{"product_id":"semiconductor-microchips-and-fabrication-9781119867784","title":"Semiconductor Microchips and Fabrication","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eAuthor Biography xi\u003c\/p\u003e \u003cp\u003ePreface xiii\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction to the Basic Concepts 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 What Is a Microchip? 1\u003c\/p\u003e \u003cp\u003e1.2 Ohm’s Law and Resistivity 1\u003c\/p\u003e \u003cp\u003e1.3 Conductor, Insulator, and Semiconductor 5\u003c\/p\u003e \u003cp\u003eReferences 5\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Brief Introduction of Theories 7\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 The Birth of Quantum Mechanics 7\u003c\/p\u003e \u003cp\u003e2.2 Energy Band (Band) 11\u003c\/p\u003e \u003cp\u003eReferences 15\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Early Radio Communication 17\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Telegraph Technology 17\u003c\/p\u003e \u003cp\u003e3.2 Electron Tube 19\u003c\/p\u003e \u003cp\u003eReferences 22\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Basic Knowledge of Electric Circuits (Circuits) 23\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Electric Circuits and the Components 23\u003c\/p\u003e \u003cp\u003e4.2 Electric Field 26\u003c\/p\u003e \u003cp\u003e4.3 Magnetic Field 28\u003c\/p\u003e \u003cp\u003e4.4 Alternating Current 30\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Further Discussion of Semiconductors and Diodes 33\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Semiconductor Energy Band 33\u003c\/p\u003e \u003cp\u003e5.2 Semiconductor Doping 36\u003c\/p\u003e \u003cp\u003e5.3 Semiconductor Diode 42\u003c\/p\u003e \u003cp\u003eReferences 46\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Transistor and Integrated Circuit 47\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Bipolar Transistor 47\u003c\/p\u003e \u003cp\u003e6.2 Junction Field Effect Transistor 49\u003c\/p\u003e \u003cp\u003e6.3 Metal–Semiconductor Field Effect Transistor 52\u003c\/p\u003e \u003cp\u003e6.4 Metal–Insulator–Semiconductor Field Effect Transistor 55\u003c\/p\u003e \u003cp\u003eReferences 60\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 The Development History of Semiconductor Industry 61\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 The Instruction of Semiconductor Products and Structures 61\u003c\/p\u003e \u003cp\u003e7.2 A Brief History of the Semiconductor Industry 63\u003c\/p\u003e \u003cp\u003e7.3 Changes in the Size of Transistors and SiliconWafers 65\u003c\/p\u003e \u003cp\u003e7.4 Clean Room 67\u003c\/p\u003e \u003cp\u003e7.5 Planar Process 71\u003c\/p\u003e \u003cp\u003eReferences 75\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Semiconductor Photonic Devices 77\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Light-Emitting Devices and Light-Emitting Principles 77\u003c\/p\u003e \u003cp\u003e8.2 Light-Emitting Diode (LED) 82\u003c\/p\u003e \u003cp\u003e8.3 Semiconductor Diode Laser 88\u003c\/p\u003e \u003cp\u003e8.3.1 Resonant Cavity 89\u003c\/p\u003e \u003cp\u003e8.3.2 Reflection and Refraction of Light 91\u003c\/p\u003e \u003cp\u003e8.3.3 Heterojunction Materials 93\u003c\/p\u003e \u003cp\u003e8.3.4 Population Inversion and Threshold Current Density 94\u003c\/p\u003e \u003cp\u003eReferences 96\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Semiconductor Light Detection and Photocell 97\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 Digital Camera and CCD 97\u003c\/p\u003e \u003cp\u003e9.2 Photoconductor 100\u003c\/p\u003e \u003cp\u003e9.3 Transistor Laser 101\u003c\/p\u003e \u003cp\u003e9.4 Solar Cell 105\u003c\/p\u003e \u003cp\u003eReferences 106\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Manufacture of