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Edições Nosso Conhecimento DISTRIBUIÇÃO ÓPTIMA DE ENERGIA ELÉCTRICA NA CIDADE DE GOMA
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Wydawnictwo Nasza Wiedza Zastosowania systemów sterowania w przemyle papierniczym
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Verlag Unser Wissen LeitsystemAnwendungen in der Papierindustrie
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Edizioni Sapienza Applicazioni del sistema di controllo nellindustria cartaria
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Wydawnictwo Nasza Wiedza Raport na temat promieniowania wie komórkowych
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Verlag Unser Wissen Bericht über die Strahlung von Mobilfunkmasten
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Wiley-VCH Verlag GmbH Implantable Bioelectronics
Book SynopsisHere the renowned editor Evgeny Katz has chosen contributions that cover a wide range of examples and issues in implantable bioelectronics, resulting in an excellent overview of the topic. The various implants covered include biosensoric and prosthetic devices, as well as neural and brain implants, while ethical issues, suitable materials, biocompatibility, and energy-harvesting devices are also discussed. A must-have for both newcomers and established researchers in this interdisciplinary field that connects scientists from chemistry, material science, biology, medicine, and electrical engineering.Table of ContentsImplantable Bioelectronics - Editorial Introduction Magnetically-Functionalised Cells: Fabrication, Characterization and Biomedical Applications Untethered Insect Interfaces Miniaturized Biomedical Implantable Devices Cross-Hierarchy Design Exploration for Implantable Electronics Neural Interfaces: From Human Nerves to Electronics Cyborgs - The Neuro-Tech Version Interacting with Implanted Devices Through Implanted User Interfaces Ultra-Low Power and Robust On-Chip Digital Signal Processing for Closed-Loop Neuro-Prosthesis Implantable CMOS Imaging Devices Implanted Wireless Biotelemetry Nano-Enabled Implantable Device for In-Vivo Glucose Monitoring Improving the Biocompatibility of Implantable Bioelectronics Devices Abiotic (Non-Enzymatic) Implantable Biofuel Cells Direct Electron Transfer Based Enzymatic Fuel Cells In Vitro, Ex Vivo, and In Vivo Enzymatic Fuel Cells: From Design to Implantation in Mammals Implanted Biofuel Cells Operating In Vivo Biomedical Implantable Systems----History, Design and Trends Brain Computer Interfaces: Ethical and Policy Considerations Conclusions and Perspectives
£134.06
Wiley-VCH Verlag GmbH Analysis and Design of Electrical Power Systems:
Book SynopsisA one-stop resource on how to design standard-compliant low voltage electrical systems This book helps planning engineers in the design and application of low voltage networks. Structured according to the type of electrical system, e.g. asynchronous motors, three-phase networks, or lighting systems, it covers the respective electrical and electrotechnical fundamentals, provides information on the implementation of the relevant NEC and IEC standards, and gives an overview of applications in industry. Analysis and Design of Electrical Power Systems: A Practical Guide and Commentary on NEC and IEC 60364 starts by introducing readers to the subject before moving on to chapters on planning and project management. It then presents readers with complete coverage of medium- and low-voltage systems, transformers, asynchronous motors (ASM), switchgear combinations, emergency generators, and lighting systems. It also looks at equipment for overcurrent protection and protection against electric shock, as well as selectivity and backup protection. A chapter on the current carrying capacity of conductors and cables comes next, followed by ones on calculation of short circuit currents in three-phase networks and voltage drop calculations. Finally, the book takes a look at compensating for reactive power and finishes with a section on lightning protection systems. Covers a subject of great international importance Features numerous tables, diagrams, and worked examples that help practicing engineers in the planning of electrical systems Written by an expert in the field and member of various national and international standardization committees Supplemented with programs on an accompanying website that help readers reproduce and adapt calculations on their own Analysis and Design of Electrical Power Systems: A Practical Guide and Commentary on NEC and IEC 60364 is an excellent resource for all practicing engineers such as electrical engineers, engineers in power technology, etc. who are involved in electrical systems planning.Table of ContentsPreface xv Acknowledgments xvii Symbols xix Abbreviations xxvii 1 Introduction 1 2 Electrical Systems 5 2.1 High-Voltage Power Systems 5 2.2 Transformer Selection Depending on Load Profiles 9 2.3 Low-Voltage Power Systems 10 2.4 Examples of Power Systems 17 2.4.1 Example 1: Calculation of the Power 17 2.4.2 Example 2: Calculation of the Main Power Line 17 2.4.3 Example: Power Supply of a Factory 17 3 Design of DC Current Installations 21 3.1 Earthing Arrangement 21 3.2 Protection Against Overcurrent 22 3.3 Architecture of Installations 23 4 Smart Grid 25 5 Project Management 27 5.1 Guidelines for Contracting 27 5.2 Guidelines for Project Planning of Electrical Systems 28 6 Three-Phase Alternating Current 31 6.1 Generation of Three-Phase Current 31 6.2 Advantages of the Three-Phase Current System 31 6.3 Conductor Systems 32 6.4 Star Connection 36 6.5 Triangle Circuit 37 6.6 Three-Phase Power 38 6.7 Example: Delta Connection 39 6.8 Example: Star Connection 41 6.9 Example: Three-Phase Consumer 43 6.10 Example: Network Calculation 44 6.11 Example: Network 45 6.12 Example: Star Connection 47 7 Symmetrical Components 49 7.1 Symmetrical Network Operation 49 7.2 Unsymmetrical Network Operation 51 7.3 Description of Symmetrical Components 51 7.4 Examples of Unbalanced Short-Circuits 54 7.4.1 Example: Symmetrical Components 54 7.4.2 Example: Symmetrical Components 54 7.4.3 Example: Symmetrical Components 55 8 Short-Circuit Currents 57 8.1 Introduction 57 8.2 Fault Types, Causes, and Designations 60 8.3 Short-circuit with R–L Network 61 8.4 Calculation of the Stationary Continuous Short-circuit 63 8.5 Calculation of the Settling Process 64 8.6 Calculation of a Peak Short-Circuit Current 65 8.6.1 Impact Factor for Branched Networks 65 8.6.2 Impact Factor for Meshed Networks 65 8.7 Calculation of the Breaking Alternating Current 66 8.8 Near-Generator Three-Phase Short-circuit 66 8.9 Calculation of the Initial Short-Circuit Alternating Current 67 8.10 Short-Circuit Power 68 8.11 Calculation of Short-Circuit Currents in Meshed Networks 68 8.11.1 Superposition Method 68 8.11.2 Method of Equivalent Voltage Source 70 8.12 The Equivalent Voltage Source Method 72 8.13 Short-Circuit Impedances of Electrical Equipment 72 8.13.1 Network Feeders 73 8.13.2 Synchronous Machines 74 8.13.3 Transformers 75 8.13.4 Consideration of Motors 76 8.13.5 Overhead Lines, Cables, and Lines 78 8.13.6 Impedance Corrections 79 8.14 Calculation of Short-Circuit Currents 81 8.14.1 Three-Phase Short-circuits 81 8.14.2 Line-to-Line Short-circuit 82 8.14.3 Single-Phase Short-circuits to Ground 82 8.14.4 Calculation of Loop Impedance 83 8.14.5 Peak Short-Circuit Current 85 8.14.6 Symmetrical Breaking Current 85 8.14.7 Steady-State Short-circuit Current 87 8.15 Thermal and Dynamic Short-circuit Strength 87 8.16 Examples for the Calculation of Short-Circuit Currents 89 8.16.1 Example 1: Calculation of the Short-Circuit Current in a DC System 89 8.16.2 Example 2: Calculation of Short-Circuit Currents in a Building Electrical System 91 8.16.3 Example 3: Dimensioning of an Exit Cable 92 8.16.4 Example 4: Calculation of Short-Circuit Currents with Zero-Sequence Resistances 93 8.16.5 Example 5: Complex Calculation of Short-Circuit Currents 94 8.16.6 Example 6: Calculation with Effective Power and Reactive Power 97 8.16.7 Example 7: Complete Calculation for a System 101 8.16.8 Example 8: Calculation of Short-Circuit Currents with Impedance Corrections 111 8.16.9 Example: Load Voltage and Zero Impedance 113 8.16.10 Example: Power Transmission 116 9 Relays 119 9.1 Terms and Definitions 119 9.2 Introduction 119 9.3 Requirements 121 9.4 Protective Devices for Electric Networks 121 9.5 Type of Relays 122 9.5.1 Electromechanical Protective Relays 122 9.5.2 Static Protection Relays 122 9.5.3 Numeric Protection Relays 122 9.6 Selective Protection Concepts 123 9.7 Overcurrent Protection 124 9.7.1 Examples for Independent Time Relays 126 9.8 Reserve Protection for IMT Relays with Time Staggering 126 9.9 Overcurrent Protection with Direction 126 9.10 Dependent Overcurrent Time Protection (DMT) 129 9.11 Differential Relays 131 9.12 Distance Protection 133 9.12.1 Method of Distance Protection 135 9.12.2 Distance Protection Zones 135 9.12.3 Relay Plan 135 9.13 Motor Protection 138 9.14 Busbar Protection 138 9.15 Saturation of Current Transformers 140 9.16 Summary 141 10 Power Flow in Three-Phase Network 143 10.1 Terms and Definitions 143 10.2 Introduction 143 10.3 Node Procedure 145 10.4 Simplified Node Procedure 148 10.5 Newton–Raphson Procedure 151 11 Substation Earthing 155 11.1 Terms and Definitions 155 11.2 Methods of Neutral Earthing 160 11.2.1 Isolated Earthing 162 11.2.2 Resonant Earthing 163 11.2.3 Double Earth Fault 164 11.2.4 Solid (Low-Impedance) Earthing 166 11.3 Examples for the Treatment of the Neutral Point 166 11.3.1 Example: Earth Fault CurrentWhen Operating with Free Neutral Point 166 11.3.2 Example: Calculation of Earth Fault Currents 167 11.3.3 Example: Ground Fault Current of a Cable 167 11.3.4 Example: Earth Leakage Coil 168 11.3.5 Example: Arc Suppression Coil 168 11.4 Dimensioning of Thermal Strength 168 11.5 Methods of Calculating Permissible Touch Voltages 169 11.6 Methods of Calculating Permissible Step Voltages 172 11.7 Current Injunction in the Ground 172 11.8 Design of Earthing Systems 173 11.9 Types of Earth Rods 175 11.9.1 Deep Rod 175 11.9.2 Earthing Strip 175 11.9.3 Mesh Earth 176 11.9.4 Ring Earth Electrode 177 11.9.5 Foundation Earthing 177 11.10 Calculation of the Earthing Conductors and Earth Electrodes 177 11.11 Substation Grounding IEEE Std. 80 178 11.11.1 Tolerable Body Current 178 11.11.2 Permissible Touch Voltages 179 11.11.3 Calculation of the Conductor Cross Section 180 11.11.4 Calculation of the Maximum Mesh Residual Current 181 11.12 Soil Resistivity Measurement 182 11.13 Measurement of Resistances and Impedances to Earth 184 11.14 Example: Calculation of a TR Station 184 11.15 Example: Earthing Resistance of a Building 186 11.15.1 Foundation Earthing REF 186 11.15.2 Ring Earth Electrode 1 RER1 187 11.15.3 Ring Earth Electrode 2 RER2 187 11.15.4 Deep Earth Electrode RET 187 11.15.5 Total Earthing Resistance RETotal 188 11.16 Example: Cross-Sectional Analysis 188 11.17 Example: Cross-Sectional Analysis of the Earthing Conductor 189 11.18 Example: Grounding Resistance According to IEEE Std. 80 190 11.19 Example: Comparison of IEEE Std. 80 and EN 50522 193 11.20 Example of Earthing Drawings and Star Point Treatment of Transformers 194 11.21 Software for Earthing Calculation 199 11.21.1 Numerical Methods for Grounding System Analysis 199 11.21.2 IEEE Std. 80 and EN 50522 203 11.21.3 Summary 217 12 Protection Against Electric Shock 219 12.1 Voltage Ranges 221 12.2 Protection by Cut-Off orWarning Messages 222 12.2.1 TN Systems 222 12.2.2 TT Systems 224 12.2.3 IT Systems 226 12.2.4 Summary of Cut-Off Times and Loop Resistances 228 12.2.5 Example 1: Checking Protective Measures 229 12.2.6 Example 2: Determination of Rated Fuse Current 231 12.2.7 Example 3: Calculation of Maximum Conductor Length 231 12.2.8 Example 4: Fault Current Calculation for a TT System 231 12.2.9 Example 5: Cut-Off Condition for an IT System 232 12.2.10 Example 6: Protective Measure for Connection Line to a House 232 12.2.11 Example 7: Protective Measure for a TT System 233 13 Equipment for Overcurrent Protection 235 13.1 Electric Arc 235 13.1.1 Electric Arc Characteristic 235 13.1.2 DC Cut-Off 237 13.1.3 AC Cut-Off 237 13.1.3.1 Cut-Off for Large Inductances 238 13.1.3.2 Cut-Off of Pure Resistances 239 13.1.3.3 Cut-Off of Capacitances 239 13.1.3.4 Cut-Off of Small Inductances 239 13.1.4 Transient Voltage 240 13.2 Low-Voltage Switchgear 241 13.2.1 Characteristic Parameters 241 13.2.2 Main or Load Switches 242 13.2.3 Motor Protective Switches 242 13.2.4 Contactors and Motor Starters 244 13.2.5 Circuit-Breakers 244 13.2.6 RCDs (Residual Current Protective Devices) 245 13.2.7 Main Protective Equipment 248 13.2.8 Meter Mounting Boards with Main Protective Switch 249 13.2.9 Fuses 251 13.2.9.1 Types of Construction 253 13.2.10 Power Circuit-Breakers 256 13.2.10.1 Short-Circuit Categories in Accordance with IEC 60947 258 13.2.10.2 Breaker Types 259 13.2.11 Load Interrupter Switches 260 13.2.12 Disconnect Switches 260 13.2.13 Fuse Links 261 13.2.14 List of Components 261 14 Current Carrying Capacity of Conductors and Cables 263 14.1 Terms and Definitions 263 14.2 Overload Protection 264 14.3 Short-Circuit Protection 265 14.3.1 Designation of Conductors 268 14.3.2 Designation of Cables 269 14.4 Current Carrying Capacity 270 14.4.1 Loading Capacity Under Normal Operating Conditions 270 14.4.2 Loading Capacity Under Fault Conditions 271 14.4.3 Installation Types and Load Values for Lines and Cables 273 14.4.4 Current Carrying Capacity of Heavy Current Cables and Correction Factors for Underground and Overhead Installation 276 14.5 Examples of Current Carrying Capacity 280 14.5.1 Example 1: Checking Current Carrying Capacity 280 14.5.2 Example 2: Checking Current Carrying Capacity 