Description

Book Synopsis

Ed Carryer is the Director of the Smart Product Design Laboratory (SPDL) in the Design Division of Mechanical Engineering at Stanford University. He is currently a Consulting Professor in the Design Division of Mechanical Engineering. He received his Ph.D. degree in Mechanical Engineering from Stanford University in 1992. Prior to that, he received an M.S. in Bio-Medical Engineering from the University of Wisconsin, Madison in 1978. His B.S.E. was awarded from the Illinois Institute of Technology in 1975, where he was a member (1/3) of the first graduating class of the Education and Experience in Engineering (E 3)program.

Dr. Carryer's industrial experience varies wildly, from designing water treatment facilities for coal and nuclear power plants for Sargent & Lundy to designing the electronic controller for an Arctic Heated Glove under contract to NASA. He spent eight years in the Detroit area working in and about the auto industry. During that time he work

Trade Review
“Very comprehensive…Well written with good HW problems.” — Larry Banta, West Virginia University

“What I love about this book is that it puts much of what we teach in one text allowing the students to study in more depth the details their projects require." — Daniel J. Block, University of Illinois

“I expect this to become the gold standard for Mechatronics classes for years to come.” — David Fisher, Rose-Hulman

“I was very impressed with the organization of the material and the level of knowledge the authors bring to each topic. I was also impressed with the concise and clear way topics are introduced and explained.” — David Fisher, Rose-Hulman

“I think that’s great! My students get an introduction to Mechatronics then have a textbook to take with them after the course that they can continue to use and learn from.” — David Fisher, Rose-Hulman

“The authors really know their stuff and offer good guidelines, rules of thumb, and advice on dealing with real electronics, actuators, and sensors. I also really enjoyed the project discussion and trying to put into words what needs to happen in a good design process!” — David Fisher, Rose-Hulman

“The best features of the proposed text are its breadth and its detailed coverage of practical electronics.” — William R. Murray, California Polytechnic State University

“The textbook is overflowing with information. There is traditional analysis, an extensive survey of current hardware (sensors, actuators, computer hardware), practical advice (do’s & don’t’s). There is a lot to assimilate with many useful chapters that contain pedagogical examples and a wealth of practical information.” — Mark Nagurka, Marquette University

“The textbook is applied and not just a theoretical product. It reflects years of hardware experience from the authors.” — Mark Nagurka, Marquette University

“This one volume includes many subjects that are part of the enterprise of mechatronics. The book has exceptionally strong coverage of microcontrollers.” — Mark Nagurka, Marquette University



Table of Contents

Part 1: Introduction

Preface

Chapter 1 Introduction

1.1 Philosophy

1.3 Who Should Study Mechatronics?

1.3 How to Use this Book

1.4 Summary

Part 2: Software

Chapter 2 What’s a Micro?

