Description
Book SynopsisUltra Large Scale Integration (ULSI) refers to chips with more than 10,000,000 devices per chip. It is the natural outgrowth of VLSI (Very Large Scale Integration). ULSI Semiconductor Technology Atlas uses TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and associated problems.
Trade Review"...provides a historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issue." (
IEEE Solid-State Circuits Society Newsletter, January 2004)
"…strongly recommended…" (E-Streams, Vol. 7, No. 4)
Table of ContentsFOREWORD ix
PREFACE xi
PART I 1
1 Microelectronics and Microscopy 3
2 ULSI Process Technology 36
3 Applications of TEM for Construction Analysis 61
4 TEM Sample Preparation Techniques 90
PART II 141
5 Ion Implantation and Substrate Defects 143
6 Dielectrics and Isolation 179
7 Silicides, Polycide, and Salicide 256
8 Metallization and Interconnects 287
PART III 343
9 ULSI Devices I: DRAM Cell with Planar Capacitor 345
10 ULSI Devices II: DRAM Cell with Stacked Capacitor 365
11 ULSI Devices III: DRAM Cell with Trench Capacitor 399
12 ULSI Devices IV: SRAM 445
PART IV 475
13 TEM in Failure Analysis 477
14 Novel Devices and Materials 526
15 TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies 558
16 High-Resolution TEM in Microelectronics 609
INDEX 647
