Description

Book Synopsis

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

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Table of Contents
Green Materials and Electronic Packaging Interconnect Technology.- Electronic Materials and Technology.- Green Materials and Technology.

Proceedings of the Green Materials and Electronic

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    A Hardback by Mohd Arif Anuar Mohd Salleh, Dewi Suriyani Che Halin, Kamrosni Abdul Razak

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      Book details

      Publisher Springer Verlag, Singapore
      Published 3 July 2023
      ISBN-13 9789811992667
      978-9811992667
      ISBN-10 9811992665
      Also in:
      Sustainability Chemistry Condensed matter physics

      Description

      Book Synopsis

      This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

      ​

      Table of Contents
      Green Materials and Electronic Packaging Interconnect Technology.- Electronic Materials and Technology.- Green Materials and Technology.

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