Mechanical engineering and materials Books

Book SynopsisThe field of multiphase flows has grown by leaps and bounds in the last thirty years and is now regarded as a major discipline. Engineering applications, products and processes with particles, bubbles and drops have consistently grown in number and importance. An increasing number of conferences, scientific fora and archived journals are dedicated to the dissemination of information on flow, heat and mass transfer of fluids with particles, bubbles and drops. Numerical computations and “thought experiments” have supplemented most physical experiments and a great deal of the product design and testing processes. The literature on computational fluid dynamics with particles, bubbles and drops has grown at an exponential rate, giving rise to new results, theories and better understanding of the transport processes with particles, bubbles and drops. This book captures and summarizes all these advances in a unified, succinct and pedagogical way.

Read more less

Book SynopsisThis proceedings consists of selected papers presented at the 3rd International Conference on Application of Materials Science and Environmental Materials (AMSEM2015), which was successfully held on Phuket Island, Thailand, between October 01-03, 2015.Building on the success of AMSEM2013 and AMSEM2014, AMSEM2015 continues to provide a forum for academic scientists, leading engineers, industry researchers and doctoral students to exchange and share their experience and research results, so as to promote the advancement in Materials Engineering, Environments Materials and Material Science.AMSEM2015 attracted more than 80 submissions. Among them, only 33 papers were accepted into the conference after a stringent peer review process. It is hoped that this book will provide readers with a broad overview of the latest advances on the above areas, and also serve as a good reference for academic research and industrial professionals.

Read more less

Book SynopsisTwo large international conferences on Advances in Engineering Sciences were held in Hong Kong, March 18-20, 2015, under the International MultiConference of Engineers and Computer Scientists (IMECS 2015), and in London, UK, 1-3 July, 2015, under the World Congress on Engineering (WCE 2015) respectively. This volume contains 35 revised and extended research articles written by prominent researchers participating in the conferences. Topics covered include engineering mathematics, computer science, electrical engineering, manufacturing engineering, industrial engineering, and industrial applications. The book offers state-of-the-art advances in engineering sciences and also serves as an excellent reference work for researchers and graduate students working with/on engineering sciences.

Read more less

Book SynopsisThe first edition of the combined monograph and textbook Probabilistic Methods in the Theory of Structures was published by Wiley-Interscience in 1983. 1n 1999, Dover Publications, Inc. published its second edition under shorter title Probabilistic Theory of Structures. Now, World Scientific has expanded into a 3rd edition to include Problems with Complete Worked-Through Solutions. This compendium of solutions was written in response to requests by numerous university educators around the world, since it has been adopted as a textbook or an additional reading for both undergraduate and graduate courses.The author hopes that the availability of such solutions manual will further help to establish the courses dealing with probabilistic strength of materials, design, random buckling, and random vibration. The material itself was developed by author for various undergraduate and graduate courses, during years 1972-1989 at the Technion — Israel Institute of Technology, in Haifa, Israel, at the Delft University of Technology in the Netherlands, year 1979/80 at the University of Notre Dame, Indiana, USA and at the Florida Atlantic University, USA since 1994.Already since mid-eighties, the author was informed that the book was adopted in numerous universities worldwide. Besides complete solutions to more than one hundred problems, additional material and remarks are included as Chapter 12, bringing some ideas down to the 'number' level.It is strongly hoped that this manual will promote much wider dissemination of probabilistic methods' courses at universities, and ultimately, in engineering practice worldwide.The 3rd Edition of the textbook, , is available separately.

