Description

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

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Hardback by Yue Ma , Christian Gontrand

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As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence... Read more

    Publisher: Taylor & Francis Ltd
    Publication Date: 28/03/2019
    ISBN13: 9780367023430, 978-0367023430
    ISBN10: 0367023431

    Number of Pages: 226

    Non Fiction , Technology, Engineering & Agriculture , Education

    Description

    As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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