Search results for "tag:"Author Lennart Bamberg""

Book SynopsisThis book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.Table of ContentsPart I Introduction1 Introduction to 3D Technologies 1.1 Motivation for Heterogenous 3D ICs 1.2 3D Technologies 1.3 TSV Capacitances—A Problem Resistant to Scaling 1.4 Conclusion 2 Interconnect Architectures for 3D Technologies 2.1 Interconnect Architectures 2.2 Overview of Interconnect Architectures for 3D ICs 2.3 Three-dimensional Networks on chips 2.4 Conclusion Part II 3D Technology Modeling 3 Power and Performance Formulas 3.1 High-Level Formula for the Power Consumption 3.2 High-Level Formula for the Propagation Delay 3.3 Matrix Formulations 3.4 Evaluation 3.5 Conclusion 4 Capacitance Estimation 4.1 Existing Capacitance Models 4.2 Edge and MOS Effects on the TSV Capacitances 4.3 TSV Capacitance Model 4.4 Evaluation 4.5 Conclusion Part III System Modeling xiii xiv Contents 5 Application and Simulation Models 5.1 Overview of the Modeling Approach 5.2 Application Traffic Model 5.3 Simulation Model of 3D NoCs 5.4 Simulator Interfaces 5.5 Conclusion 6 Bit-level Statistics 6.1 Existing Approaches to Estimate the Bit-Level Statistics for Single Data Streams 6.2 Data-Stream Multiplexing 6.3 Bit-Level Statistics with Data-Stream Multiplexing 6.4 Evaluation 6.5 Conclusion 7 Ratatoskr Framework 7.1 Ratatoskr for Practitioners 7.2 Implementation 7.3 Evaluation 7.4 Case Study: Link Power Estimation and Optimization 7.5 Conclusion Part IV 3D-Interconnect Optimization 8 Low-Power Technique for 3D Interconnects 8.1 Fundamental Idea 8.2 Power-Optimal TSV assignment 8.3 Systematic Net-to-TSV Assignments 8.4 Combination with Traditional Low-Power Codes 8.5 Evaluation 8.6 Conclusion 9 Low-Power Technique for High-Performance 3D Interconnects. 9.1 Edge-Effect-Aware Crosstalk Classification 9.2 Existing Approaches and Their Limitations 9.3 Proposed Technique 9.4 Extension to a Low-Power 3D CAC 9.5 Evaluation 9.6 Conclusion 10 Low-Power Technique for High-Performance 3D Interconnects (Misaligned) 10.1 Temporal-Misalignment Effect on the Crosstalk 10.2 Exploiting Misalignment to Improve the Performance 10.3 Effect on the TSV Power Consumption Contents xv 10.4 Evaluation 10.5 Conclusion 11 Low-Power Technique for Yield-Enhanced 3D Interconnects 11.1 Existing TSV Yield-Enhancement Techniques 11.2 Preliminaries—Logical Impact of TSV Faults 11.3 Fundamental Idea 11.4 Formal Problem Description 11.5 TSV Redundancy Schemes 11.6 Evaluation 11.7 Case Study 11.8 Conclusion Part V NoC Optimization for Heterogeneous 3D Integration 12 Heterogeneous Buffering for 3D NoCs251 12.1 Buffer Distributions and Depths 12.2 Routers with Optimized Buffer Distribution 12.3 Routers with Optimized Buffer Depths 12.4 Evaluation 12.5 Discussion 12.6 Conclusion 13 Heterogeneous Routing for 3D NoCs 13.1 Heterogeneity and Routing 13.2 Modeling Heterogeneous Technologies 13.3 Modeling Communication 13.4 Routing Limitations from Heterogeneity 13.5 Heterogeneous Routing Algorithms 13.6 Heterogeneous Router Architectures 13.7 Low-Power Routing in Heterogeneous 3D ICs 13.8 Evaluation 13.9 Discussion 13.10Conclusion 14 Heterogeneous Virtualisation for 3D NoCs 14.1 Problem Description 14.2 Heterogeneous Microarchitectures Exploiting Traffic Imbalance 14.3 Evaluation 14.4 Conclusion 15 Network Synthesis and SoC Floor Planning 15.1 Fundamental Idea 15.2 Modelling and Optimization 15.3 Mixed-Integer Linear Program 15.4 Heuristic Solution xvi Contents 15.5 Evaluation 15.6 Conclusion Part VI Finale 16 Conclusion 16.1 Putting it all together 16.2 Impact on Future Work A Appendix B Pseudo Codes C Method to Calculate the Depletion-Region Widths D Modeling Logical OR Relations

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