3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
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Hardback by Lennart Bamberg , Jan Moritz Joseph
Short Description:
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially... Read more
Publisher: Springer Nature Switzerland AGPublication Date: 28/06/2022
ISBN13: 9783030982287, 978-3030982287
ISBN10: 3030982289
Number of Pages: 395
Non Fiction , Technology, Engineering & Agriculture , Education