285 14.5.3 Example 3: Protection of Cables in Parallel 290 14.5.4 Example 4: Connection of a Three-Phase Cable 293 14.5.5 Example 5: Apartment Building Without ElectricalWater Heating 294 14.6 Examples for the Calculation of Overcurrents 300 14.6.1 Example 1: Determination of Overcurrents and Short-Circuit Currents 300 14.6.2 Example 2: Overload Protection 302 14.6.3 Example 3: Short-Circuit Strength of a Conductor 303 14.6.4 Example 4: Checking Protective Measures for Circuit-Breakers 304 15 Selectivity and Backup Protection 309 15.1 Selectivity 309 15.2 Backup Protection 317 16 Voltage Drop Calculations 321 16.1 Consideration of the Voltage Drop of a Line 321 16.2 Example: Voltage Drop on a 10 kV Line 325 16.3 Example: Line Parameters of a Line 325 16.4 Example: Line Parameters of a Line 327 16.5 Voltage Regulation 328 16.5.1 Permissible Voltage Drop in Accordance With the Technical Conditions for Connection 328 16.5.2 Permissible Voltage Drop in Accordance With Electrical Installations in Buildings 329 16.5.3 Voltage Drops in Load Systems 329 16.5.4 Voltage Drops in Accordance With IEC 60364 330 16.5.5 Parameters for the Maximum Line Length 330 16.5.6 Summary of Characteristic Parameters 333 16.5.7 Lengths of Conductors With a Source Impedance 334 16.6 Examples for the Calculation of Voltage Drops 334 16.6.1 Example 1: Calculation of Voltage Drop for a DC System 334 16.6.2 Example 2: Calculation of Voltage Drop for an AC System 335 16.6.3 Voltage Drop for a Three-Phase System 336 16.6.4 Example 4: Calculation of Voltage Drop for a Distributor 338 16.6.5 Calculation of Cross Section According to Voltage Drop 338 16.6.6 Example 6: Calculation of Voltage Drop for an Industrial Plant 339 16.6.7 Example 7: Calculation of Voltage Drop for an Electrical Outlet 339 16.6.8 Example 8: Calculation of Voltage Drop for a HotWater Storage Unit 339 16.6.9 Example 9: Calculation of Voltage Drop for a Pump Facility 339 16.6.10 Example: Calculation of Line Parameters 340 17 Switchgear Combinations 343 17.1 Terms and Definitions 343 17.2 Design of the Switchgear 347 17.2.1 Data for Design 347 17.2.2 Design of the Distributor and Proof of Construction 348 17.2.3 Short-Circuit Resistance Proofing 348 17.2.4 Proof of Heating 349 17.2.5 Determination of an Operating Current 349 17.2.6 Determination of Power Losses 350 17.2.7 Determination of a Design Loading Factor RDF 350 17.2.8 Determination of an Operating Current 350 17.2.9 Check of Short-Circuit Variables 351 17.2.10 Construction and Manufacturing of the Distribution 351 17.2.11 CE Conformity 352 17.3 Proof of Observance of Boundary Overtemperatures 352 17.4 Power Losses 353 18 Compensation for Reactive Power 355 18.1 Terms and Definitions 355 18.2 Effect of Reactive Power 358 18.3 Compensation for Transformers 358 18.4 Compensation for Asynchronous Motors 359 18.5 Compensation for Discharge Lamps 359 18.6 c∕k Value 360 18.7 Resonant Circuits 360 18.8 Harmonics and Voltage Quality 360 18.8.1 CompensationWith Nonchoked Capacitors 362 18.8.2 Inductor–Capacitor Units 363 18.8.3 Series Resonant Filter Circuits 365 18.9 Static Compensation for Reactive Power 365 18.9.1 Planning of Compensation Systems 368 18.10 Examples of Compensation for Reactive Power 368 18.10.1 Example 1: Determination of Capacitive Power 368 18.10.2 Example 2: Capacitive Power With k Factor 369 18.10.3 Example 3: Determination of Cable Cross Section 369 18.10.4 Example 4: Calculation of the c∕k Value 370 19 Lightning Protection Systems 371 19.1 Lightning Protection Class 373 19.2 Exterior Lightning Protection 374 19.2.1 Air Terminal 374 19.2.2 Down Conductors 375 19.2.3 Grounding Systems 379 19.2.3.1 Minimum Length of Ground Electrodes 385 19.2.4 Example 1: Calculation of Grounding Resistances 386 19.2.5 Example 2: Minimum Lengths of Grounding Electrodes 387 19.2.6 Exposure Distances in theWall Area 387 19.2.7 Grounding of Antenna Systems 389 19.2.8 Examples of Installations 389 19.3 Interior Lightning Protection 392 19.3.1 The EMC Lightning Protection Zone Concept 392 19.3.2 Planning Data for Lightning Protection Systems 395 20 Lighting Systems 399 20.1 Interior Lighting 399 20.1.1 Terms and Definitions 399 20.2 Types of Lighting 400 20.2.1 Normal Lighting 400 20.2.2 Normal Workplace-Oriented Lighting 400 20.2.3 Localized Lighting 400 20.2.4 Technical Requirements for Lighting 401 20.2.5 Selection and Installation of Operational Equipment 401 20.2.6 Lighting Circuits for Special Rooms and Systems 402 20.3 Lighting Calculations 403 20.4 Planning of Lighting with Data Blocks 405 20.4.1 System Power 405 20.4.2 Distribution of Luminous Intensity 405 20.4.3 Luminous Flux Distribution 405 20.4.4 Efficiencies 406 20.4.5 Spacing Between Lighting Elements 407 20.4.6 Number of Fluorescent Lamps in a Room 407 20.4.7 Illuminance Distribution Curves 407 20.4.8 Maximum Number of Fluorescent Lamps on Switches 407 20.4.9 Maximum Number of Discharge Lamps Per Circuit-Breaker 408 20.4.10 Mark of Origin 408 20.4.11 Standard Values for Planning Lighting Systems 409 20.4.12 Economic Analysis and Costs of Lighting 409 20.5 Procedure for Project Planning 412 20.6 Exterior Lighting 413 20.7 Low-Voltage Halogen Lamps 415 20.8 Safety and Standby Lighting 416 20.8.1 Terms and Definitions 416 20.8.2 Circuits 417 20.8.3 Structural Types for Groups of People 417 20.8.4 Planning and Configuring of Emergency Symbol and Safety Lighting 417 20.8.5 Power Supply 421 20.8.6 Notes on Installation 422 20.8.7 Testing During Operation 422 20.9 Battery Systems 423 20.9.1 Central Battery Systems 423 20.9.2 Grouped Battery Systems 427 20.9.3 Single Battery Systems 429 20.9.4 Example: Dimensioning of Safety and Standby Lighting 432 21 Generators 435 21.1 Generators in Network Operation 437 21.2 Connecting Parallel to the Network 438 21.3 Consideration of Power and Torque 438 21.4 Power Diagram of a Turbo Generator 439 21.5 Example 1: Polar Wheel Angle Calculation 440 21.6 Example 2: Calculation of the Power Diagram 440 22 Transformer 441 22.1 Introduction 441 22.2 Core 445 22.3 Winding 446 22.4 Constructions 446 22.5 AC Transformer 446 22.5.1 Construction 446 22.5.2 Mode of Action 447 22.5.3 Idling Stress 448 22.5.4 Voltage and Current Translation 448 22.5.5 Operating Behavior of the Transformer 449 22.6 Three-phase Transformer 452 22.6.1 Construction 452 22.6.2 Windings 452 22.6.3 Circuit Groups 452 22.6.4 Overview of Vector Groups 454 22.6.5 Parallel Connection of Transformers 454 22.7 Transformers for Measuring Purposes 457 22.7.1 Current Transformers 457 22.7.2 Voltage Transformer 457 22.7.3 Frequency Transformer 458 22.8 Transformer Efficiency 459 22.9 Protection of Transformers 459 22.10 Selection of Transformers 459 22.11 Calculation of a Continuous Short-Circuit Current on the NS Side of a Transformer 461 22.12 Examples of Transformers 462 22.12.1 Example 1: Calculation of the Continuous Short-Circuit Current 462 22.12.2 Example: Calculation of a Three-phase Transformer 462 23 Asynchronous Motors 467 23.1 Designs and Types 467 23.1.1 Principle of Operation (No-Load) 468 23.1.1.1 Motor Behavior 469 23.1.1.2 Generator Behavior 469 23.1.2 Typical Speed–Torque Characteristics 469 23.2 Properties Characterizing Asynchronous Motors 471 23.2.1 Rotor Frequency 471 23.2.2 Torque 471 23.2.3 Slip 472 23.2.4 Gear System 472 23.3 Startup of Asynchronous Motors 473 23.3.1 Direct Switch-On 473 23.3.2 Star Delta Startup 474 23.4 Speed Adjustment 479 23.4.1 Speed Control by the Slip 479 23.4.2 Speed Control by Frequency 479 23.4.3 Speed Control by Pole Changing 480 23.4.4 Soft Starters 481 23.4.5 Example: Calculation of Overload and Starting Conditions 483 23.4.6 Example: Calculation of Motor Data 484 23.4.7 Example: Calculation of the Belt Pulley Diameter and Motor Power 485 23.4.8 Example: Dimensioning of a Motor 485 24 Questions About Book 487 24.1 Characteristics of Electrical Cables 487 24.2 Dimensioning of Electric Cables 487 24.3 Voltage Drop and Power Loss 488 24.4 Protective Measures and Earthing in the Low-voltage Power Systems 488 24.5 Short Circuit Calculation 488 24.6 Switchgear 489 24.7 Protection Devices 489 24.8 Electric Machines 489 References 491 Index 495
£999.99
Wiley-VCH Verlag GmbH Hybridized and Coupled Nanogenerators: Design,
Book SynopsisA comprehensive guide to efficiently scavenge multi-energies from the surrounding environment to power some electronic devices and realize self-powered sensing! With the advantages of high-integration level, low cost, and high-conversion efficiency, hybridized nanogenerators have many potential applications in multi-energy scavenging and sensor fields. This book offers a comprehensive review of the design, performance, and applications of hybridized and coupled nanogenerators. The authora noted expert on the topicexplores the various new hybridized and multi-effects coupled nanogenerators. The book examines the current approaches of improving electric generation performance and offers an introduction to the applications of hybridized nanogenerators in energy harvesting and sensing. This technology has proven to be highly applicable in multi-energy scavenging and self-powered sensor fields. This book includes: Examines the potential applications of hybridized and coupled nanogenerators in multi-energy scavenging and sensor fields Covers the principles of device design Explores the most current approaches to improve performance Reviews various multi-effects coupled nanogenerators and their potential applications Written for materials scientists, engineering scientists, electronics engineers, bioengineers, sensor developers, and sensor industry professionals, This book is a guide to hybridized and coupled nanogenerators that achieve the maximum utilization of multi-type and stable energies.Table of ContentsForewords xi Preface xiii 1 Overview 1 1.1 Introduction 1 1.2 Hybridized Nanogenerators 2 1.2.1 Hybrid Energy Cells 2 1.2.2 Electromagnetic–Triboelectric Hybridized Nanogenerators 4 1.2.3 Other Hybridized Nanogenerators 6 1.3 Coupled Nanogenerators 9 1.3.1 Pyroelectric and Photovoltaic Coupled Nanogenerators 10 1.3.2 Multi-effects Coupled Nanogenerators 10 1.4 Applications 13 1.5 Conclusion and Prospects 14 References 15 2 Wind-Driven Triboelectric Nanogenerators 19 2.1 Introduction 19 2.2 Conventional Wind Harvester 19 2.2.1 Working Mechanisms and Devices Structure 19 2.2.2 Applications 21 2.3 Triboelectric Nanogenerators for Scavenging Wind Energy 21 2.3.1 Fundamental Modes and Structure 21 2.3.1.1 Vibrating Plate-Based TENGs 21 2.3.1.2 Enhanced Plate-Based TEGs 22 2.3.1.3 Elasto-aerodynamics-Driven TENGs 25 2.3.1.4 Others 25 2.3.2 Materials 27 2.3.2.1 Cellulose 27 2.3.2.2 Metal 29 2.3.2.3 Polymer 30 2.3.2.4 Nanoparticle and Nanowire 31 2.3.3 Performance 33 2.3.3.1 Mechanical Behavior 33 2.3.3.2 Electrical Output 37 2.3.4 Applications 41 2.3.4.1 Self-Powered Printer 41 2.3.4.2 Wind Gauging System 42 2.3.4.3 Polarization of Ferroelectric Materials 43 2.3.4.4 Self-Powered Wearable Electronics 43 2.3.4.5 Others 46 2.4 Comparison 52 2.5 Conclusion 53 References 53 3 Electromagnetic–Triboelectric Hybridized Nanogenerators 59 3.1 Introduction 59 3.2 Working Mechanisms 59 3.3 Hybridized Devices Structure and Working Mechanisms 61 3.3.1 Shared-Electrode-Based EMG–TENG 61 3.3.2 Rotating-Disk-Based EMG–TENG 61 3.3.3 Spring-Based EMG–TENG 64 3.3.4 Stretchable EMG–TENG 66 3.3.5 Others 67 3.4 Materials 73 3.4.1 Glass Fibers/Silver Nanowires 74 3.4.2 Composite Materials 74 3.4.3 Materials with Rough Structures 74 3.4.4 Others 75 3.5 Performance 76 3.5.1 Conjunction Manipulation 76 3.5.2 Output Characteristics 77 3.6 Applications 84 3.6.1 Powering Electronic Devices 85 3.6.2 Self-Powered Wearable Electronics 86 3.6.3 Others 87 3.7 Summary and Perspectives 90 References 91 4 Other Hybridized Nanogenerators 97 4.1 Introduction 97 4.1.1 Nanogenerators for Harvesting Solar Energy 97 4.1.2 Nanogenerators for Harvesting Electrochemical Energy 101 4.2 Hybridized Photoelectric and Piezoelectric Nanogenerator 107 4.2.1 Typical Materials and Structure Design 110 4.2.2 Principles 110 4.2.3 Applications and Performances 115 4.3 Hybridized Photoelectric and Triboelectric Nanogenerator 116 4.3.1 Materials and Fabrication 116 4.3.2 Principles and Performances 116 4.3.3 Applications 119 4.4 Hybridized Photoelectric and Pyroelectric Nanogenerator 122 4.4.1 Materials and Structure Design 122 4.4.2 Principles and Applications 122 4.4.3 Performances 126 4.5 Conclusions and Prospects 128 References 128 5 Hybridizing Nanogenerators and Sensors 133 5.1 Introduction 133 5.2 Materials 133 5.2.1 Organic Materials 133 5.2.2 Inorganic Materials 134 5.3 Design of Self-Powered Sensors 137 5.3.1 Pressure Sensors 137 5.3.2 Strain Sensors 140 5.3.3 Temperature Sensors 142 5.3.4 Photodetectors 144 5.3.5 Magnetic Sensors 147 5.4 Performance 148 5.4.1 Sensitivity 148 5.4.2 Response Speed 154 5.4.3 Stability 157 5.5 Applications 162 5.5.1 Touch and Motion Detection 162 5.5.2 Strain Detection 163 5.5.3 Temperature Detection 166 5.5.4 Image Sensor 166 5.6 Conclusion and Prospects 168 References 170 6 Hybridizing Nanogenerators and Energy Storage Devices 173 6.1 Introduction 173 6.2 Working Mechanisms 177 6.2.1 Piezoelectric Nanogenerator-Based Energy Storage Devices 177 6.2.1.1 PENG-Based Li-ion Batteries 177 6.2.1.2 PENG-Based Supercapacitors 178 6.2.2 Triboelectric Nanogenerator-Based Energy Storage Devices 180 6.2.2.1 TENG-Based Lithium-Ion Batteries 180 6.2.2.2 TENG-Based Supercapacitors 186 6.3 Materials 188 6.3.1 Typical Piezoelectric Materials 188 6.3.2 Typical Triboelectric Materials 191 6.3.3 Materials for Lithium-Ion Batteries 194 6.3.4 Materials for Supercapacitors 196 6.4 Devices Structure and Design 198 6.4.1 Piezoelectric Nanogenerator-Based Energy Storage Devices 198 6.4.2 Triboelectric Nanogenerator-Based Energy Storage