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Stochastic Finite Element Modeling in Electronic Packaging

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    A Hardback by Chu

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      View other formats and editions of Stochastic Finite Element Modeling in Electronic Packaging by Chu

      Publisher: Wiley-Blackwell
      Publication Date: 22/02/2026
      ISBN13: 9781394352944, 978-1394352944
      ISBN10:
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      Mathematics

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