Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
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Hardback by Yue Ma , Christian Gontrand
Short Description:
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence... Read more
Publisher: Taylor & Francis LtdPublication Date: 28/03/2019
ISBN13: 9780367023430, 978-0367023430
ISBN10: 0367023431
Number of Pages: 226
Non Fiction , Technology, Engineering & Agriculture , Education