2.1 Introduction

2.2 What IS a “Micro”?

2.3 Microprocessors, Microcontrollers, Digital Signal Processors (DSP’s) and More

2.4 Microcontroller Architecture

2.5 The Central Processing Unit (CPU)

2.5.1 Representing Numbers in the Digital Domain

2.5.2 The Arithmetic Logic Unit (ALU)

2.6 The Data Bus and the Address Bus

2.7 Memory

2.8 Subsystems and Peripherals

2.9 Von Neumann Architecture

2.10 The Harvard Architecture

2.11 Real World Examples

2.11.1 The Freescale MC9S12C32 Microcontroller

2.11.2 The Microchip PIC12F609 Microcontroller

2.12 Where to Find More Information

2.13 Homework Problems

Chapter 3 Microcontroller Math and Number Manipulation

3.1 Introduction

3.2 Number Bases and Counting

3.3 Representing Negative Numbers

3.4 Data Types

3.5 Sizes of Common Data Types

3.6 Arithmetic on Fixed Size Variables

3.7 Modulo Arithmetic

3.8 Math Shortcuts

3.8 Boolean Algebra

3.9 Manipulating Individual Bits

3.10 Testing Individual Bits

3.11 Homework Problems

Chapter 4: Programming Languages

4.1 Introduction

4.2 Machine Language

4.3 Assembly Language

4.4 High-Level Languages

4.5 Interpreters

4.6 Compilers

4.7 Hybrid Compiler/Interpreters

4.8 Integrated Development Environments (IDEs)

4.9 Choosing a Programming Language

4.10 Homework Problems

Chapter 5: Program Structures for Embedded Systems

5.1 Background

5.2 Event Driven Programming

5.3 Event Checkers

5.4 Services

5.5 Building an Event Driven Program

5.6 An Example

5.7 Summary of Event Driven Programming

5.8 State Machines

5.9 A State Machine in Software

5.10 The Cockroach Example as a State Machine

5.11 Summary

Homework Problems

Chapter 6 Software Design

6.1 Introduction

6.2 Building as a Metaphor for Creating Software

6.3 Introducing Some Software Design Techniques

6.3.1 Decomposition

6.3.2 Abstraction and Information Hiding

6.3.3 Pseudo-Code

6.4 Software Design Process

6.4.1 Generating Requirements

6.4.2 Defining the Program Architecture

6.4.3 The Performance Specification

6.4.4 The Interface Specification

6.4.5 Detail Design

6.4.6 Implementation

6.4.6.1 Intra-Module Organization

6.4.6.2 Writing the Code

6.4.7 Unit Testing

6.4.8 Integration

6.5 The Sample Problem

6.5.1 Requirements for the Morse Code Receiver

6.5.2 The Morse Code Receiver System Architecture

6.5.3 The Morse Code Receiver Software Architecture

6.5.4 The Morse Code Receiver Performance Specifications

6.5.5 The Morse Code Receiver Interface Specification

6.5.5.1 The Button Module Interface Specification

6.5.5.2 The Morse Elements Module Interface Specification

6.5.5.3 The Morse Decode Module Interface Specification

6.5.5.4 The LCD Display Module Interface Specification

6.5.6 The Morse Code Receiver Detail Design

6.5.6.1 Button Module Detail Design

6.5.6.2 Morse Elements Detail Design

6.5.6.3 Morse Decode Detail Design

6.5.6.4 Display Detail Design

6.5.6.5 Main Detail Design

6.5.7 The Morse Code Receiver Implementation

6.5.8 The Morse Code Receiver Unit Testing. 6-28

6.5.9 The Morse Code Receiver Integration

6.6 Homework Problems

Chapter 7 Communications

7.1: Introduction

7.2: Without a Medium, there is no Message

7.3: Bit-Parallel and Bit-Serial Communications

7.3.1: Bit-Serial Communications

7.3.1.1: Synchronous Serial Communications

7.3.1.2: Asynchronous Serial Communications

7.3.2: Bit Parallel Communications

7.4: Signaling Levels

7.4.1: TTL/CMOS Levels

7.4.2: RS-232

7.4.3: RS-485

7.5: Communicating Over Limited Bandwidth Channels

7.5.1: Telephones and Modems

7.5.1.1: Modulation Techniques

7.5.1.2: Amplitude Modulation (AM)

7.5.1.3: Frequency Modulation (FM)

7.5.1.4: Phase Modulation (PM)

7.5.1.5: Quadrature Amplitude Modulation (QAM)

7.6: Communicating with Light

7.7: Communicating over a Radio

7.7.1: RF Remote Controls

7.7.2: RF Data Links

7.7.3: RF Networks

7.8: Homework Problems

Chapter 8 : Microcontroller Peripherals

8.1 : Accessing the Control Registers

8.2 : The Parallel Input/Output Subsystem

8.2.1 : The Data Direction Register

8.2.2 : The Input/Output Register(s)

8.2.3 : Shared Function Pins

8.3 : Timer Subsystems

8.3.1 : Timer Basics

8.3.2 : Timer Overflow

8.3.3 : Output Compare

8.3.4 : Input Capture

8.3.5 : Combining Input Capture and Output Compare to Control an Engine

8.4 : Pulse Width Modulation (PWM)

