Description
Book SynopsisSuccessfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems
A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.
Additionally, the author:
Trade Review
"This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product."
—James Feine, President, USI Ultrasonic, Houston, Texas, USA
Table of Contents
Introduction. Basic Heat Transfer—Conduction, Convection, and Radiation. Conductive Cooling. Radiation Cooling. Fundamentals of Convection Cooling. Combined Modes, Transient Heat Transfer, and Advanced Materials. Basics of Vibration and Its Isolation. Basics of Shock Management. Induced Stresses. The Finite Element Methods. Mechanical and Thermomechanical Concerns. Acoustics. Mechanical Failures and Reliability. Electrical Failures and Reliability. Chemical Attack Failures and Reliability Concerns. Reliability Models, Predictions, and Calculations. Design Considerations in an Avionics Electronic Package.
Appendices. References.
