Description

Book Synopsis
Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

Table of Contents
Basics of Interactions Between Flat Surfaces.

Influence of Particles, Surface Steps, and Cavities.

Surface Preparation and Room-Temperature Wafer Bonding.

Thermal Treatment of Bonded Wafer Pairs.

Thinning Procedures.

Electrical Properties of Bonding Interfaces.

Stresses in Bonded Wafers.

Bonding of Dissimilar Materials.

Bonding of Structured Wafers.

Mainstream Applications.

Emerging and Future Applications.

Index.

Semiconductor Wafer Bonding Science and

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A Hardback by Q.-Y. Tong, U. Gösele

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    View other formats and editions of Semiconductor Wafer Bonding Science and by Q.-Y. Tong

    Publisher: John Wiley & Sons Inc
    Publication Date: 18/12/1998
    ISBN13: 9780471574811, 978-0471574811
    ISBN10: 0471574813
    Also in:
    Chemistry Electrochemistry and magnetochemistry Testing of materials

    Description

    Book Synopsis
    Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

    Table of Contents
    Basics of Interactions Between Flat Surfaces.

    Influence of Particles, Surface Steps, and Cavities.

    Surface Preparation and Room-Temperature Wafer Bonding.

    Thermal Treatment of Bonded Wafer Pairs.

    Thinning Procedures.

    Electrical Properties of Bonding Interfaces.

    Stresses in Bonded Wafers.

    Bonding of Dissimilar Materials.

    Bonding of Structured Wafers.

    Mainstream Applications.

    Emerging and Future Applications.

    Index.

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