8.5 : PWM Using the Output Compare System

8.6 : The Analog-to-Digital (A/D) Converter Subsystem

8.6.1 : The Process for Converting an Analog Input to a Digital Value

8.6.2 : The A/D Converter Clock

8.6.3 : Multiplexer Switching Transients and DC Effects

8.6.4 : Automating the A/D Conversion Process

8.7 : Homework Problems

Part 3: Electronics

Chapter 9 Basic Circuit Analysis and Passive Components

9.1 Voltage, Current and Power

9.2 Circuits and Ground

9.3 Laying Down the Laws

9.4 Resistance

9.4.1 Resistors in Series and Parallel

9.4.2 The Voltage Divider

9.5 Thevenin Equivalents

9.6 Capacitors

9.6.1 Capacitors in Series and Parallel

9.6.2 Capacitors and Time-Varying Signals

9.7 Inductors

9.7.1 Inductors and Time-Varying Signals

9.8 The Time and Frequency Domains

9.9 Circuit Analysis with Multiple Component Types

9.9.1 Basic RC Circuit Configurations

9.9.2 Low-Pass RC Filter Behavior in the Time Domain

9.9.3 High-Pass RC Filter Behavior in the Time Domain

9.9.4 RL Circuit Behavior in the Time Domain

9.9.5 Low-Pass RC Filter Behavior in the Frequency Domain

9.9.6 High-Pass RC Filter Behavior in the Frequency Domain

9.9.7 High-Pass RC Filter with a DC Bias

9.10 Simulation Tools

9.10.1 Limitations of Simulation Tools

9.11 Real Voltage Sources

9.12 Real Measurements

9.12.1 Measuring Voltage

9.12.2 Measuring Current

9.13 Real Resistors

9.13.1 A Model for a Real Resistor

9.13.2 Resistor Construction Basics

9.13.3 Carbon Film Resistors

9.13.4 Metal Film Resistors

9.13.5 Power Dissipation in Resistors

9.13.6 Potentiometers

9.13.7 Multi-Resistor Packages

9.13.8 Choosing Resistors

9.14 Real Capacitors

9.14.1 A Model for a Real Capacitor

9.14.2 Capacitor Construction Basics

9.14.3 Polar vs. Non-Polar Capacitors

9.14.4 Ceramic Disk Capacitors

9.14.5 Monolithic Ceramic Capacitors

9.14.6 Aluminum Electrolytic Capacitors

9.14.7 Tantalum Capacitors

9.14.8 Film Capacitors

9.14.9 Electric Double Layer Capacitors / Super capacitors

9.14.10 Capacitor Labeling

9.14.10.1 Ceramic Capacitor (Disc and MLC) Labeling

9.14.10.2 Aluminum Electrolytic Capacitor Labeling

9.14.10.3 Tantalum Capacitor Labeling

9.14.10.4 Film Capacitor Labeling

9.14.11 Choosing a Capacitor

9.15 Homework Problems

Chapter 10 Semiconductors

10.1 Doping, Holes and Electrons

10.2 Diodes

10.2.1 The VI Characteristic for Diodes

10.2.2 The Magnitude of Vf

10.2.3 Reverse Recovery

10.2.4 Schottky Diodes

10.2.5 Zener Diodes

10.2.6 Light Emitting Diodes

10.2.7 Photo-Diodes

10.3 Bipolar Junction Transistors

10.3.1 The Darlington Pair

10.3.2 The Photo-Transistor

10.4 MOSFETs

10.5 hoosing Between BJTs and MOSFETs

10.5.1 When Will a BJT be the Best (or Only) Choice?

10.5.2 When Will a MOSFET be the Best (or Only) Choice?

10.5.3 How Do You Choose When Either a MOSFET or a BJT Could Work?

10.6 Multi-Transistor Circuits

10.7 Reading Transistor Data Sheets

10.7.1 Reading a BJT Data Sheet

10.7.2 Reading a MOSFET Data Sheet

10.7.3 A Sample Application

10.7.4 A Potpourri of Transistor Circuits

10.8 Homework Problems

Chapter 11 : Operational Amplifiers

11.1 : Operational Amplifier Behavior

11.2 : Negative Feedback

11.3 : The Ideal Op-Amp

11.4 : Analyzing Op-Amp Circuits

11.4.1 : The Golden Rules

11.4.2 : The Non-Inverting Op-Amp Configuration

11.4.3 : The Inverting Op-Amp Configuration

11.4.3.1 : The Virtual Ground

11.4.3.2 : There is Nothing Magic About Ground

11.4.4 : The Unity Gain Buffer

11.4.5 : The Difference Amplifier Configuration

11.4.6 : The Summer Configuration

11.4.7 : The Trans-Resistive Configuration

11.4.8 : Computation with Op-Amps

11.5 : The Comparator

11.5.1 : Comparator Circuits