Read more less

Book SynopsisThe first edition of the combined monograph and textbook Probabilistic Methods in the Theory of Structures was published by Wiley-Interscience in 1983. 1n 1999, Dover Publications, Inc. published its second edition under shorter title Probabilistic Theory of Structures. Now, World Scientific has expanded into a 3rd edition to include Problems with Complete Worked-Through Solutions. This compendium of solutions was written in response to requests by numerous university educators around the world, since it has been adopted as a textbook or an additional reading for both undergraduate and graduate courses.The author hopes that the availability of such solutions manual will further help to establish the courses dealing with probabilistic strength of materials, design, random buckling, and random vibration. The material itself was developed by author for various undergraduate and graduate courses, during years 1972-1989 at the Technion — Israel Institute of Technology, in Haifa, Israel, at the Delft University of Technology in the Netherlands, year 1979/80 at the University of Notre Dame, Indiana, USA and at the Florida Atlantic University, USA since 1994.Already since mid-eighties, the author was informed that the book was adopted in numerous universities worldwide. Besides complete solutions to more than one hundred problems, additional material and remarks are included as Chapter 12, bringing some ideas down to the 'number' level.It is strongly hoped that this manual will promote much wider dissemination of probabilistic methods' courses at universities, and ultimately, in engineering practice worldwide.The 3rd Edition of the textbook, , is available separately.

Read more less

Book SynopsisHeld in Wuhan of China from August 20-21, 2016, the 2016 International Conference on Mechatronics and Manufacturing Technologies (MMT2016) provides an excellent international academic forum for all the researchers and practitioners to share resources, exchange opinions and inspire studying.The conference enjoys a wide spread participation among all over the universities and research institutes. It provides a broad overview of the latest research results on related fields and also a significant platform for academic connection and exchange.MMT2016 proceedings collects together 96 articles, after peer-review, to report on state-of-art developments of mechanical engineering based on originality, significance and clarity for the purpose of the Conference.

Read more less

Book SynopsisThermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. Set 3: Thermal Packaging Applications The third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author's 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems. The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks. The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.Table of ContentsVolume 1: Heat Transfer in Avionic Equipment (Boris Abramzon): Using Cold Plates and Compact Heat Exchangers for Cooling of Electronics Equipment; Heat Transfer and Flow Friction Data for Circular and Noncircular Ducts; Heat Transfer and Hydraulic Performance Data of Compact Heat Transfer Surfaces for Avionics Cooling; Flow Pressure Drop Analysis, Fans, and Pumps; Thermal Conduction Heat Transfer in Finned Passages; Mathematical Model of Heat Transfer in Cold Plates; Analysis of Compact Fin-Plate Heat Exchangers with e-NTU Method; Rating, Sizing and Optimum Design Problems of Compact Fin-Plate Heat Exchangers; Random Optimization Search Algorithm MARS; Air Physical Properties; Physical Properties of Liquid coolants and Construction Materials; Volume 2: Thermal Management of RF Systems (John D Albrecht, David H Altman & Joseph J Maurer): Introduction to Thermal Management of Advanced Radar Systems; Thermal Management Fundamentals; Past and Current Thermal Solutions for Electronically Scanned Arrays; Thermal Management in AESA Systems Engineering; Advancements in Thermal Technology for Remote Cooling Architectures; Towards Embedded Thermal Architectures; Volume 3: Phase Change Materials for Thermal Management of Electronic Components (Gennady Ziskind & Yoram Kozak): Introduction to Phase-Change Materials; Overview of Phase-Change Materials; Modeling Approaches; Experimental Methods; Basic Geometries and Processes; Heat Sinks; Enhanced Systems; PCM Slurries; Case Studies;

