Description

Book Synopsis
Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

Table of Contents
Basics of Interactions Between Flat Surfaces.

Influence of Particles, Surface Steps, and Cavities.

Surface Preparation and Room-Temperature Wafer Bonding.

Thermal Treatment of Bonded Wafer Pairs.

Thinning Procedures.

Electrical Properties of Bonding Interfaces.

Stresses in Bonded Wafers.

Bonding of Dissimilar Materials.

Bonding of Structured Wafers.

Mainstream Applications.

Emerging and Future Applications.

Index.

Semiconductor Wafer Bonding Science and

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    A Hardback by Q.-Y. Tong, U. Gösele

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      Book details

      Publisher John Wiley & Sons Inc
      Published 18 December 1998
      ISBN-13 9780471574811
      978-0471574811
      ISBN-10 0471574813
      Also in:
      Science & Nature Chemistry Electrochemistry and magnetochemistry Technology, Engineering & Agriculture Testing of materials

      Description

      Book Synopsis
      Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

      Table of Contents
      Basics of Interactions Between Flat Surfaces.

      Influence of Particles, Surface Steps, and Cavities.

      Surface Preparation and Room-Temperature Wafer Bonding.

      Thermal Treatment of Bonded Wafer Pairs.

      Thinning Procedures.

      Electrical Properties of Bonding Interfaces.

      Stresses in Bonded Wafers.

      Bonding of Dissimilar Materials.

      Bonding of Structured Wafers.

      Mainstream Applications.

      Emerging and Future Applications.

      Index.

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