11.6 : Homework Problems

Chapter 12 : Real Operational Amplifiers and Comparators

12.1 : Real Op-Amp Characteristics — How the Ideal Assumptions Fail

12.1.1 : Non-Infinite Gain

12.1.2 : Variation in Open Loop Gain with Frequency

12.1.3 : Input Current is Not Zero

12.1.3.1 : Input Bias Current and Input Offset Current

12.1.3.2 : Input Impedance

12.1.4 : The Output Voltage Source is Not Ideal

12.1.5 : Other Non-Idealities

12.1.5.1 : Input Offset Voltage

12.1.5.2 : Power Supplies

12.1.5.3 : Input Common Mode Voltage Range

12.1.5.5 : Input Common Mode Rejection Ratio

12.1.5.6 : Temperature Effects

12.2 : Reading an Op-Amp Data Sheet

12.2.1 : Maxima, Minima and Typical Values

12.2.2 : The Front Page

12.2.3 : The Absolute Maximum Ratings Section

12.2.4 : The Electrical Characteristics Section

12.2.5 : The Packaging Section

12.2.6 : The Typical Applications Section

12.3 : Reading a Comparator Data Sheet

12.3.1 : Comparator Packaging

12.4 : Comparing Op-Amps

12.5 : Homework Problems

Chapter 13 Sensors

13.1 Introduction

13.2 Sensor Output & Microcontroller Inputs

13.3 Sensor Design

13.3.1 Measuring Temperature with a Thermistor

13.3.2 Measuring Acceleration

13.3.3 Definitions of Sensor Performance Characteristics

13.4 Fundamental Sensors and Interface Circuits

13.4.1 Switches as Sensors

13.4.2 Interfacing to Switches

13.4.3 Resistive Sensors

13.4.4 Interfacing to Resistive Sensors

13.4.4.1 Using a Resistive Sensor in a Voltage Divider

13.4.4.2 Measuring Resistance Using a Current Source

13.4.4.3 The Constant Current Circuit

13.4.4.4 The Wheatstone Bridge

13.4.5 Capacitive Sensors

13.4.6 Interfacing to Capacitive Sensors

13.4.6.1 Measuring Capacitance with a Step Input

13.4.6.2 Measuring Capacitance with an Oscillator

13.4.6.3 Measuring Capacitance with a Wheatstone Bridge

13.5 A Survey of Sensors

13.5.1 Light Sensors

13.5.1.1 Photodiodes

13.5.1.2 Phototransistors

13.5.1.3 Emitter-Detector Pair Modules

13.5.1.4 Photocells

13.5.2 Strain Sensors

13.5.2.1 Metal Foil Strain Gages

13.5.2.2 Piezoresistive Strain Gages

13.5.2.3 Load Cells

13.5.3 Temperature Sensors

13.5.3.1 Thermocouples

13.5.3.2 Thermistors

13.5.4 Magnetic Field Sensors

13.5.4.1 Hall Effect Sensors

13.5.4.3 Reed Switches

13.5.5 Proximity Sensors

13.5.5.1 Capacitive Proximity Sensors

13.5.5.2 Inductive Proximity Sensors

13.5.5.3 Ultrasonic Proximity Sensors

13.5.6 Position Sensors

13.5.6.1 Potentiometers

13.5.6.2 Optical Encoders

13.5.6.3 Inductive Pickups / Gear Tooth Sensors

13.5.6.4 Reflective Infrared Sensors

13.5.6.5 Capacitive Displacement Sensors

13.5.6.6 Ultrasonic Displacement Sensors

13.5.6.7 Flex Sensors

13.5.7 Acceleration Sensors

Introduction to Mechatronic Design

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    View other formats and editions of Introduction to Mechatronic Design by J. Carryer

    Publisher: Pearson Education (US)
    Publication Date: 08/03/2011
    ISBN13: 9780131433564, 978-0131433564
    ISBN10: 0131433563

    Description

    Book Synopsis

    Ed Carryer is the Director of the Smart Product Design Laboratory (SPDL) in the Design Division of Mechanical Engineering at Stanford University. He is currently a Consulting Professor in the Design Division of Mechanical Engineering. He received his Ph.D. degree in Mechanical Engineering from Stanford University in 1992. Prior to that, he received an M.S. in Bio-Medical Engineering from the University of Wisconsin, Madison in 1978. His B.S.E. was awarded from the Illinois Institute of Technology in 1975, where he was a member (1/3) of the first graduating class of the Education and Experience in Engineering (E 3)program.