Read more less

Book SynopsisThis two-volume, 1100 pages, 38 chapters book is a significantly expanded, revised and updated version of the monograph by the authors published in 2013 (Ben-Dor, G, Dubinsky, A, Elperin, T, 'High Speed Penetration Dynamics: Engineering Models and Methods,' Singapore: World Scientific Publishing Company). The contents increased by 60%, the number of titles in bibliography doubled and reached 1600; and the scope covers a range of new topics related to hypervelocity penetration, along with high-speed impact.Presented material is structured into two parts. The first part includes description and analysis of practically all known engineering models for calculating high-speed penetration of projectiles into concrete, metals, geological shields, adobe, and gelatine.The second part focuses on the use of approximate models for solving conventional and non-standard problems of penetration mechanics including prediction and optimization of protective properties of monolithic and multi-layered shields against high-speed projectiles and space debris; shape optimization of high-speed projectiles penetrating into various media; modelling of penetration and optimal control of penetrators equipped with jet thrusters; and investigation of the efficiency and optimization of segmented projectiles. The book includes comprehensive overviews on basic classes of problems in high-speed penetration mechanics.This is a indispensable reference guide for scientists, engineers, and students specializing in the field of high-speed and hypervelocity penetration mechanics.

Read more less

Book SynopsisThis Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Read more less

Book SynopsisThis Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Read more less

Book SynopsisThis Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Read more less

Book SynopsisThis Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Read more less

Book SynopsisThis important monograph is the first comprehensive compendium of engineering models used in high-speed penetration mechanics.The book consists of two parts. The first part (more than a quarter of the book's content) is in fact a handbook giving a very detailed summary of the engineering models used for the analysis of high-speed penetration of rigid projectiles into various media (concrete, metals, geological media). The second part of the book demonstrates the possibilities and efficiency of using approximate models for investigating traditional and nontraditional problems of penetration mechanics.Different chapters in the books are devoted to different classes of problems and can be read independently. Each chapter is self-contained, which includes a comprehensive literature survey of the topic, and carries a list of used notations. The bibliography includes more than 700 references.This monograph is a reliable and indispensable reference guide for anyone interested in using engineering models in high-speed penetration mechanics.Table of ContentsSome Conventional Approaches to Penetration Modeling: Localized Interaction Models; Cavity Expansion Approximations; Penetration into Concrete Shields: Empirical Models; Analytical Models; Penetration into Metallic Shields: Empirical Models; Analytical Models; Penetration into Geological Shields: Empirical Models; Analytical Models; Some Special Inverse Problems: Theoretical Basis of the Method; Application to Penetration Mechanics; Method of Basic Impactors for Prediction of Penetration and Perforation: Simplified Version of the Method; Complete Version of the Method; Shape Optimization of Impactors: Survey; Penetration with Non-Constant Friction; Semi-Infinite Concrete Shields; Metal Shields with a Finite Thickness; Fiber Reinforced Plastic Laminates; Effectiveness of Segmented Impactors: High-Speed Impact; Simplified Discrete Model; High-Speed Impact. Generalized Discrete and Continuous Models; Hypervelocity Impact; Modeling and Optimal Control of Impactors with Jet Thruster: Application of Two-Term Model of Penetration; Application of the Modified Young's Model; Effect of the Order of Plates, Layering and Spacing on Protective Properties of Ductile Shields: Survey; Effect of Spacing for Non-Conical Impactors. Numerical Simulation; Effect of the Order of Plates for Non-Conical Impactors. Numerical Simulation; Effect of Layering. Theoretical Analysis; Optimization of Multi-Layer Shields; Some Optimization Problems for Non-Homogeneous Non-Ductile Shields: Optimization of Reinforced Concrete Panels with Steel Liner; Optimization of Two-Component Armor against Single and Repeated Impacts; Appendix: Some Properties of Convex/Concave Increasing Positive Functions.

Read more less

Book SynopsisThis Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Read more less

Book SynopsisWith the rapid development of machinery, materials science and energy engineering technology in China, new theories and application results constantly appear. Higher and newer requirements in these fields are sought by business enterprises and members of the engineering profession.This conference was held to further promote the exchange and cooperation among local researchers, to upgrade the academic standards and international influence on the study of these fields in China, and to play a positive role in bridging the gap with the international research community.This volume consists of 106 peer-reviewed articles by local and foreign eminent scholars which cover the frontiers and hot topics in machinery and process equipment, materials science, energy engineering and mechatronics.

Read more less