Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging

Name: Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging
Brand: Taylor & Francis Ltd
SKU: 9780367573669
Price: 42.74 GBP
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A Paperback by Xing-Chang Wei

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Publisher: Taylor & Francis Ltd
Publication Date: 30/06/2020
ISBN13: 9780367573669, 978-0367573669
ISBN10:

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Electronics: circuits and components Microwave technology