    Dr. Carryer's industrial experience varies wildly, from designing water treatment facilities for coal and nuclear power plants for Sargent & Lundy to designing the electronic controller for an Arctic Heated Glove under contract to NASA. He spent eight years in the Detroit area working in and about the auto industry. During that time he work

    Trade Review
    “Very comprehensive…Well written with good HW problems.” — Larry Banta, West Virginia University

    “What I love about this book is that it puts much of what we teach in one text allowing the students to study in more depth the details their projects require." — Daniel J. Block, University of Illinois

    “I expect this to become the gold standard for Mechatronics classes for years to come.” — David Fisher, Rose-Hulman

    “I was very impressed with the organization of the material and the level of knowledge the authors bring to each topic. I was also impressed with the concise and clear way topics are introduced and explained.” — David Fisher, Rose-Hulman

    “I think that’s great! My students get an introduction to Mechatronics then have a textbook to take with them after the course that they can continue to use and learn from.” — David Fisher, Rose-Hulman

    “The authors really know their stuff and offer good guidelines, rules of thumb, and advice on dealing with real electronics, actuators, and sensors. I also really enjoyed the project discussion and trying to put into words what needs to happen in a good design process!” — David Fisher, Rose-Hulman

    “The best features of the proposed text are its breadth and its detailed coverage of practical electronics.” — William R. Murray, California Polytechnic State University

    “The textbook is overflowing with information. There is traditional analysis, an extensive survey of current hardware (sensors, actuators, computer hardware), practical advice (do’s & don’t’s). There is a lot to assimilate with many useful chapters that contain pedagogical examples and a wealth of practical information.” — Mark Nagurka, Marquette University

    “The textbook is applied and not just a theoretical product. It reflects years of hardware experience from the authors.” — Mark Nagurka, Marquette University

    “This one volume includes many subjects that are part of the enterprise of mechatronics. The book has exceptionally strong coverage of microcontrollers.” — Mark Nagurka, Marquette University



    Table of Contents

    Part 1: Introduction

    Preface

    Chapter 1 Introduction

    1.1 Philosophy

    1.3 Who Should Study Mechatronics?

    1.3 How to Use this Book

    1.4 Summary

    Part 2: Software

    Chapter 2 What’s a Micro?

