Description
Book SynopsisCircuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book''s microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.
Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:
* Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost
* Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data
* Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures
* Characteriz
Table of ContentsDesign for Reliability Concepts.
Starting the Design Process.
Substrates.
Wire and Wirebonds.
Tape Automated Bonding.
Flip-Chip Bonding.
Attachment.
Case.
Leads.
Lead Seals.
Lid Seal and Lid.
Index.
