Description
Book SynopsisCeramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.
Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined
Table of ContentsOverview of Ceramic Interconnect Technology. Electrical Design, Simulation, and Testing. ThermoMechanical Design. Ceramic Materials. Screen Printing. Multilayer Ceramics. Photo-Defined and Photo-Imaged Films. Copper Interconnects for Ceramic Substrates and Packages. Integrated Passives in Ceramic Substrates. Index.
