Description

Book Synopsis
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.

Table of Contents
Solders, Solder Fluxes, and Solder Pastes.

Wave Soldering.

Reflow Soldering.

Cleaning and Contamination.

Reliability and Quality.

Rework, Repair, and Manual Assembly.

Appendix.

Glossary of Soldering Terms.

Index.

Soldering Processes and Equipment

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A Hardback by Michael Pecht

15 in stock


    View other formats and editions of Soldering Processes and Equipment by Michael Pecht

    Publisher: John Wiley & Sons Inc
    Publication Date: 06/07/1993
    ISBN13: 9780471591672, 978-0471591672
    ISBN10: 047159167X

    Description

    Book Synopsis
    Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.

    Table of Contents
    Solders, Solder Fluxes, and Solder Pastes.

    Wave Soldering.

    Reflow Soldering.

    Cleaning and Contamination.

    Reliability and Quality.

    Rework, Repair, and Manual Assembly.

    Appendix.

    Glossary of Soldering Terms.

    Index.

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