{"product_id":"structural-dynamics-of-electronic-and-photonic-systems-9780470250020","title":"Structural Dynamics of Electronic and Photonic","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eThe proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003ePreface.  \u003cp\u003eContributors.\u003c\/p\u003e \u003cp\u003e1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems (\u003ci\u003eDavid S. Steinberg).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2 Linear Response to Shocks and Vibrations (\u003ci\u003eEphraim Suhir).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3 Linear and Nonlinear Vibrations Caused by Periodic Impulses (\u003ci\u003eEphraim Suhir).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4 Random Vibrations of Structural Elements in Electronic and Photonic Systems (\u003ci\u003eEphraim Suhir).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations (\u003ci\u003eDavid S. Steinberg).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6 Drop\/Impact of Typical Portable Electronic Devices: Experimentation and Modeling (\u003ci\u003eT. X. Yu and C. Y. Zhou).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7 Shock Test Methods and Test Standards for Portable Electronic Devices (\u003ci\u003eC. Y. Zhou, T. X. Yu, S. W. Ricky Lee, and Ephraim Suhir).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock (\u003ci\u003eDavid S. Steinberg).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment (\u003ci\u003eDavid S. Steinberg).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e10 Correlation between Package-Level High-Speed Solder Ball Shear\/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (\u003ci\u003eFubin Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging (\u003ci\u003eV. B. C. Tan, K. C. Ong, C. T. Lim, and J. E. Field).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration (\u003ci\u003eT. E. Wong).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e13 Vibration Considerations for Sensitive Research and Production Facilities (\u003ci\u003eE. E. Ungar, H. Amick, and J. A. Zapfe).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e14 Applications of Finite Element Analysis: Attributes and Challenges (\u003ci\u003eMetin Ozen).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e15 Shock Simulation of Drop Test of Hard Disk Drives (\u003ci\u003eD. W. Shu, B. J. Shi, and J. Luo).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e16 Shock Protection of Portable Electronic Devices Using a “Cushion” of an Array of Wires (AOW) (\u003ci\u003eEphraim Suhir).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads (\u003ci\u003eToni T. Matilla, Pekka Marjamaki, and Jorma Kivilahti).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests (\u003ci\u003eMilena Vujosevic and Ephraim Suhir).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions? (\u003ci\u003eEphraim Suhir).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e20 Shock Isolation of Micromachined Device for High-\u003ci\u003eg\u003c\/i\u003e Applications (\u003ci\u003eSang-Hee Yoon, Jin-Eep Roh, and Ki Lyug Kim).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods (\u003ci\u003eX. Q. Shi, G. Y. Li, and Q. J. Yang).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e22 Thermal Cycle and Vibration\/Drop Reliability of Area Array Package Assemblies (\u003ci\u003eReza Ghaffarian).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse? (\u003ci\u003eEphraim Suhir and Luciano Arruda).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eIndex.\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49402308657495,"sku":"9780470250020","price":150.0,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9780470250020.jpg?v=1730480020","url":"https:\/\/bookcurl.com\/products\/structural-dynamics-of-electronic-and-photonic-systems-9780470250020","provider":"Book Curl","version":"1.0","type":"link"}