Description

Book Synopsis
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don''t cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests.

This book''s groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today''s high-performancemicroelectronics. It does this with powerful...
* Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata
* Physics-of-failure product reliability assessment methods thatcan be pro

Table of Contents
Three-Dimensional Stacked Dies.

Cofired Ceramic Substrates.

Organic Laminated Substrates and Chip-on-Board.

High-Density Interconnects and Deposited Dielectrics.

Wire and Wirebonds.

Tape Automated Bonds.

Flip-Chip Bonds.

Device and Substrate Attachment.

Cases.

Leads.

Lead Seals.

Lid Seals.

Material and Product Evaluation Methods.

Rework Methods.

Bibliography.

Index.

Quality Conformance and Qualification of Microelectronic Packages and Interconnects

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    A Paperback by Michael G. Pecht, Abhijit Dasgupta, John W. Evans

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      Book details

      Publisher John Wiley & Sons
      Published 1 May 1995
      ISBN-13 9780471594369
      978-0471594369
      ISBN-10 0471594369
      Also in:
      Electronics engineering Reliability engineering

      Description

      Book Synopsis
      All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don''t cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests.

      This book''s groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today''s high-performancemicroelectronics. It does this with powerful...
      * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata
      * Physics-of-failure product reliability assessment methods thatcan be pro

      Table of Contents
      Three-Dimensional Stacked Dies.

      Cofired Ceramic Substrates.

      Organic Laminated Substrates and Chip-on-Board.

      High-Density Interconnects and Deposited Dielectrics.

      Wire and Wirebonds.

      Tape Automated Bonds.

      Flip-Chip Bonds.

      Device and Substrate Attachment.

      Cases.

      Leads.

      Lead Seals.

      Lid Seals.

      Material and Product Evaluation Methods.

      Rework Methods.

      Bibliography.

      Index.

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