Description
Book SynopsisAll packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don''t cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests.
This book''s groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today''s high-performancemicroelectronics. It does this with powerful...
* Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata
* Physics-of-failure product reliability assessment methods thatcan be pro
Table of ContentsThree-Dimensional Stacked Dies.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
