission Lines 405 8.10 Engineering Application Examples 406 References 422 Problems 422 9 Waveguides 425 9.1 Introduction 425 9.2 Rectangular Waveguides 425 9.2.1 Waveguide Design with Isotropic Media 426 9.2.1.1 TEmn Modes 427 9.2.2 Waveguide Design with Gyrotropic Media 429 9.2.2.1 TEm0 Modes 431 9.2.3 Waveguide Design with Anisotropic Media 432 9.3 Cylindrical Waveguides 442 9.3.1 TE Modes 442 9.3.2 TM Modes 444 9.4 Waveguide Phase Shifter Design 444 9.5 Engineering Application Examples 446 References 454 Problems 454 10 Power Amplifiers 457 10.1 Introduction 457 10.2 Amplifier Parameters 457 10.2.1 Gain 457 10.2.2 Efficiency 459 10.2.3 Power Output Capability 460 10.2.4 Linearity 460 10.2.5 1 dB Compression Point 461 10.2.6 Harmonic Distortion 462 10.2.7 Intermodulation 465 10.3 Small Signal Amplifier Design 470 10.3.1 DC Biasing Circuits 471 10.3.2 BJT Biasing Circuits 472 10.3.2.1 Fixed Bias 473 10.3.2.2 Stable Bias 474 10.3.2.3 Self-bias 475 10.3.2.4 Emitter Bias 476 10.3.2.5 Active Bias Circuit 477 10.3.2.6 Bias Circuit using Linear Regulator 477 10.3.3 FET Biasing Circuits 477 10.3.4 Small Signal Amplifier Design Method 478 10.3.4.1 Definitions Power Gains for Small Signal Amplifiers 478 10.3.4.2 Design Steps for Small Signal Amplifier 482 10.3.4.3 Small Signal Amplifier Stability 483 10.3.4.4 Constant Gain Circles 488 10.3.4.5 Unilateral Figure of Merit 493 10.4 Engineering Application Examples 494 References 508 Problems 509 11 Antennas 513 11.1 Introduction 513 11.2 Antenna Parameters 514 11.3 Wire Antennas 521 11.3.1 Infinitesimal (Hertzian) Dipole (l ≤ λ/50) 521 11.3.2 Short Dipole ( λ/50 ≤ l ≤ λ/10) 524 11.3.3 Half-wave Dipole (l = λ/2) 525 11.4 Microstrip Antennas 531 11.4.1 Type of Patch Antennas 533 11.4.2 Feeding Methods 533 11.4.2.1 Microstrip Line Feed 533 11.4.2.2 Proximity Coupling 536 11.4.3 Microstrip Antenna Analysis – Transmission Line Method 536 11.4.4 Impedance Matching 537 11.5 Engineering Application Examples 539 References 552 Problems 552 12 RF Wireless Communication Basics for Emerging Technologies 555 12.1 Introduction 555 12.2 Wireless Technology Basics 555 12.3 Standard Protocol vs Proprietary Protocol 556 12.3.1 Standard Protocols 556 12.3.2 Proprietary Protocols 556 12.3.2.1 Physical Layer Only Approach 557 12.4 Overview of Protocols 557 12.4.1 ZigBee 557 12.4.2 LowPAN 558 12.4.3 Wi-Fi 558 12.4.4 Bluetooth 560 12.5 RFIDs 560 12.5.1 Active RFID Tags 562 12.5.2 Passive RFID Tags 562 12.5.3 RFID Frequencies 562 12.5.3.1 Low Frequency ~124 kHz and High Frequency ~13.56 MHz 562 12.5.3.2 Ultrahigh Frequency (UHF) Tags ~423 MHz–2.45 GHz 563 12.6 RF Technology for Implantable Medical Devices 563 12.6.1 Challenges with IMDs 564 12.6.1.1 Biocompatibility 564 12.6.1.2 Frequency 564 12.6.1.3 Dimension Constraints 564 12.7 Engineering Application Examples 565 References 576 13 Energy Harvesting and HVAC Systems with RF Signals 577 13.1 Introduction 577 13.2 RF Energy Harvesting 577 13.3 RF Energy Harvesting System Design for Dual Band Operation 578 13.3.1 Matching Network for Energy Harvester 580 13.3.2 RF–DC Conversion for Energy Harvester 582 13.3.3 Clamper and Peak Detector Circuits 582 13.3.4 Cascaded Rectifier 584 13.3.5 Villard Voltage Multiplier 584 13.3.6 RF–DC Rectifier Stages 584 13.4 Diode Threshold Vth Cancellation 585 13.4.1 Internal Vth Cancellation 585 13.4.2 External Vth Cancellation 586 13.4.3 Self-Vth Cancellation 586 13.5 HVAC Systems 587 13.6 Engineering Application Examples 588 References 609 Index 611