Devices 201 6.5 Performance 203 6.5.1 The Charging/Discharging Performance of Lithium-ion Batteries and Supercapacitors Based on Piezoelectric Nanogenerators 204 6.5.2 The Charging/Discharging Performance of Triboelectric Nanogenerator-Based Lithium-Ion Batteries and Supercapacitors 205 6.6 Applications 209 6.6.1 Powering Electronic Devices 209 6.6.2 Wearable/Portable Electronics 211 6.6.3 Other Applications 212 6.7 Conclusions and Prospects 212 References 214 7 Pyroelectric and Thermoelectric Nanogenerators 219 7.1 Introduction 219 7.2 Working Mechanisms 220 7.2.1 Pyroelectric Nanogenerators 220 7.2.2 Thermoelectric Nanogenerators 222 7.2.3 Comparison of Pyroelectric and Thermoelectric Nanogenerators 222 7.3 Progress of Pyroelectric Nanogenerators 223 7.3.1 Typical Pyroelectric Materials 223 7.3.2 Structure Design 227 7.3.3 Performance of Pyroelectric Nanogenerators 231 7.3.4 Applications for Sensing and Electrochemistry 235 7.4 Progress ofThermoelectric Nanogenerators 238 7.4.1 Typical Thermoelectric Materials 238 7.4.2 Structure Design 241 7.4.3 Thermoelectric Performance 245 7.4.4 Applications in Various Fields 247 7.5 Conclusions and Prospects 250 References 252 8 Photovoltaic–Pyroelectric Coupled Effect Nanogenerators 259 8.1 Introduction 259 8.2 Basic Principle 260 8.2.1 Pyroelectric Effect 260 8.2.2 Photovoltaic Effect 261 8.2.3 Photovoltaic–Pyroelectric Coupled Effect 262 8.2.4 Temperature Dependence of Photovoltaic–Pyroelectric Coupled Effect 265 8.3 Materials 266 8.3.1 ZnO Nanowires 266 8.3.2 BTO Materials 268 8.3.3 BFO Materials 268 8.3.4 Other Materials 269 8.4 Device Design 270 8.4.1 Vertical Structure 270 8.4.2 Planar Structure 271 8.5 Performance 272 8.5.1 Output Electric Signals 272 8.5.2 Resistance 273 8.5.3 Comparison of Vertical- and Planar-Structured Nanogenerators 275 8.5.4 Temperature Dependence 277 8.6 Applications 278 8.6.1 Common Photodetection 279 8.6.2 Image Photodetection 281 8.7 Conclusions and Prospects 286 References 287 9 Multi-effects Coupled Nanogenerators 293 9.1 Introduction 293 9.2 Materials 294 9.2.1 Semiconductors 294 9.2.2 Inorganic Ferroelectrics 296 9.2.3 Polymeric Ferroelectrics 297 9.3 Device Design and Working Principle 298 9.3.1 Electrode/Bulk Semiconductor/Electrode Structure 298 9.3.2 Electrode/Heterojunction/Electrode Structure 302 9.3.3 Electrode/Ferroelectrics/Electrode Structure 303 9.3.4 Other Structures 306 9.4 Performance 310 9.4.1 Output Characteristics for Harvesting Thermal and Light Energies 310 9.4.2 Output Performance for Scavenging Thermal and Mechanical Energies 315 9.4.3 Output Characteristics for Harvesting Light and Mechanical Energies 315 9.4.4 Output Characteristics for Harvesting Thermal, Light, and Mechanical Energies 316 9.5 Applications 320 9.5.1 Energy-Storage Device Charging 320 9.5.2 Electrics Powering 322 9.5.3 General Sensing 322 9.5.4 Multifunctional Sensing 323 9.5.5 Image Sensing 326 9.6 Conclusions and Prospects 331 References 331 10 Coupled Nanogenerators for New Physical Effects 337 10.1 Introduction 337 10.2 Pyro-Phototronic Effect 338 10.2.1 Introduction 338 10.2.2 Possible Semiconducting Materials 338 10.2.3 Applications 339 10.3 Ferro-Pyro-Phototronic Effect 341 10.3.1 Introduction 341 10.3.2 Possible Ferroelectric Materials 341 10.3.3 Applications 342 10.4 Thermo-Phototronic Effect 346 10.4.1 Introduction 346 10.4.2 Possible Thermoelectric Materials 346 10.4.3 Applications 347 10.5 Conclusions and Prospects 350 References 352 Index 357
£999.99
Wiley-VCH Verlag GmbH Foundations of Classical and Quantum Electrodynamics
Book SynopsisThis advanced textbook covers many fundamental, traditional and new branches of electrodynamics, as well as the related fields of special relativity, quantum mechanics and quantum electrodynamics. The book introduces the material at different levels, oriented towards 3rd-4th year bachelor, master, and PhD students. This is so as to describe the whole complexity of physical phenomena, instead of a mosaic of disconnected data. The required mathematical background is collated in Chapter 1, while the necessary physical background is included in the main text of the corresponding chapters and also given in appendices. The content is based on teaching material tested on students over many years, and their training to apply general theory for solving scientific and engineering problems. To this aim, the book contains approximately 800 examples and problems, many of which are described in detail. Some of these problems are designed for students to work on their own with only the answers and descriptions of results, and may be solved selectively. The examples are key ingredients to the theoretical course; the user should study all of them while reading the corresponding chapters. Equally suitable as a reference for researchers specialized in science and engineering.Table of ContentsPreface XI Fundamental Constants and Frequently Used Numbers XV Basic Notation XVII 1 The Mathematical Methods of Electrodynamics 1 1.1 Vector and Tensor Algebra 1 1.2 Vector and Tensor Calculus 18 1.3 The Special Functions of Mathematical Physics 41 1.4 Answers and Solutions 71 2 Basic Concepts of Electrodynamics: The Maxwell Equations 91 2.1 Electrostatics 91 2.2 Magnetostatics 112 2.3 Maxwell's Equations. Free Electromagnetic Field 131 2.4 Answers and Solutions 154 3 The Special Theory of Relativity and Relativistic Kinematics 193 3.1 The Principle of Relativity and Lorentz Transformations 193 3.2 Kinematics of Relativistic Particles 214 3.3 Answers and Solutions 233 4 Fundamentals of Relativistic Mechanics and Field Theory 271 4.1 Four-Dimensional Vectors and Tensors 271 4.2 The Motion of Charged Particles in Electromagnetic Fields. Transformation of the Electric Field 280 4.3 The Four-Dimensional Formulation of Electrodynamics. Introduction to Field Theory 313 4.4 Answers and Solutions 332 5 Emission and Scattering of Electromagnetic Waves 395 5.1 Green's Functions and Retarded Potentials 395 5.2 Emission in Nonrelativistic Systems of Charges and Currents 404 5.3 Emission by Relativistic Particles 416 5.4 Interaction of Charged Particles with Radiation 436 5.5 Answers and Solutions 449 6 Quantum Theory of Radiation Processes. Photon Emission and Scattering 513 6.1 Quantum Theory of the Free Electromagnetic Field 513 6.2 Quantum Theory of Photon Emission, Absorption, and Scattering by Atomic Systems 539 6.3 Interaction between Relativistic Particles 560 6.4 Answers and Solutions 581 7 Fundamentals of Quantum Theory of the Electron-Positron Field 631 7.1 Covariant Form of the Dirac Equation. Relativistic Bispinor Transformation 631 7.2 Covariant Quadratic Forms 636 7.3 Charge Conjugation and Wave Functions of Antiparticles 639 7.4 Secondary Quantization of the Dirac Field. Creation and Annihilation Operators for Field Quanta 640 7.5 Energy and Current Density Operators for Dirac Particles 643 7.6 Interaction between Electron-Positron and Electromagnetic Fields 645 7.7 Schrödinger Equation for Interacting Fields and the Evolution Operator 647 7.8 Scattering Matrix and Its Calculation 649 7.9 Calculations of Probabilities and Effective Differential Cross-Sections 652 7.10 Scattering of a Relativistic Particle with a Spin in the Coulomb Field 653 7.11 Green's Functions of Electron-Positron and Electromagnetic Fields 657 7.12 Interaction between Electrons and Muons 662 7.13 Higher-Order Corrections 667 7.14 Answers and Solutions 669 Appendix A Conversion of Electric and Magnetic Quantities between the International System of Units and the Gaussian System 675 Appendix B Variation Principle for Continuous Systems 677 B.1 Vibrations of an Elastic Medium as the Vibration Limit of Discrete Point Masses 677 B.2 The Lagrangian Form of Equations of Motion for a Continuous Medium 680 Appendix C General Outline of Quantum Theory 685 C.1 Spectrum of Physical Values and the Wave Function 685 C.2 State Vector 686 C.3 Indistinguishability of Identical Particles 687 C.4 Operators and Their Properties 688 C.5 Some Useful Formulas of Operator Algebra 698 C.6 Wave Functions of the Hydrogen-Like Atom (the Lowest Levels) 699 C.6.1 Addition of Angular Moments 700 C.6.2 Spin Operators and Wave Functions of Fermions (s D 1/2) 700 References 703 Index 709
£88.35
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Widerstände, Kondensatoren, Spulen und ihre
Book SynopsisTable of Contents1 Widerstände und ihre Werkstoffe.- 2 Kondensatoren und Isolierstoffe (dielektrische Werkstoffe).- 3 Spulen, Übertrager und magnetische Werkstoffe.- Anhang. Grundlagen der Zuverlässigkeitsanalyse und -synthese (A. Vlcek).- 1. Begriffsbestimmungen.- 2. Zuverlässigkeitsanalyse und -synthese.- 3. Ermittlung von Zuverlässigkeitsparametern.- Literatur.- 1. Widerstände und ihre Werkstoffe.- 2. Kondensatoren und Isolierstoffe (dielektrische Werkstoffe).- 3. Spulen, Übertrager und magnetische Werkstoffe.- Anhang. Grundlagen der Zuverlässigkeitsanalyse und -synthese.
£44.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG History of Semiconductor Engineering
Book SynopsisThis book provides a unique account of the history of integrated circuit, the microelectronics industry and the people involved in the development of transistor and integrated circuit. In this richly illustrated account the author argues that the group of inventors was much larger than originally thought. This is a personal recollection providing the first comprehensive behind-the-scenes account of the history of the integrated circuit. Trade ReviewFrom pre-publication reviews "Your book is going to make a major contribution to semiconductor history. You and I agree that, while the world loves a hero, semiconductor progress depended on the efforts and ideas of a large number of people, and that moving forward depended on contributors going back a few decades in some cases. Also, as is the case with most inventions, a number of people with access to the same pool of common knowledge were working independently at the same time to put it all together and to make the necessary extensions to the existing technology and who realized that the time was right for society to accept the new concepts. Your diligent research points all this out." Dr. Jay Last, former Shockley Laboratories employee, co-founder of Fairchild Semiconductor, co-founder of Amelco Semiconductor, and manager of the Fairchild’s group which design and produced the world first planar integrated circuit "Bo Lojek presents a remarkable document of the most important and significant technical development of our times. He describes in astounding detail the engineering efforts of modern microelectronics. He concentrates on the history of silicon semiconductor devices. California’s "Silicon Valley" is the center of attention, together with its ancestry of transistor invention at Bell Laboratories. He has collected a wealth of illustrative documentation, gives incisive insight into the lives of the main actors and shows the often tragic fates of the engineers and businessmen. He does not hide his firm believe in the individual engineer and warns of the retarding influence of present-day political correctness." Dr. Hans J. Queisser, former Shockley Semiconductor scientist and retired director of the Max-Planck-Institute for Solids, Stuttgart "The technical history of the semiconductor industry rivals the 1849 California Gold Rush as a period filled with excitement and opportunity. Although I cannot first hand validate its complete accuracy, I enthusiastically encourage you to read the collected facts, opinions, and views of an author who was actually part of this amazing period, viewing it as a successful practicing Engineer during this "gold rush" like hay-day of the semiconductor industry.For educators and technologists you will find this collection of data, facts, and opinions, collected and observed first hand by the author, fascinating! It is a tough read for others due to the writing experience of the author and its technical focus." John F. Gifford, former Fairchild Semiconductor Marketing Manager of Linear Integrated Circuits, co-founder of Advanced Micro Devices, and President and Chief Executive Officer of Maxim Integrated Products "Bo Lojek gets it right! There are few industries as dynamic as semiconductors and the history of the semiconductor industry is still unfolding. This book gives history of the people, places and the technology that resulted in today's semiconductor industry. I particularly like the inclusion of many technical pieces in the book." Robert Dobkin, former National Semiconductor Director of Advanced Circuit Development and co-founder and Chief Technical Officer of Linear Technology Corporation "This book contains an enormous amount of important material, much of it obtained by intense individual research by the author. The author's viewpoint leads him to different stories and credits from those generally accepted by the media. This feature may make the book more interesting reading for some. However, its real value is as remarkably detailed account of accomplishments that constitutes semiconductor microelectronics." Dr. Morgan Sparks, Former Bell Laboratories scientist, designer of the world's first junction transistor, and retired president of Sandia LaboratoriesTable of ContentsPrologue.- Research Organization: Bell Telephone Laboratories.- Grown Junction and Diffused Transistors.- Shockley Semiconductor Laboratories.- Fairchild Semiconductor Corporation — Subsidiary of Fairchild Camera and Instrument Company.- Driving the Company Out of Business.- Integrated Circuits outside Fairchild Semiconductor.- Linear Integrated Circuits: Pre-Widlar Era Prior to 1963.- Robert J. Widlar — The Genius, The Legend, The Bohemian.- National Semiconductor — A New Type of Semiconductor Company.- The MOS Transistor.- Epilogue.