    2.1 Introduction

    2.2 What IS a “Micro”?

    2.3 Microprocessors, Microcontrollers, Digital Signal Processors (DSP’s) and More

    2.4 Microcontroller Architecture

    2.5 The Central Processing Unit (CPU)

    2.5.1 Representing Numbers in the Digital Domain

    2.5.2 The Arithmetic Logic Unit (ALU)

    2.6 The Data Bus and the Address Bus

    2.7 Memory

    2.8 Subsystems and Peripherals

    2.9 Von Neumann Architecture

    2.10 The Harvard Architecture

    2.11 Real World Examples

    2.11.1 The Freescale MC9S12C32 Microcontroller

    2.11.2 The Microchip PIC12F609 Microcontroller

    2.12 Where to Find More Information

    2.13 Homework Problems

    Chapter 3 Microcontroller Math and Number Manipulation

    3.1 Introduction

    3.2 Number Bases and Counting

    3.3 Representing Negative Numbers

    3.4 Data Types

    3.5 Sizes of Common Data Types

    3.6 Arithmetic on Fixed Size Variables

    3.7 Modulo Arithmetic

    3.8 Math Shortcuts

    3.8 Boolean Algebra

    3.9 Manipulating Individual Bits

    3.10 Testing Individual Bits

    3.11 Homework Problems

    Chapter 4: Programming Languages

    4.1 Introduction

    4.2 Machine Language

    4.3 Assembly Language

    4.4 High-Level Languages

    4.5 Interpreters

    4.6 Compilers

    4.7 Hybrid Compiler/Interpreters

    4.8 Integrated Development Environments (IDEs)

    4.9 Choosing a Programming Language

    4.10 Homework Problems

    Chapter 5: Program Structures for Embedded Systems

    5.1 Background

    5.2 Event Driven Programming

    5.3 Event Checkers

    5.4 Services

    5.5 Building an Event Driven Program

    5.6 An Example

    5.7 Summary of Event Driven Programming

    5.8 State Machines

    5.9 A State Machine in Software

    5.10 The Cockroach Example as a State Machine

    5.11 Summary

    Homework Problems

    Chapter 6 Software Design

    6.1 Introduction

    6.2 Building as a Metaphor for Creating Software

    6.3 Introducing Some Software Design Techniques

    6.3.1 Decomposition

    6.3.2 Abstraction and Information Hiding

    6.3.3 Pseudo-Code

    6.4 Software Design Process

    6.4.1 Generating Requirements

    6.4.2 Defining the Program Architecture

    6.4.3 The Performance Specification

    6.4.4 The Interface Specification

    6.4.5 Detail Design

    6.4.6 Implementation

    6.4.6.1 Intra-Module Organization

    6.4.6.2 Writing the Code

    6.4.7 Unit Testing

    6.4.8 Integration

    6.5 The Sample Problem

    6.5.1 Requirements for the Morse Code Receiver

    6.5.2 The Morse Code Receiver System Architecture

    6.5.3 The Morse Code Receiver Software Architecture

    6.5.4 The Morse Code Receiver Performance Specifications

    6.5.5 The Morse Code Receiver Interface Specification

    6.5.5.1 The Button Module Interface Specification

    6.5.5.2 The Morse Elements Module Interface Specification

    6.5.5.3 The Morse Decode Module Interface Specification

    6.5.5.4 The LCD Display Module Interface Specification

    6.5.6 The Morse Code Receiver Detail Design

    6.5.6.1 Button Module Detail Design

    6.5.6.2 Morse Elements Detail Design

    6.5.6.3 Morse Decode Detail Design

    6.5.6.4 Display Detail Design

    6.5.6.5 Main Detail Design

    6.5.7 The Morse Code Receiver Implementation

    6.5.8 The Morse Code Receiver Unit Testing. 6-28

    6.5.9 The Morse Code Receiver Integration

    6.6 Homework Problems

    Chapter 7 Communications

    7.1: Introduction

    7.2: Without a Medium, there is no Message

    7.3: Bit-Parallel and Bit-Serial Communications

    7.3.1: Bit-Serial Communications

    7.3.1.1: Synchronous Serial Communications

    7.3.1.2: Asynchronous Serial Communications

    7.3.2: Bit Parallel Communications

    7.4: Signaling Levels

    7.4.1: TTL/CMOS Levels

    7.4.2: RS-232

    7.4.3: RS-485

    7.5: Communicating Over Limited Bandwidth Channels

    7.5.1: Telephones and Modems

    7.5.1.1: Modulation Techniques

    7.5.1.2: Amplitude Modulation (AM)

    7.5.1.3: Frequency Modulation (FM)

    7.5.1.4: Phase Modulation (PM)

    7.5.1.5: Quadrature Amplitude Modulation (QAM)

    7.6: Communicating with Light

    7.7: Communicating over a Radio

    7.7.1: RF Remote Controls

    7.7.2: RF Data Links

    7.7.3: RF Networks

    7.8: Homework Problems

    Chapter 8 : Microcontroller Peripherals

    8.1 : Accessing the Control Registers

    8.2 : The Parallel Input/Output Subsystem

    8.2.1 : The Data Direction Register

    8.2.2 : The Input/Output Register(s)

    8.2.3 : Shared Function Pins

    8.3 : Timer Subsystems

    8.3.1 : Timer Basics

    8.3.2 : Timer Overflow

    8.3.3 : Output Compare

    8.3.4 : Input Capture

    8.3.5 : Combining Input Capture and Output Compare to Control an Engine

    8.4 : Pulse Width Modulation (PWM)

