Description

Book Synopsis
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Table of Contents
System Integration and Modeling Concepts; Modeling of Cylindrical Interconnections; Electrical Modeling of Through Silicon Vias; Electrical Performance and Signal Integrity; Power Integrity, Return Path Discontinuities and Thermal Management.

Design And Modeling For 3d Ics And Interposers

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    £108.00

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    RRP £120.00 – you save £12.00 (10%)

    Order before 4pm tomorrow for delivery by Sat 20 Jun 2026.

    A Hardback by Madhavan Swaminathan, Ki Jin Han

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      View other formats and editions of Design And Modeling For 3d Ics And Interposers by Madhavan Swaminathan

      Publisher: World Scientific Publishing Co Pte Ltd
      Publication Date: 24/12/2013
      ISBN13: 9789814508599, 978-9814508599
      ISBN10: 9814508594

      Description

      Book Synopsis
      3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

      Table of Contents
      System Integration and Modeling Concepts; Modeling of Cylindrical Interconnections; Electrical Modeling of Through Silicon Vias; Electrical Performance and Signal Integrity; Power Integrity, Return Path Discontinuities and Thermal Management.

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