£132.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Piezoelectric Sensorics: Force Strain Pressure Acceleration and Acoustic Emission Sensors Materials and Amplifiers
Book SynopsisFor the first time, this book covers the entire field of piezoelectric sensors for mechanical measurands. It gives extensive practical advice along with an overview of the most important piezoelectric materials and their properties, plus consistent terminology for describing sensors. Trade ReviewFrom the reviews: "Piezoelectric Sensorics is the first book written in English to cover the entire field of piezoelectric sensors for mechanical measurands. It provides a comprehensive overview of the subject and describes the characteristics and practical applications for each type of sensor presented. … This book is well written, technically informative and a pleasure to read. It provides extensive practical advice and clear coverage of the theory, making it suitable for students, scientists, technicians and engineers." (Sensor Review, Vol. 22 (4), 2002) "This book covers the entire field of piezoelectric sensors for mechanical measurands. Scientists, engineers and technicians, as well as students in engineering will find in this book for the first time a complete overview of this special type of sensors. Extensive practical advice is given throughout the text allowing the reader to profit from author’s many years of experience. … numerous examples illustrate the vast range of practical applications." (ETDE Energy Database, October, 2002)Table of Contents1 Introduction.- 2 Background of Piezoelectric Sensors.- 3 Piezoelectric Materials for Sensors.- 4 Piezoelectric Sensor Terminology.- 5 Piezoelectric Sensors.- 6 Force and Torque Sensors.- 7 Strain Sensors.- 8 Pressure Sensors.- 9 Acceleration Sensors.- 10 Acoustic Emission Sensors.- 11 Amplifiers for Piezoelectric Sensors.- References.- List of Manufacturers.
£85.49
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Taschenbuch der Hochfrequenztechnik: Band 1:
Book Synopsis
£113.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG MOS-Feldeffekttransistoren
Book SynopsisDieses moderne Lehr- und Nachschlagewerk stellt die Funktionsweise und elektronischen Eigenschaften der wichtigsten Prinzipien des MOS-Transistors- insbesondere f}r den VLSI- Bereich - umfassend dar. Verst{ndliche und zusammenfassend wertende Darstellung des Gleichstrom-, Wechselstrom-, Frequenz- und Schaltverhaltens des MOS-Transistors einschlie~lich der jeweiligen Transistormodelle. Betonte Behandlung der Besonderheiten f r den VLSI-Bereich (Einflu~ kleiner Abmessungen, Submikrometermodellierung, Einflu~ typischer Technologieschritte). Umfassendes Literaturverzeichnis bietet vielf{litge Vertiefungsm glichkeiten.Table of Contents1. Der MOS-Feldeffektransistor, das wichtigste Bauelement innerhalb der Familie der Feldeffekttransistoren.- 2. Der MOS-Transistor als Funktionselement. Grundlagen, Wirkprinzip und Kennlinienmodell.- 2.1 Der MOS-Zweipol.- 2.1.1 Die Raumladungszone.- 2.1.2 Einfluß von Austrittsarbeit und Oberflächenzuständen auf die Flachbandspannung.- 2.1.3 Kapazität des MOS-Zweipols.- 2.1.4 Der MOS-Zweipol mit zugängiger Inversionsschicht.- 2.2 Der MOS-Transitor. Grundlegende Kennlinieneigenschaften.- 2.2.1 Wirkprinzip. Grundmodell.- 2.3 Verbesserte Modellierung.- 2.3.1 Verallgemeinertes Flächenladungsmodell.- 2.3.1.1 Drift- und Diffusionsstrom-Kennlinienmodell.- 2.3.1.2 Kennlinie im Bereich starker Inversion.- 2.3.1.3 Linearisierung der Verarmungsladung.- 2.3.1.4 Vergleich der Kennlinienmodelle.- 2.3.1.5 Kennlinie bei schwacher Inversion.- 2.3.1.6 Bereich mittlerer Inversion.- 2.3.2 Besondere physikalische Effekte.- 2.3.2.1 Beweglichkeitsmodellierung.- 2.3.2.2 Kanallängenmodulation. Sättigungsverhalten.- 2.3.2.3 Durchbruchsverhalten.- 2.3.2.3.1 Lawinendurchbruch.- 2.3.2.3.2 Gatedurchbruch. Schutzmaßnahmen.- 2.3.3 Strom-Spannungsverhalten verschiedener MOSFET.- 2.3.3.1 p-Kanal-Anreicherungs-MOSFET.- 2.3.3.2 n-Kanal-Verarmungs-MOSFET.- 2.3.3.3 MOSFET mit implantiertem Kanal gleichen Leitungstyps zum Substrat.- 2.3.3.4 MOSFET mit implantiertem Kanal entgegengesetzten Leitungstyps, n-Kanal Verarmungstransistor.- 2.3.3.4.1 Betriebsmoden.- 2.3.3.4.2 Stromfluß. Kennlinie.- 2.3.3.4.3 Verarmungstransistor.- 2.3.3.4.4 Anreicherungstransistor.- 2.4 Der MOSFET bei abnehmenden Geometrien. Kurzkanal- und Schmalkanaleffekte. Submikrometertransistor.- 2.4.1 Geometrieabhängigkeit der Schwellspannung.- 2.4.1.1 Kurzkanalsch wellspannung.- 2.4.1.2 Schmalkanalschwellspannung.- 2.4.1.3 Kleingeometrieeffekte.- 2.4.1.4 Kurzkanalschwellspannung des MOSFET mit vergrabenem Kanal.- 2.4.1.5 Kennlinien im Bereich schwacher Inversion bei Kurzkanaleffekt.- 2.4.2 Hochfeldeffekte.- 2.4.2.1 Durchgreifeffekt.- 2.4.2.2 Heißelektroneneffekte.- 2.4.2.2.1 Heiße Ladungsträger im Oxid. Gatestrom..- 2.4.2.2.2 Durchbruchserscheinungen.- 2.4.3 Transporteffekte.- 2.4.3.1 Beweglichkeit, Geschwindigkeitssättigung.- 2.4.3.2 Transporteffekte.- 2.4.4 Source-Drainwiderstände und ihre Auswirkungen.- 2.4.5 Skalierung.- 3. Der MOSFET im dynamischen Betrieb.- 3.1 Kleinsignal verhalten für tiefe Frequenzen.- 3.1.1 Formale Darstellung. Kleinsignalparameter.- 3.1.2 Kleinsignalparameter.- 3.1.2.1 Gatesteilheit gm.- 3.1.2.2 Substratsteilheit gmb.- 3.1.2.3 Drainleitwert gd.- 3.1.2.4 Gate-, Substratdurchgriff.- 3.1.2.5 Einfluß der Bahnwiderstände.- 3.2 Signalverhalten im quasistationären Betrieb.- 3.2.1 Der MOSFET als ladungsgesteuertes Bauelement.- 3.2.1.1 Prinzip der Ladungssteuerung.- 3.2.1.2 Strom-Ladungsbeziehungen.- 3.2.1.3 Ladungsanalyse.- 3.2.1.3.1 Ladungsmodell des Langkanaltransistors..- 3.2.1.3.2 Ladungsmodell des Kurzkanaltransistors..- 3.2.1.3.3 Ladungsmodell des Verarmungstransistors.- 3.2.2 Linearisierung des ladungsgesteuerten MOSFET. Kapazitäten.- 3.2.2.1 Nichtreziproke Kapazität.- 3.2.2.2 Kapazitätsbeziehungen.- 3.2.2.3 Kapazitätsanordnung in der Vierpolersatzschaltung.- 3.2.2.4 Ladung und Kapazitäten.- 3.2.2.5 Parasitäre Elemente.- 3.2.3 Allgemeine Kleinsignalersatzschaltung.- 3.3 Dynamisches Verhalten.- 3.3.1 Modell, Grundgleichungen.- 3.3.2 Quasistatische Betrachtung.- 3.3.3 Substrateinbezug.- 3.3.3.1 Grundgleichung der Kanalspannung und ihre Lösung.- 3.3.3.2 Die Admittanzparameter und Ersatzschaltelemente..- 3.3.4 Ersatzschaltung.- 3.3.4.1 Quasistatische Ersatzschaltung.- 3.3.4.2 Nichtquasistatische Ersatzschaltung.- 3.3.5 Vergleich der Ladungsmodelle.- 3.4 MOSFET-Modelle für den Schaltungsentwurf.- 3.4.1 Kompaktmodelle für die Schaltungssimulation.- 3.4.1.1 Kompaktmodelle für den Digitalschaltungsentwurf..- 3.4.1.2 Kompaktmodelle für den Analogschaltungsentwurf..- 3.4.2 Tabellenmodelle.- 3.5 Schalt- und Impulsverhalten.- 3.5.1 Quasistatisches Schaltverhalten.- 3.5.2 Dynamisches Verhalten.- 3.5.3 Schaltverhalten des dynamischen Grundelementes.- 4. Bauformen des MOSFET.- 4.1 Der MOSFET in integrierten Schaltungen.- 4.1.1 Bauformen.- 4.1.2 CMOS-Technik.- 4.1.2.1 CMOS-Inverter.- 4.1.2.2 Durchschalteffekt.- 4.1.2.3 Technologieaspekte.- 4.1.3 SOI-MOSFET.- 4.1.3.1 Typische Eigenschaften der MISIS-Grundstruktur.- 4.1.3.2 Kennlinien.- 4.2 Speicherfeldeffekttransistoren.- 4.2.1 MNOSFET.- 4.2.2 Floating-Gate-MOSFET.- 4.3 MOS-Leistungsbauelemente.- 4.3.1 Bauformen.- 4.3.2 Elektrische Eigenschaften.- 4.3.3 Weitere MOS-Leistungsbauelemente.- 4.3.4 Leistungshalbleiter-Schaltkreise.- 4.4 Temperaturverhalten.- 4.4.1 Kanaltemperatur, Temperaturkoeffizienten.- 4.4.2 Verhalten bei sehr tiefer Temperatur.- 4.4.3 Thermisch-elektrische Wechselwirkung in MOSFETs.
