fabrication techniques based on different material properties, descriptions of their limitations and func
Table of Contents
Preface. List of Symbols.
List of Abbreviations.
1 Introduction.
1.1 What is a Microsystem?
1.2 Microelectronics and Microsystem Technology.
1.3 Areas of Application and Trends of Development.
1.4 Example: Yaw Rate Sensor.
2 Scaling and Similarity.
2.1 Scaling.
2.2 Similarity and Dimensionless Numbers.
3 Materials.
3.1 Overview.
3.2 Single Crystalline Silicon.
3.3 Glasses.
3.4 Polymers.
3.5 Thin Films.
3.6 Comparison of Material Characteristics.
4 Microfabrication.
4.1 Overview.
4.2 Cleanliness During Production.
4.3 Lithography.
4.4 Thin-film Formation.
4.5 Layer Patterning.
4.6 Anisotropic Wet Chemical Deep Etching.
4.7 Doping.
4.8 Bonding Techniques.
4.9 Insulation Techniques.
4.10 Surface Micromachining.
4.11 Near-surface Micromachining.
4.12 HARMST.
4.13 Miniaturized Classical Techniques.
4.14 Selection of Microtechnical Manufacturing Techniques.
5 Packaging.
5.1 Tasks and Requirements.
5.2 Functions of Packaging.
6 Function and Form Elements in Microsystem Technology.
6.1 Mechanical Elements.
6.2 Fluidic Elements.
6.3 Thermal Elements.
7 Sensors and Actuators.
7.1 Reversible and Parametric Transducers.
7.2 Transducers for Sensors and Actuators.
8 Design of Microsystems.
8.1 Design Methods and Tools.
8.2 Systems with Lumped Parameters.
8.3 Systems with Distributed Parameters.
9 Effect of Technological Processes on Microsystem Properties.
9.1 Parameter-based Microsystem Design.
9.2 Robust Microsystem Design.
10 The Future of Microsystems.
10.1 Status and Trends in Microsystem Technology.
10.2 Microoptical Applications.
10.3 Probe Tips.
10.4 RF Microsystems.
10.5 Actuators.
10.6 Microfluidic Systems.
10.7 Chemical, Biological and Medical Systems.
10.8 Energy Harvesting and Wireless Communications.
10.9 Micro Fuel Cells.
References.
Appendix A Physical Constants.
Appendix B Coordinate Transformation.
B.1 Elastic Coefficients.
B.2 Piezoresistive Coefficients.
References.
Appendix C Properties of Silicon Dioxide and Silicon Nitride Layers.
References.
Appendix D Nomenclature of Thin-film Processes.
Reference.
Appendix E Adhesion of Surface Micromechanical Structures.
E.1 Capillary Forces.
E.2 Critical Length of Cantilever Springs.
Reference.
Index.
