Description

Book Synopsis
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Table of Contents
System Integration and Modeling Concepts; Modeling of Cylindrical Interconnections; Electrical Modeling of Through Silicon Vias; Electrical Performance and Signal Integrity; Power Integrity, Return Path Discontinuities and Thermal Management.

Design And Modeling For 3d Ics And Interposers

Product form

£108.00

Includes FREE delivery

RRP £120.00 – you save £12.00 (10%)

Order before 4pm today for delivery by Tue 23 Dec 2025.

A Hardback by Madhavan Swaminathan, Ki Jin Han

Out of stock


    View other formats and editions of Design And Modeling For 3d Ics And Interposers by Madhavan Swaminathan

    Publisher: World Scientific Publishing Co Pte Ltd
    Publication Date: 24/12/2013
    ISBN13: 9789814508599, 978-9814508599
    ISBN10: 9814508594
    Also in:
    Electronic devices and materials

    Description

    Book Synopsis
    3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

    Table of Contents
    System Integration and Modeling Concepts; Modeling of Cylindrical Interconnections; Electrical Modeling of Through Silicon Vias; Electrical Performance and Signal Integrity; Power Integrity, Return Path Discontinuities and Thermal Management.

    Recently viewed products

    © 2025 Book Curl

      • American Express
      • Apple Pay
      • Diners Club
      • Discover
      • Google Pay
      • Maestro
      • Mastercard
      • PayPal
      • Shop Pay
      • Union Pay
      • Visa

      Login

      Forgot your password?

      Don't have an account yet?
      Create account