Description

Book Synopsis
This is the only book of its kind to focus on closed form solutions to micro-mechanical problems. This approach allows readers to easily understand the linear and nonlinear behavior of Micro Electro Mechanical Systems (MEMS) and their design applications.

Trade Review
"It is ideal for radio frequency/electronics/sensor specialists who, for design purposes, would like to forego numerical nonlinear mechanical simulations. The closed-form solution approach will also appeal to device designers interested in performing large-scale parametric analysis." (PCBDesign007, 22 February 2011)



Table of Contents
PREFACE.

1 INTRODUCTION.

1.1 Microelectromechanical Systems.

1.2 Coupled Systems.

1.3 Knowledge Required.

1.4 Dimensional Analysis.

Problems.

2 MICROFABRICATION.

2.1 Bulk and Surface Micromachining.

2.2 Lithography.

2.3 Layer Deposition.

2.4 Layer Etching.

2.5 Fabrication Process Design.

Problems.

3 STATICS.

3.1 Static Equilibrium.

3.2 Stress–Strain Relationship.

3.3 Thermal Stress.

3.4 Beam Behavior Subjected to a Torsional Moment.

3.5 Moment–Curvature Relationship.

3.6 Beam Equation.

3.7 Galerkin's Method.

3.8 Energy Method.

3.9 Energy Method for Beam Problems.

Problems.

4 STATIC BEHAVIOR OF MICROSTRUCTURES.

4.1 Elements of Microstructures.

4.2 Stiffness of Commonly Used Beams.

4.3 Trusses.

4.4 Stiffness Transformation.

4.5 Static Behavior of Planar Structures.

4.6 Residual Stress.

4.7 Cubic Force of Structures.

4.8 Potential Energy.

4.9 Analogy Between Potential Energies.

Problems.

5 DYNAMICS.

5.1 Cubic Equation.

5.2 Description of Motion.

5.3 Governing Equations of Dynamics.

5.4 Energy Conversion Between Potential and Kinetic Energy.

5.5 Free Vibration of Undamped Systems.

5.6 Vibration of Damped Systems.

5.7 Multidegree-of-freedom systems.

5.8 Continuous Systems.

5.9 Effective Mass, Damping, and Stiffness.

5.10 Systems with Repeated Structures.

5.11 Duffi ng's Equation.

Problems.

6 FLUID DYNAMICS.

6.1 Viscous Flow.

6.2 Continuity Equation.

6.3 Navier–Stokes Equation.

6.4 Reynolds Equation.

6.5 Couette Flow.

6.6 Oscillating Plate in a Fluid.

6.7 Creeping Flow.

6.8 Squeeze Film.

Problems.

7 ELECTROMAGNETICS.

7.1 Basic Elements of Electric Circuits.

7.2 Kirchhoff’s Circuit Laws.

7.3 Electrostatics.

7.4 Force and Moment Due to an Electric Field.

7.5 Electrostatic Forces and Moments Acting

on Various Objects / 395

7.6 Electromagnetic Force / 410

7.7 Force Acting on a Moving Charge in Electric and

Magnetic Fields / 418

7.8 Piezoresistance.

7.9 Piezoelectricity.

Problems.

8 PIEZOELECTRIC AND THERMAL ACTUATORS.

8.1 Composite Beams.

8.2 Piezoelectric Actuators.

8.3 Thermal Actuators.

Problems.

9 ELECTROSTATIC AND ELECTROMAGNETIC ACTUATORS.

9.1 Electrostatic Actuators.

9.2 Comb Drive Actuator.

9.3 Parallel-Plate Actuator.

9.4 Torsional Actuator.

9.5 Fixed–Fixed Beam Actuator.

9.6 Cantilever Beam Actuator.

9.7 Dynamic Response of Gap-Closing Actuators.

9.8 Approximation of Gap-Closing Actuators.

9.9 Electromagnetic Actuators.

Problems.

10 SENSORS.

10.1 Force and Pressure Sensors.

10.2 Accelerometers.

10.3 Electrostatic Accelerometers.

10.4 Vibratory Gyroscopes.

10.5 Other Issues.

Problems.

APPENDIX.

REFERENCES.

INDEX.

Principles of Microelectromechanical Systems

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    A Hardback by Ki Bang Lee

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      View other formats and editions of Principles of Microelectromechanical Systems by Ki Bang Lee

      Publisher: John Wiley & Sons Inc
      Publication Date: 04/01/2011
      ISBN13: 9780470466346, 978-0470466346
      ISBN10: 0470466340

      Description

      Book Synopsis
      This is the only book of its kind to focus on closed form solutions to micro-mechanical problems. This approach allows readers to easily understand the linear and nonlinear behavior of Micro Electro Mechanical Systems (MEMS) and their design applications.