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Book SynopsisA comprehensive survey of advanced multilevel converter design, control, operation and grid-connected applications Advanced Multilevel Converters and Applications in Grid Integration presents a comprehensive review of the core principles of advanced multilevel converters, which require fewer components and provide higher power conversion efficiency and output power quality. The authors noted experts in the field explain in detail the operation principles and control strategies and present the mathematical expressions and design procedures of their components. The text examines the advantages and disadvantages compared to the classical multilevel and two level power converters. The authors also include examples of the industrial applications of the advanced multilevel converters and offer thoughtful explanations on their control strategies. Advanced Multilevel Converters and Applications in Grid Integration provides a clear understanding of the gaTable of ContentsList of Contributors xv Preface xvii Part I A review on Classical Multilevel Converters 1 1 Classical Multilevel Converters 3Gabriel H. P. Ooi, Ziyou Lim, and Hossein Dehghani Tafti 1.1 Introduction 3 1.2 Classical Two-Level Converters 3 1.3 The Need for Multilevel Converters 4 1.4 Classical Multilevel Converters 5 1.5 Multilevel Applications and Future Trends 12 References 14 2 Multilevel Modulation Methods 17Ziyou Lim, Hossein Dehghani Tafti, and Harikrishna R. Pinkymol 2.1 Introduction 17 2.2 Carrier-Based Sinusoidal Pulse-WidthModulation Methods 19 2.3 Space Vector Modulation (SVM) 24 2.4 Summary 27 References 28 3 Mathematical Modeling of Classical Three-Level Converters 29Gabriel H. P. Ooi 3.1 Introduction 29 3.2 Three-Level Diode-Clamped Inverter Topology 29 3.3 Three-Level Flying-Capacitor Inverter Topology 38 3.4 Summary 44 References 44 4 Voltage BalancingMethods for Classical Multilevel Converters 45Gabriel H. P. Ooi, Hossein Dehghani Tafti, and Harikrishna R. Pinkymol 4.1 Introduction 45 4.2 Active Balancing by Adding dc Offset Voltage to Modulating Signals 45 4.3 Measurement Results for dc Offset Modulation Control 47 4.4 Natural Balancing by using Star Connected RC Filter 49 4.5 Measurement Results for the Natural Balancing Method 59 4.6 Space Vector Modulation with the Self-Balancing Technique 59 4.7 Summary 61 References 63 Part II Advanced Multilevel Rectifiers and their Control Strategies 65 5 Unidirectional Three-Phase Three-Level Unity-Power Factor Rectifier 67Gabriel H. P. Ooi and Hossein Dehghani Tafti 5.1 Introduction 67 5.2 Circuit Configuration 67 5.3 Proposed Controller Scheme 70 5.4 Experimental Verification 80 5.5 Summary 86 References 86 6 Bidirectional and Unidirectional Five-Level Multiple-Pole Multilevel Rectifiers 89Gabriel H. P. Ooi 6.1 Introduction 89 6.2 Circuit Configuration 89 6.3 Modulation Scheme 91 6.4 Design Considerations 93 6.5 Comparative Evaluation 95 6.6 Control Strategy 101 6.7 Experimental Verification 103 6.8 Summary 105 References 105 7 Five-Level Multiple-Pole Multilevel Vienna Rectifier 107Gabriel H. P. Ooi and Ali I. Maswood 7.1 Introduction 107 7.2 Operating Principle 108 7.3 Design Considerations 110 7.4 Control Strategy 112 7.5 Validation 115 7.6 Summary 116 References 117 8 Five-Level Multiple-Pole Multilevel Rectifier with Reduced Components 119Gabriel H. P. Ooi 8.1 Introduction 119 8.2 Operation Principle 120 8.3 Modulation Scheme 122 8.4 Control Strategy 123 8.5 Design Considerations 128 8.6 Validation 131 8.7 Experimental Verification 131 8.8 Summary 132 References 134 9 Four-Quadrant Reduced Modular Cell Rectifier 137Ziyou Lim 9.1 Introduction 137 9.2 Circuit Configuration 139 9.3 Operating Principle 139 9.4 Design Considerations 141 9.5 Control Strategy 144 9.6 Comparative Evaluation of Classical MFCR and Proposed RFCR 148 9.7 Experimental Verification 149 References 160 Part III Advanced Multilevel Inverters and their Control Strategies 163 10 Transformerless Five-Level/Multiple-Pole Multilevel Inverters with Single DC Bus Configuration 165Gabriel H. P. Ooi 10.1 Introduction 165 10.2 Five-Level Multiple-Pole Concept 166 10.3 Circuit Configuration and Operation Principles 167 10.4 Modulation Scheme 176 10.5 Design Consideration 176 10.6 Accuracy of the Current Stress Calculation 184 10.7 Losses in Power Devices 189 10.8 Discussion 197 References 199 11 Transformerless Seven-Level/Multiple-Pole Multilevel Inverters with Single-Input Multiple-Output (SIMO) Balancing Circuit 201Hossein Dehghani Tafti and Gabriel H. P. Ooi 11.1 Introduction 201 11.2 Circuit Configuration and Operating Principles 201 11.3 SIMO Voltage Balancing Circuit 204 11.4 Design Considerations 208 11.5 Experimental Verification 212 11.6 Summary 215 References 215 12 Three-Phase Seven-Level Three-Cell Lightweight Flying Capacitor Inverter 217Ziyou Lim 12.1 Introduction 217 12.2 LFCI Topology 219 12.3 Circuit Configuration 220 12.4 Operational Principles 220 12.5 Modulation Scheme 228 12.6 Design Considerations 230 12.7 Harmonic Characteristics 234 12.8 Experimental Verification 247 References 250 13 Three-Phase Seven-Level Four-Cell Reduced Flying Capacitor Inverter 251Ziyou Lim 13.1 Introduction 251 13.2 Circuit Configuration 251 13.3 Operation Principles 252 13.4 Design Considerations 254 13.5 Flying Capacitor Voltage Balancing Control 259 13.6 Experimental Verification 264 14 Active Neutral-Point-Clamped Inverter 275Ziyou Lim 14.1 Introduction 275 14.2 Circuit Configuration 277 14.3 Operating Principles 277 14.4 Design Considerations 279 14.5 Multiple Voltage Quantities Enhancement Control 280 14.6 Common Mode Reduction 298 References 316 15 Multilevel Z-Source Inverters 319Muhammad M. Roomi 15.1 Introduction 319 15.2 Two-Level ZSI 321 15.3 Three-Level ZSI 324 15.4 Modulation Methods for Three-Level Z-Source NPC Inverter 332 15.5 Modulation Method for Three-Level Dual Z-Source NPC Inverter 335 15.6 Reference Disposition Level-Shifted PWM for Non-ideal Dual Z-Source Network NPC Inverter 350 15.7 Applications of ZSI 363 15.8 Summary 365 References 367 Part IV Grid-Integration Applications of Advanced Multilevel Converters 369 16 Multilevel Converter-Based Photovoltaic Power Conversion 371Hossein Dehghani Tafti, Georgios Konstantinou, and Josep Pou 16.1 Introduction 371 16.2 Three-Level Neutral-Point-Clamped Inverter–Based PV Power Plant 371 16.3 Seven-Level Cascaded H-Bridge Inverter–Based PV Power Plant 390 16.4 Summary 407 References 407 17 Multilevel Converter–basedWind Power Conversion 413Md Shafquat Ullah Khan 17.1 Introduction 413 17.2 Wind Power Conversion Principles 413 17.3 Multilevel Converters in Wind Power Conversion 416 17.4 Grid-Connected Back-to-Back Three-Phase NPC Converter 418 17.5 Summary 429 References 429 18 Z-Source Inverter–Based Fuel Cell Power Generation 433Muhammad M. Roomi 18.1 Introduction 433 18.2 Fuel Cell Power Conversion Principles 436 18.3 Modelling of the PEMFC 437 18.4 Circuit Configuration 439 18.5 Control Strategy 440 18.6 Validation 442 18.7 Summary 451 References 453 19 Multilevel Converter-Based Flexible Alternating Current Transmission System 455Muhammad M. Roomi and Harikrishna R. Pinkymol 19.1 Introduction 455 19.2 A Space Vector Modulated Five-Level Multiple-pole Multilevel Diode-Clamped STATCOM 456 19.3 Summary 470 References 470 Index 473