£49.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Elektronische Schaltungen 2:
Book SynopsisDieses zweibändige, grundlegende und tiefgehende Werk über analoge und digitale Schaltungstechnik bietet neben einer verständlichen Darstellung des Lehrstoffs viele umfangreiche Lernhilfen. Es ist daher besonders für Einsteiger und zum Selbst- und Fernstudium geeignet. Eine Vielzahl von detailliert durchgerechneten Beispielen, Aufgaben mit ausführlichen Lösungsvorschlägen, Merksätzen und Kapitelzusammenfassungen erleichtern das Lernen ebenso wie die zahlreichen Abbildungen und Tabellen. Das Werk entstand aus einer Vorlesung an der Fernuniversität Hagen. Der zweite Band behandelt Aufbau und Schaltungen des Operationsverstärkers, Digitale Schaltungen (Gatter-Familien, Flip-Flop-Typen, Dekoder/Enkoder, Multiplexer, Minimierungs- verfahren) sowie Verbindungsleitungen.Table of Contents7 Operationsverstärker.- 7.1 Allgemeines.- 7.2 Der ideale Operationsverstärker.- 7.3 Verstärker mit Bipolar-Transistoren.- 7.3.1 Die Eingangsstufe.- 7.3.2 Spannungsverstärkung und Potentialverschiebung.- 7.3.3 Gesamtschaltung.- 7.4 Verstärker mit MOS-Transistoren.- 7.4.1 Die Eingangsstufe.- 7.4.2 Spannungsverstärkung und Potentialverschiebung.- 7.5 Frequenz-Kompensation.- 7.5.1 Ursachen für Stabilitätsprobleme.- 7.5.2 Universalkompensation (Dominant-Pol-Kompensation) …..- 7.5.3 Kompensations-Kapazität im Rückkopplungs-Netzwerk ….- 7.5.4 Vorwärts-Kompensation.- 7.6 Schaltungsverhalten bei Dominant-Pol-Kompensation.- 7.6.1 Invertierender Verstärker.- 7.6.2 Nichtinvertierender Verstärker.- 7.6.3 Kaskadenschaltung von zwei gleichen Verstärkern.- 7.6.4 Kenngrößen im Zeitbereich.- 7.6.5 Nichtlineare Begrenzung der Anstiegs- und Abfallzeit („Slew Rate“).- 7.6.6 Instabiles Verhalten durch kapazitive Belastung.- 7.7 Offset-Erscheinungen.- 7.7.1 Offset-Spannung.- 7.7.2 Offset-Strom.- 7.7.3 Offset-Kompensation.- 7.7.4 Chopper-stabilisierte Operationsverstärker.- 7.8 Rauschen in Operationsverstärker-Schaltungen.- 7.8.1 Rauschen in Operationsverstärkern.- 7.8.2 Berechnung des Ausgangsrauschens.- 7.8.3 Äquivalente Rauschbandbreite.- 7.9 Zusammenfassung.- 7.10 Aufgaben.- 8 Schaltungen mit Operationsverstärkern.- 8.1 Allgemeines.- 8.2 Lineare Grundschaltungen.- 8.2.1 Invertierender Verstärker.- 8.2.2 Nichtinvertierender Verstärker.- 8.2.3 Subtrahier-Schaltung (Differenzverstärker).- 8.2.4 Summier-Schaltungen.- 8.2.5 Integrierer.- 8.2.6 Differenzierer.- 8.2.7 Spannungs-Strom-Wandler (Spannungsgesteuerte Stromquellen).- 8.2.8 Stromverstärker (Stromgesteuerte Stromquelle).- 8.2.9 Strom-Spannungs-Wandler (Stromgesteuerte Spannungsquelle).- 8.2.10 Ladungsverstärker.- 8.3 RC-aktive Filter.- 8.3.1 Allgemeines.- 8.3.2 Approximation des Däampfungsverlaufs.- 8.3.3 Butterworth-Approximation.- 8.3.4 Tschebyscheff-Approximation.- 8.3.5 Phasenverlauf.- 8.3.6 Frequenztransformationen.- 8.3.7 Tiefpafi-Bandpaß-Transformation.- 8.3.8 Filter-Schaltungen.- 8.3.9 Universelle Filter-Struktur 2. Ordnung.- 8.3.10 Kerbfilter (Notch filter).- 8.3.11 Allpässe.- 8.3.12 Zusammenfassende Darstellung von Frequenzbereichs- und Zeit-bereichs-Verhalten.- 8.4 Oszillatoren.- 8.4.1 Einführung.- 8.4.2 Wien-Brücken-Oszillator.- 8.5 Nichtlineare Schaltungen mit Operationsverstärkern.- 8.5.1 Gleichrichterschaltungen.- 8.5.2 Logarithmier-Schaltung und Delogarithmier-Schaltung.- 8.5.3 Multiplizier-, Dividier- und Radizier-Schaltungen.- 8.6 Anwendung des Operationsverstärkers als Komparator.- 8.6.1 Schwellendetektor.- 8.6.2 Schmitt-Trigger.- 8.6.3 Astabiler Multivibrator.- 8.7 Schaltungen für die A/D- und die D/A- Umsetzung.- 8.7.1 Elektronische Schalter mit Sperrschicht-Feldeffekt-Transistoren.- 8.7.2 Abtast-Halte-Schaltungen.- 8.7.3 A/D- und D/A-Umsetzung.- 8.8 Zusammenfassung.- 8.9 Aufgaben.- 9 Digitale Grundschaltungen.- 9.1 Einführende Erläuterungen.- 9.1.1 Allgemeines.- 9.1.2 Aussagelogik.- 9.2 Logik-Beschreibung.- 9.2.1 Algebren.- 9.2.2 Boolesche Algebra für zweiwertige Logik.- 9.2.3 Andere Logiksysteme.- 9.3 Logikfunktionen.- 9.4 Logikfamilien.- 9.5 Dioden-Transistor-Logik.- 9.6 Transistor-Transistor-Logik (TTL).- 9.6.1 Standard-TTL.- 9.6.2 Weiterentwicklungen der TTL-Logik.- 9.6.3 Ausgangsstufen-Varianten für die TTL-Serien.- 9.6.4 Weitere TTL-Schaltungen.- 9.7 Emittergekoppelte Logik (ECL).- 9.7.1 Logikverknüpfungen.- 9.7.2 Weitere Logikfunktionen.- 9.7.3 Versorgungsspannung.- 9.7.4 Vorteile von ECL-Gattern.- 9.8 MOS-Schaltungen.- 9.8.1 Verwendete MOS-Transistoren.- 9.8.2 MOS-Inverter.- 9.8.3 NAND- und NOR-Gatter in NMOS-Technik.- 9.9 CMOS-Schaltungen.- 9.9.1 Verlustleistung.- 9.9.2 Logikverknüpfungen in CMOS-Technik.- 9.9.3 Ausgangsstufen.- 9.9.4 Transmissionsgatter.- 9.9.5 Standardserien.- 9.10 Zusammenfassung.- 10 Speicher-Schaltungen.- 10.1 Basis-Flipflop.- 10.1.1 Schaltungsrealisierung von Flipfiops.- 10.2 Flipflop-Typen.- 10.2.1 SR-Flipflop.- 10.2.2 Taktzustandsgesteuertes SR-Flipflop.- 10.2.3 Taktflankengesteuertes SR-Flipflop.- 10.2.4 SR-Master-Slave-Flipflop.- 10.2.5 JK-Flipflop.- 10.2.6 Taktflankengesteuterte JK-Flipflops.- 10.2.7 Weitere Flipflop-Arten.- 10.3 Schieberegister.- 10.4 Zusammenfassung.- 11 Minimierung von Logikfunktionen.- 11.1 Normalform-Darstellungen.- 11.1.1 Die disjunktive Normalform.- 11.1.2 Die konjunktive Normalform.- 11.2 Minimierungsverfahren.- 11.2.1 Karnaugh-Diagramme.- 11.2.2 Die Quine-McCluskey-Methode.- 11.2.3 Ergänzende Bemerkungen.- 11.3 Zusammenfassung.- 11.4 Aufgaben.- 12 Kombinatorische und sequentielle Schaltkreise.- 12.1 Kombinatorische Schaltkreise.- 12.1.1 Addierer.- 12.1.2 Dekoder-und Enkoder-Schaltungen.- 12.1.3 Multiplexer und Demultiplexer.- 12.2 Synchrone sequentielle Schaltkreise.- 12.2.1 Zählerschaltungen.- 12.2.2 Ringzähler.- 12.2.3 Systematischer Entwurf von Zählerschaltungen.- 12.2.4 Zusammenfassung des systematischen Zählerentwurfs.- 12.2.5 Allgemeine synchrone Schaltungen.- 12.2.6 Zustandsreduzierung.- 12.3 Zusammenfassung.- 12.4 Aufgaben.- 13 Verbindungsleitungen.- 13.1 Einleitende Bemerkungen.- 13.2 Modellbildung.- 13.3 Lösung der DifFerentialgleichungssysteme.- 13.3.1 Verlustlose Leitung.- 13.3.2 Leitungsverhalten im stationären Zustand bei sinusförmigen Spannungen und Strömen.- 13.4 Leitungskonstanten.- 13.4.1 Primäre Leitungskonstanten.- 13.4.2 Sekundäre Leitungskonstanten.- 13.5 Verhalten von Leitungen im stationären Zustand.- 13.5.1 Lange Leitung.- 13.5.2 Leitung endlicher Länge.- 13.6 Zusammenfassung.- 13.7 Aufgaben.- Literatur.- Lösungsvorschläge zu den Aufgaben.
£39.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Automatisierungstechnik 1: Meß- und Sensortechnik
Book SynopsisFür die Probleme des planenden Ingenieurs werden die Elemente zur Lösung seiner Aufgaben genannt und in Aufbau und Funktion beschrieben. Es gibt einen Überblick über die wichtigen Grundlagen und Bauelemente und deren Eigenschaften, aus denen komplexe Systeme der Meßtechnik aufgebaut werden. Ein umfassendes Abkürzungsverzeichnis der Automatisierungstechnik rundet das Werk ab. Zum Leserkreis gehören Ingenieure aus Industrie, Planung, Entwicklung und Forschung sowie Hochschullehrer und Studenten.Table of ContentsA Begriffe, Benennungen, Definitionen.- Begriffe, Definitionen.- 1.1 Aufgabe der Automatisierung.- 1.2 Methoden der Automatisierung.- 1.3 Information, Signal.- 1.4 Signalarten.- 1.4.1 Amplitudenanaloge Signale.- 1.4.2 Frequenzanaloge Signale.- 1.4.3 Digitale Signale.- 1.4.4 Zyklisch-absolute Signale.- 1.4.5 Einheitssignale.- 1.5 Hilfsenergie.- Grundlagen der Systembeschreibung.- 2.1 Glieder in Steuerungen und Regelungen — Darstellung im Blockschaltbild.- 2.2 Kennfunktion und Kenngrößen von Gliedern.- 2.3 Untersuchung und Beschreibung von Systemen.- 2.3.1 Experimentelle Untersuchung.- 2.3.2 Mathematische Beschreibung.- Umgebungsbedingungen.- 3.1 Gehäusesysteme.- 3.1.1 Aufgabe und Arten.- 3.1.2 Konstruktionsmäßiger Aufbau.- 3.2 Einbauorte.- 3.3 Schutzarten.- 3.3.1 Einteilung und Einsatzbereiche.- 3.3.2 Fremdkörperschutz.- 3.3.3 Explosionsschutz.- 3.4 Elektromagnetische Verträglichkeit.- B Meßumformer, Sensoren.- Kraft, Masse, Drehmoment.- 1.1 Kraftmessung.- 1.1.1 Kompensationsverfahren.- 1.1.2 Federwaagenkonzept.- 1.1.3 Resonante Kraftsensoren.- 1.1.4 Mehrkomponenten-Kraftaufnehmer.- 1.2 Massenbestimmung.- 1.3 Messung des Drehmoments.- Druck, Druckdifferenz.- 2.1 Aufgabe der Druckmeßtechnik und Druckarten.- 2.1.1 Zu den Ausführungen über Druckmeßeinrichtungen.- 2.1.2 Aufgabe und Druckarten [DIN 23412].- 2.1.3 Aufbau von Druckmeßeinrichtungen.- 2.1.4 Verfahren der Druckmessung.- 2.2 Druck- und Differenzdruckmeßeinrichtungen.- 2.2.1 Meßeinrichtungen auf der Grundlage mechanischer Prinzipe der Druckwandlung.- 2.2.2 Meßeinrichtungen auf der Grundlage elektrischer Prinzipe der Druckwandlung.- 2.2.3 Druckwandlung auf der Grundlage mechanisch-pneumatischer Prinzipe.- 2.2.4 Intelligente Druckmeßeinrichtungen und Meßsignalverarbeitung.- 2.2.5 Meßanordnungen zur Druckmessung.- 2.2.6 Meßanordnungen zur Füllstandmessung.- Beschleunigung.- 3.1 Einleitung.- 3.2 Messung translatorischer Beschleunigung.- 3.2.1 Beschleunigungsaufnehmer nach dem Ausschlagverfahren (Open-loop-Aufnehmer).- 3.2.2 Beschleunigungsaufnehmer nach dem Kompensationsverfahren (Closed-loop-Aufnehmer).- 3.2.3 Daten typischer Beschleunigungsaufnehmer.- 3.3 Aufnehmer für rotatorische Beschleunigungen.- 3.3.1 Mechanische Kreisel — Drallsatz.- 3.3.2 Optische Kreisel — Sagnac-Effekt.- 3.3.3 Ozillierende Kreisel — Coriolis-Effekt.- 3.3.4 Magnetohydrodynamischer Kreisel.- 3.3.5 Daten typischer Drehratenaufnehmer.- 3.4 Integralinvariante.- Winkelgeschwindigkeits- und Geschwindigkeitsmessung.- 4.1 Einleitung.- 4.2 Sensor-Parameter.- 4.2.1 Linearität.- 4.2.2 Symmetrie.- 4.3 Winkelgeschwindigkeitsmessung.- 4.3.1 Gleichstromtachogeneratoren.- 4.3.2 Wechselstromtachogeneratoren.- 4.3.3 Stroboskop.- 4.3.4 Schlupfspule.- 4.3.5 Digitale Winkelgeschwindigkeitsmessung.- 4.4 Geschwindigkeitsmessung.- 4.4.1 Dopplerverfahren.- 4.4.2 Laufzeitkorrelationsverfahren.- Längen-/Winkelmessung.- 5.1 Analoge Verfahren.- 5.1.1 Amplituden-analoge Weg-/Winkelmessung.- 5.1.2 Laufzeitverfahren.- 5.2 Digitale geometrische Meßverfahren.- 5.2.1 Dingliche Maßstäbe.- 5.2.2 Interferometer.- 5.3 Dehnungsmessung.- 5.3.1 Dehnungsmeßstreifen (DMS).- 5.3.2 Faseroptische Dehnungssensoren.- 5.3.3 Resonante Dehnungssensoren.- 5.4 Dickenmessung.- 5.4.1 Bestimmung der totalen Dicke.- 5.4.2 Messung von Oberflächenschichten.- 5.5 Füllstandsmessung.- 5.5.1 Echte Bestimmung der Füllmenge.- 5.5.2 Füllstand.- Temperatur.- 6.1 Einleitung.- 6.2 Temperaturmeßgeräte mit elektrischem Ausgangssignal.- 6.2.1 Sensoren.- 6.2.2 Analoge Temperaturmeßverfahren.- 6.2.3 Digitale Temperaturmeßverfahren.- 6.3 Temperaturmeßgeräte mit mechanischem Ausgangssignal.- 6.3.1 Flüssigkeits-Glasthermometer.- 6.3.2 Zeigerthermometer.- 6.4 Temperaturmeßgeräte mit optischem Ausgangssignal.- 6.5 Besondere Temperatursensoren und Meßverfahren.- 6.5.1 Rauschthermometer.- 6.5.2 Akustische Thermometer.- Durchfluß.- 7.1 Einleitung.- 7.2 Aufnehmer für Volumina.- 7.2.1 Unmittelbare Aufnehmer.- 7.2.2 Mittelbare Aufnehmer.- 7.2.3 Anpassungsschaltungen für Aufnehmer für Volumina.- 7.3 Aufnehmer für den Durchfluß.- 7.3.1 Volumendurchfluß.- 7.3.2 Massendurchfiuß.- 7.3.3 Anpassungsschaltungen für Druckaufnehmer.- 7.3.4 Anpassungsschaltungen für Laser-Doppler-Velozimeter.- 7.3.5 Anpassungsschaltungen für Schwebekörper-Aufnehmer.- 7.3.6 Anpassungsschaltungen für thermische Durchflußmesser.- 7.4 Signalverarbeitung.- 7.5 Elektromagnetische Verträglichkeit der Meßeinrichtungen (EMV).- pH-Wert, Redoxspannung, Leitfähigkeit.- 8.1 pH-Wert.- 8.1.1 Defintion.- 8.1.2 Bedeutung.- 8.1.3 Einheit.- 8.1.4 Grundlagen.- 8.1.5 Meßprinzip.- 8.1.6 Sensoren.- 8.1.7 Temperatureinfluß.- 8.1.8 Übertragungsfunktion.- 8.1.9 Meßwertumformer.- 8.1.10 Justieren.- 8.1.11 Standards.- 8.1.12 Meßunsicherheit.- 8.2 Redoxspannung.- 8.2.1 Defintion.- 8.2.2 Bedeutung.- 8.2.3 Einheit.- 8.2.4 Grundlagen.- 8.2.5 Meßprinzip.- 8.2.6 Sensoren.- 8.2.7 Temperatureinfluß.- 8.2.8 Übertragungsfunktion.- 8.2.9 Meßwertumformer.- 8.2.10 Justieren.- 8.2.11 Standards.- 8.2.12 Meßunsicherheit.- 8.2.13 rh-wert.- 8.3 Leitfähigkeit.- 8.3.1 Defintion.- 8.3.2 Bedeutung.- 8.3.3 Einheit.- 8.3.4 Grundlagen.- 8.3.5 Meßprinzip.- 8.3.6 Sensoren.- 8.3.7 Temperatureinfluß.- 8.3.8 Übertragungsfunktion.- 8.3.9 Meßwertumformer.- 8.3.10 Justieren.- 8.3.11 Standards.- 8.3.12 Meßunsicherheit.- Gasfeuchte.- 9.1 Begriffe, Definitionen, Umrechnungen.- 9.1.1 Allgemeines.- 9.1.2 Definitionen und Bedeutung der Kenngrößen.- 9.2 Allgemeines zur Feuchtemessung.- 9.3 Verfahren der Gasfeuchtemessung.- 9.3.1 Tauspiegel-Hygrometer.- 9.3.2 Psychrometer.- 9.3.3 Haar- bzw. Faserhygrometer.- 9.3.4 Kapazitive Feuchtesensoren.- 9.3.5 LiCl-Sensoren.- 9.3.6 Aluminiumoxid-Sensoren.- 9.3.7 Sonstige Verfahren.- Gasanalyse.- 10.1 Einleitung.- 10.2 Fotometrische Verfahren.- 10.3 Paramagnetische Sauerstoffmessung.- 10.4 Wärmeleitfähigkeitsanalysator.- 10.5 Flammenionisationsdetektor FID.- 10.6 Chemosensoren.- 10.7 Gaschromatographie GC.- 10.8 Analysensysteme (Anwendungen).- Abkürzungsverzeichnis.
