Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

Name: Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Brand: Institution of Engineering and Technology
SKU: 9781837241408
Price: 109.25 GBP
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Publisher Institution of Engineering and Technology

Published 1 June 2025

ISBN-13 9781837241408
978-1837241408

Also in:
Heat transfer processes