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Book SynopsisThis is a self-contained book on the foundations and applications of optical and microwave technologies to telecommunication networks application, with an emphasis on access, local, road, indoor and in-car data transmission.Table of ContentsPreface xi 1 Introduction 1 2 Optical and Microwave Fundamentals 11 2.1 Free Space Propagation of Electromagnetic Waves 11 2.2 Interference 16 2.3 Coherence 17 2.4 Polarization 21 2.5 Refraction and Reflection 27 2.6 Diffraction 31 3 Optical Fibers 35 3.1 Attenuation in Glass Fibers 47 3.1.1 Attenuation Mechanisms in Glass Fibers 48 3.1.2 Attenuation Measurement Techniques 51 3.2 Dispersions in Fibers 55 3.2.1 Dispersion Mechanisms in Fibers 56 3.2.2 Polarization Mode Dispersion in Single-Mode Fibers 63 3.2.3 Joint Action of Dispersion Mechanisms 65 3.2.4 Dispersion Measurement Techniques 68 3.2.5 Partial Dispersion Suppression by Soliton Transmission in Single-Mode Fibers 70 4 Fiber Manufacturing, Cabling and Coupling 75 4.1 Fiber Manufacturing 75 4.1.1 Preparation of a Preform 75 4.1.2 Fiber Drawing 82 4.1.3 Mechanical Properties of Optical Fibers 83 4.1.4 Alternative Fiber Manufacturing Processes 85 4.2 Fiber Cabling 86 4.2.1 Fibers for Telecom and Data Networks 86 4.2.2 Cables: Applications, Operating Conditions and Requirements 94 4.2.3 Fiber Protection and Identification in Cables 100 4.2.4 Indoor Cables 108 4.2.5 Duct Cables 111 4.2.6 Aerial Cables 116 4.2.7 Optical Ground Wires 117 4.2.8 Fiber Cabling Summary 119 4.3 Coupling Elements for Fiber-Optic Systems 119 4.3.1 Light Source-to-Fiber Coupling 120 4.3.2 Fiber-to-Fiber Coupling 126 4.3.3 Fiber-Optic Splices 130 4.3.4 Fiber-Optic Connectors 131 4.3.5 Fiber-Optic Couplers 133 4.3.6 Fiber-Optic Switches 137 4.3.7 Fiber-to-Detector Coupling 137 5 Integrated-Optic Components 139 5.1 Integrated-Optic Waveguides 140 5.2 Integrated-Optic Modulators 141 5.3 Integrated-Optic Polarizers 145 5.4 Integrated-Optic Filters 146 5.5 Losses in Integrated-Optic Devices 148 6 Optical Light Sources and Drains 149 6.1 Semiconductor Light Sources 154 6.1.1 Light Emitting Diodes 156 6.1.2 Semiconductor Lasers 160 6.1.3 Organic Lasers 185 6.2 Semiconductor Light Drains 185 6.2.1 Types of Photodiodes 188 7 Optical Transmitter and Receiver Circuit Design 197 7.1 Optical Transmitter Circuit Design 197 7.2 Optical Receiver Circuit Design 199 7.2.1 Receiver Circuit Concepts 201 7.2.2 Noise in Optical Receivers 206 8 Fiber-Optic Amplifiers 209 8.1 Erbium Doped Fiber Amplifiers 209 8.2 Fiber Raman Amplifiers 211 9 Fiber- and Wireless-Optic Data Transmission 215 9.1 Direct Transmission Systems as Point-to-Point Connections 217 9.1.1 Unidirectional, Bidirectional and Multichannel Systems 225 9.2 Orthogonal Frequency Division Multiplex (OFDM) Systems 227 9.2.1 Approaches to Increase Channel Capacity 227 9.2.2 Fundamentals of OFDM 229 9.2.3 Implementation Options for Coherent Optical OFDM 230 9.2.4 Nyquist Pulse Shaping as an Alternative to OFDM Systems 232 9.3 Optical Satellite Communications 233 9.3.1 Applications of Optical Satellite Communications 234 9.3.2 Channel Characteristics and Technical Issues 236 9.4 Coherent Transmission Systems 241 9.4.1 Main Principle of Coherent Transmission 241 9.4.2 System Components 245 9.4.3 Modulation Methods for Coherent Transmission Systems 247 9.4.4 Detection and Demodulation Methods for Coherent Transmission Systems 248 9.5 Top Results on Fiber-Optic Transmission Capacity for High-Speed Long Distance 251 9.6 Optical Fibers in Automation Technology 255 9.6.1 Optical Fiber Cables 255 9.6.2 Connectors 257 9.6.3 Network and Network Components 257 10 Last Mile Systems, In-House-Networks, LAN- and MAN-Applications 263 10.1 Last Mile Systems 269 10.1.1 Special Case of Access Network 270 10.1.2 Fiber Access Networks 271 10.1.3 FTTB Networks 275 10.1.4 Point-to-Point FTTH Networks 277 10.1.5 Passive Optical Networks (PON) 280 10.1.6 WDM-PON Networks 285 10.1.7 Upgrade and Migration Issues in FTTH Networks 286 10.1.8 Passive Fiber Plant 288 10.1.9 Development and standardization of FTTH technologies 297 10.1.10 Active Equipment 300 10.1.11 Conclusions 305 10.2 Polymer Optical Fibers, POF 306 10.2.1 Basics of POF 306 10.2.2 Techniques for Data Transmission over POF 312 10.2.3 In-House Communications 319 10.2.4 Communications in Transportation Systems: From Automotive to Spatial 321 10.2.5 Standardization Activities 325 10.3 Radio over Fiber (RoF) Systems 328 10.3.1 Key Enabling Technologies 331 10.3.2 RoF Land Network Design 337 10.3.3 Case Study of the Proposed Design Framework 344 10.3.4 Conclusions 349 10.4 Free Space Optical Communications 349 10.4.1 FSO under Turbulence Conditions 352 10.4.2 System Set-up 356 10.4.3 System Performance under Weak Turbulence 358 10.4.4 FSO Link Evaluation 361 10.4.5 Relation to Outdoor FSO Link 363 10.4.6 FSO under Fog Conditions 364 10.4.7 Characterization of Fog and Smoke Attenuation in a Laboratory Chamber 366 10.4.8 Fog and Smoke Channel – Experiment Set-up 367 10.4.9 Results and Discussion 369 10.4.10 Conclusions 376 10.5 WLAN Systems and Fiber Networks 377 10.5.1 A Historical Perspective on IEEE 802.11 WLANs 380 10.5.2 Relevant Operating Principles of WLAN Systems 386 10.5.3 Hybrid Fiber-Wireless Network Architectures: Wi-Fi-based FiWi Architectures 392 10.6 Energy Efficiency Aspects in Optical Access and Core Networks 399 10.6.1 Energy Efficiency in Current and Next Generation Optical Access Networks 399 10.6.2 Energy Efficient Time Division Multiplexed Passive Optical Networks 400 10.6.3 Energy Efficient Time and Wavelength Division Multiplexed Passive Optical Networks 406 10.6.4 Spectral and Energy Efficiency Considerations in Single Rate WDM Networks with Signal Quality Guarantee 413 10.6.5 Spectral versus Energy Efficiency in Mixed-Line Rate WDM Systems with Signal Quality Guarantee 420 10.6.6 Results and Discussion 423 11 Optical Data-Bus and Microwave Systems for Automotive Application in Vehicles, Airplanes and Ships 427 11.1 Communication in Transportation Systems 427 11.1.1 Communication Needs in Transportation Systems 428 11.1.2 Communication with Transportation Systems 433 11.1.3 Hybrid Networks for use in Transportation Systems 435 11.2 Radar for Transportation Systems 438 11.2.1 ARVS Main Features 441 11.2.2 Features of ARVS Equipment Construction 446 11.2.3 Main Tasks and Processing Methods of Radar Data in the ARVS 455 11.2.4 Main Problems and Tasks of ARVS Development 460 11.2.5 Conclusions 461 References 463 Index 497

