{"product_id":"mitigating-tin-whisker-risks-theory-and-practice-wiley-series-on-processing-of-engineering-materials-9780470907238","title":"Mitigating Tin Whisker Risks Theory and Practice","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eDiscusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks     This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eList of Contributors ix\u003c\/p\u003e \u003cp\u003eIntroduction xi\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 A Predictive Model forWhisker Formation Based on Local Microstructure and Grain Boundary Properties 1\u003c\/b\u003e\u003cbr\u003e\u003ci\u003ePylin Sarobol, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, John P. Koppes, John E. Blendell and Carol A. Handwerker\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.1 Introduction, 1\u003c\/p\u003e \u003cp\u003e1.2 Characteristics of Whisker and Hillock Growth from Surface Grains, 3\u003c\/p\u003e \u003cp\u003e1.3 Summary and Recommendations, 17\u003c\/p\u003e \u003cp\u003eAcknowledgments, 18\u003c\/p\u003e \u003cp\u003eReferences, 19\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Major Driving Forces and Growth Mechanisms for TinWhiskers 21\u003c\/b\u003e\u003cbr\u003e\u003ci\u003eEric Chason and Nitin Jadhav\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction, 21\u003c\/p\u003e \u003cp\u003e2.2 Understanding the Mechanisms Behind Imc-Induced Stress Evolution and Whisker Growth, 24\u003c\/p\u003e \u003cp\u003e2.3 Relation of Stress to Whisker Growth, 34\u003c\/p\u003e \u003cp\u003e2.4 Conclusions, 39\u003c\/p\u003e \u003cp\u003eAcknowledgments, 40\u003c\/p\u003e \u003cp\u003eReferences, 40\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Approaches of Modeling and Simulation of Stresses in Sn Finishes 43\u003c\/b\u003e\u003cbr\u003e\u003ci\u003ePeng Su and Min Ding\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction, 43\u003c\/p\u003e \u003cp\u003e3.2 Constitutive Model, 44\u003c\/p\u003e \u003cp\u003e3.3 Strain Energy Density, 46\u003c\/p\u003e \u003cp\u003e3.4 Grain Orientation, 46\u003c\/p\u003e \u003cp\u003e3.5 Finite Element Modeling of Triple-Grain Junction, 48\u003c\/p\u003e \u003cp\u003e3.6 Finite Element Modeling of Sn Finish with Multiple Grains, 55\u003c\/p\u003e \u003cp\u003eReferences, 66\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Properties and Whisker Formation Behavior of Tin-Based Alloy Finishes 69\u003c\/b\u003e\u003cbr\u003e\u003ci\u003eTakahiko Kato and Asao Nishimura\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction, 69\u003c\/p\u003e \u003cp\u003e4.2 General Properties of Tin-based Alloy Finishes (Asao Nishimura), 70\u003c\/p\u003e \u003cp\u003e4.3 Effect of Alloying Elements on Whisker Formation and Mitigation (Asao Nishimura), 75\u003c\/p\u003e \u003cp\u003e4.4 Dependence of Whisker Propensity of Matte Tin–Copper Finish on Copper Lead-Frame Material (Takahiko Kato), 89\u003c\/p\u003e \u003cp\u003e4.5 Conclusions, 118\u003c\/p\u003e \u003cp\u003eAcknowledgments, 118\u003c\/p\u003e \u003cp\u003eReferences, 119\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Characterization Techniques for Film Characteristics 125\u003c\/b\u003e\u003cbr\u003e\u003ci\u003eTakahiko Kato and Yukiko Mizuguchi\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction, 125\u003c\/p\u003e \u003cp\u003e5.2 TEM (Takahiko Kato), 125\u003c\/p\u003e \u003cp\u003e5.3 SEM (Yukiko