Silicon Wafer 109\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 From Quartzite Ore to Polysilicon 110\u003c\/p\u003e \u003cp\u003e10.2 Chemical Reaction 113\u003c\/p\u003e \u003cp\u003e10.3 Pull Single Crystal 115\u003c\/p\u003e \u003cp\u003e10.4 Polishing and Slicing 116\u003c\/p\u003e \u003cp\u003eReferences 123\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Basic Knowledges of Process 125\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 The Structure of Integrated Circuit (IC) 125\u003c\/p\u003e \u003cp\u003e11.2 Resolution of Optical System 128\u003c\/p\u003e \u003cp\u003e11.3 Why Plasma Used in the Process 131\u003c\/p\u003e \u003cp\u003eReferences 133\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Photolithography (Lithography) 135\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 The Steps of Lithography Process 135\u003c\/p\u003e \u003cp\u003e12.1.1 Cleaning 135\u003c\/p\u003e \u003cp\u003e12.1.2 Dehydration Bake 136\u003c\/p\u003e \u003cp\u003e12.1.3 Photoresist Coating 138\u003c\/p\u003e \u003cp\u003e12.1.4 Soft Bake 141\u003c\/p\u003e \u003cp\u003e12.1.5 Alignment and Exposure 141\u003c\/p\u003e \u003cp\u003e12.1.6 Developing 145\u003c\/p\u003e \u003cp\u003e12.1.7 Inspection 146\u003c\/p\u003e \u003cp\u003e12.1.8 Hard Bake 147\u003c\/p\u003e \u003cp\u003e12.1.9 Descum 148\u003c\/p\u003e \u003cp\u003e12.2 Alignment Mark (Mark) Design on the Photomask 152\u003c\/p\u003e \u003cp\u003e12.3 Contemporary Photolithography Equipment Technologies 156\u003c\/p\u003e \u003cp\u003eReferences 159\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Dielectric Films Growth 161\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13.1 The Growth of Silicon Dioxide Film 162\u003c\/p\u003e \u003cp\u003e13.1.1 Thermal Oxidation Process of SiO2 162\u003c\/p\u003e \u003cp\u003e13.1.2 LTO Process 164\u003c\/p\u003e \u003cp\u003e13.1.3 PECVD Process of Silicon Dioxide 166\u003c\/p\u003e \u003cp\u003e13.1.4 TEOS + O3 Deposition Using APCVD System 167\u003c\/p\u003e \u003cp\u003e13.2 The Growth of Silicon Nitride Film 168\u003c\/p\u003e \u003cp\u003e13.2.1 LPCVD 168\u003c\/p\u003e \u003cp\u003e13.2.2 PECVD Process of Silicon Nitride 171\u003c\/p\u003e \u003cp\u003e13.3 Atomic Layer Deposition Technique 174\u003c\/p\u003e \u003cp\u003eReferences 177\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 Introduction of Etching and RIE System 179\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e14.1 Wet Etching 179\u003c\/p\u003e \u003cp\u003e14.2 RIE System for Dry Etching 182\u003c\/p\u003e \u003cp\u003e14.2.1 RIE Process Flow and Equipment Structure 182\u003c\/p\u003e \u003cp\u003e14.2.2 Process Chamber 184\u003c\/p\u003e \u003cp\u003e14.2.3 Vacuum Pumps 186\u003c\/p\u003e \u003cp\u003e14.2.4 RF Power Supply (Source) and Matching Network (Matchwork) 187\u003c\/p\u003e \u003cp\u003e14.2.5 Gas Cylinder and Mass Flow Controller (MFC) 189\u003c\/p\u003e \u003cp\u003e14.2.6 Heater and Coolant 194\u003c\/p\u003e \u003cp\u003eReferences 196\u003c\/p\u003e \u003cp\u003e\u003cb\u003e15 Dry Etching 197\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e15.1 The Etch Profile of RIE 197\u003c\/p\u003e \u003cp\u003e15.1.1 Case 1 198\u003c\/p\u003e \u003cp\u003e15.1.2 Case 2 201\u003c\/p\u003e \u003cp\u003e15.2 Etching Rate of RIE 203\u003c\/p\u003e \u003cp\u003e15.3 Dry Etching of III–V Semiconductors and Metals 206\u003c\/p\u003e \u003cp\u003e15.4 Etch Profile Control 207\u003c\/p\u003e \u003cp\u003e15.4.1 Influence of the PR Opening Shape on the Etch Profile 208\u003c\/p\u003e \u003cp\u003e15.4.2 The Effect of Carbon on Etching Rate and Profile 209\u003c\/p\u003e \u003cp\u003e15.5 Other Issues 211\u003c\/p\u003e \u003cp\u003e15.5.1 The Differences Between RIE and PECVD 211\u003c\/p\u003e \u003cp\u003e15.5.2 The Difference Between Si and SiO2 Dry