£59.99
Publicia Sistemas Fotovoltaico
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Novas Edições Acadêmicas Análise e síntese dos ganhos dos controladores clássicos
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Scholars' Press Safety Enhancement for Vehicular AdHoc Network
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Scholars' Press An IoTDriven Approach to Plant Monitoring Systems
£43.00
Novas Edições Acadêmicas Análise e síntese de controladores modernos
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Scholars' Press Spread Spectrum Pulse Width Modulation Methods
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Verlag Unser Wissen Die Entwicklung eines Bildüberlagerungssystems für biomedizinische Anwendungen
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Editions Notre Savoir Développement dun système de superposition dimages dans le domaine biomédical
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Edizioni Sapienza Lo sviluppo del sistema di sovrapposizione di immagini nelle applicazioni biomediche
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Wydawnictwo Nasza Wiedza Rozwój systemu nakadania obrazów w zastosowaniach biomedycznych
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Edições Nosso Conhecimento O desenvolvimento de um sistema de sobreposição de imagens em aplicações biomédicas
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Scholars' Press Advanced Control of Dual ThreePhase PMSMs
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Scholars' Press Design and control for high frequency resonant converters
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AV Akademikerverlag Neubauer L Absolute Position Estimation with GPSINS Senso
£37.90
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Semiconductor Power Devices: Physics, Characteristics, Reliability
Book SynopsisSemiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device production technology. In practice, not only the semiconductor, but also the thermal and mechanical properties of packaging and interconnection technologies are essential to predict device behavior in circuits. Wear and aging mechanisms are identified and reliability analyses principles are developed. Unique information on destructive mechanisms, including typical failure pictures, allows assessment of the ruggedness of power devices. Also parasitic effects, such as device induced electromagnetic interference problems, are addressed. The book concludes with modern power electronic system integration techniques and trends.Trade ReviewAus den Rezensionen:“... Das Buch ist eine erweiterte, aktualisierte englische Version des deutschen Buchs der Autoren. Es präsentiert Leistungshalbleiter auf umfassender Weise ... Das Buch prasentiert auch diverse Störungen und Schwingungen, die durch Schaltvorgänge bei Leistungskomponenten verursacht werden. ... Die Lektüre schafft es, fundierte Theorie praxisnah und verständlich zu vermitteln. Ein gründliches, ausgewogenes Buch, das sowohl Energietechnik-Studierenden als auch Leistungselektronik-Entwicklungsingenieuren eine Fülle an wertvollen Informationen und Einsichten bietet.“ (in: Bulletin SEV/VSE, 7/October/2011, Issue 10, S. 68)Table of ContentsPower Semiconductor Devices – Key Components for Efficient Electrical Energy Conversion Systems.- Semiconductor Properties.- pn - Junctions.- Short introduction to power device technology.- pin-Diodes.- Schottky Diodes.- Bipolar Transistors.- Thyristors.- MOS Transistors.- IGBTs.- Packaging and Reliability of Power Devices.- Destructive Mechanisms in Power Devices.- Power Device Induced Oscillations and Electromagnetic Disturbances.- Power Electronic Systems.- Appendix.- Index.
£151.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Optical Measurement of Surface Topography
Book SynopsisThe measurement and characterisation of surface topography is crucial to modern manufacturing industry. The control of areal surface structure allows a manufacturer to radically alter the functionality of a part. Examples include structuring to effect fluidics, optics, tribology, aerodynamics and biology. To control such manufacturing methods requires measurement strategies. There is now a large range of new optical techniques on the market, or being developed in academia, that can measure areal surface topography. Each method has its strong points and limitations. The book starts with introductory chapters on optical instruments, their common language, generic features and limitations, and their calibration. Each type of modern optical instrument is described (in a common format) by an expert in the field. The book is intended for both industrial and academic scientists and engineers, and will be useful for undergraduate and postgraduate studies.Trade ReviewFrom the reviews:“This book shows how optical microscopy can be used in the characterization and metrology of various surfaces. … Several important methods are presented in a clear and simple way … . The case studies scattered throughout the text greatly improve the readability and contribute to the practical emphasis of this book. … the index is comprehensive. I recommend this book to anyone trying to find the most appropriate method for surface topography measurement, as well as researchers who are new to using microscopy for measurements.” (Dejan Pantelić, Optics & Photonics News, December, 2011)Table of ContentsIntroduction to surface texture measurement.- Some common terms and definitions.- Limitations of optical 3D sensors.- Calibration of optical surface topography measuring instruments.- Chromatic confocal microscopy.- Point autofocus instruments.- Focus variation instruments.- Phase shifting interferometry.- Coherence scanning interferometry.- Digital holographic microscopy.- Imaging confocal microscopy.- Light scattering methods
£170.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG X-Ray Diffraction Crystallography: Introduction,
Book SynopsisX-ray diffraction crystallography for powder samples is a well-established and widely used method. It is applied to materials characterization to reveal the atomic scale structure of various substances in a variety of states. The book deals with fundamental properties of X-rays, geometry analysis of crystals, X-ray scattering and diffraction in polycrystalline samples and its application to the determination of the crystal structure. The reciprocal lattice and integrated diffraction intensity from crystals and symmetry analysis of crystals are explained. To learn the method of X-ray diffraction crystallography well and to be able to cope with the given subject, a certain number of exercises is presented in the book to calculate specific values for typical examples. This is particularly important for beginners in X-ray diffraction crystallography. One aim of this book is to offer guidance to solving the problems of 90 typical substances. For further convenience, 100 supplementary exercises are also provided with solutions. Some essential points with basic equations are summarized in each chapter, together with some relevant physical constants and the atomic scattering factors of the elements.Trade ReviewFrom the reviews:“The authors have developed their course lecture notes into a useful book that is suitable for graduate students of materials science and engineering who use X-ray diffraction techniques. … This book is a very concise presentation of the theory of scattering and diffraction and the determination of crystal structures. … The biggest strength of this book are the solutions that illustrate the quantitative aspects of the subject. The illustrations complement the text and there are many tables of real diffraction data and calculations of structures.” (Barry R. Masters, Optics & Photonics News, April, 2012)Table of ContentsFundamental Properties of X-rays.- Geometry of Crystals.- Scattering and Diffraction by Atoms and Crystals.- Diffraction from a Polycrystalline Sample and its Application to Determination of Crystal Structures.- Reciprocal Lattice and Integrated Intensity from Crystals.- Symmetry Analysis for Crystals and the Use of International Tables.- Solved Problems.
£170.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Terahertz Spectroscopy and Imaging
Book SynopsisThis book presents the state-of-the-art of Terahertz spectroscopy. It is a modern source for a beginners and researcher interested in THz spectroscopy. The basics and physical background of THz spectroscopy and technology are explained, and important applications are described. The book presents the highlights of scientific research in the field of THz science and provides an excellent overview of the field and future directions of research. Over the last decade the field of terahertz spectroscopy has developed into one of the most rapidly growing fields of spectroscopy with large impact across a wide range of scientific disciplines. Due to substantial advances in femtosecond laser technology, terahertz time-domain spectroscopy (THz-TDS) has established itself as the dominant spectroscopic technique for experimental scientists interested in measurements in this frequency range. In solids and liquids terahertz radiation is at resonance with both phonon modes and hydrogen bonding modes which makes it an ideal tool to study the interaction between molecules in a unique way, thus opening a wealth of opportunities for research in physics, chemistry, biology, materials science and pharmaceuticals. This book provides an easy access to scientists, engineers and students alike who want to understand the theory and applications of modern terahertz spectroscopy.Table of ContentsTransmission, reflection, refraction and scattering of Terahertz radiation.- Optical constants and dispersion relations in THz spectroscopy.- Scattering effects.- Converging Terahertz beam vs. plane wave.- Signal Processing – Wavelet Transform.- Signal Processing – Fractional Fourier transformation and spectrogram in signal processing of Terahertz pulses.- Terahertz Spectroscopy.- Crystalline and non-crystalline solids.- Liquids and Biomolecules.- Ellipsometry and active polarization control of Terahertz waves.- ATR sensing at terahertz frequencies.- Pump-probe spectroscopy.- Liquid crystals.- Waveguide spectroscopy.- Condensed matter physics.- Assignment of vibrational modes in crystalline materials.- On-chip pulsed Terahertz spectroscopy.- Nonlinear terahertz spectroscopy.- Terahertz Imaging.- Far-field / Near-field.- Biomedical Imaging.- Pharmaceutical imaging.- Terahertz tomography.- Security.- Artists’ materials characterization.- Interesting Physics at Terahertz Frequencies.- Plasmonic structures.
£208.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Topological Signal Processing
Book SynopsisSignal processing is the discipline of extracting information from collections of measurements. To be effective, the measurements must be organized and then filtered, detected, or transformed to expose the desired information. Distortions caused by uncertainty, noise, and clutter degrade the performance of practical signal processing systems.In aggressively uncertain situations, the full truth about an underlying signal cannot be known. This book develops the theory and practice of signal processing systems for these situations that extract useful, qualitative information using the mathematics of topology -- the study of spaces under continuous transformations. Since the collection of continuous transformations is large and varied, tools which are topologically-motivated are automatically insensitive to substantial distortion. The target audience comprises practitioners as well as researchers, but the book may also be beneficial for graduate students.Trade ReviewFrom the book reviews:“This text provides a nice exposition of the topological ideas used to extract information from signals and the practical details of signal processing. … Robinson’s intended audience is first year graduate students in both engineering and mathematics, and advanced undergraduates. … Throughout the text there are numerous examples and diagrams. Each chapter also ends with some open questions. These features make the book quite readable.” (Michele Intermont, MAA Reviews, February, 2015)“Three major goals for this book: firstly to show that topological invariants provide qualitative information about signals that is both relevant and practical, second to show that the signal processing concepts of filtering, detection, and noise correspond respectively to the concepts of sheaves, functoriality and sequences, and third to advocate for the use of sheaf theory in signal processing. … The target audience is practitioners so that the theoretical notions are covered with the practitioner in mind with motivations emphasized.” (Jonathan Hodgson, zbMATH, Vol. 1294, 2014)Table of ContentsIntroduction and informal discussion.- Parametrization.- Signals.- Detection.- Transforms.- Noise.
£64.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Tools of Radio Astronomy
Book SynopsisThis 6th edition of “Tools of Radio Astronomy”, the most used introductory text in radio astronomy, has been revised to reflect the current state of this important branch of astronomy. This includes the use of satellites, low radio frequencies, the millimeter/sub-mm universe, the Cosmic Microwave Background and the increased importance of mm/sub-mm dust emission. Several derivations and presentations of technical aspects of radio astronomy and receivers, such as receiver noise, the Hertz dipole and beam forming have been updated, expanded, re-worked or complemented by alternative derivations. These reflect advances in technology. The wider bandwidths of the Jansky-VLA and long wave arrays such as LOFAR and mm/sub-mm arrays such as ALMA required an expansion of the discussion of interferometers and aperture synthesis. Developments in data reduction algorithms have been included. As a result of the large amount of data collected in the past 20 years, the discussion of solar system radio astronomy, dust emission, and radio supernovae has been revisited. The chapters on spectral line emission have been updated to cover measurements of the neutral hydrogen radiation from the early universe as well as measurements with new facilities. Similarly the discussion of molecules in interstellar space has been expanded to include the molecular and dust emission from protostars and very cold regions. Several worked examples have been added in the areas of fundamental physics, such as pulsars. Both students and practicing astronomers will appreciate this new up-to-date edition of Tools of Radio Astronomy. Trade ReviewAus den Rezensionen zur 6.Auflage: “... Studenten und Absolventen einschlägiger Fachrichtungen ist das Buch auch fur Quereinsteiger und Amateure geeignet, die ernsthaft in dieses Fachgebiet eindringen wollen.“ (in: Funkamateur, Heft 5, 2014)Table of ContentsRadio Astronomical Fundamentals.- ElectromagneticWave Propagation Fundamentals.- Wave Polarization.- Signal Processing and Receivers: Theory.- Practical Receiver Systems.- Fundamentals of Antenna Theory.- Practical Aspects of Filled Aperture Antennas.- Single Dish Observational Methods.- Interferometers and Aperture Synthesis.- Emission Mechanisms of Continuous Radiation.- Some Examples of Thermal and Nonthermal Radio Sources.- Spectral Line Fundamentals.- Line Radiation from Atoms.- Radio Recombination Lines.- Overview of Molecular Basics.- Molecules in Interstellar Space.- Some Useful Vector Relations & Fourier Transforms.- The Van Vleck Clipping Correction: One Bit Quantization.- Conventional Derivation of Square Law Detector Response & Receiver Noise.- The Reciprocity Theorem.- Filled Aperture Antennas.- The Hankel Transform.- Lists of Calibration Radio Sources.- The Mutual Coherence Function and van Cittert-Zernike Theorem.- Bibliography.- Index.
