Description
Book SynopsisThis book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.
This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new in
Table of Contents
Preface ix
Contributors xi
PART I INTRODUCTION 1
1 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES 3
Mrityunjay Singh, Tatsuki Ohji, Rajiv Asthana, and Sanjay Mathur
PART II SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION 15
2 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES 17
Jolanta Janczak-Rusch
3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY 39
Monica Ferraris, Milena Salvo, and Valentina Casalegno
4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC AND CERAMIC–METAL JOINING 91
K. S. Weil, J. T. Darsell, and J. Y. Kim
5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS 143
Michael C. Halbig and Mrityunjay Singh
6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS 163
Mrityunjay Singh and Rajiv Asthana
7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOINING AND INTEGRATION 193
V. M. Perevertailo and O. B. Loginova
PART III INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION 231
8 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS 233
Richard Matz
9 OXIDE THERMOELECTRIC POWER GENERATION 267
Ryoji Funahashi, Saori Urata, Atsuko Kosuga, and Delphine Flahaut
10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS 297
Yoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, Koichi Hamamoto, Masanobu Awano, and Nigel Sammes
11 INTEGRATION TECHNOLOGIES FOR SENSORS 323
Woosuck Shin, Maiko Nishibori, and Ichiro Matsubara
12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS 339
Talha Erdem and Hilmi Volkan Demir
13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION 393
Takashi Goto
14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY 415
Cher Ming Tan and Yuejin Hou
15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FOR TUNABLE MICROWAVE APPLICATIONS 449
Ashok Kumar, Supriya Ketkar, and Venkataraman Gurumurthy
16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES 489
Jun Akedo
PART IV NANO- AND BIOINTEGRATION 521
17 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY 523
Yoshitake Masuda and Kunihito Koumoto
18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES 575
F. Hernández-Ramírez, J. D. Prades, A. Romano-Rodriguez, S. Barth, H. Shen, and S. Mathur
19 INTEGRATING DIAMOND-LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS) 641
Xijun Li and Daniel H. C. Chua
20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES 671
D. Pliszka, S. Sundarrajan, and S. Ramakrishna
21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY 699
C. Jin, W. Wei, R. Aggarwal, and R. J. Narayan
22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS 721
Ataur Sarkar and M. Saif Islam
23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS 743
Umur Caglar, Ville Pekkanen, Jani Valkama, Pauliina Mansikkamäki, and Jussi Pekkanen
24 BIOINTEGRATION OF PROSTHETIC DEVICES 777
Masakazu Kawashita, Toshiki Miyazaki, and Chikara Ohtsuki
Index 803
