Description
Book SynopsisThe topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices.
Trade Review"The book is well organized and has excellent technical depth with recent state-of-the-art information. Researchers, graduate students, and those in industry working on finding new materials and processes for thin-film dielectric materials would find this book to be a valuable resource." (
IEEE Electrical Insulation Magazine, March/April 2009)
Table of ContentsSeries Preface.
Preface. (Mikhail Baklanov, Martin Green and Karen Maex).
1. Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition. (A. Grill).
2. Spin-On Dielectric Materials. (Geraud Dubois, Willi Volksen and Robert D. Miller).
3.Porosity of Low Dielectric Constant Materials.
3.1 Positron Annihilation Spectroscopy. (David W. Gidley, Hua-Gen Peng, and Richard Vallery).
3.2Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation. (Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu).
3.3 Ellipsometric Porosimetry. (M. R. Baklanov).
4.Mechanical and Transport Properties of Low-k Dielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill).
5. Integration of low-k dielectric films in damascene processes. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F. Iacopi).
6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application. (Yakov Roizin and Vladimir Gritsenko).
High Dielectric constant Materials.
7. Material Engineering of High-k Gate Dielectrics. (Akira Toriumi and Koji Kita).
8. Physical Characterisation of ultra-thin high-k dielectric. (T. Conard, H. Bender and W. Vandervorst).
9. Electrical Characterization of Advanced Gate Dielectrics. (Robin Degraeve, Jurriaan Schmitz, Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken).
Medium dielectric constant materials.
10. Integration Issues of High-k Gate Dielectrics. (Yasuo Nara).
Dielectric films for interconnects (packaging).
11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects. (Yi Li, C. P. Wong).
Index.