      Trade Review
      "It is ideal for radio frequency/electronics/sensor specialists who, for design purposes, would like to forego numerical nonlinear mechanical simulations. The closed-form solution approach will also appeal to device designers interested in performing large-scale parametric analysis." (PCBDesign007, 22 February 2011)



      Table of Contents
      PREFACE.

      1 INTRODUCTION.

      1.1 Microelectromechanical Systems.

      1.2 Coupled Systems.

      1.3 Knowledge Required.

      1.4 Dimensional Analysis.

      Problems.

      2 MICROFABRICATION.

      2.1 Bulk and Surface Micromachining.

      2.2 Lithography.

      2.3 Layer Deposition.

      2.4 Layer Etching.

      2.5 Fabrication Process Design.

      Problems.

      3 STATICS.

      3.1 Static Equilibrium.

      3.2 Stress–Strain Relationship.

      3.3 Thermal Stress.

      3.4 Beam Behavior Subjected to a Torsional Moment.

      3.5 Moment–Curvature Relationship.

      3.6 Beam Equation.

      3.7 Galerkin's Method.

      3.8 Energy Method.

      3.9 Energy Method for Beam Problems.

      Problems.

      4 STATIC BEHAVIOR OF MICROSTRUCTURES.

      4.1 Elements of Microstructures.

      4.2 Stiffness of Commonly Used Beams.

      4.3 Trusses.

      4.4 Stiffness Transformation.

      4.5 Static Behavior of Planar Structures.

      4.6 Residual Stress.

      4.7 Cubic Force of Structures.

      4.8 Potential Energy.

      4.9 Analogy Between Potential Energies.

      Problems.

      5 DYNAMICS.

      5.1 Cubic Equation.

      5.2 Description of Motion.

      5.3 Governing Equations of Dynamics.

      5.4 Energy Conversion Between Potential and Kinetic Energy.

      5.5 Free Vibration of Undamped Systems.

      5.6 Vibration of Damped Systems.

      5.7 Multidegree-of-freedom systems.

      5.8 Continuous Systems.

      5.9 Effective Mass, Damping, and Stiffness.

      5.10 Systems with Repeated Structures.

      5.11 Duffi ng's Equation.

      Problems.

      6 FLUID DYNAMICS.

      6.1 Viscous Flow.

      6.2 Continuity Equation.

      6.3 Navier–Stokes Equation.

      6.4 Reynolds Equation.

      6.5 Couette Flow.

      6.6 Oscillating Plate in a Fluid.

      6.7 Creeping Flow.

      6.8 Squeeze Film.

      Problems.

      7 ELECTROMAGNETICS.

      7.1 Basic Elements of Electric Circuits.

      7.2 Kirchhoff’s Circuit Laws.

      7.3 Electrostatics.

      7.4 Force and Moment Due to an Electric Field.

      7.5 Electrostatic Forces and Moments Acting

      on Various Objects / 395

      7.6 Electromagnetic Force / 410

      7.7 Force Acting on a Moving Charge in Electric and

      Magnetic Fields / 418

      7.8 Piezoresistance.

      7.9 Piezoelectricity.

      Problems.

      8 PIEZOELECTRIC AND THERMAL ACTUATORS.

      8.1 Composite Beams.

      8.2 Piezoelectric Actuators.

      8.3 Thermal Actuators.

      Problems.

      9 ELECTROSTATIC AND ELECTROMAGNETIC ACTUATORS.

      9.1 Electrostatic Actuators.

      9.2 Comb Drive Actuator.

      9.3 Parallel-Plate Actuator.

      9.4 Torsional Actuator.

      9.5 Fixed–Fixed Beam Actuator.

      9.6 Cantilever Beam Actuator.

      9.7 Dynamic Response of Gap-Closing Actuators.

      9.8 Approximation of Gap-Closing Actuators.

      9.9 Electromagnetic Actuators.

      Problems.

      10 SENSORS.

      10.1 Force and Pressure Sensors.

      10.2 Accelerometers.

      10.3 Electrostatic Accelerometers.

      10.4 Vibratory Gyroscopes.

      10.5 Other Issues.

      Problems.

      APPENDIX.

      REFERENCES.

      INDEX.

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