Etching 214\u003c\/p\u003e \u003cp\u003e15.6 Inductively Coupled Plasma (ICP) Technique and Bosch Process 215\u003c\/p\u003e \u003cp\u003e15.6.1 Inductively Coupled Plasma Technique 216\u003c\/p\u003e \u003cp\u003e15.6.2 Bosch Process 219\u003c\/p\u003e \u003cp\u003eReferences 223\u003c\/p\u003e \u003cp\u003e\u003cb\u003e16 Metal Processes 225\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e16.1 Thermal Evaporation Technique 225\u003c\/p\u003e \u003cp\u003e16.2 Electron Beam Evaporation Technique 227\u003c\/p\u003e \u003cp\u003e16.3 Magnetron Sputtering Deposition Technique 231\u003c\/p\u003e \u003cp\u003e16.4 The Main Differences Between Electron Beam (Thermal) Evaporation and Sputtering Deposition 234\u003c\/p\u003e \u003cp\u003e16.5 Metal Lift-off Process 235\u003c\/p\u003e \u003cp\u003e16.6 Metal Selection and Annealing Technology 241\u003c\/p\u003e \u003cp\u003e16.6.1 The Selection of Metals 241\u003c\/p\u003e \u003cp\u003e16.6.2 Metal Annealing 242\u003c\/p\u003e \u003cp\u003eReferences 243\u003c\/p\u003e \u003cp\u003e\u003cb\u003e17 Doping Processes 245\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e17.1 Basic Introduction of Doping 245\u003c\/p\u003e \u003cp\u003e17.2 Basic Principles of Diffusion 246\u003c\/p\u003e \u003cp\u003e17.3 Thermal Diffusion 247\u003c\/p\u003e \u003cp\u003e17.4 Diffusion and Redistribution of Impurities in SiO2 248\u003c\/p\u003e \u003cp\u003e17.5 Minimum Thickness of SiO2 Masking Film 250\u003c\/p\u003e \u003cp\u003e17.6 The Distribution of Impurities Under the SiO2 Masking Film 251\u003c\/p\u003e \u003cp\u003e17.7 Diffusion Impurity Sources 252\u003c\/p\u003e \u003cp\u003e17.8 Parameters of the Diffusion Layer 255\u003c\/p\u003e \u003cp\u003e17.9 Four-Point Probe Sheet Resistance Measurement 256\u003c\/p\u003e \u003cp\u003e17.10 Ion Implantation Process 257\u003c\/p\u003e \u003cp\u003e17.11 Theoretical Analysis of Ion Implantation 259\u003c\/p\u003e \u003cp\u003e17.12 Impurity Distribution after Implantation 260\u003c\/p\u003e \u003cp\u003e17.13 Type and Dose of Implanted Impurities 262\u003c\/p\u003e \u003cp\u003e17.14 The Minimum Thickness of Masking Film 263\u003c\/p\u003e \u003cp\u003e17.15 Annealing Process 264\u003c\/p\u003e \u003cp\u003e17.16 Buried Implantation 266\u003c\/p\u003e \u003cp\u003e17.16.1 Implantation through Masking Film 266\u003c\/p\u003e \u003cp\u003e17.16.2 SOI Manufacture 267\u003c\/p\u003e \u003cp\u003eReferences 270\u003c\/p\u003e \u003cp\u003e\u003cb\u003e18 Process Control Monitor, Packaging, and the Others 271\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e18.1 Dielectric Film Quality Inspection 271\u003c\/p\u003e \u003cp\u003e18.2 Ohmic Contact Test 273\u003c\/p\u003e \u003cp\u003e18.3 Metal-to-Metal Contact 274\u003c\/p\u003e \u003cp\u003e18.4 Conductive Channel Control 277\u003c\/p\u003e \u003cp\u003e18.5 Chip Testing 278\u003c\/p\u003e \u003cp\u003e18.6 Dicing 279\u003c\/p\u003e \u003cp\u003e18.7 Packaging 280\u003c\/p\u003e \u003cp\u003e18.8 Equipment Operation Range 281\u003c\/p\u003e \u003cp\u003e18.9 Low-\u003ci\u003ek \u003c\/i\u003eand High-\u003ci\u003ek \u003c\/i\u003eDielectrics 282\u003c\/p\u003e \u003cp\u003e18.9.1 Copper Interconnection and Low-\u003ci\u003ek \u003c\/i\u003eDielectrics 283\u003c\/p\u003e \u003cp\u003e18.9.2 Quantum Tunneling Effect and High-\u003ci\u003ek \u003c\/i\u003eDielectrics 286\u003c\/p\u003e \u003cp\u003e18.10 End 291\u003c\/p\u003e \u003cp\u003eReferences 293\u003c\/p\u003e \u003cp\u003eIndex 295\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":48866421473623,"sku":"9781119867784","price":88.65,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9781119867784.jpg?v=1722278566","url":"https:\/\/bookcurl.com\/products\/semiconductor-microchips-and-fabrication-9781119867784","provider":"Book Curl","version":"1.0","type":"link"}