Mizuguchi), 140\u003c\/p\u003e \u003cp\u003e5.4 EBSD (Yukiko Mizuguchi), 146\u003c\/p\u003e \u003cp\u003e5.5 Conclusions, 154\u003c\/p\u003e \u003cp\u003eAcknowledgments, 155\u003c\/p\u003e \u003cp\u003eReferences, 155\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Overview of Whisker-Mitigation Strategies for High-Reliability Electronic Systems 159\u003c\/b\u003e\u003cbr\u003e\u003ci\u003eDavid Pinsky\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.1 Overview of Tin Whisker Risk Management, 159\u003c\/p\u003e \u003cp\u003e6.2 Details of Tin Whisker Mitigation, 164\u003c\/p\u003e \u003cp\u003e6.3 Managing Tin Whisker Risks at the System Level, 173\u003c\/p\u003e \u003cp\u003e6.4 Control of Subcontractors and Suppliers, 183\u003c\/p\u003e \u003cp\u003e6.5 Conclusions, 185\u003c\/p\u003e \u003cp\u003eReferences, 185\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects 187\u003c\/b\u003e\u003cbr\u003e\u003ci\u003eNicholas G. Clore, Dennis D. Fritz, Wei-Hsun Chen, Maureen E. Williams, John E. Blendell and Carol A. Handwerker\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction, 187\u003c\/p\u003e \u003cp\u003e7.2 Surface-Defect Classification and Measurement Method, 189\u003c\/p\u003e \u003cp\u003e7.3 Preparation and Storage Conditions of Electroplated Films on Substrates, 194\u003c\/p\u003e \u003cp\u003e7.4 Surface Defect Formation as a Function of Tin Film Type, Substrate, and Storage Condition, 195\u003c\/p\u003e \u003cp\u003e7.5 Conclusions, 209\u003c\/p\u003e \u003cp\u003eAppendix, 209\u003c\/p\u003e \u003cp\u003eAcknowledgments, 209\u003c\/p\u003e \u003cp\u003eReferences, 213\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Board Reflow Processes and their Effect on Tin Whisker Growth 215\u003c\/b\u003e\u003cbr\u003e\u003ci\u003eJasbir Bath\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction, 215\u003c\/p\u003e \u003cp\u003e8.2 The Effect of Reflowed Components on Tin Whisker Growth in Terms of Grain Size and Grain Orientation Distribution, 215\u003c\/p\u003e \u003cp\u003e8.3 Reflow Profiles and the Effect on Tin Whisker Growth, 216\u003c\/p\u003e \u003cp\u003e8.4 Influence of Reflow Atmosphere and Flux on Tin Whisker Growth, 219\u003c\/p\u003e \u003cp\u003e8.5 Effect of Solder Paste Volume on Component Tin Whisker Growth during Electronics Assembly, 220\u003c\/p\u003e \u003cp\u003e8.6 Conclusions, 221\u003c\/p\u003e \u003cp\u003eAcknowledgments, 222\u003c\/p\u003e \u003cp\u003eReferences, 222\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Mechanically Induced TinWhiskers 225\u003c\/b\u003e\u003cbr\u003e\u003ci\u003eTadahiro Shibutani and Michael Osterman\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction, 225\u003c\/p\u003e \u003cp\u003e9.2 Overview of Mechanically Induced Tin Whisker Formation, 227\u003c\/p\u003e \u003cp\u003e9.3 Theory, 228\u003c\/p\u003e \u003cp\u003e9.4 Case Studies, 237\u003c\/p\u003e \u003cp\u003e9.5 Conclusions, 245\u003c\/p\u003e \u003cp\u003eReferences, 246\u003c\/p\u003e \u003cp\u003eIndex 249\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49402457817431,"sku":"9780470907238","price":101.66,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9780470907238.jpg?v=1730480458","url":"https:\/\/bookcurl.com\/products\/mitigating-tin-whisker-risks-theory-and-practice-wiley-series-on-processing-of-engineering-materials-9780470907238","provider":"Book Curl","version":"1.0","type":"link"}