Microelectronics Packaging Handbook Subsystem Packaging Part III Technology Drivers

Name: Microelectronics Packaging Handbook Subsystem Packaging Part III Technology Drivers
Brand: Springer
SKU: 9780412084515
Price: 123.49 GBP
Availability: InStock

Product form

£123.49

Includes FREE delivery

RRP £129.99 – you save £6.50 (5%)

Order before 4pm today for delivery by Wed 24 Jun 2026.

A Hardback by R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

15 in stock

Trusted by thousands of customers. See 2,385+ Customer Reviews

View other formats and editions of Microelectronics Packaging Handbook Subsystem Packaging Part III Technology Drivers by R.R. Tummala

Publisher: Springer
Publication Date: 31/01/1997
ISBN13: 9780412084515, 978-0412084515
ISBN10:

Also in:
Computing Computer hardware Technology, Engineering & Agriculture Electrical engineering Production and industrial engineering