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Book SynopsisThis book targets new trends in microwave engineering by downscaling components and devices for industrial purposes such as miniaturization and function densification, in association with the new approach of activation by a confined optical remote control. It covers the fundamental groundwork of the structure, property, characterization methods and applications of 1D and 2D nanostructures, along with providing the necessary knowledge on atomic structure, how it relates to the material band-structure and how this in turn leads to the amazing properties of these structures. It thus provides new graduates, PhD students and post-doctorates with a resource equipping them with the knowledge to undertake their research.Table of ContentsINTRODUCTION ix CHAPTER 1. NANOTECHNOLOGY-BASED MATERIALS AND THEIR INTERACTION WITH LIGHT 1 1.1. Review of main trends in 3D to 0D materials 1 1.1.1. Main trends in 3D materials for radio frequency (RF) electronics and photonics 1 1.1.2. Main trends in 2D materials for RF electronics and photonics 2 1.1.3. Review of other two-dimensional structures for RF electronic applications 5 1.1.4. Main trends in 1D materials for RF electronics and photonics 6 1.1.5. Other 1D materials for RF applications 9 1.1.6. Some attempts on 0D materials 13 1.2. Light/matter interactions 13 1.2.1. Fundamental electromagnetic properties of 3D bulk materials 14 1.2.2. Linear optical transitions 22 1.2.3. Bandgap engineering in nanomaterials: effect of confinement/sizing on bandgap structure 23 1.3. Focus on two light/matter interactions at the material level 26 1.3.1. Photoconductivity in semiconductor material 26 1.3.2. Example of light absorption in metals: plasmonics 45 CHAPTER 2. ELECTROMAGNETIC MATERIAL CHARACTERIZATION AT NANOSCALE 51 2.1. State of the art of macroscopic material characterization techniques in the microwave domain with dedicated equipment 51 2.1.1. Static resistivity 51 2.1.2. Carrier and doping density 53 2.1.3. Contact resistance and Schottky barriers 55 2.1.4. Transient methods for the determination of carrier dynamics 56 2.1.5. Frequency methods for complex permittivity determination in frequency 57 2.2. Evolution of techniques for nanomaterial characterization 60 2.2.1. The CNT transistor 60 2.2.2. Optimizing DC measurements 60 2.2.3. Pulsed I-V measurements 61 2.2.4. Capacitance–voltage measurements 61 2.3. Micro- to nanoexperimental techniques for the characterization of 2D, 1D and 0D materials 62 CHAPTER 3. NANOTECHNOLOGY-BASED COMPONENTS AND DEVICES 65 3.1. Photoconductive switches for microwave applications 67 3.1.1. Major stakes 67 3.1.2. Basic principles 67 3.1.3. State of the art of photoconductive switching 71 3.1.4. Photoconductive switching at nanoscale – examples 72 3.2. 2D materials for microwave applications 74 3.2.1. Graphene for RF applications 74 3.2.2. Optoelectronic functions 76 3.2.3. Other potential applications of graphene 77 3.3. 1D materials for RF electronics and photonics 78 3.3.1. Carbon nanotubes in microwave and RF circuits 78 3.3.2. CNT microwave transistors 79 3.3.3. RF absorbing and shielding materials based on CNT composites 82 3.3.4. Interconnects 83 CHAPTER 4. NANOTECHNOLOGY-BASED SUBSYSTEMS 85 4.1. Sampling and analog-to-digital converter 85 4.1.1. Basic principles of sampling and subsampling 87 4.1.2. Optical sampling of microwave signals 89 4.2. Photomixing principle 89 4.3. Nanoantennas for microwave to THz applications 91 4.3.1. Optical control of antennas in the microwave domain 91 4.3.2. THz photoconducting antennas 91 4.3.3. 2D material-based THz antennas 92 4.3.4. 1D material-based antennas 92 4.3.5. Challenges for future applications 96 CONCLUSIONS AND PERSPECTIVES 99 C.1. Conclusions 99 C.2. Perspectives: beyond graphene structures for advanced microwave functions 100 C.2.1. van der Waals heterostructures 101 C.2.2. Beyond graphene: heterogeneous integration of graphene with other 2D semiconductor materials 103 C.2.3. Graphene allotropes 103 BIBLIOGRAPHY 105 INDEX 119

