Description

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of materials as it pertains to adhesion
  • Surface cleaning as it pertains to adhesion
  • Ways to improve adhesion
  • Unraveling of interfacial interactions using an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion (metallized polymers)
  • Polymer adhesion to various substrates
  • Adhesion of thin films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of different dielectric materials
  • Delamination and reliability issues in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion measurement of thin films and coatings

Adhesion in Microelectronics

Product form

£174.95

Includes FREE delivery
Usually despatched within 12 days
Hardback by K. L. Mittal , Tanweer Ahsan

2 in stock

Short Description:

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily... Read more

    Publisher: John Wiley & Sons Inc
    Publication Date: 24/10/2014
    ISBN13: 9781118831335, 978-1118831335
    ISBN10: 1118831330

    Number of Pages: 368

    Non Fiction , Technology, Engineering & Agriculture , Education

    Description

    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

    • Various theories or mechanisms of adhesion
    • Surface (physical or chemical) characterization of materials as it pertains to adhesion
    • Surface cleaning as it pertains to adhesion
    • Ways to improve adhesion
    • Unraveling of interfacial interactions using an array of pertinent techniques
    • Characterization of interfaces / interphases
    • Polymer-polymer adhesion
    • Metal-polymer adhesion (metallized polymers)
    • Polymer adhesion to various substrates
    • Adhesion of thin films
    • Adhesion of underfills
    • Adhesion of molding compounds
    • Adhesion of different dielectric materials
    • Delamination and reliability issues in packaged devices
    • Interface mechanics and crack propagation
    • Adhesion measurement of thin films and coatings

    Customer Reviews

    Be the first to write a review
    0%
    (0)
    0%
    (0)
    0%
    (0)
    0%
    (0)
    0%
    (0)

    Recently viewed products

    © 2025 Book Curl,

      • American Express
      • Apple Pay
      • Diners Club
      • Discover
      • Google Pay
      • Maestro
      • Mastercard
      • PayPal
      • Shop Pay
      • Union Pay
      • Visa

      Login

      Forgot your password?

      Don't have an account yet?
      Create account