Description

Book Synopsis
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Table of Contents
TSV and TSI Device Fabrication; Device Modeling; Macromodeling; Power and Thermal Integrity; Power Ground Design; Clock-Tree Design; 3D IC Test; Compressive Sensing and Data Recovery; Power and Thermal Modeling; Microfludic Based Thermal Management; Power I/O Management; Signal I/O Bandwidth Management; Q-Learning; Signal I/O Voltage-Swing Management; 3D Sensor Design; CMOS Readout Circuit; I/O Buffer Design; I/O with Clock-Data Recovery; Multi-Core Microprocessor Design; Non-Volatile Memory;

Advances In 3d Integrated Circuits And Systems

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    A Hardback by Hao Yu, Chuan Seng Tan

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      Book details

      Publisher World Scientific Publishing Co Pte Ltd
      Published 16 October 2015
      ISBN-13 9789814699006
      978-9814699006
      ISBN-10 9814699004

      Description

      Book Synopsis
      3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

      Table of Contents
      TSV and TSI Device Fabrication; Device Modeling; Macromodeling; Power and Thermal Integrity; Power Ground Design; Clock-Tree Design; 3D IC Test; Compressive Sensing and Data Recovery; Power and Thermal Modeling; Microfludic Based Thermal Management; Power I/O Management; Signal I/O Bandwidth Management; Q-Learning; Signal I/O Voltage-Swing Management; 3D Sensor Design; CMOS Readout Circuit; I/O Buffer Design; I/O with Clock-Data Recovery; Multi-Core Microprocessor Design; Non-Volatile Memory;

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