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Book SynopsisMicrowave and radio frequency (RF) elements play an important role in communication systems, and, due to the proliferation of radar, satellite and mobile wireless systems, there is a need for the study of electromagnetism. Each of the nine chapters of this book provides a complete analysis and modeling of the microwave structure used for emission or reception technology, providing students with a set of approaches that can be used for current and future RF and microwave circuit designs. The authors emphasize the practical nature of the subject by summarizing the analysis steps and giving numerous examples of problems and exercises complete with solutions, making this book theoretical, but also experimental, with over 16 microwave problems. This approach has produced a coherent and practical treatment of the subject. The book has grown out of the authors’ own teaching and, as such, has a unity of methodology and style. It provides basic knowledge of microwave and RF range and is intended for microwave engineers and for advanced graduate students.Table of ContentsPREFACE xi INTRODUCTION xv PART 1. TRANSMISSION LINES 1 CHAPTER 1. ELECTROMAGNETIC OF TEM TRANSMISSION LINES 3 CHAPTER 2. LOSSES IN TEM TRANSMISSION LINES 23 CHAPTER 3. DETERMINATION OF THE CHARACTERISTICS OF TEM LINES 51 PART 2. GUIDES 77 CHAPTER 4. ELECTROMAGNETIC IN LINEAR, HOMOGENEOUS, ISOTROPIC AND LOSSLESS GUIDES 79 CHAPTER 5. LOSSES IN GUIDES 107 CHAPTER 6. RECTANGULAR TM AND TE GUIDES 123 CHAPTER 7. CIRCULAR TM AND TE GUIDES 151 PART 3. CAVITIES 173 CHAPTER 8. RECTANGULAR TE011 CAVITY 175 CHAPTER 9. CIRCULAR TEmnp AND TMmnp CAVITIES 191 INDEX 201