£49.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Femtosecond Laser Micromachining: Photonic and Microfluidic Devices in Transparent Materials
Book SynopsisFemtosecond laser micromachining of transparent material is a powerful and versatile technology. In fact, it can be applied to several materials. It is a maskless technology that allows rapid device prototyping, has intrinsic three-dimensional capabilities and can produce both photonic and microfluidic devices. For these reasons it is ideally suited for the fabrication of complex microsystems with unprecedented functionalities. The book is mainly focused on micromachining of transparent materials which, due to the nonlinear absorption mechanism of ultrashort pulses, allows unique three-dimensional capabilities and can be exploited for the fabrication of complex microsystems with unprecedented functionalities.This book presents an overview of the state of the art of this rapidly emerging topic with contributions from leading experts in the field, ranging from principles of nonlinear material modification to fabrication techniques and applications to photonics and optofluidics.Table of ContentsPart I: Introductory concepts and characterization 1 Fundamentals of femtosecond Laser micromachining in transparent materials 2 -Ultrafast imaging of plasma dynamics and material response during micromachining 3 -Spectroscopic characterization of waveguides 4 -Optimizing Laser-induced refractive index changes in bulk optical materials via spatio-temporal beam shaping 5 -Controlling the cross-section of ultrafast Laser inscribed waveguides 6 –Anisotropy of femtosecond Laser writing Part II: Waveguides and optical devices in glass 7 –Passive optical waveguide devices in glass 8 - Femtosecond Laser inscription of fibre gratings 9 –3-D Bragg grating waveguide devices 10 –Active photonic devices Part III: Waveguides and optical devices in other transparent materials 11 -Waveguides in crystalline materials 12 -Refractive index structures in polymers Part IV: Microsystems and applications 13 –Discrete optics in waveguide arrays 14 –Optofluidics for biosensing 15 –Microstructuring of Photosensitive glass 16 -Microsystems and sensors 17 -Ultrashort Laser joining and welding
£151.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Der digitale Gutenberg: Alles was Sie über
Book SynopsisMit diesem Buch sind Sie für die aufregendste Herausforderung der graphischen Industrie in diesem Jahrhundert gerüstet!Der digitale Druck verändert nicht nur die Arbeitsschritte, Arbeitsinhalte und Investitionsentscheidungen in den Vorstufen der Druckereien. Diese neue Technologie wird auch einen tiefgreifenden ökonomischen Einfluß auf die gesamte Arbeitswelt der Druckereien haben.Das Buch liefert Ihnen mit der umfassenden Darstellung des status quo und der kommenden technischen und ökonomischen Entwicklungen Entscheidungshilfen und Alternativvorschläge.Table of ContentsDer theoretische Unterbau.- Computer to Pate.- Die Prinzipien der Direktbelichtung.- Die Wirtschaftlichkeit des Systems „Computer to Plate“.- Die richtige Wahl.- Die anderen Systemkomponenten für „Computer to Plate,… Press, …Film“.- Die Menschen und die Betriebe.- Andere digitale Verfahren und Ausblicke.- Glossar und Stichwortregister.- 9.1 Glossar.- 9.2 Stichwortregister.
£49.99
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Digital Photoelasticity: Advanced Techniques and Applications
Book SynopsisA straightforward introduction to basic concepts and methodologies for digital photoelasticity, providing a foundation on which future researchers and students can develop their own ideas. The book thus promotes research into the formulation of problems in digital photoelasticity and the application of these techniques to industries. In one volume it provides data acquisition by DIP techniques, its analysis by statistical techniques, and its presentation by computer graphics plus the use of rapid prototyping technologies to speed up the entire process. The book not only presents the various techniques but also provides the relevant time-tested software codes. Exercises designed to support and extend the treatment are found at the end of each chapter.Trade ReviewExcerpts from the Reviews of the book on Digital Photoelasticity(Pattern I) The author has produced a first class text book that should find widespread use among students, researchers, and design engineers in many branches of engineering….. Applied Mechanics Reviews 55(4) B69-B71 JUL 2002 The book is accompanied by a CD-ROM of the C source code of the programs referred to in the text along with some photoelasticity simulations and some hardware-specific code. The text is supported by ample end-of-chapter tutorial questions….. Strain 38 85-86 2002 Bible of digital photoelasticity., 17 February, 2001 Not only beginners and students but also researchers, engineers and inspectors should read this book as a bible of photoelasticity. http://www.amazon.co.uk/exec/obidos/ASIN/3540667954/qid%3D1050727743/202-1368056-3855028 ….This is the first monograph in its field and forms a useful contribution… Meas. Sci. Technol. 11 (December 2000) 1826-1827Table of Contents1 Transmission Photoelasticity.- 1.1 Introduction.- 1.2 Physical Principle Used in Photoelasticity.- 1.3 Nature of Light.- 1.4 Polarization.- 1.5 Passage of Light Through Isotropic Media.- 1.6 Passage of Light Through a Crystalline Medium.- 1.7 Light Ellipse.- 1.8 Retardation Plates and Wave Plates.- 1.9 Stress-Optic Law.- 1.10 Plane Polariscope.- 1.10.1 Analysis by Trigonometric Resolution.- 1.11 Jones Calculus.- 1.11.1 Rotation Matrix.- 1.11.2 Retardation Matrix.- 1.11.3 Representation of a Retarder.- 1.11.4 Polarizer.- 1.11.5 Quarter-Wave Plate.- 1.12 Analysis of Plane Polariscope by Jones Calculus.- 1.13 Circular Polariscope.- 1.14 Use of White Light.- 1.15 Determination of Isoclinic and Isochromatic Fringe Order at a Point.- 1.15.1 Ordering of Isoclinics.- 1.15.2 Ordering of Isochromatics.- 1.16 Tardy’s Method of Compensation.- 1.17 Calibration of Photoelastic Model Materials.- 1.17.1 Stress Field in a Circular Disc Under Diametral Compression.- 1.17.2 Conventional Method.- 1.17.3 Sampled Linear Least Squares Method.- Need for a better methodology.- Use of whole field data to evaluate material fringe value.- 1.17.4 Theoretical Reconstruction of Fringe Patterns.- 1.18 Further Comments on Fringe Ordering.- 1.18.1 Properties of Isochromatic Fringe Field.- 1.18.2 Properties of Isoclinic Fringe Field.- 1.18.3 Use of Fringe Field Properties to Identify Fringe Ordering.- 1.18.4 Role of Principles of Solid Mechanics in Fringe Ordering.- 1.19 Determination of the Sign of the Boundary Stresses.- 1.20 Resolving the Ambiguity on the Principal Stress Direction.- 1.21 Introduction to Three-Dimensional Photoelasticity and Integrated Photoelasticity.- 1.21.1 Conventional Three-Dimensional Photoelasticity.- 1.21.2 Principle of Optical Equivalence.- 1.22 Model to Prototype Relations.- 1.23 Closure.- Exercises.- References.- 2 Reflection Photoelasticity.- 2.1 Introduction.- 2.2 Reflection Polariscope.- 2.3 Stress and Strain-Optic Relations for Coatings.- 2.4 Coating and Specimen Stresses.- 2.5 Correction Factors for Photoelastic Coatings.- 2.6 Poisson’s Ratio Mismatch.- 2.7 Coating Materials.- 2.8 Bonding the Coating.- 2.9 Selection of the Coating Thickness.- 2.10 Calibration of the Coating Material.- 2.11 Data Collection and Analysis.- 2.12 Application of Photoelastic Coatings.- 2.13 Closure.- Exercises.- References.- 3 Digital Image Processing.- 3.1 Introduction.- 3.2 Image Sampling and Quantization.- 3.2.1 Pictures as Functions.- 3.2.2 Uniform Sampling and Quantization.- 3.3 Video Standards.- 3.4 Image Sensors.- 3.5 Image Display.- 3.6 Image Perception.- 3.7 Image Storage.- 3.8 Some Basic Relationships and Mathematical Operations Between Pixels.- 3.8.1 Neighbours of a Pixel.- 3.8.2 Arithmetic and Logic Operations.- 3.8.3 Neighbourhood Oriented Operations.- 3.9 Basic Steps in Image Processing.- 3.10 Typical Image Processing Systems for Digital Photoelasticity.- 3.11 Software Structure and Design.- 3.12 Image Acquisition.- 3.13 Tools for Image Understanding.- 3.13.1 Pseudo Colouring.- 3.13.2 Histogram.- 3.13.3 Two-Dimensional and Three-Dimensional Intensity Plots.- 3.14 Filtering in Spatial Domain.- 3.14.1 Low Pass Spatial Filtering.- 3.14.2 Median Filtering.- 3.15 Image Enhancement.- 3.15.1 Contrast Stretching.- 3.15.2 Histogram Equalisation.- 3.16 Image Segmentation.- 3.16.1 Thresholding.- Global thresholding.- Semi thresholding.- Dynamic thresholding.- 3.16.2 Edge Detection.- Edge detection by convolution filters.- Edge detection by non-convolution filters.- Edge detection by thresholding.- 3.17 Morphological Filters.- 3.18 Further Discussions on Image Sensors.- 3.18.1 Operation of CCD Arrays.- 3.18.2 Interline Transfer CCD.- 3.18.3 Linearity and Dynamic Range.- 3.18.4 Sources of Noise.- 3.19 Digitisation of the Camera Video Signal.- 3.20 Resolution of an Image Processing System.- 3.21 Gamma Compensation.- Exercises.- References.- 4 Fringe Multiplication, Fringe Thinning and Fringe Clustering.- 4.1 Introduction.- 4.2 Fringe Multiplication.- 4.3 Half Fringe Photoelasticity (HFP).- 4.4 DIP Methods for Fringe Thinning.- 4.5 Algorithms Based on Considering the Fringe Patterns as a Binary Image.- 4.6 Mask-Based Algorithms for Skeleton Extraction Using Intensity Variation within a Fringe.- 4.7 Global Identification of Fringe Skeletons Based on Intensity Variation.- 4.7.1 Edge Detection.- 4.7.2 Fringe Skeletonization.- Row-Wise scanning algorithm.- Algorithm for fringe skeleton extraction for arbitrarily shaped fringes.- 4.7.3 Applications of the Algorithm to Actual Experimental Conditions.- 4.8 Further Improvements on the Global Thinning Algorithm.- 4.9 Performance Evaluation of Various Fringe Thinning Algorithms.- 4.9.1 Comparison of the Skeleton Extraction.- Computer generated test images.- Images recorded from actual experimental situations.- 4.9.2 Comparison of the Computational Effort.- 4.10 Use of Tiling to Improve Information in Stress Concentration Zones.- 4.11 Fringe Tracing Algorithm.- 4.12 Ordering of Fringes.- 4.13 Closure.- Exercises.- References.- 5 Phase Shifting, Polarization Stepping and Fourier Transform Methods.- 5.1 Introduction.- 5.2 Early Attempts for Automated Polariscopes.- 5.3 Phase Shifting in Photoelasticity.- 5.4 Intensity of Light Transmitted for a Generic Arrangement of a Plane Polariscope.- 5.5 Intensity of Light Transmitted for a Generic Arrangement of a Circular Polariscope.- 5.6 Evaluation of Fractional Fringe Order along an Isoclinic Contour.- 5.7 Whole Field Evaluation of Photoelastic Data by Using a Plane Polariscope.- 5.8 Whole Field Evaluation of Photoelastic Data by Using a Circular Polariscope.- 5.8.1 The Generic Procedure.- 5.8.2 Calculation and Representation of Whole Field Data.- 5.8.3 Parameters Affecting the Generation of Phase Map and its Solution.- Influence of local oscillations of isoclinic parameter on fractional retardation calculation.- Importance of isoclinic parameter representing either ?1 or ?2 direction over the domain.- Ambiguity in experimentally evaluating the isoclinic parameter.- Interactive approach to obtain a good phase map.- 5.9 Error Sources and Methods to Minimise Their Influence.- 5.9.1 Influence of Error in Measuring Intensities.- 5.9.2 Errors Due to Mismatch of Quarter-Wave Plates.- 5.10 Evaluation of Isoclinic Value by Phase Shifting Technique.- 5.10.1 Use of Two Loads to Get Continuous Isoclinic Contours.- 5.10.2 Use of Multiple Wavelengths to Get Continuous Isoclinic Contours.- 5.11 Polarization Stepping for Isoclinic Determination.- 5.12 Fourier Transform Methods for Photoelastic Data Acquisition.- 5.12.1 Use of Carrier Fringes.- 5.12.2 Use of Multiple Polarization Stepped Images.