    8.5 : PWM Using the Output Compare System

    8.6 : The Analog-to-Digital (A/D) Converter Subsystem

    8.6.1 : The Process for Converting an Analog Input to a Digital Value

    8.6.2 : The A/D Converter Clock

    8.6.3 : Multiplexer Switching Transients and DC Effects

    8.6.4 : Automating the A/D Conversion Process

    8.7 : Homework Problems

    Part 3: Electronics

    Chapter 9 Basic Circuit Analysis and Passive Components

    9.1 Voltage, Current and Power

    9.2 Circuits and Ground

    9.3 Laying Down the Laws

    9.4 Resistance

    9.4.1 Resistors in Series and Parallel

    9.4.2 The Voltage Divider

    9.5 Thevenin Equivalents

    9.6 Capacitors

    9.6.1 Capacitors in Series and Parallel

    9.6.2 Capacitors and Time-Varying Signals

    9.7 Inductors

    9.7.1 Inductors and Time-Varying Signals

    9.8 The Time and Frequency Domains

    9.9 Circuit Analysis with Multiple Component Types

    9.9.1 Basic RC Circuit Configurations

    9.9.2 Low-Pass RC Filter Behavior in the Time Domain

    9.9.3 High-Pass RC Filter Behavior in the Time Domain

    9.9.4 RL Circuit Behavior in the Time Domain

    9.9.5 Low-Pass RC Filter Behavior in the Frequency Domain

    9.9.6 High-Pass RC Filter Behavior in the Frequency Domain

    9.9.7 High-Pass RC Filter with a DC Bias

    9.10 Simulation Tools

    9.10.1 Limitations of Simulation Tools

    9.11 Real Voltage Sources

    9.12 Real Measurements

    9.12.1 Measuring Voltage

    9.12.2 Measuring Current

    9.13 Real Resistors

    9.13.1 A Model for a Real Resistor

    9.13.2 Resistor Construction Basics

    9.13.3 Carbon Film Resistors

    9.13.4 Metal Film Resistors

    9.13.5 Power Dissipation in Resistors

    9.13.6 Potentiometers

    9.13.7 Multi-Resistor Packages

    9.13.8 Choosing Resistors

    9.14 Real Capacitors

    9.14.1 A Model for a Real Capacitor

    9.14.2 Capacitor Construction Basics

    9.14.3 Polar vs. Non-Polar Capacitors

    9.14.4 Ceramic Disk Capacitors

    9.14.5 Monolithic Ceramic Capacitors

    9.14.6 Aluminum Electrolytic Capacitors

    9.14.7 Tantalum Capacitors

    9.14.8 Film Capacitors

    9.14.9 Electric Double Layer Capacitors / Super capacitors

    9.14.10 Capacitor Labeling

    9.14.10.1 Ceramic Capacitor (Disc and MLC) Labeling

    9.14.10.2 Aluminum Electrolytic Capacitor Labeling

    9.14.10.3 Tantalum Capacitor Labeling

    9.14.10.4 Film Capacitor Labeling

    9.14.11 Choosing a Capacitor

    9.15 Homework Problems

    Chapter 10 Semiconductors

    10.1 Doping, Holes and Electrons

    10.2 Diodes

    10.2.1 The VI Characteristic for Diodes

    10.2.2 The Magnitude of Vf

    10.2.3 Reverse Recovery

    10.2.4 Schottky Diodes

    10.2.5 Zener Diodes

    10.2.6 Light Emitting Diodes

    10.2.7 Photo-Diodes

    10.3 Bipolar Junction Transistors

    10.3.1 The Darlington Pair

    10.3.2 The Photo-Transistor

    10.4 MOSFETs

    10.5 hoosing Between BJTs and MOSFETs

    10.5.1 When Will a BJT be the Best (or Only) Choice?

    10.5.2 When Will a MOSFET be the Best (or Only) Choice?

    10.5.3 How Do You Choose When Either a MOSFET or a BJT Could Work?

    10.6 Multi-Transistor Circuits

    10.7 Reading Transistor Data Sheets

    10.7.1 Reading a BJT Data Sheet

    10.7.2 Reading a MOSFET Data Sheet

    10.7.3 A Sample Application

    10.7.4 A Potpourri of Transistor Circuits

    10.8 Homework Problems

    Chapter 11 : Operational Amplifiers

    11.1 : Operational Amplifier Behavior

    11.2 : Negative Feedback

    11.3 : The Ideal Op-Amp

