Description

Book Synopsis
This book, written by recognized experts in the field, is intended for designers of RF or microwave passive integrated circuits. It describes methods used for modeling passive circuits using the most common numerical analysis techniques (the method of moments, finite element methods, FDTD, TLM), and pays particular attention to propagation phenomena. Interconnections and packaging modeling are included, as well as an original method for multi-scale circuit modeling.

Characterization and measurement methods in the time and frequency domains are the subject of two very detailed chapters. Measurement errors using Vector Network Analyzer (VNA ) and appropriate corrections are detailed and the divergences between all the various parameters S, Z, Y, h, T, ABCD are given. Time domain reflectometry and its use are also covered in detail.

Passive RF Integrated Circuits: Modeling,

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    A Hardback by Pierre Saguet

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      Book details

      Publisher ISTE Ltd and John Wiley & Sons Inc
      Published 9 October 2009
      ISBN-13 9781848211759
      978-1848211759
      ISBN-10 1848211759
      Also in:
      Electronics: circuits and components

      Description

      Book Synopsis
      This book, written by recognized experts in the field, is intended for designers of RF or microwave passive integrated circuits. It describes methods used for modeling passive circuits using the most common numerical analysis techniques (the method of moments, finite element methods, FDTD, TLM), and pays particular attention to propagation phenomena. Interconnections and packaging modeling are included, as well as an original method for multi-scale circuit modeling.

      Characterization and measurement methods in the time and frequency domains are the subject of two very detailed chapters. Measurement errors using Vector Network Analyzer (VNA ) and appropriate corrections are detailed and the divergences between all the various parameters S, Z, Y, h, T, ABCD are given. Time domain reflectometry and its use are also covered in detail.

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