Description

Book Synopsis
Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text

Table of Contents
Purpose and Importance of Preparatory Semiconductor Analysis.
Opening the Package: Chip Insulation.
Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
Crystallographic Etching in the Silicon.
Dry Etching in the Plasma.
Microsectioning Technology, Metallography.
Outlook.
Appendices.
Index.

Integrated Circuit Failure Analysis

    Product form

    A Hardback by Friedrich Beck

    £168.26

    Includes FREE delivery

    RRP £186.95 – you save £18.69 (9%)

    Order before 4pm today for delivery by Thu 26 Nov 2026.

      Trusted by thousands of customers. See 2,385+ Customer Reviews

      View other formats and editions of Integrated Circuit Failure Analysis by Friedrich Beck

      Book details

      Publisher Wiley
      Published 1/19/1998 12:00:00 AM
      ISBN-13 9780471974017
      978-0471974017
      ISBN-10 0471974013
      Also in:
      Electronic devices and materials

      Description

      Book Synopsis
      Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text

      Table of Contents
      Purpose and Importance of Preparatory Semiconductor Analysis.
      Opening the Package: Chip Insulation.
      Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
      Crystallographic Etching in the Silicon.
      Dry Etching in the Plasma.
      Microsectioning Technology, Metallography.
      Outlook.
      Appendices.
      Index.

      Recently viewed products

      © 2026 Book Curl

        • American Express
        • Apple Pay
        • Diners Club
        • Discover
        • Google Pay
        • Maestro
        • Mastercard
        • PayPal
        • Shop Pay
        • Union Pay
        • Visa

        Login

        Forgot your password?

        Don't have an account yet?
        Create account