- 5.12.3 Use of Load Stepping.- 5.13 Comparative Evaluation of Phase Shifting, Polarization Stepping and Fourier Transform Techniques.- 5.14 Closure.- Exercises.- References.- 6 Phase Unwrapping and Optically Enhanced Tiling in Digital Photoelasticity.- 6.1 Introduction.- 6.2 Boundary Detection.- 6.3 Noise Removal in Phase Maps.- 6.4 Algorithm for Phase Unwrapping.- 6.5 Representation of the Unwrapped Phase.- 6.5.1 Three-Dimensional Plots.- 6.5.2 Total Fringe Order Viewing on the Image.- 6.6 Parameters Affecting Phase Unwrapping.- 6.6.1 Influence of the Selection of the Phase Unwrapping Threshold.- 6.6.2 Influence of the Location of the Primary Seed Point.- 6.7 Use of Tiling Procedure for Phase Unwrapping.- 6.8 Digital Magnification of High Fringe Density Zones.- 6.8.1 Replication.- 6.8.2 Linear Interpolation.- 6.8.3 Higher Order Interpolation.- 6.9 Optically Enhanced Tiling (OET).- 6.10 Cementing of a Tile.- 6.11 OET Applied to a Circular Disc Under Diametral Compression.- 6.12 OET Applied to a Ring Under Diametral Compression.- 6.13 Closure.- Exercises.- References.- 7 Colour Image Processing Techniques.- 7.1 Introduction.- 7.2 Colour Models.- 7.2.1 RGB Model.- 7.2.2 HSI Model.- 7.3 Colour Image Processing Systems.- 7.3.1 Hardware.- Transmission Photoelasticity.- Reflection Photoelasticity.- 7.3.2 Software.- 7.4 Typical Spectral Response of a Colour Camera.- 7.5 Intensity of Light Transmitted in White Light for Various Polariscope Arrangements.- 7.6 Three Fringe Photoelasticity (TFP).- 7.6.1 Calibration.- 7.6.2 Methodology.- 7.6.3 Application to the Problem of a Circular Disc Under Diametral Compression.- 7.7 Green Image Plane as a Green Filter.- 7.8 Phase Shifting in Colour Domain.- 7.8.1 Transmission Photoelasticity.- 7.8.2 Reflection Photoelasticity.- 7.9 Spectral Content Analysis (SCA).- 7.10 Digital Spectral Content Analysis (DSCA).- 7.11 Hybrid Techniques.- 7.11.1 Polarization Stepping in Colour Domain.- 7.12 Tricolour Photoelastic Method.- 7.13 Closure.- Exercises.- References.- 8 Evaluation of Contact Stress Parameters and Fracture Parameters.- 8.1 Introduction.- 8.2 Basic Data Required and its Digital Acquisition.- 8.2.1 Conversion of Pixel Co-ordinates to Model Co-ordinates.- 8.2.2 Rotational Transformation.- 8.3 Stresses in Terms of Contact Length and Geometrical and Elastic Properties of the Bodies in Contact.- 8.4 Evaluation of Contact Stress Parameters by Least Squares Analysis.- 8.4.1 Validation for Hertzian and Non-Hertzian Contact.- 8.5 Developments in the Description of the Stress Field Equations in the Neighbourhood of a Crack-tip.- 8.5.1 Mode-I Stress Field Equations.- 8.5.2 Mixed-Mode (Combination of Mode-I and Mode-II) Stress Field Equations.- 8.5.3 Equivalence Between the Multi-Parameter Stress Field Equations.- 8.6 Developments in SIF Evaluation Methodology.- 8.7 Evaluation of Mixed-Mode Stress Field Parameters Using Least Squares Technique.- 8.8 Experimental Validation of the Methodology.- 8.8.1 Mode-I Loading.- 8.8.2 Mixed-Mode Loading.- 8.9 Contact Stress and Fracture Analysis of a Spur Gear.- 8.9.1 Loading Frame Design.- 8.9.2 Evaluation of Contact Parameters.- Measurement of radius of curvature at the point of contact.- Experimental results.- 8.9.3 Evaluation of Fracture Parameters.- 8.10 Closure.- Exercises.- References.- 9 Stress Separation Techniques.- 9.1 Introduction.- 9.2 Oblique Incidence Method.- 9.2.1 Secondary Principal Stresses.- 9.2.2 The Methodology.- 9.3 Shear Difference Technique.- 9.3.1 Conventional Method.- 9.3.2 Improvement by Tesar.- 9.4 Survey of Numerical Methods.- 9.4.1 Integration of Compatibility Condition.- Finite difference approach.- 9.4.2 Integration of Stress Difference Equations.- 9.4.3 Least Squares Method.- 9.4.4 Hybrid Techniques.- 9.4.5 Methods Using Only Isochromatic Data.- 9.5 Stress Separation by Combined Phase Shifting and FEM.- 9.5.1 Finite Element Formulation.- 9.5.2 Meaningful Discretization of the Domain.- 9.5.3 Plotting of Fringe Contours from FE Results.- 9.5.4 Influence of Error in Fringe Data.- 9.5.5 Application of the Technique to the Problem of Plate with a Hole.- 9.6 Use of Integrated Photoelasticity Concepts for Stress Separation.- 9.6.1 Least Squares Algorithm.- 9.6.2 Design of the Loading Frame.- 9.6.3 Application to the Problem of Disc under Diametral Compression.- 9.7 Stress Separation in Three-Dimensional Photoelasticity.- 9.8 Stress Separation in Reflection Photoelasticity.- 9.8 Closure.- Exercises.- References.- 10 Fusion of Digital Photoelasticity, Rapid Prototyping and Rapid Tooling Technologies.- 10.1 Introduction.- 10.2 Difficulties in Conventional Three-Dimensional Photoelasticity.- 10.3 Rapid Prototyping in Model Making.- 10.3.1 Software Issues in RP.- 10.3.2 Stereolithography Process.- 10.3.3 Solid Ground Curing.- 10.3.4 Fused Deposition Modelling.- 10.4 Direct Analysis of RP Models by Photoelastic Coatings.- 10.4.1 Experimental Results.- 10.4.2 Analysis of the Results.- Evaluation of Young’s modulus by tensile test.- Study on the seepage of the adhesive.- Numerical simulation of fringe patterns.- 10.4.3 Recommendations.- 10.5 Direct Use of RP Models for Transmission Photoelastic Analysis.- 10.6 Rapid Tooling for Model Making.- 10.6.1 Basic Steps in Rapid Tooling.- 10.6.2 Digital Photoelastic Characterisation of the Process.- 10.7 Closure.- Exercises.- References.- 11 Recent Developments and Future Trends.- 11.1 Introduction.- 11.2 Evaluation of Characteristic Parameters.- 11.2.1 Srinath and Keshavan’s Method.- 11.2.2 Whole Field Determination of Characteristic Parameters by Phase Shifting.- Development of relevant equations.- Experimental evaluation of characteristic parameters.- Whole field theoretical evaluation of characteristic parameters.- 11.3 Tensorial Tomography.- 11.4 Developments in DIP Hardware.- 11.5 Developments in DIP Software.- 11.5.1 Development of a Device Independent Software.- Selection of software features.- FRN_DAT software.- An application.- 11.5.2 Future Possibility.- 11.6 Digital Dynamic Photoelasticity.- 11.6.1 Classification of High, Very-high and Ultra-high-speed Photography.- 11.6.2 Classical Methods for High-speed Photography.- 11.6.3 Digital Dynamic Recording.- 11.7 Application to Composites.- 11.7.1 Photo-Orthotropic Elasticity Theories.- Stress-Optic law.- Strain-Optic law.- 11.7.2 Calibration of Photo-Orthotropic Composites.- 11.7.3 Influence of Residual Birefringence.- 11.7.4 Separation of Stresses in Photo-Orthotropic Elasticity.- 11.7.5 Application of Digital Photoelasticity to Composites.- 11.8 Closure.- Exercises.- References.
£85.49
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Elektronische Schaltungen 1: Grundlagen, Analyse,
Book SynopsisDieses zweibändige, grundlegende und tiefgehende Werk über analoge und digitale Schaltungstechnik bietet neben einer verständlichen Darstellung des Lehrstoffs viele umfangreiche Lernhilfen. Es ist daher besonders für Einsteiger und zum Selbst- und Fernstudium geeignet. Eine Vielzahl von detailliert durchgerechneten Beispielen, Aufgaben mit ausführlichen Lösungsvorschlägen, Merksätzen und Kapitelzusammenfassungen erleichtern das Lernen ebenso wie die zahlreichen Abbildungen und Tabellen. Das Werk entstand aus einer Vorlesung an der Fernuniversität Hagen. Der erste Band behandelt die Modellbildung für passive und aktive Bauelemente, die Signalbeschreibung im Hinblick auf die Schaltungstechnik, die Schaltungsanalyse, Rückkopplung und Stabilität sowie das Rauschen.Table of Contents1 Modellierung elektronischer Schaltungen.- 1.1 Passive Bauelemente.- 1.1.1 Eintorelemente.- 1.1.2 Zweitorelemente.- 1.2 Quellen.- 1.2.1 Unabhängige Quellen.- 1.2.2 Gesteuerte Quellen.- 1.3 Die Sperrschichtdiode.- 1.4 Der Bipolar-Transistor.- 1.4.1 Modelle für das statische Großsignalverhalten.- 1.4.2 Vereinfachtes Modell für den aktiven Bereich vorwärts.- 1.4.3 Berücksichtigung des Early-EfFekts.- 1.4.4 Durchbruchserscheinungen.- 1.4.5 Dynamisches Großsignal-Modell.- 1.4.6 Modelle für geringe Aussteuerung.- 1.4.7 Modell-Umwandlungen.- 1.4.8 Modelle für den Schalterbetrieb.- 1.5 FeldefFekt-Transistoren.- 1.5.1 Allgemeines.- 1.5.2 Das statische Verhalten von MOS-Transistoren.- 1.5.3 Dynamisches Modell für MOS-Transistoren.- 1.5.4 MOS-Transistor-Modell für geringe Aussteuerung.- 1.6 Zusammenfassung.- 1.7 Aufgaben.- 2 Signalbeschreibung.- 2.1 Allgemeines.- 2.2 Sinusförmige Signale.- 2.3 Nicht sinusförmige periodische Signale.- 2.4 Nichtperiodische Signale.- 2.4.1 Verallgemeinerte Funktionen.- 2.4.2 Die Fourier-Transformation.- 2.4.3 Die Laplace-Transformation.- 2.5 Periodisch geschaltete Signale.- 2.6 Stochastische Signale.- 2.6.1 Grundbegriffe der Wahrscheinlichkeitstheorie.- 2.6.2 Wichtige Verteilungen.- 2.6.3 Erwartungswert (Mittelwert), Varianz und Momente höherer Ordnung.- 2.6.4 Beziehungen bei zwei Zufallsvariablen.- 2.6.5 Stochastische Prozesse.- 2.6.6 Ergodischer Prozeß.- 2.7 Leist ungsbeziehungen.- 2.7.1 Sinusförmige Signale.- 2.7.2 Allgemeine periodische Signale.- 2.7.3 Allgemeine Signale.- 2.7.4 Rauschsignale.- 2.8 Zusammenfassung.- 2.9 Aufgaben.- 3 Analyse elektronischer Schaltungen.- 3.1 Die Gleichstromanalyse.- 3.1.1 Formulierung der Schaltungsgleichungen.- 3.1.2 Die Knotenanalyse.- 3.1.3 Die modifizierte Knotenanalyse.- 3.1.4 Gleichstromanalyse nichtlinearer Schaltungen.- 3.2 Analyse linearer dynamischer Schaltungen im Zeitbereich.- 3.2.1 Einführung.- 3.2.2 Lösung von Differentialgleichungs-Systemen unter Verwendung von Matrizen.- 3.2.3 Schaltungsbeschreibung im stationären Zustand.- 3.2.4 Sprungantwort und Impulsantwort.- 3.2.5 Schaltungsbeschreibung durch eine Differentialgleichung höherer Ordnung.- 3.3 Analyse linearer Schaltungen im Frequenzbereich.- 3.3.1 Die Übertragungsfunktion.- 3.3.2 Das Prinzip der analytischen Fortsetzung und die komplexe Frequenz.- 3.3.3 Darstellung der Übertragungsfunktion durch Pole und Nullstellen.- 3.3.4 Partialbruchzerlegung und Kettenbruchentwicklung der Übertragungsfunktion.- 3.3.5 Identität von Polen der Übertragungsfunktion und Eigenwerten der Systemmatrix.- 3.3.6 Impulsantwort und Übertragungsfunktion.- 3.3.7 Zweitor-Beschreibungen.- 3.4 Zusammenfassung.- 3.5 Aufgaben.- 4 Lineare Grundschaltungen.- 4.1 Festlegung von Transistor-Arbeitspunkten.- 4.1.1 Überlegungen zur Wahl des Arbeitspunktes.- 4.1.2 Arbeitspunkteinstellung bei Bipolar-Transistoren.- 4.1.3 Arbeitspunkteinstellung bei Feldeffekt-Transistoren.- 4.2 Verbundtransistoren.- 4.2.1 Die Darlington-Schaltung.- 4.2.2 Die Paradox-Schaltung.- 4.2.3 Die komplementäre Darlington-Schaltung.- 4.2.4 Das Super-Triplet.- 4.3 Realisierung von Stromquellen mit Transistoren (Stromspiegel).- 4.3.1 Quellen mit Bipolar-Transistoren.- 4.3.2 Quellen mit MOS-Transistoren.- 4.4 Die Kaskode-Schaltung.- 4.5 Der Differenzverstärker.- 4.5.1 Differenzverstärker mit Bipolar-Transistoren.- 4.5.2 Differenzverstärker mit MOS-Transistoren.- 4.6 Leistungs-Endstufen.- 4.6.1 Leistungs-Endstufen mit Bipolar-Transistoren.- 4.6.2 Endstufen mit Leistungs-MOSFETs.- 4.7 Zusammenfassung.- 4.8 Aufgaben.- 5 Rückkopplung und Stabilität.- 5.1 Allgemeines.- 5.2 Allgemeine Grundlagen.- 5.3 Rückkopplungs-Strukturen.- 5.4 Stabilität.- 5.4.1 Einführung.- 5.4.2 Das Nyquist-Kriterium.- 5.4.3 Das Bode-Diagramm.- 5.5 Zusammenfassung.- 5.6 Aufgaben.- 6 Rauschen in elektronischen Schaltungen.- 6.1 Autokorrelationsfunktion und Leistungsdichtespektrum.- 6.2 Rauschursachen.- 6.2.1 Thermisches Rauschen.- 6.2.2 Schrot-Rauschen (“shot noise”).- 6.2.3 1/f-Rauschen.- 6.2.4 Weitere Rauscharten.- 6.3 Rauschberechnungen in linearen Schaltungen.- 6.3.1 Eintore.- 6.3.2 Zweitore.- 6.3.3 Rauschzahl, Rauschanpassung und Signal-Rausch-Verhältnis.- 6.4 Rauschen in Halbleitern.- 6.4.1 Sperrschichtdioden.- 6.4.2 Bipolar-Transistoren.- 6.4.3 Feldeffekt-Transistoren.- 6.5 Zusammenfassung.- 6.6 Aufgaben.- Literatur.- Lösungsvorschläge zu den Aufgaben.
£44.99