Microelectronics Packaging Handbook Subsystem Packaging Part III Technology Drivers

Name: Microelectronics Packaging Handbook Subsystem Packaging Part III Technology Drivers
Brand: Springer
SKU: 9780412084515
Price: 999.99 GBP

Product form

£999.99

Includes FREE delivery

A Hardback by R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

Out of stock

Trusted by thousands of customers. See 2,385+ Customer Reviews

View other formats and editions of Microelectronics Packaging Handbook Subsystem Packaging Part III Technology Drivers by R.R. Tummala

Publisher: Chapman and Hall
Publication Date: 31/01/1997
ISBN13: 9780412084515, 978-0412084515
ISBN10:

Also in:
Computing Computer hardware Technology, Engineering & Agriculture Electrical engineering Production and industrial engineering