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Book SynopsisThis open access book provides practicing electrical engineers and students a practical – and mathematically sound – introduction to the topic of electromagnetic compatibility (EMC). The author enables readers to understand better how to overcome commonly failed EMC tests for radiated emission, radiated immunity, and electrostatic discharge (ESD), while providing concrete EMC design guidelines. The book also presents an overview of EMC standards and regulations and how to test for a global market access.Table of Contents1-Introduction 2-Regulations And Standards 3-Decibel 4-Frequency And Wavelength 5-Time-Domain And Frequency-Domain 6-RF Parameters 7-Transmission Lines 8-Electromagnetic Fields 9-Antennas 10-Skin Effect 11-Components 12-Noise Coupling 13-Shielding 14-Grounding 15-Filtering 16-EMC Design Guidelines

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Book SynopsisDieses Lehr- und Übungsbuch behandelt anschaulich die Grundlagen und moderne Anwendungen der Übertragungstechnik ohne mathematischen Ballast. Es vermittelt strukturiertes Wissen, das übergreifende Zusammenhänge und deren Verständnis ermöglicht. Schwerpunkte bilden die Nachrichtenquellen, das Rauschen in Kommunikationssystemen und die digitale Modulation. Beispiele und Aufgaben mit Lösungen sind an die Kenntnisse der Studierenden der Informationstechnik und verwandter Studiengänge angepasst und gewährleisten ein erfolgreiches Selbststudium.Table of ContentsNachrichtenquellen - Amplitudenmodulation - Frequenz- und Phasenmodulation - Rauschen in Kommunikationssystemen - Digitale Übertragung im Basisband - Digitale Modulation mit Sinusträger - Digitale Modulation für den Mobilfunk

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Book SynopsisVolkmar Brückner gibt einen Überblick über die Datenübertragung im Festnetz, durch Mobilfunk oder Satelliten sowie über globale mobile und optische Netze. Grenzen und Fehlerquellen für das Festnetz und die Übertragung bei der mobilen Kommunikation sowie Problemfelder in Technik und Ökologie werden angesprochen.Table of ContentsKommunikation heute.- Die digitale Welt.- Das Bit und sein Weg durchs Netz.- Globale Netze.- Glasfasern und Halbleiterlaser als Basiselemente optischer Netze.- Mobile Kommunikation.- Gesundheit und ökologischer Rucksack beim Mobilfunk.

