Description

Book Synopsis

Introduction to IC Packaging Development and Assembly Processes.- Bonding Techniques Interconnects.- CVD in Semiconductor Packaging.- Etching in Semiconductor Manufacturing: Techniques, Applications, and Performance Metrics in Advanced IC Packaging.- Physical Vapor Deposition in Advanced Semiconductor Packaging.

Introduction to Microelectronics Advanced Packaging Assurance

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    Order before 4pm tomorrow for delivery by Wed 17 Jun 2026.

    A Hardback by Navid Asadizanjani

    15 in stock


      View other formats and editions of Introduction to Microelectronics Advanced Packaging Assurance by Navid Asadizanjani

      Publisher: Springer
      Publication Date: 08/07/2025
      ISBN13: 9783031861017, 978-3031861017
      ISBN10:
      Also in:
      Electronics: circuits and components

      Description

      Book Synopsis

      Introduction to IC Packaging Development and Assembly Processes.- Bonding Techniques Interconnects.- CVD in Semiconductor Packaging.- Etching in Semiconductor Manufacturing: Techniques, Applications, and Performance Metrics in Advanced IC Packaging.- Physical Vapor Deposition in Advanced Semiconductor Packaging.

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