Through Silicon Vias: Materials, Models, Design, and Performance

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Hardback by Brajesh Kumar Kaushik , Vobulapuram Ramesh Kumar Short Description:

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via... Read more

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Publisher: Taylor & Francis Inc
Publication Date: 26/08/2016
ISBN13: 9781498745529, 978-1498745529
ISBN10: 1498745520

Number of Pages: 216

Non Fiction , Technology, Engineering & Agriculture , Education