Description
Book SynopsisThe first edition of this book published in 2004 and has proved to be both a valuable textbook and a handy desk reference. This new edition continues to provide students with an accessible guide to an important field. Fully updated, it has five new chapters that incorporate the recent developments in the field.
Table of ContentsPreface to the First Edition.
Preface to the Second Edition.
Acknowledgements.
1 Introduction.
Characterization.
3 Simulation of Microfabrication Processes.
4 Silicon.
5 Thin-Film Materials and Processes.
6 Epitaxy.
7 Advanced Thin Films.
8 Pattern Generation.
9 Optical Lithography.
10 Advanced Lithography.
11 Etching.
12 Wafer Cleaning and Surface Preparation.
13 Thermal Oxidation.
14 Diffusion.
15 Ion Implantation.
16 CMP: Chemical–Mechanical Polishing.
17 Bonding.
18 Polymer Microprocessing.
19 Glass Microprocessing.
20 Anisotropic Wet Etching.
21 Deep Reactive Ion Etching.
22 Wafer Engineering.
23 Special Processes and Materials.
24 Serial Microprocessing.
25 Process Integration.
26 MOS Transistor Fabrication.
27 Bipolar Transistors.
28 Multilevel Metallization.
29 Surface Micromachining.
30 MEMS Process Integration.
31 Process Equipment.
32 Equipment for Hot Processes.
33 Vacuum and Plasmas.
34 CVD and Epitaxy Equipment.
35 Cleanrooms.
36 Yield and Reliability.
37 Economics of Microfabrication.
38 Moore's Law and Scaling Trends.
39 Microfabrication at Large.
Appendix A Properties of Silicon.
Appendix B Constants and Conversion Factors.
Appendix C Oxide and Nitride Thickness by Color.
Index.