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Book SynopsisDieses essential befasst sich mit den Prozessketten zur Herstellung optischer Komponenten für LED-Beleuchtungsanwendungen. Mit Blick auf eine wirtschaftliche Fertigung der Komponenten gehen die Autoren besonders auf die Möglichkeiten zur kostengünstigen Replikation durch Kunststoffspritzguss oder Rolle-zu-Rolle-Prozesse ein. Sie thematisieren die notwendigen Fertigungsschritte für die Werkzeugherstellung genauso wie die messtechnische Charakterisierung der Kunststoffkomponenten. Dabei zeigen sie die notwendige Maschinen- und Werkzeugtechnik, mögliche Verfahrensvarianten, die verwendeten Materialien und entsprechende Beispielgeometrien auf.Table of ContentsWas Sie in diesem Essential finden können.- Einleitung.- LED-Vorsatzoptiken: Formen, Toleranzen und Anforderungen.- Herstellung von Werkzeugformeinsätzen durch Diamantzerspanung.- Replikation von Kunststoffoptiken im Spritzgießverfahren.- Herstellung von Flächenlichtleitern.- Messtechnische Charakterisierung optischer Komponenten.- Was Sie aus diesem Essential mitnehmen können.

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Book SynopsisReiner Thiele leitet die Lösungen partieller Riccati-Differenzialgleichungen her und zeigt den Zusammenhang zwischen allgemeinem Integral und singulärer Lösung auf. Dazu appliziert er eine neue Zerlegungsmethode dieser nichtlinearen Differenzialgleichungen (DGL) in jeweils zwei lineare Gleichungen. Nach der Bestimmung der Eigenwerte liegen die Lösungen vor, die bei Faraday-Effekt-Stromsensoren auftreten und durch eine lineare Beziehung zwischen Messgröße und Messwert gekennzeichnet sind. Praxisrelevante Beispiele für Messgrößen und Messwerte beweisen die große Applikationsbreite der patentierten Faraday-Effekt-Stromsensoren des Autors.Der AutorProf. Dr.-Ing. Reiner Thiele lehrte an der Hochschule Zittau/Görlitz und lehrt an der Staatlichen Studienakademie Bautzen.Table of Contents

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Book SynopsisReiner Thiele entwickelt eine neue Theorie für optische Nachrichtensysteme, die ohne die Maxwell-Gleichungen der Elektrotechnik auskommt. Dazu definiert er charakteristische Momente und Funktionen für die Systemelemente einer Punkt-Punkt-Verbindung. Außerdem schlägt der Autor Dreieck-Impulse als Modulationssignal vor. Dadurch entstehen inverse Gabor-Wavelets im Lichtwellenleiter, mit denen die Signalübertragung erfolgt. Dies führt zu effizienten schaltungstechnischen Lösungen an den Endstellen der Übertragungsstrecke. Damit ergibt sich schließlich ein einfaches Verfahren zur Signal-Rekonstruktion im Empfänger.Der Autor: Prof. Dr.-Ing. Reiner Thiele lehrte an der Hochschule Zittau/Görlitz und unterrichtet derzeit an der Staatlichen Studienakademie Bautzen.Table of ContentsCharakteristische Momente und Funktionen der Laserdiode.- Feldverteilung als charakteristische Ortsfunktion und Impulsantwort als charakteristische Zeitfunktion des Lichtwellenleiters (LWL).- Übertragungs-Gleichung mit inversen Gabor-Wavelets.- Charakteristische Momente und Funktionen der Fotodiode und Signal-Rekonstruktion.

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Book SynopsisIn der hochbitratigen optischen Nachrichtentechnik ist es wichtig, parasitäre induktive und kapazitive Einflüsse auf die Funktion von Laser- und Fotodioden zu kompensieren. Wegen des nichtlinearen Charakters der u-i-Relationen der Induktivitäten, Kapazitäten und Widerstände ist es möglich, Kompensationsverfahren gegen parasitäre Effekte zu entwickeln oder die Nichtlinearitäten gezielt zur Signalübertragung einzusetzen. Reiner Thiele beweist, dass bei Applikation der vorgestellten Kompensationsverfahren kapazitive und induktive Influenzen auf die Grundfunktion der optoelektronischen Bauelemente vermeidbar sind, das Klemmenverhalten durch die u-i-Kennlinien von Laser- oder Fotodioden komplett erfasst wird und ungünstige Einflüsse der Systemumgebung auf die optoelektronischen Schaltungen vermieden werden. Außerdem stellt er Definitionen für optoelektronische Grundstromkreise sowie ihre Berechnung für die Applikation gleichartiger Laser- oder Fotodioden als Sende- bzw. Empfangsbauelemente der optischen Nachrichtentechnik vor.Der Autor: Prof. Dr.-Ing. Reiner Thiele lehrte an der Hochschule Zittau/Görlitz und unterrichtet derzeit an der Staatlichen Studienakademie Bautzen.Table of ContentsParameter von Dioden.- Kompensation elektromagnetischer Beeinflussungen.- Optoelektronische Grundstromkreise.