    11.4 : Analyzing Op-Amp Circuits

    11.4.1 : The Golden Rules

    11.4.2 : The Non-Inverting Op-Amp Configuration

    11.4.3 : The Inverting Op-Amp Configuration

    11.4.3.1 : The Virtual Ground

    11.4.3.2 : There is Nothing Magic About Ground

    11.4.4 : The Unity Gain Buffer

    11.4.5 : The Difference Amplifier Configuration

    11.4.6 : The Summer Configuration

    11.4.7 : The Trans-Resistive Configuration

    11.4.8 : Computation with Op-Amps

    11.5 : The Comparator

    11.5.1 : Comparator Circuits

    11.6 : Homework Problems

    Chapter 12 : Real Operational Amplifiers and Comparators

    12.1 : Real Op-Amp Characteristics — How the Ideal Assumptions Fail

    12.1.1 : Non-Infinite Gain

    12.1.2 : Variation in Open Loop Gain with Frequency

    12.1.3 : Input Current is Not Zero

    12.1.3.1 : Input Bias Current and Input Offset Current

    12.1.3.2 : Input Impedance

    12.1.4 : The Output Voltage Source is Not Ideal

    12.1.5 : Other Non-Idealities

    12.1.5.1 : Input Offset Voltage

    12.1.5.2 : Power Supplies

    12.1.5.3 : Input Common Mode Voltage Range

    12.1.5.5 : Input Common Mode Rejection Ratio

    12.1.5.6 : Temperature Effects

    12.2 : Reading an Op-Amp Data Sheet

    12.2.1 : Maxima, Minima and Typical Values

    12.2.2 : The Front Page

    12.2.3 : The Absolute Maximum Ratings Section

    12.2.4 : The Electrical Characteristics Section

    12.2.5 : The Packaging Section

    12.2.6 : The Typical Applications Section

    12.3 : Reading a Comparator Data Sheet

    12.3.1 : Comparator Packaging

    12.4 : Comparing Op-Amps

    12.5 : Homework Problems

    Chapter 13 Sensors

    13.1 Introduction

    13.2 Sensor Output & Microcontroller Inputs

    13.3 Sensor Design

    13.3.1 Measuring Temperature with a Thermistor

    13.3.2 Measuring Acceleration

    13.3.3 Definitions of Sensor Performance Characteristics

    13.4 Fundamental Sensors and Interface Circuits

    13.4.1 Switches as Sensors

    13.4.2 Interfacing to Switches

    13.4.3 Resistive Sensors

    13.4.4 Interfacing to Resistive Sensors

    13.4.4.1 Using a Resistive Sensor in a Voltage Divider

    13.4.4.2 Measuring Resistance Using a Current Source

    13.4.4.3 The Constant Current Circuit

    13.4.4.4 The Wheatstone Bridge

    13.4.5 Capacitive Sensors

    13.4.6 Interfacing to Capacitive Sensors

    13.4.6.1 Measuring Capacitance with a Step Input

    13.4.6.2 Measuring Capacitance with an Oscillator

    13.4.6.3 Measuring Capacitance with a Wheatstone Bridge

    13.5 A Survey of Sensors

    13.5.1 Light Sensors

    13.5.1.1 Photodiodes

    13.5.1.2 Phototransistors

    13.5.1.3 Emitter-Detector Pair Modules

    13.5.1.4 Photocells

    13.5.2 Strain Sensors

    13.5.2.1 Metal Foil Strain Gages

    13.5.2.2 Piezoresistive Strain Gages

    13.5.2.3 Load Cells

    13.5.3 Temperature Sensors

    13.5.3.1 Thermocouples

    13.5.3.2 Thermistors

    13.5.4 Magnetic Field Sensors

    13.5.4.1 Hall Effect Sensors

    13.5.4.3 Reed Switches

    13.5.5 Proximity Sensors

    13.5.5.1 Capacitive Proximity Sensors

    13.5.5.2 Inductive Proximity Sensors

    13.5.5.3 Ultrasonic Proximity Sensors

    13.5.6 Position Sensors

    13.5.6.1 Potentiometers

    13.5.6.2 Optical Encoders

    13.5.6.3 Inductive Pickups / Gear Tooth Sensors

    13.5.6.4 Reflective Infrared Sensors

    13.5.6.5 Capacitive Displacement Sensors

    13.5.6.6 Ultrasonic Displacement Sensors

    13.5.6.7 Flex Sensors

    13.5.7 Acceleration Sensors

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