Description

Book Synopsis
This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.

Table of Contents
Building Blocks for Integrated Circuits; Thermal Oxidation; Gas Kinetics and Plasma Physics; Chemical Vapor Deposition; Plasma-enhanced Chemical Vapor Deposition and Etching; Pattern Transfer: Photolithography; Pattern Generation: Photomask Processing; Doping Technology; Metallization and Silicidation; Planarization and CMP Technology; Copper and Low k.

Semiconductor Manufacturing Technology

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    £76.95

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    RRP £81.00 – you save £4.05 (5%)

    Order before 4pm today for delivery by Tue 4 Aug 2026.

    A Hardback by Chue San Yoo

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      Publisher: World Scientific Publishing Co Pte Ltd
      Publication Date: Publication Date: 04/03/2008
      ISBN13: 9789812568236, 978-9812568236
      ISBN10: 9812568239

      Description

      Book Synopsis
      This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.

      Table of Contents
      Building Blocks for Integrated Circuits; Thermal Oxidation; Gas Kinetics and Plasma Physics; Chemical Vapor Deposition; Plasma-enhanced Chemical Vapor Deposition and Etching; Pattern Transfer: Photolithography; Pattern Generation: Photomask Processing; Doping Technology; Metallization and Silicidation; Planarization and CMP Technology; Copper and Low k.

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