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Book SynopsisDieses Buch vermittelt geballtes Wissen zur Halbleiter-SchaltungstechnikSeit nunmehr 50 Jahren ist dieses Buch über die Schaltungstechnik auf dem Markt, doch in die Jahre gekommen ist es noch lange nicht. Auch die 16. Auflage wurde von den Verfassern intensiv überarbeitet und erweitert und stellt dem Leser viele wichtige Themen der Halbleiter-Schaltungstechnik vor, darunter eine Einführung in die Digitaltechnik, Anwendungsmöglichkeiten in Bauelementen und Schaltungen der Nachrichtentechnik.Inhalte richten sich Praktiker und Studierende Von den Inhalten dieses Buchs über die Schaltungstechnik profitieren sowohl Studenten als auch Ingenieure. Sämtliche Kapitel wurden entsprechend der neuesten technischen Entwicklungen überarbeitet. Es vermittelt Grundlagenwissen aber auch tiefergehende Informationen.Table of ContentsTeil I: Grundlagen: Diode.- Bipolartransistor.- Feldeffekttransistor.- Verstärker.- Operationsverstärker.- Digitaltechnik Grundlagen.- Schaltnetze.- Schaltwerke.- Halbleiterspeicher.- Teil II: Anwendungen: Analogrechenschaltungen.- Gesteuerte Quellen und Impedanzkonverter.- Aktive Filter.- Regler.- Signalgeneratoren.- Leistungsverstärker.- Stromversorgung.- DA- und AD-Umsetzer.- Messschaltungen.- Sensorik.- Optoelektronische Bauelemente.- Teil III: Schaltungen der Nachrichtentechnik: Grundlagen.- Sender und Empfänger.- Passive Komponenten.- Hochfrequenz-Verstärker.- Mischer.- Oszillatoren.-Phasenregelschleife.- Anhang.- Literaturverzeichnis.- Sachverzeichnis.

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Book SynopsisDieses Buch behandelt alle für ein Software Defined Radio (SDR) relevanten Systemteile: Antenne, Antennenanpassung, analoges Frontend, A/D-Umsetzung, Digital Downconversion (DDC), Interpolation, Synchronisation, Demodulation. Zunächst werden die notwendigen Grundlagen für die Darstellung von Signalen vermittelt sowie der gesamte Aufbau eines Software Defined Radios beschrieben, um anschließend die einzelnen Komponenten näher zu betrachten.Der Schwerpunkt des Buches liegt auf dem Zusammenspiel der Komponenten und Signale innerhalb des Empfängers. Zur Veranschaulichung der Signale wird das Open-Source-Programm GNU Octave verwendet. Table of ContentsEinleitung.- Darstellung von Signalen und Spektren.- Aufbau und Signale eines Software Defined Radio Systems.- Drahtlose Netzwerke.- Übertragungsstrecke.- Leistungsdaten eines Empfängers.- Digital Downconverter.- Demodulation digital modulierter Signale.

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Book Synopsis1 Verstärkerschaltungen.- 2 Siebschaltungen.- 3 Oszillatoren.- 4 Gleichrichter.- 5 Digital/Analog- und Analog/Digital-Wandler.- 6 Modulatoren und Demodulatoren.- 7 Digitale Schaltnetze.- 8 Digitale Schaltwerke und Zeitglieder.- 9 Mikroprozessoren.- 10 Optoelektronische Schaltungen.- Sachwortverzeichnis.Table of Contents1 Verstärkerschaltungen.- 2 Siebschaltungen.- 3 Oszillatoren.- 4 Gleichrichter.- 5 Digital/Analog- und Analog/Digital-Wandler.- 6 Modulatoren und Demodulatoren.- 7 Digitale Schaltnetze.- 8 Digitale Schaltwerke und Zeitglieder.- 9 Mikroprozessoren.- 10 Optoelektronische Schaltungen.- Sachwortverzeichnis.

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Book SynopsisDie Informations- und Kommunikationstechnik hat in den letzten Jahrzehnten enorm an Bedeutung gewonnen. Um so wichtiger wird die Vermittlung von Grundlagenwissen in der digitalen Informationsübertragung. Aktuelle Forschungsgebiete wie Mehrantennensysteme (MIMO-Systeme) und Mehrnutzerkommunikation basieren auf informationstheoretischen Ansätzen, aber auch auf Kenntnissen der Codierungstheorie, der Übertragungstechnik und der Schätzverfahren. Im Vordergrund dieses Lehrbuchs stehen leistungsfähige drahtlose Übertragungstechniken unter besonderer Berücksichtigung des Mobilfunks. Die meisten Prinzipien und Verfahren sind aber auch in anderen Bereichen der digitalen Übertragungstechnik und zum Teil auch in der Speichertechnik anwendbar.Table of ContentsGrundlagen der angewandten Informationstheorie.- Grundlagen der Kanalcodierung.- Digitale Modulations- und Übertragungsverfahren.- Konzepte der Mobilfunkkommunikation.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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a huge range and FREE tracked UK delivery on ALL orders.

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