Description

Book Synopsis

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.

Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:

  • Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer
  • Discusses the use

    Table of Contents

    3D Integration Technology with TSV and IMC Bonding. Wafer-Level 3D ICs for Advanced CMOS Integration. Integration of Graphics Processing Cores with Microprocessors. Electrothermal Simulation of 3D ICs. Thermal Management in 3D ICs/Systems. Emerging Interconnect Technologies for 3D Networks-on-Chips. Inductive-Coupling ThruChip Interface for 3D Integration. Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via. Low-Power Testing for 2D/3D Devices and Systems.

Design of 3D Integrated Circuits and Systems

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    A Hardback by Rohit Sharma

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      Publisher: Taylor & Francis Inc
      Publication Date: 12/11/2014
      ISBN13: 9781466589407, 978-1466589407
      ISBN10: 146658940X
      Also in:
      Electrical engineering

      Description

      Book Synopsis

      Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.

      Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:

      • Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer
      • Discusses the use

        Table of Contents

        3D Integration Technology with TSV and IMC Bonding. Wafer-Level 3D ICs for Advanced CMOS Integration. Integration of Graphics Processing Cores with Microprocessors. Electrothermal Simulation of 3D ICs. Thermal Management in 3D ICs/Systems. Emerging Interconnect Technologies for 3D Networks-on-Chips. Inductive-Coupling ThruChip Interface for 3D Integration. Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via. Low-Power Testing for 2D/3D Devices and Systems.

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