Description

Book Synopsis
Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moiré Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis is on the application of the method to real situations, and presents a very readable account of the technique from the point of view of the user. As an introduction to the Moiré technique and its variants, this book will be of interest to readers at all levels, but is particularly suitable for undergraduates and graduate students in physics, materials science, and structural and mechanical engineering.

Table of Contents
1 Introduction, 1.1 A brief history of the moiré method, References, CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT—THE MOIRÉ MICROSCOPE, 2.1 Nonlinear analysis of interferometric moiré fringes, 2.1.1 Example fringe data reduction, References, 2.2 Microscopic moiré interferometry, 2.2.1 Immersion interferometer, 2.2.1.1 Optical configuration, 2.2.1.2 Four-beam immersion interferometer, 2.2.2 Mechanical configuration, 2.2.3 Fringe shifting and O/DFM method, References, 2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry, 2.3.1 Specimen preparation, 2.3.2 Thin small outline package, 2.3.3 Leadless chip carrier, 2.3.4 Effect of underfill encapsulation on flip chip solder bump, 2.3.5 Plated through hole, References, 2.4 Titanium in elastic tension: micromechanical deformation, 2.4.1 Introduction, 2.4.2 Specimen and loading fixture, 2.4.3 Experimental procedure and fringe patterns, 2.4.4 Anomalous strains along the grain boundaries, 2.4.5 Discussion, References, 2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite, 2.5.1 Experimental procedure and fringe patterns, 2.5.2 Analysis and results, 2.5.3 Discussion, References, CHAPTER 3: FRACTURE MECHANICS, 3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load, 3.1.1.1 Introduction, 3.1.1.2 Experimental details, 3.1.1.3 Measurement of Von Mises yield locus, 3.1.1.4 Discussion of results, 3.1.1.5 Conclusions, References, 3.1.2 Deformation around fatigue cracks from moiré fringe measurement, 3.1.2.1 Introduction, 3.1.2.2 Basic crack-tip models, 3.1.2.2.1 Stationary crack under monotonie loading, 3.1.2.2.2 Stationary crack under cyclic loading, 3.1.2.3 Experimental details, 3.1.2.4 Fatigue crack-tip deformation, 3.1.2.4.1 Local yielding, 3.1.2.4.2 Non-singular stresses, 3.1.2.4.3 Cyclic plasticity, 3.1.2.4.4 Local mode-mixity, 3.1.2.5 Summary, Acknowledgment, References, 3.2.1 Applications of moiré to cellulosic (paper and woo

Handbook of Moire Measurement Series in Optics

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A Hardback by C.A. Walker

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    View other formats and editions of Handbook of Moire Measurement Series in Optics by C.A. Walker

    Publisher: Taylor & Francis Ltd
    Publication Date: 01/12/2003
    ISBN13: 9780750305228, 978-0750305228
    ISBN10: 0750305223

    Description

    Book Synopsis
    Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moiré Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis is on the application of the method to real situations, and presents a very readable account of the technique from the point of view of the user. As an introduction to the Moiré technique and its variants, this book will be of interest to readers at all levels, but is particularly suitable for undergraduates and graduate students in physics, materials science, and structural and mechanical engineering.

    Table of Contents
    1 Introduction, 1.1 A brief history of the moiré method, References, CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT—THE MOIRÉ MICROSCOPE, 2.1 Nonlinear analysis of interferometric moiré fringes, 2.1.1 Example fringe data reduction, References, 2.2 Microscopic moiré interferometry, 2.2.1 Immersion interferometer, 2.2.1.1 Optical configuration, 2.2.1.2 Four-beam immersion interferometer, 2.2.2 Mechanical configuration, 2.2.3 Fringe shifting and O/DFM method, References, 2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry, 2.3.1 Specimen preparation, 2.3.2 Thin small outline package, 2.3.3 Leadless chip carrier, 2.3.4 Effect of underfill encapsulation on flip chip solder bump, 2.3.5 Plated through hole, References, 2.4 Titanium in elastic tension: micromechanical deformation, 2.4.1 Introduction, 2.4.2 Specimen and loading fixture, 2.4.3 Experimental procedure and fringe patterns, 2.4.4 Anomalous strains along the grain boundaries, 2.4.5 Discussion, References, 2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite, 2.5.1 Experimental procedure and fringe patterns, 2.5.2 Analysis and results, 2.5.3 Discussion, References, CHAPTER 3: FRACTURE MECHANICS, 3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load, 3.1.1.1 Introduction, 3.1.1.2 Experimental details, 3.1.1.3 Measurement of Von Mises yield locus, 3.1.1.4 Discussion of results, 3.1.1.5 Conclusions, References, 3.1.2 Deformation around fatigue cracks from moiré fringe measurement, 3.1.2.1 Introduction, 3.1.2.2 Basic crack-tip models, 3.1.2.2.1 Stationary crack under monotonie loading, 3.1.2.2.2 Stationary crack under cyclic loading, 3.1.2.3 Experimental details, 3.1.2.4 Fatigue crack-tip deformation, 3.1.2.4.1 Local yielding, 3.1.2.4.2 Non-singular stresses, 3.1.2.4.3 Cyclic plasticity, 3.1.2.4.4 Local mode-mixity, 3.1.2.5 Summary, Acknowledgment, References, 3.2.1 Applications of moiré to cellulosic (paper and woo

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